M330710 八、新型說明： ，【新型所屬之技術領域】 本創作係關於一種印刷電路板，尤其係關於一種撓性 印刷電路板。 【先前技術】 I 當鈾許多電氣設備，如液晶顯示器、移動電話等等， 需使用撓性印刷電路板將不同部份之電路連接起來。請參 閲圖1 ’其係一種先前技術撓性印刷電路板之平面示意 圖。該撓性印刷電路板1 〇包括一傳導部1]L及一連接部 12 〇 請一併參閱圖2，其係圖1所示連接部沿Η — 〗〗線之剖 面示意圖。該連接部12包括一基底120，一第一黏合層 131、一第一端子結構層141、一第二黏合層132及一第二 端子結構層142。該第一、第二端子結構層141、142分別 -藉由該第一、第二黏合層131、132固定在該基底12〇之兩 侧。該第一、第二端子結構層141、142包括複數條金手指 125及複數間隔體；[27 ’該間隔體127與該金手指125間隔 設置。 岡 在生産該撓性印刷電路板1〇之過程中，該金手指125 與該間隔體127之間會產生材料應力，當材料應力達到一 定程度時該間隔體127上可能會出現裂痕129。現結合圖3 分析該裂痕129之產生原因。 6 ' M330710 p俨：閲其係圖1所示區域111之微結構圖。該間 八工 之、貝般為聚酰亞胺（polyimide,PI)。聚酰亞胺 二128為殘型分子’該複數聚醜亞胺分子128大致沿同 方向排列。當該金手指125與該間隔體127之間產生之 :料應力達到程度時該間隔體127容易沿此方向出現 ;痕129。因此，該撓性印刷電路板10之品質通常不高。 【新型内容】 、有銓於此，提供一種品質較高之撓性印刷電路板 貝為必要。 一一種撓性印刷電路板，其包括一連接部。該連接部包 括基底、至少一黏合層及至少一端子結構層。該至少一 端子結構層藉由該黏合層固定在該基底上。談至少一端子 =構層包括複數金手指及複數間隔體，該間隔體與該金手 指間隔設置。該間隔體中設置有複數纖維物。 種撓性印刷電路板，其包括一連接部。該連接部包 括一基底、至少一黏合層及至少一端子結構層。該至少一 端子結構層藉由該黏合層固定在該基底上。該至少一端子 結構層包括複數金手指及複數間隔體，該間隔體與該金手 才曰間隔6又置。該間隔體中設置有增加間隔體強度之物 質。 與先前技術相比，本創作撓性.印刷電路板之間隔體中 加入了複數纖維物或增加間隔體強度之物質，從而增加 了該間隔體之強度’該撓性印刷電路板之品質也相應得到 7 、M330710 提高。 ，【實施方式】 卜明，1、、、圖4 ’其係本創作撓性印刷電路板第一實 施方式之示意圖。該撓性印刷電路板2〇包括一傳導 部21及一連接部22。 請—併參_ 5，其係圖4所示連接部沿ν· v線之剖 面不意圖。該連接部22包括—基底22〇, 一第一黏合層 231、帛一端子結構層241、_第二黏合層及一第二 端子結構層242。該第-、第二端子結構層241、242分別 藉由該第一、第二黏合層231、232黏合至該基底22〇之兩 侧。該第-、第二端子結構層241、242包括複數條金手指 225及複數間隔體227,該間隔體227與該金手指2乃間隔 «又置。該間隔體227中設置有複數纖維絲25〇，該纖維絲 250長短不一，呈細條狀。 ·'該基底220及該間隔體之材質一般為聚酰亞胺。 -在該間隔體227中加入該複數纖維絲25〇后，該複數纖維 絲250隨機分佈在該間隔體227中，該複數纖維絲25〇與 複數聚酰亞胺分子相互交織成網狀結構。因此，該間隔體 227之結構強度大大增加，其基本可避免出現裂痕，從而 該撓性印刷電路板20之品質亦相應得到提高。 本創作撓性印刷電路板20是以具有二層線路層之 雙面撓性印刷電路板為例進行説明，但該摻有複數纖維絲 250之間隔體227也同樣可應用在僅有一層線路層之單面 M330710 撓性印刷電路板或 板0 具有多層線路層之多層撓性印刷 電路 凊參閱圖6,其係本創作撓性印刷電路板第二實施 電之剖面示意圖。該第二實施方式之撓性印刷 板（圖未示）與第一實施方式之挽性印刷電路板2〇 目同’其主要區別在於：連接部％之間隔體奶中設M330710 VIII. New description: , [New technical field] This is a printed circuit board, especially for a flexible printed circuit board. [Prior Art] I When uranium is used in many electrical equipment, such as liquid crystal displays, mobile phones, etc., flexible printed circuit boards are used to connect different parts of the circuit. Referring to Figure 1 '' is a plan view of a prior art flexible printed circuit board. The flexible printed circuit board 1 includes a conductive portion 1] L and a connecting portion 12 〇 Please refer to FIG. 2 together, which is a cross-sectional view of the connecting portion shown in FIG. The connecting portion 12 includes a substrate 120, a first bonding layer 131, a first terminal structure layer 141, a second bonding layer 132, and a second terminal structure layer 142. The first and second terminal structure layers 141, 142 are respectively fixed to the two sides of the substrate 12 by the first and second adhesive layers 131, 132. The first and second terminal structure layers 141, 142 include a plurality of gold fingers 125 and a plurality of spacers; [27] the spacers 127 are spaced apart from the gold fingers 125. During the production of the flexible printed circuit board, material stress is generated between the gold finger 125 and the spacer 127, and cracks 129 may appear on the spacer 127 when the material stress reaches a certain level. The cause of the crack 129 will now be analyzed in conjunction with FIG. 6 ' M330710 p俨: Read the microstructure of the area 111 shown in Figure 1. In this case, it is made of polyimide (PI). Polyimide II 128 is a residual molecule 'The plurality of poly-imidazole molecules 128 are arranged substantially in the same direction. When the material stress is reached between the gold finger 125 and the spacer 127, the spacer 127 is likely to appear in this direction; the mark 129. Therefore, the quality of the flexible printed circuit board 10 is generally not high. [New content] In view of this, it is necessary to provide a high-quality flexible printed circuit board. A flexible printed circuit board comprising a connection. The connecting portion includes a base, at least one adhesive layer, and at least one terminal structural layer. The at least one terminal structure layer is fixed to the substrate by the adhesive layer. Talk about at least one terminal = the structuring layer includes a plurality of gold fingers and a plurality of spacers, the spacer being spaced from the gold finger. A plurality of fibrous materials are disposed in the spacer. A flexible printed circuit board comprising a connection. The connecting portion includes a base, at least one adhesive layer and at least one terminal structure layer. The at least one terminal structure layer is fixed to the substrate by the adhesive layer. The at least one terminal structure layer includes a plurality of gold fingers and a plurality of spacers, and the spacers are spaced apart from the gold hand gaps. A substance for increasing the strength of the spacer is provided in the spacer. Compared with the prior art, the flexible printed circuit board spacer is filled with a plurality of fibers or a substance for increasing the strength of the spacer, thereby increasing the strength of the spacer. The quality of the flexible printed circuit board is correspondingly Get 7 and M330710 to improve. [Embodiment] Bu Ming, 1, and Fig. 4' are schematic views showing a first embodiment of the present flexible printed circuit board. The flexible printed circuit board 2 includes a conductive portion 21 and a connecting portion 22. Please - and refer to _ 5, which is not intended to be a cross-section along the line ν·v as shown in Fig. 4. The connecting portion 22 includes a base 22 , a first adhesive layer 231 , a first terminal structure layer 241 , a second adhesive layer and a second terminal structure layer 242 . The first and second terminal structure layers 241 and 242 are bonded to the two sides of the substrate 22 by the first and second adhesive layers 231 and 232, respectively. The first and second terminal structure layers 241 and 242 include a plurality of gold fingers 225 and a plurality of spacers 227, and the spacers 227 and the gold fingers 2 are spaced apart. The spacer 227 is provided with a plurality of filaments 25, which are different in length and in a thin strip shape. - The material of the substrate 220 and the spacer is generally polyimide. - After the plurality of filaments 25 are added to the spacer 227, the plurality of filaments 250 are randomly distributed in the spacer 227, and the plurality of filaments 25 and the plurality of polyimide molecules are interwoven into a network structure. Therefore, the structural strength of the spacer 227 is greatly increased, and cracks are substantially prevented, so that the quality of the flexible printed circuit board 20 is correspondingly improved. The flexible printed circuit board 20 of the present invention is described by taking a double-sided flexible printed circuit board having two circuit layers as an example, but the spacer 227 doped with the plurality of filaments 250 can also be applied to only one layer of the circuit layer. Single-sided M330710 flexible printed circuit board or board 0 A multilayer flexible printed circuit having a multi-layer circuit layer. Referring to Figure 6, it is a cross-sectional view of a second embodiment of the present flexible printed circuit board. The flexible printed board (not shown) of the second embodiment is identical to the printed circuit board 2 of the first embodiment. The main difference is that the spacer portion is provided in the spacer milk.
4 維球350，該複數纖維球350隨機分佈在該間 隔體327中，該複數纖維球35〇大小不一。 /月參閱圖7，其係本創作撓性印刷電路板第三實施 :式之連接部之剖面示意圖。該第三實施方式之撓性印刷 路板（圖未示）與第一實施方式之撓性印刷電路板2〇 大致目同，其主要區別在於··連接部42之間隔體427中設 置有複數纖維塊450，該複數纖維塊45〇隨機分佈在該間 隔體427中，該複數纖維塊45〇大小不一。 •惟，本創作並不限於上述實施方式所述，例如··撓性 _:刷電路板之連接部之間隔體中設置之複數纖維物為 複數纖維絲、纖維球及纖維塊之混纟；該I數纖維物 ^可以是其他幾何形狀結構，例如三角形結構、菱形 f構等；該撓性印刷電路板之連接部之間隔體中也可= 設置能增加間隔體強度之其他物質。 綜上所述，本創作確已符合新型專利之要件，麦 依法提出專利申請。惟，以上所述者僅為本創作之較 佳實施例，本創作之範圍並不以上述實施方式為限= 舉凡熟悉本案技藝之人士，在援依本案創作精神所作 ，M330710 之等效修飾或變化 内。 皆應包含於以下之申請專利範圍The 4-dimensional ball 350, the plurality of fiber balls 350 are randomly distributed in the spacer 327, and the plurality of fiber balls 35 are different in size. Referring to FIG. 7 , it is a cross-sectional view of the third embodiment of the present flexible printed circuit board. The flexible printed circuit board (not shown) of the third embodiment is substantially the same as the flexible printed circuit board 2 of the first embodiment, and the main difference is that the spacer 427 of the connecting portion 42 is provided with plural numbers. The fiber block 450, the plurality of fiber blocks 45〇 are randomly distributed in the spacer 427, and the plurality of fiber blocks 45 are different in size. • However, the present invention is not limited to the above embodiments, for example, the flexible _: the plurality of fibers disposed in the spacer of the connecting portion of the brush circuit board is a mixture of a plurality of filaments, fiber balls, and fiber blocks; The I-number fiber material may be other geometric structures, such as a triangular structure, a rhombic structure, or the like; and the spacer of the connection portion of the flexible printed circuit board may also be provided with other substances capable of increasing the strength of the spacer. In summary, this creation has indeed met the requirements of the new patent, and Mai filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments. For those who are familiar with the skill of the present invention, in the spirit of the creation of the case, the equivalent modification of M330710 or Within the change. Should be included in the following patent application scope
【圖式簡單說明】 圖1係一種先前技術撓性印刷電路板之平面示意圖。 圖2係圖1所示連接部沿II-II線之剖面示意圖。 圖3係圖i所示區域m之微結構圖。 圖4係本創作撓性印刷 圖5係圖4所示連接部沿 圖6係本創作撓性印刷 剖面示意圖。 電路板第一實施方式之示意圖 V、V線之剖面示意圖。 包路板第二實施方式之連接部 之 圖7係本創作撓性印刷 剖面示意圖。 電路板第三實施方式之連接部之 【主要元件符號說明】 籲撓性印刷電路板 -傳導部 連揍部 基底 金手指 間隔體 第一黏合層 第一端子結構層 第二黏合層 20 21 22、32 > 42 220 225 227 、 327, 427 231 241 232 M330710 .第二端子結構層 242 纖維絲 250 纖維球 350 纖維塊 450BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a plan view of a prior art flexible printed circuit board. Figure 2 is a schematic cross-sectional view of the connecting portion shown in Figure 1 taken along line II-II. Figure 3 is a micrograph of the region m shown in Figure i. Fig. 4 is a flexible printed view of the present invention. Fig. 5 is a schematic cross-sectional view of the connecting portion shown in Fig. 4 taken along the line of Fig. 6. Schematic diagram of the first embodiment of the circuit board. The connecting portion of the second embodiment of the wrapping plate is shown in Fig. 7 as a schematic cross-sectional view of the flexible printing. [Main component symbol description of the connection portion of the third embodiment of the circuit board] flexible printed circuit board - conductive portion connecting portion base gold finger spacer first bonding layer first terminal structure layer second adhesive layer 20 21 22, 32 > 42 220 225 227 , 327 , 427 231 241 232 M330710 . Second terminal structure layer 242 fiber filament 250 fiber ball 350 fiber block 450