TWM331726U - Condenser microphone with filter in sound hole of case - Google Patents

Condenser microphone with filter in sound hole of case Download PDF

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Publication number
TWM331726U
TWM331726U TW096218541U TW96218541U TWM331726U TW M331726 U TWM331726 U TW M331726U TW 096218541 U TW096218541 U TW 096218541U TW 96218541 U TW96218541 U TW 96218541U TW M331726 U TWM331726 U TW M331726U
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TW
Taiwan
Prior art keywords
moisture
sound hole
condenser microphone
microphone
unit
Prior art date
Application number
TW096218541U
Other languages
Chinese (zh)
Inventor
Chung-Dam Song
Jong-Sub Lee
Original Assignee
Bse Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of TWM331726U publication Critical patent/TWM331726U/en

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/04Microphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/02Casings; Cabinets ; Supports therefor; Mountings therein
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/12Sanitary or hygienic devices for mouthpieces or earpieces, e.g. for protecting against infection
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/02Details casings, cabinets or mounting therein for transducers covered by H04R1/02 but not provided for in any of its subgroups

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Description

M331726 八、新型說明: 【新型所屬之技術領域】 本新型關於電容傳聲器,更詳細而言,關於聲孔上設 • 置有防震和防潮單元的電容傳聲器。 % 【先前技術】 通常,廣泛使用於行動通信終端或音響等的電容傳聲 器由如下部分構成:偏壓元件;一對膜片/背板,其用於形 成與聲壓對應地變化的電容器(c);以及接面場效應電晶 體(JFET),其用於缓衝輸出信號。這種典型方式的電容傳 聲器透過如下方式製造:在一個殼體内一體地組裝振動 板、隔環、絕緣環、背板、導電環、印刷電路板(PCB) 之後,將殼體的末端捲曲(curling)。 而且,如第一圖(a)、(b)所示,通常在電容傳聲器 的殼體20上形成有多個聲孔20a,為了防止外部的灰塵等 • 透過該聲孔20a流入到傳聲器内部而造成傳聲器音質下 降,如第二圖和第三圖所示,將無紡布10黏貼到傳聲器殼 ' 體20的外部,或者,將與無紡布作用的金屬片10’黏貼到 ‘ 傳聲器内部。 但是,將無紡布10黏貼到傳聲器殼體20外部的情況 下,不僅需要追加用於黏貼無紡布10的製造程序,還存在 因無紡布露出而產生不便的問題。為了解決這種問題,在 傳聲器殼體20内部附加與無紡布作用的金屬片10’的情況 下,存在電容傳聲器的厚度相應增加、平滑度下降的問題。 M331726 尤其疋,如第三圖所示,在將金屬片1〇,安裝到傳聲器 内相結射,組裝時,振動板的極環(polaning)按遷 金屬片,使得金屬的中央部向振_ (膜片)側堆積, 破壞金屬片的平滑度,使金屬片與振動膜接觸,從而在振 動膜上產生不良。亦即,金屬片與振動膜接觸的同時,在 振動膜上產生劃痕(flaw),這種劃痕成為smd回流焊 (reflow)不良的原因。另外,如第三圖所示將金屬片⑽ 女衣到傳耳為内部的結構存在如下問題:進行恆溫/恆濕測 試時,金屬片上殘留濕氣而引起不良。 【新型内容】 、本疋為了解決上述問題而提出的,本新型的目的 :帛在设體的聲孔巾—體形成有防震和防潮單 兀的電容傳聲器。 干 刷電路述目的,本新型的電容傳聲器在娜 械結構,料_之間包括由—對振純和背板構顧 形,兮麻矣吸體的一面開口而由底表面和侧壁形成為 塵和渴ur成有聲孔,該聲孔中用於防止外料 二的防震和防潮單元與該殼體形成為-體。 微孔或口元是形成於該殼體的聲孔中 力,並且, )°亥防展和防潮單元借助支架增強> 震和防潮單-為表面的巾央形成有—個或至少兩個11 上。 70,或者該防震和防潮單元形成在整個底肩 M331726 如上所述,根據本新型,在電容傳聲器中,用於防止 外部的灰塵或濕氣透過聲孔流入到傳聲器内部的防震和防 潮單元(無紡布、金屬片等)直接與殼體的聲孔一體形成, • 從而解決了以往那樣無紡布露出到殼體外部或插入到殼體 、 的内側空間時產生的問題。亦即,本新型能夠解決由於無 紡布露出所引起的問題和在傳聲器殼體的内侧附加與無紡 布作用的金屬片時電容傳聲器的厚度相應增加的問題,還 能夠解決安裝到殼體内部的金屬片的平滑度下降而引起的M331726 VIII. New description: [New technical field] The new type relates to a condenser microphone. More specifically, a condenser microphone with a shockproof and moisture-proof unit is provided on the sound hole. % [Prior Art] Generally, a condenser microphone widely used in a mobile communication terminal or an audio system is constituted by a biasing element, a pair of diaphragms/back plates for forming a capacitor that changes in accordance with sound pressure (c) And a junction field effect transistor (JFET) that is used to buffer the output signal. This typical mode of condenser microphone is manufactured by integrally assembling a vibrating plate, a spacer ring, an insulating ring, a back plate, a conductive ring, a printed circuit board (PCB) in a housing, and then crimping the end of the housing ( Curling). Further, as shown in the first drawings (a) and (b), a plurality of sound holes 20a are generally formed in the casing 20 of the condenser microphone, and the external sound is prevented from flowing into the inside of the microphone through the sound hole 20a. The sound quality of the microphone is lowered. As shown in the second and third figures, the nonwoven fabric 10 is adhered to the outside of the microphone housing 20, or the metal sheet 10' which acts with the nonwoven fabric is adhered to the inside of the microphone. However, when the nonwoven fabric 10 is adhered to the outside of the microphone casing 20, it is necessary to add not only the manufacturing procedure for adhering the nonwoven fabric 10 but also the inconvenience caused by the exposure of the nonwoven fabric. In order to solve such a problem, in the case where the metal piece 10' which acts on the inside of the microphone case 20 is added to the inside of the microphone case 20, there is a problem that the thickness of the condenser microphone is increased correspondingly and the smoothness is lowered. M331726 In particular, as shown in the third figure, when the metal piece is mounted to the microphone, the pole is attached. When assembled, the pole of the vibrating plate is moved to the metal piece, so that the central part of the metal is vibrated. The (membrane) side is deposited, and the smoothness of the metal piece is broken, and the metal piece is brought into contact with the vibrating film to cause a defect in the vibrating film. That is, the metal piece is in contact with the vibrating film, and a flaw is generated on the vibrating film, which is a cause of poor reflow of the smd. Further, as shown in the third figure, the structure in which the metal piece (10) is transferred to the inside of the ear has the following problem: when the constant temperature/humidity test is performed, moisture remains on the metal piece to cause a defect. [New content] In order to solve the above problems, the purpose of the present invention is to form a condenser microphone with a shockproof and moisture proof single body in the sound hole towel body of the body. The purpose of the dry brush circuit is that the condenser microphone of the present invention comprises: a pair of pure vibration and a back plate shape, and a side surface and a side wall of the ramie suction body are formed by the bottom surface and the side wall. The dust and the thirsty ur are formed into sound holes, and the anti-vibration and moisture-proof unit of the sound hole for preventing the outer material 2 is formed into a body. The micro-hole or port element is formed in the sound hole of the housing, and the defensive and moisture-proof unit is reinforced by the bracket. The shock and moisture-proof sheets are formed on the surface of the towel at one or at least two. 70, or the shock-proof and moisture-proof unit is formed on the entire bottom shoulder M331726. According to the present invention, in the condenser microphone, a shock-proof and moisture-proof unit for preventing external dust or moisture from flowing into the inside of the microphone through the sound hole (none The woven fabric, the metal sheet, and the like are formed integrally with the sound hole of the casing, and the problem that occurs when the nonwoven fabric is exposed to the outside of the casing or inserted into the inner space of the casing is solved. That is, the present invention can solve the problem caused by the exposure of the nonwoven fabric and the corresponding increase in the thickness of the condenser microphone when the metal sheet acting on the inside of the microphone housing is added to the inside of the microphone housing, and can also be solved to be mounted inside the casing. Caused by the smoothness of the metal sheet

I 問題。 另外,如果像本新型這樣在殼體的聲孔上以一體方式 形成防震和防潮單元,則在高溫下也不會發生熱變形,從 而能夠直接應用到SMD中,可以解決由無紡布不良引起的 問題,具有程序簡化的優點。 【實施方式】 | 下面,參照附圖詳細說明本新型的較佳實施例。 第四圖(a)、(b)是表示本新型的聲孔上設置有防 ’ 震和防潮單元的電容傳聲器殼體的第一實施例,(a)為俯 • 視圖,(b)為侧截面圖。 如第四圖(a)、(b)所示,本新型的電容傳聲器殼 體102為一面開口的圓筒形,底表面的中央形成有圓形的聲 孔102a,並且,聲孔102a上形成有篩網104,以作為與現有 的無紡布相同功能的防震和防潮單元,防止異物透過聲孔 102a流入到傳聲器内部。 7 M3 31726 本新型的在殼體102的聲孔102a上形成防震和防潮單 元的方式可以採用利用了真空靶(target)的方式、超微細 加工技術、微加工技術等多種方式,防震和防潮單元的形 狀可以採用單方向或雙方向篩網或者圓形或多邊形形狀的 微孔等多種形狀。 第五圖(a)、(b)是表示本新型的聲孔上設置有防 震和防潮單元的電容傳聲器殼體的第二實施例,(a)為俯 視圖,(b)為側截面圖。 · . 赫 如第五圖(a)、(b)所示,本新型的電容傳聲器殼 體2 02為一面開口的圓筒形,底表面的中央形成有圓形的聲 孔202a,並且,聲孔2〇2a上形成有篩網2〇4,以作為與現有 的無紡布相同功能的防震和防潮單元,而且,為了提高支 承強度,還形成有將聲孔2〇2a劃分為十字型的支架206。如 上所述,本新型的傳聲器殼體202在聲孔202a自身上形成與 無紡布作用的篩網204,能夠防止異物透過聲孔202a流入到 傳聲器内部。 根據本新型,在殼體1〇2的聲孔102a上形成防震和防潮 單元的方式可以採用利用了真空靶的方式、超微細加工技 術、微加工技術等多種方式,防震和防潮單元的形狀可以 採用單方向或雙方向篩網或者圓形或多邊形形狀的微孔等 多種形狀。 第六圖是本新型的聲孔上設置有防震和防潮單元的電 各傳聲器的側戴面圖。 根據本新型,聲孔102a上設置有防震和防潮單元104 M331726 的電容傳聲ϋ如第六圖所示’殼體1G2的聲孔膨上形成有 防震和防潮單·4,以防止外部的異物流人到傳聲器内 部0I question. In addition, if the shock-proof and moisture-proof unit is integrally formed on the sound hole of the casing as in the present invention, thermal deformation does not occur at a high temperature, so that it can be directly applied to the SMD, and the problem caused by the nonwoven fabric can be solved. The problem has the advantage of program simplification. [Embodiment] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The fourth diagrams (a) and (b) show a first embodiment of the condenser microphone housing in which the anti-shock and moisture-proof unit is provided on the sound hole of the present invention, (a) being a tilted view, and (b) being a side. Sectional view. As shown in the fourth (a) and (b), the condenser microphone housing 102 of the present invention has a cylindrical shape with an open side, a circular acoustic hole 102a is formed in the center of the bottom surface, and the sound hole 102a is formed. The screen 104 has a shock-proof and moisture-proof unit having the same function as the conventional nonwoven fabric, and prevents foreign matter from flowing into the inside of the microphone through the sound hole 102a. 7 M3 31726 The method for forming the anti-vibration and moisture-proof unit on the sound hole 102a of the casing 102 can adopt various methods such as a vacuum target, ultra-fine processing technology, micro-machining technology, etc., shockproof and moisture-proof unit. The shape may be a plurality of shapes such as a single direction or a double direction sieve or a circular or polygonal shape. Fig. 5 (a) and (b) are views showing a second embodiment of a condenser microphone case in which a shock absorbing and moisture-proof unit is provided in the sound hole of the present invention, (a) being a plan view and (b) being a side sectional view. According to the fifth diagrams (a) and (b) of the present invention, the condenser microphone housing 102 of the present invention has a cylindrical shape with an open side, and a circular sound hole 202a is formed in the center of the bottom surface, and the sound is A screen 2〇4a is formed on the hole 2〇2a to serve as a shock-proof and moisture-proof unit having the same function as the conventional nonwoven fabric, and in order to improve the support strength, the sound hole 2〇2a is also formed into a cross type. Bracket 206. As described above, the microphone housing 202 of the present invention forms the screen 204 acting on the sound hole 202a itself against the nonwoven fabric, and prevents the foreign matter from flowing into the inside of the microphone through the sound hole 202a. According to the present invention, the manner of forming the anti-vibration and moisture-proof unit on the sound hole 102a of the casing 1〇2 can adopt various methods such as a vacuum target method, ultra-fine processing technology, and micro-machining technology, and the shape of the anti-vibration and moisture-proof unit can be A variety of shapes such as a single- or double-direction screen or a micro-hole of a circular or polygonal shape are used. The sixth figure is a side view of the electric microphones provided with the anti-vibration and moisture-proof units on the sound hole of the present invention. According to the present invention, the acoustic hole 102a is provided with a condenser sound transmission of the shockproof and moisture-proof unit 104 M331726. As shown in the sixth figure, the sound hole of the casing 1G2 is swollen to form a shockproof and moisture-proof single 4 to prevent external differences. Logistics person to the inside of the microphone 0

爹見第六圖,本新型的電容傳聲器由如下部分構成: 振動板Η)6,其透過殼體收與咖側電連接,斑可動電極 的作用;間隔物108;絕緣環㈣;背板m,其上形成有駐 極體’與固定電極的作用;導電環114,其使背板112向pcB 侧導電;以及PCB 116 ’其上安裝有電路元件(未圖示), 用於將借助經由聲孔102a流入的聲壓而在振動板1〇6和背 板112之間呈現出的靜電容量變化轉換為電聲音信號之後 放大。這類電容傳聲器的内部結構只是一個示例,本新型 可以應用於各種結構的傳聲器。 如上所述,根據本新塑,在殼體的聲孔上直接設置執 行與現有的無紡布相同功能的篩網的情況下,由於無需向 以往那樣在殼體的外侧黏貼無紡布或在殼體内附加金屬片 ,因此,具有能夠縮短傳聲器組裝程序、減少傳聲器厚度 的優點。尤其疋,在设體的内部附加金屬片的情況下,附 加金屬片導致平滑度下降,%起各種不良,但是,本新型 的電容傳聲器的組裝體無需金屬片,因此,具有平滑度良 好的優點。 另一方面,根據本新塑,在電容傳聲器的聲孔102&上 設置防震和防潮單元104的方式可以採用如下幾種方式:在 设體102上形成一個杈大的聲孔的方式;在殼體上分別 形成兩個以上聲孔的方式;或者’在殼體1〇2的整個底表面 9 M331726 上形成聲孔的方式等。 第七圖是本新型的在殼體上形成有兩個以上聲孔的傳 聲器殼體的例子。 參見第七圖,在利用微加工技術製作殼體302的過程中 ,在聲孔302a上形成微細孔或篩網304,以防止外部的灰塵 或濕氣等透過聲孔302a流入到傳聲器内部。第七圖的情況 下,除了聲孔的數量,其他與前面的實施例相同,因此, 省略詳細說明。 • * · . * 以上的實施例中,以圓筒形的傳聲器為例進行了說明 ,但這只不過是一個實施例,本新型可以直接應用於多邊 形形狀的傳聲器等其他形狀的傳聲器中。 【圖式簡單說明】 第一圖(a)、(b)是表示現有的電容傳聲器的殼體 的示意圖。 第二圖是表示在現有的電容傳聲器中在殼體外侧黏貼 無紡布作為防震和防潮單元的例子。 第三圖是表示在現有的電容傳聲器中在殼體内侧黏貼 金屬片作為防震和防潮單元的例子。 第四圖(a)、(b)是表示本新型的聲孔上設置有防 震和防潮單元的傳聲器殼體的第一實施例。 第五圖(a)、(b)是表示本新型的聲孔上設置有防 震和防潮單元的傳聲器殼體的第二實施例。 第六圖是表示本新型的聲孔上設置有防震和防潮單元 M331726 的電容傳聲器的侧截面圖。 第七圖是表示本新型的聲孔上設置有防震和防潮單元 的傳聲器殼體的其他實施例。Referring to the sixth figure, the condenser microphone of the present invention is composed of the following parts: a vibrating plate 6) 6, which is electrically connected to the coffee side through the housing, the action of the spot movable electrode; the spacer 108; the insulating ring (four); the back plate m Having an electret' and a fixed electrode formed thereon; a conductive ring 114 that electrically conducts the backing plate 112 toward the pcB side; and a PCB 116' on which a circuit component (not shown) is mounted for The sound pressure that the sound hole 102a flows in and the electrostatic capacitance change that appears between the vibration plate 1〇6 and the back plate 112 is converted into an electric sound signal and then amplified. The internal structure of such a condenser microphone is just an example, and the present invention can be applied to microphones of various structures. As described above, according to the present invention, when a screen that performs the same function as the conventional nonwoven fabric is directly provided on the sound hole of the casing, it is not necessary to adhere the nonwoven fabric to the outside of the casing as in the prior art. Since the metal piece is attached to the casing, there is an advantage that the microphone assembly process can be shortened and the thickness of the microphone can be reduced. In particular, when a metal piece is added to the inside of the body, the addition of the metal piece causes a decrease in smoothness, and the % causes various defects. However, the assembly of the condenser microphone of the present invention does not require a metal piece, and therefore has a good smoothness. . On the other hand, according to the present invention, the manner of providing the anti-vibration and moisture-proof unit 104 on the sound hole 102& of the condenser microphone can be adopted in the following manners: a method of forming a large sound hole on the body 102; The manner in which two or more sound holes are respectively formed on the body; or the manner in which the sound holes are formed on the entire bottom surface 9 M331726 of the casing 1〇2. The seventh figure is an example of the present invention having a microphone housing in which two or more sound holes are formed in a casing. Referring to the seventh drawing, in the process of manufacturing the casing 302 by the micromachining technique, fine holes or screens 304 are formed in the sound holes 302a to prevent external dust or moisture or the like from flowing into the inside of the microphone through the sound holes 302a. In the case of the seventh figure, the number of the sound holes is the same as that of the previous embodiment, and therefore detailed description thereof will be omitted. • * · . * In the above embodiment, a cylindrical microphone has been described as an example. However, this is merely an embodiment. The present invention can be directly applied to microphones of other shapes such as a microphone having a polygonal shape. BRIEF DESCRIPTION OF THE DRAWINGS The first figures (a) and (b) are schematic views showing the housing of a conventional condenser microphone. The second figure shows an example in which a non-woven fabric is adhered to the outside of the casing as a shockproof and moisture-proof unit in the conventional condenser microphone. The third figure shows an example in which a metal piece is adhered to the inside of the casing as an anti-vibration and moisture-proof unit in the conventional condenser microphone. The fourth diagrams (a) and (b) show a first embodiment of the microphone housing in which the vibration and moisture-proof unit of the present sound hole is provided. Fig. 5 (a) and (b) show a second embodiment of the microphone case in which the shockproof and moisture-proof unit is provided on the sound hole of the present invention. The sixth drawing is a side sectional view showing a condenser microphone in which the shockproof and moisture-proof unit M331726 is provided on the sound hole of the present invention. Fig. 7 is a view showing another embodiment of the microphone case in which the shockproof and moisture-proof unit is provided on the sound hole of the present invention.

【主要元件符號說明】 10 無紡布 10, 金屬片 20 殼體 20a 聲孔 102 殼體 102a 聲孔 104 防震和防潮單元 106 防震和防潮單元 108 間隔物 110 絕緣環 112 背板 114 導電環 116 PCB 104 篩網 202 殼體 202a 聲孔 204 篩網 206 支架 302 殼體 11 M331726 302a 304 聲孔 篩網 12[Main component symbol description] 10 Non-woven fabric 10, metal sheet 20 Housing 20a Sound hole 102 Housing 102a Sound hole 104 Shockproof and moisture-proof unit 106 Shockproof and moisture-proof unit 108 Spacer 110 Insulation ring 112 Back plate 114 Conductive ring 116 PCB 104 Screen 202 Housing 202a Sound hole 204 Screen 206 Bracket 302 Housing 11 M331726 302a 304 Sound hole screen 12

Claims (1)

M331726 九、申請專利範圍: 1· 一種擎孔上設置有防震和防潮單元的電容傳聲器,該電 容傳聲ϋ在殼體和印刷電路板之間包括由_對振動板和 背板構成的機械結構’該電容傳聲器的特徵在於,該殼 體的Φ開口而由底表面和侧壁形成為筒形,該底表面 上形成有聲孔,該聲孔巾餘防 灰 入的防震和防湖單元舆該殼體形成為一想。一 的聲孔上設置有防震和防 孔單元 3.根據申請專利範圍第2 巾 潮單元的電容傳聲器,复^、荦孔上汉置有防震和防 借助支架增強支承力。/、特徵在於,該防震和防潮單元 4·根據申請專利範圍第1項、、 潮單元的電容傳聲器,其^述的聲孔上設置有防震和防 形成有-個或至少兩個讀防,在於,在該底表面的中央 和防潮單元形成在整個底表防潮單兀,或者該防震M331726 Nine, the scope of application for patents: 1. A condenser microphone with a shock-proof and moisture-proof unit on the engine hole, the capacitor-transmitting sound between the casing and the printed circuit board includes a mechanical structure composed of a vibration plate and a back plate The condenser microphone is characterized in that the Φ opening of the casing is formed into a cylindrical shape by the bottom surface and the side wall, and the bottom surface is formed with a sound hole, and the sound hole towel is provided with an anti-shock and anti-lake unit. The casing is formed as a thought. The sound hole of one is provided with a shockproof and anti-hole unit. 3. According to the condenser microphone of the second unit of the patent application scope, the upper and lower pupils are provided with anti-vibration and anti-bracket support to enhance the supporting force. /, characterized in that the anti-vibration and moisture-proof unit 4) according to the first aspect of the patent application scope, the condenser microphone of the tide unit, the sound hole of the description is provided with anti-shock and anti-formation with - or at least two read defenses, In that, the center of the bottom surface and the moisture-proof unit are formed on the entire bottom surface of the moisture-proof unit, or the shockproof
TW096218541U 2006-12-18 2007-11-02 Condenser microphone with filter in sound hole of case TWM331726U (en)

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KR20100092992A (en) * 2009-02-11 2010-08-24 주식회사 비에스이 Method of making sound hole in case of condenser microphone and the condenser microphone case
KR20110004076U (en) * 2009-10-19 2011-04-27 주식회사 비에스이 Condensor microphone
KR101109102B1 (en) * 2010-01-18 2012-01-31 주식회사 비에스이 Mems microphone package
KR101894580B1 (en) * 2011-05-19 2018-09-04 엘지전자 주식회사 Fluid circulating unit, mobile terminal having it and control method therof
KR101339909B1 (en) * 2012-04-30 2013-12-10 전자부품연구원 Microphone package
KR101303954B1 (en) * 2012-12-14 2013-09-05 주식회사 비에스이 Bottom port type microphone assembly for wide band and water proof
KR101661923B1 (en) * 2015-05-27 2016-10-04 (주)파트론 Microphone package
KR102091112B1 (en) 2018-12-18 2020-03-19 한국기계연구원 Microphone and method of packaging the same

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KR200141158Y1 (en) * 1996-08-21 1999-05-15 변봉덕 Cap for microphone
JP3609031B2 (en) 2001-03-01 2005-01-12 ホシデン株式会社 Condenser microphone
JP4188325B2 (en) 2005-02-09 2008-11-26 ホシデン株式会社 Microphone with built-in dustproof plate
KR200415820Y1 (en) 2006-02-13 2006-05-08 주식회사 씨에스티 Microphone assembly

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