M3 09124 八、新型說明： 【新型所屬之技術領域】 本創作係有關於一種液晶模組，特別是指一種能提供液晶模組較佳散熱效 果之背光源，且能便利拼合組裝而提昇其製造、利用效率之液晶模組之拼合式 光源模組。 【先前技術】 習知液晶模組結構如第1圖所示，該液晶模組9〇包括有一液晶面板91、光 擴散板92及背光源93，其中該背光源93係由複數冷陰極管⑽^所組成，該 冷陰極管所投㈣光觸光擴散板92舰後進人舰晶面板91，以作為液晶模 組90的背光來源。 前述該習知液晶模組90所設之冷陰極管雖可提供背光來源，但由於冷陰極 管所呈現的色飽和錄低’對該液晶模組9Q所欲呈現較高之影像品質顯然形成 -種障礙。而為解決此問，乃有_發光二鋪(_來取代冷陰歸而作為液 晶模組之背光源，賴發光二極體所投射的光其色飽和錄冷陰極f為高，但 發光二極體的散熱錄差’料聚熱形成較高之溫度，對液晶面板的運作及壽 命將會造成辨’且發光二極_柄勻度也較差，若大為增加就二極體的 數里刀佈’也會增加其製作成本㈣符轉效益或不利市場辭。再者，由於 目前液晶模組所製成之電視或螢幕具有不同長寬比例之製作(如4 : 3或16 : 9 等），且其大小尺寸種類亦相當多，因此#液晶模組⑽進行裁切以製成不同比 例、尺寸之電視或螢幕時’乃造成相當液晶模組⑽材料之浪費，對其製造經濟 效益產生嚴重的影響，因此，如何針對發光二極體之應用於液晶模組，且能一 併解決其Μ及光均勻度問題，並兼顧其製造之經濟性，誠是業界或有智之士 應再進一步思考、努力突破之重要課題。 鑒於前職晶餘級紅.點及其結構輯上未輕狀事實，本案 5 M309124 創作人即著手研發構思其解決方案，希雜職出—種更具品及經濟性之 拼合式液n以服務社會大眾及促進此t之發展，遂歸時之顧而有本 【新型内容】 本I]作之目的係在提供_種液晶模組之拼合式光賴組，其制用拼合方 式來、、aH光—極體所作成之背光板，以提高液晶模組的姻率及減少浪費， 進而積極提昇液晶模組之製作經濟效益者。 、 »、，本_之再-目的係在提供_種液晶模蚊拼合式統難，其係利用發 光-極體作為背光源，以提高液晶模組之色飽和度，並具有極佳之散熱功能， . 進而積極提昇液晶模組之影像品質者。 · •★糊作之又-目的在於提供—魏晶模組之拼合式光賴組，其能有效提 南發光二極體之光均勻度而作為液晶模組最佳之背光源者。 本創作為達上述目_採用之技術手段，主要係包括有—背光散熱裝置， =背光散熱裝置包括有複數發光二極體晶片及一散熱板，該發光二極體晶片係 籲口又於為政熱板上’該發光二極體晶片的上方係設有一導電層，該散熱板係由複 數政熱板單元所組成，該散熱板單元的組接面係具有一凸部或凹部之設置，藉 違散熱板單7〇_成雜大面積之散熱板，錄驗上似有—散熱裝置。 本創作一種液晶模組之拼合式光源模組所採用之技術手段也可以包括有一 散熱板，該散熱板係由複數散熱板單元所組成，該兩相鄰的散熱板單元的組接 面具有相組接卡合機構，該散熱板單元上係進一步設有背光源。 茲為使貴審查委員對本創作之技術特徵及所達成之功效更有進一步之瞭 解與認識，謹佐以較佳之實施例圖及配合詳細之說明，說明如後： 6 M309124 【實施方式】 請參閱第2圖，本創作液晶模組1〇〇係包括有一液晶面板1〇、光擴散板20 及背光散熱裝置30 ;該光擴散板2〇係設於該液晶面板1〇的後繼部位，用以將 背光源的光擴散而作為該液晶面板1〇運作的光照來源，而該背光散熱裝置3〇 係設於該光擴散板20的後繼部位，該背光散熱裝置3〇係進一步包括有複數發M3 09124 VIII. New Description: [New Technology Field] This creation is about a liquid crystal module, especially a backlight that can provide better heat dissipation of the liquid crystal module, and can be easily assembled and improved. The split light source module of the liquid crystal module using efficiency. [Previous Technology] As shown in FIG. 1 , the liquid crystal module 9 includes a liquid crystal panel 91, a light diffusing plate 92, and a backlight 93. The backlight 93 is composed of a plurality of cold cathode tubes (10). According to the composition, the cold cathode tube casts (4) the light-light diffusing plate 92 and enters the ship crystal panel 91 to serve as a backlight source of the liquid crystal module 90. The cold cathode tube provided by the conventional liquid crystal module 90 can provide a backlight source, but the color saturation of the cold cathode tube is low. The image quality of the liquid crystal module 9Q is obviously formed. Kind of obstacle. In order to solve this problem, there is _ illuminating two shop (_ to replace the cold yin as the backlight of the liquid crystal module, the light projected by the luminescence diode is saturated with the cold cathode f, but the light is The heat dissipation of the polar body's heat builds a higher temperature, which will cause discrimination on the operation and life of the liquid crystal panel, and the light-emitting diode _ handle is also poorly formed. If it is greatly increased, the number of diodes is increased. Knife cloth' will also increase its production cost (4) to transfer benefits or adverse market words. Moreover, due to the current LCD module or screen made of different length to width ratio (such as 4: 3 or 16: 9 etc. ), and its size and size are also quite a lot, so when the #LCD module (10) is cut to make TVs or screens of different proportions and sizes, it is a waste of the material of the liquid crystal module (10), resulting in economical manufacturing benefits. Severe impact, therefore, how to apply the LED to the liquid crystal module, and to solve the problem of flaws and uniformity of light, and to take into account the economics of its manufacture, it is the industry or the wisdom of the people should further Thinking, hard work, breakthrough, important lesson In view of the fact that the predecessor's remnant level red dot and its structure are not light, the creator of the 5 M309124 in this case started to develop and conceive its solution, and he worked in a variety of products and economics. In order to serve the public and promote the development of this t, it is a matter of time to return to the future. [New content] The purpose of this I] is to provide a flat-type optical group of liquid crystal modules, which is manufactured by a combination method. , aH light-polar body made of backlight board, to improve the marriage rate of the liquid crystal module and reduce waste, and thus actively improve the economic efficiency of the production of the liquid crystal module., »,, this _ re-purpose is provided _ kinds of liquid crystal mold mosquito type is difficult, it uses the light-polar body as a backlight to improve the color saturation of the liquid crystal module, and has excellent heat dissipation function, and thus actively improve the image quality of the liquid crystal module · ·★ 糊 之 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - Up to the above objectives _ using the technical means, the main The system includes a backlight heat sink, and the backlight heat sink includes a plurality of light emitting diode chips and a heat sink. The light emitting diode chip is also on the hot plate of the light emitting diode. The heat dissipation plate is composed of a plurality of thermal plate units, and the assembly surface of the heat dissipation plate unit has a convex portion or a concave portion, and the heat dissipation plate is arranged to dissipate a large area. The board, the recording device seems to have a heat sink. The technical means used in the split light source module of the liquid crystal module may also include a heat sink, which is composed of a plurality of heat sink units, the two phases The assembly surface of the adjacent heat sink unit has a phase-bonding mechanism, and the heat-dissipating unit is further provided with a backlight. In order to enable the reviewing committee to further understand the technical features of the creation and the achieved effects. And the following is a description of the preferred embodiment and the detailed description, as explained below: 6 M309124 [Embodiment] Please refer to Figure 2, the liquid crystal module 1 includes a liquid crystal a plate 1 , a light diffusing plate 20 and a backlight heat sink 30; the light diffusing plate 2 is disposed at a subsequent portion of the liquid crystal panel 1 , for diffusing the light of the backlight as the light of the liquid crystal panel 1 The backlight heat sink 3 is disposed at a subsequent portion of the light diffusing plate 20, and the backlight heat sink 3 further includes a plurality of hairpins
光一極體日日片31、一電路層32、一散熱板35及一散熱裝1 ouo n钱-70一倒一 晶片31(LED Chip)係設於該電路層32之線路上，該發光二極體晶片31也可以 封裝形式設置；該電路層32後方係設有一絕緣層33，用以隔絕散熱板35與該 發光二極體31連結之電路層32 ;該散熱板35係設於該絕緣層沿之後繼部位， 作為熱ΐ之散熱，該散熱板35係包括有複數散熱板單元35〇，該散熱板單元35〇 係具有一凸部351及該凸部351相對應側之凹部祁2(請一併參閱第3Α圖），因 此相鄰之散熱板單元35Q可藉相鄰對應之凸部35卜凹部脱而加以拼合對接； 再者，-對邊框36係設於該組合之散熱板單元35〇兩側，該對邊框36相對該 政…、板單元350之-側係分別設有凹部361及凸部362,藉該邊框洲之凹部撕 及凸。Ρ 362可刀別組接於該散熱板單元35〇之凸部卜凹部脱，而對整體之 政熱板35加以定位，在較佳實施例中，該散熱板35係為金屬板材，用以提供 較佳之散熱功能，而該散熱板35之後方係設有該散熱裝置353(下詳述）。八 、如圖3Α所不’ θ述该絕緣層33係設於該散熱板單元上，該絕緣層肋 可=層狀或局轉方式而雜、印刷或塗布於該散熱板單元上；該電路層 ，係設於該絕緣層33上，藉以隔絕該散熱板35，如第^圖所示的絕緣層^ :層狀⑽魏_3切㈣前伽局部辦娜_層犯下方處， /電路層32錄錄熱板單元的兩側輸接面延伸，並繞設過 熱板早元350之凸部351及凹部，如士，叮你α 政 及凹0P 352如此’可使兩相鄰之散熱板單元350組接 以相互電路導接。之、·且接面及凸福1、凹部鍁上的電路層32也可 7 M3 09124 請一併參閱第3A、3B圖，該單一散熱板單元350上係設有二發光二極體31 ’ 乃包括有一紅光發光二極體313、綠光發光二極體314及藍光發光二極體315， 可以分別藉該紅光發光二極體313、綠光發光二極體314及藍光發光一極體315 的色彩調整而近一步組合成所需求的光源。 繼請參閱第4圖，該發光二極體晶片3丨的上方係設有一導電層34，當該發 光二極體晶片31發出光源至該導電層34時，將會產生光源繞射（Diffraction) 之如同球形的第一波前311，該第一波前311經傳導一段距離後相互交會形成擴 張之照射面積，並藉由該第一波前311之相互干涉而使發光二極體光源之照明 亮度相當均勻。在較佳實施例中，該導電層34之長度係大於發光二極體晶片31 上方出射面的長度。The light-pole body day 31, a circuit layer 32, a heat sink 35, and a heat-dissipating device 31 are mounted on the circuit layer 32, and the light-emitting diodes are disposed on the circuit layer 32. The electrode chip 31 can also be disposed in a package form. The circuit layer 32 is provided with an insulating layer 33 for insulating the circuit layer 32 connected to the light emitting diode 31. The heat sink 35 is disposed on the insulating layer. The heat dissipation plate 35 includes a plurality of heat dissipation plate units 35 具有 having a convex portion 351 and a concave portion 相对 2 corresponding to the convex portion 351 along the subsequent portion. (Please refer to FIG. 3 together), so that the adjacent heat dissipation plate unit 35Q can be folded and joined by the adjacent convex portions 35 and the concave portions; further, the pair of frame 36 is disposed on the combined heat dissipation plate. The two sides of the unit 35 are respectively provided with a concave portion 361 and a convex portion 362 opposite to the side of the board member 350. The concave portion of the frame is torn and convex. The 362 362 can be assembled to the convex portion of the heat sink unit 35, and the overall heat plate 35 is positioned. In the preferred embodiment, the heat sink 35 is a metal plate for A heat dissipation function is provided, and the heat dissipation device 353 is provided behind the heat dissipation plate 35 (described in detail below). 8. As shown in FIG. 3, the insulating layer 33 is disposed on the heat dissipating plate unit, and the insulating layer rib can be mixed, printed or coated on the heat dissipating plate unit in a layered or localized manner; The layer is disposed on the insulating layer 33, thereby isolating the heat dissipation plate 35, such as the insulation layer shown in the figure ^: layered (10) Wei _3 cut (four) front gamma local 娜 _ layer lie below, / circuit The layer 32 records the extension surface of the hot plate unit to extend, and surrounds the convex portion 351 and the concave portion of the hot plate early 350, such as 士,叮你α政和凹0P 352, so that the two adjacent heat dissipation The board units 350 are assembled to be electrically connected to each other. The circuit layer 32 on the junction and the surface of the recess and the recessed portion can also be 7 M3 09124. Please refer to FIGS. 3A and 3B together. The single heat sink unit 350 is provided with two light emitting diodes 31'. The invention comprises a red light emitting diode 313, a green light emitting diode 314 and a blue light emitting diode 315, which can respectively adopt the red light emitting diode 313, the green light emitting diode 314 and the blue light emitting pole The color adjustment of the body 315 is further combined into a desired light source. Referring to FIG. 4, a conductive layer 34 is disposed on the upper surface of the LED chip 3. When the LED chip 31 emits a light source to the conductive layer 34, a light source diffraction (Diffraction) is generated. Like the first wavefront 311 of the sphere, the first wavefront 311 is crossed by a distance to form an expanded illumination area, and the illumination of the LED source is interfered by mutual interference of the first wavefront 311. The brightness is fairly uniform. In a preferred embodiment, the length of the conductive layer 34 is greater than the length of the exit surface above the LED array 31.
繼請參閱第5圖，該導電層34係進一步設有一穿孔341，當該發光二極體 晶片31所發出之光源經由該導電層34之穿孔341產生單狹縫繞射之第二波前 312，由於該第二波前312係產生於該導電層34之穿孔341上方，因此該第二 波前312與第一波前311使光源完成擴張照射面積之距離變短，即光源可在更 近的距離内形成擴張照射面積。而且如此設計可使該發光二極體晶片31兩侧所 產生之第一波前311，及該導電層34經由穿孔341之單狹縫所產生之第二波前 312，兩者干涉後會使得亮度更為均勻。再者，該穿孔341係可以複數設置而更 提昇其光照效果；又，該穿孔341係可於該導電層34上採用蝕刻製程所形成， 或利用金屬粒子摻雜透光粒子經由網版印刷以形成該導電層34，而該透光粒子 即如同該穿孔341作用而得以產生該第二波前312。 訂請爹閱第 丁、4別讣攸日日棋殂之折令式光源模組第二實施例，該散 熱板單το 35G’，於兩側組合面係分別設有—成對應形狀之填尾狀凸部咖，及埃 尾狀凹部352，當兩相鄰之散熱板單元，組接時，則利用該填尾狀凸部 3:及^:凹部352，予以組接，進而完成—所需求較大面積之散熱板邪。 單元350之凸部351、凹部352設置僅為兩相鄰之散熱板單元 、、且，因此__之散·單元·組接卡合技術並摘限，且該 M3 09124 凸部351、凹部352之形狀亦非所限。 又如第3A圖所tf ’該散熱裝置353係包括有一贿型散熱板，該織型散 熱板係可以獅方式或其他方式固定在該散熱板35上，馳_散熱板的一端 係呈具有複數溝槽354之鰭片狀板。再者，該散熱裝置353係可於該散熱板35 上直接形成，即該散熱板35的後端係呈具有複數溝槽354之鰭片狀板，用以一 體成型該散熱板35與散熱裝置353，而使該散熱板35具有更佳之散熱功能。 請參閱第7A圖，係本創作散熱裝置第二實施例，該散熱裝置353係包括有 一網狀散熱墊353A，該網狀散熱墊353A係固設在該散熱板35上，該網狀散熱 墊353A係以金屬材所編織形成。 如第7B圖所示，係本創作散熱裝置第三實施例，該散熱裝置353係包括有 一金屬穿孔網353B，該金屬穿孔網353B係固設在該散熱板35上，該金屬穿孔 網353B係可以金屬片材滾軋而形成其上之散熱穿孔。 如第7C圖所不，係本創作散熱裝置第四實施例，該散熱裝置353係包括有 一設於該散熱板35上之冷卻散熱管(Heat Pipe)353C，該冷卻散熱管35χ内設 有冷卻液，藉循環流動方式以帶走該散熱板35上之熱能。 如第7D圖所不，係本創作散熱裝置第五實施例，該散熱裝置邓3係包括有 «又於該散熱板35上之風扇353D，藉該風扇353D之風力吹襲以帶走該散熱板 35上之熱能。 在前述該散熱裝置之諸實施例中，該散熱裝置36係可以兩種以上之實施方 式加以併用，以更提高其散熱效果。 本創作液晶模組之拼合式光源模組，該發光二極體晶片31所投射的光經該 光擴政板20擴散後進入該液晶面板1〇，以作為液晶模組1⑽的背光來源；而因 該散熱板35及該散熱裝置36之設置，可使該發光二極體晶片31所產生之高熱 適當予以降溫，以確保該液晶面板1〇之運作性能及使用壽命；且該發光二極體 晶片31藉由該導電層34之設置後，可大為提高其光度。因此本創作在利用發 光二極體作為背光源之情況下，可同時具有較高之色飽和度及較佳之光均勻 9 M309124 度2得以徹底解決習知技術相關之缺失，進而大為提昇液晶模組之 品質者。 而此間值·職_是，本_液晶·之拼合式棘模_職散熱 便利㈣刀離旦°方式’不但可使其上所設置的發光二極體晶片光源色彩可 便_正，而且就散熱板35之製作可提供相當便利之組合且較佳經濟性之製作 方式’使侧t熱板35可因應獨_或尺寸之液晶触之製作，進 免液晶模組製作上其裁切所造成之浪費。 綜合上述，本創作確已符合創作專利之要件，爰依法提出專利申請。惟以 上所述者，僅為本創作較佳實施例而已，並非用來限定 ，與W女·由冰由 采限疋本創作實施之範圍，故 舉凡依本創作申睛專利範圍所述之形狀、構造、特徵 修飾，均應包括於本創作之申請專利範圍内。 斤為之嫩化與 【圖式簡單說明】 第1圖係習知液晶模組之結構示意圖； 第2圖係本創作之結構示意圖； 第3A圖係本創作散熱板單元之結構示意圖； 籲第犯圖係本創作紅綠藍色發光二極體設置之電路示意圖； 第4圖係本_發光二極體晶狀結構示意圖； 第5圖係本創作發光二極體晶片之導電層設置穿孔示意圖； 第6圖係本創作第二實施例結構示意圖； 第7A圖係本創作散熱裝置第二實施例示意圖； 第7B ®係本創作散熱裝置第三實施例示意圖； 第7C圖係本創作散織置第四實施例示意圖； 第7D圖係本創作散熱裝置第五實施例示意圖； M309124 【主要元件符號說明】 液晶模組90 光擴散板92 液晶面板10 背光散熱裝置30 電路層32 散熱裝置353 散熱板單元350 凹部邊框36 凸部362 綠光發光二極體314 導電層34 穿孔341 凸部351’ 散熱板單元350’ 溝槽354 金屬穿孔網353B 風扇353D 液晶面板91 背光源93 光擴散板20 發光二極體晶片31 散熱板35 絕緣層33 凸部351 凹部361 紅光發光二極體313 藍光發光二極體315 第一波前311 第二波前312 凹部352’ 凹部352 網狀散熱墊353A 冷卻散熱管353C 液晶模組100Referring to FIG. 5, the conductive layer 34 is further provided with a through hole 341. When the light source emitted by the LED chip 31 passes through the through hole 341 of the conductive layer 34, the second wavefront 312 of the single slit diffraction is generated. Since the second wavefront 312 is generated above the through hole 341 of the conductive layer 34, the second wavefront 312 and the first wavefront 311 shorten the distance that the light source completes the expanded illumination area, that is, the light source can be closer. The expanded illumination area is formed within the distance. Moreover, the first wavefront 311 generated on both sides of the LED chip 31 and the second wavefront 312 generated by the conductive layer 34 via the single slit of the through hole 341 are designed to interfere with each other. The brightness is more uniform. Furthermore, the perforations 341 can be arranged in a plurality to enhance the illumination effect; further, the perforations 341 can be formed by using an etching process on the conductive layer 34, or by using metal particles doped with light-transmitting particles via screen printing. The conductive layer 34 is formed, and the light transmissive particles act as the perforations 341 to produce the second wavefront 312. Please refer to the second embodiment of the folding light source module of the Ding Ding and the 4th Days of the Japanese chess game. The heat dissipating plate is το 35G', and the combined surface of the two sides is respectively provided with the corresponding shape. The tail-shaped convex portion coffee and the apex-shaped concave portion 352 are assembled when the two adjacent heat-dissipating plate units are assembled, and then the closed-shaped convex portions 3: and the: concave portions 352 are used for assembly, thereby completing A large area of heat sink is required. The convex portion 351 and the concave portion 352 of the unit 350 are disposed only as two adjacent heat dissipating plate units, and therefore, the __ 散 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 The shape is not limited. As shown in FIG. 3A, the heat dissipating device 353 includes a bristle type heat dissipating plate which can be fixed on the heat dissipating plate 35 by lion or other means, and one end of the heat dissipating plate has a plurality of The fin plate of the groove 354. In addition, the heat dissipating device 353 can be directly formed on the heat dissipating plate 35, that is, the rear end of the heat dissipating plate 35 is a fin-shaped plate having a plurality of grooves 354 for integrally forming the heat dissipating plate 35 and the heat dissipating device. 353, so that the heat sink 35 has a better heat dissipation function. Referring to FIG. 7A, a heat dissipation device 353 includes a mesh heat dissipation pad 353A. The mesh heat dissipation pad 353A is fixed on the heat dissipation plate 35. The mesh heat dissipation pad is used. The 353A is formed by weaving metal. As shown in FIG. 7B, the heat dissipation device 353 includes a metal perforated mesh 353B, and the metal perforated mesh 353B is fixed on the heat dissipation plate 35. The metal perforated mesh 353B is a third embodiment. The metal sheet may be rolled to form a heat-dissipating perforation thereon. As shown in FIG. 7C, the heat dissipation device 353 includes a cooling heat pipe 353C disposed on the heat dissipation plate 35, and the cooling heat pipe 35 is provided with cooling. The liquid, by means of a circulating flow, takes away the heat energy on the heat sink 35. As shown in FIG. 7D, the heat dissipation device Deng 3 includes a fan 353D on the heat sink 35, and the wind is blown by the fan 353D to take away the heat dissipation. The heat energy on the plate 35. In the embodiments of the heat dissipating device, the heat dissipating device 36 can be used in combination of two or more embodiments to further improve the heat dissipating effect. In the split light source module of the liquid crystal module, the light projected by the LED chip 31 is diffused through the optical expansion board 20 and enters the liquid crystal panel 1 as a backlight source of the liquid crystal module 1 (10); Due to the arrangement of the heat dissipation plate 35 and the heat dissipation device 36, the high heat generated by the LED chip 31 can be appropriately cooled to ensure the operation performance and the service life of the liquid crystal panel 1; and the LED After the wafer 31 is disposed by the conductive layer 34, the luminosity thereof can be greatly improved. Therefore, in the case of using the light-emitting diode as a backlight, the present invention can simultaneously have a high color saturation and a uniform light uniformity of 9 M309124 degrees 2 to completely solve the defects associated with the prior art, thereby greatly improving the liquid crystal mode. The quality of the group. In the meantime, the value of the job is _, the _ liquid crystal · split-type ratchet mode _ job cooling convenience (four) knife away from the ° method 'not only can be set on the light-emitting diode chip light source color is OK _ positive, and The fabrication of the heat sink 35 can provide a relatively convenient combination and a more economical production method. The side t-hot plate 35 can be made in accordance with the liquid crystal touch of the size or the size of the liquid crystal module. Waste. In summary, the creation has indeed met the requirements for the creation of a patent, and has filed a patent application in accordance with the law. However, the above description is only for the preferred embodiment of the present invention, and is not intended to be limited to the scope of the creation of the W-girls, and therefore the shape described in the scope of the patent application. , construction, and feature modification shall be included in the scope of the patent application of this creation. The tenderness of Jin and the simple description of the figure [1] is a schematic diagram of the structure of the conventional liquid crystal module; the second figure is a schematic diagram of the structure of the creation; the 3A is a schematic diagram of the structure of the heat dissipation plate unit of the creation; The schematic diagram of the circuit diagram of the red, green and blue light-emitting diodes is created; the fourth figure is a schematic diagram of the crystalline structure of the light-emitting diode; the fifth figure is a schematic diagram of the perforation of the conductive layer of the light-emitting diode chip. Figure 6 is a schematic view showing the structure of the second embodiment of the present invention; Figure 7A is a schematic view of the second embodiment of the heat sink of the present invention; Figure 7B is a schematic view of the third embodiment of the heat sink device; FIG. 7D is a schematic view of the fifth embodiment of the heat sink device; M309124 [Description of main components] LCD module 90 light diffusing plate 92 liquid crystal panel 10 backlight heat sink 30 circuit layer 32 heat sink 353 heat dissipation Plate unit 350 recess frame 36 convex portion 362 green light emitting diode 314 conductive layer 34 perforation 341 convex portion 351' heat sink unit 350' groove 354 metal perforated mesh 353B fan 353D liquid crystal Plate 91 backlight 93 light diffusing plate 20 light emitting diode chip 31 heat sink 35 insulating layer 33 convex portion 351 concave portion 361 red light emitting diode 313 blue light emitting diode 315 first wave front 311 second wave front 312 concave portion 352' recess 352 mesh cooling pad 353A cooling heat pipe 353C liquid crystal module 100