TWM329794U - Backlight module - Google Patents
Backlight module Download PDFInfo
- Publication number
- TWM329794U TWM329794U TW96212193U TW96212193U TWM329794U TW M329794 U TWM329794 U TW M329794U TW 96212193 U TW96212193 U TW 96212193U TW 96212193 U TW96212193 U TW 96212193U TW M329794 U TWM329794 U TW M329794U
- Authority
- TW
- Taiwan
- Prior art keywords
- frame
- wavelength conversion
- backlight module
- coating
- light
- Prior art date
Links
Landscapes
- Led Device Packages (AREA)
- Liquid Crystal (AREA)
Abstract
Description
M329794 八、新型說明: 【新型所屬之技術領域】 本創作係關於一波長轉換結構,尤其關於一含有可用以將紫外 光’尤其是波長不大於280nm之紫外光(即1^^)轉換為可見光 之波長轉換塗層之結構’該塗層可於空氣存在情形下配合UVc光 源使用,轉換UVc波長至可見光波長。該波長轉換結構製作步驟 臀 "簡單,從而可以簡易手段提供一大面積之平面光源。本創作另關 於將該波長轉換結構應用於發光模組及背光模組中。 1 【先前技術】 大發光面積之平面光源為目前光源之發展趨勢,尤其大發光面 積之平面光源對於大面板液晶顯示器之背光模組更顯重要。目前 習知光源中,利用能量/波長轉換方式提供可見光波長之方式,包 括冷陰極管技術(cold cathode fluorescent lamp ; CCFL )、外部電 極螢光管技術(external electrode fluorescent lamp ; EEFL)、發 光二極體技術(light emitting diode ; LED )、奈米碳管技術(carbon I nanotube ; CNT)、平面光源技術(Flat Fluorescent Lamp ; FFL) 以及有機發光二極體技術(organic light emitting display ; OLED) 等。 於上述各式藉由能量/波長轉換以提供可見光波長之手段中, CCFL係於玻璃管内壁塗覆一層螢光體,並在螢光管内部封入少量 惰性氣體及汞蒸氣,汞蒸氣於電極放電過程中經電子衝擊而產生 紫外光,紫外光經由燈管壁上之螢光體轉換為可見光而釋出,以 提供可見光波長。CCFL具有製作技術成熟、成本與前揭技術相比 5 VM^29794 較低等優點,惟受限於螢光塗層需與發光源置於同一真空燈乾 中’故有不易大型化、難以提供大面積波長轉換之限制。此外, 現有CCFL於試圖將燈管加長以提供較大發光面積時,尚有良率 低、成本大幅提高等缺點。 ^M329794 VIII. New Description: [New Technology Field] This creation is about a wavelength conversion structure, especially for a UV light that can be used to convert ultraviolet light, especially wavelengths of not more than 280 nm (ie 1^^) into visible light. The structure of the wavelength conversion coating 'The coating can be used in combination with a UVc source in the presence of air to convert the UVc wavelength to the visible wavelength. The wavelength conversion structure is fabricated in a step of "hip", which makes it easy to provide a large area of planar light source. This creation is also related to the application of the wavelength conversion structure to the light-emitting module and the backlight module. 1 [Prior Art] The planar light source with large illumination area is the development trend of the current light source. Especially the planar light source with large illumination area is more important for the backlight module of the large panel liquid crystal display. In the conventional light source, the wavelength of visible light is provided by energy/wavelength conversion, including cold cathode fluorescent lamp (CCFL), external electrode fluorescent lamp (EEFL), and luminescent diode. Light emitting diode (LED), carbon I nanotube (CNT), Flat Fluorescent Lamp (FFL), and organic light emitting display (OLED). In the above methods for energy/wavelength conversion to provide visible light wavelength, the CCFL is coated with a layer of phosphor on the inner wall of the glass tube, and a small amount of inert gas and mercury vapor are sealed inside the fluorescent tube, and the mercury vapor is discharged at the electrode. During the process, ultraviolet light is generated by electron impact, and the ultraviolet light is converted into visible light by the phosphor on the wall of the lamp tube to provide visible light wavelength. CCFL has the advantages of mature production technology and lower cost compared with the previous technology. 5 VM^29794 is lower, but it is limited by the fact that the fluorescent coating needs to be placed in the same vacuum lamp as the light source. The limitation of large-area wavelength conversion. In addition, the existing CCFL has disadvantages such as low yield and high cost when attempting to lengthen the lamp to provide a large light-emitting area. ^
EEFL與CCFL之最大差異,在於將電極置於燈管外部,故可利 用同-轉換器驅動多根螢光燈管,因此,轉換器之成本較低、電 能利用效率較高。然,EEFL仍具有應用上之限制,例如當Eefl 燈源焭度不足時,若欲藉由提高燈管電壓以增加電流、提升輸出 亮度時,則會造成轉換器體積急劇上升,散熱效果變差。此外, 如同CCFL,EEFL亦具有無法提供較大發光面積之缺點。 LED係一由半導體材料所製成之發光元件,以m_v族化學元素 (如:磷化鎵(GaP)、砷化鎵(GaAs)等)為材料,透過對化合物半 導體施加電流,經由電子與電洞的結合而以光的形式釋出,達成 發光效果。LED具有體積小、壽命長、驅動電壓低、及反應速率 快等優點。然而,LED於製作上仍具有混色問題、製作成本高、 均一度低、散熱不佳、以及用電效率低等問題。 CNT係利用高電場將電子從尖端釋出,再利用高壓加速撞擊螢 光板而轉換成光波長能量,此技術雖具省電、無汞與低溫等優點, 但其製程較複雜、成本尚、亮度穩定性不佳、且均勻度不佳。此 外,CNT之大型化製作技術仍在發展中。 FFL係利用惰性氣體放電時所產生的紫外光激發彩色螢光體粉 末後,再轉換成人眼可接受的可見光波長。FFL雖有不含汞、壽 命長與簡化光學設計等優點,但於現階段則仍存在製程困難、製 6 M329794 作成本較高、效率不佳及散熱問題等缺點。 • 至於OLED,則係利用一外加偏壓以驅動電洞/電子各自從正/負 . 極注入,其後於電場作用下,使電洞與電子相向移動、進行再結 合而釋出光波長能量。OLED雖具厚度薄、贵度高、操作溫度範圍 廣、低耗電、以及低驅動電壓等優點,但於現階段則仍存在大型 化困難、製作成本較高、效率不足、以及使用壽命短等缺點。 由上述說明可知,於現有之可見光光源中,若非製作技術未臻 成熟(如:LED、CNT、OLED與FFL),便具有因先天上製作限 制所致之無法大型化缺點(如CCFL與EEFL),均無法滿足業界 以簡易、低成本手段提供大面積波長轉換之需求。 本創作即針對上述需求所為之研發成果,透過簡易手段,可結 合既有技術,而提供大面積之波長轉換方法。 【新型内容】 於本揭露中,所謂「UVc」係指波長不大於280 nm之紫外光, 例如200至280 nm之光、特別是250至26〇 nm之光,尤其是指 • 253·7 nm之光。所謂「uvb」係指波長介於280〜320nm之光,所 謂「UVA」係指波長介於320〜400nm之光。所謂「巨分子」 (Macromer)係指分子量大於1〇〇〇之分子,包含募聚物 (Oligomer)及咼分子(P〇lymer)。所謂『可受紫外光(或是UVc、 uvA或uvB)激發之螢光體』係指於接受紫外光(或是UVc、UVa、 或uvB)照射時,可吸收紫外光(或是UVc、UVa* UVb)且放 出可見光之材料。 本創作之一目的,在於提供一種波長轉換結構,其係包含: M329794 一基材;以及 一波長轉換塗層,位於該基材上且包含: (a) —可受UVc激發之螢光體粉末;以及 (b) —抗UVc黏著劑, 其中該波長轉換塗層之厚度為螢光體粉末平均粒徑之2至10倍, 且該螢光體粉末於該波長轉換塗層之含量係符合以下至少一條 件: (i) 螢光體粉末於波長轉換塗層中之體積百分比為30%至85%(以 螢光體粉末與黏著劑之總體積為基準);以及 (ii) 螢光體粉末與黏著劑之重量比為1:1至20:1。 本創作波長轉換結構可搭配UVc光源,提供大面積之可見光平 面光源。該可見光光源更可運用於背光模組中,以簡易手段提供 大面積之顯示面板。 本創作之另一目的,在於提供一種製造波長轉換結構之方法, 其係包含: ’ 提供一基材; 於該基材表面塗覆一漿料,其係置於一儲槽中且包含·· (a) —可受UVc激發之螢光體粉末; (b) —抗UVc黏著劑;以及 (c) 一有機溶劑, 其中,該螢光體粉末與該黏著劑之重量比為1:1至20:1 ;以及 乾燥該經塗覆之基材。 在參閱隨後描述之實施方式後,本創作所屬技術領域中具有通 8 M329794 常知識者當可輕易瞭解本創作之基本精神及其他創作目的,以及 . 本創作所採用之技術手段與較佳實施態樣。 . 【實施方式】 為提供一大發光面積之平面光源,本創作人藉由一螢光體將紫 外光轉換成為可見光,特別是將含螢光體粉末之漿料直接塗佈於 一平面基材上形成一波長轉換結構。如此可使紫外光,尤其是UVc " 波段,經由該波長轉換結構轉換成為可見光。亦即,使紫外光激 _ 發螢光體粉末,並產生可見光。此一波長轉換結構可增進發光之 均勻度,且可視需要地提供所需之發光面積。 如前述,CCFL具有製作技術成熟、成本較低等優點,惟受限於 螢光塗層需與發光源置於同一真空燈管中,故有不易大型化、難 以提供大面積波長轉換之限制。詳細言之,CCFL係將螢光體漿料 溶液(係一由螢光粉、有機物、無機物及溶劑組合而成之組合物 成分)塗佈於玻璃管内部,其後再將該組合物中之有機物成份燒 結去除,於玻璃管内壁形成一螢光層。再於玻璃管内灌入汞蒸氣, 參 之後封閉玻璃管,以電極方式激發汞蒸氣而釋出UVc,該UVc經 由玻璃壁上之螢光層而轉換成為可見光。 於上述傳統CCFL製法中,該螢光層之塗覆係以直立方式進行, 利用虹吸原理先將螢光體漿料吸至直立燈管上端,再藉由重力使 其由上而下塗覆於燈管内壁,其後燒結去除塗層中之有機物成 分,形成所欲之螢光層。前述塗覆方式,會因重力差而於燈管上 下端造成厚度不均一現象,此一不均勻現象,於燈管尺寸需求高 之情形(即,需要較長燈管的情形)尤其嚴重。 9 M329794 另,現有CCFL之結構係將螢光體燒結於玻璃管壁上,但仍難 以避免紫外光從螢光層之螢光體間隙中洩漏。以現有的之液晶顯 示器技術為例,CCFL之紫外光洩漏會影響擴散板、增亮膜等光學 材料之特性,造成該等材料的劣化。因此多數材料均需經過抗紫 外光塗層的處理,以增進其使用壽命。 針對上述問題,本創作人試圖將螢光體漿料直接塗佈於個別基 材上,而非玻璃管内壁,以燈管與螢光層分離之方式提供可見光 光源,免除CCFL螢光層厚度不一之問題,增進其發光均勻度, 且可視需要地提供所欲之發光面積。而且經研究發現,透過特殊 溶劑及黏著劑之使用,以及黏著劑與螢光體粉末含量之控制,所 形成之組合物漿料可於不需燒結製程之情形下,於基材上形成一 可將紫外光有效轉換為可見光之波長轉換塗層。該漿料可使用相 對簡易之塗佈方式(例如捲對捲(roll-to-roll)塗佈法)塗佈於基 材上以大幅增進其量產性。其他塗佈方式舉例言之(但不以此為 限),可採用浸塗法(dip coating )、刮刀式塗佈法(comma coating)、 喷塗法(spraying coating )、旋轉式塗法(spin coating )、擠壓塗 佈法(slot coating)、簾幕式塗佈法(curtain coating )、凹板塗模法 (gravure coating)、或繞線棒塗佈法。尤其,可視需要地,以任 何合宜之方式乾燥之。舉例言之(但不以此為限),可以自然揮 發方式、或輔以通氣及/或加熱之強制揮發方式(如:通以熱空氣) 來進行該乾燥。該處理塗層搭配基材之結合,可成為一簡單之波 長轉換塗層組合結構,可與現有背光源、燈源、固態照明(如LED 及OLED)等應用結合而無須更改既有之結構設計,有其高應用性。 M329794 此外,該波長轉換塗層結構可有效免除傳統CCFL之營光體粉 末劣化問題。於此,習知CCFL於放電過程中所產生之l85nm光 會使螢光體粉末產生吸收或放光頻譜(color center,亦稱「色心 」 或「色中心」),導致新的吸收帶產生,使螢光體粉末的亮度降 低(前述現象可參見美國第6402987號專利之說明,該專利内容 併於此處以供參考)。其次,汞離子與電子於燈管壁處複合時會 釋放10.42 eV能量,該能量能破壞螢光體粉末之晶格,使亮度降 低。再者,由於CCFL燈管中通常存在鈉離子,其會與CCFL燈 管放電時所產生之電子複合而形成鈉原子。該鈉原子將擴散進入 螢光體粉末晶粒,導致螢光體粉末性能之降低。因此,當將本波 長轉換結構應用於發光模組中時,由於波長轉換塗層係與UVe光 源分離,此即,螢光體與UVc光源分離,故可有效免除傳統ccfl 將螢光體粉末與UVc光源置於同一燈管所致之前述問題。 具體而言,本創作可提供一波長轉換結構,其具體實施態樣可 如第1A圖例示說明,其中,〇、#及❿分別代表不同顏色之螢光 體私末。波長轉換結構1 〇2係包含一基材1 〇21與一波長轉換塗層 1023。該塗層1023係位於該基材1021上且包含一可受UVe激發 之螢光體粉末以及一抗UVc之黏著劑。其中,該轉換塗層1〇23 之厚度為螢光體粉末平均粒徑之2至10倍,且該螢光體粉末於該 波長轉換塗層1〇23之含量係符合以下至少一條件: (')螢光體粉末於波長轉換塗層中之體積百分比為3〇%至 85% (以螢光體粉末與黏著劑之總體積為基準);以及 螢光體粉末與黏著劑之重量比為1:1至2〇:1。 11 •M329794 可於波長轉換塗層採用任何合且之可觉UVc激發之螢光體粉 • 末。舉例§之(但不以此為限),該螢光體粉末可選自以下群組·· 氧化紀摻雜銪、填酸化鑭鈽摻雜轼、氧化鋇鎮銘摻雜鎖、及其組 合。亦可自市場上直接購買合宜產品作為該波長轉換塗層之螢光 體粉末。The biggest difference between EEFL and CCFL is that the electrode is placed outside the lamp tube, so the same converter can be used to drive multiple fluorescent tubes. Therefore, the converter has lower cost and higher energy utilization efficiency. However, EEFL still has application limitations. For example, when the Eefl lamp source is insufficient, if the lamp voltage is increased to increase the current and increase the output brightness, the converter volume will rise sharply and the heat dissipation effect will be poor. . In addition, like CCFL, EEFL also has the disadvantage of not providing a large light-emitting area. LED is a light-emitting element made of a semiconductor material, which is made of a m_v group of chemical elements (such as gallium phosphide (GaP), gallium arsenide (GaAs), etc.), and applies a current to the compound semiconductor through electrons and electricity. The combination of the holes is released in the form of light to achieve a luminous effect. LEDs have the advantages of small size, long life, low driving voltage, and fast reaction rate. However, LEDs still have problems of color mixing, high production cost, low uniformity, poor heat dissipation, and low power efficiency. The CNT system uses a high electric field to release electrons from the tip, and then uses high voltage to accelerate the impact on the phosphor plate to convert it into light wavelength energy. Although this technology has the advantages of power saving, no mercury and low temperature, the process is complicated, cost, and brightness. Poor stability and poor uniformity. In addition, the large-scale production technology of CNT is still in development. The FFL uses the ultraviolet light generated by the discharge of an inert gas to excite the color phosphor powder, and then converts the visible wavelength of light acceptable to the adult eye. Although FFL has the advantages of no mercury, long life and simplified optical design, at present, there are still some shortcomings such as difficult process, high cost, inefficiency and heat dissipation. • As for the OLED, an external bias is applied to drive the holes/electrons from each of the positive/negative poles, and then the electric field moves toward the electrons and recombines to release the wavelength energy of the light under the action of the electric field. Although OLED has the advantages of thin thickness, high reliability, wide operating temperature range, low power consumption, and low driving voltage, at present, there are still large-scale difficulties, high production costs, insufficient efficiency, and short service life. Disadvantages. It can be seen from the above description that in the conventional visible light source, if the non-production technology is not mature (such as LED, CNT, OLED, and FFL), there is a disadvantage that it cannot be enlarged due to the limitations of the innate production (such as CCFL and EEFL). Can not meet the industry's need to provide large-area wavelength conversion in a simple, low-cost way. This creation is aimed at the research and development of the above requirements, and it can be combined with existing technologies to provide a large-area wavelength conversion method through simple means. [New content] In the present disclosure, the term "UVc" refers to ultraviolet light having a wavelength of not more than 280 nm, such as light of 200 to 280 nm, especially light of 250 to 26 nm, especially 253·7 nm. Light. The term "uvb" means light having a wavelength of from 280 to 320 nm, and "UVA" means light having a wavelength of from 320 to 400 nm. By "Macromer" is meant a molecule having a molecular weight greater than 1 Å, comprising an Oligomer and a P〇lymer. The so-called "fluorescent body that can be excited by ultraviolet light (or UVc, uvA or uvB) means that it can absorb ultraviolet light (or UVc, UVa) when it is irradiated with ultraviolet light (or UVc, UVa, or uvB). * UVb) and emit visible light material. One object of the present invention is to provide a wavelength conversion structure comprising: M329794 a substrate; and a wavelength conversion coating on the substrate and comprising: (a) a phosphor powder that can be excited by UVc And (b) an anti-UVc adhesive, wherein the thickness of the wavelength conversion coating is 2 to 10 times the average particle diameter of the phosphor powder, and the content of the phosphor powder in the wavelength conversion coating is as follows: At least one condition: (i) the volume percentage of the phosphor powder in the wavelength conversion coating is from 30% to 85% (based on the total volume of the phosphor powder and the adhesive); and (ii) the phosphor powder The weight ratio to the adhesive is 1:1 to 20:1. The creation wavelength conversion structure can be combined with a UVc light source to provide a large area of visible light source. The visible light source can be used in a backlight module to provide a large-area display panel in a simple manner. Another object of the present invention is to provide a method for fabricating a wavelength conversion structure comprising: 'providing a substrate; applying a slurry to the surface of the substrate, which is placed in a reservoir and containing (a) - a phosphor powder that can be excited by UVc; (b) an anti-UVc adhesive; and (c) an organic solvent, wherein the weight ratio of the phosphor powder to the adhesive is 1:1 to 20:1; and drying the coated substrate. After referring to the embodiments described later, those skilled in the art of the present invention can easily understand the basic spirit of the creation and other creative purposes, and the technical means and preferred embodiments adopted by the present invention. kind. [Embodiment] In order to provide a planar light source with a large light-emitting area, the present author converts ultraviolet light into visible light by a phosphor, in particular, directly coating a slurry containing a phosphor powder on a planar substrate. A wavelength conversion structure is formed thereon. In this way, ultraviolet light, in particular the UVc " band, can be converted into visible light via the wavelength conversion structure. That is, the ultraviolet light is excited to emit a phosphor powder and generate visible light. This wavelength conversion structure enhances the uniformity of illumination and provides the desired illumination area as needed. As mentioned above, CCFL has the advantages of mature production technology and low cost. However, it is limited that the fluorescent coating needs to be placed in the same vacuum tube as the light source, so it is difficult to enlarge and it is difficult to provide a large-area wavelength conversion. In detail, the CCFL coats a phosphor slurry solution (a composition component composed of a combination of a phosphor powder, an organic substance, an inorganic substance, and a solvent) in a glass tube, and thereafter, in the composition. The organic component is sintered and removed to form a phosphor layer on the inner wall of the glass tube. The glass tube is then filled with mercury vapor, and after the reference, the glass tube is closed, and the mercury vapor is excited by the electrode to release UVc, which is converted into visible light by the phosphor layer on the glass wall. In the above conventional CCFL manufacturing method, the coating of the phosphor layer is performed in an upright manner, and the phosphor paste is first sucked to the upper end of the vertical tube by the siphon principle, and then applied to the lamp from top to bottom by gravity. The inner wall of the tube is then sintered to remove the organic components of the coating to form the desired phosphor layer. In the foregoing coating method, thickness unevenness is caused at the upper and lower ends of the lamp due to the difference in gravity. This unevenness is particularly serious in the case where the lamp tube size is high (i.e., a case where a long lamp is required). 9 M329794 In addition, the existing CCFL structure sinters the phosphor onto the glass tube wall, but it is still difficult to prevent ultraviolet light from leaking from the phosphor gap in the phosphor layer. Taking the existing liquid crystal display technology as an example, the ultraviolet light leakage of the CCFL affects the characteristics of the optical materials such as the diffusion plate and the brightness enhancement film, resulting in deterioration of the materials. Therefore, most materials are treated with an anti-UV coating to increase their service life. In response to the above problems, the creator attempts to directly apply the phosphor paste directly to the individual substrate instead of the inner wall of the glass tube, providing a visible light source in a manner that separates the tube from the phosphor layer, eliminating the thickness of the CCFL phosphor layer. One problem is to increase the uniformity of illumination and to provide the desired illumination area as needed. Moreover, it has been found through research that through the use of special solvents and adhesives, and the control of the content of the adhesive and the phosphor powder, the formed composition slurry can be formed on the substrate without a sintering process. A wavelength conversion coating that efficiently converts ultraviolet light into visible light. The slurry can be applied to the substrate by a relatively simple coating method (e.g., roll-to-roll coating method) to greatly enhance the mass productivity. Other coating methods are exemplified (but not limited thereto), and dip coating, comma coating, spraying coating, and spin coating (spin) may be employed. Coating), slot coating, curtain coating, gravure coating, or wire bar coating. In particular, it may be dried in any convenient manner as needed. By way of example (but not by way of limitation), the drying may be carried out in a natural manner, or by a forced volatilization of aeration and/or heating (e.g., by hot air). The combination of the treatment coating and the substrate can be a simple wavelength conversion coating combination that can be combined with existing backlights, light sources, solid state lighting (such as LEDs and OLEDs) without changing the existing structural design. , has its high applicability. M329794 In addition, the wavelength conversion coating structure is effective in eliminating the problem of conventional CCFL campsite powder degradation. Here, it is known that the light light generated by the CCFL during the discharge process causes the phosphor powder to absorb or emit a spectrum (color center, also known as "color center" or "color center"), resulting in a new absorption band. The brightness of the phosphor powder is reduced (the aforementioned phenomenon can be found in the description of U.S. Patent No. 6,402,987, the disclosure of which is incorporated herein by reference). Second, the mercury ions and electrons recombine at the wall of the tube and release 10.42 eV of energy, which destroys the crystal lattice of the phosphor powder and reduces the brightness. Furthermore, since sodium ions are usually present in the CCFL lamp, it combines with the electrons generated when the CCFL lamp is discharged to form sodium atoms. The sodium atoms will diffuse into the phosphor powder grains, resulting in a decrease in the performance of the phosphor powder. Therefore, when the wavelength conversion structure is applied to the light-emitting module, since the wavelength conversion coating is separated from the UVe light source, that is, the phosphor is separated from the UVc light source, thereby effectively eliminating the conventional ccfl phosphor powder and The aforementioned problems caused by the UVc light source being placed in the same lamp. Specifically, the present invention can provide a wavelength conversion structure, and its specific implementation can be illustrated as in FIG. 1A, wherein 〇, #, and ❿ respectively represent the phosphors of different colors. The wavelength conversion structure 1 〇 2 comprises a substrate 1 〇 21 and a wavelength conversion coating 1023. The coating 1023 is disposed on the substrate 1021 and comprises a UVe-excitable phosphor powder and an anti-UVc adhesive. Wherein, the thickness of the conversion coating 1〇23 is 2 to 10 times the average particle diameter of the phosphor powder, and the content of the phosphor powder in the wavelength conversion coating layer 1〇23 meets at least one of the following conditions: ') The volume percentage of the phosphor powder in the wavelength conversion coating is from 3% to 85% (based on the total volume of the phosphor powder and the adhesive); and the weight ratio of the phosphor powder to the adhesive is 1:1 to 2:1. 11 • M329794 can use any combination of sensible UVc-excited phosphor powder for wavelength conversion coatings. For example, but not limited to, the phosphor powder may be selected from the group consisting of: oxidized-doped yttrium, yttrium-doped yttrium-doped yttrium oxide, yttrium-doped yttrium-doped lock, and combinations thereof . A suitable product can also be purchased directly from the market as a phosphor powder for the wavelength conversion coating.
於波長轉換塗層中,所採用之黏著劑係可黏結螢光體粉末以提 u 供一波長轉換層’通常係選自巨分子黏著劑。然而,為配合UVC 之應用,避免激發過程造成自身材料之劣化,較佳者係於該波長 > 轉換塗層中採用具抗UVc性質之黏著劑。 具體而言,以使用253.7nm波長之UVc光源為例,由於其光能 量約為113 kcal/mol,在不受理論限制之情形下,咸信若一巨分子 黏著劑之重複單元的化學結構中至少包含一鍵能大於113 kcal/mol之化學鍵,便足以抵抗UVc波段之能量,避免於激發過 程造成自身材料之劣化。於此,因碳氟鍵之鍵能為132 kcal/mol, 故若採用253.7 nm之UVc光源,則可採用如下之含氟高分子為黏 _ 著劑:聚四氟乙烯(polytetrafluoroethylene,PTFE )、聚偏二氟 乙烯(poly(vinylidene fluorde),PVDF )、聚偏二氟乙烯·六氟丙 烯(poly(vinylidene fluoride-hexafluoropropylene),PVDF-HFP )、 乙稀·四氟乙烯共聚物(ethylene-tetrafluoroethylene copolymer, ETFE )、氟化乙烯丙烯共聚物(fluorinated ethylene propylene copolymer,FEP)、全氣烧氧(perfluoroalkoxy,PFA)、氟橡勝 (fluoro-rubber)、氟彈性體(fluoro-elastomer)、非結晶型氣高 分子(amorphous fluoropolymers)、及其組合。亦可採用如下含 12 •M329794 矽高分子:矽膠(silicon rubber)、聚矽氧烷(p〇lysil〇xane)及 * 其組合。其他如聚醯亞胺(PoWmide,PI )、聚醚颯 • (pl〇yetherSulW ’ PES)等高效能聚合物,亦可於採用uVc波 段之253.7細波長之紫外糾,作麵長轉換塗層之黏著劑。較 佳者係採用含_之巨分子為黏著劑。此外,其他具黏結功能 或可作為螢光體基質之無機或有機·無機混成化合物,如二氧化 石夕、二氧化鈦、二氧化錯等無機或溶膠凝膠材料(如咖讀論) #等,亦可搭配253.7咖波長之⑽而施用於波長轉換塗層中。 #前述’波長轉換塗層中之螢光體粉末含量須符合以下條件: (1) 30%至85%體積百分比(以螢光 * #、 ^ 體知末與黏著劑之總體積為 基準)及/或⑺_螢光體粉末與黏著劑之重量比為卜i至⑽。於 此’當黏者劑含量越低’所提供螢光層之螢光體彼此間、以及螢 光體與施用該螢光層之基材間之黏附將越弱;相對地,當黏著劑 含量越高,雖可提供較強之黏附效果,但該較高量黏著劑暴露於 UVc之機會將越^長期使用下除造成黏著劑之性能劣化外,更 •易使得所提供波長轉換結構之發光效率降低。因此,為提供-合 宜之波長轉換塗層,較佳者係使波長轉換塗層中含有符合以下條 件之螢光體粉末含量以形_似沙琪狀結構(即,黏著劑於塗 層中係以薄層形式覆於螢光體粉末上,而非為一連續相):⑴體 積百分比為50至70%之螢光體及/或(2)螢光體粉末與黏著劑之 重量比為2·5 : 1至1 〇 · t Λ • 1。更佳者係使螢光體粉末與黏著劑之重 量比為3 : 1至6 : 1。 基於發光效率考量,螢光體粉末之粒徑分佈較佳為工至川微 13 M329794 米,更佳為1至10微米。此外,可採用二或多種粒徑分佈區間之 螢光體粉末組合以增加其堆疊效率,增進所提供波長轉換塗層之 紫外光吸收效率與可見光發光效率。於此,僅需其一之粒秤^上 述範圍即可。舉例言之,可採用第一種粒徑分佈區間在丨至10微 米,且第二種粒徑分佈在1至1000奈米之螢光體粉末組合。 於波長轉換結構中,當轉換塗層之厚度過高,將阻擋所轉換釋 出之可見光,而若塗層厚度過薄,則易因UVc吸收不全而產生UVc 洩漏現象,造成波長轉換結構之基材或黏著劑等高分子材料黃 化。因此,為提供合宜之UVc轉換效益、避免黃化,宜控制波長 轉換塗層之厚度。於此,經發現,當轉換塗層之厚度為螢光體粉 末平均粒徑之2至1〇倍時,可於塗層中具有多層螢光體粉末之堆 疊,此可使UVc於塗層中經多次反射及/或折射,有效兼顧發光效 率及阻隔UVc。更佳地,該轉換塗層之厚度為螢光體粉末平均粒 徑之3至5倍。舉例言之,當螢光粉之平均大小為3至4微米時, 轉換塗層之厚度以6至40微米為佳,尤以1〇至20微米更佳。 波長轉換結構之基材可為一撓性膜,尤其是由聚合物材料所構 成者,以利於傳統捲對捲(r〇ll-to_roll)之量產塗佈方式。該挽性 基材較佳具可透光性,更佳為具較高透光性。舉例言之(但不以 此為限),可採用選自以下群組之材料所提供之膜層為基材:聚 對苯二甲酸乙二酯(polyethylene terephthalate,PET )、三醋酸纖 維(triacetyl-cellulose,TAC )、聚萘二甲酸乙二酯(p〇iy(ethylene 2,6-naphthalate),PEN)、聚 颯(polyether sulfone,PES )、聚 偏二氟乙烯(poly(vinylidene fluorde),PVDF)、乙浠-辛稀共聚 M3*29794 物(poly(ethylene_co-octene ) ,PE_PO)、丙浠-乙稀共聚物 (poly(propylene-co-ethylene ) ,ΡΡ·ΡΕ)、雜排聚丙浠(atactic polypropylene,aPP )、同排聚丙稀(isotactic polypropylene,iPP)、 - . 官能化聚稀烴(functionalized polyolefin )、及線性低密度聚乙烯 -g-順丁 婦二酐(linear low density polyethylene-g-maleic anhydride,LLDPE_g-MA),較佳為光學級之 PET 與 TAC。 亦可以透明薄片為波長轉換結構之基材。舉例言之(但不以此 為限),可採用由玻璃、石英、聚(甲基丙烯酸甲酯)(poly(methyl ^ methacrylate),PMMA)、聚苯乙浠(polystyrene,PS)、聚(甲基 丙烯酸甲酯·苯乙浠)共聚物 (methyl methacrylate-co_styrene, MS)、或聚碳酸酯(polycarbonate,PC)所提供之薄片為基材, 或者,可利用可透光之纖維織物(fabrics)作為基材,其材質通常 為玻璃。此外,亦可採用由二或多層上述膜層及/或薄片所構成之 複合層為基材;於此,可利用高分子感壓膠以黏合各層。 該波長轉換結構可由包括如下步驟之方法製得: | 提供一基材; 於該基材表面塗覆一漿料,其係置於一儲槽中且包含: (a) —可受UVc激發之螢光體粉末; (b) —抗UVc黏著劑;以及 (c) 一有機溶劑, 其中,該螢光體粉末與該黏著劑均如前述所定義且此二者之 重量比為1:1至20:1 ;以及 乾燥該經塗覆之基材。 · 15 M329794 可採用任何合宜有機溶劑以作為螢光體粉末與黏著劑之載劑 - (carrier)。一般而言,基於連續性塗佈之容易性的考量,通常係 控制漿液黏度在lOcps至lOOOOcps之範圍内,此時較佳係採用低 沸點有機溶劑,以避免於塗層乾燥過程中因溶劑無法迅速揮發而 發生螢光體沉澱,進而導致顏色偏差等問題。合宜之低沸點溶劑 包括(但不以此為限)選自以下群組者:C3-C4酮類、經一或多個 '鹵基取代之CVC4鏈烷類、C5-C7鏈烷類、C5_C6環烷類、CrC4鏈 烷醇類、C2-C4醚類、乙酸乙酯、苯、甲苯、乙腈(acetonitrile)、 _ 四氫呋喃、石油醚、氟素溶劑、及其組合。較佳為C3-C4酮類、經 一或多個鹵基取代之CrQ鏈烷類、C5-C7鏈烷類、C5-C6環烷類、 乙腈、及前述之組合。 適用之低沸點有機溶劑的具體實例包括(但不限於):丙酮、 甲乙_、1,2-二氯乙烧、二氯曱烧、氯仿、戊烧、正己烧、庚烧、 環戊烷、環己烷、甲醇、乙醇、丙醇、異丙醇、三級丁醇、乙醚、 乙酸乙酯、苯、曱苯、乙腈(acetonitrile )、四氫吱喃、石油醚、 p 及其組合。較佳之具體實施例為甲苯、甲乙酮、乙酸乙酯、1,2-二氯乙烷、及其組合。 漿料中之有機溶劑含量並非本創作重點所在,可視所欲漿料黏 度而調整。一般所採用之有機溶劑含量(以漿料總重量為基準) 在20至80重量%,較佳為35至55重量%。 視需要地,可於漿料中進一步添加其他成分,以延長所提供波 長轉換結構之壽命。此等視需要添加之其他成分包括(但不以此 為限):穩定劑、吸收劑、阻斷劑、及其組合。於此,如氧化鋁、 16 ^ M329794 氧化辞及二氧化鈦之金屬氧化物(較佳為具奈米尺寸者),係可 提供阻斷效益;如二苯基_及料三奴有機化合物,乃典型之 及收?=ι] /、了及收束外光而釋出熱;如受阻胺(hindered amine) 之光穩定劑,則可吸收被激發基團而防止其所造成之化學反應。 一般而言,為避免對波長轉換結構之效能造成不利影響,此等視 需要添加成分之總量通常為(以漿料總重為基準)不超過1〇重量 %。 於上述方法中,可於塗覆進行前或進行中將前述螢光體粉末與 黏著劑摻混於溶劑中以形成所需漿料。其後,將該漿料塗覆於基 材表面,再乾燥去除溶劑,即得所欲之波長轉換塗層。較佳地, 係於塗覆過程中對該儲槽中之漿料施予適度的攪拌,以避免因密 度差異所致之固體物沉澱或相分離現象。可以各式合宜方式以提 供該攪拌。舉例言之(但不以此為限),可經由機械攪拌方式、 均質攪拌、混鍊、雙轴攪拌、三滚筒攪拌、行星式攪拌、球磨、 或脈衝加壓方式,以於儲槽内之漿料中形成紊流擾動,達到攪拌 目的。 可採用任何合宜之方式來進行上述塗覆操作。舉例言之(但不 以此為限),可採用浸塗法(dip coating )、刮刀式塗佈法(comma coating)、喷塗法(spraying coating )、旋轉式塗法(spin coating )、 擠壓塗佈法(slot coating)、簾幕式塗佈法(curtain coating )、凹板 塗模法(gravure coating)、或捲對捲(roll_to_ro11)塗佈法。視 需要地,可進行一或多次塗覆操作至所需之塗層厚度。該塗層可 以任何合宜方式以乾燥之。舉例言之(但不以此為限),可以自 17 'M329794 然揮發方式、或輔以通氣及/或加熱之強制揮發方式(如:通以熱 - 空氣)來進行該乾燥。 該波長轉換結構可應用於一發光模組。於此,可視需要於基材 覆有波長轉換塗層侧之相對侧形成如稜鏡或微粒之光學增進結 構,以提供額外之光學效果。波長轉換結構可視需要更包含任何 合宜之光學元件,例如擴散板、擴散膜、增亮膜(Brightness Enhancement Him ; BEF )、反射式增亮膜(Dual Brightness ,Enhancement Film ; DBEF)、稜鏡板(Prism Plate)、凸鏡片 (LenticularFilm)、偏光板、或前述組合之光學膜片,以提供增 亮或偏光效能。波長轉換結構之另一實施態樣茲以第IB、1C圖例 示說明,其中,〇、#及⑩分別代表不同顏色之螢光體粉末。於 第1B圖中,波長轉換結構104係包含一基材1〇41與一位於基材 1041上方之波長轉換塗層1043,基材1〇41係由一如PET之透明 膜層1045與一如PMMA、MS、或PC之透明薄片1047經由一層 高分子感壓膠1049所黏合而成之複合層。第1C圖所示波長轉換 • 結構106係包含一基材1061與一位於基材1061上方之波長轉換 塗層1063,其中,基材1061係一於一侧具稜鏡結構或擴散結構之 光學增進結構。此外,可視需要於基材上使用一保護性膜(如PET 膜)以保護之。 第2A圖顯示一應用上述波長轉換結構之發光模組之分解示意 圖。於發光模組20之框體201中設有UVc光源203。光源203通 常為一燈管(lamp )。為固定燈管位置,使其不致產生移動,傳 統上會於光源203與框體201底部之間設置一光源固定座(holder) 18 M329794 207(如第2B圖所示)。該光源固定座2〇7通常具有一背板2〇71、· • 複數固定架2073及一支撐柱2075。固定架2073與支撐柱2075 均設置於背板2071上,背板2071則固定於框體201内之底部上。 固定架2073夾持該光源203使其固定於一適當位置,而支撐柱 2075則可支撐框體201上方之光學元件(圖未繪示)使其不致下 垂。其中’為保護光源固定座207不受光源203產生之UVc所損 壞,亦可視需要於光源固定座207之表面上塗覆前述波長轉換塗 層(圖未繪示)。 下述之發光模組(包括背光模組)均可視需要地設置光源固定 座,惟簡化起見,以下内容中除非特別指出,否則將以不設置光 源固定座之態樣來進行說明。 再參考第2A圖,框體201具有一開口 2011,於開口 2011上設 置一波長轉換結構205,以與框體201形成一含有空氣之密閉空 間2013。波長轉換結構205包含一波長轉換塗層2051及一基材 2053,波長轉換塗層2051塗侔於基材2053面向光源203之侧面 φ 上(即,於基材2053之面光源侧)。於發光模組20中,當光源 203產生UVc並射向波長轉換結構205時,波長轉換塗層2051中 之螢光體粉末將被UVc激發,並釋出可見光。 該可見光之顏色可經由光混色原理而獲得,例如混合紅色、綠 色及藍色之可見光,可獲得實質上白色之可見光。 第3A圖顯示一應用上述波長轉換結構之發光模組30之剖面示 意圖。發光模組30包含一框體301、一波長轉換結構305、由樞 體301與波長轉換結構305所包圍之含有空氣的密閉空間3013、 M329794 以及位於密閉空間3013内之UVc光源303。波長轉換結構305包 含一第一波長轉換塗層3051及一基材3053,第一波長轉換塗層 3051塗佈於基材3053面向光源303之側面上(即,於基材3053 之面光源侧)。第一波長轉換塗層3051包含可受UVc激發而釋出 第一可見光之螢光體粉末。框體301之内側壁上則設置一第二波 長轉換塗層307,其包含可受UVc激發而釋出第二可見光之螢光 體粉末。當光源303產生UVc並射向波長轉換結構305及第二波 長轉換塗層307時,波長轉換結構305之第一波長轉換塗層3051 中的螢光體粉末將被UVc激發而釋出第一可見光;第二波長轉換 塗層307中的螢光體粉末則被uvc激發而釋出第二可見光。該第 二可見光於穿過波長轉換結構305之後,與結構305所釋出之第 一可見光進行混光而產生一第三可見光。 於第3A圖之發光模組3〇中,當第一可見光與第二可見光之顏 色相同時’可提供顏色與第一可見光與第二可見光相同、但亮度 較其為高之第三可見光;而若第一可見光與第二可見光之顏色不 1 同時’則可產生混光作用,提供顏色與第一可見光與第二可見光 不同之可見光。舉例言之,當該第一可見光包含紅色可見光及綠 色可見光且該第二可見光為藍光時,便可透過前述混光而產生白 色可見光。 該第一波長轉換塗層307之設置,除可採用直接塗佈於框體301 内側壁(如第3A圖所示)之方式以外,亦可經由先將第二波長轉 換塗層307塗佈於一適當之撓性基材上(圖未繪出),以形成一 第一波長轉換結構(圖未繪出),其後再將該結構設置於框體301 ’ M329794 内側壁上之方式而達成,提供所欲混光效益。 • 第3B圖顯示應用上述波長轉換結構之另一發光模組32之剖面 • 示思圖。發光模組32包含一框體321、一波長轉換結構325、以 及由框體321與波長轉換結構325所包圍之含有空氣的密閉空間 • 3213。密閉空間3213内設有複數個光源,包括可產生uVc之光源 3231以及可產生可見光(例如藍色可見光)之光源3233。波長轉 換結構325包含一波長轉換塗層3251及一基材3253,波長轉換塗 I 層3251塗佈於基材3253面向光源之側面上(即,於基材3253之 面光源側)。波長轉換塗層3251包含可受UVc激發釋出一可見光 之螢光體粉末。類似前述第3A圖之發光模組30,於發光模組32 中,當光源3231產生UVc並射向波長轉換結構325時,波長轉換 塗層3251中之螢光體粉末將被UVc激發,並釋出一第一可見光。 該第一可見光與光源3233所產生之第二可見光進行混光,產生一 第三可見光。該第三可見光之顏色可與第一可見光與第二可見光 相同(當第一可見光之顏色與第二可見光相同)或為第一可見光 • 與第二可見光之混光結果(當第一可見光之顏色與第二可見光相 異)。 如周知,一般UVC光源於發光時,除UVC波段之紫外光以外, 亦可能會提供少許UVa波段及/或UVb波段之紫外光。為有效利用 UVc,本揭露中之螢光體粉末可選用吸收UVe波長之螢光體粉 末以及可吸收其他紫外光波長之螢光體粉末之組合,例如可吸 收波長實質上為365奈米(nm)之UVB或400奈米(nm)之UVa 之螢光體粉末,以充分轉換光源所發出之紫外光。 21 M329794 為避免前述微量uvA波段及/或uvB波段紫外光所可能造成之 ' 影響’除可於發光模組之波長轉換塗層中同時包含可吸收11¥0與 - UVa及1JVb之螢光粉以外,亦可於發光模組之波長轉換結構中進 一步包含~紫外光波長阻絕塗層,以減少任何可能之紫外光^ 漏。此—具紫外光波長阻絕塗層之發光模組實施態樣之示咅圖可 參考第4A至4C圖,其中第4A圖係為發光模組之分解圖,第4B、 4C圖係為第4A圖中沿AA’線之波長轉換結構局部剖面示音圖, φ 代表波長轉換結構之二不同態樣。 如第4A圖所示,發光模組40包含一框體401具有一開口 4〇11, 框體401中設有UVc光源4〇3。於開口 4〇11上設置一波長轉換結 構405’波長轉換結構4〇5與框體4〇1組合形成一含有空氣之密閉 空間4013。其中,波長轉換結構4〇5之一實施態樣如第圖所 示,由下而上包含一波長轉換塗層4〇5卜一基材4〇53以及一紫外 光波長阻絕塗層4055,即,波長轉換塗層4051與紫外光波長阻絕 塗層4055係置於基材4〇53之兩側。紫外光波長阻絕塗層4〇55亦In the wavelength conversion coating, the adhesive used may bond the phosphor powder to provide a wavelength conversion layer, typically selected from macromolecular adhesives. However, in order to cope with the application of UVC and avoid the deterioration of the material caused by the excitation process, it is preferred to use an adhesive having UV-resistant properties in the wavelength conversion coating. Specifically, taking a UVc light source having a wavelength of 253.7 nm as an example, since the light energy is about 113 kcal/mol, in the case of not being limited by theory, the chemical structure of a repeating unit of a macromolecular adhesive is not included in the theoretical limit. A chemical bond containing at least one bond greater than 113 kcal/mol is sufficient to resist the energy of the UVc band and avoid degradation of its material during the excitation process. Here, since the bond energy of the fluorocarbon bond is 132 kcal/mol, if a UVc light source of 253.7 nm is used, the following fluorine-containing polymer can be used as a viscous agent: polytetrafluoroethylene (PTFE), Poly(vinylidene fluorde), PVDF, poly(vinylidene fluoride-hexafluoropropylene, PVDF-HFP), ethylene-tetrafluoroethylene copolymer Copolymer, ETFE), fluorinated ethylene propylene copolymer (FEP), perfluoroalkoxy (PFA), fluoro-rubber, fluoro-elastomer, amorphous Amorphous fluoropolymers, and combinations thereof. It is also possible to use the following 12 • M329794 矽 polymer: silicon rubber, p〇lysil〇xane and * combinations thereof. Other high-performance polymers such as PoWmide (PI), polyether 飒 (pl〇yetherSulW ' PES), can also be used as a face length conversion coating using 253.7 fine wavelength UV correction in the uVc band. Adhesive. The better ones use macromolecules containing _ as an adhesive. In addition, other inorganic or organic-inorganic hybrid compounds which have a bonding function or can serve as a matrix of a phosphor, such as an inorganic or sol-gel material such as silica dioxide, titanium dioxide, and dioxins (such as coffee reading) #等, It can be applied to the wavelength conversion coating in combination with (10) of 253.7 coffee wavelength. # The above-mentioned phosphor powder content in the wavelength conversion coating shall meet the following conditions: (1) 30% to 85% by volume (based on the total volume of the fluorescent * #, ^ body and the adhesive) and / or (7) _ phosphor powder and adhesive weight ratio is i to (10). Here, the lower the adhesive content, the weaker the phosphors of the phosphor layer provided and the adhesion between the phosphor and the substrate to which the phosphor layer is applied; in contrast, when the adhesive content is The higher the adhesion, the stronger the adhesion effect, but the higher the amount of adhesive exposure to UVc will be, the longer the use will be, the more the performance of the adhesive will be degraded, and the light-emitting structure will be lighted. Reduced efficiency. Therefore, in order to provide a suitable wavelength conversion coating, it is preferred that the wavelength conversion coating contains a phosphor powder content in a shape similar to a Shaqi-like structure (ie, an adhesive is applied to the coating layer). Covering the phosphor powder in a thin layer instead of a continuous phase): (1) 50 to 70% by volume of the phosphor and/or (2) the weight ratio of the phosphor powder to the adhesive is 2 · 5 : 1 to 1 〇 · t Λ • 1. More preferably, the weight ratio of the phosphor powder to the adhesive is from 3:1 to 6:1. The particle size distribution of the phosphor powder is preferably 13 M329794 m, more preferably 1 to 10 m, based on the luminous efficiency. In addition, a combination of two or more particle size distributions of phosphor powder can be used to increase stacking efficiency and enhance the ultraviolet light absorbing efficiency and visible light illuminating efficiency of the provided wavelength converting coating. Here, only one of the scales can be used. For example, a first phosphor particle powder combination having a particle size distribution interval of 10 to 10 μm and a second particle size distribution of 1 to 1000 nm can be used. In the wavelength conversion structure, when the thickness of the conversion coating is too high, the converted visible light will be blocked, and if the thickness of the coating is too thin, UVc leakage may occur due to incomplete UVc absorption, resulting in a wavelength conversion structure. Yellowing of polymer materials such as materials or adhesives. Therefore, in order to provide a suitable UVc conversion benefit and avoid yellowing, it is desirable to control the thickness of the wavelength conversion coating. Herein, it has been found that when the thickness of the conversion coating is 2 to 1 times the average particle diameter of the phosphor powder, a stack of multiple layers of phosphor powder can be present in the coating, which allows UVc to be in the coating. After multiple reflections and / or refraction, it effectively balances luminous efficiency and blocks UVc. More preferably, the thickness of the conversion coating is 3 to 5 times the average particle diameter of the phosphor powder. For example, when the average size of the phosphor powder is 3 to 4 μm, the thickness of the conversion coating layer is preferably 6 to 40 μm, more preferably 1 to 20 μm. The substrate of the wavelength converting structure can be a flexible film, especially a polymer material, to facilitate the conventional roll-to-roll application. The tractable substrate preferably has a light transmissive property, and more preferably has a high light transmittance. For example, but not limited to, the film layer provided by the material selected from the group below may be used as a substrate: polyethylene terephthalate (PET), triacetate (triacetyl) -cellulose, TAC), polyethylene naphthalate (p〇iy (ethylene 2,6-naphthalate), PEN), polyether sulfone (PES), poly(vinylidene fluorde), PVDF), acetonitrile-octane copolymer M3*29794 (poly(ethylene_co-octene), PE_PO), propylene-ethylene copolymer (poly(propylene-co-ethylene), ΡΡ·ΡΕ), miscellaneous polypropylene (atactic polypropylene, aPP), isotactic polypropylene (iPP), - functionalized polyolefin, and linear low-density polyethylene-g-succinyl dianhydride (linear low density polyethylene- G-maleic anhydride, LLDPE_g-MA), preferably optical grade PET and TAC. The transparent sheet can also be a substrate for the wavelength conversion structure. For example, but not limited to, it can be made of glass, quartz, poly(methyl methacrylate), PMMA, polystyrene (PS), poly ( A sheet provided by methyl methacrylate-co-styrene (MS) or polycarbonate (PC) is used as a substrate, or a woven fabric can be used (fabric As a substrate, the material is usually glass. Further, a composite layer composed of two or more layers of the above-mentioned film layers and/or sheets may be used as a substrate; here, a polymer pressure sensitive adhesive may be used to bond the layers. The wavelength conversion structure can be obtained by a method comprising the steps of: providing a substrate; coating a surface of the substrate with a slurry disposed in a reservoir and comprising: (a) - being permeable to UVc a phosphor powder; (b) an anti-UVc adhesive; and (c) an organic solvent, wherein the phosphor powder and the adhesive are both as defined above and the weight ratio of the two is 1:1 to 20:1; and drying the coated substrate. · 15 M329794 Any suitable organic solvent can be used as a carrier for the phosphor powder and the adhesive - (carrier). In general, based on the ease of continuous coating, the viscosity of the slurry is usually controlled in the range of lOcps to 1000 cps. In this case, a low-boiling organic solvent is preferably used to avoid the solvent being unable to be dried during the coating drying process. Rapid evaporation causes phosphor precipitation, which leads to problems such as color deviation. Suitable low boiling solvents include, but are not limited to, those selected from the group consisting of C3-C4 ketones, CVC4 alkanes substituted with one or more 'halo groups, C5-C7 alkanes, C5_C6 Naphthenes, CrC4 alkanols, C2-C4 ethers, ethyl acetate, benzene, toluene, acetonitrile, _tetrahydrofuran, petroleum ether, fluorinated solvents, and combinations thereof. Preferred are C3-C4 ketones, CrQ alkanes substituted with one or more halo groups, C5-C7 alkanes, C5-C6 naphthenes, acetonitrile, and combinations of the foregoing. Specific examples of suitable low-boiling organic solvents include, but are not limited to, acetone, methyl bromide, 1,2-dichloroethane bromide, dichlorohydrazine, chloroform, pentane bromide, n-hexanol, heptane, cyclopentane, Cyclohexane, methanol, ethanol, propanol, isopropanol, tertiary butanol, diethyl ether, ethyl acetate, benzene, toluene, acetonitrile, tetrahydrofuran, petroleum ether, p, and combinations thereof. Preferred embodiments are toluene, methyl ethyl ketone, ethyl acetate, 1,2-dichloroethane, and combinations thereof. The organic solvent content of the slurry is not the focus of this creation and can be adjusted depending on the viscosity of the desired slurry. The organic solvent content (based on the total weight of the slurry) is generally from 20 to 80% by weight, preferably from 35 to 55% by weight. Further ingredients may be further added to the slurry to extend the life of the provided wavelength conversion structure, as desired. Other ingredients that may be added as needed include, but are not limited to, stabilizers, absorbents, blockers, and combinations thereof. Here, such as alumina, 16 ^ M329794 oxidation and titanium dioxide metal oxide (preferably with nanometer size), can provide blocking benefits; such as diphenyl _ and material three slave organic compounds, is typical And ??, and and the external light to release heat; such as hindered amine light stabilizer, can absorb the excited group to prevent the chemical reaction caused by it. In general, to avoid adverse effects on the performance of the wavelength converting structure, the total amount of such added components is usually (based on the total weight of the slurry) not more than 1% by weight. In the above method, the foregoing phosphor powder and an adhesive may be blended in a solvent to form a desired slurry before or during coating. Thereafter, the slurry is applied to the surface of the substrate, and the solvent is removed by drying to obtain a desired wavelength conversion coating. Preferably, the slurry in the storage tank is moderately agitated during the coating process to avoid solids precipitation or phase separation due to differences in density. This agitation can be provided in a variety of convenient ways. For example (but not limited to), it can be mechanically stirred, homogenized, mixed, biaxially stirred, three-rolled, planetary, balled, or pulsed. Turbulence disturbances are formed in the slurry for agitation purposes. The above coating operation can be carried out in any convenient manner. For example (but not limited thereto), dip coating, comma coating, spraying coating, spin coating, extrusion may be employed. Slot coating, curtain coating, gravure coating, or roll-to-ro11 coating. Optionally, one or more coating operations can be performed to the desired coating thickness. The coating can be dried in any convenient manner. By way of example (but not by way of limitation), the drying may be carried out from the 17 'M329794 volatilization mode, or by a forced volatilization method of aeration and/or heating (eg, by hot-air). The wavelength conversion structure can be applied to a light emitting module. Here, an optically enhancing structure such as ruthenium or microparticles may be formed on the opposite side of the substrate coated with the wavelength conversion coating side to provide additional optical effects. The wavelength conversion structure may further include any suitable optical components, such as a diffusion plate, a diffusion film, a brightness enhancement film (BEF), a reflective brightness enhancement film (Dual Brightness, Enhancement Film; DBEF), and a slab (Prism). Plate), Lenticular Film, polarizing plate, or a combination of the foregoing optical films to provide brightness enhancement or polarizing efficacy. Another embodiment of the wavelength conversion structure is illustrated by the IB, 1C diagrams, wherein 〇, #, and 10 represent phosphor powders of different colors, respectively. In FIG. 1B, the wavelength conversion structure 104 includes a substrate 1〇41 and a wavelength conversion coating 1043 over the substrate 1041. The substrate 1〇41 is made of a transparent film layer 1045 like PET. The transparent sheet 1047 of PMMA, MS, or PC is bonded through a layer of polymer pressure sensitive adhesive 1049. The wavelength conversion structure 106 shown in FIG. 1C includes a substrate 1061 and a wavelength conversion coating 1063 over the substrate 1061, wherein the substrate 1061 is optically enhanced on one side with a germanium structure or a diffusion structure. structure. In addition, a protective film (such as a PET film) may be used to protect the substrate as needed. Fig. 2A shows an exploded schematic view of a light-emitting module to which the above-described wavelength conversion structure is applied. A UVc light source 203 is disposed in the frame 201 of the light emitting module 20. Light source 203 is typically a lamp. In order to fix the position of the lamp so as not to cause movement, a light source holder 18 M329794 207 (as shown in Fig. 2B) is conventionally disposed between the light source 203 and the bottom of the frame 201. The light source fixing base 2〇7 usually has a back plate 2〇71, a plurality of fixing frames 2073 and a supporting column 2075. The fixing frame 2073 and the supporting column 2075 are both disposed on the back plate 2071, and the back plate 2071 is fixed on the bottom of the frame 201. The fixing frame 2073 holds the light source 203 to be fixed in a proper position, and the supporting column 2075 can support the optical component (not shown) above the frame 201 so as not to sag. In order to protect the light source fixing base 207 from the UVc generated by the light source 203, the wavelength conversion coating layer (not shown) may be coated on the surface of the light source fixing base 207 as needed. The light-emitting module (including the backlight module) described below may be provided with a light source fixing seat as needed. For the sake of simplicity, unless otherwise specified, the description will be made without setting the light source fixing seat. Referring again to FIG. 2A, the frame 201 has an opening 2011, and a wavelength conversion structure 205 is disposed on the opening 2011 to form a sealed space 2013 containing air with the frame 201. The wavelength conversion structure 205 includes a wavelength conversion coating 2051 and a substrate 2053. The wavelength conversion coating 2051 is applied to the side surface φ of the substrate 2053 facing the light source 203 (i.e., on the surface side of the substrate 2053). In the light-emitting module 20, when the light source 203 generates UVc and is incident on the wavelength conversion structure 205, the phosphor powder in the wavelength conversion coating 2051 will be excited by UVc and emit visible light. The color of the visible light can be obtained by the principle of light mixing, for example, mixing red, green, and blue visible light to obtain substantially white visible light. Fig. 3A shows a cross-sectional view of a light-emitting module 30 to which the above-described wavelength conversion structure is applied. The light-emitting module 30 includes a frame 301, a wavelength conversion structure 305, air-containing sealed spaces 3013, M329794 surrounded by the pivot 301 and the wavelength conversion structure 305, and a UVc light source 303 located in the sealed space 3013. The wavelength conversion structure 305 includes a first wavelength conversion coating 3051 and a substrate 3053. The first wavelength conversion coating 3051 is applied on the side of the substrate 3053 facing the light source 303 (ie, on the surface side of the substrate 3053). . The first wavelength converting coating 3051 comprises a phosphor powder that is excited by UVc to release the first visible light. A second wavelength conversion coating 307 is disposed on the inner sidewall of the frame 301, and comprises a phosphor powder which is excited by UVc to release the second visible light. When the light source 303 generates UVc and is incident on the wavelength conversion structure 305 and the second wavelength conversion coating 307, the phosphor powder in the first wavelength conversion coating 3051 of the wavelength conversion structure 305 will be excited by UVc to release the first visible light. The phosphor powder in the second wavelength conversion coating 307 is excited by uvc to release the second visible light. After passing through the wavelength conversion structure 305, the second visible light is mixed with the first visible light emitted by the structure 305 to generate a third visible light. In the light-emitting module 3A of FIG. 3A, when the colors of the first visible light and the second visible light are the same, 'the third visible light having the same color as the first visible light and the second visible light but having a higher brightness; If the color of the first visible light and the second visible light are not at the same time, a light mixing effect may be generated to provide visible light having a color different from the first visible light and the second visible light. For example, when the first visible light includes red visible light and green visible light and the second visible light is blue light, white visible light can be generated by the aforementioned mixed light. The first wavelength conversion coating layer 307 can be disposed on the inner side wall of the frame 301 (as shown in FIG. 3A), or the second wavelength conversion coating layer 307 can be applied to the first wavelength conversion coating layer 307. A suitable flexible substrate (not shown) is formed to form a first wavelength conversion structure (not shown), and then the structure is placed on the inner side wall of the frame 301 ' M329794 to achieve To provide the desired blending benefits. • Figure 3B shows a cross-section of the illumination module 32 to which the wavelength conversion structure described above is applied. The light-emitting module 32 includes a frame 321, a wavelength conversion structure 325, and a sealed space containing air 3232 surrounded by the frame 321 and the wavelength conversion structure 325. A plurality of light sources are provided in the confined space 3213, and include a light source 3231 that can generate uVc and a light source 3233 that can generate visible light (e.g., blue visible light). The wavelength conversion structure 325 includes a wavelength conversion coating 3251 and a substrate 3253. The wavelength conversion coating layer 3251 is applied to the side of the substrate 3253 facing the light source (i.e., on the side of the substrate 3503). The wavelength converting coating 3251 comprises a phosphor powder that is capable of being excited by UVc to emit a visible light. In the light-emitting module 30 of the foregoing FIG. 3A, in the light-emitting module 32, when the light source 3231 generates UVc and is incident on the wavelength conversion structure 325, the phosphor powder in the wavelength conversion coating 3251 will be excited by UVc, and released. A first visible light is produced. The first visible light is mixed with the second visible light generated by the light source 3233 to generate a third visible light. The color of the third visible light may be the same as the first visible light and the second visible light (when the first visible light color is the same as the second visible light) or the first visible light and the second visible light mixed result (when the first visible light color Different from the second visible light). As is well known, in general, UVC light sources, in addition to UV light in the UVC band, may also provide a small amount of UV light in the UVa band and/or UVb band. In order to effectively utilize UVc, the phosphor powder of the present disclosure may be selected from a combination of a phosphor powder that absorbs UVe wavelength and a phosphor powder that absorbs other ultraviolet wavelengths, for example, an absorbable wavelength of substantially 365 nm (nm). UVB or 400 nanometer (nm) of UVa phosphor powder to fully convert the ultraviolet light emitted by the light source. 21 M329794 In order to avoid the above-mentioned traces of uvA band and/or uvB band ultraviolet light, the 'effect' may be included in the wavelength conversion coating of the light-emitting module, which can absorb 11¥0 and - UVa and 1JVb phosphor powder. In addition, the wavelength conversion structure of the light emitting module may further include a UV wavelength blocking coating to reduce any possible ultraviolet light leakage. For the embodiment of the light-emitting module with UV wavelength blocking coating, refer to Figures 4A to 4C, wherein Figure 4A is an exploded view of the light-emitting module, and Figures 4B and 4C are 4A. In the figure, a partial cross-sectional view of the wavelength conversion structure along the line AA', φ represents two different aspects of the wavelength conversion structure. As shown in FIG. 4A, the light-emitting module 40 includes a frame 401 having an opening 4〇11, and a UVc light source 4〇3 is disposed in the frame 401. A wavelength conversion structure 405' is disposed on the opening 4'11, and the wavelength conversion structure 4'5 is combined with the frame 4'' to form a sealed space 4013 containing air. Wherein, one embodiment of the wavelength conversion structure 4〇5 is as shown in the figure, and comprises a wavelength conversion coating 4〇5b a substrate 4〇53 and an ultraviolet wavelength blocking coating 4055 from bottom to top, ie The wavelength conversion coating 4051 and the ultraviolet wavelength blocking coating 4055 are placed on both sides of the substrate 4〇53. UV wavelength blocking coating 4〇55 also
春可視需要地與波長轉換塗層4051置於基材4053之同側,如第4C 圖所示。 紫外光波長阻絕塗層4〇55之材料可為任何可阻絕紫外光者,例 如:紫外光阻擋材料、紫外光穩定材料、紫外光吸收材料、紫外 光反射材料、及Μ述之組合。常用之紫外光阻播材料如金屬氧化 物,具體態樣可為氧化銘、二氧化鈦、氧化鋅、及前述之組合。 /、中Κ土係採用粒控實質上小於1微米之金屬氧化物。可採用 之系外光L疋材料如雙阻胺(hindered ),且可採用之紫外 22 ‘M329794 光吸收材料則之具體例如二苯基酮、苯并三唑、及前述之組合。 為更進一步阻絕紫外光洩漏,可於發光模組之框體内侧壁中進 一步設置一保護層。參考第5圖,顯示另一發光模組於框體部份 之剖面示意圖,該發光模組如第4A圖所示,但於框體内側壁另具 有一保護層。如第5圖所示,此一實施態樣係包含一框體501,其 内設有UVc光源503,且於内側壁上設置有一保護層505,以阻擋 * UVc光源所發出之光穿透該框體501。保護層505係包含如前述紫 外光波長阻絕塗層所含之可阻絕紫外光材料或一反射層(例如金 •屬層)。框體501内側壁可視需要設有一波長轉換塗層(例如第 3A圖所示),於設有此一波長轉換塗層時,保護層505係設置於 框體内壁與波長轉換塗層之間。 上述各種發光模組亦可應用於顯示裝置之各種背光模組中’例 如側光式背光模組或直下式背光模組。第6圖為一應用該發光模 組之側光式背光模組60之示意圖。背光模組60包含一框體61 ’ 框體61内之一側設有UVc光源63,光源63之一側則設有一波長 φ 轉換結構65。於框體61之適切處設置有所需之光學膜片’例如擴 散膜67卜稜鏡片673、導光板675、反射片679等等。 第7圖為上述發光模組於直下式背光模組之一應用態樣之示意 圖。於第7圖中,直下式背光模組70包含一具一開口之框體701, 框體701内設有UVc光源703,於框體7〇丨開口上設有一波長轉 換結構705,波長轉換結構7〇5上則設有一光學膜片707。其中’ 波長轉換結構705包含一波長轉換塗層7〇51及一基材7053。基材 7053通常為一玎透光基材,且波長轉換塗層7051通常設置於基材 23 M329794 7053之面光側。 • 如前述第2B圖所述,有關光學膜片於發光模組(包括背光模組) _ 之應用,傳統係於發光模組之框體内設有包含支撐柱之光源固定 座。其中,支撐柱主要係用以避免光學膜片下垂、減少膜片表面 不平坦之現象,從而免除因此所致之亮度不均勻或不正確的結 果。第8圖為傳統直下式背光模組之一實施態樣之示意圖。直下 式背光模組80包含一具一開口之框體81,框體81内設有光源83, 於框體81開口上設有光學膜片85,且於框體81内存在支撐柱87 以支撐光學膜片85,以免除膜片85表面不平坦所致之不利結果 (為簡化起見,此圖中僅顯示光源固定座之支撐柱部分)。 然而,經發現,當於第7圖所示直下式背光模組70採用習知手 段,以支撐柱來支撐光學膜片707時,由於光學膜片707係設於 波長轉換結構705上且波長轉換塗層7051係設置於波長轉換結構 705之面光源側,故波長轉換塗層7051將直接與支撐柱接觸。此 於長時間使用,或於背光模組搬運或安裝過程中,均可能導致支 φ 撐柱損害(例如刮傷)波長轉換塗層7051,造成背光模組之發光 缺陷。 為避免上述因支撐柱損害波長轉換結構或波長轉換結構剛性不 足所致表面不平坦之現象,可於背光模組中進一步設置可提供波 長轉換結構一張力之一固定裝置,維持該波長轉換結構之表面於 實質上平坦,且免除支撐柱之使用。特定言之,可於將一波長轉 換結構設置於背光模組之前,先預施加一張力於該波長轉換結 構,使其表面獲得實質上之平坦。之後,於波長轉換結構表面實 24 M329794 質上平坦之狀態下以一固定裝置固定其形狀,從而維持其表面於 . 實質上平坦。 可採用各式合宜之固定裝置。例如,固定裝置可以包含互相對 應之第一元件及第二元件,當該兩個元件互相結合時可固定波長 轉換結構之形狀,使該波長轉換結構具實質上平坦之表面。或者, 固定裝置可以包含一構形與框體相配合之元件,以於與框體相結 合時固定波長轉換結構之形狀。 舉例言之,參考第9A至9F圖,顯示本背光模組之一實施態樣, * 其包含上述固定裝置之一特定態樣,其中第9A圖係為背光模組之 分解圖,第9B至9F圖係為第9A圖中沿BB’線之波長轉換結構局 部剖面示意圖,代表波長轉換結構之不同態樣。 如第9A圖所示,背光模組90包含一具一開口 911之框體91, 於開口 911上設有一波長轉換結構93,框體91内設有UVc光源 95。波長轉換結構93包含一波長轉換塗層931及一基材933,波 長轉換塗層931位於基材933之面光源側。波長轉換結構93經由 φ 一固定裝置而固定其形狀,固定裝置包含第一框架971及第二框 架973,且框架971與框架973具實質上相同尺寸。如第9B圖所 示,經由如黏合劑之合宜方式將框架971及框架973分別固定於 波長轉換結構93之上下兩側面,以固定該波長轉換結構93之形 狀,使其具實質上平坦之表面。 固定裝置所含二框架未必須具相同尺寸,亦可具不同尺寸,如 第9C圖所示。於第9C圖中,固定裝置係含第一框架975及第二 框架977,第二框架977之尺寸小於第一框架975 (或者相反,即, 25 、M329794 第一框架977之尺寸小於第二框架975)且可與第一框架975相嵌 - 設。從而,當框架975與框架977相嵌設時,可將波長轉換結構 . 93固定於其中,從而維持其表面於實質上平坦。 亦可如第9D圖所示,僅使用一框架979,經由黏合劑或其他適 切方式將波長轉換結構93固定於框架979上,以維持波長轉換結 構93之表面於實質上平坦,而可置於框體91上。或者,可如第 9E圖及第9F圖所示,採用外徑較開口 911小之框架981或内徑 _ 較開口 911側之框體91截面大之框架983,經由框架981或983 與框體91相嵌設之方式,固定波長轉換結構93之形狀,使其具 實質上平坦之表面。 上述各實施態樣之框架可為一體成形之框架或為複數條狀物所 組合之框架。此外,框架之形狀不限於矩形,亦可為應用上所需 之其他形狀(如:橢圓形)。 亦可於固定裝置上具特殊構型設計,藉由構形間之組合而固定 波長轉換結構。參考第10A至10E圖,第10A圖為本背光模組之 φ 另一實施態樣之示意圖,其中第10A圖係為背光模組之分解圖, 第10B至10E圖係為第10A圖中沿CC’線之波長轉換結構局部剖 面示意圖,代表波長轉換結構之不同態樣。於第10A圖中,背光 模組100之框體101具有一開口 1011,於開口 1011上設有一波長 轉換結構103,框體101内設有UVc光源105。波長轉換結構103 包含一波長轉換塗層1031及一基材1033,波長轉換塗層1031位 於基材1033之面光源側。如第10B圖所示,固定裝置包含一具凹 狀結構之第一元件1071,以及一具凸狀結構之第二元件1073。第 26 M329794 一元件1071之凹狀結構之位置至少與第二元件1073之凸狀結構 之位置相對應。 當然,固定裝置亦可包含一具凸狀結構之第一元件1075,以及 一具凹狀結構之第二元件1077,如第10C圖所示。其中,該凹狀 結構之位置至少與該凸狀結構之位置相對應。較佳地,該凹狀結 構與凸狀結構係分別為條形凹狀結構與條形凸狀結構。從而,於 凹狀結構與凸狀結構相嵌設時,可以固定波長轉換結構103於其 中,而維持其表面於實質上平坦。 亦可藉由框體與固定裝置之組合,提供所欲固定波長轉換結構 之效益。第10D圖顯示此一組合之一實施態樣之示意圖。其中, 框體101a進一步於頂端具一凸狀結構,而固定裝置則包含一具凹 狀結構之第一元件1079,該凹狀結構之位置至少與凸狀結構之位 置相對應。當兩者相互嵌設時,可以固定波長轉換結構103,維持 其具實質上平坦之表面。或者,可於框體頂端具凹狀結構而於固 定裝置包含具有與該凹狀結構之對應之凸狀結構之元件,參見第 > 10E圖。如第10E圖所示,框體101b進一步於頂端具一凹狀結構, 固定裝置則包含一具凸狀結構之第一元件1081,凹狀結構之位置 至少與凸狀結構之位置相對應。 於上述各實施態樣中,第一元件1071、1075、1079、1081及第 二元件1073、1077係被設置於波長轉換結構103之部份側邊,惟 不受此限,第一元件107卜1075、1079、1081及第二元件1073、 1077亦可被設置於波長轉換結構103之全部側邊或其他適當處。 各凹狀結構及凸狀結構亦不受圖式之形狀所限。此外,固定裝置 27 M329794 可視需要包含二或多個第一元件或第二元件。 舉例言之,對於開口為矩形之框體而言,第一元件與第二元件 可為環繞成矩形之條狀物,亦可為由L形或I形條狀物所相嵌組 合而成之矩形。於此,當採用框體與固定裝置之組合,以藉由其 凹/凸結構相嵌設而固定波長轉換結構時,可於固定裝置含有二具 有與框體頂端相對應凹/凸狀結構之I形條狀物,經由與框體頂端 相對侧相嵌設而固定波長轉換結構之相對側邊,以維持其表面於 實質上平坦。亦可於固定裝置含有二具有與框體頂端相對應凹/凸 狀結構之L形條狀物,經由與框體頂端相對角相嵌設而固定波長 轉換結構之相對側角,而維持其表面於實質上平坦。 固定裝置亦可為其他態樣。參考第11A至11D圖,第11A圖顯 示一背光模組110,其中第11A圖係為背光模組之分解圖,第11B 至11D圖係為第11A圖中沿DD’線之波長轉換結構局部剖面示意 圖,代表波長轉換結構之不同態樣。如第11A圖所示,背光模組 110包含一框體111,框體111具有一開口 1111,於開口 1111上 設有一波長轉換結構113,框體111内設有UVc光源115。波長轉 換結構113包含一波長轉換塗層1131以及一基材1133,波長轉換 塗層1131位於基材1133之面光源側。如第11B圖所示,固定裝 置包含一具有一連接件之第一元件1171以及一具有一連接孔之第 二元件1173,該連接件係與該連接孔相配合。從而,經由該連接 件與該連接孔而結合第一元件1171與第二元件1173,以固定波長 轉換結構113,使其具實質上平坦之表面。 另一背光模組之實施態樣如第11C圖所示,其中,背光模組係 28 M329794 與第nA圖所示相同,但所包含之框體uia則進一步且 孔,而固技置則包含-具有連接件之第—元件1175,框體⑴a 之連接孔與第一元件1175之連接件相配合。從而,藉由連接件盘 連接孔而結合框體Ula㈣定裝置之第—元件1175,關 轉換結構⑴之形狀’使其具實質上平坦之表面。類似地,可如 第11D圖所示,於背光模組之框體⑽進一步具一連接件(如圖 中所不之侧凸部分),而固定裝置則包含一具有連接孔 _Spring can optionally be placed on the same side of the substrate 4053 as the wavelength conversion coating 4051, as shown in Figure 4C. The UV wavelength blocking coating 4〇55 may be any material that blocks ultraviolet light, such as ultraviolet light blocking materials, ultraviolet light stabilizing materials, ultraviolet light absorbing materials, ultraviolet light reflecting materials, and combinations thereof. Commonly used ultraviolet light-blocking materials such as metal oxides may be oxidized, titanium dioxide, zinc oxide, and combinations thereof. /, the middle earth system uses a metal oxide whose particle control is substantially less than 1 micrometer. An external light L 疋 material such as hindered amine may be used, and an ultraviolet 22 ‘M329794 light absorbing material may be used, such as diphenyl ketone, benzotriazole, and combinations thereof. In order to further block the ultraviolet leakage, a protective layer may be further disposed in the sidewall of the casing of the light-emitting module. Referring to Fig. 5, a cross-sectional view of another light-emitting module in a frame portion is shown. The light-emitting module is as shown in Fig. 4A, but has a protective layer on the side wall of the frame. As shown in FIG. 5, this embodiment includes a frame 501 having a UVc light source 503 disposed therein, and a protective layer 505 disposed on the inner sidewall to block light emitted by the *UVc light source from penetrating the Frame 501. The protective layer 505 comprises a blockable ultraviolet light material or a reflective layer (e.g., a gold layer) as contained in the aforementioned ultraviolet light wavelength blocking coating. The inner side wall of the frame 501 may be provided with a wavelength conversion coating (for example, as shown in FIG. 3A). When the wavelength conversion coating is provided, the protective layer 505 is disposed between the inner wall of the frame and the wavelength conversion coating. The above various light-emitting modules can also be applied to various backlight modules of a display device, such as an edge-lit backlight module or a direct-lit backlight module. Figure 6 is a schematic diagram of an edge-lit backlight module 60 to which the illumination module is applied. The backlight module 60 includes a frame body 61'. One side of the frame body 61 is provided with a UVc light source 63, and one side of the light source 63 is provided with a wavelength φ conversion structure 65. A desired optical film such as a diffusion film 67, a light guide plate 675, a reflection sheet 679, and the like are provided at a suitable portion of the frame 61. Fig. 7 is a schematic view showing an application aspect of the above-mentioned light emitting module in a direct type backlight module. In the seventh embodiment, the direct-type backlight module 70 includes a frame 701 having an opening, a UVc light source 703 is disposed in the frame 701, and a wavelength conversion structure 705 is disposed on the opening of the frame body 7. The wavelength conversion structure is provided. An optical film 707 is provided on the 7〇5. The wavelength conversion structure 705 includes a wavelength conversion coating 7〇51 and a substrate 7053. The substrate 7053 is typically a light transmissive substrate, and the wavelength converting coating 7051 is typically disposed on the face side of the substrate 23 M329794 7053. • As described in Figure 2B above, the application of the optical film to the light-emitting module (including the backlight module) is conventionally provided with a light source fixing base including a support column in the frame of the light-emitting module. Among them, the support column is mainly used to avoid the sagging of the optical film and reduce the unevenness of the surface of the diaphragm, thereby eliminating the uneven brightness or the incorrect result. Figure 8 is a schematic diagram of one embodiment of a conventional direct type backlight module. The direct-type backlight module 80 includes a frame 81 having an opening, a light source 83 is disposed in the frame 81, an optical film 85 is disposed on the opening of the frame 81, and a support column 87 is supported in the frame 81 to support The optical film 85 is provided to avoid the unfavorable result of the unevenness of the surface of the diaphragm 85 (for the sake of simplicity, only the support column portion of the light source holder is shown in this figure). However, it has been found that when the direct type backlight module 70 shown in FIG. 7 adopts a conventional means to support the optical film 707 with a support post, since the optical film 707 is disposed on the wavelength conversion structure 705 and wavelength conversion The coating 7051 is disposed on the surface light source side of the wavelength conversion structure 705, so the wavelength conversion coating 7051 will directly contact the support column. This may cause the φ pillar to damage (such as scratch) the wavelength conversion coating 7051 during long-term use, or during the handling or installation of the backlight module, causing the backlight module to emit light defects. In order to avoid the phenomenon that the surface of the support column is damaged due to insufficient rigidity of the wavelength conversion structure or the wavelength conversion structure, a fixing device capable of providing a wavelength conversion structure may be further disposed in the backlight module to maintain the wavelength conversion structure. The surface is substantially flat and eliminates the use of support columns. Specifically, before a wavelength conversion structure is disposed in the backlight module, a force is applied to the wavelength conversion structure to make the surface substantially flat. Thereafter, the surface of the wavelength conversion structure is fixed in a state of being flat with a fixing means to maintain its surface substantially flat. A variety of suitable fixtures can be used. For example, the fixture can include first and second components that correspond to each other, and when the two components are coupled to each other, the shape of the wavelength conversion structure can be fixed such that the wavelength conversion structure has a substantially flat surface. Alternatively, the fixture may include an element that conforms to the frame to secure the shape of the wavelength conversion structure when combined with the frame. For example, referring to FIGS. 9A to 9F, an embodiment of the backlight module is shown, which includes a specific aspect of the above-mentioned fixing device, wherein the 9A is an exploded view of the backlight module, and the 9B is The 9F diagram is a partial cross-sectional view of the wavelength conversion structure along line BB' in Figure 9A, representing different aspects of the wavelength conversion structure. As shown in FIG. 9A, the backlight module 90 includes a frame 91 having an opening 911, a wavelength conversion structure 93 is disposed on the opening 911, and a UVc light source 95 is disposed in the frame 91. The wavelength conversion structure 93 includes a wavelength conversion coating 931 and a substrate 933, and the wavelength conversion coating 931 is located on the surface side of the substrate 933. The wavelength conversion structure 93 is fixed in shape by a fixing means comprising a first frame 971 and a second frame 973, and the frame 971 has substantially the same size as the frame 973. As shown in FIG. 9B, the frame 971 and the frame 973 are respectively fixed to the upper and lower sides of the wavelength conversion structure 93 via a suitable manner such as an adhesive to fix the shape of the wavelength conversion structure 93 to have a substantially flat surface. . The two frames included in the fixture are not necessarily of the same size and may be of different sizes, as shown in Figure 9C. In FIG. 9C, the fixing device includes a first frame 975 and a second frame 977, and the second frame 977 is smaller in size than the first frame 975 (or, conversely, 25, M329794, the first frame 977 is smaller in size than the second frame. 975) and can be embedded with the first frame 975. Thus, when the frame 975 is embedded with the frame 977, the wavelength converting structure 93 can be secured therein to maintain its surface substantially flat. Alternatively, as shown in FIG. 9D, the wavelength conversion structure 93 may be fixed to the frame 979 via an adhesive or other suitable means using only a frame 979 to maintain the surface of the wavelength conversion structure 93 substantially flat. On the frame 91. Alternatively, as shown in FIGS. 9E and 9F, a frame 981 having a smaller outer diameter than the opening 911 or a frame 983 having a larger inner diameter than the frame 91 on the side of the opening 911 may be used, and the frame 981 or 983 may be used with the frame. The 91 phase is embedded in such a manner that the shape of the wavelength conversion structure 93 is fixed to have a substantially flat surface. The frame of each of the above embodiments may be an integrally formed frame or a frame in which a plurality of strips are combined. Further, the shape of the frame is not limited to a rectangle, and may be other shapes (e.g., oval) required for the application. It is also possible to have a special configuration on the fixture to fix the wavelength conversion structure by a combination of configurations. Referring to FIGS. 10A to 10E, FIG. 10A is a schematic view showing another embodiment of φ of the backlight module, wherein FIG. 10A is an exploded view of the backlight module, and FIGS. 10B to 10E are the edges of FIG. 10A. A partial cross-sectional view of the wavelength conversion structure of the CC' line, representing different aspects of the wavelength conversion structure. In FIG. 10A, the frame 101 of the backlight module 100 has an opening 1011. A wavelength conversion structure 103 is disposed on the opening 1011, and a UVc light source 105 is disposed in the frame 101. The wavelength conversion structure 103 includes a wavelength conversion coating 1031 and a substrate 1033. The wavelength conversion coating 1031 is located on the surface of the substrate 1033. As shown in Fig. 10B, the fixture includes a first member 1071 having a concave structure and a second member 1073 having a convex structure. The position of the concave structure of a member 1071 of the 26th M329794 corresponds at least to the position of the convex structure of the second member 1073. Of course, the fixture may also include a first member 1075 having a convex configuration and a second member 1077 having a concave configuration as shown in Fig. 10C. Wherein the position of the concave structure corresponds to at least the position of the convex structure. Preferably, the concave structure and the convex structure are respectively a strip-shaped concave structure and a strip-shaped convex structure. Therefore, when the concave structure is embedded in the convex structure, the wavelength conversion structure 103 can be fixed therein while maintaining the surface thereof substantially flat. The benefit of the desired fixed wavelength conversion structure can also be provided by the combination of the frame and the fixture. Figure 10D shows a schematic diagram of one embodiment of this combination. Wherein, the frame body 101a further has a convex structure at the top end, and the fixing means comprises a first member 1079 having a concave structure, the concave structure being located at least corresponding to the position of the convex structure. When the two are embedded with each other, the wavelength conversion structure 103 can be fixed to maintain its substantially flat surface. Alternatively, it may have a concave structure at the top end of the frame and an element having a convex structure corresponding to the concave structure in the fixing means, see Fig. 10E. As shown in Fig. 10E, the frame body 101b further has a concave structure at the tip end, and the fixing means includes a first member 1081 having a convex structure, and the position of the concave structure corresponds to at least the position of the convex structure. In the above embodiments, the first components 1071, 1075, 1079, and 1081 and the second components 1073 and 1077 are disposed on a side of the wavelength conversion structure 103, but are not limited thereto. 1075, 1079, 1081 and second components 1073, 1077 may also be disposed on all sides of wavelength conversion structure 103 or other suitable locations. Each of the concave structure and the convex structure is also not limited by the shape of the drawing. In addition, the fixture 27 M329794 may optionally include two or more first or second components. For example, for a frame having a rectangular opening, the first element and the second element may be strips that are surrounded by a rectangle, or may be a combination of L-shaped or I-shaped strips. rectangle. In this case, when the combination of the frame and the fixing device is used to fix the wavelength conversion structure by the concave/convex structure, the fixing device may have a concave/convex structure corresponding to the top end of the frame. The I-shaped strips are fixed to the opposite sides of the wavelength conversion structure by being embedded on opposite sides of the top end of the frame to maintain the surface thereof substantially flat. The fixing device may also include two L-shaped strips having a concave/convex structure corresponding to the top end of the frame body, and the opposite side angles of the wavelength conversion structure are fixed by being embedded with the opposite corners of the top end of the frame body to maintain the surface thereof. It is substantially flat. The fixture can also be in other aspects. Referring to FIGS. 11A to 11D, FIG. 11A shows a backlight module 110, wherein FIG. 11A is an exploded view of the backlight module, and FIGS. 11B to 11D are partial wavelength conversion structures along the DD′ line in FIG. 11A. A schematic cross-section representing different aspects of the wavelength conversion structure. As shown in FIG. 11A, the backlight module 110 includes a frame 111. The frame 111 has an opening 1111. The opening 1111 is provided with a wavelength conversion structure 113. The frame 111 has a UVc light source 115. The wavelength conversion structure 113 includes a wavelength conversion coating 1131 and a substrate 1133, and the wavelength conversion coating 1131 is located on the surface side of the substrate 1133. As shown in Fig. 11B, the fixing device includes a first member 1171 having a connecting member and a second member 1173 having a connecting hole, the connecting member being engaged with the connecting hole. Thereby, the first element 1171 and the second element 1173 are bonded to the connection hole via the connector to fix the wavelength conversion structure 113 to have a substantially flat surface. The embodiment of the other backlight module is as shown in FIG. 11C, wherein the backlight module 28 M329794 is the same as that shown in the nA picture, but the frame uia included is further and the hole is included, and the solid technology is included. - a first element 1175 having a connector, the connection hole of the frame (1)a mating with the connector of the first element 1175. Thereby, the first element 1175 of the frame Ula (four) is fixed by the connector disk connecting hole, and the shape of the switching structure (1) is turned off to have a substantially flat surface. Similarly, as shown in FIG. 11D, the frame (10) of the backlight module further has a connecting member (the side convex portion is not shown in the figure), and the fixing device includes a connecting hole _
件1177,該連接件與該連接孔相配合。以藉由連接孔與連接件而 結合框體⑽與固絲置之第—元件1177,以固定波長轉換結構 113之$ &使其具實質上平坦之表面。於上述實施態樣中,第一 元件1177或第二元件1173係為一長條狀,惟不受此限,其亦可 為其他適當之形狀。另外,具體言之,連接件可為一螺絲,連接 孔可為-螺帽’·或者連接件可為—卡榫,連接孔可為_卡槽;或 為其他本領域具通常知識者所習知之組合構形。In the piece 1177, the connecting member cooperates with the connecting hole. The first element 1177 is bonded to the frame (10) and the fixing wire by the connecting hole and the connecting member to fix the wavelength conversion structure 113 to have a substantially flat surface. In the above embodiment, the first element 1177 or the second element 1173 is in the form of a strip, but is not limited thereto, and may be other suitable shapes. In addition, in particular, the connecting member may be a screw, the connecting hole may be a nut, or the connecting member may be a latch, and the connecting hole may be a card slot; or other conventional knowledge in the field Know the combination configuration.
又一月光模組之實施態樣如第12A至12c圖所示,其中第12A 圖係為背光模組之分解圖,第12B及12c圖係為第12A圖中沿ee, 線之波長轉換結構局部剖面示意圖,代表波長轉換結構之不同態 樣。如第12A圖所示,背光模組12〇包含一框體ι21,其具一開 口 1211,於開口 1211上設有一波長轉換結構123,框體12ι内設 有UVc光源125。波長轉換結構123包含一波長轉換塗層1231及 一基材1233 ’波長轉換塗層1231位於基材1233之面光源側。如 第12B圖所示,背光模組12〇另包含一固定裝置,其包含一框架 1271及一彈性件1273 (例如一夾子)。透過固定裝置,以彈性件 29 中文說明書替換頁(96年11月) I β ' 1273將波長轉換結構123固定於框架1271上而固定其形狀,使其 ^ 具實質上平坦之表面。另一固定裝置態樣可參考第12C圖。其中, • 框體121a於頂緣具一凸出構形,固定裝置則包含具一彈性件之第 一元件1275 (例如一夾子)。透過固定裝置之第一元件1275將波 長轉換結構123固定於框體121a上而固定其形狀,使其旦實質上 平坦之表面。於上述實施態樣中,該彈性件可不受圖式中之形式 所限,亦可為螺旋形式或其他可供應用之形式。 φ 以下將以具體實施態樣以進一步例示說明此處揭露之波長轉換 結構及其應用。 實施例 於以下實施例中,所採用之成分、材料及儀器係如下所列: ~ (1)黏著劑成份: 黏著劑溶液a ··築光公司所提供含20重量%氟素巨分子之 溶液(Chipaste),由黏著劑溶液A所得厚度約1〇〇微米之濕 膜於50°C下30秒可完全乾燥。 _ 黏著劑溶液 B :將 PVDF ( polyvinylidene difluoride,聚偏 氟乙烯)(Dyneon公司)溶於丙酮中,所調配而得含7重量 %PVDF之丙酮溶液,由黏著劑溶液B所得厚度約100微米之 濕膜於50°C下20秒可完全乾燥。 黏著劑溶液 C :將 PVDF-HFP ( polyvinylidene difluoride-co-hexafluoroproplene,聚偏氟乙稀-六氟丙稀) (Atofina公司,型號Kynar2801 )溶於丙酮中,所調配而得 含7之丙酮溶液,由黏著劑溶液C所得厚度 30 M329794 年月曰 I -骑 約100微米之濕膜於501下20秒可完全乾燥。〜一"· (2) 螢光體粉末:日本Kasei公司,型號Lp_wi,色號ex_d。 (3) 亮度測試方法j : 測里模組· UVc光源( 253.7 nm)之模組,該模組尺寸為 60公分長36公分寬,其中放置16根UVc燈管(長度尺寸為 590公分,管徑為3·5公分,管壁厚為〇·7公分,燈管強度為 3100 μλν/cm2),燈管間之間距為2公分,燈源下方為一鋁反 丨射片,該模組上方留有一樣品放置區。 測試方法:將待測樣品以含螢光塗層面對UVc燈源之方式 放置於k源上方,樣品上方〇·5公分處放置一光學量測探測器 (于在企業,型號rK828 )以量取色度座標及亮度值。 (4) 亮度測試方法II : 測量模組·· UVc光源( 253.7 nm)之模組,該模組尺寸為 72公分長42公分寬,其中放置16根UVc燈管(長度尺寸為 710公分,管徑為3·5公分,管壁厚為〇·7公分,燈管強度為 3450 pW/cm2),燈管間之間距為3·5公分,燈源下方為一塗 佈相同波長轉換塗層之反射片,該模組上方留有一樣品放置 區。 測4方法·將待測樣品以含螢光塗層面對UVc燈源之方式 放置於燈源上方,樣品上方50公分處放置一亮度色度計(中 惠科技,型號T〇pconBM7)以量取色度座標及亮度值。 實施例1 31 1VI329794 isbtix gg 年The embodiment of the moonlight module is shown in Figures 12A to 12c, wherein the 12A picture is an exploded view of the backlight module, and the 12B and 12c pictures are the wavelength conversion structure along the ee line in the 12A picture. A schematic view of a partial section representing different aspects of the wavelength conversion structure. As shown in FIG. 12A, the backlight module 12A includes a frame ι21 having an opening 1211. The opening 1211 is provided with a wavelength conversion structure 123. The frame 12i is provided with a UVc light source 125. The wavelength conversion structure 123 includes a wavelength conversion coating 1231 and a substrate 1233' wavelength conversion coating 1231 located on the surface light source side of the substrate 1233. As shown in FIG. 12B, the backlight module 12 further includes a fixing device including a frame 1271 and an elastic member 1273 (for example, a clip). Through the fixing device, the replacement page of the elastic member 29 (November, 1996) I β ' 1273 fixes the wavelength conversion structure 123 to the frame 1271 to fix its shape so as to have a substantially flat surface. For another fixture aspect, refer to Figure 12C. Wherein, the frame 121a has a convex configuration on the top edge, and the fixing device includes a first member 1275 (e.g., a clip) having an elastic member. The wavelength conversion structure 123 is fixed to the frame 121a through the first member 1275 of the fixture to fix its shape to a substantially flat surface. In the above embodiments, the elastic member is not limited to the form of the drawings, and may be in the form of a spiral or other form suitable for application. φ Hereinafter, the wavelength conversion structure disclosed herein and its application will be further exemplified in a specific embodiment. EXAMPLES In the following examples, the components, materials and instruments used are as follows: ~ (1) Adhesive component: Adhesive solution a ··The solution containing 20% by weight of fluorinated macromolecule provided by Build-up (Chipaste), a wet film having a thickness of about 1 μm obtained from the adhesive solution A was completely dried at 50 ° C for 30 seconds. _ Adhesive solution B: PVDF (polyvinylidene difluoride) (Dyneon) was dissolved in acetone to prepare an acetone solution containing 7 wt% PVDF, and the thickness of the adhesive solution B was about 100 μm. The wet film was completely dry at 20 ° C for 20 seconds. Adhesive solution C: PVDF-HFP (polyvinylidene difluoride-co-hexafluoroproplene) (Atofina, model Kynar2801) was dissolved in acetone to prepare a solution containing 7 acetone. The thickness obtained from the adhesive solution C was 30 M329794. The wet film of about 100 microns was fully dried at 501 for 20 seconds. ~一"· (2) Phosphor powder: Japan Kasei company, model Lp_wi, color number ex_d. (3) Brightness test method j: Module of the measuring module · UVc light source (253.7 nm), the module is 60 cm long and 36 cm wide, and 16 UVc tubes are placed therein (the length is 590 cm, the tube The diameter is 3·5 cm, the wall thickness is 〇·7 cm, the lamp strength is 3100 μλν/cm2), the distance between the lamps is 2 cm, and the bottom of the lamp is an aluminum anti-skull film, above the module. Leave a sample placement area. Test method: Place the sample to be tested on top of the k source with a fluorescent coating facing the UVc light source, and place an optical measurement detector (in the enterprise, model rK828) at a distance of 5 cm above the sample. Take the chroma coordinates and brightness values. (4) Brightness test method II: Measurement module · · UVc light source (253.7 nm) module, the module is 72 cm long and 42 cm wide, and 16 UVc tubes are placed (length length is 710 cm, tube) The diameter is 3·5 cm, the wall thickness is 〇·7 cm, the lamp strength is 3450 pW/cm2), the distance between the lamps is 3.5 cm, and the light source is coated with the same wavelength conversion coating. The reflective sheet has a sample placement area above the module. Method 4: Place the sample to be tested on top of the lamp source with a fluorescent coating facing the UVc light source. Place a brightness colorimeter (Zhonghui Technology, model T〇pconBM7) 50 cm above the sample. Take the chroma coordinates and brightness values. Example 1 31 1VI329794 isbtix gg year
Hu \: -;*::,: 將900克黏著劑溶液A置入2000毫弁植4山 一·_1」: 毛吖麂杯中,以磁石攪拌1〇 分鐘。再加人_克螢光體粉末,於室溫下以機簡拌葉混合2〇 分鐘,以獲得混合均句之聚料。賴混合均句後,加人氣壓式脈 衝循環器中進行授拌30分鐘。其後,利用擠壓塗佈法塗佈於ρΕτ 基材(厚度125微米)上,其擠壓膜口與ρΕΤ基材之間距為ΐ5 微米,吐出壓力為0·12 MPa,塗佈速度為15公尺/分鐘。濕膜完 成後再以50°C之熱風烘乾,從而提供於PET基材上具12至15 | 微米厚度之波長轉換塗層之樣品。 使用壳度測試方法I ’其中樣品放置區大小為3〇公分長2〇公分 I且樣品與光源間之距離為1 · 5公分;依照CIE1931之色座標量 測方式量測所得樣品之X值、y值及亮度值,結果係如表丨所列: 表1 CIEx CIEy 亮度(cd/M2) 0.271 0.321 5314 波長轉換之結果係如第13A與13B圖所示,其中第13A圖係該 提供UVc光源之模組的原始光源光譜,第13B圖為經過所得樣品 而發出之光譜;其顯示所得波長轉換塗層樣品可有效將UVc轉換 為可見光。 實施例2 重複實施例1之漿料製備、塗佈及乾燥步驟,但將所得漿料擠 壓塗佈於厚度125微米之PET基材上,得到於PET基材上具12 至15微米厚度之波長轉換塗層之樣品。 32 M329794 96. Il2av - 年月ΕΓϋΙ 接著,利用刮刀塗佈25微米厚度之壓克力膠(全科企業,型號 S3277)於所得樣品之未經波長轉換塗層塗佈之面。塗佈完成後將 該樣品與壓克力基材(厚度2公分)及PET保護基材(厚度25 微米),以滾輪貼膜設備(志聖工業,型號CSL-M25R)進行壓 合。其中,將樣品之膠面壓合於該壓克力基材上,PET保護基材 則貼壓於該壓克力(聚(甲基丙烯酸甲酯))基材之另一面。貼合速 度為1.5公尺/分鐘,壓力3 kgf/平方公分,溫度40°C。同樣地, 重複上述步驟,但以聚碳酸酯基材(厚度2公分)取代該壓克力 基板。 使用亮度測試方法I,其中樣品放置區大小為30公分長20公分 寬且樣品與光源間之距離為2公分;依照CIE1931之色座標量測 方式量測所得樣品之X值、y值及亮度值,結果係如表2所列: 表2 基板種類 CIEx CIEy 亮度(cd/M2) 壓克力基板 0.289 0.321 4655 聚碳酸酯基板 0.280 0.321 4945Hu \: -;*::,: Place 900 g of Adhesive Solution A in 2000 mTorr 4 一 1·_1": In a buttercup cup, stir with a magnet for 1 〇 minute. Add _ gram of phosphor powder and mix with the machine for 2 〇 minutes at room temperature to obtain a mixture of mixed particles. After mixing the sentence, add the person in the pneumatic pulse circulator for 30 minutes. Thereafter, it was applied on a ρΕτ substrate (thickness: 125 μm) by extrusion coating, and the distance between the extruded film opening and the ρΕΤ substrate was ΐ5 μm, the discharge pressure was 0·12 MPa, and the coating speed was 15 Metrics per minute. After the wet film was completed, it was dried by hot air at 50 ° C to provide a sample having a wavelength conversion coating of 12 to 15 μm thickness on the PET substrate. Using the shell test method I 'where the sample placement area is 3 〇 cm long and 2 〇 cm I and the distance between the sample and the light source is 1 · 5 cm; the X value of the sample is measured according to the color coordinate measurement method of CIE 1931, y value and brightness value, the results are listed in Table 表: Table 1 CIEx CIEy brightness (cd/M2) 0.271 0.321 5314 The result of wavelength conversion is shown in Figures 13A and 13B, where Figure 13A provides the UVc source The original source spectrum of the module, Figure 13B is the spectrum emitted by the resulting sample; it shows that the resulting wavelength conversion coating sample is effective in converting UVc to visible light. Example 2 The slurry preparation, coating and drying steps of Example 1 were repeated, but the resulting slurry was extrusion coated onto a PET substrate having a thickness of 125 μm to obtain a thickness of 12 to 15 μm on the PET substrate. A sample of a wavelength converted coating. 32 M329794 96. Il2av - Year Month ΕΓϋΙ Next, a 25 micron thick acrylic (former company, model S3277) was applied using a spatula to the surface of the resulting sample that was not coated with a wavelength-converting coating. After the coating was completed, the sample was pressed with an acrylic substrate (thickness 2 cm) and a PET protective substrate (thickness 25 μm) by a roller filming apparatus (Shisheng Industrial, model CSL-M25R). Wherein, the rubber surface of the sample is pressed against the acrylic substrate, and the PET protective substrate is pressed against the other side of the acrylic (poly(methyl methacrylate)) substrate. The bonding speed is 1.5 m/min, the pressure is 3 kgf/cm 2 and the temperature is 40 °C. Similarly, the above procedure was repeated except that the acrylic substrate was replaced with a polycarbonate substrate (thickness: 2 cm). The brightness test method I is used, wherein the sample placement area is 30 cm long and 20 cm wide and the distance between the sample and the light source is 2 cm; the X value, the y value and the brightness value of the sample are measured according to the color coordinate measurement method of CIE 1931. The results are listed in Table 2: Table 2 Substrate type CIEx CIEy Brightness (cd/M2) Acrylic substrate 0.289 0.321 4655 Polycarbonate substrate 0.280 0.321 4945
實施例3 取用計量之螢光體粉末與計量之黏著劑溶液分別調配為具有表 3所列重量比之混合物,分別裝於50毫升封口玻璃瓶中以磁石攪 拌10分鐘,再以超音波震盪10分鐘,獲得6份漿料。 將10公分寬15公分長之PET基材(厚度125微米)吸附於真 空吸氣台上,將各漿料以繞線棒塗佈法塗覆於PET基材上,塗佈 33 )aH.29 ι 年月日匕1 — : 速度為10公尺/分鐘,重複進行各漿料之塗佈。將6個各塗有不同 漿料之PET基材放置於流通空氣中自然乾燥3分鐘,所得塗層厚 度約為15至18微米。 使用亮度測試方法I,其中樣品放置區大小為3〇公分長如公分 寬且樣品與光源間之距離為2公分;依照αΕ1931之色座標量測 表3 方式量測所得樣品之%值、y值及亮度值,結果係如表3所列: 螢光體粉末與黏著劑 之重量比 CIEx CIEy 亮度(cd/M2) 〇·5 : 1 (比較例) 0.270 0.318 ^407 1:1 0.274 0.323 / 2.5:1 0.291 —-~.— 0.346 Jyjj ^ 〇πο 5:1 0.288 _0.347 «3 GUV /1 c _ 10:1 0,292 一 1 ---- _ —M39_ __ 4078 _15:1 ------—--L 0.262 —------- — —_ 3726Example 3 The metered phosphor powder and the metered adhesive solution were separately prepared into a mixture having the weight ratios listed in Table 3, and respectively placed in a 50 ml sealed glass bottle and stirred by a magnet for 10 minutes, and then oscillated by ultrasonic waves. After 10 minutes, 6 parts of the slurry were obtained. A PET substrate (thickness 125 μm) of 10 cm wide and 15 cm long was adsorbed on a vacuum suction table, and each slurry was coated on a PET substrate by a wire bar coating method, and coated 33) aH.29 ι 年月日匕1 — : The speed is 10 meters per minute, and the coating of each slurry is repeated. Six PET substrates each coated with a different slurry were naturally dried in flowing air for 3 minutes to give a coating thickness of about 15 to 18 μm. The brightness test method I is used, wherein the sample placement area is 3 〇 cm long and the distance between the sample and the light source is 2 cm; the % value and the y value of the sample are measured according to the color coordinate measurement table 3 of αΕ1931. And brightness values, the results are listed in Table 3: Weight ratio of phosphor powder to adhesive CIEx CIEy Brightness (cd/M2) 〇·5 : 1 (Comparative example) 0.270 0.318 ^ 407 1:1 0.274 0.323 / 2.5 :1 0.291 —-~.— 0.346 Jyjj ^ 〇πο 5:1 0.288 _0.347 «3 GUV /1 c _ 10:1 0,292 a 1 ---- _ —M39_ __ 4078 _15:1 ----- -—--L 0.262 —------- — —_ 3726
M329794 實施例4 I·含碳氟鍵之黏著劑 重複實施例3之製料製備、塗佈及乾燥步驟,惟使用黏著劑 液A、黏著劑溶液B及黏著劑溶液c,且各螢光體粉末與黏著 溶液所含黏著劑之重量比為5 : i。再將所調配而得之聚料各自 佈於厚度125 «之PET基材上,得到具塗層厚度為 =,品。其中,使用黏著劑溶液A、B及c所得之樣品分別 為樣u口 A、B及C 〇 34M329794 Example 4 I. Adhesive containing fluorocarbon bond The procedure of preparation, coating and drying of the material of Example 3 was repeated except that Adhesive Solution A, Adhesive Solution B and Adhesive Solution c were used, and each phosphor was used. The weight ratio of the powder to the adhesive contained in the adhesive solution is 5: i. The aggregated materials are then placed on a PET substrate having a thickness of 125 « to obtain a coating thickness of =. Among them, the samples obtained by using the adhesive solutions A, B and c are respectively samples of mouths A, B and C 〇 34
M329794 使用亮度測試方法I,其中樣品放置區大小為10公分長10公分 寬且樣品與光源間之距離為2公分;依照CIE1931之色座標量測 方式量測所得樣品之X值、y值及亮度值,結果如表4-1所列: 表4-1 樣品 CIEx CIEy 亮度 (cd/M2) A 0.282 0.314 3748 B 0.294 0.323 3502 C 0.296 0.327 3684M329794 uses the brightness test method I, in which the sample placement area is 10 cm long and 10 cm wide and the distance between the sample and the light source is 2 cm; the X value, y value and brightness of the sample are measured according to the color coordinate measurement method of CIE 1931. Values, the results are listed in Table 4-1: Table 4-1 Sample CIEx CIEy Brightness (cd/M2) A 0.282 0.314 3748 B 0.294 0.323 3502 C 0.296 0.327 3684
此外,以如下方式,對樣品A及樣品C進行一加速實驗。分別 將樣品A及樣品C放置於一單根UV燈管製具上,其中,樣品與 光源之距離為0.5公分,UV強度為10000 pW/cm2,且樣品照射面 積為2公分x2公分。分別於一開始及持續照射1000小時後量測強 度及色度,結果如下表所示: 樣品A 樣品C 時間 亮度(cd/m2) CIEx CIEy 亮度(cd/m2) CIEx CIEy Ohr 1180 0.290 0.340 940 0.286 0.323 lOOOhr 890 0.296 0.333 800 0.294 0.333 II·碳氩系黏著劑(比較例) 取用螢光體粉末與黏著劑溶液A以螢光體粉末與黏著劑之重量 比為5: 1之比例裝於50毫升封口玻璃瓶中,以磁石攪拌10分鐘, 攪拌後以超音波震盪10分鐘,得到一氟系漿料。另製備一聚乙烯 35 |抓1129 Εη 年月丨 以去離子$ M329794 醇(polyvinyl alcohol,PVA)黏著劑溶液 • 具20重量%之PVA)並與等重之螢光體粉末以研绰混合均勻,得 到一碳鼠糸漿料(其中碳氫鍵之鍵能為98 kcal/mol)。 接著,將10公分寬15公分長之PET基材(厚度125微米)吸 附於真空吸氣台上,將兩漿料分別以刮刀塗佈法塗佈於各PET基 材上,刮刀間隙為50微米,塗佈速度為10公尺/分鐘。之後,將 減祕料塗佈之PET基材放置於流通空氣中自_燥3分鐘, Φ 經碳氫系漿料塗佈之PET基材以熱風烘箱80°C加熱30分鐘。所 得塗層厚度約為17至20微米。 使用亮度測試方法!,其中樣品放置區大小為3〇公分長2〇公分 寬且樣品與光源間之距離為1.5公分;依照CIE1931之色座標量 '測方式量測所得樣品與光源照射⑽小時後之χ值、y值及亮度 值’結果係如表4-2所列:Further, an accelerated experiment was performed on Sample A and Sample C in the following manner. Sample A and sample C were placed on a single UV lamp control device, wherein the distance between the sample and the light source was 0.5 cm, the UV intensity was 10000 pW/cm2, and the sample irradiation area was 2 cm x 2 cm. The intensity and chromaticity were measured at the beginning and after 1000 hours of continuous exposure. The results are shown in the following table: Sample A Sample C Time Brightness (cd/m2) CIEx CIEy Brightness (cd/m2) CIEx CIEy Ohr 1180 0.290 0.340 940 0.286 0.323 lOOOOhr 890 0.296 0.333 800 0.294 0.333 II·Carbon argon-based adhesive (Comparative Example) The phosphor powder and the adhesive solution A were used in a ratio of 5:1 by weight of the phosphor powder to the adhesive. In a milliliter sealed glass bottle, the magnet was stirred for 10 minutes, stirred, and ultrasonically shaken for 10 minutes to obtain a fluorine-based slurry. Another preparation of a polyethylene 35 | scratch 1129 Ε 年 年 丨 去 M $ M329794 alcohol (PVA) adhesive solution • 20% by weight of PVA) and equal weight of the phosphor powder mixed with a mortar A carbon squirrel slurry was obtained (wherein the bond of the carbon-hydrogen bond was 98 kcal/mol). Next, a PET substrate (thickness: 125 μm) 10 cm wide and 15 cm long was adsorbed onto a vacuum suction table, and the two pastes were respectively applied to each PET substrate by a doctor blade method with a blade gap of 50 μm. The coating speed was 10 meters per minute. Thereafter, the PET substrate coated with the reduced secret material was placed in a circulating air for 3 minutes, and the PET substrate coated with the hydrocarbon slurry was heated in a hot air oven at 80 ° C for 30 minutes. The resulting coating thickness is about 17 to 20 microns. Use the brightness test method! , wherein the sample placement area is 3〇 cm long and 2〇 cm wide and the distance between the sample and the light source is 1.5 cm; according to the CIE1931 color coordinate scalar 'measurement method, the measured sample and the light source are irradiated (10) hours after the χ value, y Values and brightness values' results are listed in Table 4-2:
表4-2Table 4-2
PVA 黏著劑溶液 _〇------〇j83 〇,331 5043PVA adhesive solution _〇------〇j83 〇,331 5043
表4-2結果顯示,相較於碳氫系漿料之亮度衰減幾達的表 現,本揭露使用黏著劑中含有碳氟鍵所製得之波長轉換塗層,即 使在光源照射180小時後,仍可提供與初始相當之亮度。 III·其他黏著劑溶液 36 M329794 年月Elftl 士 補刻 取10之四乙氣基石夕燒(Tetraeth〇xysilane,TEOS ),加入1〇 克之甲基一乙氧基石夕垸(Methyitrieth〇xysilane,MTEOS)、3克之 /酉精、2克之去離子水、及1毫升1%鹽酸(HCi)水溶液。於室 温下攪拌30分鐘至均相。再於此無機水溶液中加人8克螢光粉, • U磁石攪拌60分鐘’授拌後以超音波震m 1Q分鐘,再以磁石授 摔3 0分知,獲得一漿料。 依照上述11部分所述方式,將上述漿料塗佈於厚度100微米之 Φ PET基材上。經塗佈之PET基材係置於loot烘箱中乾燥60分鐘, 冷卻後取出。 接著使用亮度測試方法丨,其中樣品放置區大小為5公分直徑 (19.6平方公分)且樣品與光源間之距離為2公分;依照cmi931 之色座標量測方式量測所得樣品之X值、y值及亮度值,結果如表 4-3所列: 表4-3 黏著劑種類 CIEx CIEy 亮度(cd/M2) 無機黏著劑 0,2728 0.3352 2673The results in Table 4-2 show that compared to the performance of the hydrocarbon-based slurry with a slight attenuation of the brightness, the present disclosure uses a wavelength-converting coating prepared by using a fluorocarbon bond in the adhesive, even after the light source is irradiated for 180 hours. Brightness comparable to the initial one is still available. III. Other Adhesive Solution 36 M329794 In the month of Elftl, engrave 10 Tetraeth〇xysilane (TEOS), add 1 gram of methyl-ethoxy zephyr (Methyitrieth〇xysilane, MTEOS) 3 g / 酉 fine, 2 g of deionized water, and 1 ml of 1% hydrochloric acid (HCi) aqueous solution. Stir at room temperature for 30 minutes to a homogeneous phase. Further, 8 g of phosphor powder was added to the inorganic aqueous solution, and the U magnet was stirred for 60 minutes. After the mixing, the ultrasonic wave was shaken for 1 minute, and then the magnet was dropped by 30 minutes to obtain a slurry. The slurry was applied to a Φ PET substrate having a thickness of 100 μm in the manner described in Section 11 above. The coated PET substrate was dried in a loot oven for 60 minutes and taken out after cooling. Then use the brightness test method, where the sample placement area is 5 cm in diameter (19.6 cm 2 ) and the distance between the sample and the light source is 2 cm; the X and y values of the sample are measured according to the color coordinate measurement method of cmi931. And brightness values, the results are listed in Table 4-3: Table 4-3 Adhesive Type CIEx CIEy Brightness (cd/M2) Inorganic Adhesive 0,2728 0.3352 2673
實施例5 採用焭度測試方法II,於相同管電壓、電流及測量方式之條件 下,對傳統CCFL模組與實施例2所製得之壓克力基板樣品之性 能進行比較,比較結果如表5-1與表5-2所列: 表5-1 37 M329794 項目/ 規格值 CCFL CCFL + 下擴散板 CCFL+下擴散 板+BEFIII CCFL+下擴散板 +BEFIII+DBEFD 中心輝度 4578 5928 8363 5729 平均輝度 (81 點) 4578.7 5811.7 8102.3 5540.7 X色度 0.2467 0.2489 0.2591 Υ色度 0.2212 0.2244 0 0.2453 均齊度 (9點) 94% 95% 93% 94% 表5-2 ——一— 項目 /規格值 轉換塗 層 轉換塗層+ 下擴散板 轉換塗層+ 下擴散板+ __BEFIII 轉換塗層+ 下擴散板+ BEFIII+DBEFD 中心輝度 6376 8338 _U720 8066 平均輝度 (81 點) 6304.7 8218.6 11464.4 7863.2 X色度 0.2742 0.2762 ^^0^2813 0.2909 Υ色度 0.3265 0.3279 __〇3362 0.3481 均齊度 (9點) 92% 92% 91% ..93% 上述結果顯示’本波長轉換塗層之性能較傳統CCFL者為優。 接著,採用亮度測試方法„,將所得壓克力基板樣品(即表5_2 所列之「轉換塗層+下擴散板」者)於該uvc模組中進行長時間 照射,其色座標及亮度變化如夹6月结^ c如表6及弟14圖所示;其中,於各個 點燈(照射)時間下,分別取雨細知m 」取兩組相同之該壓克力基板樣品進行 兩次党度測試’試驗結果分為矣&由^ 馬表6中所列樣品Α與樣品Β之結果。 此結果顯示經長時間照射後,太备丨从、丄 交本幻作波長轉換塗層仍可提供相當 38 M329794 ~— 样li29旅不 年月❾止Example 5 Using the twist test method II, the performance of the conventional CCFL module and the acrylic substrate sample prepared in Example 2 were compared under the same tube voltage, current and measurement mode, and the comparison results are shown in the table. Table 5-1 and Table 5-2: Table 5-1 37 M329794 Item / Specification CCFL CCFL + Lower diffuser CCFL + Lower diffuser + BEFIII CCFL + Lower diffuser + BEFIII + DBEFD Center luminance 4578 5928 8363 5729 Average brightness ( 81 points) 4578.7 5811.7 8102.3 5540.7 X chromaticity 0.2467 0.2489 0.2591 Υ 0.2 0.2212 0.2244 0 0.2453 Uniformity (9 points) 94% 95% 93% 94% Table 5-2 ——1—Item/Specification value conversion coating Conversion Coating + Lower Diffuser Conversion Coating + Lower Diffuser + __BEFIII Conversion Coating + Lower Diffuser + BEFIII + DBEFD Center Brightness 6376 8338 _U720 8066 Average Brightness (81 points) 6304.7 8218.6 11464.4 7863.2 X Chromaticity 0.2742 0.2762 ^^ 0^2813 0.2909 Υ色度0.3265 0.3279 __〇3362 0.3481 Uniformity (9 points) 92% 92% 91% ..93% The above results show that the performance of this wavelength conversion coating is superior to that of traditional CCFL. Then, using the brightness test method „, the obtained acrylic substrate sample (that is, the “conversion coating + lower diffusion plate” listed in Table 5_2) is irradiated for a long time in the uvc module, and the color coordinates and brightness changes thereof. If the clip is in June, it is shown in Table 6 and Figure 14; in the case of each lighting (irradiation) time, take the rain to know m" and take two identical samples of the acrylic substrate twice. The test results of the party test are divided into the results of the sample and the sample of the sample listed in Table 6. This result shows that after a long period of exposure, the 丨 丨 丨 波长 波长 波长 波长 波长 波长 波长 波长 仍 仍 仍 38 38 38 38 38 38 38 38 38 38 38 38 38 38 38 38 38 38 38 38 38 38
二?上乂ISecond?
亮度。 L 表6 點燈時間 (小時) 樣品編號 中心輝度 (nits) 平均輝度 (nits) CIEx CIEy 0 A 8703 8599.7 0.2905 0.3409 B 8860 8622.1 0.2844 0.3374 450 A 8755 8599.4 0.2931 0.3416 B 8562 8384.9 0.2816 0,3286 1880 A 8658 8475.4 0.2929 0.3399 B 8377 8188.8 0.2808 0.3267 3407 A 8413 8201.8 0.2930 0.3411 B 8226 8013.3 0.2812 0.3282brightness. L Table 6 Lighting time (hours) Sample number Center luminance (nits) Average luminance (nits) CIEx CIEy 0 A 8703 8599.7 0.2905 0.3409 B 8860 8622.1 0.2844 0.3374 450 A 8755 8599.4 0.2931 0.3416 B 8562 8384.9 0.2816 0,3286 1880 A 8658 8475.4 0.2929 0.3399 B 8377 8188.8 0.2808 0.3267 3407 A 8413 8201.8 0.2930 0.3411 B 8226 8013.3 0.2812 0.3282
實施例6 (紫外光波長阻絕塗層之效益) 將20克黏著劑溶液A與20克螢光體粉末裝於50毫升封口玻璃 瓶中以磁石攪拌10分鐘,攪拌後以超音波震盪10分鐘。將該漿 • 料以刮刀塗佈法塗佈於10公分寬10公分長之石英表面,刮刀間 隙為50微米,塗佈速度為10公尺/分鐘。經塗佈之石英係置於流 通空氣中自然乾燥3分鐘,該條件製作得之塗層厚度約為17至20 微米。此為未具有紫外光波長阻絕塗層之波長轉換塗層樣品。 另一波長轉換塗層樣品以相同方式處理,惟石英表面預先以刮 繞線棒塗佈法(RDS編號06)塗佈一層具阻擂紫外光功能之奈米 氧化辞材料(澳大利亞Advanced Nanotechnology製造,型號 NanoZ),塗佈速度為10公尺/分鐘,塗佈後置於100°C熱風烘箱 39 il29 月Example 6 (Effect of ultraviolet wavelength blocking coating) 20 g of the adhesive solution A and 20 g of the phosphor powder were placed in a 50 ml sealed glass bottle and stirred with a magnet for 10 minutes, and stirred for 10 minutes with ultrasonic waves. The slurry was applied by a doctor blade method to a quartz surface of 10 cm in width and 10 cm in length with a doctor blade gap of 50 μm and a coating speed of 10 m/min. The coated quartz was naturally dried in flowing air for 3 minutes, which resulted in a coating thickness of about 17 to 20 microns. This is a wavelength conversion coating sample that does not have a UV wavelength blocking coating. Another wavelength conversion coating sample was treated in the same manner, except that the quartz surface was previously coated with a layer of nano-oxidation materials with resistance to ultraviolet light (RDS No. 06) (manufactured by Advanced Nanotechnology, Australia). Model NanoZ), coating speed of 10 meters / minute, after coating, placed in a hot air oven at 100 ° C 39 il29 months
M329794 ^0. 年 中乾燥30分鐘 接著使用亮度測試方法I,其中樣品放置區大小為30公分長20 公分寬且樣品與光源間之距離為2公分;依照CIE1931之色座標 量測方式量測所得樣品之X值、y值及亮度值,結果如表6及第 15A圖(無紫外光波長阻絕塗層)與第15B圖(具紫外光波長阻 絕塗層)所示: 表7 CIEx CIEy 亮度(cd/M2) 無紫外光波長 阻絕塗層 0.289 0.344 3339 具紫外光波長 阻絕塗層 0.294 0.353 3535 由第15A圖與第15B圖之比較可知,未設置紫外光波長阻絕塗 層時,發光模組仍漏洩出少量未被使用完全之紫外光UVc波段, _ .以及未被利用之紫外光UVA波段以及UVB波段;而當設置紫外光 波長阻絕塗層時,紫外光UVc波段、UVA波段以及UVB波段均被 阻絕。此外,由表7可知,紫外光波長阻絕塗層之使用,並未實 質上影響發光模組之效能。 實施例7 (紫外光波長阻絕塗層之效益) 如實施例 6,但以 PET (polyethylene terephthalate)為基材,且 量測紫外光穿透度,如第16A、16B圖,前者為未設置紫外光波長 M329794 186.11.29M329794 ^0. Dry for 30 minutes in the year and then use the brightness test method I, where the sample placement area is 30 cm long and 20 cm wide and the distance between the sample and the light source is 2 cm; measured according to the CIE1931 color coordinate measurement method. The X value, y value and brightness value of the sample are shown in Table 6 and Figure 15A (no UV wavelength blocking coating) and Figure 15B (with UV wavelength blocking coating): Table 7 CIEx CIEy Brightness ( Cd/M2) UV-free wavelength barrier coating 0.289 0.344 3339 UV-wavelength barrier coating 0.294 0.353 3535 From the comparison of Figure 15A and Figure 15B, the light-emitting module is still not provided when the UV wavelength blocking coating is not provided. Leaked out a small amount of unused UV light UVC band, _. and unused UV UVA band and UVB band; and when UV wavelength blocking coating is set, UV UVC band, UVA band and UVB band Blocked. In addition, as can be seen from Table 7, the use of the ultraviolet wavelength blocking coating does not substantially affect the performance of the light-emitting module. Example 7 (Benefit of Ultraviolet Light Wavelength Resisting Coating) As in Example 6, but PET (polyethylene terephthalate) as a substrate, and measuring ultraviolet light transmittance, as shown in Figures 16A and 16B, the former is not provided with ultraviolet light. Light wavelength M329794 186.11.29
年月EJ 阻絕塗層之發光模組之紫外光穿透光譜圖,後者為設皮 長阻絕塗層之發光模組之紫外光穿透光譜圖,圖中虛線框起處為 紫外光UVc波段及UVb波段之波長。比較第16Α圖與第ΐ6β圖 可知,於設置紫外光波長阻絕塗層時,幾乎可完全阻絕紫外光之 洩露。 實施例8 (混光之效益)The ultraviolet light transmission spectrum of the light-emitting module of the EJ blocking coating is used, and the latter is the ultraviolet light transmission spectrum of the light-emitting module with the long-lasting coating. The dotted line in the figure is the ultraviolet UVc band and The wavelength of the UVb band. Comparing the 16th and ΐ6β images, it can be seen that when the UV wavelength blocking coating is set, the leakage of ultraviolet light can be almost completely blocked. Example 8 (benefit of light mixing)
提供兩組如第3Α圖所示之結構,其中,第一組之第一波長轉換 塗層係與第二波長轉換塗層相同,第二組之第—波長轉換塗層則 與第二波長轉換塗層不同。所使用之黏著劑溶液為黏著劑溶液A, 且所使用之邊光體粉末為日本Kasei公司之產品。Providing two sets of structures as shown in FIG. 3, wherein the first set of first wavelength conversion coatings is the same as the second wavelength conversion coating, and the second set of first wavelength conversion coatings is coupled to the second wavelength conversion The coating is different. The adhesive solution used was the adhesive solution A, and the edge light powder used was a product of Kasei Corporation of Japan.
第一組之第一波長轉換塗層與第二波長轉換塗層係以下列方式 獲侍。將党UVc激發可釋出紅色可見光之螢光體粉末(下稱「r 螢光體粉末」)、受UVc激發可釋出綠色可見光之螢光體粉末(下 稱「G營光體粉末」)及受UVe激發可釋出藍色可見光之發光體 粉末(下稱「BM體財」),以4.4:1.6:4.G之比例混合提 供一螢光體粉末混合物。將該螢光體粉末混合物倒入裝於%毫升 封口破璃瓶中之10公克黏著劑溶液A中’並以磁石攪拌1〇分鐘, 再以超音波震盪1〇分鐘,提供一聚料。將1〇公分寬15公分長之 PET基材(厚度1()〇微米)吸附於真空吸氣台上,將所得該腹料 以刮刀塗佈法塗佈於該PET基材上。其中,到刀間隙為%微米且 塗佈速度為H)公尺/分鐘。之後,將經塗覆之pET基材放置於流 通空氣中自然乾燥3分鐘,所得塗層厚度約為以至加微米。爪 M329794 δ6· 1L 29 贩 年月曰 第二組結構之第一波長轉換塗層之製備係如第一組結構,但^ 採用之漿料係經由將6·4公克由R螢光體粉末與G螢光體粉末以 4.9· 1.5之比例混合之螢光體粉末混合物到入6·4公克之黏著劑溶 液Α中所得到者。 第二組結構之第二波長轉換塗層之製備亦如第一組結構,但採 用由10 A克B螢光體粉末與1〇公克黏著劑溶液A混合而得之漿 料,且塗佈於厚度225微米之PET基材上。 分別將上述兩組具有第一波長轉換塗層之pET基材設置於兩組 框體之開口上以及將具有第二波長轉換塗層之附基材設置於兩 組框體之内難上。之後,分別測量兩組結構之光學特性質,結 果如表8所示: 表8 CIEx CIEy 亮度(cd/M2) 第一組 0.2471 0.2285 3100 第二組 0.2480 0.2243 ------ 3300 表8結果顯示,第二組所提供之亮度值係較第一纽提升約The first set of first wavelength converting coatings and second wavelength converting coatings are obtained in the following manner. The party UVc is excited to emit a red visible light phosphor powder (hereinafter referred to as "r phosphor powder"), and is excited by UVc to emit green visible light phosphor powder (hereinafter referred to as "G camping powder") And an illuminant powder which emits blue visible light by UVe excitation (hereinafter referred to as "BM body"), and is mixed at a ratio of 4.4:1.6:4.G to provide a phosphor powder mixture. The phosphor powder mixture was poured into 10 g of the adhesive solution A contained in a % ml sealed glass bottle and stirred by a magnet for 1 minute, and then vortexed by ultrasonic for 1 minute to provide a polymer. A PET substrate (thickness 1 () 〇 micron) having a length of 1 cm and a width of 15 cm was adsorbed onto a vacuum suction table, and the obtained web was applied onto the PET substrate by a doctor blade method. Wherein, the gap to the knife is % micrometer and the coating speed is H) meters/minute. Thereafter, the coated pET substrate was allowed to dry in a circulating air for 3 minutes, and the resulting coating thickness was about 50 micrometers. The preparation of the first wavelength conversion coating of the second group of structures of the claws M329794 δ6· 1L 29 is as in the first group structure, but the slurry used is via 6.4 g of R phosphor powder and The G phosphor powder was mixed in a ratio of 4.9·1.5 of the phosphor powder mixture to a 6.4 g gram adhesive solution. The second wavelength conversion coating of the second group of structures is also prepared according to the first group structure, but a slurry obtained by mixing 10 A grams of B phosphor powder with 1 gram of the adhesive solution A is applied to the slurry. On a PET substrate with a thickness of 225 microns. The two sets of pET substrates having the first wavelength conversion coating are disposed on the openings of the two sets of frames, respectively, and the attached substrate having the second wavelength conversion coating is disposed within the two sets of frames. Thereafter, the optical properties of the two sets of structures were measured, and the results are shown in Table 8: Table 8 CIEx CIEy Brightness (cd/M2) Group 1 0.2471 0.2285 3100 Group 2 0.2480 0.2243 ------ 3300 Table 8 Results Display, the brightness value provided by the second group is about the same as the first New Zealand
6%。 I 上述各實施例及態樣僅為例示性說明本創作之原理及其 以及_本創作之技術特徵,而制於限制本創作之保護範二’ 例如圖式巾㈣之各元件之形狀或形式並非㈣本創作: 悉本技術者之人士料在料背摘作之技術原理及精神的^ 下,可㈣完狀改變或均等性之安排均屬於本創作所主張^ 42 M^29794 圍。因此,本創作之權利保護範圍應如後述之申請專利範圍所列。 【圖式簡單說明】 第1A圖顯示本波長轉換結構之一實施態樣之示意圖; 第1B圖顯示本波長轉換結構另一實施態樣之示意圖,其中,所 含之基材為一複合層; 第1C圖顯示本波長轉換結構又一實施態樣之示意圖,其中,所 含之基材係一光學增進結構; > 第2A圖顯示應用波長轉換結構之發光模組; 第2B圖顯示可用於本揭露之發光模組之框體中之光源固定座 之不意圖, 第3A及3B圖顯示應用本揭露之發光模組之混光態樣; 第4A至4C圖顯示一具有紫外光波長阻絕塗層之發光模組實施 態樣; 第5圖顯示於發光模組之框體内側壁設置一保護層之示意圖; > 第6圖顯示一應用波長轉換結構之側光式背光模組實施態樣示 意圖, 第7圖顯示一應用波長轉換結構之直下式背光模組實施態樣之 不意圖, 第8圖顯示一傳統直下式背光模組之示意圖; 第9A至12C圖顯示具有各式固定裝置之背光模組實施態樣示意 圖; 第13A圖顯示實例1 UVc模組之原始光源光譜; 第13B圖顯示第13A圖UVc模組經由本波長轉換結構所發出光 43 Μ 幻9794 源之光譜; 第14圖顯示實施例2所得樣品於UVc照射3400小時後之色座 標及亮度變化; 第15A圖顯示實施例6所得未設置紫外光波長阻絕塗層之光譜 圖; 第15B圖顯示實施例6所得設有紫外光波長阻絕塗層之光譜圖; 第16A圖顯示實施例7所得未設置紫外光波長阻絕塗層之光譜 圖;以及 > 第16B圖顯示實施例7所得設有紫外光波長阻絕塗層之光譜圖。 【主要元件符號說明】 20、30、32、40 :發光模組 60、70、80、90、100、110、120 ·•背光模組 6 卜 8 卜 9 卜 ΗΠ、101a、101b、11 卜 111a、111b、121、121a、 201、3(Π、32卜 4(H、501、701 :框體 I 63、83、95、105、115、125、203、303、403、503、703、3231、 3233 :光源 65、93、102、103、104、106、113、123、205、305、325、405、 705 ··波長轉換結構 85、707 :光學膜片 2075、87 :支撐柱 505 :保護層 671 :擴散膜 44 M529794 673 :棱鏡片 . 675 :導光板 679 :反射片 、 * … 91卜 1011、1111、121 卜 2011、4011 ··開口 307、93卜 1023、103 卜 1043、1063、113卜 123卜 205卜 3051、 3251、4051、7051 :波長轉換塗層 ' 933、102卜 1033、104卜 106卜 1133、1233、2053、3053、3253、 4053、7053 :基材 ® 971、975 :第一框架 973、977 :第二框架 979、981、983、1271 :框架 1045 :透明膜層 1047 ··透明薄片 1049 :高分子感壓膠 1071、1075、1079、1081、1171、1175、1177、1275 :第一元 φ 件 1073、1077、1173 :第二元件 1273 :彈性件 2013、3013、3213、4013 :密閉空間 4055 :紫外光波長阻絕塗層 207 :光源固定座 2071 :背板 2073 :燈管固定架 456%. I The above embodiments and aspects are merely illustrative of the principles of the present invention and the technical features thereof, and are intended to limit the shape or form of the components of the present invention, such as the graphic towel (4). It is not (4) the creation: The person who knows the technology is expected to be in the technical principle and spirit of the material back, but (4) the change of the finished condition or the arrangement of the equality belongs to the author's claim ^ 42 M^29794. Therefore, the scope of protection of this creation should be as listed in the scope of the patent application described later. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is a schematic view showing an embodiment of the present wavelength conversion structure; FIG. 1B is a schematic view showing another embodiment of the present wavelength conversion structure, wherein the substrate is a composite layer; 1C is a schematic view showing still another embodiment of the present wavelength conversion structure, wherein the substrate is an optical enhancement structure; > Figure 2A shows a light-emitting module using a wavelength conversion structure; Figure 2B shows that it can be used for The light source fixing seat in the frame of the light emitting module of the present disclosure is not intended, and the 3A and 3B drawings show the mixed light state of the light emitting module to which the present disclosure is applied; the 4A to 4C charts show a UV light wavelength resisting coating. The embodiment of the light-emitting module of the layer; FIG. 5 is a schematic view showing a protective layer disposed on the sidewall of the frame of the light-emitting module; > FIG. 6 shows an embodiment of the edge-light backlight module applying the wavelength conversion structure Schematic diagram, FIG. 7 shows a schematic view of an embodiment of a direct-lit backlight module using a wavelength conversion structure, and FIG. 8 shows a schematic diagram of a conventional direct-lit backlight module; FIGS. 9A to 12C show various solid forms. Figure 13A shows the original source spectrum of the UVc module of Example 1; Figure 13B shows the spectrum of the light source of the UVc module via the wavelength conversion structure of Figure 13A. Figure 14 shows the color coordinates and brightness change of the sample obtained in Example 2 after 3400 hours of UVc irradiation; Figure 15A shows the spectrum of the ultraviolet light wavelength-stopping coating obtained in Example 6; Figure 15B shows Example 6 The obtained spectrum is provided with an ultraviolet wavelength blocking coating; FIG. 16A shows a spectrum of the ultraviolet light wavelength-stopping coating obtained in Example 7; and > Figure 16B shows that the ultraviolet light wavelength blocking is obtained in Example 7. Spectrogram of the coating. [Main component symbol description] 20, 30, 32, 40: Light-emitting module 60, 70, 80, 90, 100, 110, 120 ·• Backlight module 6 Bu 8 Bu 9 Bu, 101a, 101b, 11 Bu 111a , 111b, 121, 121a, 201, 3 (Π, 32, 4 (H, 501, 701: frame I 63, 83, 95, 105, 115, 125, 203, 303, 403, 503, 703, 3231, 3231 3233: light source 65, 93, 102, 103, 104, 106, 113, 123, 205, 305, 325, 405, 705 · wavelength conversion structure 85, 707: optical film 2075, 87: support column 505: protective layer 671 : Diffusion film 44 M529794 673 : Prism sheet. 675 : Light guide plate 679 : Reflecting sheet, * ... 91 Bu 1011, 1111, 121 Bu 2011, 4011 · Opening 307, 93 Bu 1023, 103 Bu 1043, 1063, 113 123 205 305 3051, 3251, 4051, 7051: wavelength conversion coating '933, 102, 1033, 104, 106, 1133, 1233, 2053, 3053, 3253, 4053, 7053: substrate® 971, 975: first Frames 973, 977: second frame 979, 981, 983, 1271: frame 1045: transparent film layer 1047 · transparent sheet 1049: polymer pressure sensitive adhesive 1071, 1075, 1079, 1081, 1171, 1175 1177, 1275: first element φ piece 1073, 1077, 1173: second element 1273: elastic member 2013, 3013, 3213, 4013: sealed space 4055: ultraviolet wavelength blocking coating 207: light source fixing seat 2071: back plate 2073 : Lamp holder 45
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW96212193U TWM329794U (en) | 2007-01-19 | 2007-07-25 | Backlight module |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW96102110 | 2007-01-19 | ||
TW96212193U TWM329794U (en) | 2007-01-19 | 2007-07-25 | Backlight module |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM329794U true TWM329794U (en) | 2008-04-01 |
Family
ID=44322728
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW96212190U TWM329236U (en) | 2007-01-19 | 2007-07-25 | Light emitting module |
TW96212193U TWM329794U (en) | 2007-01-19 | 2007-07-25 | Backlight module |
TW96127152A TW200832495A (en) | 2007-01-19 | 2007-07-25 | Light module |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW96212190U TWM329236U (en) | 2007-01-19 | 2007-07-25 | Light emitting module |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW96127152A TW200832495A (en) | 2007-01-19 | 2007-07-25 | Light module |
Country Status (1)
Country | Link |
---|---|
TW (3) | TWM329236U (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI464500B (en) * | 2012-06-14 | 2014-12-11 | Au Optronics Corp | Backlight module |
US10571625B2 (en) | 2018-04-19 | 2020-02-25 | Hon Hai Precision Industry Co., Ltd. | Backlight module and display device using same |
TWI772973B (en) * | 2020-10-13 | 2022-08-01 | 大陸商蘇州璨宇光電有限公司 | Backlight module and display apparatus |
TWI782721B (en) * | 2021-09-28 | 2022-11-01 | 佳世達科技股份有限公司 | Display device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9966280B2 (en) * | 2012-10-05 | 2018-05-08 | Tokyo Electron Limited | Process gas generation for cleaning of substrates |
-
2007
- 2007-07-25 TW TW96212190U patent/TWM329236U/en unknown
- 2007-07-25 TW TW96212193U patent/TWM329794U/en not_active IP Right Cessation
- 2007-07-25 TW TW96127152A patent/TW200832495A/en unknown
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI464500B (en) * | 2012-06-14 | 2014-12-11 | Au Optronics Corp | Backlight module |
US10571625B2 (en) | 2018-04-19 | 2020-02-25 | Hon Hai Precision Industry Co., Ltd. | Backlight module and display device using same |
TWI700523B (en) * | 2018-04-19 | 2020-08-01 | 鴻海精密工業股份有限公司 | Backlight structure and display device |
TWI772973B (en) * | 2020-10-13 | 2022-08-01 | 大陸商蘇州璨宇光電有限公司 | Backlight module and display apparatus |
TWI782721B (en) * | 2021-09-28 | 2022-11-01 | 佳世達科技股份有限公司 | Display device |
Also Published As
Publication number | Publication date |
---|---|
TW200832495A (en) | 2008-08-01 |
TWM329236U (en) | 2008-03-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200831658A (en) | Wavelength converting structure and manufacture and use of the same | |
CN201185179Y (en) | Backlight module unit | |
US6762553B1 (en) | Substrate for light emitting device, light emitting device and process for production of light emitting device | |
KR101775260B1 (en) | Fluorescent films having adjustable color location and color gamut | |
TWI680178B (en) | Quantum dot material and manufacturing method thereof | |
TWI701471B (en) | Optical laminated body and image display device | |
KR20210037000A (en) | Quantum dot films, lighting devices, and lighting methods | |
EP1100129A2 (en) | Substrate for light emitting device, light emitting device and process for production of light emitting device | |
TWM329794U (en) | Backlight module | |
JP2019503558A (en) | Backlight unit for display device | |
JP2017504078A (en) | Compensation film and organic dot for compensation film | |
TWI733079B (en) | Color conversion film, method for manufacturing color conversion film, back light unit and display appratus comprising the same | |
TW201239035A (en) | Light-diffusing resin composition and light-diffusing sheet using same | |
JP6806555B2 (en) | Wavelength conversion film and manufacturing method of wavelength conversion film | |
TW201827899A (en) | Image display apparatus | |
KR101895229B1 (en) | Composite of quantum dot, manufacturing method thereof and optical module for display using the same | |
TWM341811U (en) | Light source module with shared wavelength converting structure | |
KR20190089548A (en) | Color conversion film, back light unit and display appratus comprising the same | |
TWI500883B (en) | Reflective film for lighting fixtures | |
KR100989076B1 (en) | Cross-linking Agents Incorporating A Light Diffusion Agent of Spherical Silica Bead And Methods For Making Same | |
TWI532820B (en) | Hybrid nanoparticles and illumination devices using the hybrid nanoparticles | |
CN110875416B (en) | Preparation method of LED and film | |
KR20100112785A (en) | Transmitting-emissive display device | |
TW200426175A (en) | Additive for optical resins, and optical resin composition | |
TW200935142A (en) | Light source module with shared wavelength converting structure and the method of forming the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4K | Annulment or lapse of a utility model due to non-payment of fees |