M333586 八、新型說明： 【新型所屬之技術領域】 本創作是有關於一種液晶顯示器及其背光模組，且特 別是有關於一種膠框與電路板直接榫合之液晶顯示器及其 背光模組。 【先前技術】 • 在一般液晶顯示器中，由於液晶顯示面板（Liquid crystal display panel)並不具有主動發光的功能，故在液晶 顯示面板下方必須配置—背光模組以提供一面光源，以使 液日日顯不面板此達到顯不的目的。 圖1疋t知月光模組之剖面示意圖。請參考圖1，習 知之月光模組100至少由多個發光二極體11〇 (圖i僅繪 示一個）、一電路板 120、一導光板（light guide plate，LGp ) 130、一反射片140與一燈罩15〇所構成。其中，發光二極 豸11G配置於電路板12〇上’且發光二極體UG位於導光 板130之入光面i3〇a旁。—般而言，發光二極體ιι〇包括 -發光二極體晶片m與-縣結構114。此封裝結構114 覆蓋住發光二極體晶片112。此外，反射片14〇配置於導 -光板130下方，而燈罩150可將電路板12〇與導光板13〇 固定。 、具體而言，發光二極體110所發射出的部分光線L可 j透過燈罩150之反射，而由入光面進入導光板13〇 。實務上，燈罩15G之材f —般為金屬材料，不但製造 5 M333586 成本，且重里較重。值得注意的是，大尺寸的背光模組 1〇〇為要進行組裝或重工（rework)時，燈罩會使整 個組裝或拆卸的時間加長，進而對整體產能（Throughput) 造成影響。 【新型内容】 本創作其中之一目的就是在提供一種背光模組，其具 有組裝容易且成本低廉之優點。 本創作其中之一目是提供一種液晶顯示器，其具有成 本低廉之優點。 本創作提出一種背光模組，其包括一導光板、一框架、 =電路板與多個發光二極體晶片。其中，導光板具有一入 光面。此外，框架配置於導光板旁，且框架具有至少一第 一卡合部。另外，電路板具有至少一第二卡合部，且框架 與電路板適於藉由第一卡合部與第二卡合部接合。上述之 發光二極體晶片配置於電路板上，且位於框架與導光板之 入光面之間。 在本創作之一實施例中，上述之背光模組更包括一反 射片，其配置於電路板上。 在本創作之一實施例中，上述之反射片延伸至導光板 下方。 在本創作之一實施例中，上述之電路板具有一反射 面，且發光二極體晶片配置於反射面上。 在本創作之一實施例中，上述之框架包括膠框。 6 M333586 在本創作之一實施例中，上述框架之材質包括高反射 材料。 在本創作之一實施例中，上述之第一卡合部為卡勾。 在本創作之一實施例中，上述之第二卡合部為卡合孔。 在本創作之一實施例中，上述之第一卡合部為卡合孔。 在本創作之一實施例中，上述之第二卡合部為卡勾。 在本創作之一實施例中，上述之背光模組更包括一光 學膜片組，其配置於導光板上方。 在本創作之一貫施例中，上述之光學膜片組包括擴散 片（Diffuser film )、增光片（Brightness enhanced film，BEF ) 與稜鏡片（Prismsheet)至少其中之一。 本創作提出一種液晶顯示器，其包括上述之背光模組 與一液晶顯示面板。其中，液晶顯示面板配置於導光板上 方。 本創作之背光模組將框架與電路板藉由第一卡合部與 第一卡合部接合，而使電路板上之發光二極體晶片所發出 的光線此藉由框架而反射至導光板中，並不需要燈罩。由 於本創作之背光模組無須燈罩，因而能有效降低製造成本 並具1組裝容易之優點。本創作之液晶顯示器應用了本創 作之背光模組，因而能有效降低製造成本。 為讓本創作之上述和其他目的、特徵和優點能更明顯 易懂，下文特舉較佳實施例，並配合所附圖式，作 明如下。 、 7 M333586 【實施方式】 圖2A是本創作之一實施例之液晶顯示器立體示意 圖。請參考圖2A，本創作之液晶顯示( liquid crystal display ) 200包括一背光模組300與一液晶顯示面板400。 其中，液晶顯示面板400配置於背光模組300之上方。背 光模組300可提供液晶顯示面板400顯示晝面所需之光 源。一般而言，液晶顯示面板400主要包括一薄膜電晶體 陣列基板（thin film transistor array substrate ) 402、一彩色 渡光片404以及夹於兩者之間的液晶層（未纟會示）。 圖2B是本創作之一實施例之背光模組局部立體示意 圖’而圖2C是本創作之一實施例之背光模組局部剖面示 思圖。请同時參考圖2B與圖2C，本創作之背光模組3〇〇 包括一導光板（light guide plate，LGP ) 310、一框架（fmme ) 320、一電路板330與多個發光二極體晶片（Ught_emi出叩 diode chip)340。其中，導光板310至少包括一入光面31如 與一出光面310b。當然，所屬技術領域中具有通常知識者 應知導光板310可以選用平板型導光板、楔型導二曰 =3之ί光板，在此僅為舉例說明，並不刻意侷;艮ΐ 光板310之種類。 二卜第框f置於導光板31G旁’且框架32〇具 有至乂弟一卡合部322 (圖2B繪示為兩個）。电 此框架320例如是膠框（&咖） 二力 可以二勾。_是，框架32()之材=3=22 材料衣成。另—方面，電路板挪具有至少—第二^合部 8 M333586 332。這裡要說明的是，當第一>^合部322為卡勾時，則第 二卡合部332為卡合孔。這樣一來，框架320與電路板330 可藉由第一卡合部322與第二卡合部332相互卡合。在一 實施例中，第一卡合部322可為卡合孔，而第二卡合部332 則為卡勾，在此並不加以侷限。 此外，本創作之背光模組3〇〇更包括一可撓式電路板 (flexible printed circuit board, FPC Board) 336。此可撓式 電路板336電性連接於電路板330與液晶顯示面板400之 間。具體而言，此可撓式電路板336例如是COF (chip on film)結構。當然，可撓式電路板336可以透過捲帶式自 動接合（Tape Automatic Bonding，TAB )技術或打線（WireM333586 VIII. New Description: [New Technology Field] This creation is related to a liquid crystal display and its backlight module, and in particular to a liquid crystal display and a backlight module directly matched with a plastic frame and a circuit board. [Prior Art] • In the general liquid crystal display, since the liquid crystal display panel does not have the function of active illumination, a backlight module must be disposed under the liquid crystal display panel to provide a light source to make the liquid day The Japanese display panel does not achieve this purpose. Figure 1 is a schematic cross-sectional view of the moonlight module. Referring to FIG. 1 , the conventional moonlight module 100 is composed of at least a plurality of LEDs 11 (only one is shown in FIG. 1 ), a circuit board 120 , a light guide plate (LGp ) 130 , and a reflective sheet . 140 and a lampshade 15〇. The light-emitting diode 11G is disposed on the circuit board 12A and the light-emitting diode UG is located beside the light-incident surface i3〇a of the light guide plate 130. In general, the light-emitting diode ιι〇 includes a light-emitting diode wafer m and a county structure 114. The package structure 114 covers the LED array 112. Further, the reflection sheet 14A is disposed under the light guide plate 130, and the lamp cover 150 can fix the circuit board 12A and the light guide plate 13A. Specifically, a part of the light L emitted by the LED 110 can be reflected by the lamp cover 150 and enter the light guide plate 13 from the light incident surface. In practice, the material of the lampshade 15G is generally made of metal, which not only costs 5 M333586, but also has a heavier weight. It is worth noting that when a large-sized backlight module is to be assembled or reworked, the lampshade lengthens the entire assembly or disassembly time, thereby affecting the overall throughput (Throughput). [New Content] One of the aims of this creation is to provide a backlight module which has the advantages of easy assembly and low cost. One of the aims of the present invention is to provide a liquid crystal display which has the advantage of being inexpensive. The present invention provides a backlight module including a light guide plate, a frame, a circuit board, and a plurality of light emitting diode chips. Wherein, the light guide plate has a light incident surface. Further, the frame is disposed beside the light guide plate, and the frame has at least one first engaging portion. In addition, the circuit board has at least one second engaging portion, and the frame and the circuit board are adapted to be engaged with the second engaging portion by the first engaging portion. The above-mentioned light emitting diode chip is disposed on the circuit board and located between the frame and the light incident surface of the light guide plate. In an embodiment of the present invention, the backlight module further includes a reflective sheet disposed on the circuit board. In one embodiment of the present invention, the reflective sheet extends below the light guide. In an embodiment of the present invention, the circuit board has a reflective surface, and the light emitting diode chip is disposed on the reflective surface. In one embodiment of the present invention, the frame described above includes a plastic frame. 6 M333586 In one embodiment of the present invention, the material of the frame includes a highly reflective material. In an embodiment of the present invention, the first engaging portion is a hook. In an embodiment of the present invention, the second engaging portion is an engaging hole. In an embodiment of the present invention, the first engaging portion is an engaging hole. In an embodiment of the present invention, the second engaging portion is a hook. In an embodiment of the present invention, the backlight module further includes an optical film set disposed above the light guide plate. In a consistent embodiment of the present invention, the optical film set described above includes at least one of a diffuser film, a brightness enhanced film (BEF), and a prism sheet. The present invention proposes a liquid crystal display comprising the above backlight module and a liquid crystal display panel. The liquid crystal display panel is disposed on the light guide plate. The backlight module of the present invention engages the frame and the circuit board by the first engaging portion and the first engaging portion, so that the light emitted by the LED chip on the circuit board is reflected by the frame to the light guide plate. There is no need for a lampshade. Since the backlight module of the present invention does not require a lampshade, it can effectively reduce the manufacturing cost and has the advantage of being easy to assemble. The liquid crystal display of the present invention uses the backlight module of the present invention, thereby effectively reducing the manufacturing cost. The above and other objects, features, and advantages of the present invention will become more apparent from the understanding of the appended claims. 7 M333586 [Embodiment] FIG. 2A is a perspective view of a liquid crystal display device according to an embodiment of the present invention. Referring to FIG. 2A, the liquid crystal display 200 of the present invention includes a backlight module 300 and a liquid crystal display panel 400. The liquid crystal display panel 400 is disposed above the backlight module 300. The backlight module 300 can provide a light source required for the liquid crystal display panel 400 to display the kneading surface. In general, the liquid crystal display panel 400 mainly includes a thin film transistor array substrate 402, a color light-passing sheet 404, and a liquid crystal layer sandwiched therebetween (not shown). 2B is a partial perspective view of a backlight module of one embodiment of the present invention, and FIG. 2C is a partial cross-sectional view of a backlight module according to an embodiment of the present invention. Referring to FIG. 2B and FIG. 2C simultaneously, the backlight module 3 of the present invention includes a light guide plate (LGP) 310, a frame (fmme) 320, a circuit board 330 and a plurality of light emitting diode chips. (Ught_emi outgoing diode chip) 340. The light guide plate 310 includes at least a light incident surface 31 such as a light exit surface 310b. Of course, those skilled in the art should know that the light guide plate 310 can be selected from a flat light guide plate and a wedge type guide plate, which is merely an example, and is not intended to be used; kind. The second frame f is placed beside the light guide plate 31G' and the frame 32 has a zipper portion 322 (shown as two in Fig. 2B). This frame 320 is, for example, a plastic frame (& coffee). _Yes, frame 32 () material = 3 = 22 material. On the other hand, the board has at least a second portion 8 M333586 332. Here, it is to be noted that when the first > In this way, the frame 320 and the circuit board 330 can be engaged with each other by the first engaging portion 322 and the second engaging portion 332. In one embodiment, the first engaging portion 322 can be a snap hole, and the second engaging portion 332 is a hook, which is not limited herein. In addition, the backlight module 3 of the present invention further includes a flexible printed circuit board (FPC Board) 336. The flexible circuit board 336 is electrically connected between the circuit board 330 and the liquid crystal display panel 400. Specifically, the flexible circuit board 336 is, for example, a COF (chip on film) structure. Of course, the flexible circuit board 336 can be passed through Tape Automatic Bonding (TAB) technology or wire bonding (Wire).
Bonding，W/B)接合技術所製成，在此僅用以舉例說明並 不刻意侷限。 本創作之發光二極體晶片340配置於電路板330上， 且位於框架320與導光板310之入光面310a之間。具體而 言，發光二極體晶片340所發出之部分光線L，可以藉由框 架320之反射，而由入光面310a進入導光板310中。換言 之，本創作之背光模組300無須額外設置習知之燈罩15〇 (如圖1所示）。由於本創作之背光模組300構件數量較 少，因此能有效降低整體背光模組300之重量與製造成 本。如此一來，本創作之背光模組300不論是在進行組袭 或重工（rework)時，製造或維修人員都能有效縮短工時， 以提升產能（throughput)。 值得注意的是’為了進一步降低製造成本，本創作之 9 M333586 發光二極體晶片340可以採用未經封裝之發光二極體晶片 340。此外，本創作之背光模組300更可包括一反射片312、 334。此反射片334可配置於電路板330上，以反射發光二 極體晶片340所發出之部分光線，以提升光線之利用效 率。另一方面，反射片312可配置於導光板310下方，以 進一步提升光線之利用效率。在一實施例中，如圖3所示 之電路板330具有一反射面330a，且發光二極體晶片340 可直接配置於電路板330之反射面330a上，而無須採用反 射片334。 此外，本創作之背光模組300更包括一光學膜片組 350。此光學膜片組350配置於導光板310上方。本創作之 光學膜片組350可以包括擴散片（Diffuser film)、增光片 (Brightness enhanced film，BEF )與稜鏡片（prism sheet) 至少其中之一或其組合。具體而言，擴散片可以使發光二 極體晶片340所發出的光線更均勻地散射，而增光片可以 誕升为光模組300所呈現之亮度。此外，棱鏡片可以提升 光線出光方向的正確性。 綜上所述，本創作之框架與電路板藉由第一卡合部與 第二卡合部接合，而使電路板上之發光二極體晶片所發出 的光線月b错由框架而反射至導光板中。因此，本創作之背 光模組無須額外設置燈罩。由於本創作背光模組之構件數 里較少，因此背光模組之重量與製造成本都能有效降低。 此外，由於本創作背光模組之構件數量較少，因此背光模 組不論是進行組裝或重工，組裝或維修人員都能有效節省 M333586 二 之液晶顯示器應用了本創作之北 先桓組，、_能有低廉之製造成本。 悄作之月 雖」本創作已以較佳實施例揭 =創作’任何熟習此技藝者，在不脫離:創= 内:當可作些許之更動與潤飾，因此本二= 靶圍*視後附之申請專利範圍所界定者為準。 μη 【圖式簡單說明】 圖1是習知背光模組之剖面示意圖。 圖2Α是本創作之一實施例之液晶顯示器立體厂土 圖2Β是本創作之一f施例之背光模組局部示:二圖。 口圖2C是本創作之一實施例之背光模組局部剖1曰示°立 圖3是本創作之一實施例之另一背光模組 意圖。 勹#剖面示 【主要元件符號說明】 100、300 :背光模組 110 :發光二極體 112、340 ··發光二極體晶片 114 :封裝結構 120、330 :電路板 130、310:導光板 130a、310a :入光面 11 M333586 140、312、334 :反射片 150 :燈罩 200 :液晶顯示器 310b :出光面 320 :框架 322 :第一^^合部 332 ·•第二卡合部 336 :可撓式電路板 350 :光學膜片組 400 :液晶顯示面板 402 :薄膜電晶體陣列基板 404 :彩色濾光片 L、L，：光線Bonding, W/B) joint technology is used here for illustration only and is not intended to be limited. The LED array 340 of the present invention is disposed on the circuit board 330 and located between the frame 320 and the light incident surface 310a of the light guide plate 310. Specifically, part of the light L emitted by the LED wafer 340 can be reflected by the frame 320 and enter the light guide plate 310 from the light incident surface 310a. In other words, the backlight module 300 of the present invention does not need to be additionally provided with a conventional lamp cover 15 (as shown in FIG. 1). Since the number of components of the backlight module 300 of the present invention is small, the weight and manufacturing cost of the overall backlight module 300 can be effectively reduced. In this way, the backlight module 300 of the present invention can effectively shorten the working hours to improve the throughput even when performing the rework or rework. It is worth noting that in order to further reduce the manufacturing cost, the 9 M333586 LED chip 340 of the present invention can use the unencapsulated LED chip 340. In addition, the backlight module 300 of the present invention may further include a reflective sheet 312, 334. The reflective sheet 334 can be disposed on the circuit board 330 to reflect a portion of the light emitted by the LED chip 340 to improve light utilization efficiency. On the other hand, the reflective sheet 312 can be disposed under the light guide plate 310 to further improve the utilization efficiency of the light. In one embodiment, the circuit board 330 shown in FIG. 3 has a reflective surface 330a, and the LED wafer 340 can be directly disposed on the reflective surface 330a of the circuit board 330 without using the reflective sheet 334. In addition, the backlight module 300 of the present invention further includes an optical film set 350. The optical film set 350 is disposed above the light guide plate 310. The optical film set 350 of the present invention may include at least one of a diffuser film, a brightness enhanced film (BEF), and a prism sheet, or a combination thereof. Specifically, the diffusion sheet can scatter the light emitted by the LED chip 340 more uniformly, and the brightness enhancement sheet can be raised to the brightness exhibited by the optical module 300. In addition, the prism sheet can improve the correctness of the light exiting direction. In summary, the frame and the circuit board of the present invention are joined by the first engaging portion and the second engaging portion, so that the light emitted by the LED chip on the circuit board is reflected by the frame to the frame. In the light guide plate. Therefore, the backlight module of the present invention does not require an additional lampshade. Since the number of components of the backlight module is small, the weight and manufacturing cost of the backlight module can be effectively reduced. In addition, due to the small number of components of the backlight module, the assembly or maintenance personnel can effectively save the M333586 liquid crystal display application of the North Pioneer Group, _ Can have low manufacturing costs. Although the month of the whispering work, "this creation has been revealed by the preferred embodiment = "anyone who is familiar with this skill, does not leave: creation = inside: when you can make some changes and retouching, therefore this two = target circumference * after viewing The scope defined in the patent application is subject to change. Μη [Simplified description of the drawings] Fig. 1 is a schematic cross-sectional view of a conventional backlight module. FIG. 2 is a three-dimensional factory of a liquid crystal display according to an embodiment of the present invention. FIG. 2 is a partial view of a backlight module of one embodiment of the present invention: FIG. Port diagram 2C is a partial cross-sectional view of a backlight module of one embodiment of the present invention. FIG. 3 is an illustration of another backlight module of one embodiment of the present invention.勹#Profile [Main component symbol description] 100, 300: backlight module 110: light-emitting diode 112, 340 · light-emitting diode wafer 114: package structure 120, 330: circuit board 130, 310: light guide plate 130a 310a: light-incident surface 11 M333586 140, 312, 334: reflective sheet 150: lamp cover 200: liquid crystal display 310b: light-emitting surface 320: frame 322: first bonding portion 332 • second engaging portion 336: flexible Circuit board 350: optical film set 400: liquid crystal display panel 402: thin film transistor array substrate 404: color filters L, L,: light
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