M329913 八、新型說明： 【新型所屬之技術領域】 本創作涉及一種電連接器，尤指一種將晶片模組電性連接至印刷電路板 之電連接器。 【先前技術】 目前一種電性連接晶片模組與印刷電路板之電連接器由基體、收容於 基體中之導電端子、組設於基體上之蓋體及驅動蓋體相對於基體滑動之驅 ' 動裝置組成，蓋體上設有複數通孔，供晶片模組之針腳插入，與基體中之 導電端子實現電性連接。但晶片模組處於工作狀態時，安裳於晶片模組上 • 之散熱裝置也處於工作狀態，由於目前晶片模組之運行速度不斷提高，其 產生之熱量也急劇增加，因此散熱裝置之散熱功率也越來越大，產生之震 動也會較大，故，會對位於其下之晶片模組產生較大之衝擊，極易使晶片 模組受損變形。 美國公告第6821138號專利揭示了一種解決前述問題之電連接器，其於 蓋體上σ又有複數凸塊，藉此凸塊來支撐晶片模組，防止晶片模組受損變形。 但這種電連接器藉SMT(表面貼裝技術）焊接於電路板時會發生變形龜曲， 是故蓋體彎曲變形，進而會造成蓋體上凸塊之支撐高度變得不相同，如是 當晶片模組組接於電連接器時，由於蓋體上凸塊之支撐高度不相同，蓋體 與基體之間又有-定嶋，晶片模組下壓於蓋體上時，凸塊對晶片模組之M329913 VIII. New Description: [New Technology Field] The present invention relates to an electrical connector, and more particularly to an electrical connector for electrically connecting a chip module to a printed circuit board. [Prior Art] At present, an electrical connector for electrically connecting a chip module and a printed circuit board comprises a base body, a conductive terminal received in the base body, a cover body assembled on the base body, and a drive cover body sliding relative to the base body. The movable device is composed of a plurality of through holes for inserting the pins of the chip module to electrically connect with the conductive terminals in the base body. However, when the wafer module is in operation, the heat sink of the device is also in working state. Since the running speed of the chip module is continuously increased, the heat generated by the chip module is also increased sharply, so the heat dissipation power of the heat sink is increased. It is also getting bigger and bigger, and the vibration generated will be larger. Therefore, it will have a greater impact on the wafer module underneath, and it is easy to damage the wafer module. U.S. Patent No. 6,821,138 discloses an electrical connector that solves the aforementioned problems, which has a plurality of bumps on the cover σ, whereby the bumps support the wafer module to prevent damage to the wafer module. However, when the electric connector is soldered to the circuit board by SMT (Surface Mount Technology), the deformed tortuous shape occurs, so that the cover body is bent and deformed, and the support height of the bump on the cover body becomes different, for example, when When the chip module is connected to the electrical connector, since the support height of the bumps on the cover body is different, the cover body and the base body are further fixed, and when the wafer module is pressed down on the cover body, the bumps are opposite to the wafer. Module
馨支撑⑧度會相對不If S，從而影響晶#模組之針腳與導電端子接觸高产 • 穩定性。 X 鐾於此，實有必要提供-歡進之t連接H，以克麟述電連接器之 缺陷。 σ 【新型内容】 本創作所解決之技躺題係提供—種防止W模組受觀形之電連接 器。 為解決前述技術問題，本創作提供一種電連接器，可用於電性連接晶 片模組至印刷電路板，其包括基體、收容於基體内之複數導電端子、愈^ 體組配之蓋體及位於基體和蓋體之間之驅練置，基體設減數收容導$ 5 M329913 與習知技術相比，本創作在基體上設有開口，於開口之周圍邊緣上延 =有突起，突起延伸穿過細絲接晶片模組，由於基断接於電路板 ，其位置相對穩定，是故突起之捕高度相對敎，可⑽證晶片模组鱼 導電端子接觸之穩定性。 另，本創作還提供-種電連懸啸決歧技綱題，1包括 收容於基體狀複麟電端子、配之蓋體及錄基體和蓋ς 之驅動裝置，基體具有導電區，導電區内設有複數收料電端子之端子收The support of 8 degrees will be relatively inferior to If S, thus affecting the high yield and stability of the contact between the pins of the crystal module and the conductive terminals. X 鐾 , , , , , , , , , , , , , , , , 。 。 。 。 。 。 。 。 。 。 σ [New content] The technical problem solved by this creation is to provide an electrical connector that prevents the W module from being shaped. In order to solve the foregoing technical problems, the present invention provides an electrical connector, which can be used for electrically connecting a chip module to a printed circuit board, and includes a base body, a plurality of conductive terminals received in the base body, a cover body and a cover body. Between the base body and the cover body, the base body is provided with a reduction guide. $ 5 M329913 Compared with the prior art, the present invention has an opening on the base body, and is extended on the peripheral edge of the opening = there is a protrusion, and the protrusion extends through The filament-connected chip module has a relatively stable position due to the fact that the base is disconnected from the circuit board, so that the height of the protrusion is relatively high, and the stability of the contact of the conductive terminal of the wafer module can be verified. In addition, the creation also provides a type of electric connection singularity, 1 includes a driving device housed in a base-shaped complex electric terminal, a cover body, and a recording base and a cover, the base has a conductive area, and a conductive area Terminals with multiple receiving electrical terminals are included
^槽，其中’基體導電區之非中間位置設有複數突起，蓋體設有複數收容 犬起之孔洞。 與習知技術相比，本創作於基體之導電區内設有複數突起，基體上之 犬起牙過蓋體上之制來支撐晶片模組，由於基體相對蓋體比較穩定，故， 突起之相雜置比較敎，是故可以保證晶片模組與導電端子接觸之 性0 〜 【實施方式】 請參閱第-圖至第二圖所示’其揭示了本創作第一較佳实施例之電連 =Γ，包^體1卜收容於基體11内之複數導電端子（未圖示）、與基 =組配之，體13及位於基體u和蓋體13之間之驅動裝置14，藉此驅 ^ i =1¾ 13 i滑動’該驅動裝置14在本實施例中爲 撥杯，其也可以為凸輪。 基體11設有與蓋體13相對之對接面11〇，對接面11〇上設有複數收容 ¥電端子之端子收容槽112，於巾央位置設有開口 114，於對接面ιι〇上之 開邊緣處向上延伸有連續之突起⑴，用以支樓晶片模組（未圖示） =中央位置，防止晶片模組f曲變形，對接面⑽之—端還延伸設有頭部 116 〇 蓋體13組接於基體U ±，其設有承接晶片模組之承接面13〇，承接面 欠容槽112相對應之通孔132，晶片模組之針腳穿過通孔 132與基體时之¥電舒電性細，該承接㈣g上魏有與基體u上 之突起Π5相對應之孔洞134及承接面13〇周圍向 M329913 13=則壁135之高度與突起115之高度相同，藉侧壁135與穿過孔洞m 揮晶片模組。蓋體13還設有與基體11之頭部116相對應 示）。口 6，凸0 136與頭部116之間設有收容驅動裝置14之凹槽（未標 上，於ϊ連接器lGG時，晶片模組放置於蓋體13之承接面130 32與基體11内之導電端子接觸，導《子 ==i!錫球焊接於電路板(未圖示)上實現晶片模組與 連接。由於承接面130之周圍設有側壁135，又美體η上之 ^命使明㈣組在散熱裝置等之震動下不„曲變形，可延長晶片模組之 作電連接器之開口 114可以位於基體u之對接面⑽之中央位 門口 位^接面11〇之非中央位置’所述突起115可以連續地圍繞在 开、息矣* 、緣，也可以非連續地圍繞在開σ叫之邊緣，凡於開口 114 之、:叹^大起m來支樓晶片模組之結構皆應涵蓋於本申請專利範圍内。 電連第三圖至第四_示’其揭示了本創作第二較佳实施例之 二〜本實施例與第一實施例之不同處在於:本實施例之基體11對接 上设有複數收容導電端子之端子收容槽m，該設有端子收容槽ιΐ2 =區，形成導電區，於導電區内之非中央區域設有複數突起ιΐ5，該突起 ⑴非均勻分佈於導電區内，並穿過蓋體13相對應之孔㈣4，以支撐晶片 模組，防止晶片模組彎曲變形。 本實施例之突起m可以為實心之凸塊，也可以為支樓肋組成之非實心 構二所述突起II5可以在基體u之導電區内均句分佈也可非均句分佈。 ^上所述’本創作確已符合新型補之要件，妥依法提㈣請專利。 准以上所述者僅係本創作之較佳實施方式，本創作之範圍並不以上述實 施方式為限，舉凡熟f本隸叙人士 賴狀精騎狀等效修飾 或變化，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 第-圖為本創作電連接器第_實較佳施例之立體分解圖。 7 M329913 第二圖為第一圖所示電連接器之立體組裝圖。 第三圖為本創作電連接器第二實較佳施例之立體分解圖。 第四圖為第三圖所示電連接器之立體組裝圖。 【主要元件符號說明】 電連接器 100 基體 11 對接面 110 端子收容槽 112 開口 114 突起 115 頭部 116 蓋體 13 承接面 130 通孔 132 孔洞 134 側壁 135 凸台 136 驅動裝置 14The trough, wherein the non-intermediate position of the conductive region of the substrate is provided with a plurality of protrusions, and the cover body is provided with a plurality of holes for accommodating the dog. Compared with the prior art, the present invention has a plurality of protrusions in the conductive region of the base body, and the dog teeth on the base body are supported on the cover body to support the wafer module. Since the base body is relatively stable with respect to the cover body, the protrusion is The mismatch between the matte and the conductive terminals is 0. [Embodiment] Please refer to the first to second figures, which discloses the electric power of the first preferred embodiment of the present invention. And a plurality of conductive terminals (not shown) housed in the base 11 and the base 13 and the drive unit 14 between the base u and the cover 13 Drive i = 13⁄4 13 i slide 'The drive unit 14 in this embodiment is a dial cup, which may also be a cam. The base 11 is provided with an abutting surface 11 opposite to the cover body 13. The mating surface 11 is provided with a plurality of terminal receiving slots 112 for accommodating the electric terminals, and an opening 114 is provided at the center of the towel to open on the mating surface. A continuous protrusion (1) extends upwardly at the edge for supporting the wafer module (not shown) = central position to prevent deformation of the wafer module f, and the end of the mating surface (10) is further provided with a head 116 13 sets are connected to the base body U±, which is provided with a receiving surface 13〇 of the receiving chip module, and the receiving surface corresponds to the through hole 132 corresponding to the receiving groove 112. When the pins of the chip module pass through the through hole 132 and the base body, the electricity is charged. The electric power is fine, and the height of the hole 134 corresponding to the protrusion Π5 on the base u and the surface of the receiving surface 13〇 to the M329913 13=the wall 135 is the same as the height of the protrusion 115, by the side wall 135 and Pass the wafer module through the hole m. The cover 13 is also provided corresponding to the head 116 of the base 11). The groove 6 between the protrusion 0 136 and the head 116 is provided with a recess for receiving the driving device 14 (not labeled, when the connector lGG is mounted, the wafer module is placed in the receiving surface 130 32 of the cover 13 and the base 11 The conductive terminals are in contact, and the sub-==i! solder balls are soldered on the circuit board (not shown) to realize the chip module and the connection. Since the side surface 135 is provided around the receiving surface 130, the body η is made up. The group (4) is not deformed under the vibration of the heat sink, etc., and the opening 114 of the electrical connector that can extend the chip module can be located at a non-central position of the central gate of the mating surface (10) of the base u. 'The protrusions 115 may continuously surround the opening, the 矣*, the edge, or may be discontinuously surrounded by the edge of the opening σ, where the opening 114 is: sighing and increasing the m to the wafer module The structure should be covered by the scope of the present application. The third to fourth embodiments of the present invention disclose the second preferred embodiment of the present invention. The difference between the present embodiment and the first embodiment lies in: The base body 11 of the embodiment is provided with a plurality of terminal receiving slots m for receiving the conductive terminals, and the terminal is provided The cavity ιΐ2 = region forms a conductive region, and a plurality of protrusions ι 5 are disposed in a non-central region of the conductive region, and the protrusions (1) are non-uniformly distributed in the conductive region and pass through holes (4) 4 corresponding to the cover 13 to support the wafer The module prevents bending deformation of the wafer module. The protrusion m of the embodiment may be a solid bump or a non-solid structure composed of a rib of the branch. The protrusion II5 may be uniformly distributed in the conductive region of the substrate u. It can also be distributed in a non-uniform sentence. ^The above description of this creation has indeed met the requirements of the new supplement, and the patent is required by law. (4) The patent is only applicable. The scope of this creation is not the scope of this creation. In view of the above-mentioned embodiments, the equivalent modification or change of the person in charge of the syllabus should be covered in the scope of the following patent application. [Simplified illustration] The first figure is the creative electrical connector The three-dimensional exploded view of the preferred embodiment of the present invention. 7 M329913 The second figure is an assembled view of the electrical connector shown in the first figure. The third figure is a three-dimensional decomposition of the second practical embodiment of the creative electrical connector. Figure 4. The fourth picture shows the third picture. 3D assembly diagram of the connector. [Main component symbol description] Electrical connector 100 Base 11 Butt joint 110 Terminal receiving slot 112 Opening 114 Protrusion 115 Head 116 Cover 13 Receiving surface 130 Through hole 132 Hole 134 Side wall 135 Boss 136 Drive Device 14