M320692 - 八、新型說明： 【新型所屬之技術領域】 本新型係一種取像模組，該取像模組内具有側邊導通之 f控對焦元件，藉由電控來改變電控元件之屈折力大小，進而 達成自動難、的雜，而側邊導通的設置，可有效崎健體模 組在光軸方向所需的高度空間，以達產品小型化之需求。、 籲 【先前技術】 目前3 C產品的普及帶動了照相模組的絲日漸增多，舉凡 應用於手機、P C、NB、PDA.·.等產品，而在自 / 型化的f求下，照相模組的結構設計陷人了空間上的挑戰。 .- 自動對焦的設計是以電控方絲_對朗魏，故而導通 的位置的設計即影響模組的高度。習用技術是將電控對焦元件的 魯=軸方向上、下兩側設計為電氣接點的導通位置，再利用金屬彈 或軟式電路基板或導線或其它導通件來傳遞所需的電氣訊 ，是故在漁上的設私彡騎終通件的厚度，以及導通件與 * =控對焦疋件電氣接點所需的空間’以致於增加了模組在光軸方 向的高度。 【新型内容】 本新型目的係提供自動對焦功能且又能有效地降低整體模 M320692 組高度。 本新型由物侧至像侧依序包含有前M320692 - VIII, new description: [New technical field] The new type is an image capturing module. The image capturing module has a side-conducting f-control focusing element, which is used to change the inflection of the electronic control component by electronic control. The size of the force, in order to achieve the automatic and difficult, and the side conduction setting, can effectively meet the height space required for the body module in the optical axis direction, in order to meet the needs of product miniaturization. [C] Previously, the popularity of 3 C products has led to the increasing use of photographic modules, such as mobile phones, PCs, NBs, PDAs, etc., while taking pictures of self-styled The structural design of the module is a challenge in space. .- The design of the autofocus is based on the electronically controlled square wire _ for Langwei, so the design of the position of the conduction affects the height of the module. The conventional technology is to design the upper and lower sides of the electronically controlled focusing element in the direction of the upper and lower sides of the electrical contact as the conduction position of the electrical contact, and then use the metal bullet or the flexible circuit substrate or the wire or other conductive member to transmit the required electrical signal. Therefore, the thickness of the self-piercing terminal on the fishing, and the space required for the conduction member and the *=control contact electrical contact point, so as to increase the height of the module in the optical axis direction. [New content] The new purpose is to provide autofocus function and effectively reduce the overall module M320692 height. The present invention includes the front side from the object side to the image side.
由電控來改變電控對焦元件之屈折力大小， 汉直百電氣接點，其可藉 心，進而達成自動對焦的 為了達到上述目的， 對焦組件、取像 功能’而電控龍元侧邊設置f氣接點，可有效地降低整體模 組在光軸方向所需的高度空間，以達產品小型化之需求。、 本新型次要目的是提供可有效地降低高度，以達產品小型化 之需求的一種侧邊導通之電控對焦元件。 為了達到上述目的，本新型設計侧邊導通之電控對焦元件安 裂在電子取像模_ ’其侧較置有電氣接點，該電氣接點 之平面與光軸平行；藉由電控對焦元件側邊設置電氣接點，可 有效地降低整體模組在光軸方向所需的高度空間，以達產品小型 化之需求。 前述電控對焦元件本體可以厚度小於3腿、直徑小於 8mm ’並邊該取像模組高度小於9mm ;另該前置對焦組件之 電控對焦元件的電氣接點數量為2個或2個以上。 M320692 【實施方式】 本新型之第1實施例，請參第丨_示：—取像模組(ι〇〇) 主要包含有—前置聽組件⑽)、—取像光學組件()、一感光 組件_，該駿難、組件⑽)雜崎綠崎()相互組 設，並置於取像光學組件(300)之物侧端，而該感光組件(4〇〇)組設 於取像光學組件(300)之像側端； 其中： 知置對焦組件(2GG)主要包含有電控對減件⑽）、電控 對焦元件承郎2〇)及導通件⑽、)，射，控對焦元件 (210)係由像側端組設於電控對焦元件承座(22〇)，而該電控對焦元 件(210)係具有屈折力，且在光軸方向設置有透光槽(2ΐι)，以及側 ^又置有2處電氣接點(212、213)，該2處電氣接點(212、213) 之面與光卿行，該電控對焦元件本體餘(D)為7·6·、厚度⑴ 為1.95mm，·該導通件(230、24〇)係由金屬材質所製成，並組設於 電控對焦元件(210)之電氣接點(212、213)，使得外部電氣訊號得 以與電控對焦元件(210)之接點(212、213)相導通，並藉由電控來 改、交電控變焦元件(21〇)之屈折力大小，以達到自動對焦功能。 該取像光學組件(3〇〇)主要包含有鏡筒(31〇)、光學鏡片組 (320)與取像光學承座(33〇);其中，該鏡筒(31〇)係由塑膠材質所 製成’並在光軸處設置有透光孔(311)、光學鏡片容置槽(312)及螺 牙結構(313);該光學鏡片組(320)由物侧至像侧，依序包含有第一 鏡片(321)、第二鏡片（322)以及第三鏡片（323)，其中，該第一鏡 7 M320692 片（321)、第二鏡片（322)及第三鏡片（323)係由塑膠材質所製成， 並由像側端組設於鏡筒(31 〇);該取像光學承座(33〇)係由塑膠材質 所製成，並設置有螺牙結構(331)、防撞凸塊(332)及感光組件容置 槽(333);該鏡筒(310)之螺牙結構(313)與取像光學承座(33…之螺 牙結構(331)相螺合，以提供調焦固定用，而該防撞凸塊(332)用以 防止調焦時碰撞感光組件(4〇〇)，以及避免調焦時的掉屑，直接落 入感光組件(400)中而影響成像品質。 該感光組件(400)，主要係由半導體感光晶片（41〇)、半導體 感光晶片防護層(420)以及電路基板(430)所構成，該感光組件(4〇〇) 與取像光學承座(330)相搭接固定，而該取像模組(1〇〇)從上表面至 感光組件(400)之電路基板(430)的下表面高度等於7 6mm。 藉由上述配置，該取像模組(100)可提供自動對焦的功能， 且能有效地降低模組在光軸方向所需的高度，以利小型化的需 求。 本新型之弟2貫施例’請參第2圖例所示：一取像模組(1Q0A) 主要包含有一前置對焦組件(2〇〇A)、一取像光學組件(3〇〇A)、一 感光組件(400A)，該前置對焦組件(200A)係與取像光學組件(3〇〇A) 相互組設，並置於取像光學組件(3〇〇A)之物側端，而該感光組件 (400A)組設於取像光學組件(300A)之像侧端； 其中： 該前置對焦組件(200A)主要包含有電控對焦元件(2丨〇A)、電 M320692 控對焦元件承座(220A)及導通件(23〇A、24〇A)，其中，該電控對 焦兀件(2_係由像侧端組設於電控對焦元件承座(22〇A)，且該 包控對焦元件(21GA)具有屈折力，並在絲方向設置有透光槽 (211A)，以及側邊設置有2處電氣接點(212A、2l3A)，該2處電 氣接點(212A、213A)之面與光軸平行，該電控對焦元件(21〇A)本 體直位(Da)為7.6mm、厚度⑽為195mm;該導通件(230A、240A) 係由金屬材質所製成，並組設於電控對焦元件(21〇A)之電氣接點 (212A、213A)，使得外部電氣訊號得以與電控對焦元件(21〇A)之 接點(212A、213A)相互導通，並藉由電控來改變電控對焦元件 (210A)之屈折力大小，以達自動對焦功能。 該取像光學組件(300A)主要包含有鏡筒(3i〇A)以及光學鏡 片組(320A)，其中’該鏡筒(31〇a)係由塑膠材質所製成，並在光 轴處設置有透光孔(311A)、光學鏡片容置槽(312A)以及感光組件 容置槽(314A);該光學鏡片組(320A)由物側至像側，依序包含有 第一鏡片（321A)、第二鏡片（322A)以及第三鏡片（323A)，其中， 該第一鏡片（321A)、第二鏡片（322A)及第三鏡片（323A)係由塑膠 材質所製成，並由像侧端組設於鏡筒(3l〇A); 該感光組件(400A)，主要係由半導體感光晶片（410A)、半導 體感光晶片防護層(420A)以及電路基板(430A)所組成，該感光組 件(400A)與鏡筒(310A)相搭接固定；該鏡筒(310A)藉以成型精度 的管控’規制出一適當的距離，使得該取像模組(100A)無需經過 9 M320692 調焦程序，因此可避免因調焦所產生的掉屑問題，同時可得到穩 定的成像品質；該取像模組(100A)從上表面至感光組件(4〇〇A)之 電路基板(430A)的下表面高度(Ha)等於7.6mm。 藉由上述配置，可提供自動對焦的功能，且能有效地降低模 組高度，以利小型化的需求，並可避免調焦所產生掉屑問題，以 提供更穩定的成像品質。 值得一提的是，本新型第1實施例與第2實施例之電控對焦 元件(210、210A) ’其接點數量可為2個或2個以上；且該導通 件(230、240、230A、240A)可另為導線焊接或為軟式基板連接， 且其數量與電控對焦元件之接點數量相對應，而該光學鏡片組可 另加紅外線遮斷元件或光圈片或固定環，上述皆屬本新型專利範 圍。 M320692The electric control is used to change the refractive power of the electronically controlled focusing element. The Hanzhibai electrical contact can be used to achieve the above purpose. The focusing component and the image capturing function are controlled by the electronic component. By setting the f gas contact point, the height space required for the overall module in the optical axis direction can be effectively reduced to meet the demand for miniaturization of the product. The second secondary objective of the present invention is to provide a side-conducting electrically controlled focusing element that can effectively reduce the height to meet the demand for miniaturization of the product. In order to achieve the above object, the electronically controlled focusing element of the design of the side conduction is cracked in the electronic imaging module _ 'the side is opposite to the electrical contact, the plane of the electrical contact is parallel to the optical axis; by electronically controlled focusing The electrical contacts are arranged on the side of the component, which can effectively reduce the height space required for the overall module in the optical axis direction, so as to meet the demand for miniaturization of the product. The electronically controlled focusing element body may have a thickness of less than 3 legs and a diameter of less than 8 mm 'and the height of the image capturing module is less than 9 mm; and the number of electrical contacts of the electronically controlled focusing component of the front focusing component is 2 or more . M320692 [Embodiment] In the first embodiment of the present invention, please refer to the following: _: The image capturing module (ι) mainly includes a front listening component (10), an image capturing optical component (), and a The photosensitive member _, the dynasty, the component (10)) is assembled with each other and placed on the object side end of the image taking optical component (300), and the photosensitive member (4 〇〇) is set in the image taking optics The image side of the component (300); wherein: the in-focus component (2GG) mainly includes an electronically controlled reduction component (10), an electronically controlled focusing component (2), and a conduction component (10), a projecting, controlling focusing component (210) is disposed on the electronically controlled focusing element holder (22〇) by the image side end, and the electrically controlled focusing element (210) has a refractive power, and a light transmission groove (2ΐι) is disposed in the optical axis direction, And the side ^ is also provided with two electrical contacts (212, 213), the surface of the two electrical contacts (212, 213) and the light clear line, the electronic control focus component body (D) is 7·6· The thickness (1) is 1.95mm. The conductive members (230, 24〇) are made of metal and are assembled on the electrical contacts (212, 213) of the electronically controlled focusing component (210) to make external electrical signals. With electronic control Power element (210) of the contacts (212, 213) with conductive, and electrically controlled to change by cross zoom electric element (21〇) the size of the refractive power, in order to achieve autofocus. The image taking optical component (3〇〇) mainly comprises a lens barrel (31〇), an optical lens group (320) and an image taking optical holder (33〇); wherein the lens barrel (31〇) is made of plastic material The light lens (311), the optical lens receiving groove (312) and the screw structure (313) are disposed at the optical axis; the optical lens group (320) is from the object side to the image side, in order The first lens (321), the second lens (322) and the third lens (323) are included, wherein the first mirror 7 M320692 (321), the second lens (322) and the third lens (323) are It is made of plastic material and is set on the lens barrel (31 〇) by the image side end; the image-receiving optical socket (33〇) is made of plastic material and is provided with a screw structure (331). a bump preventing block (332) and a photosensitive member receiving groove (333); the screw structure (313) of the lens barrel (310) is screwed with the threading structure (331) of the image taking optical holder (33) To provide focus fixing, the anti-collision bump (332) is used to prevent the photosensitive component (4〇〇) from colliding when focusing, and to avoid chipping during focusing, and directly falls into the photosensitive component (400). Affects imaging quality. The photosensitive component (400) is mainly composed of a semiconductor photosensitive wafer (41 〇), a semiconductor photosensitive wafer protective layer (420), and a circuit substrate (430), the photosensitive member (4 〇〇) and the image taking optical holder (330) are overlapped and fixed, and the taking The height of the lower surface of the circuit substrate (430) of the module (1) from the upper surface to the photosensitive member (400) is equal to 76 mm. With the above configuration, the image capturing module (100) can provide autofocus function. , and can effectively reduce the height of the module in the direction of the optical axis, in order to facilitate the miniaturization. The younger brother of the new application of the example 'Please refer to the second example: an image capture module (1Q0A) The utility model comprises a front focusing component (2〇〇A), an imaging optical component (3〇〇A), a photosensitive component (400A), the front focusing component (200A) and the imaging optical component (3〇〇) A) mutually assembled and placed on the object side end of the image taking optical component (3A), and the photosensitive element (400A) is assembled on the image side end of the image taking optical component (300A); wherein: the front side The focusing component (200A) mainly includes an electronically controlled focusing component (2丨〇A), an electric M320692 controlled focusing component socket (220A), and a conducting member (23〇A, 24〇A), wherein The electronically controlled focusing element (2_ is set by the image side end set on the electronically controlled focusing element socket (22〇A), and the package-controlled focusing element (21GA) has a refractive power, and a light-transmitting groove is arranged in the wire direction (211A), and two electrical contacts (212A, 2l3A) are disposed on the side, and the faces of the two electrical contacts (212A, 213A) are parallel to the optical axis, and the electronically controlled focusing component (21〇A) is straight. The position (Da) is 7.6 mm and the thickness (10) is 195 mm; the conduction members (230A, 240A) are made of metal material and are assembled on the electrical contacts of the electrically controlled focusing element (21〇A) (212A, 213A). ), so that the external electrical signal can be electrically connected to the contact point (212A, 213A) of the electronically controlled focusing component (21A), and the refractive power of the electronically controlled focusing component (210A) can be changed by electronic control to achieve automatic Focus function. The imaging optical component (300A) mainly comprises a lens barrel (3i〇A) and an optical lens group (320A), wherein the lens barrel (31〇a) is made of a plastic material and is disposed at the optical axis. a light-transmitting hole (311A), an optical lens accommodating groove (312A), and a photosensitive member accommodating groove (314A); the optical lens group (320A) from the object side to the image side, sequentially including the first lens (321A) a second lens (322A) and a third lens (323A), wherein the first lens (321A), the second lens (322A), and the third lens (323A) are made of a plastic material and are image side The end assembly is disposed in the lens barrel (3l〇A); the photosensitive assembly (400A) is mainly composed of a semiconductor photosensitive wafer (410A), a semiconductor photosensitive wafer protection layer (420A), and a circuit substrate (430A), the photosensitive assembly ( 400A) is fixed to the lens barrel (310A); the lens barrel (310A) is controlled by a molding precision to make an appropriate distance, so that the image capturing module (100A) does not need to go through the 9 M320692 focusing program. It can avoid the problem of chipping caused by focusing, and at the same time, obtain stable image quality; the image capturing module (100A) from the upper surface to the sense The lower surface of the height (Ha of) component (4〇〇A) of the circuit board (430A) is equal to 7.6mm. With the above configuration, the function of autofocus can be provided, and the height of the module can be effectively reduced to meet the demand for miniaturization, and the problem of chipping caused by focusing can be avoided to provide more stable image quality. It is to be noted that the electrically controlled focusing elements (210, 210A) of the first embodiment and the second embodiment of the present invention may have two or more contacts; and the conductive members (230, 240, 230A, 240A) may be additionally wired or connected to a flexible substrate, and the number thereof corresponds to the number of contacts of the electrically controlled focusing element, and the optical lens group may be additionally provided with an infrared blocking element or a diaphragm or a fixing ring, All belong to the scope of this new patent. M320692
(1 0 0A)取像模組 (2 Ο 〇A)前置對焦組件 (2 1 1A)透光槽 (2 1 3 A)電氣接點 (2 3 0A)導通件 (3 Ο 〇A)取像光學組件 (3 1 0A)鏡筒 (3 1 2A)光學鏡片容置槽 (3 2 0 A)光學鏡片組 (3 2 2A)第二鏡片 (4 Ο ΟA)感光組件 (410 A)半導體感光晶片 (2 1 0A)電控對焦元件 (2 1 2A)電氣接點 (2 2 0A)電控對焦元件承座 (2 4 0A)導通件 (3 1 1A)透光孔 (3 1 4A)感光組件容置槽 (3 2 1 A)第一鏡片 (3 2 3A)第三鏡片(1 0 0A) Image capture module (2 Ο 〇A) Front focus component (2 1 1A) Transmissive slot (2 1 3 A) Electrical contact (2 3 0A) Conductor (3 Ο 〇A) Image optical component (3 1 0A) lens barrel (3 1 2A) optical lens receiving groove (3 2 0 A) optical lens group (3 2 2A) second lens (4 Ο Ο A) photosensitive component (410 A) semiconductor photosensitive Wafer (2 1 0A) electronically controlled focusing component (2 1 2A) electrical contact (2 2 0A) electronically controlled focusing component socket (2 4 0A) conduction (3 1 1A) light transmission hole (3 1 4A) Component accommodating groove (3 2 1 A) first lens (3 2 3A) third lens
(4 2 0A)半導體感光晶片防護層 (4 3 0 A)電路基板 (Da)直徑 （t a)厚度 (Ha)高度 12(4 2 0A) Semiconductor Photosensitive Wafer Protective Layer (4 3 0 A) Circuit Board (Da) Diameter (t a) Thickness (Ha) Height 12