TWI840707B - Chip socket - Google Patents
Chip socket Download PDFInfo
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- TWI840707B TWI840707B TW110137946A TW110137946A TWI840707B TW I840707 B TWI840707 B TW I840707B TW 110137946 A TW110137946 A TW 110137946A TW 110137946 A TW110137946 A TW 110137946A TW I840707 B TWI840707 B TW I840707B
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- Prior art keywords
- chip
- fixing
- receiving cavity
- locking mechanism
- cam
- Prior art date
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- 238000010586 diagram Methods 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000009413 insulation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
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Abstract
Description
本發明有關一種晶片連接器,尤其涉及一種具有鎖固機構的晶片連接器。 The present invention relates to a chip connector, and more particularly to a chip connector with a locking mechanism.
中國實用新型專利第CN202712640U號揭示了一種晶片連接器,用於電性連接晶片模組,包括基座、保持於基座的導電端子,基座定義了支撐晶片模組的上表面、與上表面相對的下表面及複數貫穿所述兩表面的端子槽,導電端子收容於端子槽且部分突出於上表面,基座於上表面設置用來固定晶片模組的定位塊及將定位塊固定於上表面的定位件,所述定位件套於定位塊上且延伸出鎖扣臂,鎖扣臂經由端子槽而鎖靠於下表面而將定位件固定,定位件還設有將鎖扣臂解除鎖靠的解扣部。該晶片連接器可測試不同幾何尺寸的晶片模組。該晶片連接器通過常規定位塊穩固晶片模組。 China Utility Model Patent No. CN202712640U discloses a chip connector for electrically connecting a chip module, including a base, a conductive terminal held on the base, the base defines an upper surface supporting the chip module, a lower surface opposite to the upper surface, and a plurality of terminal slots penetrating the two surfaces, the conductive terminal is accommodated in the terminal slot and partially protrudes from the upper surface, the base is provided with a positioning block for fixing the chip module and a positioning member for fixing the positioning block to the upper surface on the upper surface, the positioning member is sleeved on the positioning block and extends a locking arm, the locking arm is locked against the lower surface through the terminal slot to fix the positioning member, and the positioning member is also provided with a release portion for releasing the locking arm. The chip connector can test chip modules of different geometric sizes. The chip connector stabilizes the chip module through a conventional positioning block.
是故,確有必要提供一種改進的晶片連接器,以克服上述缺陷。 Therefore, it is necessary to provide an improved chip connector to overcome the above defects.
本發明所要解決的技術問題係提供一種具有鎖固機構的晶片連接器。 The technical problem to be solved by the present invention is to provide a chip connector with a locking mechanism.
為解決上述技術問題,本發明採用如下技術方案:一種晶片連接器,包括承載有端子的本體、圍繞所述本體而形成收容腔的限位座及鎖固機構,所述收容腔用來收容晶片,所述收容腔向上開口且具有複數內壁面;所述鎖固機構包括操作部及固定部;所述操作部帶動所述固定部施力於所述晶片而將所述晶片固定於晶片收容腔內,或解除所述固定部對晶片的固定。 In order to solve the above technical problems, the present invention adopts the following technical solutions: a chip connector, including a body carrying terminals, a limit seat surrounding the body to form a receiving cavity, and a locking mechanism, the receiving cavity is used to receive the chip, the receiving cavity is upwardly open and has a plurality of inner wall surfaces; the locking mechanism includes an operating part and a fixing part; the operating part drives the fixing part to apply force to the chip to fix the chip in the chip receiving cavity, or releases the fixing part from fixing the chip.
與先前技術相比,本發明具有如下有益效果:本發明的鎖固機構 可以抵壓晶片,實現對晶片的卡位固定,也可以遠離晶片,方便對晶片的自由取放。 Compared with the previous technology, the present invention has the following beneficial effects: the locking mechanism of the present invention can press against the chip to achieve the fixed position of the chip, and can also be far away from the chip to facilitate the free placement of the chip.
100:晶片連接器 100: Chip connector
10:本體 10: Body
11:絕緣子板 11: Insulation sub-board
200:晶片 200: Chip
20:限位座 20: Limit seat
201:收容腔 201: Receiving chamber
202:內壁面 202: Inner wall surface
21:側壁 21: Side wall
22:凸塊 22: Bump
221:內壁面 221: Inner wall surface
30:鎖固機構 30: Locking mechanism
31:操作部 31: Operation Department
310:凸輪部 310: Cam part
311:平行邊 311: Parallel edges
312:弧型邊 312: Arc edge
32:移動塊 32:Move block
320:固定部 320: Fixed part
321:連接部 321:Connection part
322:圓孔 322: Round hole
33:彈簧 33: Spring
34:樞轉軸 34: Pivot axis
40:PCB板 40: PCB board
50:散熱背板 50: Heat dissipation back panel
60:下壓組件 60: Press down assembly
R1、R2:半徑 R1, R2: Radius
70:散熱組件 70: Heat dissipation component
80:固定座 80: Fixed seat
第一圖係本發明晶片連接器處於打開狀態且未安裝晶片的立體圖;第二圖係第一圖組裝入晶片並鎖固晶片的立體圖;第三圖係第二圖晶片連接器處於閉合狀態的立體圖;第四圖係第二圖去上方下壓元件以及散熱元件的立體圖;第五圖係第四圖取出晶片的立體示意圖;第六圖係第五圖的立體分解圖;第七圖係本發明鎖固機構其中一側未裝入移動塊的立體分解圖;第八圖係第七圖另一角度的立體圖;第九圖係本發明鎖固機構的正視圖;第十圖係本發明鎖固機構部分結構的立體分解圖;第十一圖係本發明鎖固機構與限位座的結構示意圖;第十二圖係晶片自由狀態時,晶片、限位座以及鎖固機構於彈簧處沿豎直方向的剖視圖;及第十三圖係晶片鎖固狀態時,晶片、限位座以及鎖固機構於彈簧處沿豎直方向的剖視圖。 The first figure is a three-dimensional diagram of the chip connector of the present invention in an open state and without a chip installed; the second figure is a three-dimensional diagram of the first figure with a chip installed and locked; the third figure is a three-dimensional diagram of the chip connector of the second figure in a closed state; the fourth figure is a three-dimensional diagram of the second figure without the upper pressing element and the heat dissipation element; the fifth figure is a three-dimensional schematic diagram of the fourth figure with the chip removed; the sixth figure is a three-dimensional exploded diagram of the fifth figure; the seventh figure is a three-dimensional exploded diagram of one side of the locking mechanism of the present invention without a moving block installed ; Figure 8 is a three-dimensional view of Figure 7 from another angle; Figure 9 is a front view of the locking mechanism of the present invention; Figure 10 is a three-dimensional exploded view of the partial structure of the locking mechanism of the present invention; Figure 11 is a schematic diagram of the structure of the locking mechanism and the limit seat of the present invention; Figure 12 is a cross-sectional view of the chip, the limit seat and the locking mechanism at the spring along the vertical direction when the chip is in a free state; and Figure 13 is a cross-sectional view of the chip, the limit seat and the locking mechanism at the spring along the vertical direction when the chip is in a locked state.
請參第一圖至第三圖所示,一種晶片連接器100,用以測試晶片200,晶片連接器100包括本體10、圍繞本體10而形成收容腔201的限位座20、位於限位座20週邊的固定座80及鎖固機構30,固定座80為中空的框體結構,限位座20、本體10及鎖固機構30均位於其內。本發明的改善點在於收容腔201用來收容晶片200,鎖固機構30可延伸入收容腔201內抵接鎖固晶片200,防止晶片正常工作時產生晃動;非工作狀態時,操作鎖固機構30,使其遠離晶片200,方便使用者無障礙地取放晶片。
Please refer to the first to third figures, a
晶片連接器100的上方設置有樞接於固定座80上方的下壓元件60以及散熱元件70。散熱元件70固定於下壓元件60,下壓元件60一側樞接於固定座80,且可繞一樞轉軸相對固定座80旋轉下壓,於晶片200裝入收容腔201時,向下旋轉所述下壓組件60,進而帶動散熱元件70向下移動並最終接觸晶片200,從而匯出晶片200測試過程中產生的熱量。下壓元件60同時也提供對晶片200的下壓力,使其與下方本體10內的端子實現穩定的電性連接。本體10承載有導電端子(未圖示),導電端子電性抵接晶片200。參第六圖,本體10同時安裝於PCB板40上,導電端子與PCB板也達成電性連接,散熱背板50貼覆於PCB板下方,將端子產生的熱量匯出。本實施例中,本體10安裝於PCB板40上方且由三塊絕緣子板堆疊形成,其中最上方的絕緣子板11為浮動板,當晶片200受力被下壓時,其與浮動板同時往下。位於浮動板下方的兩塊絕緣子板為固定子板,用以固定導電端子(未圖示)。
A
參第四圖至第六圖所示,限位座20為安裝於本體10上,其具有四側壁21,四側壁21圍設形成向上開口的上述收容腔201,收容腔具有複數內壁面202。其中一側壁兩端分別向外凸設形成凸塊22,所述鎖固機構30則安裝於所述凸塊22上,並由固定座80作進一步限制。
As shown in the fourth to sixth figures, the
繼續參第七圖至第十一圖,所述鎖固機構30安裝於所述限位座20,鎖固機構30包括操作部31及固定部320;操作部31帶動固定部32施力於晶片200而將晶片固定於晶片收容腔201內,或解除固定部32對晶片200的固定。晶片200從上向下組裝入收容腔201,固定部32則沿於垂直於上下方向的橫向方向進入收容腔201,固定部320穿過內壁面202而可緊緊地抵壓於晶片200的側面。鎖固機構30還包括一彈簧33,彈簧彈性抵壓於固定部320,以增加固定部施力於晶片200的作用力,進而晶片連接器工作時,晶片200可穩固位於收容腔201內。參第七圖至第十圖,具體地,鎖固機構30包括移動塊32、操作桿31、彈簧33以及樞轉軸34,操作桿即為上述操作部31。操作部31包括凸輪部310,移動塊32的內側端形成所述固定部320,相對的外側端則穿過凸塊設置的貫穿孔(未圖
示)而形成連接部321,連接部321與凸輪部通過一樞轉軸34而實現彼此連接,所述凸輪部310抵壓於所述側壁21的外壁面且具有不同的半徑R,操作部31旋轉而使得凸輪部旋轉,從而帶動移動塊32朝遠離或者接近所述收容腔201的方向移動,參第十二圖至第十三圖所示。
Continuing to refer to FIG. 7 to FIG. 11, the
參第十二圖至第十三圖所示,當操作桿31向上旋轉處於豎直狀態時,凸輪部310抵壓於側壁的外壁面而具有較大半徑R1,此時移動塊32向外移動一段距離,使得固定部320遠離收容腔201,且不會抵接晶片200。當操作桿31旋轉至水平狀態時,凸輪部310抵壓於側壁的外壁面而具有較小半徑R2(R1大於R2),此時移動塊32相較之前狀態向內移動一段距離,使得固定部320靠近收容腔201移動,最終抵接晶片200。以上兩種半徑具體解釋為:凸輪部310包括兩平行邊311及連接平行邊的弧型邊312,樞轉軸34與弧型邊的頂點的半徑R2小於所述樞轉軸34與平行邊311的半徑R1。固定部320抵接晶片200時,晶片200被穩固收容於收容腔201內,旋轉上述操作部31,使得固定部320遠離晶片200,此時晶片200可被自由地取放。
As shown in FIGS. 12 to 13, when the
如第七圖至第十圖所示,彈簧33設置於固定部320與側壁21的內壁面之間,並預設呈彈性抵壓於固定部320。具體地,鎖固機構30每一側包括兩彈簧33,移動塊32的連接部321的尺寸較固定部320窄,固定部設有兩圓孔322,彈簧的一端插入圓孔322內,而另一端則露出固定部320且位於連接部321的兩側,自由狀態時,彈簧的另一端臨近操作部的凸輪部310,安裝入限位座20內呈壓縮狀態時,彈簧的另一端向外延伸且直至其抵壓於凸塊22的內壁面221,第十一圖至第十三圖可見。彈簧33被壓縮後產生對固定部320向內的抵壓力,繼而增加了固定部320向內施力於晶片200的作用力。鎖固機構30為軸對稱結構,其包括位於其兩側的兩移動塊32及與移動塊配合的兩凸輪部310,兩凸輪部310之間連接有一操作部31,操作部31設置成與上述平行邊311相平行。
As shown in Figures 7 to 10, the
應當指出,以上所述僅為本發明的最佳實施方式,不是全部的實施方式,本領域普通技術人員通過閱讀本發明說明書而對本發明技術方案採取 的任何等效的變化,均為本發明的申請專利範圍所涵蓋。 It should be pointed out that the above is only the best implementation method of the present invention, not all implementation methods. Any equivalent changes made to the technical solution of the present invention by ordinary technicians in this field after reading the specification of the present invention are covered by the scope of the patent application of the present invention.
11:絕緣子板 11: Insulation sub-board
20:限位座 20: Limit seat
22:凸塊 22: Bump
30:鎖固機構 30: Locking mechanism
201:收容腔 201: Receiving chamber
202:內壁面 202: Inner wall surface
21:側壁 21: Side wall
40:PCB板 40: PCB board
50:散熱背板 50: Heat dissipation back panel
80:固定座 80: Fixed seat
Claims (9)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011160815.8 | 2020-10-27 | ||
CN202011160815.8A CN112260007A (en) | 2020-10-27 | 2020-10-27 | Chip connector |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202230906A TW202230906A (en) | 2022-08-01 |
TWI840707B true TWI840707B (en) | 2024-05-01 |
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Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4260210A (en) | 1979-06-29 | 1981-04-07 | International Business Machines Corporation | Pluggable module actuation and retention device |
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4260210A (en) | 1979-06-29 | 1981-04-07 | International Business Machines Corporation | Pluggable module actuation and retention device |
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