TWM312762U - Electronic device manufacturing apparatus - Google Patents

Description

M312762 points and includes at least one opening. The method also includes assembling the separate process chamber components into the non-polygonal transfer chamber. Other features and aspects of the present invention will become more fully apparent from the following detailed description. [Embodiment] Fig. 1 is a plan view showing a first exemplary multi-piece electronic component manufacturing process chamber 100 in accordance with some embodiments of the present invention. Referring to Fig. 1, the multi-piece electronic component manufacturing process chamber 100 is a transfer chamber for transporting a substrate during the manufacture of electronic components. The transfer chamber 100 is coupled to one or more process chambers and/or load lock chambers 103 during manufacture of the electronic components. The transfer chamber 100 can include an end effector (not shown) for transferring a substrate between the process chamber and/or the load lock chamber during manufacture of the electronic component. Exemplary substrates include, for example, a glass sheet, a polymeric substrate, a semiconductor wafer, a reticle, a reticle, or the like. According to some embodiments of the present author, the transfer chamber 100 may include a plurality of process chamber components that are coupled together. In detail, the transfer chamber 100 may include a first process chamber component 1〇9 (eg, a first side process chamber component) and a second process chamber component 1 1 1 (eg, a second side process) The chamber component) is coupled to a third process chamber component 113 (eg, a central processing chamber component). The first process chamber component 109 and the second process chamber component 11 1 are coupled to the third process chamber component 141 via a 〇-ring (not individually shown). The first process chamber component 109 and the second process chamber component 1 1 1 are coupled to the third process 7 by using a fixed mechanism such as a screw, a bolt or the like, respectively.

M312762 Room components 1 13. Although the multi-piece electronic component manufacturing process chamber 100 of FIG. 1 includes three processing chamber components, the multi-piece electronic component manufacturing processing chamber may include a greater or lesser number of processing chamber components (eg, 2, 4, 5, 6, etc.). The width of a conventional transfer chamber (e.g., a one-piece transfer) is generally limited to about 3 meters or less to comply with land and/or air transportation regulations, shipping capacity, and/or design architectural design. For example, a transmission room larger than 3 meters would be prohibited by local regulations from being transported by air cargo aircraft of the largest normal capacity (such as Boeing 747) and could not pass through the entrances and exits of general electronic components manufacturing sites. Conversely, in one or more aspects of the present creation, the multi-piece transfer chamber has a width W1 of 4 · 2 meters after being assembled. Therefore, the electronic component manufacturing process chamber 100 of the present invention can accommodate a larger substrate than a conventional one-piece transfer chamber. The width of the electronic component manufacturing chamber 1 可以 can be larger or smaller than 4.2 meters. According to some embodiments of the present invention, each of the processing chamber components I 09-11 3 of the multi-piece electronic component manufacturing process chamber is shaped like one or more wires from a top view or a side cross-sectional view. The circle that was cut. For example, from a top view or from a side cross-sectional view, the side processing chamber components 1 〇 9, 1 1 1 are similar to a portion cut by a wire (or, more generally, an ellipse). Similarly, the central processing chamber component 1 1 3 is similar to a portion where a circle is cut by two strands, as seen from a top view or from a side cross-sectional view. This shape includes two curved sections and two straight sections. Side treatment chamber components 1 0 9, II 1 shape includes a curved section and a straight section. It should be noted that each of the process chamber components 1 09-1 1 3 does not have a polygonal shape. In other words 8 M312762, each of the process chamber components 109-113 includes at least one curved section of the bay.攸 Top view or from the side cross-sectional view, the demonstration of the batch of electronic components ... room 1 〇〇 after assembly (such as 'combined shape) is _ after the versatile multi-piece electronic components Manufacturing process $1〇° after assembly of the overall shape (such as 'three-dimensional shape') for an exemplary eve from 44 #...' and '祀' multi-piece electronic components manufacturing processing room 1〇〇db ^ j has other integral shapes including various types of non-rectangle shapes (e.g., cylinders of u ellipsoid shape).

A F-shaped chamber, especially a symmetrical non-polygonal chamber, A to (for example, a cylinder to), can provide a suitable internal substrate transfer area ~ 曰理室叔·剌, called Ding Yizhen The material is flawed. For example, compared with a polygonal chamber, it is combined with a corner area that is not accessible to the polygonal chamber. Thus, for a quantitative amount of internal substrate transfer area, a non-polygonal chamber weighs less than a polygonal chamber having the same number of available internal substrate transfer areas. 2A is a first exemplary multi-T electronic component manufacturing process chamber 100 (which is rotated relative to the first diagram) in accordance with certain embodiments of the present invention = a knife-cut perspective view. Each of the first to third process chamber components 1〇9_113 is horizontally coupled to form the multi-piece electronic component manufacturing process chamber 100. The length of the first process chamber component 109 is represented by LS1 and the maximum width of the first process chamber component 109 (e.g., the width at the widest point) is represented by wsi. The length of the second process chamber component ηι is represented by ls2 and the maximum width of the second process chamber component lu is represented by WS2. The maximum length of the third process chamber component 113 (e.g., the length at the longest point) is represented by LC 1 and the width of the second process chamber component 3 is represented by wc. In one or more embodiments, the maximum of the third process chamber component 丨丨3

The M312762 has a width of about 2.4 meters and the third process chamber member 113 has a maximum length of 4.2 meters. The length and/or width of the third processing chamber component 113 can be somewhat larger or smaller than the above values. In the illustrated embodiment, the maximum length LC1 of the three process chamber components 113 is also the total diameter of the chamber 100. As shown, the length LSI of the first process chamber member 109 and the length LS2 of the second chamber member 11 1 are equal to the length of the side of the third process chamber member 141. However, the length LSI of the first process chamber component 109 and the length LS2 of the second chamber component 1 1 1 may be different. In one implementation, both the width WS1 of the first process chamber component 109 and the width WS2 of the second process chamber section 111 are both about 0.9 meters. However, the width WS1 of the first processing chamber portion 109 and/or the width WS2 of the second processing chamber member 111 are different from (e.g., larger or smaller) the above numerical values and/or two widths to be different from each other. (In a particular embodiment, the third process chamber component 1 can have a width that is approximately equal to or less than the degree of the first process chamber component 109 plus the width of the second process chamber component 111, however, the first process There may be other relationships between the width of the chamber portion 109, the second processing chamber member 111 and the third processing chamber member 113.) Each processing chamber portion of the multi-piece electronic component manufacturing processing chamber 1 is 1 0 9 - 1 1 3 is used, for example, aluminum, stainless steel or any material that is available, relatively reflective and can be used as a transfer chamber. Although the overall size of the multi-piece electronic component manufacturing process chamber 1 is not in accordance with terrestrial and/or air transportation regulations, each of the processing chamber components 109-113 of the multi-piece electronic component manufacturing chamber 100 conforms to land and/or Or air transport regulations. In detail, in the example described, the multi-piece electronic component is approximately the first straight edge of the sample piece, the cocoa 13 wide piece of the piece is singularly transported by the member 10 M312762 t ^ at a total of 1 to 0 The width is 4.2 meters and it does not comply with the requirements of the land and / or the second wheel. However, the width WS1 of the first process chamber component and the width WS2 of the first process chamber component 〇1 are 〇·9 meters and the width WC 1 of the third process chamber component 311 is 2·4 meters, which are all in accordance with the land. And / or air transport regulations. (In another embodiment, the width WC1 of the third process chamber member 丨丨3 is 3 to 3.2 meters, and the widths WS1, WS2 of the first and second process chamber members 1 〇 9, 111 are 0.5 to 〇·6 Further, each of the processing chamber components 1 09-11 3 of the multi-piece electronic component manufacturing processing chamber 100 can be fabricated on a conventional processing tool or machine. Therefore, the manufacturer of the multi-piece electronic component manufacturing processing chamber 1 can select one or more implements or machines from a plurality of conventional processing tools or machines to manufacture the processing of the multi-piece electronic component manufacturing processing chamber 100. Room components 109-113. The manufacturer of the multi-piece electronic component manufacturing process chamber 1 can obtain a good price from the competition of many conventional processing tools or machines. Conversely, the number of processing implements or machines that can be used to fabricate a single-piece electronic component manufacturing process chamber 1 that can accommodate large substrate sizes is relatively limited. The result of this limited number of processing tools or machines is a reduction in competition. As competition is reduced, the manufacturer will have to pay more for the one-piece room than for the multi-piece electronics manufacturing process. Also, because this one-piece room does not comply with terrestrial and/or air transport regulations', manufacturers of such one-piece rooms will need special assistance when transporting this room, such as police guards, oversized Size goods,, signing, etc. The multi-piece electronic component manufacturing processing chamber 丨00 of the present invention does not require such assistance. 11

M312762 The first multi-piece electronic component manufacturing processing chamber will be assembled after the first chamber 100 is assembled with reference to FIGS. 2A and 2B-2D; a top view; and a 2D view of the first chamber 100 All sides of a chamber 100, which are adapted to be coupled to a three-base chamber, as will be described in more detail below). Referring to Figures 2A-2D, the first chamber 100 includes 201 A-F (20 1D is not visible outside of the chamber), and six concave cuts are provided, but the number can also be used. Each of the concave cut surfaces 201A-F provides a chamber, a load lock chamber or other chamber as shown (e.g., through a loop or other seal), chamber 103. Although the overall structure of the concave facets 201Α-Ϊ 1 00 is a cylindrical shape. For example, if the first (side) processing chamber component 109 includes a cylindrical cut surface 201B, 201C formed therein, and the negative 111 includes a cylindrical wall 205 that allows the recess to be cut therein. The third (central) processing chamber component 113 has side walls 207, 2 09 (shown in Figure 2A), which are divided into 201A, 201D. Because of the relationship of the chamber components 109, 111, 113, the inner region of the first chamber 100 (see, for example, Figures 2A and 2C). Other features that allow one bit 100 are now illustrated, wherein FIG. 2B FIG. 2C is a side view of the first chamber 100 (which shows the first stacked load locks a plurality of concave cut faces. More embodiments in the illustrated embodiment or Fewer cross-sectional areas allow a process to be sealingly coupled to the presence of, for example, Figure 1, but as shown in Figure 2A-2C of the first chamber, the wall 203 can be recessed 5 (side) The process chamber component faces 201E, 201F are formed with cylindrically opposed faces including recessed facet 0 cylindrical walls 203, 205, which are also generally cylindrical in the first chamber 100. 12 ports 211A-D are also in the substrate. An additional gap is provided through the openings (slit openings) formed in the respective cut faces of the first and second process chamber members 109, 111. That is, the notches 211A_D can be transported through the substrate respectively corresponding to

When the real two-machine of the M312762 is freely rotated, the cylindrical structure can reduce the internal space of the first chamber 100. This rotation occurs when, for example, the robot rotates to convey the substrate between the chambers 103 (i-th) coupled to the first chamber 100. In order to accommodate the rotation of the vacuum robot through the third (central) processing chamber component 113, the third processing chamber component ι3 includes a notched region 211AD (see Figure 2A, only the notch 2UA_C is shown) . Additional gaps are provided when the slots 213', 215', 217, 219 of the recessed facets 201F, 201E, 201C, 201B (as shown in Figures 2A and a). Although the concave cut faces 201B, 201C, 201E, 20 1F of the first and second process chamber components 309, 31 are shown as having only one opening, each of the concave cut faces may include additional openings (eg, 2 , 3, 4 or more openings). Similarly, the cut surface 2〇1A of the illustrated third (central) process chamber component 113 has a single opening 22 1 (Fig. 2A), but it may also include additional openings (e.g., 2, 3, 4, etc.) Wait). The cut surface 21〇D (Fig. 2D) of the third process chamber component 113 includes three vertically stacked openings 223A-C (2A and 2D views), but may also include other numbers of openings (e.g., 1, 2). , 4, 5, etc.). In at least one embodiment of the present invention, the intermediate opening 223B of the concave cut surface 2 1 0D of the third processing chamber component 3 and the opening of the concave cut surface 2 0 1 E of the second side processing chamber component i丨丨2 1 5 and the opening 217 of the concave cut surface 201C of the first side processing chamber component i 〇 9 are vertically aligned (as shown in Fig. 2D). Should 13

M312762 Note that each opening 2 1 3-223C is made to a size that allows a substrate to pass. Other structures and alignments can also be used. Referring to Figures 2A-2B, the first and second side processing chamber components 109, 111 include a plurality of fin structures 22 5, each of which provides structural integrity of the first chamber 100. For example, the fin structure 225 can reduce the pressure between the interior region of the first chamber 100 and the process chamber coupled to the first chamber and/or the environment outside the first chamber 100 The cylindrical side/equal wall deflection of the first and second side processing chamber components 1 0 9, 1 11 caused by the difference. Moreover, the use of the fin structure 225 reduces the wall thickness of the first and second side processing chamber components 10, 1 1 1 and reduces the total weight of the first chamber 1 〇 。. In one embodiment, the fin structures 225 have a thickness of about 0.55 inches near the side walls/top walls of the first and second side processing chamber components 109, 11 1 , and in the first and second The side treatment chamber components 1 09, 1 1 1 have a thickness of about 1.3 inches (for stainless steel) at the sealing surface of the central processing chamber component 113, although other materials and/or thicknesses may be used. As shown in Fig. 2A, the bottom portion 227 of the third (central) processing chamber member 1 13 of the first chamber 1 includes a flat portion 229 and a dome portion 21 3 (see also Fig. 2D). The dome portion 231 provides increased strength to the bottom portion 227 due to its dome relationship and can reduce the material thickness requirements of the bottom portion 227. In an exemplary embodiment, when stainless steel is used, the dome portion 231 can have a thickness of about 3/8" or less, while the flat portion 227 has a thickness of about 3/4" to 1" or A smaller thickness. Other material and/or thickness values and/or thickness differences between the flat portion 229 and the dome portion 231 may also be used. To further enhance the dome portion 14

M312762 2 3 1, fins or similar support structures 233 may be formed underneath the dome portion 213 as shown in Fig. 2D. The fins 233 can be used to reduce, for example, the vertical deflection of the dome portion 2 31. Figure 2B-2C shows a top cover 23 5 which can be used with the first chamber 1 - it is used. For example, the top cover 23 5 can be adapted to seal the third (central) process chamber component 1 1 3 of the first chamber (by using a 〇-shaped ring or similar seal on the equal cover 235 and the third treatment Referring to Figure 2B-2C between the chamber members 113, the top cover 23 5 includes a flat sealing portion 237 that is reinforced with a plurality of support structures (beams 239 as shown). The sealing portion 237 can Having a thickness 'which approximates the thickness of the flat portion 229 (Fig. 2A) of the bottom 227 of the chamber 1 ,, and the beam 239 provides additional structural support (to reduce the thickness and weight of the top cover 235) The top cover 235 can include a joint location 241 that can be used to raise and/or lower the top cover 23 5 relative to the first chamber 1 (eg, through a crane or the like). The relationship of the weight of the cover 235, it is preferred to provide one or more inlet hatches (not shown) or other openings on the top cover 23 5 such that the entire top i 23 5 does not have to be from the first chamber 1 The raft is removed to gain access to the interior of the first chamber (eg, for repair or maintenance). Any number of access checks Can be included (eg, 1, 3, 4, etc.). Figure 3 is a top plan view of a second exemplary multi-piece electronic component fabrication processing chamber 300 in accordance with certain embodiments of the present disclosure. Referring to Figure 3, The multi-piece electronic component manufacturing process t 300 "to feed the substrate during the manufacture of the electronic component - the material "t" is coupled to one or more process chambers and/or &;^ 1 _ ..... 15

The M312762 100 can include an end effector (not shown) for transferring a substrate between the process chamber and/or the load lock chamber during manufacture of the electronic component. According to some embodiments of the present author, the transfer chamber 300 may include a plurality of process chamber components that may be coupled together. In detail, the transfer chamber 300 can include a first processing chamber component 309 (eg, a first side processing chamber component) and a second processing chamber component 31 (eg, a second side processing chamber component) It is coupled to a third process chamber component 3 1 3 (eg, a central processing chamber component). The first process chamber component 309 and the second process chamber component 311 are each coupled to the third process chamber component 313 via a Ο-type ring (not shown separately). The first process chamber component 3 09 and the second process chamber component 3 1 1 are each coupled to the third process chamber component 3 13 by use of a securing mechanism, such as a screw, bolt or the like. Although the multi-piece electronic component manufacturing process chamber 300 of FIG. 3 includes three processing chamber components, the multi-piece electronic component manufacturing processing chamber may include a greater or lesser number of processing chamber components (eg, 2 , 4, 5, 6, etc.). In one or more aspects of the present creation, the width (e.g., total) W2 of the multi-piece transfer chamber after being assembled is 4.2 meters. Therefore, the electronic component manufacturing process chamber 300 of the present invention can accommodate a larger substrate than a conventional one-piece transfer chamber. The width of the electronic component manufacturing chamber 300 may be larger or smaller than 4.2 meters. According to some embodiments of the present invention, each of the processing chamber components 3 09-3 1 3 of the multi-piece electronic component manufacturing process chamber is shaped like one or more lines, from a top view or a side cross-sectional view. The circle cut by the rope. For example, 16

M312762 From a top view or from a side cross-sectional view, the side processing chamber components 3 09, 31 1 are similar to a portion cut by a string (or, more generally, an ellipse). Similarly, from a top view or from a side cross-sectional view, the central processing chamber component 313 is similar to a portion of a circle that was cut by two parallel strands. This shape includes two curved sections and two straight sections. The shape of the side processing chamber component 3 09, 3 1 1 includes a curved section and a straight section. It should be noted that each of the process chamber components 3 09-3 1 3 does not have the shape of a polygon. In other words, each of the process chamber components 3 0 9 - 3 1 3 includes at least one curved segment. The exemplary multi-piece electronic component manufacturing process chamber 300 is rounded after assembly (e.g., combined shape) from a top view or from a side cross-sectional view. The overall shape (e.g., three-dimensional shape) of the exemplary multi-piece electronic component manufacturing process chamber 300 after assembly is a cylindrical shape. However, the exemplary multi-piece electronic component manufacturing process chamber 300 can have other integral shapes (e.g., elliptical cylinders) including various non-multilateral shape shapes. As mentioned above, these non-polygonal chambers, particularly symmetrical non-polygonal chambers (e.g., a cylindrical chamber), provide the most suitable internal substrate transfer area to a certain amount of processing chamber material. For example, a non-polygon chamber will not include corner areas that are not used, as compared to a polygonal chamber. Figure 4A is an exploded perspective view of a first exemplary multi-piece electronic component manufacturing process chamber 300 (which is rotated relative to Figure 3) in accordance with certain embodiments of the present teachings. Each of the first to third process chamber components 309-313 is horizontally coupled to form the multi-piece electronic component manufacturing process chamber 300. The length of the first processing chamber component 109 is represented by LSI and the 17th

M312762 The maximum width of a process chamber component 3 09 (e.g., the width at the widest point) is represented by WS1'. The length of the second processing chamber component 311 is represented by LS2' and the maximum width of the second processing chamber component 31 1 is represented by W S 2 '. The maximum length of the third process chamber component 3 1 3 (e.g., the length at the longest point) is represented by LC'1 and the width of the third process chamber component 313 is represented by WC1'. In one or more embodiments, the third process chamber component 313 has a maximum width WC1' of about 2.4 meters and the third process chamber component 313 has a maximum length LC1' of about 4.2 meters. The length and/or width of the third processing chamber component 313 can be somewhat larger or smaller than the above values. In the illustrated embodiment, the maximum length LC 1 ' of the third process chamber component 3 1 3 is also the total diameter of the chamber 300. As shown, the length LS' of the first processing chamber member 309 and the length LS2' of the second processing chamber member 31 1 are equal to the length of the side of the third processing chamber member 313. However, the length LS 1 ' of the first process chamber component 309 and the length LS2' of the second process chamber component 311 may be different. In one embodiment, the width WS 1 ' of the first processing chamber component 309 and/or the width WS2' of the second processing chamber component 31 1 are both about 0.9 meters. However, the width WS1' of the first process chamber component 309 and/or the width WS2' of the second process chamber component 311 may differ from the above values (e.g., larger or smaller) and/or the two widths may be different from each other. (In a particular embodiment, the third process chamber component 113 may have a width that is approximately equal to or less than the width of the first process chamber component 309 plus the width of the second process chamber component 31. There may be other relationships between the width of the first process chamber component 3 0 9 , the second process chamber component 3 1 1 and the third process chamber component 3 1 3 .) Each of the process chamber components of 18 or any available, relatively

M312762 The multi-piece electronic component manufacturing processing chamber 3〇〇 3 09-3 1 3 is used, for example, aluminum, stainless steel, passive and can be made as a material for the transfer chamber. Although the multi-piece electronic component manufacturing site: land and /: Ge air transport regulations 'but the multi-piece electronic component manufacturing process to 300 mother-processing room components 3 〇9 _ 3 } 3 are _ F δ Land and/or air transport regulations. DETAILED DESCRIPTION OF THE INVENTION In the described example, the multi-piece electronic component manufacturing process chamber 300 has a total width of 42 meters. It does not comply with terrestrial and/or air transportation regulations. However, the width WU of the first process chamber component and the width WS2 of the second process chamber component 3U are the width f of the "metric ruler and the third process chamber component 313, which are 2.4 meters and are in accordance with the land and/or Or air transport regulations. (In another embodiment, the width WC1 of the third processing chamber component 3丨3 is 3 to 3.2 meters, and the widths WS1', WS2' of the second and second processing chamber components 3〇9, S11 are 〇5 Up to 6 meters.) Further, each of the processing chamber components 3 09-3 1 3 of the multi-piece electronic component manufacturing process chamber 300 can be manufactured on a conventional processing tool or machine. Therefore, the manufacturer of the multi-piece electronic component manufacturing processing chamber 100 can select one or more implements or machines from a variety of conventional processing tools or machines to manufacture the processing chamber of the multi-piece electronic component manufacturing processing chamber 300. Parts 309-313. The maker of the multi-piece electronic component manufacturing processing chamber 300 obtains a good payout from the competition of many conventional processing tools or machines. Moreover, the multi-piece electronic component manufacturing process chamber 3 of the present invention does not require special transportation assistance. Other features of the first multi-piece electronic component manufacturing process chamber 300 are now

M312762 will be described with reference to FIG. 4A and FIG. 4B-4D, wherein FIG. 4B is a perspective view of the second chamber 300 after assembly; FIG. 4C is a plan view of the second chamber 300; and FIG. 4D is a second chamber. A side view of 300 (which shows all of the faces of the second chamber 300, which are adapted to be coupled to a three-substrate stacked load lock chamber, as will be explained in more detail below). Referring to Figures 4A-4D, the first chamber 300 includes a plurality of protruding cut faces 401A-F which project from the curved side walls of the chamber 300. In the illustrated embodiment, six protruding cuts are provided, but a greater or lesser number of cuts can be used. Each raised face 401 AF provides a flat area for a process chamber, a load lock chamber or other chamber to be sealingly coupled thereto as shown (eg, through a 0-ring or other seal) ), for example, the chamber 103 in FIG. Despite the presence of the raised facets 401A-F, the overall configuration of the second chamber 300 is generally cylindrical. For example, as shown in Figures 4A-4C, the first (side) processing chamber component 309 includes a cylindrical wall 403 in which the projecting facets 4 0 1 B, 4 0 1 C are formed, and The two (side) processing chamber component 311 includes a cylindrical wall 405 from which the projecting cut faces 401E, 401F extend. The third (central) process chamber component 313 has cylindrical opposing side walls 407, 409 (shown in Figure 4A) that include projecting cut faces 401A, 401D, respectively. Because of the relationship of the cylindrical walls 403, 405, 407, 409 of the process chamber components 309, 311, 313, the interior region of the second chamber 300 is also generally cylindrical (see, for example, Figures 4A and 4C). The cylindrical structure can reduce the second chamber 20 when a vacuum robot in the second chamber 300 is allowed to freely rotate.

M312762 1 00 internal space. This rotation occurs, for example, when the robot rotates to convey the substrate to each of the chambers 1〇3 (Fig. 3) coupled to the second chamber 300. Θ > The vacuum robot passes the rotation of the third (central) processing chamber component 3 1 3, and the third processing chamber component 3丨3 includes the notched regions 411A-D (see Figure 4, only the notches 411A-C in the figure) The notch 411 AD also provides an additional gap when the substrate is conveyed through openings (slit openings) formed in the respective cut faces of the first and second process chamber members 109, 111. The notch 4 1 1 AD can be conveyed through the substrate through openings corresponding to the protruding faces 401F, 401E, 401C, 401B (as shown in Figures 4A and 4B), respectively, 4 1 3, 4 1 5, 4 1 7 Additional clearance is provided at 4 1 pm. Although the extended sections 401B, 401C, 401E, 401F of the first and second process chamber components 3 09, 31 1 are shown to have only one opening, each projection The cut faces may include additional openings (eg, 2, 3, 4 or more openings). Similarly, the third (central) process chamber component 3 1 3 is shown. The face 40 1 A has a single opening 42 1 (Fig. 4A), but it may also include additional openings (e.g., 2, 3, 4, etc.). The cut surface 410D of the third process chamber component 313 ( Figure 4D) includes three vertically stacked openings 423A-C (Figs. 4A and 4D), but may also include other numbers of openings (e.g., 1, 2, 4, 5, etc.). In at least one embodiment, the intermediate opening 423B of the protruding section 410D of the third processing chamber component 3丨3 and the opening 2 1 of the second processing chamber component 311 projecting the slit 2 0 1 E 5 and the opening 417 of the protruding face 401C of the first side processing chamber component 309 is vertically aligned (as shown in Fig. 4D). It should be noted that each opening 4 1 3 - 4 2 3 C is made Let 21

M312762 The size of a substrate through. Other structures and alignments can also be used. Referring to Figures 4A-4B, the first and second side processing chamber components 3 09, 31 1 include a plurality of fin structures 42 5 , each of which provides structural integrity of the second chamber 300. For example, the fin structure 225 can be reduced between the interior region of the second chamber 300 and the process chamber coupled to the second chamber, and/or between the environment outside the second chamber 300. The deflection of the cylindrical side/equal wall of the first and second side processing chamber components 3 0 9, 3 1 1 caused by the pressure difference. Moreover, the use of the fin structure 425 reduces the wall thickness of the first and second side processing chamber components 3 09, 31 1 and reduces the total weight of the second chamber 300. In one embodiment, the fin structures 42 5 have a thickness of about 0.5 5 inches near the side walls/top walls of the first and second side processing chamber components 3 09, 31 1 , and at the first And the second side processing chamber component 3 09, 31 1 has a thickness of about 1.3 inches (for stainless steel) at the sealing surface of the central processing chamber component 3 1 3 , but other materials and/or Thickness can also be used. As further shown in Fig. 4A, the bottom portion 427 of the third (central) processing chamber component 313 of the second chamber 300 includes a flat portion 429 and a dome portion 4 1 3 (see also Figure 4D). The dome portion 43 1 can provide increased strength to the bottom portion 42 7 due to its dome relationship and can reduce the material thickness requirements of the bottom portion 427. In an exemplary embodiment, when stainless steel is used, the dome portion 431 can have a thickness of about 3/8" or less, while the flat portion 427 has a thickness of about 3/4" to 1" or Smaller thicknesses. Other material and/or thickness values and/or thickness differences between the flat portion 429 and the dome portion 43 1 may also be used. To further enhance the dome portion 43 1, Forming fins or the like under the dome portion 431

The support structure 433 of the M312762 is as shown in Fig. 4D. The fins 433 can be used to reduce, for example, the vertical deflection of the dome portion 433. Figure 4B-4C shows a top cover 43 5 which can be used with the second chamber 300. For example, the top cover 43 5 can be adapted to seal the third (central) process chamber component 3 1 3 of the second chamber 300 (by using a Ο-shaped ring or similar seal on the equal cover 435 and the third treatment Between the chamber components 3 1 3). Referring to Figures 4B-4C, the top cover 43 5 includes a flat sealing portion 437 that is reinforced with a plurality of support structures (beams 43 9 as shown). The sealing portion 43 7 can have a thickness that approximates the thickness of the flat portion 42 9 (Fig. 4A) of the bottom portion 427 of the chamber 300, and the beam 439 provides additional structural support (allowing the thickness of the top cover 43 5 And the weight is reduced). The top cover 43 5 can include a joint location 44 1 that can be used to raise and/or lower the top cover 435 relative to the second chamber 300 (e.g., through a crane or the like). In order to manufacture a multi-piece electronic component manufacturing process chamber 1, 300, a user, such as a manufacturer, the method 500 of the present invention can be used, which will be described hereinafter with reference to FIG. Method 500 starts at step 5 02. In accordance with the method 500 of the present authorisation, at step 504, one or more overall dimensions of the electronic component fabrication processing chamber are determined. In particular, a manufacturer is required to make a substrate of the desired size. Depending on the desired size, the manufacturer can determine (e. g., design) one or more overall dimensions of an electronic component fabrication process chamber from which the substrate can be fabricated. If the required substrate size is large enough, the overall size of the chamber will not meet at least one of the land and air transportation regulations. Thereafter, in some embodiments, the manufacturer, for example, may decide to

M312762 How to divide the electronic component manufacturing processing chamber into a plurality of processing chamber components such that each of the processing chamber components is sized to conform to at least one of terrestrial and air transportation regulations and at the same time, The integrity of the chamber will be sufficient to perform manufacturing operations when assembled. For example, a manufacturer can cut a designed multi-piece electronic component fabrication process chamber into vertically segmented process chamber components, such as the electronic component fabrication processing chamber 100, 300 shown in Figures 1-4. Horizontal segmentation can also be used. The manufacturer may decide to divide the electronic component manufacturing process chamber into process chamber components in a segmented manner in a combination of other directions or directions. Thereafter, at step 506, the plurality of processing chamber components are fabricated. For example, a manufacturer can use a processing tool or machine to make the process chamber components. The multi-piece electronic component manufacturing process chamber 100, 300 is produced in this manner. After the electronic component manufacturing process chamber 100, 300 is manufactured, the electronic component manufacturing process chamber 100, 300 can be shipped to the customer's location at step 508. In order to transport a multi-piece electronic component manufacturing process chamber 100, 300, the manufacturer may use a method of transporting such a chamber in accordance with one or more embodiments of the present teachings. For example, the first process chamber component of the plurality of electronic component manufacturing process chamber components can be transported by one of land and air transportation. The first process chamber component can be placed in a container that conforms to shipping regulations such that the first process chamber component forms an angle with one side (e.g., the bottom side) of the container. Thus, if the first process chamber component is not placed in the container at the angle, the first process chamber component can have a height or width dimension that is greater than the allowed size and can still be placed into a Meets 24

M312762 Transport within the specified container. The ability to transport larger chamber components allows the multi-part chamber of the creation to be constructed from fewer chamber components. Therefore, it is preferred, but not necessary, to place the processing chamber components at an angle within the container. In some embodiments, it is preferred to manufacture a multi-part chamber as a primary or central processing chamber component that is as large as possible and still fits into a standard size container, and to make the remaining processing chamber components Smaller or as small as possible to make assembly easier. At step 510, when the process chamber components arrive, for example, at the customer's location, the process chamber components can be assembled to form the electronic component manufacturing process chamber 100, 300. In some embodiments, the projecting cut faces may be mounted in step 512 to or in place of the undercut faces 201 A-F of the electronic component fabrication processing chamber 1〇〇. In these embodiments, the projecting cut surface can assist in engaging the load lock chamber and/or the process chamber to the electronic component manufacturing process chamber 100. In some embodiments, the protruding cut surface that is added to the concave cut surface 201 AF extends completely beyond the outer circumference of the electronic component manufacturing process chamber 100, so that the resulting chamber looks like The embodiment shown in Figure 4A is similar. In other embodiments, the raised cut surface that is added to the concave cut surface 20 1 A-F extends only partially beyond the outer circumference of the electronic component manufacturing process chamber 100. The protruding cut surface may include a flat area (for coupling a load lock chamber or a process chamber) with an opening (which is made to allow a substrate to pass) and a joint portion, which is sealed Enter into the recess of the concave section 2 0 1 A - F. At step 514, the load lock chamber and/or the process chamber are coupled to the cut surface of the electronic component fabrication processing chamber 100,300. At step 516, one is used to

The robot in which the M312762 substrate is moved between the process chambers via the non-polygonal transfer chamber is mounted in the electronic component manufacturing process chambers 1, 300. The method 500 ends at step 518. Therefore, the present invention has been described with reference to the exemplary embodiments of the present invention, and it is to be understood that other embodiments may fall within the spirit and scope of the present invention as defined by the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing a first exemplary multi-piece electronic component manufacturing process chamber in accordance with some embodiments of the present invention. Fig. 2A is an exploded perspective view of the first exemplary multi-piece electronic component manufacturing process chamber in accordance with some embodiments of the present invention in Fig. 1. Fig. 2B is a perspective view of the first chamber after assembly of Fig. 2A. Fig. 2C is a plan view of the first chamber of Fig. 2A. Fig. 2D is a side view of the first chamber of Fig. 2A. Figure 3 is a top plan view of a second exemplary multi-piece electronic component fabrication process chamber in accordance with certain embodiments of the present teachings. Fig. 4A is an exploded perspective view of the second exemplary multi-piece electronic component manufacturing process chamber in accordance with some embodiments of the present invention in Fig. 3. Fig. 4B is a perspective view of the first chamber after assembly of Fig. 3A. Figure 4C is a plan view of the first chamber of Figure 3A. Figure 4D is a side view of the first chamber of Figure 3A. Figure 5 is a flow chart showing some method embodiments of the present author. 26

M312762 [Description of main component symbols] 100 multi-piece electronic component manufacturing processing chamber 103 process chamber and/or load lock chamber 109 first processing chamber component 111 second processing chamber section half 113 third processing chamber component 201A-F recessed Section 203 cylindrical wall 205 cylindrical wall 207 opposite side wall 209 opposite side wall 21 1 A - D notch 213- 219 opening 223A-C opening 225 tab structure 227 bottom 229 flat portion 23 1 dome portion 233 support structure 235 top Cover 237 Flat sealing portion 239 Beam 241 Connection position 300 Multi-piece electronic component manufacturing processing chamber 309 First processing chamber component 311 Second processing chamber portion f 3 13 Third processing chamber component 401 AF protruding 403 Cylindrical Wall 405 cylindrical wall 407 opposite side wall 409 opposite side wall 411 A - D notch 413 - 419 opening 423A - C opening 425 piece structure 427 bottom 429 flat part 43 1 dome part 433 support structure 435 top cover 437 flat seal Section 439 Beam 441 Connection Location 27 M312762 500 Method

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Claims (1)

M312762 IX. Patent application scope: 1. A device for manufacturing electronic components, comprising at least: a plurality of processing chamber components adapted to be assembled together to form a non-polygonal electronic component manufacturing processing chamber, wherein each of the processing chamber components Having a size that meets at least one of the requirements of land and air transportation regulations; and The overall size of the non-polygonal electronic component manufacturing process chamber does not comply with at least one of the terrestrial and air transportation regulations. 2. The device of claim 1, wherein each of the processing chamber components comprises at least one curved side. 3. The device of claim 2, wherein at least one of the processing chamber components comprises at least two curved sides and two straight sides. 4. The device of claim 2, wherein at least two of the processing chamber components, each of the processing chamber components comprises at least one of a curved side and a straight side. 5. The device of claim 4, wherein the processing chamber components are adapted to be joined together along the linear sides. 6. The device of claim 2, wherein each curved side is 29 M312762 includes at least one opening, each opening being sized to pass a substrate therethrough and adapted to be coupled to a second chamber. 7. The device of claim 2, wherein the plurality of processing chamber components comprise at least one processing chamber component having at least one face at least one of its curved sides, and wherein At least all of the faces are adapted to be coupled to a second chamber and include at least one opening. 8. The device of claim 7, wherein the at least all of the faces are recessed on the curved side. 9. The device of claim 8, wherein the at least one of the faces comprises a plurality of openings. The device of claim 7, wherein the at least one surface is adapted to protrude from the curved side. 1 1. The device of claim 10, wherein the at least one of the plurality of faces comprises a plurality of openings. 12. A device for manufacturing electronic components, comprising: at least: a first processing chamber component having a cut by two cords M312762 a lateral cross-sectional shape of the elliptical portion such that the shape comprises two curved segments, a first straight segment, and a second straight segment; a second processing chamber component having an elliptical portion cut by a wire a lateral cross-sectional shape such that the shape includes a curved section and a third straight section; and a third processing chamber component having a lateral cross-sectional shape of the elliptical portion cut by a string such that the shape includes A curved section and a fourth straight section, wherein the processing chamber components are adapted to be assembled together to form an elliptical cylindrical shape. The device of claim 12, wherein the two strands forming the lateral cross-sectional shape of the first processing chamber component are parallel. 14. The device of claim 12, wherein the first processing chamber component is adapted to be coupled to the second processing chamber component along the first straight section, and wherein the first processing chamber component is adapted to The second straight line segment is coupled to the third processing chamber component. The device of claim 12, wherein the processing chamber components are adapted to be assembled together to form a chamber having a cylindrical shape. 31 M312762 16. Apparatus for manufacturing electronic components, comprising: at least: a first processing chamber component; a second processing chamber component adapted to be coupled to the first processing chamber component; and a third processing chamber a member adapted to be coupled to the first processing chamber component, wherein the first processing chamber component includes a top having a shape formed by two curved segments, a first straight segment, and a second straight segment, wherein the shape The second processing chamber component includes a top having a shape formed by a curved section and a straight section, wherein the third processing chamber component includes a top having a shape formed by a curved section and a straight section, wherein the a length of the first straight section of the first processing chamber component is approximately equal to a straight section of the second processing chamber component, and a length of the second straight section of the first processing chamber component is approximately equal to a straight section of the third processing chamber component, and Wherein the two curved sections of the first processing chamber component, the curved section of the second processing chamber component, and the curved section of the third processing chamber component are in the second processing chamber component and the third processing chamber component Connected to the first member when the processing chamber together form an ellipse. The device of claim 16, wherein the ellipse formed by the curved segments of the processing chamber components is a circle. The device of claim 16, wherein the second process 32 M312762 chamber component is adapted to be coupled along a straight line segment of the second process chamber component and a first straight segment of the first process chamber component Connected to the first processing chamber component. The device of claim 16 wherein the first straight line segment of the first processing chamber component and the second straight segment of the first processing chamber component are substantially equal in length. The device of claim 16, wherein the first straight line segment of the first processing chamber component and the second straight straight segment of the first processing chamber component have different lengths. The device of claim 16, wherein each of the processing chamber components includes at least one curved side wall and at least one cut surface on the curved side wall, wherein at least one of Coupling to a load lock chamber, and At least one of the faces includes one or more openings for passing a substrate, and the device of claim 21, wherein at least all of the faces are recessed on a curved side wall. The device of claim 2, wherein at least all of the features protrude from a curved side wall. 33