KR101661923B1 - Microphone package - Google Patents

Microphone package Download PDF

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Publication number
KR101661923B1
KR101661923B1 KR1020150073655A KR20150073655A KR101661923B1 KR 101661923 B1 KR101661923 B1 KR 101661923B1 KR 1020150073655 A KR1020150073655 A KR 1020150073655A KR 20150073655 A KR20150073655 A KR 20150073655A KR 101661923 B1 KR101661923 B1 KR 101661923B1
Authority
KR
South Korea
Prior art keywords
cover
thin portion
present
microphone package
acoustic hole
Prior art date
Application number
KR1020150073655A
Other languages
Korean (ko)
Inventor
김재명
박두영
Original Assignee
(주)파트론
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by (주)파트론 filed Critical (주)파트론
Priority to KR1020150073655A priority Critical patent/KR101661923B1/en
Priority to PCT/KR2016/003163 priority patent/WO2016190534A1/en
Application granted granted Critical
Publication of KR101661923B1 publication Critical patent/KR101661923B1/en

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/01—Electrostatic transducers characterised by the use of electrets
    • H04R19/016—Electrostatic transducers characterised by the use of electrets for microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/01—Electrostatic transducers characterised by the use of electrets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

A microphone package and a method of manufacturing the same are disclosed. A microphone package and a method of manufacturing the same according to the present invention include a base substrate having an electrode formed on an upper surface thereof, a transducer coupled to an electrode of the base substrate, and an inner space coupled to the substrate to accommodate the transducer, And a cover having an acoustic hole penetrating the inner surface, wherein a periphery of the acoustic hole of the cover is formed as a thin portion which is formed to be thinner than a peripheral portion thereof.

Description

Microphone package {MICROPHONE PACKAGE}

The present invention relates to a microphone package, and more particularly, to a microphone package for converting an acoustic signal into an electrical signal.

The microphone package is mounted on various electronic devices such as smart phones and tablet computers. Some recent electronic devices have implemented waterproof and dustproof functions for use in various environments. In order for an electronic device to have a waterproof and dustproof characteristic, the elements exposed to the outside should also have waterproof and dustproof characteristics.

In the case of a microphone package, it is necessary to provide an opening for inputting a sound signal, so that it is difficult to provide a waterproof and dustproof property. Various methods have been attempted in the past to solve this problem. As disclosed in Japanese Patent Application Laid-Open No. 2004-328231, a method of covering a soundproof or dustproof fabric with a cloth such as a nonwoven fabric has been attempted in a microphone package. Also, as disclosed in Korean Patent No. 10-0854310, a method of adding fine holes or a mesh as a dustproof and moisture proofing means has been attempted.

However, the conventional technology for realizing waterproof and dustproof has a complicated process because a process of attaching a separate non-woven fabric or a mesh to the cover must be added. In addition, there is a problem that bonding of nonwoven fabric or net or the like is not robust and durability is low.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a microphone package that can simplify a manufacturing process and reduce a manufacturing cost by facilitating a process of forming an acoustic hole, and a manufacturing method thereof.

Another problem to be solved by the present invention is to provide a microphone package and a method of manufacturing the microphone package which can improve the waterproof and dustproof characteristics by finely forming the shape or size of the acoustic hole.

Another object of the present invention is to provide a microphone package having high durability against an air shock and a manufacturing method thereof.

According to an aspect of the present invention, there is provided a microphone package and a method of manufacturing the same. The microphone package includes a base substrate having electrodes formed on an upper surface thereof, a transducer coupled to the electrodes of the base substrate, And a cover having an acoustic hole penetrating through the outer surface and the inner surface, and the periphery of the acoustic hole of the cover is formed as a thin portion which is formed to be thinner than the peripheral portion thereof.

In one embodiment of the present invention, the boundary portion between the thin portion and the adjacent portion of the thin portion may be stepped.

In one embodiment of the present invention, the step may be formed on the inner surface of the cover.

In one embodiment of the present invention, the step may be formed on an outer surface of the cover.

In an embodiment of the present invention, the adjacent portion of the thin portion may be formed to a thickness of 50 to 200 탆, and the thin portion may be formed to a thickness of 40% to 75% of the thickness of the adjacent portion.

In an embodiment of the present invention, the acoustic hole may include a plurality of micro holes.

In one embodiment of the present invention, the outer opening surface of the acoustic hole may have a larger area than the inner opening surface.

In one embodiment of the present invention, the inner opening surface of the acoustic hole may have a larger area than the outer opening surface.

In one embodiment of the present invention, a water repellent coating layer may be further formed on at least a part of the cover including the periphery of the acoustic hole.

According to another aspect of the present invention, there is provided a method of manufacturing a microphone package, the method comprising: providing a base substrate having electrodes on an upper surface thereof; coupling a transducer to electrodes of the base substrate; Forming a thin portion thinner than the peripheral portion on a part of the cover, forming an acoustic hole passing through the thin portion of the cover, And engaging the cover.

In one embodiment of the present invention, the step of forming the acoustical hole may include forming a through hole by irradiating a laser to a part of the cover on which the acoustical hole is to be formed.

In one embodiment of the present invention, the step of forming the acoustical hole may include forming a through hole by punching a part of the cover on which the acoustical hole is to be formed.

In one embodiment of the present invention, the step of forming the thin portion may forging a portion of the cover to be formed with the thin portion.

The microphone package and the method of manufacturing the same according to an embodiment of the present invention can simplify the manufacturing process and reduce the manufacturing cost by facilitating the process of forming the acoustic holes.

In addition, the microphone package and the manufacturing method thereof according to the embodiment of the present invention can improve the waterproof and dustproof characteristics by precisely forming the shape or size of the acoustic hole.

In addition, the microphone package and the manufacturing method thereof according to the embodiment of the present invention can improve durability against air shock.

1 is a cross-sectional view of a microphone package according to an embodiment of the present invention.
Fig. 2 is an enlarged cross-sectional view of the thin portion of the microphone package shown in Fig. 1. Fig.
3 is an enlarged cross-sectional view of a thin portion of a microphone package according to another embodiment of the present invention.
4 is an enlarged cross-sectional view of a thin portion of a microphone package according to another embodiment of the present invention.
5 is an enlarged cross-sectional view of a thin portion of a microphone package according to another embodiment of the present invention.
6 is a flowchart illustrating a method of manufacturing a microphone package according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In describing the present invention, if it is judged that it is possible to make the gist of the present invention obscure by adding a detailed description of a technique or configuration already known in the field, it is omitted from the detailed description. In addition, terms used in the present specification are terms used to appropriately express embodiments of the present invention, which may vary depending on the person or custom in the field. Therefore, the definitions of these terms should be based on the contents throughout this specification.

Hereinafter, a microphone package according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2 attached hereto.

1 is a cross-sectional view of a microphone package according to an embodiment of the present invention.

Referring to FIG. 1, a microphone package of the present invention includes a base substrate 100, a transducer 200, and a cover 300.

The base substrate 100 is formed in a flat plate shape. The base substrate 100 may have a rectangular shape in top and bottom. Electrodes may be formed on the upper and lower surfaces of the base substrate 100, respectively. Each of the electrodes 110 is formed to be exposed to the outside. The electrode 110 on the upper surface may be electrically connected by mounting the transducer 200 and / or the ASIC 250. The bottom electrode 110 can be used to input or output signals or to supply power. The upper and lower electrodes 110 may be electrically connected through a via hole or the like in the base substrate 100. The base substrate 100 may be formed of a printed circuit board (PCB).

A transducer (200) is an element that receives a sound signal and converts it into an electric signal. The transducer 200 may be, but is not limited to, an electret transducer, a MEMS transducer, or a piezoelectric transducer. The transducer 200 is mounted on the upper surface electrode 110 of the base substrate 100 and electrically connected thereto. Also, the transducer 200 may be positioned opposite the acoustic hole 320 of the cover 300, which will be described later. Further, the transducer 200 is accommodated in the inner space formed by the base substrate 100 and the cover 300. [

Other elements such as the ASIC 250 may be mounted in the inner space in addition to the transducer 200.

The cover 300 is coupled with the base substrate 100 to form an inner space. The cover 300 may include a top surface portion and a side surface portion. The upper surface portion is disposed so as to face the upper surface of the base substrate 100 in a spaced apart relationship, and the side surface portion extends downward from the outer surface of the upper surface portion to connect the upper surface portion to the base substrate 100. A flange portion that abuts and engages with the base substrate 100 may be formed at the lower end of the side portion. The upper surface portion and the side surface portion may be integrally formed, or may be separately formed and then joined.

The cover 300 may be formed of a metal material. The cover 300 may be formed of, for example, one or a combination of two or more materials selected from brass, bronze or phosphor bronze.

The cover 300 has at least one acoustic hole 320. The acoustic hole 320 may be formed on the upper surface portion of the cover 300, for example. The acoustic hole 320 may be formed as a through hole passing through the outer surface 302 and the inner surface 301 of the cover 300. The sound signal to be sensed by the transducer 200 through the acoustic hole 320 can be transmitted from the outside to the inner space.

FIG. 2 is an enlarged cross-sectional view of a portion of the thin portion 310 of the microphone package shown in FIG.

Referring to FIG. 2, a portion of the cover 300 is formed of a thin portion 310. The thin portion 310 means a portion which is thinner than the other portions of the cover 300 around the periphery. In particular, the thin portion 310 may be around the acoustic hole 320 of the cover 300.

For example, the cover 300 excluding the thin portion 310 may be formed of a metal plate having a thickness of 50 to 200 占 퐉. The thin portion 310 may be formed to a thickness of 40% to 75% of the thickness of the adjacent portion of the thin portion 310. Specifically, the thin portion 310 may be formed to a thickness of 20 占 퐉 to 150 占 퐉.

The boundary portion between the thin portion 310 and its adjacent portion can be formed stepwise. For example, the thin portion 310 may be recessed from the inner surface 301 of the cover 300, and a stepped portion may be formed on the inner surface 301 of the cover 300.

The acoustic hole 320 may include a plurality of fine holes. The plurality of fine holes may be located at a portion of the cover 300 in a concentrated manner. It is preferable that a plurality of dense fine holes are formed in the thin portion 310.

The acoustic holes 320 may be formed in various shapes, but may be formed in a substantially circular shape. Each acoustic hole 320 has an inner opening surface formed on the inner surface of the cover 300 and an outer opening surface formed on the outer surface of the cover 300.

In the acoustic holes 320, the inner opening surface may be formed to have a larger area than the outer opening surface. For example, the acoustic holes 320 may be formed in a shape having a circular or similar area with a diameter of 30 mu m to 150 mu m, and the outer opening face may have a circular shape with a diameter of 10 mu m to 120 mu m Or an area similar thereto.

Such a shape of the acoustic hole 320 can further improve the waterproof and dustproof function. That is, the probability that water or dust penetrates into the interior due to a small area of the outer opening surface is lowered. The acoustic holes 320 may be formed when the acoustic holes 320 are formed through a laser drilling process. The laser drilling process is a method of forming a through hole by melting a cover 300 by irradiating laser to a certain portion of a cover 300 to form an acoustic hole 320. In the case of using the laser drilling process, the opening surface in the direction in which the laser is irradiated may be formed larger than the opening surface in the opposite direction. Therefore, in the case of the acoustic hole 320 shown in FIG. 2, it may be a shape that can be formed when the laser is irradiated from the inner opening surface side. However, the method of forming the acoustic holes 320 is not limited to the laser drilling process. In some cases, a punching process may be used.

Forming the thin portion 310 in the cover 300 and puncturing the thin portion 310 to form the acoustic hole 320 facilitates the formation of the acoustic hole 320. [ That is, since the thickness of the cover 300 to be penetrated in order to form the acoustic hole 320 is reduced, penetration is facilitated. Therefore, the time and cost required for the perforation process can be reduced, as compared with the case where the portion of the cover 300 where the acoustic hole 320 is formed is relatively thick. In addition, the opening area and shape of the acoustic hole 320 can be precisely controlled. By adjusting the opening area and shape of the acoustic hole 320, the acoustic characteristics of the microphone package can be improved.

Hereinafter, a microphone package according to another embodiment of the present invention will be described with reference to FIG.

The present embodiment is different from the embodiment described above with reference to Figs. 1 and 2 only in the form of the thin portion, and the remaining portions are the same. Therefore, for convenience of explanation, the present embodiment will be described focusing on differences from the above-described embodiment.

3 is an enlarged cross-sectional view of a portion of the thin portion 310 of the microphone package according to another embodiment of the present invention.

Referring to FIG. 3, a boundary portion between the thin portion 311 and its adjacent portion may be formed stepwise. For example, the thin portion 311 may be recessed at the outer surface 302 of the cover 300 so that a stepped portion may be formed at the outer surface 302 of the cover 300. The acoustic hole 321 is formed in the thin portion 311.

Although not shown in the drawings, the stepped portion may be formed on both the inner surface 301 and the outer surface 302 of the cover 300 as occasion demands.

Hereinafter, a microphone package according to another embodiment of the present invention will be described with reference to FIG.

This embodiment differs from the embodiment described above with reference to Figs. 1 and 2 only in the form of acoustic holes, and the remaining portions are the same. Therefore, for convenience of explanation, the present embodiment will be described focusing on differences from the above-described embodiment.

4 is an enlarged cross-sectional view of a portion of the thin portion 312 of the microphone package according to another embodiment of the present invention.

Referring to FIG. 4, in the acoustic holes 322, the outer opening surface may be formed to have a larger area than the inner opening surface. For example, the acoustic holes 322 may be formed in a shape having a circular or similar area with a diameter of 30 mu m to 150 mu m, and the inner opening face may be formed in a circular shape having a diameter of 10 mu m to 120 mu m Or an area similar thereto.

Although not shown in the drawings, the acoustic holes may be formed to have the same or similar areas of the inner opening face and the outer opening face as the case may be.

Hereinafter, a microphone package according to another embodiment of the present invention will be described with reference to FIG.

This embodiment differs from the embodiment described above with reference to Figs. 1 and 2 only in that a water-repellent coating layer is added, and the remaining portions are the same. Therefore, for convenience of explanation, the present embodiment will be described focusing on differences from the above-described embodiment.

5 is an enlarged cross-sectional view of a portion of the thin portion 310 of the microphone package according to another embodiment of the present invention.

Referring to FIG. 5, the water-repellent coating layer 400 is formed on at least a part of the cover 300 including the surroundings of the acoustic holes 320. The water-repellent coating layer 400 may be formed on the outer surface 302 of the thin portion 310. However, the water-repellent coating layer 400 may also be formed on the inner surface 301 as the case may be.

The water repellent coating layer 400 may be formed of one or a combination of two or more materials selected from, for example, PTFE (Poly Tetra Fluoro Ethylene), silicon carbide (SiC), and silicone resin. The water repellent coating layer 400 can increase the contact angle of the moisture particles located around the acoustic holes 320 to inhibit the penetration of moisture particles into the inner space.

Hereinafter, a method of manufacturing a microphone package according to an embodiment of the present invention will be described with reference to FIG.

The present embodiment corresponds to the method of manufacturing the microphone package described above with reference to Figs. Therefore, for the sake of convenience of description, some of the contents overlapping with the above-mentioned contents are omitted.

6 is a flowchart illustrating a method of manufacturing a microphone package according to an embodiment of the present invention.

Referring to FIG. 6, a method of manufacturing a microphone package includes steps S100, S200, S300, S400, Forming a sound hole (S500), and joining the cover (S600).

7 is a cross-sectional view illustrating a step of providing a base substrate and a step of coupling a transducer in a method of manufacturing a microphone package according to an embodiment of the present invention.

The base substrate 100 provided in the step of providing the base substrate (S100) is formed in the shape of a flat plate, and the electrode 110 is formed on the upper surface. In step S200 of coupling the transducer, the transducer 200 is coupled to the electrode 110 of the base substrate 100. The terminal of the transducer 200 and the electrode 110 of the base substrate 100 may be electrically connected.

8 is a cross-sectional view illustrating a step of providing a cover of a method of manufacturing a microphone package according to an embodiment of the present invention.

The cover 300 provided in the step S300 of forming the cover may form an internal space for accommodating the transducer 200 by engaging with the substrate. Specifically, the cover 300 may include a top surface portion and a side surface portion. The cover 300 may be formed of a metal material. The cover 300 may be formed of, for example, one or a combination of two or more materials selected from brass, bronze or phosphor bronze.

9 is a cross-sectional view illustrating a step of forming a thin portion in a method of manufacturing a microphone package according to an embodiment of the present invention.

In step S400 of forming the thin portion, the thin portion 310 may be formed on a part of the cover 300. [ Specifically, the thin portion 310 may be formed on the upper surface of the cover 300. The thin portion 310 is formed to be thinner than the other portion of the cover 300 in the periphery. Specifically, the cover 300 excluding the thin portion 310 may be formed of a metal plate having a thickness of 50 탆 to 200 탆. The thin portion 310 may be formed to a thickness of 40% to 75% of the thickness of the adjacent portion of the thin portion 310. Specifically, the thin portion 310 may be formed to a thickness of 20 占 퐉 to 150 占 퐉.

Specifically, a portion of the cover 300 may be forged to form the thin portion 310. [ The forging process is a process of applying pressure to a part of the cover 300 to change the shape of the pressure-applied portion. The thickness of the cover 300 can be reduced by forging. The forging process may be machined in at least one of the inner surface 301 or the outer surface 302 of the cover 300. For example, when the forging process is performed on the inner surface 301 of the cover 300, the thin portion 310 is recessed in the inner surface 301 of the cover 300, As shown in FIG. However, the portion where forging processing is performed is not limited to this.

The formation of the thin portion 310 is not limited to forging. The cover 300 except for the thin portion 310 may be formed of a plurality of layers and the thin portion 310 may be formed of a single layer or a thin plate having a smaller number of layers than the surrounding portion .

10 is a cross-sectional view illustrating a step of forming acoustic holes in a method of manufacturing a microphone package according to an embodiment of the present invention.

In the step S500 of forming the acoustic hole, the acoustic hole 320 is formed through the thin portion 310 of the cover 300. [ The acoustic hole 320 may include a plurality of fine holes. The plurality of fine holes may be located at a portion of the cover 300 in a concentrated manner. It is preferable that a plurality of dense fine holes are formed in the thin portion 310.

For example, a laser drilling process can be used to form the acoustic hole 320. [ Specifically, the laser drilling process is a method of forming a through hole by melting a cover 300 by irradiating laser to a certain portion of a cover 300 to form an acoustic hole 320. In the case of using the laser drilling process, the opening surface in the direction in which the laser is irradiated may be formed larger than the opening surface in the opposite direction. Therefore, in the case of the acoustic hole 320 shown in FIG. 10, it may be a shape that can be formed when the laser is irradiated from the inner opening face side. However, the method of forming the acoustic holes 320 is not limited to the laser drilling process. In some cases, a punching process may be used.

Forming the thin portion 310 in the cover 300 and puncturing the thin portion 310 to form the acoustic hole 320 facilitates the formation of the acoustic hole 320. [ That is, since the thickness of the cover 300 to be penetrated in order to form the acoustic hole 320 is reduced, penetration is facilitated. Therefore, the time and cost required for the perforation process can be reduced, as compared with the case where the portion of the cover 300 where the acoustic hole 320 is formed is relatively thick. In addition, the opening area and shape of the acoustic hole 320 can be precisely controlled. By adjusting the opening area and shape of the acoustic hole 320, the acoustic characteristics of the microphone package can be improved.

In some cases, forming the acoustical hole 320 may be to form a through hole by punching a part of the cover 300 on which the acoustical hole 320 is to be formed. In the punching process, the punching machine physically hits the cover 300 to form a through hole.

11 is a cross-sectional view illustrating a step of engaging a cover 300 of a method of manufacturing a microphone package according to an embodiment of the present invention.

The step of joining the cover (S600) is a step of joining the cover (300) to the base substrate (100). The cover 300 may be electrically connected to the grounding portion of the base substrate 100 to improve the electrical stability.

The step of forming the water-repellent coating layer 400 may be performed. The water-repellent coating layer 400 is formed on at least a part of the cover 300 including the surroundings of the acoustic holes 320. The water-repellent coating layer 400 may be formed on the outer surface 302 of the thin portion 310. However, the water-repellent coating layer 400 may also be formed on the inner surface 301 as the case may be.

The water repellent coating layer 400 may be formed of one or a combination of two or more materials selected from, for example, PTFE (Poly Tetra Fluoro Ethylene), silicon carbide (SiC), and silicone resin. The water repellent coating layer 400 can increase the contact angle of the moisture particles located around the acoustic holes 320 to prevent the moisture particles from penetrating into the inner space.

The embodiments of the microphone package and the manufacturing method thereof of the present invention have been described above. The present invention is not limited to the above-described embodiments and the accompanying drawings, and various modifications and changes may be made by those skilled in the art to which the present invention pertains. Therefore, the scope of the present invention should be determined by the equivalents of the claims and the claims.

100: base substrate 101: upper surface
102: lower surface 110: electrode
200: Transducer 250: ASIC
300: cover 301: inner surface
302: outer surface 305: step
310: Thin section 320: Acoustic hole
400: Water repellent coating layer

Claims (13)

A base substrate on which an electrode is formed;
A transducer coupled to an electrode of the base substrate; And
A cover coupled to the substrate to form an inner space for receiving the transducer and having an acoustic hole penetrating the outer surface and the inner surface,
The periphery of the acoustic hole of the cover is formed as a thin portion having a thickness thinner than a peripheral portion thereof,
The adjacent portion of the thin portion is formed to a thickness of 50 mu m to 200 mu m,
Wherein the thin portion is formed to a thickness of 40% to 75% of the thickness of the adjacent portion.
The method according to claim 1,
Wherein a boundary portion between the thin portion and the adjacent portion of the thin portion is stepped.
3. The method of claim 2,
Wherein the step is formed on the inner surface of the cover.
3. The method of claim 2,
Wherein the step is formed on an outer surface of the cover.
delete The method according to claim 1,
Wherein the acoustic hole includes a plurality of microholes.
The method according to claim 1,
Wherein the acoustic hole has an outer opening surface larger in area than an inner opening surface.
The method according to claim 1,
Wherein the acoustic hole has an inner opening surface larger in area than an outer opening surface.
The method according to claim 1,
And a water-repellent coating layer formed on at least a part of the cover including the periphery of the acoustic hole.
delete delete delete delete
KR1020150073655A 2015-05-27 2015-05-27 Microphone package KR101661923B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020150073655A KR101661923B1 (en) 2015-05-27 2015-05-27 Microphone package
PCT/KR2016/003163 WO2016190534A1 (en) 2015-05-27 2016-03-28 Microphone package and manufacturing method therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150073655A KR101661923B1 (en) 2015-05-27 2015-05-27 Microphone package

Related Child Applications (1)

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KR1020160060409A Division KR101731039B1 (en) 2016-05-17 2016-05-17 Microphone package

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WO (1) WO2016190534A1 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007150507A (en) * 2005-11-25 2007-06-14 Matsushita Electric Works Ltd Microphone package
KR20140121623A (en) * 2013-04-08 2014-10-16 싸니코전자 주식회사 Mems microphone having multiple sound pass hole

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004328231A (en) * 2003-04-23 2004-11-18 Matsushita Electric Ind Co Ltd Microphone with water-proof and wind-proof function, and water-proof and wind-proof screen to be used therefor
KR100854310B1 (en) * 2006-12-18 2008-08-26 주식회사 비에스이 Condenser microphone with filter in sound hole of case
KR101452402B1 (en) * 2013-04-05 2014-10-22 싸니코전자 주식회사 Mems microphone having sound pass hole by downward curve

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007150507A (en) * 2005-11-25 2007-06-14 Matsushita Electric Works Ltd Microphone package
KR20140121623A (en) * 2013-04-08 2014-10-16 싸니코전자 주식회사 Mems microphone having multiple sound pass hole

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