TWM339117U - Electrical connector and contacts thereof - Google Patents

Electrical connector and contacts thereof Download PDF

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Publication number
TWM339117U
TWM339117U TW096221941U TW96221941U TWM339117U TW M339117 U TWM339117 U TW M339117U TW 096221941 U TW096221941 U TW 096221941U TW 96221941 U TW96221941 U TW 96221941U TW M339117 U TWM339117 U TW M339117U
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TW
Taiwan
Prior art keywords
electrical connector
conductive terminal
clamping
base
plated
Prior art date
Application number
TW096221941U
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English (en)
Inventor
Ming-Yue Chen
Been-Yang Liaw
Wen-Yi Hsieh
Shih-Wei Hsiao
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW096221941U priority Critical patent/TWM339117U/zh
Publication of TWM339117U publication Critical patent/TWM339117U/zh
Priority to KR1020080132029A priority patent/KR20090069142A/ko
Priority to US12/317,651 priority patent/US7963778B2/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/514—Bases; Cases composed as a modular blocks or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/82—Coupling devices connected with low or zero insertion force
    • H01R12/85—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures
    • H01R12/89—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by moving connector housing parts linearly, e.g. slider
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/10—Sockets for co-operation with pins or blades
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/10—Sockets for co-operation with pins or blades
    • H01R13/11—Resilient sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Description

• M339117 • 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種電連接器及其導電端子，尤其涉及一安裝於電路板 上用來連接一晶片元件之電連接器及其端子。 【先前技術】 用於測試晶片元件之電連接器中具有和晶片元件上之導電體如錫球相 電性接觸之導電端子，通常為提高導電端子之相關特性，導電端子之表面 被鍍有貴金屬材料，如金等。惟，金材料在與晶片元件之錫球相接觸時容 易沾住錫球上的錫材料，長期使用後，附著之錫材料增多將會提高導電端 藝 子之電性阻抗，不利於晶片元件之正常電性測試。另，在晶片元件測試完 成之後，通常通過吸取設備將晶片元件從電連接器中吸取出，然，若導電 端子沾住晶片元件之錫球，則不利於晶片元件之取下。 因此，有必要對前述電連接器進行改進以克服先前技術之缺陷。 【新型内容】 本創作之目的係提供一種減少沾錫之導電端子及使用該導電端子之電 連接器。 本創作之電連接器係通過以下技術方案實現的：一種電連接器，其包 括·座體、組裝於座體中之複數導電端子及架設於座體上並可相對於座體 i. 上下運動之驅動件，所述導電端子具有一對夾持臂，兩夾持臂分別具有夾 持端，夾持端上鍍有鈀鈷合金層。 本創作之導電端子係通過以下技術方案實現的··一種導電端子，具有 一對夾持臂，兩夾持臂分別具有夾持端，夾持端上鍍有鈀鈷合金層。 相較於先前技術，本創作於導電端子之夾持端鍍有鈀鈷合金，可降低 對錫材料之親和力，從而防止導電端子之阻抗上升並使得與其相連接之測 試元件容易取下。 【實施方式】 上、本創作之電連接器使用時組裝在一電路板（未圖示）上，用來連接測 "戈種底部有錫球之晶片元件。參照第一圖及第二圖，本創作之電連接 5 M339117 ί =要包括座體2、架設於座體2上方之驅鱗3及組裝在座體2中之複 數導電端子4。座體2中放置一晶片元件5。 參第三圖及第四圖，本創作之導電端子4包括位於中間之基部4〇、由 ，部40向上延伸之_對夾持臂4卜42及由基部4()向下延伸形成之焊接端 =中，夾持臂41為靜止臂，整體呈直線型，而另—夾持犯為可動臂， 2曰:折結構並財―定之彈性。兩夾持臂4卜42之頂端分卿成用來夾 持曰曰片70件5之錫球50之夾持端41〇、42〇，兩夾持端41〇、42〇分別相向 延伸出-凸刺4U、42卜凸刺4n、421可刺破錫球5〇表面之氧化層。 重點參照第二至第四目，座體2包括呈框體結構之基座2〇、組設於基
J 2〇中之承載板2卜裳於基座2〇底部之底板22及用來卡扣晶片元件5之 、扣件23，承載板21用來承載晶片元件5。底板22、基座2〇及承載板21 /刀別設有相對應之端子孔22〇、及21〇，導電端子4依次穿過該等端子 其中基部40固持於基座2〇之端子孔2〇〇中，爽持端·、42〇向上穿 ^载板21之端子孔21G，焊接端43向下穿出底板22之端子孔220。承 、反21、為可移動元件’其於基座2〇内受驅動件3之驅動而於水平方向移 承載板21上設有受驅動件3驅動並具有傾斜導引面（未標示）之承受 P 1相應地·_動件3於對應處設有按壓部3〇，當驅動件3下壓時，按 壓30 承文部叫之傾斜導引面滑動從而驅動承載板η於水平方向移 $承載板21 -端裝配有一用於承載板21水平移紐復位之彈簧％，彈 η 24、端抵罪於承載板2卜另一端抵靠於基座之内壁。於承載板η水 =移動過程中，導電端子4之可動之夾持臂幻跟隨承載板21運動，當驅 件3，於下壓位置時，兩失持臂4卜Μ相遠離，同時兩卡扣件Β處於 ^開狀此時可將晶片元件5放入座體2中或從座體2中取出，當驅動 ^ 3回復至初始位置時，兩夹臂4卜42相靠近，鍚球50被夾持於兩夾持 =、42〇之間’卡扣件23利用彈簧Μ之彈性復位而卡於晶片元件5之 ”面至於承載板21 .驅動導電端子4之詳細原理及相應結構則為本領域内 t知技藝’在此不作詳述。另，驅動件3與座體2之間設有彈赞31，用於 驅動件3下壓後之復位。 I巴钻合金(Pd_Co)為金屬材料領域中一種習知合金材料，本創作將把鈷 ’使形成之電在韻性、減定性和孔隙率方 6 M339117 面均優於傳統之贿魏狀金(Au)、婦_材料。此外，糊作之 人在多次試驗巾發現祕合金鑛層在高溫狀態下，其與金屬錫之親和^交 低’即相對於金等材料，把鈷合金鑛層不易沾錫，從而可控制導電端子之 電=阻抗。另，在將晶片元件5從電連接器丨中取出時，其亦不會因被導 電端子沾住而難以取出。-同參照第五圖和第六圖，導電端子4最里層整 體表面鑛鎳(Ni)從而形成鍍鎳層44,夾持端410、420於鍍鎳層44上進三步 鍍鈀鈷合金形成鈀鈷合金層45。由於金與錫之間親和力較強，故焊接端43 於鍍鎳層44上進一步鍍金形成鍍金層46，以使通過焊錫焊接至電路板時具 有更好之效果。導電端子4之中間部分之鍍鎳層上可不再電鍍其他金屬層。 本創作於導電端子之兩夾持端上鍍有鈀鈷合金，可以減少導電端子沾 錫，從而控制導電端子之阻抗，同時導電端子不沾住晶片元件底部之錫球， 可使得晶片元件容易從電連接器中被吸取出。
【圖式簡單說明】 第一圖係本創作之電連接器之立體組合圖，其中收容有晶片元件； 第二圖係本創作之電連接器之立體分解圖； 第三圖係本創作之導電端子之立體圖； 第四圖係本創作之導電端子及所夾持之晶片元件； 第五圖係本創作之導電端子之夾持端之鍍層示意圖； 第六圖係本創作之導電端子之焊接端之鑛層示意圖。 座體 2 端子孔 200、210、220 承受部 211 卡扣件 23 驅動件 3 導電端子 4 夾持臂 41 > 42 凸刺 41 卜 421 鍍鎳層 44 【主要元件符號說明】 電連接器 1 基座 20 承載板 21 底板 22 彈簧 24、25、31 按壓部 30 基部 40 夾持端 410、420 焊接端 43 7 M339117 1巴1古合金層 晶片元件 45 5 鐘金層 46 錫球 50

Claims (1)

  1. M339117 九、申請專利範圍： 1. 一種電連接器’其包括： 座體； 複數導電端子，係組裝於座體中； 驅動件，係架設於座體上並可相對於座體上下運動； 其中，所述導電端子具有一對夾持臂，兩夾持臂分別具有夾持端，夾持端 上鍍有把钻合金層。 、 2·如申請專利範圍第1項所述之電連接器，其中所述導電端子整體表面具有鍍 鎳層，所述夾持端上之鈀鈷合金層位於鍍鎳層上。 φ ' 3·如申請專利範圍第2項所述之電連接器，其中所述一對夾持臂中之一為可動 臂，另一為靜止臂。 4_如申請專利範圍第3項所述之電連接器，其中所述導電端子具有向下延伸之 焊接端，焊接端之鍍鎳層上具有鍍金層。 5.如申請專利範圍第4項所述之電連接器，其中所述夾持端分別具有相向延伸 之凸刺。 6_如申請專利範圍第5項所述之電連接器，其中所述座體包括基座及容納在基 座中之承載板，承載板可受驅動件驅動而在基座中水平移動。 7. 如申請專利範圍第6項所述之電連接器，其中所述靜止臂可跟隨承載板運動。 8. —種導電端子，其具有一對夾持臂，兩夾持臂分別具有夾持端，夾持端上鍍 ® . 有把钻合金層。 9·如申請專利範圍第8項所述之導電端子，其整體表面具有鍍鎳層，所述夾持 端上之鈀鈷合金層位於鍍鎳層上。 10·如申請專利範圍第9項所述之導電端子，其中所述一對夾持臂中之一為可動 臂，另一為靜止臂。 11·如申請專利範圍第10項所述之導電端子，其具有向下延伸之焊接端，焊接 端之鍍鎳層上具有鍍金層。 12·如申請專利範圍第11項所述之導電端子，其中所述夾持端分別具有相向延 伸之凸刺。 9
TW096221941U 2007-12-24 2007-12-24 Electrical connector and contacts thereof TWM339117U (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW096221941U TWM339117U (en) 2007-12-24 2007-12-24 Electrical connector and contacts thereof
KR1020080132029A KR20090069142A (ko) 2007-12-24 2008-12-23 전기 커넥터와 이에 구비된 전도성 단자
US12/317,651 US7963778B2 (en) 2007-12-24 2008-12-23 Burn-in socket with plated contacts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096221941U TWM339117U (en) 2007-12-24 2007-12-24 Electrical connector and contacts thereof

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TWM339117U true TWM339117U (en) 2008-08-21

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TW096221941U TWM339117U (en) 2007-12-24 2007-12-24 Electrical connector and contacts thereof

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US (1) US7963778B2 (zh)
KR (1) KR20090069142A (zh)
TW (1) TWM339117U (zh)

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Publication number Priority date Publication date Assignee Title
TWI573332B (zh) * 2014-07-23 2017-03-01 鴻騰精密科技股份有限公司 電連接器及其端子
US11237207B2 (en) * 2019-11-25 2022-02-01 Sensata Technologies, Inc. Semiconductor test socket with a floating plate and latch for holding the semiconductor device

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US5730606A (en) * 1996-04-02 1998-03-24 Aries Electronics, Inc. Universal production ball grid array socket
KR100231828B1 (ko) * 1997-02-20 1999-12-01 유무성 다층 도금 리드프레임
US6274254B1 (en) * 1999-08-23 2001-08-14 Lucent Technologies Inc. Electrodeposited precious metal finishes having wear resistant particles therein
JP2002025731A (ja) * 2000-07-07 2002-01-25 Texas Instr Japan Ltd ソケット及び電子部品装着装置
JP3771811B2 (ja) * 2001-05-21 2006-04-26 山一電機株式会社 Ｉｃソケット
TWI288958B (en) * 2002-03-18 2007-10-21 Nanonexus Inc A miniaturized contact spring

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US7963778B2 (en) 2011-06-21
US20090163069A1 (en) 2009-06-25
KR20090069142A (ko) 2009-06-29

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