M331674 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種載晶裝置，尤指一種供顯示器面板 與外部電路板電性連接用之載晶裝置。 - 【先前技術】 目前液晶顯示器（Liquid Crystal Display，簡稱LCD ) •係極為普遍地應用於大大小小的電子裝置上，而液晶顯示 器内部用以供顯示器面板與週邊驅動電路板之間電性連接 的晶片，’也因為顯示器面板尺寸的不同或製作成本的高 低，有著不同的構裝及連接技術。目前常見係有玻璃覆晶 (Chip_On-Glass，簡稱c〇G )構裝技術與薄膜覆晶 (Chip-On-Film，簡稱 COF)構裝技術。 請參閱第三圖所示，COG構裝技術係指將該晶片（7 0 ) 乂復曰曰方式’利用異方向性導電膠（Anisotropic 齡 Conductive Film，簡稱 ACF 膠）、紫外光（mtravi〇let， ^簡稱UV )硬化膠或是銀膠直接黏著在一顯示器面板之玻 • 璃基板（7 1 )上，再由玻璃基板（7 1 )與一軟性印刷 電路板（Flexible Printed Circuit，簡稱 FPC) ( 7 2 )電 性連接’令週邊驅動電路板（7 3 )可透過連接該FPC ( 7 2 )’再經由該晶片（7 〇 )與玻璃基板（7 1 )電性連 接；是以’藉由該FPC ( 7 2 )之可撓曲折特性，可省去 使用一般電路板連接玻璃基板（7 1 )與週邊驅動電路板 (7 3 )時所佔去之空間，在電子設備不斷追求輕薄短小 4 M331674 之今天’實是一大突破。 由上述說明可知，為令晶片（7 〇 )可放置於玻璃基 板（7 1 )上’勢必要採用較大尺寸的玻璃基板（7 1 )， 惟如此一來，將使顯示器面板之顯像區域不變，但整體尺 寸卻加大，而有違輕薄短小之要求。 而COF構裝技術即是可解決上述顯示器面板整體尺寸 加大之缺點的技術，請參閱第四圖所示，c〇F構裝技術主 要係將晶片（8 0 )以覆晶方式黏著在一 c〇F軟板（8工） 後，再由该COF軟板（8 1 )之一側電性連接於顯示器面 板之玻璃基板（8 2 )上，而c〇F軟板（8丄）的相對另 側則供與週邊驅動電路板（8 3 )電性連接，如此該晶片 (8 0 )即載放於該C0F軟板（8 i )上而非玻璃基板（8 2 )上，因此即毋需為载放晶片（8 〇 )而加大顯示器面 板之整體尺寸，且C0F軟板（8丄）亦具有如Fpc般的 可撓曲特性。 惟上述COF構裝技術採用之c〇F軟板（8丄）與一 般FPC並不相同，其主因係在於：由於隨著技術的進^， 晶片（8 0 )之尺寸越來越小，因此晶片（8 〇 )上接腳 之間的距離亦越做越小；然FpC受限於材料與製程之限制， 故無法配合晶片（8 〇 )上接腳之較小間距，製作出相對 應的接點與線路1 COF軟板（8丄）則可藉由精密的势 造設備，製作出可供晶片（8 Q)設於其上的接點與線路: 因此COF軟板（8 i )之材料成本較高，且為製作出 C〇F軟板（8 i )上間距小的接點與線路，整體製程所採 M331674 用的製造设備與之後配合品檢用之檢測儀器係相當昂貴， 故COF軟板（8 1 )尚難以普及。M331674 VIII. New Description: [New Technology Field] This creation is about a crystal carrying device, especially a crystal carrying device for electrically connecting a display panel to an external circuit board. - [Prior Art] At present, liquid crystal display (LCD) is widely used in large and small electronic devices, and the inside of the liquid crystal display is used for electrical connection between the display panel and the peripheral driving circuit board. The chip, 'also has different mounting and connection technologies because of the different size of the display panel or the cost of production. At present, there are commonly used techniques for chip-on-glass (Chip_On-Glass, c-G) and chip-on-Film (COF). Referring to the third figure, the COG packaging technology refers to the method of resolving the wafer (70) by using anisotropic conductive adhesive (Anisotropic Age Conductive Film, ACF) and ultraviolet light (mtravi〇let). , ^ abbreviated as UV) hardener or silver glue directly adheres to the glass substrate (7 1 ) of a display panel, and then the glass substrate (7 1 ) and a flexible printed circuit board (FPC) (7 2) electrical connection 'so that the peripheral driver circuit board (7 3 ) can be electrically connected to the glass substrate (7 1 ) through the connection of the FPC ( 7 2 )'; The flexible and tortuous nature of the FPC (7 2 ) eliminates the space occupied by the use of a general circuit board to connect the glass substrate (7 1 ) to the peripheral driver circuit board (7 3 ), and is constantly pursuing light and thin in electronic equipment. 4 M331674 today is a big breakthrough. As can be seen from the above description, in order to allow the wafer (7 〇) to be placed on the glass substrate (7 1 ), it is necessary to use a larger-sized glass substrate (7 1 ), but the display area of the display panel will be made. It is unchanged, but the overall size is increased, and it is in violation of the requirements of lightness and shortness. The COF packaging technology is a technology that can solve the above disadvantages of the overall size of the display panel. Referring to the fourth figure, the c〇F mounting technology mainly bonds the wafer (80) in a flip chip manner. After the c〇F soft board (8 working), one side of the COF soft board (8 1 ) is electrically connected to the glass substrate (82) of the display panel, and the c〇F soft board (8丄) The other side is electrically connected to the peripheral driving circuit board (83), so that the wafer (80) is placed on the COF soft board (8i) instead of the glass substrate (8 2 ), thus It is not necessary to increase the overall size of the display panel for placing the wafer (8 〇), and the C0F soft board (8 丄) also has the flexibility characteristics like Fpc. However, the c〇F soft board (8丄) used in the above COF construction technology is different from the general FPC. The main reason is that the size of the wafer (800) is getting smaller and smaller as the technology progresses. The distance between the pins on the chip (8 〇) is also getting smaller and smaller; however, FpC is limited by the material and process constraints, so it can't match the smaller pitch of the pins on the chip (8 〇) to make the corresponding Contact and Line 1 COF Soft Board (8丄) can be used to make contacts and lines on which the chip (8 Q) can be placed by precision potential equipment: Therefore COF soft board (8 i ) The material cost is high, and in order to make the joints and lines with small spacing on the C〇F soft board (8 i ), the manufacturing equipment used for the M331674 and the testing equipment used for the product inspection are quite expensive. Therefore, the COF soft board (8 1 ) is still difficult to popularize.
由上述可知，關於顯示器面板與週邊驅動電路之連接 技術’尚有待進一步改進方案P 【新型内容】 為此，本創作之主要目的在於提供一種供顯示器面板 與外部電路板t性連接用之載晶，其可令晶片不直接 載放於顯示器面板之玻璃基板上，並使用低價的軟性印刷 電路板降低製造成本，以增加應用彈性。 為達成前述目的所採取之主要技術手段係令前述載晶 裝置，係包括： 並 一没有複數連接線路的導電玻璃，係供晶片設置 以連接線路與該晶片電性連接； α有複數連接線路的第一軟性印刷電路板，其一側 係供以連接線路與-顯示器面板電性連接，而相對另側則 設於前述導電玻璃之一側上’令所述第一軟性印刷電路板 與δ亥導電玻璃的連接線路相互電性連接； / 一設有複數連接線路的第二軟性印刷電路板，其一側 係供以連接線路與—外部電路板電性連接，而相對另側則 設於前述導電玻璃之相對側上，令所述第二軟性印刷電路 板與该導電玻璃的連接線路相互電性連接。 本創作係藉由將晶片設置於導電玻璃後，4以導電 璃兩側分別透過箆—、钕_ k U , 、 刀⑴选心弟 弟一軟性印刷電路板電性連接顯示 6 M331674 器面板與外部電路板；如此一來，利用本創作之載晶裝置， 即可毋需將晶片設置於顯示器面板上，而避免顯示器面板 的尺寸不必要地加大；此外，由於導電玻璃與軟性印刷電 路板係今日極為普遍之構件，因此本創作亦具有成本低之 優點，而使整體之應用範圍增廣。 【實施方式】 本創作係為一種供顯示器面板與外部電路板電性連接 用之載晶裝置，請參閱第一圖所示，#一較佳實施例係包 括： 一導電玻璃（10)，係具有複數連接線路（11) 設於其中，如第二圖所示，所述導電玻璃（丄〇)之頂面 可供一積體電路（Integrated Circuit，簡稱ic)晶片（2 〇)設置，於本實施例中，該IC晶片（2 〇)係利用異 方向性導電膠（Anisotropic Conductive Film，簡稱 ACF 膠） (圖中未示）黏設於導電玻璃上（1 〇 )，且與該連接線 路（1 1 )電性連接，·而該導電玻璃（1 〇 )之特性即在 於：由於導電玻璃（1 〇 )係今日極為普遍之構件，因此 其製程技術成熟穩定，且可依需求製作出符合IC晶片（2 0 )上接腳間距之連接線路（1 1 )，於本實施例中，該 連接線路（1 1 )於與1C晶片（2 0 )電性連接處之間 距係對應1C晶片（2 0 )上接腳之間距，當連接線路（工 1 )延伸至導電玻璃（1 0 )之兩側時，則以較寬之間距 相間隔； M331674 ^第軚性印刷電路板（Flexible Printed Circuit，簡 稱FPC) ( 3 Ο ) ’係具有複數連接線路（3 1 )，所述 第一 FPC ( 3 0 )之一伽仫糾m 係利用ACF膠黏設於前述導電玻 璃“〇)之-側上，令該第—FPC(3〇)上的連接線 路（3 1)與該導電玻璃（1 〇)上的連接線路（1 1) 電㈣接：而該第一 FPC(30)之相對另側則以ACF膠 黏设於一顯示器面板（4 n、 ®攸I 4 0 )上，且連接線路（i丄）係 與顯=面板（4〇)上的接點（圖中未示）電性連接； 第 （5〇)，係具有複數連接線路（51)， 所^弟一 FPC ( 5 1 )之一側係以ACF膠黏設於前述導電 玻璃（1 0 )上相對設有該第—FPC ( 3 〇 )之另側，且 =二FPC(5〇)上的連接線路（Η)係與該導電玻 肖1 0 )上的連接線路（1 1 )電性連接；而該第二FPC (5 0 )之另側則利用a c F膠黏設於一外部電路板（"） ί 二來’該外部電路板（6 〇 )即可透過連接該第 —(5 0 ) ’以經由該Ic晶片（2 〇 )以及該第一 Fpc (30)而與顯示器面板（4〇)電性連接。 〜由广述可知’本創作係利用導電玻璃可依需求製作出 ::日曰曰片上接腳間距之連接線路，而可如同習用薄膜 2晶（ChlP_〇n_Film ’簡稱⑽）構裝技術之咖軟板般， =了供設置K：晶片之特性，目前各製造商之導 电玻掏製造技術已有一定水準 疋&半α此無珊疋材料成本或製 :成本，均較製作C0F軟板低廉，並具有較高的梦造良 此外，由於採用導電玻璃設置1C晶片已解決IC晶片 8 M3 31674 上接腳間距較小之問題，故可採用成本較c〇F軟板低之Fpc 進一步與顯示裔面板和外部電路板電性連接。 綜上所述，本創作不但仍具有c〇F軟板之覆晶與可撓 4寸（'生且材料與製造成本又更為低廉，故實為一極具進步 ，性與實用性之佳#，且未見於刊物或公開使帛，符合新型 -專利之申請要件，爰依法提出申請。 φ 【圖式簡單說明】 第一圖·係本創作之一較佳實施例與一顯示器面板和 外部電路板連接之俯視圖。 ^第二圖··係本創作之一較佳實施例與顯示器面板和外 4電路板連接之側視圖。 第二圖··係習用玻璃覆晶（Chip-On_Glass，簡稱C0G) 構裝之俯視圖。 第四圖：係習用薄膜覆晶（Chip-On-Film，簡稱c〇F) % 構裝之俯視圖。 【主要元件符號說明】 (10)導電玻璃 （11)連接線路 (2 0 )積體電路晶片 (3 0 )第一可撓性電路板（3 1 )連接線路 (4 0 )顯示器面板 (5 1 )連接線路 (50)第二可撓性電路板 (6 0 )外部電路板 9 M331674 (7 Ο )積體電路 ( (7 2 )軟性印刷電路板 （ (8 0 )積體電路 （ (8 2 )玻璃基板 （ 7 1 )玻璃基板 7 3 )週邊驅動電路 8 1 )薄膜覆晶軟板 83)週邊驅動電路It can be seen from the above that the connection technology between the display panel and the peripheral driving circuit has yet to be further improved. [New content] For this reason, the main purpose of the present invention is to provide a crystal for the t-connection of the display panel and the external circuit board. It can make the wafer not directly placed on the glass substrate of the display panel, and use low-cost flexible printed circuit board to reduce the manufacturing cost to increase the application flexibility. The main technical means for achieving the foregoing purpose is that the crystal carrying device comprises: a conductive glass without a plurality of connecting lines, wherein the wafer is arranged to electrically connect the connecting line with the chip; α has a plurality of connecting lines The first flexible printed circuit board has one side for electrically connecting the connection line and the display panel, and the other side is disposed on one side of the conductive glass to make the first flexible printed circuit board and the The connecting lines of the conductive glass are electrically connected to each other; / a second flexible printed circuit board having a plurality of connecting lines, one side of which is electrically connected to the external circuit board, and the other side is provided in the foregoing On opposite sides of the conductive glass, the connection lines of the second flexible printed circuit board and the conductive glass are electrically connected to each other. In this creation, after the wafer is placed on the conductive glass, the two sides of the conductive glass are respectively 箆-, 钕_ k U, and the knife (1) is selected by the younger brother, a flexible printed circuit board is electrically connected to display the 6 M331674 panel and the outside. The circuit board; thus, with the crystal carrying device of the present invention, it is not necessary to set the wafer on the display panel, and the size of the display panel is unnecessarily increased; in addition, due to the conductive glass and the flexible printed circuit board Today's extremely common components, so this creation also has the advantage of low cost, and the overall application range is widened. [Embodiment] The present invention is a crystal carrying device for electrically connecting a display panel and an external circuit board. Referring to the first figure, a preferred embodiment includes: a conductive glass (10), A plurality of connection lines (11) are disposed therein. As shown in the second figure, the top surface of the conductive glass (丄〇) can be disposed on an integrated circuit (IC) chip (2 〇). In this embodiment, the IC chip (2 〇) is adhered to the conductive glass (1 〇) by using an anisotropic conductive film (ACF) (not shown), and the connecting line is connected to the connecting line. (1 1 ) Electrical connection, · The characteristic of the conductive glass (1 〇) is that: Because conductive glass (1 〇) is a very common component today, its process technology is mature and stable, and can be produced according to requirements. In the embodiment, the connection line (1 1 ) is connected to the 1C wafer at a distance between the electrical connection with the 1C wafer (20). 2 0) the distance between the upper pins, when connecting the line (work 1 ) When extending to both sides of the conductive glass (10), they are spaced apart by a wider distance; M331674^Flexible Printed Circuit (FPC) (3 Ο ) ' has multiple connection lines ( 3 1 ), one of the first FPC (30) is affixed to the side of the conductive glass “〇” by ACF adhesive, so that the connection line on the first FPC (3〇) (3 1) is connected to the connecting line (1 1) of the conductive glass (1 )), and the opposite side of the first FPC (30) is adhered to a display panel by ACF glue (4 n, ® 攸I 4 0 ), and the connection line (i丄) is electrically connected to the contact (not shown) on the display panel (4〇); the (5〇) system has a plurality of connection lines ( 51), one side of the FPC (5 1 ) is attached to the conductive glass (10) by ACF adhesive on the other side of the first FPC (3 〇), and = two FPC ( The connection line (Η) on the 5〇) is electrically connected to the connection line (1 1 ) on the conductive glass plate 10; and the other side of the second FPC (50) is glued on the ac F On an external board (") ί Secondly, the external circuit board (6 〇) can be connected to the display panel (4 〇) via the Ic chip (2 〇) and the first Fpc (30) by connecting the first (5 0 ) ' Connection. ~ It is known from the extensive description that 'this creation department can use conductive glass to make the connection line of the foot-to-pin spacing on the nibble sheet, but it can be like the conventional film 2 crystal (ChlP_〇n_Film '(10)) The technical coffee is like a soft board. = The characteristics of the K: wafer are set. At present, the manufacturer's conductive glass manufacturing technology has a certain level of 疋 &; α 此 此 此 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋The C0F soft board is low-cost and has a high dream. In addition, since the 1C wafer is made of conductive glass, the problem of small pitch on the IC chip 8 M3 31674 has been solved, so the cost can be lower than that of the c〇F soft board. The Fpc is further electrically connected to the display panel and the external circuit board. In summary, this creation not only has the flip chip and flexible 4 inch of the c〇F soft board ('sheng and the material and manufacturing cost are lower, so it is a very advanced, good and practical good# And not found in the publication or publicity, in line with the new-patent application requirements, 提出 apply according to law. φ [Simple diagram of the diagram] The first figure is a preferred embodiment of the creation and a display panel and external circuit A top view of the board connection. ^Second picture · A preferred embodiment of the present invention is connected to the display panel and the outer 4 circuit board. The second picture is a conventional glass flip chip (Chip-On_Glass, referred to as C0G) Top view of the structure. Fig. 4: Top view of the chip-on-film (Chip-On-Film, c简称F) %. [Main component symbol description] (10) Conductive glass (11) connection line ( 2 0) integrated circuit chip (30) first flexible circuit board (3 1) connection line (40) display panel (5 1) connection line (50) second flexible circuit board (60) External circuit board 9 M331674 (7 Ο ) integrated circuit ( (7 2 ) flexible printed circuit board ( (8 0 ) integrated body Road ((8 2 ) glass substrate ( 7 1 ) glass substrate 7 3 ) peripheral drive circuit 8 1 ) thin film flip chip 83) peripheral drive circuit