M331408 八、新型說明·· 【新型所屬之技術領域】 本創作主要係關於一種研磨盤，尤指一種吸塵效果佳 且方便使用之研磨盤者。 【先前技術】 既有研磨機於使用時，為了避免研磨時所產生的粉塵 污染工作環境及造成空氣污染’會於研磨機前端裝設一研 磨盤來將粉塵進行吸收，其中既有研磨盤主要係設有一基 板、一主盤體及一研磨層，該基板的周緣上係設有數個穿 孔，而主盤體係凹設有一與研磨層相對且與基板穿孔相連 通之環溝，而研磨層係設有數個與環溝及穿孔相連通之通 孔，進而於研磨時藉由通孔、環溝及穿孔而將粉塵吸引隹 中； ’、 '、、;'而，既有研磨盤於進行吸塵時，由於穿孔及通孔係 分別設於基板及研磨層的周緣上，因此於吸塵使用時，僅 能將位於研磨層外圍之粉塵進行吸引，而無法將位於研磨 層中心部位的粉塵進行吸引’因此需經由移動後方可對位 於中心部位之粉塵進行吸引，相對使得吸塵效率受限且造 成使用上的不便，誠有加以改良之處。 【新型内容】 四此，本創作有 …、…β…示r於1f 位置之粉塵進行吸塵使料不足及缺失，特經過不斷的 驗與研究’終於發展出-種能改進現有缺失之本創作。 本創作之主要目的’在於提供一種研磨盤，其係可 M331408 2方、中’u部位之粉塵進行吸引，而能達到方便操作且 可提高吸塵效果之目的者。 勺A為達到上述目0勺’本創作纟要係提供-種研磨盤，其 匕芑有基板、一主盤體及一研磨層，其中： 該基板於一側面係凸設有一與研磨機相結合之結合柱 ’於該結合柱之周緣係環設有數個穿孔；M331408 VIII. New Description·· 【New Technical Fields】 This creation is mainly about a grinding disc, especially a grinding disc with good vacuuming effect and convenient use. [Prior Art] When the grinder is used, in order to avoid the dust generated during the grinding, the working environment and the air pollution will be installed. A grinding disc is installed at the front end of the grinder to absorb the dust. The system is provided with a substrate, a main disc body and a polishing layer. The substrate has a plurality of perforations on the periphery thereof, and the main disc system is recessed with a ring groove opposite to the polishing layer and communicating with the substrate perforation, and the polishing layer is There are a plurality of through holes communicating with the annular groove and the perforation, so that the dust is attracted to the crucible by the through hole, the annular groove and the perforation during the grinding; ', ', ,; ', and the grinding disc is used for vacuuming Since the perforations and the through holes are respectively provided on the periphery of the substrate and the polishing layer, when the dust is used, only the dust located on the periphery of the polishing layer can be attracted, and the dust located at the center of the polishing layer cannot be attracted. Therefore, it is necessary to attract the dust located at the center portion after moving, so that the dust collection efficiency is limited and the inconvenience in use is caused, and improvement is made. [New content] Four, this creation has...,...β...showing the dust in the 1f position to vacuum and make the material insufficient and missing. After continuous examination and research, 'finally developed--can improve the existing lack of creation . The main purpose of the present invention is to provide a grinding disc which is capable of attracting dust of the M331408 two-side and middle-u parts, and is capable of achieving convenient operation and improving the dust collecting effect. Spoon A is to achieve the above-mentioned object 0 scoop 'this creation is to provide a kind of grinding disc, which has a substrate, a main disc body and a polishing layer, wherein: the substrate is convexly arranged on one side with a grinder The combined binding column 'is provided with a plurality of perforations on the circumference of the binding column;
主盤體係與基板異於結合柱一側面相結合，且於另一 側面之中處係凸設有一圓才反，該圓板於中心處係設有一 吸孔且徑向穿設有三個分別與吸孔相連通之流道，於圓板 的外周緣上係凸設有數個呈放射狀環設之扇型，使圓板 與^形板間係形成數個與流道相連通之溝槽，該主盤體 另牙。又有數個與溝槽及基板穿孔相連通之通孔；以及 研磨層係與主盤體相結合，其中該研磨層的中心處係 設有一與圓板吸孔相連通之吸塵孔，且於吸塵孔外周緣上 係穿設有數個分別與通孔及穿孔相連通之吸入孔。 幸乂佐地，忒研磨層另設有一與主盤體相結合之黏合層 二使研磨層透過黏合層而與主盤體相結合，且該黏合層係 6又有一與主盤體吸孔及研磨層吸塵孔相連通之連通孔及數 個與通孔、穿孔及吸入孔相連通之圓孔。 較佳地，部分的通孔係與三個流道相連通。 【實施方式】 本創作主要係提供-種研磨#，請配合參看第一至四 圖由圖中可看到，本創作的研磨盤主要係包含有一基板 (10)、一主盤體（20)及一研磨層㈡〇)，其中 M331408 3亥基板（1 Ο )於一側面係凸設有一與研磨機（5 〇 )相結合之結合柱（1 ;[)，於該結合柱（1丄）之周緣 係環設有數個穿孔（1 2 ); 主盤脱（2 0 )係與基板（1 〇 )異於結合柱（1 1 )一側面相結合，於另一側面中心處係凸設有一圓板（2 • 1 )，該圓板（2 1 )於中心處係設有一吸孔（2丄工） 且控向穿設有三個分別與吸孔（2工工）相連通之流道（ ♦ 2 1 2 )，於圓板（2 1 )的外周緣上係凸設有數個呈放 射狀環設之扇型板（22)，使圓板（21)與各扇形板 (2 2 )間係形成數個與流道（2丄2 )相連通之溝槽（ 、2 3 )，該主盤體（2 〇 )另穿設有數個與溝槽（2 ^ ) 及基板（1 0 )穿孔（；[2 )相連通之通孔（2 4 )，較 佳地，部分的通孔（2 4 )係與三個流道（2工2 )相連 研磨層（3 〇 )係與主盤體（2 〇 )相結合，其中該 研磨層（3 0 )的中心處係設有一與圓板（2丄）吸孔（ 夕2 1 1 )相連通之吸塵孔（3工），且於吸塵孔（3工） 卜周緣上係穿設有數個分別與通? L ( 2 4 )及穿孔2 連通之吸入孔（3 2 )，較佳地，該研磨㉟（3 〇 ) 設有一與主盤體（20)相結合之黏合層（4〇) (30)透過黏合層（4〇)而與主盤體 相結合，Β #乐，人 υ ; 且该黏合層（4 〇 )係設有一與主盤體（2 吸孔（Pi 1、u 丄）及研磨層（3 0 )吸塵孔（3 1 )相連通 7 M331408 之連通孔（4 !)及數個與通孔 及吸入孔（…相連通之圓孔（42) (12) “本劊作研磨盤於使用時係如第三及四圖所示，當研磨 )進行研磨時所產生之粉塵，係經由研磨層（3 0 )之吸塵f q π、 ^ / 雙孔（3 1 )、吸入孔（3 2 )及第二吸入孔（ 3 3 )，再由點合層（4 〇 )之連通孔（4丄）、圓孔（The main disc system and the substrate are combined with one side of the combined column, and a circle is convexly formed in the other side. The circular plate is provided with a suction hole at the center and three radial holes are respectively arranged. The flow channel connecting the suction holes is formed on the outer periphery of the circular plate by a plurality of fan-shaped fan-shaped rings, so that a plurality of grooves communicating with the flow path are formed between the circular plate and the curved plate. The main body is another tooth. Further, there are a plurality of through holes communicating with the groove and the substrate through hole; and the polishing layer is combined with the main disk body, wherein the center of the polishing layer is provided with a dust suction hole communicating with the circular plate suction hole, and vacuuming The outer periphery of the hole is provided with a plurality of suction holes respectively communicating with the through hole and the through hole. Fortunately, the 忒 abrasive layer is further provided with an adhesive layer 2 combined with the main body, so that the polishing layer is bonded to the main body through the adhesive layer, and the adhesive layer 6 has a suction hole with the main body and a communicating hole through which the dust collecting hole of the polishing layer communicates and a plurality of circular holes communicating with the through hole, the through hole and the suction hole. Preferably, a portion of the through hole system is in communication with the three flow paths. [Embodiment] This creation mainly provides - kind of grinding #, please refer to the first to fourth figures. As can be seen from the figure, the grinding disc of the present invention mainly comprises a substrate (10) and a main disc body (20). And a polishing layer (2), wherein the M331408 3H substrate (1 Ο ) is convexly disposed on one side with a bonding column (1; [) in combination with a grinder (5 ,), and the bonding column (1 丄) The peripheral ring is provided with a plurality of perforations (1 2 ); the main disc (20) is combined with the substrate (1 〇) different from the side of the binding column (1 1 ), and is convex at the center of the other side. a circular plate (2 • 1 ), the circular plate (2 1 ) is provided with a suction hole (2 completion) at the center, and the control direction is provided with three flow paths respectively communicating with the suction holes (2 workers) ( ♦ 2 1 2), on the outer circumference of the circular plate (2 1 ), a plurality of fan-shaped plates (22) radially arranged are arranged to be arranged between the circular plate (21) and each of the sector plates (2 2 ) Forming a plurality of grooves (2, 3) communicating with the flow channel (2丄2), the main disk body (2 〇) is additionally provided with a plurality of grooves (2^) and a perforation of the substrate (10) (;[2) through holes (2 4 ) Preferably, a portion of the through hole (24) is connected to the three flow paths (2) and the polishing layer (3 〇) is combined with the main disk (2 〇), wherein the polishing layer (30) The center of the center is provided with a dust suction hole (3 working) which is connected with the circular plate (2 丄) suction hole (Xi 2 1 1 ), and is threaded on the periphery of the dust suction hole (3 work). L ( 2 4 ) and the suction hole (32) of the perforation 2, preferably, the grinding 35 (3 〇) is provided with an adhesive layer (4〇) combined with the main disk body (20) (30) It is combined with the main disc body through the adhesive layer (4〇), Β#乐,人υ; and the adhesive layer (4 〇) is provided with a main disc body (2 suction holes (Pi 1 , u 丄) and grinding The layer (3 0 ) dust suction hole (3 1 ) communicates with the communication hole (4 !) of the 7 M331408 and a plurality of round holes (42) (12) which communicate with the through hole and the suction hole (...) When used, as shown in the third and fourth figures, the dust generated when grinding is grounded by the grinding layer (30), fq π, ^ / double hole (3 1 ), suction hole (3) 2) and the second suction hole (3 3 ), and then by the point layer (4 〇) Connected holes (4丄), round holes (
4 2 )及穿設孔（4 3 )及圓板（2丄）之吸孔（2 η )及肌運（2 1 2 )，而吸入至主盤冑（2 0 )之溝槽（ 2 3 )中，再經由各通孔（2 4 )及基板（丄〇 )之穿孔 (1 2 )而吸收至研磨機（5 〇 )中，不僅可藉由位於最 :圍之第_吸入孔（3 3 ) &穿設孔（4 3 )來增加研磨 枝（5 0 )吸收粉塵的效率，且可使位於研磨層（3 〇 ) 中心部位之粉塵經由吸塵孔（3 1 )、圓孔（4工）、吸 孔（2 1 1 )、流道（2 1 2 )、溝槽（2 3 )、通孔（ 2 4 )及穿孔（工2 )而集中於研磨，（5 〇 )中，進而 提供一吸塵效率高且方便使用之研磨盤者。4 2 ) and through the hole (4 3 ) and the suction hole (2 η ) of the circular plate (2丄) and the muscle transport (2 1 2 ), and suck into the groove of the main disk (2 0 ) ( 2 3 ), and is absorbed into the grinder (5 〇) through the through holes (2 4 ) and the perforations (1 2 ) of the substrate (丄〇), not only by the _ suction hole located at the most: 3) & hole (4 3 ) to increase the efficiency of dust absorption by the grinding branch (50), and the dust located in the center of the polishing layer (3 〇) can be passed through the dust suction hole (3 1 ), round hole (4 Work), suction hole (2 1 1 ), flow path (2 1 2 ), groove (2 3 ), through hole (24), and perforation (work 2) are concentrated in grinding, (5 〇), and further Provide a grinding disc with high efficiency and easy to use.
【圖式簡單說明】 第一圖係本創作之立體分解圖。 第二圖係本創作之剖面側視圖。 第三圖係本創作結合於一研磨機之操作剖面側視圖。 第四圖係本創作於操作使用時之局部俯視剖面圖。 【主要元件符號說明】 (1 0 )基板 (1 1 )結合柱 （1 2 )穿孔 8 M331408 (2 Ο )主盤體 (2 1 )圓板 (211)吸孔 (2 2 )扇型板 (2 4 )通孔 (3 0 )研磨層 (31)吸塵孔 (4 0 )黏合層 (41)連通孔 (5 0 )研磨機 212)流道 2 3 )溝槽 3 2 )吸入孔 4 2 )圓孔[Simple description of the diagram] The first diagram is a three-dimensional exploded view of the creation. The second picture is a cross-sectional side view of the creation. The third figure is a side view of the operation section of the present invention combined with a grinder. The fourth figure is a partial top cross-sectional view of the present invention when it is used in operation. [Main component symbol description] (1 0) Substrate (1 1 ) Bonding column (1 2 ) Perforation 8 M331408 (2 Ο ) Main disk body (2 1 ) Round plate (211) Suction hole (2 2 ) Fan plate ( 2 4) Through hole (30) polishing layer (31) suction hole (40) adhesive layer (41) communication hole (50) grinder 212) flow path 2 3) groove 3 2) suction hole 4 2 ) Round hole