M33 1779 •… 面上的距離。 前述插接部2之安置區20内分別安置有一鎖扣裝置4，該 鎖扣裝置4包括一鎖扣部40，該鎖扣部40 —端呈内扣之彎曲 狀，另一端中間凸設有凸柱41，該凸柱41與插接部2的凸柱202 相對設置並藉一鎖扣彈簧62相連接。前述凸柱41邊上設有可與 插接部2之承接面203相對應之受壓部42。前述鎖扣裝置4的 兩側各設有一與插接部2之孔洞204相配合之樞軸43。M33 1779 • The distance on the surface. A latching device 4 is disposed in the rest area 20 of the plugging portion 2, and the latching device 4 includes a latching portion 40. The latching portion 40 has an inner buckle bent at the end and a convex portion at the other end. The stud 41 is disposed opposite to the stud 202 of the plug portion 2 and connected by a latch spring 62. A pressure receiving portion 42 corresponding to the receiving surface 203 of the insertion portion 2 is provided on the side of the boss 41. Each of the two sides of the locking device 4 is provided with a pivot 43 that cooperates with the hole 204 of the insertion portion 2.
請茶閱第二圖至第五圖，本體部i上安裝有驅動體3，該驅 動體3大致呈方形框體，其四周向下垂伸有複數突板3〇，突板 30插入至本體部丨之側壁u外侧之複數槽體12中。前述驅動 體3之四個角上朝向本體部丨分別延伸有與本體部丨四個邊角上 之彈簧孔13相對應之柱體31，其可與驅動彈簧6〇相配合並插 入到前述彈簧孔13中，以使驅動體3沿上下方向移動。驅動體 3之一相對兩側設有複數按壓部32，該按壓部32在驅動體3下 矛夕之過程中可按壓鎖扣裝置4之受壓部42，以使鎖扣裝置4旋 轉約>90度。前述按壓部的旁邊設有可與凸塊22相作用之驅動塊 33、’，該驅動塊33上設有一斜面33〇可隨驅動體3往下運動時作 用前述孤面220。 。月參第一圖，為電連接器之閉合狀態。一併參考其他圖，在 閉合狀恶，插接部2於水平方向上偏向於本體部丨之腔室16的 一端，插接於其中的端子5之夾持部51〇、52〇之間的距離小於 晶片模組上錫球的直徑，鎖扣裝置4扣持於插接部2上，所有彈 簧都未被壓縮。安裝晶片模組時，對驅動體3施加外力，驅動體 3^朝〃本體部1的方向向下運動至最終位置（柱體31完全進入到 彈簧孔13中），在此過程中，所有彈簧被壓縮，驅動體3之按 壓部32按壓鎖扣裝置4之受壓部42部使得鎖扣裝置4藉極轴 43旋，約90度而使鎖扣部40離開插接部2,驅動體3之驅動塊 33擠壓、插接部2之凸塊22使得插接部2在水平方向上朝本體部 1之腔室16之另一端抵靠，此時插接部2的上端子孔％盥端子 5的活動臂52相互作用，使該活動臂52朝遠離固定臂η、的方 向移動:夾持部510、520之距離略大於晶片模組之錫球的直徑 (未圖不），此時就將晶片模組安裝於電連接 妙 加於驅動體3上的外力，由於驅動彈簣6Q之彈#恢復力後=乍去^ 7 M331779 驅動體3恢復至初始位置， 作用，插接部2朝初始位置移；於=;:二二彈簧恢復力的 臂5!移動，夹持部51〇、52ff f子5之f動臂％朝固定 鎖扣彈箬之强黎士作 字日日片核、、且之錫球夾緊，又由於 二乍Λ’鎖扣裝置4回轉靖而使鎖 時料將晶片模組拆卸出來。表面。再次在驅動體3上施加外力 組之;= 從而實現晶片模組與電路 =的，力變形，端子的接觸部與電路的 =的觸部與導電片沒有採用焊接,而是採用表面 路』:之‘電7该電連接器很容易從電路板上拆卸且不傷害電 M 述係本創作之較佳實施例，當然並不㈣此。上述端 設置，類似鑷子將晶片模組之錫球夾持，也可二 置’以類㈣刀的運動方式將錫球夾持，此時的插接部 =:Γ性部可為c型，也可為s型等其他形狀提供足夠 可不用插接部固定，而用其他的方式或直接固定 dirw述鎖扣裝置也可用其他的方式或不用鎖扣裝置而 螺絲以外的固定狀置將電連接器固定於電路板上㈣。。也了用除 心综上所述，本創作確已符合新型專利之要件，爰依法提出申 =專利。惟，以上所述者僅係本創作之較佳實施方式，本創作之 範圍並不以上述實施方式為限，舉凡熟習本案技藝之人士援依本 創作之精神所作之等效修飾或變化，皆應涵以下申請專利範 内。 国 【圖式簡單說明】 第一圖係一種習知端子的立體圖。 第二圖係本創作電連接器呈關閉狀態時的立體圖。 第三圖係本創作電連結器之立體分解圖。 第四圖係本創作電連接器之本體部的立體圖。 8Please refer to the second to fifth figures, the main body portion i is mounted with a driving body 3, the driving body 3 is substantially a square frame body, and a plurality of protruding plates 3 are downwardly extended from the periphery thereof, and the protruding plate 30 is inserted into the body portion. The plurality of grooves 12 on the outer side of the side wall u. The four corners of the driving body 3 respectively extend toward the body portion 有 respectively with a cylinder 31 corresponding to the spring hole 13 at the four corners of the body portion, which can be engaged with the driving spring 6 并 and inserted into the aforementioned spring In the hole 13, the driving body 3 is moved in the vertical direction. A plurality of pressing portions 32 are provided on opposite sides of the driving body 3, and the pressing portion 32 can press the pressure receiving portion 42 of the locking device 4 during the lowering of the driving body 3 to rotate the locking device 4 about > ;90 degrees. The driving portion 33 is disposed adjacent to the pressing portion, and the driving block 33 is provided with a slope 33 which can be used as the driving body 3 moves downward. . The first picture of the monthly reference is the closed state of the electrical connector. Referring to the other figures, in the closed state, the insertion portion 2 is biased in the horizontal direction toward the end of the chamber 16 of the body portion, and is interposed between the clamping portions 51, 52 of the terminal 5 therein. The distance is smaller than the diameter of the solder ball on the wafer module, and the locking device 4 is fastened to the plug portion 2, and all the springs are not compressed. When the wafer module is mounted, an external force is applied to the driving body 3, and the driving body 3^ moves downward toward the final body portion 1 to the final position (the cylinder 31 completely enters the spring hole 13), in the process, all the springs Compressed, the pressing portion 32 of the driving body 3 presses the pressing portion 42 of the locking device 4 so that the locking device 4 is rotated by the pole shaft 43 by about 90 degrees, so that the locking portion 40 is separated from the insertion portion 2, and the driving body 3 The driving block 33 is pressed and the bump 22 of the plug portion 2 is such that the plug portion 2 abuts against the other end of the chamber 16 of the body portion 1 in the horizontal direction. At this time, the upper terminal hole of the plug portion 2 is 盥The movable arm 52 of the terminal 5 interacts to move the movable arm 52 away from the fixed arm η: the distance between the clamping portions 510 and 520 is slightly larger than the diameter of the solder ball of the wafer module (not shown). The external force of the chip module is mounted on the driving body 3, and the spring force of the driving magazine 6Q is restored. After the restoring force = M ^ 7 M331779 The driving body 3 is restored to the initial position, and the plug portion 2 is activated. Move to the initial position; at =;: two-two spring restoring force arm 5! moves, the clamping portion 51〇, 52ff f sub-f The lock of the magazine is made by the strong lyrics of the lyrics, and the tin ball is clamped, and the wafer module is removed by the lock of the second 乍Λ's locking device 4. surface. The external force group is applied to the driving body 3 again; = thereby realizing the wafer module and the circuit=, the force is deformed, and the contact portion of the terminal and the contact portion of the circuit and the conductive piece are not welded, but the surface path is adopted: The electric connector is easily detached from the circuit board and does not harm the electrical system. The preferred embodiment of the present invention is of course not (4). The above-mentioned end arrangement is similar to the tweezers holding the solder ball of the wafer module, or the two places can be clamped by the motion of the class (four) knife, and the plug portion at this time =: the crotch portion can be c-type. It can also provide sufficient shape for other shapes such as s-type to be fixed without the use of the plug-in part, and the latching device can be fixed by other means or directly by fixing the dirw, or can be electrically connected by other means or without a locking device. The device is fixed on the circuit board (4). . Also, in addition to the above, the creation has indeed met the requirements of the new patent, and the patent is filed according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and those who are familiar with the skill of the present invention are equivalent to the equivalent modifications or changes made by the spirit of the present creation. The following application patents should be included. Country [Simplified description of the drawings] The first figure is a perspective view of a conventional terminal. The second figure is a perspective view of the present invention when the electrical connector is in a closed state. The third figure is an exploded view of the present electrical connector. The fourth figure is a perspective view of the body portion of the present electrical connector. 8