M312560 、八、新型說明： ^ 【新型所屬之技術領域】 -本齡為有_—種合成板結構改良，_是減_合層交錯 重豐形成-夾層’並於夾層頂、底兩面各結合—板材，俾達應用廣泛 及使用方便之目的。 【先前技術】 按，一般在印刷電路板上鑽孔時，皆會在印刷電路板下方墊置一 ♦木賴成的絲板，並藉此倾機纟及槪玉具。*當絲板使用至 -定程度後就無法續㈣’所習知的作法是報銷丟棄或統—焚燒鎖 毀。但報銷丟棄或統-焚燒銷毁皆相當不符合環保，同時亦形成資源 的浪費。 目前雖有回收底墊板的技術，並進而製成—合成板結構，係如公 告字遽第M292605之「合成板結構」，主要係設有回收之印刷電路板鑽 孔用之底墊板，该底墊板上具有多數個大小深淺不一的凹孔；其特徵 籲係在·由數#底墊板及二>;木材單板所組成，先於各底墊板上塗以黏 膠，將底墊板與底塾板相互黏合，其黏膠可滲入底墊板之凹孔内並將 之真平並藉由凹孔内黏膠之抓持，可將相互貼合之底墊板更為緊密 士占口依所奴製成之合成板厚度，將數片底墊板相互黏合至所須之板 體厚度後再於其頂、底面分別以黏膠黏上木材單板。 ‘ 而分析上述内容尚有下狀缺失··㈠各底她是叫目同大小的 底墊板所黏合喊，因此相料容賴作成大尺寸的合成板，在應用 上’也因為大小尺寸的限制導致無法廣泛的使用。（二）上述技術在黏 5 M312560 合各底刪，州目職單—_騎嶋合軸作，因此 當面f種規格的底塾板時，便無法依照上述技術進行施工，在組裝 上相當不便，啊亦增加t者嶋材料的成本。 因此如何開發-種能解決合成減構關題，並具有朗廣泛及 使用方便的結構，實為目前硫解決的課題。 有鑑如此’本創作人基於回收印刷電路板鑽孔用之底塾板的需 求’乃以痛娜年軟陶積，曝㈣合成板結構 改良，供以此產業需利用。 【新型内容】 ，馨於以上所述習知技術缺點，本創作之主要目的係提供一種應用 廣泛及使用方便之合成板結構改良。 為達上揭目的以及其他目的，本創作提供一種合成板結構改良， 應用於回㈣稱路板在觀狀麵板，包対—⑽及兩板材， 其中： 該夾層，係包括至少-鋪合層，該鋪合層係呈交錯重疊，另鋪合 層係由數底墊板鋪設而成；以及 該板材，結合於夾層頂、底兩面，並用以強化及美化合成板。 藉由上述技術手段’本創作可崎料知缺失而具有顧廣泛及 使用方便的優點。 【實施方式】 有關於本創作所採用之技術、手段及其達成功效，兹舉較佳實施 例並配合圖式詳細·如後，滅當可由之得深人而具體的瞭解。 6 M312560 ” 在本新型被洋細描述之前，要注意的是，在以下說明内容中，類 ,似的元件是以相同的編號來表示。 …請配合參閱第-圖至第三圖所示，本創作之合成板結構改良，應 用於回收印刷電路板在鑽孔用之底墊板1U，包含有一夾層丨及兩板 材2，其中： 該夾層1，係包括至少一鋪合層U，各鋪合層u係呈交錯重疊， 另鋪合層11係由數大小不一的底墊板⑴鋪設而成，該底塾板⑴ ⑩係為回收印刷電路板(PCB)在鑽孔用之板材，另底墊板U1正、反兩面 係具有數鑽孔後所留下深淺不一且呈不規則排列之鑽孔丨12 ;以及 该板材2，係為一平面板體，結合於夾層】頂、底兩面，並用以 強化及美化合成板。 有關於上述構件之組合結構請參閱第三圖及第四圖所示，本創作 之合成板結構改良係糊-板材2的一端表面上塗絲膠3後膠合一 鋪合層11，該黏膠3係可滲入鑽孔112内及各底塾板U1之間的縫隙， ⑩且強化其結構；之後，在該鋪合層n另一面塗佈黏膠3，並交錯膠合 另一鋪合層11，藉此結構將鋪合層n交錯膠合至一定高度形成夾層i 後，於其頂面膠合另-板材2，使形成一具環保之家倶建材者。附帶 一提的是，所述之板材2可為塑膠板、竹板及木板等材f，其板材2 的厚薄度可隨業者的設計自行改變。雖然，本可實施例板材2係為一 平面板體。但板材2的外側面亦可塗佈各種圖案、花紋及顏色，並可 以凹凸不平的幾何_為之(如第五_示），只需熱層丨結合的内 側面為-平面，就可達到與上述相同之使用目的及功效。其次，所述 M312560 夾層1係由數底墊板11鋪設而成，該底墊板Η雖呈大小不一，但 •亦可呈大小相同，只要設置得宜，者阿達到與上述相同之使用目的及 . 功效。 再者，本創作之合成板結構改良亦可再進一步加工裁切，進而形 成業者所需的外型及其規格，在此不再贅述。 【圖式簡單說明】 第一圖所示係本創作之外觀立體圖； 馨第一圖所示係本創作板材結合於夾層底面之外觀立體圖； 第二圖所示係本創作之分解立體圖； 第四圖所示係本創作之剖面圖；以及 第五圖所7F縣創作之另—鶴的板材剖面圖。 【主要元件符號說明】 1................夾層 ...............鋪合層 ® ln···...........底墊板 112..............鑽孔M312560, VIII, new description: ^ [New technical field] - The age is _------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------ - Plates, Trent are widely used and easy to use. [Prior Art] According to the general method, when drilling a hole on a printed circuit board, a silk board made of wood ray is placed under the printed circuit board, and the machine is tilted and smashed. *When the silk plate is used to a certain extent, it cannot be continued (4). The conventional practice is to reimburse or discard the burn-in. However, reimbursement or destruction-incineration and destruction are quite environmentally friendly and waste of resources. At present, although there is a technology for recovering the bottom plate, and then the structure of the composite plate is made, such as the "synthetic plate structure" of the bulletin word M292605, which is mainly provided with a bottom plate for recycling the printed circuit board for drilling. The bottom pad has a plurality of recessed holes of different sizes; the features are composed of a number of bottom plates and two wooden veneers, and the adhesive is applied before each of the bottom pads. The bottom pad and the bottom plate are bonded to each other, and the adhesive can penetrate into the concave hole of the bottom pad and be flat and grasped by the adhesive in the concave hole, so that the bottom plate which is mutually adhered can be further Close to the thickness of the composite board made by the slaves, the bottom plates are bonded to each other to the thickness of the required plate, and then the veneers are glued to the top and bottom surfaces respectively. 'And the analysis of the above content is still missing. · (a) each bottom is called the same size of the bottom pad to join the shout, so the material is expected to be made into a large-sized composite board, in application 'also because of the size of the size Limitations make it impossible to use it extensively. (2) The above-mentioned technology is deleted at the bottom of the stick 5 M312560, and the state's catalogue is _ 嶋 嶋 嶋 , , , , , , , , , , , , , , , , , , , , f f f f f f f f f f f f f f f , ah also increases the cost of materials. Therefore, how to develop a kind of structure that can solve the problem of synthetic subtractive construction, and has a wide range and convenient use is a problem solved by the current sulfur. In view of the above, the creator's need to recycle the bottom slab for drilling printed circuit boards is based on the improvement of the structure of the Naoya soft clay and the exposed (four) composite panels for use by the industry. [New content], Xin is a shortcoming of the above-mentioned conventional techniques. The main purpose of this creation is to provide a composite board structure that is widely used and easy to use. In order to achieve the purpose and other purposes, the present invention provides a composite board structure improvement, which is applied to the back (four) weighing board in the viewing panel, the package - (10) and two sheets, wherein: the interlayer includes at least - paving In the layer, the paving layer is staggered and overlapped, and the paving layer is laid by the bottom pad; and the plate is combined on the top and bottom sides of the interlayer to strengthen and beautify the composite board. With the above-mentioned technical means, the creation of the present invention has the advantages of being extensive and easy to use. [Embodiment] Regarding the techniques, means, and efficiencies used in the creation of the present invention, the preferred embodiment is combined with the details of the drawings, and the following can be understood in detail. 6 M312560 ” Before this description is described in detail, it should be noted that in the following description, the similar components are denoted by the same number. ... Please refer to the figures - to the third figure. The composite board structure of the present invention is improved, and is applied to the bottom board 1U for recycling the printed circuit board in the drilling, and comprises a sandwich layer and two sheets 2, wherein: the interlayer 1 comprises at least one paving layer U, each paving The laminated layer u is staggered and overlapped, and the other layer 11 is laid by a plurality of bottom pads (1) of different sizes, and the bottom plate (1) 10 is used for recycling printed circuit boards (PCBs) for drilling. The bottom and back sides of the bottom pad U1 have a plurality of boreholes 12 which are different in depth and irregularly arranged after drilling; and the plate 2 is a flat plate body which is combined with the top layer and the bottom layer. On both sides, it is used to strengthen and beautify the composite board. For the combination structure of the above components, please refer to the third and fourth figures. The composite board structure of the present invention is modified on the one end surface of the paste-sheet 2 and coated with the glue 3 a laminate layer 11, the adhesive 3 can penetrate into the bore 112 and each a gap between the bottom plate U1, 10 and strengthen its structure; after that, the other side of the paving layer n is coated with the adhesive 3, and the other paving layer 11 is alternately glued, whereby the structure interlaces the paving layer n After gluing to a certain height to form the interlayer i, the other side of the sheet 2 is glued to form an environmentally friendly home building material. Incidentally, the sheet 2 can be a plastic board, a bamboo board and a wood board. The thickness of the sheet 2 can be changed according to the design of the material. Although the sheet 2 of the embodiment can be a flat plate body, the outer side of the plate 2 can also be coated with various patterns, patterns and colors, and It can be rugged geometry (such as the fifth_show), and only the inner side of the thermal layer is combined with the plane, the same purpose and effect as above can be achieved. Secondly, the M312560 interlayer 1 is composed of The bottom pad 11 is laid. The bottom plate is different in size, but it can also be the same size. As long as it is properly set up, it achieves the same purpose and effect as above. In addition, this creation The composite plate structure can be further processed and cut, and further The appearance and specifications of the manufacturer are not repeated here. [Simple description of the drawing] The first figure shows the appearance of the creation. The first picture shows the combination of the creation plate and the bottom surface of the interlayer. The second perspective shows the exploded perspective view of the creation; the fourth diagram shows the profile of the creation; and the section of the fifth section of the 7F county created by the crane - the section of the plate. [Main component symbol description] 1................Layer...............Pavement layer® ln···......... .. bottom pad 112..............drilling