M333603 八、新型說明： 【新型所屬之技術領域】 本創作係與電腦硬體設備有關，特別是有關於一種用 於主機板之無線遙控散熱裝置。 5【先前技術】 習知用於主機板之散熱裝置，其係將至少一風扇設於 一主機板的外圍或特定晶片組之相對位置，再經由多數線 材電性連接該風扇以及該主機板，該主機板經由該等線材 傳輸控制彳g號而可调卽該風扇轉速，藉以達到控制風扇以 及供應風扇電力之目的，該主機板透過該風扇帶動氣流流 動以進行散熱。 然而’該風扇必須要藉由該等線材形成控制迴路，才 能使該主機板達到控制該風扇之目的；習用者在不修改電 路基板設計的前提下，該風扇都只能設於該主機板的外圍 15或特定位置，設計彈性不佳，且此種方式造成氣流僅在該 主機板的部分區域流動，而難以達到散熱最佳化之效果。 另外，當該主機板使用複數個該風扇以提升散熱效 果，繁雜的配線電性連接除了增加成本以外，同一作業空 間内集合了大量線材的結果，將影響氣流的流動而不利於 20散熱；換言之，增加該風扇的數量並不能有效解決該主機 板中央部分散熱不良的問題。再者，該等線材配線過多亦 不利於作業人員進行檢修或拆裝作業，具有組裝不方便的 缺點。 綜上所陳，習知用於主機板之散熱裝置具有上述之缺 4 M333603 失而有待改進 【新型内容】 創作之主要目的在於提供—觀於主機板之無線遙 二，、、、衣置’其能夠依據域板的散熱需求設置，具有提 升散熱效果之特色。 本創作之再-目的在於提供—制齡絲之無線遙 熱裝置，其能夠減少線材的使用，以利於作業人員進 订檢修或拆裝作業，具有_方便之特色。 為達成上述目的，本創作所提供—_於主機板之無 、” 熱I置’包含有：—風扇；—電路單元，係電性 15 20 =該風扇以及該主機板，該電路單元自該主機板取得電 :源，-電性連接該電路單元之第—訊魏發模組，係 /、有-第-發射器以及一第一接收器；該第一發射器可發 射一回授訊號’以將該風扇的運轉狀態輸出；—電性連接 ，，機板之第二訊號收發模組，係具有—第二發射器以及 =二接收器’該第二接收器接收該回授訊號·該第二發 可發射-控制訊號給該第—接收器而間接控制該電路 早元改變該風扇的運作狀態。 藉此，本創作所提供用於主機板之無線遙控散熱裝置 透過上述結構，其能夠依據該主機板的散熱需长嗖置而 受限設於触機板的外_分，躺克服習用者散熱致 不佳的缺點，具有提升散熱效果之特色。再者，本創 夠減少線材的使用而簡化配線作業，以利於作業人員進= 5 M333603 檢修或拆裝作業，具有組裝方便之特色。 【實施方式】 為了詳細說明本創作之結構、特徵及功效所在，茲舉 5以下較佳實施例並配合圖式說明如後，其中·· 第一圖為本創作一較佳實施例之立體圖。 第二圖為本創作一較佳實施例之元件分解圖。 鲁第三圖為本創作一較佳實施例之電路方塊圖。 請參閱第一圖至第三圖，本創作一較佳實施例所提供 10用於主機板之無線遙控散熱裝置（10)，包含有：一風扇 (20)、一電路單元(3〇)、一第一訊號收發模組(4〇)以及一第 二訊號收發模組(50)。 該風扇(20)係與習用之直流電扇相同，在此容不贅述。 該電路單元(30)主體係為印刷電路板且形成有一插接 I5鈿子(32)，該插接端子(32)透過插設於該主機板(6〇)之一供 • 電插座(62)而取得電力來源；該電路單元(30)與該風扇（20) 係透過一框架(33)結合，該電路單元(3〇)以一排線(34)短距 離地電性連接該風扇（20)，用以驅動該風扇（2〇)開啟或關 閉。 20 該第一訊號收發模組(40)電性連接該電路單元(30)且 2有一第一發射器(42)以及一第一接收器(44);該訊號收發 模組(40)經由該電路單元(3〇)得知該風扇（2〇)的運轉狀態， 該第-發射器(42)可發射一回授訊號，用以將該風扇(2^)的 運轉狀態傳輸出去，該回授訊號係包含有該風扇(2〇)的轉速 6 M333603 狀態。其中，該回授訊號係選自以紅外線、射頻以及藍芽 其中-種方式進行傳輸；本實施例中，該回授訊號係選自 以紅外線為例，在此僅為提供-種實施態樣，並非做 制要件。 5 該第二訊號收發模組(50)電性連接該主機板(60)且具 有一第二發射器(52)以及一第二接收器(54);該第二接收^ (54)接收該回授訊號，用以使該主機板(6〇)得知該風扇（2〇) 的轉速狀悲，當該主機板(60)需要調節該風扇(2〇)轉速，該 主機板(60)可經由第二發射器（52)發射一控制訊號給該第 H) —訊號收發模組(40)之第一接收器（44)而間接控制該電路 單70 (30);該控制訊號係為脈衝寬度調變（pulse width modulation , PWM)信號，用以控制該電路單元(30)改變該 風扇(20)的轉速，進而改變該風扇(2〇)的運作狀態。其中， 該控制訊號係選自以紅外線、射頻以及藍芽其中一種方式 15進行傳輸；本實施例中，該控制訊號係選自以紅外線為例， 在此僅為提供一種實施態樣，並非做為限制要件。 經由上述結構，當該風扇(20)於運轉期間，該第一訊號 收發模組(40)會發射該回授訊號給位於該主機板(6〇)之第 二訊號收發模組(50)，該主機板(6〇)可經由該回授訊號得知 2〇該風扇（20)的運轉狀態，用以作為調節該風扇（2〇)參考依 據。當該主機板(5〇)需要改變該風扇(20)的轉速而調節散熱 效果，該第二訊號收發模組(5〇)會發射該控制訊號給該第一 訊號收發模組(40)，進而驅使該電路單元(30)改變該風扇（20) 的轉速，藉以達到調節散熱效果之目的。 7 M333603 藉此’本創作所提供用於主機板之無線遙控散熱裝 置’其能夠依據該主機板(60)的散熱需求設置而不受限設於 該主機板(60)的外圍部分，例如：該主機板(6〇)的中央部 方便之特色 为，進而克服習用者散熱效果不佳的缺點，具有提升散熱 效果之特色。再者’本創作能夠減少線材的使用而簡化配 線作業’關於作業人員進行檢修或料作業，具有組裝 本創，於前揭實施例中所揭露的構成元件 說明制本案之範圍，其他等效元件㈣代或 10變化，亦應為本案之申請專利範圍所涵蓋 M333603 【圖式簡單說明】 第一圖為本創作一較佳實施例之立體圖。 第二圖為本創作一較佳實施例之元件分解圖。 第三圖為本創作一較佳實施例之電路方塊圖。 5 【主要元件符號說明】 風扇(20) 插接端子(32) 排線(34) 第一發射器(42) 第二訊號收發模組(50) 第二接收器(54) 供電插座(62) 無線遙控散熱裝置(10) 電路單元(30) 框架(33) ίο 第一訊號收發模組(40) 第一接收器(44) 第二發射器(52) 主機板(60)M333603 VIII. New Description: [New Technology Field] This creation is related to computer hardware equipment, especially for a wireless remote control heat sink for the motherboard. 5 [Prior Art] A heat sink for a motherboard is provided, wherein at least one fan is disposed at a periphery of a motherboard or a relative position of a specific chip set, and the fan and the motherboard are electrically connected via a plurality of wires. The motherboard can adjust the fan speed through the wire transmission control ,g number, thereby achieving the purpose of controlling the fan and supplying the fan power, and the motherboard drives the airflow through the fan to dissipate heat. However, the fan must form a control loop through the wires to enable the motherboard to control the fan; the fan can only be placed on the motherboard without modifying the circuit board design. The peripheral 15 or the specific position is not well designed, and this way, the airflow flows only in a part of the main board, and it is difficult to achieve the heat dissipation optimization effect. In addition, when the motherboard uses a plurality of the fans to improve the heat dissipation effect, in addition to increasing the cost of the complicated wiring electrical connection, the result of collecting a large number of wires in the same working space will affect the flow of the airflow and is not conducive to 20 heat dissipation; Increasing the number of fans does not effectively solve the problem of poor heat dissipation in the central portion of the motherboard. Moreover, the excessive wiring of the wires is also disadvantageous for the operator to perform maintenance or disassembly work, and has the disadvantage of being inconvenient to assemble. In summary, the conventional heat sink for the motherboard has the above-mentioned shortcomings. 4 M333603 is missing and needs to be improved. [New content] The main purpose of the creation is to provide a view of the wireless remote control of the motherboard. It can be set according to the heat dissipation requirements of the domain board, and has the feature of improving the heat dissipation effect. The re-creation of this creation is to provide a wireless remote heating device for aging silk, which can reduce the use of wire rods, so as to facilitate the operator to carry out maintenance or disassembly operations, and has the characteristics of convenience. In order to achieve the above objectives, the present invention provides - _ no on the motherboard, "heat I set" contains: - fan; - circuit unit, system 15 20 = the fan and the motherboard, the circuit unit from The motherboard obtains electricity: a source, an electrical connection to the first unit of the circuit unit, a system, a --transmitter, and a first receiver; the first transmitter can transmit a feedback signal Outputting the operating state of the fan; electrically connecting, the second signal transceiver module of the board has a second transmitter and a second receiver, the second receiver receiving the feedback signal. The second transmittable control signal is indirectly controlled by the first receiver to change the operating state of the fan. The wireless remote control heat sink for the motherboard is provided by the present invention. The heat dissipation of the motherboard needs to be long and limited, and is limited to the outside of the touch panel. The lie overcomes the shortcomings of the heat dissipation of the conventional user, and has the feature of improving the heat dissipation effect. Moreover, the utility can reduce the use of the wire. Simplify wiring work In order to facilitate the operator to enter / 5 M333603 maintenance or disassembly work, it has the characteristics of convenient assembly. [Embodiment] In order to explain in detail the structure, features and effects of the present invention, the following preferred embodiment is combined with the drawing. BRIEF DESCRIPTION OF THE DRAWINGS The following is a perspective view of a preferred embodiment of the present invention. The second drawing is an exploded view of a preferred embodiment of the present invention. Please refer to the first to third figures. A preferred embodiment of the present invention provides a wireless remote control heat sink (10) for a motherboard, comprising: a fan (20) and a circuit unit ( 3〇), a first signal transceiver module (4〇) and a second signal transceiver module (50). The fan (20) is the same as the conventional DC fan, and will not be described here. 30) The main system is a printed circuit board and is formed with a plug-in I5 switch (32), and the plug terminal (32) is powered by being plugged into one of the motherboard (6〇) for the electrical socket (62). Source; the circuit unit (30) is coupled to the fan (20) through a frame (33) The circuit unit (3〇) is electrically connected to the fan (20) by a short line (34) for driving the fan (2〇) to be turned on or off. 20 The first signal transceiver module (40) Electrically connecting the circuit unit (30) and having a first transmitter (42) and a first receiver (44); the signal transceiver module (40) knows the fan via the circuit unit (3) In the operating state of (2〇), the first transmitter (42) can transmit a feedback signal for transmitting the operating state of the fan (2^), and the feedback signal includes the fan (2〇) The rotation speed is 6 M333603 state, wherein the feedback signal is selected from the group consisting of infrared rays, radio frequency, and blue bud; in this embodiment, the feedback signal is selected from the case of infrared rays, and only In order to provide an implementation, it is not a requirement. The second signal transceiver module (50) is electrically connected to the motherboard (60) and has a second transmitter (52) and a second receiver (54); the second receiver (54) receives the The feedback signal is used to make the motherboard (6〇) know the speed of the fan (2〇), and when the motherboard (60) needs to adjust the speed of the fan (2〇), the motherboard (60) The circuit board 70 can be indirectly controlled by transmitting a control signal to the first receiver (44) of the H)-signal transceiver module (40) via the second transmitter (52); the control signal is A pulse width modulation (PWM) signal is used to control the circuit unit (30) to change the rotation speed of the fan (20), thereby changing the operating state of the fan (2〇). The control signal is selected from one of the infrared rays, the radio frequency, and the blue mode 15; in this embodiment, the control signal is selected from the case of infrared rays, and only provides an implementation manner, not To limit the requirements. Through the above configuration, when the fan (20) is in operation, the first signal transceiver module (40) transmits the feedback signal to the second signal transceiver module (50) located on the motherboard (6〇). The motherboard (6〇) can know the operating state of the fan (20) through the feedback signal, as a reference for adjusting the fan (2〇). When the motherboard (5〇) needs to change the speed of the fan (20) to adjust the heat dissipation effect, the second signal transceiver module (5〇) transmits the control signal to the first signal transceiver module (40). In turn, the circuit unit (30) is driven to change the rotation speed of the fan (20), thereby achieving the purpose of adjusting the heat dissipation effect. 7 M333603 The wireless remote control heat sink for the motherboard provided by the present invention can be set according to the heat dissipation requirement of the motherboard (60) without being limited to the peripheral portion of the motherboard (60), for example: The central part of the motherboard (6〇) is convenient to overcome the shortcomings of the poor heat dissipation effect of the user, and has the feature of improving the heat dissipation effect. Furthermore, 'this creation can reduce the use of wire rods and simplify the wiring work'. The maintenance personnel or the material work are performed on the workers, and the assembly is invented. The components disclosed in the foregoing embodiments are described in the scope of the case, and other equivalent components. (4) The change of the generation or the 10 is also covered by the scope of the patent application of the present invention. M333603 [Simplified description of the drawings] The first figure is a perspective view of a preferred embodiment of the present invention. The second figure is an exploded view of an element of a preferred embodiment of the present invention. The third figure is a circuit block diagram of a preferred embodiment of the present invention. 5 [Description of main component symbols] Fan (20) Plug-in terminal (32) Cable (34) First transmitter (42) Second signal transceiver module (50) Second receiver (54) Power socket (62) Wireless remote control heat sink (10) Circuit unit (30) Frame (33) ίο First signal transceiver module (40) First receiver (44) Second transmitter (52) Motherboard (60)