TWM622106U - Multilayer compound plate structure - Google Patents
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- TWM622106U TWM622106U TW110208899U TW110208899U TWM622106U TW M622106 U TWM622106 U TW M622106U TW 110208899 U TW110208899 U TW 110208899U TW 110208899 U TW110208899 U TW 110208899U TW M622106 U TWM622106 U TW M622106U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
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Abstract
本創作中提出一種多層複合板材結構,包含:多層紙層;多層PE膜層,其中該多層紙層與該多層PE膜層交錯配置,而應用熱熔後熱壓的該多層PE膜層或黏膠黏合;其中本案應用該多層紙層與該多層PE膜層交錯配置黏合而形成一定厚度的複合板材;該複合板材可作為建材用或印刷電路板業的鑽孔墊板或上蓋板。該多層複合板材結構尚包含:至少一層鋁箔板,係與上述該多層紙層與該多層PE膜層交錯配置而形成複合板材;該鋁箔板在於防水及防水氣,使得水或者水氣可以被隔離。或者是該多層複合板材結構,尚可包含至少一層廢紙層。 This creation proposes a multi-layer composite sheet structure, including: multi-layer paper layers; multi-layer PE film layers, wherein the multi-layer paper layers and the multi-layer PE film layers are alternately arranged, and the multi-layer PE film layers or adhesive layers after hot-melting are applied. Adhesive bonding; in this case, the multi-layer paper layer and the multi-layer PE film layer are staggered and bonded to form a composite board with a certain thickness; the composite board can be used as a drilling pad or upper cover for building materials or printed circuit board industry. The multi-layer composite sheet structure further includes: at least one layer of aluminum foil, which is interleaved with the multi-layer paper layer and the multi-layer PE film layer to form a composite sheet; the aluminum foil is waterproof and waterproof, so that water or moisture can be isolated . Alternatively, the multi-layer composite board structure may further include at least one layer of waste paper.
Description
本創作係有關於多層板材,尤其是一種多層複合板材結構。 This work is about multi-layer panels, especially a multi-layer composite panel structure.
在工程的應用上,往往需要很多板材,譬如裝潢板、傢俱板(如桌椅、沙發、櫥櫃等類型)、地板(木地板)或系統櫃的板材,或者是PCB(印刷電路板業)的鑽孔墊板或上蓋板。這些板材的消耗量相當的大,一般係用木板或者是塑膠板製作。而木板及塑膠板的成本較高,而且廢棄物的處理也是一個很大的問題,譬如熱固性塑膠製品,幾乎只有掩埋與焚燒兩種最終處理的方式,由於分解困難,如用掩埋的方式會造成環保上的問題,若採用焚燒的方式,更會進一步促進地球溫室效應的惡化。 In engineering applications, many boards are often required, such as decorative boards, furniture boards (such as desks, chairs, sofas, cabinets, etc.), floors (wood floors) or system cabinet boards, or PCB (printed circuit board industry). Drill backing plate or top cover. The consumption of these boards is quite large, and they are generally made of wooden boards or plastic boards. The cost of wood and plastic boards is relatively high, and the disposal of waste is also a big problem. For example, thermosetting plastic products, there are almost only two final disposal methods: burial and incineration. The problem of environmental protection, if the method of incineration is adopted, will further promote the deterioration of the global warming effect.
以環境工程角度,廢棄物是放錯地方的資源。如果可以適當的方式將資源透過循環再利用,再製作成可用的產品,一方面可以減少需要處理的廢棄物,而且更進一步利用廢物可以達到減少利用天然資源的目的。 From an environmental engineering perspective, waste is a misplaced resource. If the resources can be recycled and reused in an appropriate way, and then made into usable products, on the one hand, the waste that needs to be treated can be reduced, and the further utilization of the waste can achieve the purpose of reducing the use of natural resources.
所以如果可以應用簡便的製程,而且盡量地採用廢棄的材料形成上述的建築板材,或者是PCB(印刷電路板業)的鑽孔墊板或上蓋板,藉由一種新型且能簡易施作的再利用方式形成一種新型的材料,可獲得多種效益,有別於傳統焚燒、掩埋之環境工程最終處理法。以廣泛增加廢棄纖維循環再利用的特性,並達到循環經濟的目標及環境永續性的概念。 Therefore, if a simple process can be applied, and waste materials are used as much as possible to form the above-mentioned building boards, or the drilling pads or upper cover boards of PCB (printed circuit board industry), a new and easy-to-operate The reuse method forms a new type of material, which can obtain various benefits, which is different from the traditional incineration and burial of environmental engineering final treatment methods. In order to widely increase the characteristics of waste fiber recycling, and achieve the goal of circular economy and the concept of environmental sustainability.
故本案希望提出一種嶄新的,以解決上述先前技術上的缺陷。 Therefore, this case hopes to propose a new one to solve the above-mentioned defects in the prior art.
所以本創作的目的係為解決上述習知技術上的問題,本創作中提出一種多層複合板材結構,其中整體的結構所使用的膠或熱熔膠不含甲醛,可作為無甲醛板材,所以不會對人體產生危害。再者對於上述的製作材料可以大量地使用再生材,整體成本較為低廉,再者紙層、廢紙層及PE膜層均可再製再利用,所以對環境衝擊較低,可以達到環保的目的。另外這些均使用相當輕質的材料,所以整體的重量不大,因此搬運容易、施工也方便。 Therefore, the purpose of this creation is to solve the above-mentioned problems in the conventional technology. In this creation, a multi-layer composite sheet structure is proposed, wherein the glue or hot melt adhesive used in the overall structure does not contain formaldehyde and can be used as a formaldehyde-free sheet, so it is not Harmful to human body. Furthermore, for the above-mentioned production materials, a large number of recycled materials can be used, and the overall cost is relatively low. Moreover, the paper layer, the waste paper layer and the PE film layer can be recycled and reused, so the impact on the environment is low, and the purpose of environmental protection can be achieved. In addition, these are made of fairly lightweight materials, so the overall weight is not large, so it is easy to carry and construct.
為達到上述目的本創作中提出一種多層複合板材結構,包含:多層紙層;多層PE膜層,其中該多層紙層與該多層PE膜層交錯配置,而應用熱熔後熱壓的該多層PE膜層或黏膠黏合;其中本案應用該多層紙層與該多層PE膜層交錯配置黏合而形成一定厚度的複合板材;該複合板材可作為建材用或印刷電路板業的鑽孔墊板或上蓋板。 In order to achieve the above-mentioned purpose, this creation proposes a multi-layer composite sheet structure, comprising: multi-layer paper layers; multi-layer PE film layers, wherein the multi-layer paper layers and the multi-layer PE film layers are alternately arranged, and the multi-layer PE film layer after hot-melting is applied. Film layer or adhesive bonding; in this case, the multi-layer paper layer and the multi-layer PE film layer are staggered and bonded to form a composite board with a certain thickness; the composite board can be used as a drilling pad for building materials or a printed circuit board industry. cover plate.
該多層複合板材結構尚包含:至少一層鋁箔板,係與上述該多層紙層與該多層PE膜層交錯配置,並以熱熔後熱壓的該多層PE膜層或該黏膠與其他板材黏合;該鋁箔板在於防水及防水氣,使得水或者水氣可以被隔離。 The multi-layer composite sheet structure also includes: at least one layer of aluminum foil, which is interleaved with the above-mentioned multi-layer paper layer and the multi-layer PE film layer, and is bonded to other plates by the multi-layer PE film layer or the adhesive after hot-melting ; The aluminum foil board is waterproof and waterproof, so that water or moisture can be isolated.
該多層複合板材結構尚包含:至少一層廢紙層,係由眾多之廢紙集合形成的層板。該廢紙層為一般利樂包的廢材所形成者;利樂包係為紙層及PE膜層集合成的包裝材料。該廢紙層插入於交錯配置的該多層紙層與該多層PE膜層之間。或者是該廢紙層插入於交錯配置的該多層紙層與該多層PE膜層的外表面以增進多層複合板材的美觀。 The multi-layer composite board structure further comprises: at least one layer of waste paper, which is a laminate formed by collecting a large number of waste papers. The waste paper layer is formed by the waste materials of the general Tetra Pak package; the Tetra Pak package is a packaging material composed of a paper layer and a PE film layer. The waste paper layer is interposed between the staggered multi-layer paper layers and the multi-layer PE film layers. Or the waste paper layer is inserted on the outer surface of the multi-layer paper layer and the multi-layer PE film layer which are staggered to improve the aesthetics of the multi-layer composite board.
由下文的說明可更進一步瞭解本創作的特徵及其優點,閱讀時並請參 考附圖。 The features and advantages of this creation can be further understood from the following description, and please refer to the Check the attached drawings.
1:多層複合板材結構 1: Multilayer composite sheet structure
10:多層紙層 10: Multiple layers of paper
20:多層PE膜層 20: Multilayer PE film layer
30:黏膠 30: Viscose
40:鋁箔板 40: Aluminum foil board
50:廢紙層 50: Waste paper layer
圖1A顯示本案第一實施例中的複合板材之示意圖。 FIG. 1A shows a schematic diagram of the composite board in the first embodiment of the present application.
圖1B顯示本案第一實施例中的複合板材之示意圖,其中包含該黏膠作為結合用。 FIG. 1B shows a schematic diagram of the composite board in the first embodiment of the present application, which includes the adhesive for bonding.
圖2A顯示圖1A之A-A’方向之截面示意圖。 Fig. 2A shows a schematic cross-sectional view along the line A-A' of Fig. 1A.
圖2B顯示圖1B之B-B’方向之截面示意圖。 Fig. 2B shows a schematic cross-sectional view along the direction B-B' of Fig. 1B.
圖3A顯示本案第二實施例中的複合板材之示意圖。 FIG. 3A shows a schematic diagram of the composite board in the second embodiment of the present application.
圖3B顯示本案第二實施例中的複合板材之示意圖,其中包含該黏膠作為結合用。 FIG. 3B shows a schematic diagram of the composite board in the second embodiment of the present application, which includes the adhesive for bonding.
圖4A顯示本案第三實施例中的複合板材之示意圖。 FIG. 4A shows a schematic diagram of the composite board in the third embodiment of the present application.
圖4B顯示本案第三實施例中的複合板材之示意圖,其中包含該黏膠作為結合用。 FIG. 4B shows a schematic diagram of the composite board in the third embodiment of the present application, which includes the adhesive for bonding.
圖5A顯示本案第三實施例中的複合板材之另一型態之示意圖,其中顯示該廢紙層插入於交錯配置的該多層紙層與該多層PE膜層的外表面。 5A shows a schematic diagram of another type of the composite board in the third embodiment of the present application, which shows that the waste paper layer is inserted on the outer surface of the multi-layer paper layer and the multi-layer PE film layer which are staggered.
圖5B顯示圖5A的結構,其中以該黏膠作為結合用。 FIG. 5B shows the structure of FIG. 5A, wherein the adhesive is used for bonding.
圖6A顯示本案第三實施例中的複合板材之另一型態之示意圖,其中顯示該廢紙層及至少一層鋁箔板插入於交錯配置的該多層紙層與該多層PE膜層的外表面。 6A shows a schematic diagram of another type of the composite sheet in the third embodiment of the present application, which shows that the waste paper layer and at least one layer of aluminum foil are inserted on the outer surfaces of the staggered multi-layer paper layers and the multi-layer PE film layers.
圖6B顯示圖6A的結構,其中以該黏膠作為結合用。 FIG. 6B shows the structure of FIG. 6A, wherein the adhesive is used for bonding.
茲謹就本案的結構組成,及所能產生的功效與優點,配合圖式,舉本 案之一較佳實施例詳細說明如下。 Hereby, I would like to cite the structure of this case, the effects and advantages it can produce, in conjunction with the diagram. A preferred embodiment of the case is described in detail as follows.
請參考圖1A至圖6B所示,顯示本創作之多層複合板材結構1,本案的第一實施例(參考圖1A至圖2B)中,該多層複合板材結構1包含:
Please refer to FIG. 1A to FIG. 6B , showing the multi-layer
多層紙層10,該多層紙層10可以是牛皮紙、漂白紙、或回收紙等各種的紙層。較佳者,該多層紙層10應用再生材料所製造。
The
多層PE膜層20,其中該多層紙層10與該多層PE膜層20交錯配置,該多層PE膜層20熱熔後熱壓可與該多層紙層10結合(圖1A,2A)。
The multi-layer
也可以該多層紙層10與該多層PE膜層20之間應用黏膠30結合(圖1B,2B)。
該黏膠30為樹脂黏膠。其中該黏膠30主要是用於黏合該多層紙層10與該多層PE膜層20。其中該黏膠30可為固態或液態之樹脂,以固態者為佳。該黏膠30可為酚醛樹脂、尿素甲醛樹脂、環氧樹脂、壓克力樹脂等樹脂類型,或其混合物。
The
或者該黏膠30為熱可塑的膜狀熱熔層。 Or the adhesive 30 is a thermoplastic film-like hot melt layer.
本案中應用該多層紙層10與該多層PE膜層20交錯配置黏合而形成一定厚度的複合板材。
In this case, the
本第一實施例的主要是作為建材用,譬如作為裝潢板、傢俱板(如桌椅、沙發、櫥櫃等類型)、地板(木地板)或系統櫃的板材,也可以作為PCB(印刷電路板業)的鑽孔墊板或上蓋板。 The first embodiment is mainly used as a building material, such as a decorative board, a furniture board (such as desks, chairs, sofas, cabinets, etc.), a floor (wood floor) or a board for a system cabinet, and can also be used as a PCB (printed circuit board). industry) drilling backing plate or cover plate.
本案的第二實施例中,該多層複合板材結構1包含:
In the second embodiment of this case, the multi-layer
多層紙層10,該多層紙層10可以是牛皮紙、漂白紙、或回收紙等各種的紙層。較佳者,該多層紙層10應用再生材料所製造。
The
多層PE膜層20,其中該多層紙層10與該多層PE膜層20交錯配置,該多層PE膜層20熱熔後熱壓可與該多層紙層10結合。
The multi-layer
也可以該多層紙層10與該多層PE膜層20之間應用黏膠30結合。
至少一層鋁箔板40(圖3A及3B中顯示在本案的結構中具有雙層的鋁箔板),係與上述該多層紙層10與該多層PE膜層20交錯配置所形成的複合板材之間(該鋁箔板40也可以配置在最外層),並以該多層PE膜層20熱熔後熱壓作為結合劑(圖3A),或者是以該黏膠30與其他板材黏合(圖3B)。該鋁箔板40的主要作用在於防水及防水氣,使得水或者水氣可以被隔離。
At least one layer of aluminum foil board 40 (shown in FIGS. 3A and 3B has a double-layer aluminum foil board in the structure of the present case) is between the composite board formed by the above-mentioned
本實施例中,該黏膠30同於上述第一實施例,這裡不再敘述其細節。 In this embodiment, the adhesive 30 is the same as the above-mentioned first embodiment, and its details will not be described here.
本案中應用該多層紙層10與該多層PE膜層20及至少一層鋁箔板40交錯配置黏合,而形成一定厚度的複合板材。
In this case, the
本第二實施例的主要是作為建材用,譬如作為裝潢板、傢俱板(如桌椅、沙發、櫥櫃等類型)、地板(木地板)或系統櫃的板材,也可以作為PCB(印刷電路板業)的鑽孔墊板或上蓋板。 The second embodiment is mainly used as a building material, such as a decorative board, a furniture board (such as tables and chairs, sofas, cabinets, etc.), a floor (wood floor) or a board of a system cabinet, and can also be used as a PCB (printed circuit board). industry) drilling backing plate or cover plate.
本案的第三實施例中,該多層複合板材結構1包含:
In the third embodiment of this case, the multi-layer
多層紙層10,該多層紙層10可以是牛皮紙、漂白紙、或回收紙等各種的紙層。較佳者,該多層紙層10應用再生材料所製造。
The
多層PE膜層20,其中該多層紙層10與該多層PE膜層20交錯配置,該多層PE膜層20熱熔後熱壓可與該多層紙層10結合(圖4A)。
The multi-layer
也可以該多層紙層10與該多層PE膜層20之間應用黏膠30結合(圖4B)。
至少一層廢紙層50(如圖4A及4B所示),係由眾多之廢紙集合形成的層板。其中該廢紙層50為一般利樂包的廢材所形成者。利樂包係為紙層及PE
膜層集合成的包裝材料,使用極廣,因此廢材的數量也很龐大。這些廢紙可以用膠合材料(如上述之PE膜層、樹脂或一般的膠合材料均可)黏合。
At least one waste paper layer 50 (shown in FIGS. 4A and 4B ) is a laminate formed by a collection of many waste papers. Wherein the
本案中該廢紙層50可以插入於交錯配置的該多層紙層10與該多層PE膜層20之間。
In this case, the
如圖5A及5B所示,本案中該廢紙層50可以插入於交錯配置的該多層紙層10與該多層PE膜層20的外表面。在此情況下,該廢紙層50可具有相當花俏的樣貌,而增進本案之層板的美觀。其中圖5A係以熱熔後熱壓的該多層PE膜層20作為黏合之用,圖5B係以該黏膠30作為黏合之用。
As shown in FIGS. 5A and 5B , in this case, the
同樣地,如圖6A及6B所示,在本實施例中,可以在該多層紙層10與該多層PE膜層20可另外與至少一層鋁箔板40交錯配置(該鋁箔板40也可以配置在最外層),並以熱熔後熱壓的該多層PE膜層20(圖6A)或該黏膠30(圖6B)與其他板材黏合。該鋁箔板40的主要作用在於防水及防水氣,使得水或者水氣可以被隔離。
Similarly, as shown in FIGS. 6A and 6B , in this embodiment, the
本第三實施例的主要是作為建材用,譬如作為裝潢板、傢俱板(如桌椅、沙發、櫥櫃等類型)、地板(木地板)或系統櫃的板材,也可以作為PCB(印刷電路板業)的鑽孔墊板或上蓋板。 The third embodiment is mainly used as a building material, such as a decorative board, a furniture board (such as tables and chairs, sofas, cabinets, etc.), a floor (wood floor) or a board of a system cabinet, and can also be used as a PCB (printed circuit board). industry) drilling backing plate or cover plate.
本案的優點為整體的結構所使用的膠或熱熔膠不含甲醛,可作為無甲醛板材,所以不會對人體產生危害。再者對於上述的製作材料可以大量地使用再生材,整體成本較為低廉,再者紙層、廢紙層及PE膜層均可再製再利用,所以對環境衝擊較低,可以達到環保的目的。另外這些均使用相當輕質的材料,所以整體的重量不大,因此搬運容易、施工也方便。 The advantage of this case is that the glue or hot melt adhesive used in the overall structure does not contain formaldehyde and can be used as a formaldehyde-free sheet, so it will not cause harm to the human body. Furthermore, for the above-mentioned production materials, a large number of recycled materials can be used, and the overall cost is relatively low. Moreover, the paper layer, the waste paper layer and the PE film layer can be recycled and reused, so the impact on the environment is low, and the purpose of environmental protection can be achieved. In addition, these are made of fairly lightweight materials, so the overall weight is not large, so it is easy to carry and construct.
綜上所述,本案人性化之體貼設計,相當符合實際需求。其具體改進 現有缺失,相較於習知技術明顯具有突破性之進步優點,確實具有功效之增進,且非易於達成。本案未曾公開或揭露於國內與國外之文獻與市場上,已符合專利法規定。 To sum up, the humanized and considerate design of this case is quite in line with the actual needs. its specific improvements Compared with the prior art, the existing deficiencies obviously have the advantages of breakthrough progress, and indeed have the improvement of efficacy, and it is not easy to achieve. This case has not been disclosed or disclosed in the domestic and foreign literature and markets, and has complied with the provisions of the Patent Law.
上列詳細說明係針對本創作之一可行實施例之具體說明,惟該實施例並非用以限制本創作之專利範圍,凡未脫離本創作技藝精神所為之等效實施或變更,均應包含於本案之專利範圍中。 The above detailed description is a specific description of a feasible embodiment of this creation, but this embodiment is not intended to limit the patent scope of this creation. within the scope of the patent in this case.
1:多層複合板材結構 1: Multilayer composite sheet structure
10:多層紙層 10: Multiple layers of paper
20:多層PE膜層 20: Multilayer PE film layer
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