M309753 八 、新型說明： 【新型所屬之技術領域】 本新型是有關於—種磨針機，特別是指—種可利用電 -來调整、控制之可電控調整之磨針機。 【先前技術】 在晶圓被製造完成之後，需對晶圓進行各種不同之電 參數或功能之測試，以判斷 朴，、、上 彳丨w展出之晶圓的品質好壞， 猎此過濾其成品或半成品， . 、准持下一階段製程作業之 =率’或者保證其出貨時之產品皆具有一定水準之品 二存=此測試作業對於IC產業而言確實有其重要的實質意 ㈣:產業之測試作業是藉由-探針卡(P-e 盘複數iir i，該探針卡1包括有一電路板11 :、稷數連接於該電路板u的探針12。該等探針12各自呈 、、、田針狀且含有鎢、鋅箄+屬 鏢等金屬成勿，並具有一與該電路板u 連接之連接端121，以及一 土袁雜兮、4山 。 通離忒連接知121之接觸端122 2行晶圓測試時，該探針卡！上之每一接觸端122 ^ 日日粒上的電極墊相互對應，同時，每一 :Γτ:相對應之連接端⑵，— 钦度Τ ’以使母一板輕牡 衣針12皆能準確且平均地與晶圓上之 母顆a日粒的電極墊做電 、炎U 接觸而騎不同之電性準位 乡數或功月6等種種測試。 然而’為使在該探針卡^進行測試之前，每一根探針 M309753 12的接觸端122到其連接端⑵之距離都相同，且使每一 接觸端122具有一定程度的平坦度，故必須對該等探針12 之接觸端122進行研磨，使該探針卡1上之每-接觸端122 皆在同一平面上。 般。兒來，心針卡1上之每一接觸端】22的研磨作業 ’皆是—操作人員手持砂紙，來對各接_ 122進行研磨 、。由於各探針12是呈細針狀，且-探針卡！上-般皆設置 為數眾夕之探# 12’故一工作人員在一一研磨其接觸端 122時’必須聚精會神且小心謹慎地進行研磨，以使每一接 觸端122可達同-平面，非常地耗時且勞心費力。 -’其母-刻所承受的研磨力量，以及研磨角度等皆互有 不同’因此常使得該等複數探針12的接觸端122無法均句 地被研磨，進而不能呈同一平面；且由於該等探針Η是呈 細針狀’-旦操作人員研磨時猶有不甚’就很容易地致使 各探針12因不當受力而歪折，影響到了整張探針卡丄之測 試_，倘若探針12 f折地太過嚴重，將無法被用於測 試作業，於是製造商又得購f新的探針卡1來進行晶圓測 試作業，也因此增加了成本。 比但是’手工操作的研磨方式，並無法使各接觸端122 皆以相同之角度而被研磨，而且操作人員亦不能精準地控 制其研磨之力道，因此，對於該等探針12之接觸端122而 有鑑於此，在_ IC產業發展蒸蒸日上，晶圓測試作 業的精準度更為要求之同時，如何快速又精準地研磨一探 針卡上之各接觸端，以準確地測量出晶圓的各項功能與參 M309753 數即已成為目前各相關業者亟思改善之處。 【新型内容】 因此，本新型之目的，即在提供一種可研磨—探針卡 上之複數探針的可電控調整之磨針機。 於是，本新型可電控調整之磨針機包含一圍繞界定出 一容置空間的基座、一設置於該基座上並開設有一與該容 置空間相連通之開口且使其上之探針卡的複數探針經由^ 開口而朝向該容置空間的承載板，一設置於該容置空間中x 且包括有一動力單元而可研磨該等探針之研磨裝置，以及 -與該動力單元電連接而可控制該動力單元的啟閉與轉 速度的控制面板。 ~ 藉由本新型可電控調整之磨針機，將可使上述之以人 工方式進行的探針接觸端研磨作業，改以機器來執行，而 可使各接觸端能被更精準地被研磨，有助於提高後續測試 作業之準確性，同時降低廠商之人事與工時成本。、 【實施方式】 有關本新型之前述及其他技術内容、特點與功效，在 以下配合參考圖式之一較佳實施例的詳細說明中，將可清 楚的呈現。 參閱圖2,本新型可電控調整之磨針機2之較佳實施例 包含有一基座3、一承載板4、一研磨裝置5，以及一控制 面板6。 該基座3是撐立於一平面，並圍繞界定出一容置空間 31。該承載板4是設置於該基座3上，且該承載板4開設 M309753 有一與該容置空間相連通之開口 41。 參閱圖3、4’該研磨裝置5是設置於該基座3之容置 空間3 1中’並包含有'一固定座51、一設置於该固定座51 上的運動單元52、一與該運動單元52連接並可驅動其旋轉 的動力單元53、一固定於該運動單元52上的真空腔體54 ，及一位於該真空腔體54上的磨針板55。 該固定座51被固定於該容置空間31中的最底部，並 與該基座3連接。該運動單元52具有一位於該固定座51 上的第一導向板521、一設置於該第一導向板521上並可相 對該第一導向板521左右移動的第二導向板522，及一設置 於該第二導向板522上並可相對該第二導向板522前後移 動的第三導向板523。該動力單元53是與該第一導向板 521的一端栓套在一起，並具有一偏心轉輪531，且該偏心 轉輪531的輸出端與該第三導向板523的一端連接在一起 〇 配合參閱圖5,該真空腔體54固定於該第三導向板 523上’且其表面上形成有一向下凹陷的外環槽道541、一 向下凹陷並被該外環槽道541圍繞於内的内環槽道542、二 連通該外環槽道541與該内環槽道542的導流槽道543、二 形成於該真空腔體54表面上的定位孔544、一開設於該外 %槽道541上的吸附孔545，及八個環設於該真空腔體54 面上且了供螺絲鎖固的鎖孔5 4 6。其中，該吸附孔5 4 5 是以抽真空的方式，將該外環槽道541、該内環槽道542， 8 M309753 及該二導流槽道543内的空氣抽出，以使該磨針板55吸附 於該真空腔體54上，而該複數鎖孔546可供螺絲鎖固於該 第三導向板523上。 在此，應注意的是，本實施例之真空腔體5 4的表面上 是具有一外環槽道541、一被該外環槽道541包圍的内環槽 道542，但實際實施時也可以僅具有該外環槽道541，藉由 該吸附孔545之真空吸力，同樣可使該磨針板55吸附於該 真空腔體54上，業者可依實際狀況加以變更，並不限於本 說明書中所揭露。 該磨針板55位於該真空腔體54上，並具有一上表面 551、一相反於該上表面551的下表面552，及二沿該下表 面552向下延伸之定位插銷553。該上表面551是一具有極 佳平坦度的光滑表面，該二定位插銷553可插入該二定位 孔544内，以固疋該磨針板55被吸附於該真空腔體54上 時的位置，而該下表面552是與該真空腔體54之表面相互 頂抵’且被該吸附孔545所吸附。 參閱圖6，該控制面板6是被裝設在該基座3上，並包 括有-電源開關單& 61、一自動操作系统62、一移距切換 件63、一顯不單元64、一手動操作系統Μ、一操作切換件 66，以及一停機件67。 。亥私源開關單元61是用以控制一外來電流是否通過該 研磨破置5之動力單70 53，並在-『ON』肖『OFF』兩標 丁（圖未不）之間扳動。該自動操作系統62是用以自動化地 操作該磨斜缸μ #丄 也 ，並具有一用以設定一研磨程式之設定件 9 M3 09753 ΌΔ 1 " π M钒仃该程式之執行件622，一用 、式之卜止件623，—用以將圖5中所示之該磨針板 回歸至最低點之原點轉件吻，—用以使該磨針板Μ 升件625，一用以使該磨針板55下降之下降件 件627及用以圮憶該磨針板55之特定位置的座標重置 該移距切換件63是用以控制該磨針板55每次移行之 單：距離並Γ『χ1〇』與『x100』兩標示之間板動。該顯 以以顯示料探針被研磨的程度與時間。該手 動刼作糸統65是具有一可調整該磨針板55之位置的調位 轉盤651。該操作切換件66是用以在手動與自動操作模式 之間進：切換，並在一『自動』與『手動』兩標示之間扳 動。该停機件67是用以使該研磨裝置5之動力單元53停 止運轉。 依據上述架構，並同時參閱圖6與圖7以說明圖2所 示之該磨針機2的動作原理。如圖7所示’該探針卡7具 有^一電路板71，及複數與該電路板71連接之細微探針η ’該研磨裝置5主要是用以研磨該探針卡7上之複數探針 …以使每-根探針72的針尖部位龍電路板η的長度 皆相同。 當一操作人員欲研磨該複數探針72 _，則先將該探針 卡7固定於該承載板4上，以使該複數細微探針72經由該 開口 41而朝向該容置空間31，繼而確認該控制面板6上之 電源開關單元61是指向『⑽』處。且操作人員亦需先確認 10 M3 09753 磨針板55的升降動作，當 換件66 『x動#作系統62來操控；當該操作切 ' 疋θ β手動』標示時，則該磨針板55的升降動 貝成:動拉式，亦即是藉由該手動操作系統65來操控。 ，手動Μ式之下，操作人員僅f調轉該手動操作系統^之 :周位轉盤651，即可逐步升降該磨針板&而以下則以當 A作切換件66是指向『自動』標示的自動模式來繼續說 明0 刼作人貝可先藉由該設定件621來設定所需使用之如 研磨時間、速度等各項參數，以建立—研磨程式；而此程 式亦可於之前就先行建立並儲存。然後，按下該執行件似 ，即可使該研磨程式開始執行，並使該動力單元Η開始運 轉。 。 當該動力單元53運轉時，會帶動該偏心轉輪531旋轉 ，並同時驅動該第二、三導向板522、523分別作左右及前 後方向的板塊移動。由於該偏心轉輪53丨是作圓形旋轉， 構成此一圓的任一點上可晝出切線的斜率，在數學上利用 此斜率便可求得橫向座標及縱向座標分別所代表值的大小 。在本較佳實施例中，便是將該橫向座標的值以該第二導 向板522左右方向的板塊移動量來表示，而該縱向座標的 值以該第三導向板523前後方向的板塊移動量來表示，其 差別只在於移動時位移量的大小而已。當該偏心轉輪5 3 1 不斷地改變在此一圓上的位置，便可使該第二、三導向板 11 M309753 522、523不斷地作左右及前後方向的板塊移動，從而達到 使設置於該第三導向板523上的真空腔體54作定向的圓周 運動。然後，再藉由該真空腔體54以真空吸附的形式，將 該磨針板55吸附於其上，便可使該磨針板55依圓形的運 轉軌道不斷地運轉，以研磨該探針卡7上的複數探針72。 值得一提的是，由於該磨針板55之上表面551是非常 平坦且光滑，所以一般業界在進行磨針之前，會於該磨針M309753 VIII, new description: [New technology field] This new type is related to a kind of grinding machine, especially refers to a type of grinding machine that can be adjusted and controlled by electric control. [Prior Art] After the wafer is manufactured, it is necessary to test various electrical parameters or functions of the wafer to judge the quality of the wafers exhibited by Park, and Shangyu. The finished product or semi-finished product, . . , the next stage of the process operation rate = or to ensure that the products at the time of shipment have a certain level of product two deposits = this test operation for the IC industry does have its important meaning (4): The test operation of the industry is performed by a probe card (Pe disk plural iir i, the probe card 1 includes a circuit board 11: a number of probes 12 connected to the circuit board u. The probes 12 Each of them is in the shape of a needle, and contains a tungsten, a zinc crucible, a metal such as a dart, and has a connecting end 121 connected to the circuit board u, and a earthy mixed pottery, 4 mountains. When the contact end 122 of the 121 is tested in 2 rows of wafers, the electrode pads on each of the contact terminals 122 ^ on the probe card correspond to each other, and each: Γτ: the corresponding connection end (2), — 钦度Τ 'In order to make the mother's board light can be accurately and evenly on the wafer The electrode pads of the mother particles a day are used for electricity, inflammation, U contact, riding different electrical standards, or various tests such as power month 6. However, in order to make the probe card test, each probe The distance from the contact end 122 of the needle M309753 12 to the connection end (2) is the same, and each contact end 122 has a certain degree of flatness, so the contact end 122 of the probe 12 must be ground to make the probe Each of the contact ends 122 on the card 1 is on the same plane. Generally, the grinding operation of each contact end on the PIN card 1 is 22 - the operator holds the sandpaper to connect the _ 122 Grinding, because each of the probes 12 is in the shape of a thin needle, and the probe card is generally set to a number of eves. #12', a staff member must grind one at a time when grinding the contact end 122 Carefully and carefully, so that each contact end 122 can reach the same plane, which is very time consuming and laborious. - The grinding force and the grinding angle of the mother-engraving are different from each other. Often, the contact ends 122 of the plurality of probes 12 are not uniformly ground. However, the probes are not in the same plane; and because the probes are in the shape of a thin needle, the operator may have caused the probe 12 to die due to improper force, which affects the whole Test of the probe card _, if the probe 12 f is too severe, it will not be used for testing, so the manufacturer has to purchase a new probe card 1 for wafer testing, and therefore The cost is increased. However, the 'manually operated grinding method does not allow the contact ends 122 to be ground at the same angle, and the operator cannot precisely control the grinding force. Therefore, for the probes 12 In view of this, in the development of the _IC industry, the accuracy of the wafer test operation is more demanding, how to quickly and accurately grind the contact ends on a probe card to accurately measure The functions of the wafer and the number of M309753 have become the improvement points of the relevant industry. [New content] Therefore, the object of the present invention is to provide an electronically controllable grinding machine capable of grinding a plurality of probes on a probe card. Therefore, the novel electronically adjustable grinding machine comprises a base surrounding an accommodating space, a louver disposed on the pedestal and opening an opening communicating with the accommodating space a plurality of probes of the needle card are oriented toward the accommodating space of the accommodating space, a grinding device disposed in the accommodating space x and including a power unit to grind the probes, and the power unit A control panel that is electrically connected to control the opening and closing and rotation speed of the power unit. ~ With the new electronically controllable grinding machine, the above-mentioned manual probe end grinding operation can be performed by the machine, so that the contact ends can be ground more accurately. It helps to improve the accuracy of subsequent test operations while reducing the personnel and working hours of the manufacturer. [Embodiment] The foregoing and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments. Referring to Figure 2, a preferred embodiment of the electronically adjustable needle machine 2 of the present invention includes a base 3, a carrier plate 4, a grinding device 5, and a control panel 6. The pedestal 3 is supported on a plane and defines an accommodating space 31. The carrier plate 4 is disposed on the base 3, and the carrier plate 4 is opened M309753 has an opening 41 communicating with the receiving space. Referring to Figures 3 and 4, the polishing apparatus 5 is disposed in the accommodating space 31 of the susceptor 3 and includes a fixed base 51, a moving unit 52 disposed on the fixed base 51, and the like. The moving unit 52 is connected to and can drive the rotating power unit 53, a vacuum chamber 54 fixed to the moving unit 52, and a grinding plate 55 on the vacuum chamber 54. The fixing base 51 is fixed to the bottom of the accommodating space 31 and is connected to the base 3. The moving unit 52 has a first guiding plate 521 disposed on the fixing base 51, a second guiding plate 522 disposed on the first guiding plate 521 and movable left and right relative to the first guiding plate 521, and a setting A third guiding plate 523 is disposed on the second guiding plate 522 and movable forward and backward relative to the second guiding plate 522. The power unit 53 is sleeved with one end of the first guiding plate 521 and has an eccentric rotating wheel 531. The output end of the eccentric rotating wheel 531 is coupled with one end of the third guiding plate 523. Referring to FIG. 5, the vacuum chamber 54 is fixed to the third guiding plate 523' and has a downwardly recessed outer ring channel 541 formed on the surface thereof, a downward recessed and surrounded by the outer ring channel 541. An inner ring channel 542, two guiding channels 543 connecting the outer ring channel 541 and the inner ring channel 542, and two positioning holes 544 formed on the surface of the vacuum cavity 54 are opened in the outer % slot. The adsorption hole 545 on the track 541, and the eight rings are disposed on the surface of the vacuum chamber 54 and have a locking hole 546 for screw locking. The adsorption hole 545 is extracted by vacuuming the outer ring channel 541, the inner ring channel 542, 8 M309753 and the air in the two flow guiding channel 543 to make the grinding pin The plate 55 is adsorbed on the vacuum chamber 54 , and the plurality of locking holes 546 are screwed to the third guiding plate 523 . Here, it should be noted that the surface of the vacuum chamber 54 of the present embodiment has an outer ring channel 541 and an inner ring channel 542 surrounded by the outer ring channel 541, but in practice, The outer ring channel 541 can be provided. The vacuum suction force of the adsorption hole 545 can also be used to adsorb the needle plate 55 to the vacuum chamber 54. The manufacturer can change the actual condition, and is not limited to the present specification. Revealed in the article. The needle plate 55 is located on the vacuum chamber 54 and has an upper surface 551, a lower surface 552 opposite to the upper surface 551, and two positioning pins 553 extending downward along the lower surface 552. The upper surface 551 is a smooth surface having excellent flatness, and the two positioning pins 553 can be inserted into the two positioning holes 544 to fix the position when the grinding needle plate 55 is adsorbed on the vacuum chamber 54. The lower surface 552 is abutting against the surface of the vacuum chamber 54 and is adsorbed by the adsorption hole 545. Referring to FIG. 6, the control panel 6 is mounted on the base 3 and includes a power switch unit & 61, an automatic operating system 62, a shift switch 63, a display unit 64, and a display unit. A manual operating system, an operating switching member 66, and a stop 67 are provided. . The private source switching unit 61 is for controlling whether or not an external current passes through the power unit 70 53 of the grinding break 5 and is moved between the two labels "OFF" and "OFF". The automatic operating system 62 is configured to automatically operate the honing cylinder μ#, and has a setting member 9 M3 09753 ΌΔ 1 " π M vanadium 仃a use type, a stop member 623, for returning the grinding needle plate shown in FIG. 5 to the lowest point of the origin switch, for use in the grinding needle plate lifting member 625, Resetting the shifting member 63 with the lowering member 627 for lowering the grinding needle plate 55 and the coordinates for recalling the specific position of the grinding needle plate 55 is for controlling the movement of the grinding needle plate 55 each time. : Distance between "Γ1〇" and "x100" is marked. This is shown to show the extent and timing of the material probe being ground. The manual operation system 65 has an adjustment dial 651 that adjusts the position of the grinding needle plate 55. The operation switching member 66 is used to switch between the manual and automatic operation modes and to switch between the "automatic" and "manual" indications. The stopper 67 is for stopping the operation of the power unit 53 of the polishing apparatus 5. According to the above structure, and referring to Figs. 6 and 7, the principle of operation of the grinding machine 2 shown in Fig. 2 will be explained. As shown in FIG. 7 , the probe card 7 has a circuit board 71 and a plurality of micro probes η connected to the circuit board 71. The grinding device 5 is mainly used for grinding the complex probes on the probe card 7. The needles are so long that the length of the tip board portion η of each probe 72 is the same. When an operator wants to grind the plurality of probes 72 _, the probe card 7 is first fixed on the carrier plate 4 such that the plurality of micro-probes 72 face the accommodating space 31 via the opening 41, and then It is confirmed that the power switch unit 61 on the control panel 6 is pointing to "(10)". And the operator must first confirm the lifting action of the 10 M3 09753 grinding needle plate 55. When the replacement 66 is operated by the system 62; when the operation is cut, 疋θ β manual, the grinding needle plate is used. The lifting and lowering of 55 is: moving type, that is, being controlled by the manual operating system 65. Under the manual Μ mode, the operator only adjusts the manual operating system ^: the weekly turntable 651, the gradual lifting of the grinding needle plate & and the following is when the A switching device 66 is pointing to the "automatic" mark Automatic mode to continue to explain 0 刼 贝 贝 先 先 先 621 621 621 621 621 621 621 621 621 621 621 621 621 621 621 621 621 621 621 621 621 621 621 621 621 621 621 621 621 621 621 621 621 621 621 621 621 621 621 Create and store. Then, by pressing the actuator, the grinding program is started and the power unit is started to operate. . When the power unit 53 is in operation, the eccentric wheel 531 is rotated, and the second and third guide plates 522 and 523 are simultaneously driven to move the plates in the left and right and front and rear directions, respectively. Since the eccentric wheel 53 is circularly rotated, the slope of the tangent can be drawn at any point of the circle, and the slope can be used mathematically to determine the magnitude of the value represented by the lateral coordinate and the longitudinal coordinate, respectively. In the preferred embodiment, the value of the lateral coordinate is represented by the amount of plate movement in the left-right direction of the second guide plate 522, and the value of the longitudinal coordinate is moved by the plate in the front-rear direction of the third guide plate 523. The quantity is expressed, the difference is only the amount of displacement when moving. When the eccentric wheel 5 3 1 continuously changes the position on the circle, the second and third guiding plates 11 M309753 522, 523 can continuously move the plates in the left and right and the front and rear directions, thereby achieving the setting. The vacuum chamber 54 on the third guide plate 523 is oriented in a circular motion. Then, the needle plate 55 is adsorbed on the vacuum chamber 54 by vacuum adsorption, so that the needle plate 55 can be continuously operated in a circular running track to grind the probe. A plurality of probes 72 on the card 7. It is worth mentioning that since the upper surface 551 of the grinding needle plate 55 is very flat and smooth, the industry generally uses the grinding needle before grinding the needle.
板55之上表面551上貼覆一小片砂紙8，該複數探針μ便 是於該砂紙8上進行磨針的動作，且因為該砂紙8表面上 平均分布有許多細微的研磨顆粒，隨著該複數探針72被逐 漸磨平，會在該砂、紙8上留下_圈圈圓形的磨針痕跡。再 者，由於該真空腔體54是定向地水平移動，所以該探針卡 7上的每一根騎72被摩擦到的距離皆㈣，故每一根探 針72從被摩擦的針尖到該電路板71的長度是平均且一致 的。 又上表面551在製造初期 便被要求有極佳的水平準位與平坦度，料現今工蔽技術 來說要達成並不困難；再者，該磨針板55是以真空:附的 方式而被固定，因此可使應力平 十均政佈，而可避免該磨針 板55之上表面551產生變形 〜里進而維持該磨針板55上 表面551之平坦度。根據本宰 一 系則作人實作的結果得知，以 一具有相同平坦度的磨針板55 A^ ^ “ 為刖提，使用真空吸附方式 的磨針板55其變形量可維持在 心— 内。所以，以太新 i磨針機3之研磨裝置5所進杆 吓運仃研磨的探針卡7，可讓每一 12 M309753 的長度是平均且 根探針72從被摩擦的針尖到該電路板η 呈一致性。 在研磨作業的進行 仃迺私中该操作人員可視其實際需 求，而調整該磨針板55的古疮w 的n度，例如可按壓該上升件625 而使該磨針板55上升，或是按壓該下降件而使該磨針 反55下降’而該等探針被研磨的程度與時間，皆可藉由該 顯示單元64之顯示而得知。 但在調整該磨針板55的高度之前，該操作人貝亦須視 八需求而確定該移距切換件63的指向；當其指向『χ iq』， 即表示按壓該上升件6 # π u女 料625與該下降件626將使該磨針板55 在單位時間内以短距離移動，當其指向『X _』，即表示該 磨針板55在單位時間内以長距離移動。另外，當該操作人 貝臨時欲研磨另-探針卡7時，則可按壓該座標重置件⑵ ’以使進打前-張探針卡7之研磨作㈣磨針板Μ位置可 被記憶。再者，當按壓該原點回歸件_日夺，即可使該磨 針板55直接回歸至最低點之位置，因此該操作人員並不需 要持續地按壓該下降件626。 另外，不論本新型可電控調整之磨針機2是處在自動 模式或是手動模式，若是該磨針板55失控地位移時，則可 立即按壓該停機件67，使得該研磨裝置5之動力單元兄停 止運轉，及可使該磨針板55停止位移。 由此可知，本新型可電控調整之磨針機2具有以下各 優點： 1)進行晶圓測試作業時，各探針72之針尖到該電 13 M309753 路板71可為一致·· 田於該複數探針72㈣附在該磨針板55之上表 面:51上的該砂紙8上進行磨針的動作，且該磨針板 55是被真空吸附地固定在該真空腔體μ上，並使該真 ^腔體54是定向地水平移動，因此該探針卡7上的每 T針72被摩擦到的距離皆相同，使得每—根探針 72從被摩擦的針尖到該電路板71的長度是平均且—致 :故以利用本新型可電控調整之磨針機2完成研磨之 抓針卡7進行晶圓測試作業，可更精確地測量出各晶 粒：各電性參數’減少測試作業之失誤，而得知廠商 在完成一製程時所應有的良率值。 (2)減少該複數探針72毀損·· 土承上所述，由於該複數探針72在被研磨時是平均 地靠抵在該磨針板55上之砂紙8，因此並不會有特定 的探針72承文特別大的力量而變形或斷裂，維持該 複數探針72的完整性，減少該探針卡7的損耗，節省 成太。 (3 )操控簡便： 本新型可電控調整之磨針機2的控制面板6是用 以供一操作人員操控，同時該控制面板6之設計，是 可讓該操作人員自行選擇自動或手動模式，而其中: 疋件之功能設置亦非常人性化，使用起來非常方便， 谷易上手。 知納上述，本新型可電控調整之磨針機2，主要是藉由 14 M309753 該控制面板6來控制該研磨裝置5之作動，使得一操作人 貝可簡便地以本新型可電控調整之磨針機2完成探針卡7 之探針研磨作業；再者，該磨針板55是被真空吸附地固定 住且被定向地水平帶動，故只要藉由該控制面板6來調整 該磨針板55之上下位置以及研磨速度，即可精準地研磨該 專探針7 2。 l'隹以上所述者，僅為本新型之較佳實施例而已，當不 | 能以此限定本新型實施之範圍，即大凡依本新型申請專利 乾圍及新型說明内容所作之簡單的等效變化與修飾，皆仍 屬本新型專利涵蓋之範圍内。 【圖式簡單說明】 圖1是一般探針卡的側視剖面示意圖，說明其中各構 件之相對關係； 圖2是本新型可電控調整之磨針機的一較佳實施例之 立體示意圖，說明其中各大部構件之相對位置與連結關係 » 圖3是圖2中該較佳實施例的一研磨裝置之立體分解 不意圖，說明其中之細部構件的相對位置； 圖4疋圖3中該研磨裝置的立體組合示意圖，說明其 細部構件組合後之型態； 圖5是圖3中該研磨裝置之一真空腔體與一磨針板的 立體分解示意圖，說明兩者之相對位置； 圖6是本新型可電控調整之磨針機之該較佳實施例的 -控制面板的示意圖，說明其各元件之位置關係；及 15 M309753 圖7是該較佳實施例研磨一塊探針卡的剖視示意圖， 說明該偵測卡上之複數探針被研磨。 16 M309753A small piece of sandpaper 8 is attached to the upper surface 551 of the plate 55, and the plurality of probes are used for the grinding of the sandpaper 8, and since the surface of the sandpaper 8 is evenly distributed with many fine abrasive particles, The plurality of probes 72 are gradually smoothed, leaving a circle of grinding needle marks on the sand and paper 8. Moreover, since the vacuum chamber 54 is oriented horizontally, each rider 72 on the probe card 7 is rubbed by a distance (four), so each probe 72 is from the rubbed tip to the The length of the circuit board 71 is average and uniform. The upper surface 551 is required to have excellent level and flatness at the beginning of manufacture, and it is not difficult to achieve the current machining technology; further, the needle plate 55 is vacuum: attached The fixing is performed, so that the stress can be flattened, and the surface 551 of the grinding needle plate 55 can be prevented from being deformed to maintain the flatness of the upper surface 551 of the grinding needle plate 55. According to the results of the actual work of the first slaughter, it is known that a grinding needle plate 55 A ^ ^ " with the same flatness is used for lifting, and the amount of deformation of the grinding needle plate 55 using the vacuum adsorption mode can be maintained in the heart - Therefore, the grinding device 5 of the Either i Grinding Machine 3 is fed to the polished probe card 7, so that the length of each 12 M309753 is average and the root probe 72 is from the rubbed tip to the The circuit board η is uniform. In the smuggling operation of the grinding operation, the operator can adjust the n degree of the ancient sore w of the grinding needle plate 55 according to the actual needs thereof, for example, the rising member 625 can be pressed to make the grinding The needle plate 55 is raised, or the lowering member is pressed to lower the grinding needle 55, and the extent and time during which the probes are polished can be known by the display of the display unit 64. Before the height of the needle plate 55, the operator must also determine the direction of the shift switch 63 according to the eight requirements; when it points to "χ iq", it means pressing the riser 6 #ππ女料625 and The lowering member 626 will cause the grinding needle plate 55 to move at a short distance per unit time, when Pointing to "X_" means that the grinding needle plate 55 is moved by a long distance per unit time. In addition, when the operator temporarily wants to grind the other probe card 7, the coordinate resetting member (2) can be pressed. In order to make the grinding of the pre-expansion probe card 7 (4), the position of the grinding needle plate can be memorized. Further, when the origin returning piece is pressed, the grinding needle plate 55 can be directly returned to the minimum. The position of the point, so the operator does not need to continuously press the lowering member 626. In addition, regardless of the novel electronically adjustable needle grinding machine 2 is in the automatic mode or the manual mode, if the grinding needle plate 55 is out of control When the ground is displaced, the stopping member 67 can be pressed immediately, so that the power unit of the grinding device 5 stops running, and the grinding needle plate 55 can be stopped. Thus, the novel electronically adjustable grinding machine can be known. 2 has the following advantages: 1) When performing a wafer test operation, the tip of each probe 72 can be consistent with the electric 13 M309753 road plate 71. The plurality of probes 72 (four) are attached to the grinding needle plate 55. Surface: The sandpaper 8 on the 51 performs the action of grinding the needle, and the grinding needle plate 55 The vacuum chamber body is vacuum-adhered and the horizontal cavity 54 is horizontally moved, so that each T-pin 72 on the probe card 7 is rubbed to the same distance, so that each - The length of the root probe 72 from the tip of the rubbed needle to the circuit board 71 is averaged and the wafer pick-up card 7 is finished by the grinding machine 2 that can be electrically controlled by the present invention. More accurate measurement of each grain: each electrical parameter 'reduces the error of the test operation, and knows the yield value that the manufacturer should have when completing a process. (2) Reduce the damage of the complex probe 72·· As described above, since the plurality of probes 72 are evenly pressed against the sandpaper 8 on the grinding needle plate 55 when being ground, there is no specific deformation of the probe 72 due to the particularly large force. The rupture maintains the integrity of the plurality of probes 72, reducing the loss of the probe card 7, and saving the stagnation. (3) Simple control: The control panel 6 of the novel electronically adjustable grinding machine 2 is used for an operator to control, and the control panel 6 is designed to allow the operator to select an automatic or manual mode. Among them: The function setting of the piece is also very user-friendly, it is very convenient to use, and Gu Yi is easy to use. Knowing the above, the novel electronically adjustable grinding machine 2 mainly controls the operation of the grinding device 5 by the 14 M309753 control panel 6, so that an operator can be easily adjusted by the present invention. The needle grinding machine 2 completes the probe grinding operation of the probe card 7; further, the grinding needle plate 55 is vacuum-adsorbed and is horizontally driven, so that the grinding machine is adjusted by the control panel 6. The upper and lower positions of the needle plate 55 and the grinding speed can precisely grind the special probe 72. l' 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 能 能 较佳 能 能 能 能 能 能 能 能 能 能 能 能 能 能Both effect changes and modifications are still covered by this new patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a side cross-sectional view of a general probe card illustrating the relative relationship of the components therein. FIG. 2 is a perspective view of a preferred embodiment of the electronically adjustable needle grinding machine. The relative position and the connection relationship of each of the major components are illustrated. FIG. 3 is a perspective exploded view of a polishing apparatus of the preferred embodiment of FIG. 2, illustrating the relative positions of the detailed members therein; FIG. FIG. 5 is a perspective exploded view of a vacuum chamber and a grinding needle plate of the polishing apparatus of FIG. 3, illustrating the relative positions of the two; FIG. 6 Is a schematic view of the control panel of the preferred embodiment of the electronically controllable grinding machine, illustrating the positional relationship of the components; and 15 M309753. FIG. 7 is a cross section of the probe card of the preferred embodiment. Referring to the schematic diagram, the plurality of probes on the detection card are ground. 16 M309753
【主要元件符號說明】 1 探針卡 544 11 電路板 545 12 探針 546 121 連接端 55 122 接觸端 551 2 可電控調整之磨 552 針機 553 3 基座 6 31 容置空間 61 4 承載板 62 41 開口 621 5 研磨裝置 622 51 固定座 623 52 運動單元 624 521 第一導向板 625 522 第二導向板 626 523 第三導向板 627 53 動力單元 63 531 偏心轉輪 64 54 真空腔體 65 541 外環槽道 66 542 内環槽道 67 543 導流槽道 7 定位子L 吸附？L 鎖孔 磨針板 上表面 下表面 定位插銷 控制面板 電源開關單元 自動操作系統 設定件 執行件 停止件 原點回歸件 上升件 下降件 座標重置件 移距切換件 顯示單元 手動操作系統 操作切換件 停機件 探針卡 17 M309753 71 電路板 8 砂紙 72 探針[Main component symbol description] 1 Probe card 544 11 Circuit board 545 12 Probe 546 121 Connection end 55 122 Contact end 551 2 Electronically adjustable grinding 552 Needle machine 553 3 Base 6 31 accommodating space 61 4 Carrier board 62 41 opening 621 5 grinding device 622 51 fixing seat 623 52 moving unit 624 521 first guiding plate 625 522 second guiding plate 626 523 third guiding plate 627 53 power unit 63 531 eccentric wheel 64 54 vacuum chamber 65 541 outside Ring channel 66 542 Inner ring channel 67 543 Guide channel 7 Positioner L adsorption? L Keyhole Grinding Plate Surface Lower Surface Positioning Pin Control Panel Power Switch Unit Automatic Operating System Setting Piece Actuator Stopper Origin Return Retrieval Falling Member Coordinate Reset Piece Shift Switching Display Unit Manual Operating System Operation Switching Displacement probe card 17 M309753 71 circuit board 8 sandpaper 72 probe
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