M304063 八、新型說明： 【新型所屬之技術領域】 本創作係有關於一種透氣散熱結構，尤指是針對一般 3C產品如：電腦主機、PDA等機體内所加具有之透氣散熱結 構，以降低機體所散發出之系統熱源。 ”" 【先前技術】 按，電腦已經是非常普及之設備，然而一般使用者於 • 使用電腦時通常都會遇到一個問題，亦是一般電腦製造廠 商所面臨之問題，尤其該電腦執行很多應用程式或是驅動 過多週邊電子裝置時，會產生系統溫度過高之問題，通常 這樣的高溫熱源是來自機板上之電子元件所產生，並且隨 :著CpU (Central Processing Unit，中央處理器）效能與 處理速度之不斷提升，隨之而來之散熱問題愈趨重要；雖 然電腦内部在CPU上或重要組件上設有風扇、散熱座或散熱 孔，而該等風扇或散熱座皆處於電腦内部，散熱孔之範圍 φ 不大，所以，即使該風扇、散熱座或散熱孔可將CPU及重要 組件所產生之熱源加以排除’該熱源仍會滯留於電腦内 部’除了產生噪音外，往往不能達到預定降低系統溫度之 功效，而使得電腦速度變慢甚至使電腦當機；且如果因人 為不小心將液體翻倒至電腦之風扇或散熱孔上，該液體有 可能因其空隙進入電腦内部，使其電腦遭受損害。 而如第一圖所示，該電源供應器1〇上雖有風扇1 1 及散熱孔1 2可以幫助CPU及重要組件上之風扇1 1及散 M304063 熱座將熱源排除至電腦外，或將冷空氣吸入電腦内部中， 但一來該風扇1 1係與電源供應器1 〇結合在一起，必須 兼顧排除或冷卻電源供應器1 0產生之熱，二來該風扇1 1之面積有限，且未對準熱源產生處，所能排除之熱源更 是有限。 【新型内容】 有鑑於此，本創作係一種透氣散熱結構，其結構包含 有一殼體，該殼體上設有複數個穿透孔，其重點在於該殼 體一侧適當位置處設有一散熱層，該散熱層設有複數個極 微小之透氣孔，且散熱層本身為透氣但不透水之材質，使 其兼具散熱及防水功能；可使電腦内部之熱源經由散熱層 及穿透孔散發出，且利用該散熱層之透氣不透水材質，亦 使其不受流體之損害，兼具散熱及防水功能。 尤其是將本透氣散熱結構設置於各式3C產品如電腦、 PDA等機體之一侧，可有效將機體工作發出之熱源有效散 去，並兼具有防水功能，使外部液體不易進入機體内部， 使其機體内部零件遭受損害。 【實施方式】 為能使貴審查委員清楚本創作之結構組成，以及整 體運作方式，茲配合圖式說明如下： 本創作「透氣散熱結構」，如第二圖與第三圖之實施例 所示，係為設置於電腦機體2 —側，其結構包含有一殼體 M304063 2 Ο，該殼體2 0上設有複數個穿透孔2 1，該殼體2 Ο 一侧適當位置處設有一散熱層2 2，且該散熱層2 2本身 為透氣不透水之材質。 然，該殼體2 0特別是針對電腦主機之機體2所加具 有之透氣散熱結構，殼體2 0設置於機體2之上側，與機 體2蓋合；而該殼體2 0上設有複數個穿透孔2 1，如第 四圖所示，穿透孔2 1具有透氣散熱功能；而殼體2 0本 身可為金屬或塑膠材質。 Β 而該殼體2 0 —侧適當位置處設有一散熱層2 2，散 熱層2 2設有複數個極微小之透氣孔2 3，如第五圖所 示，因透氣孔2 3大於氣體分子又小於水分子，使其散熱 層2 2為透氣但不透水之材質。 :· 該散熱層2 2除可設置於殼體2 0—侧之下方，亦可 、 設置於殼體2 0另側之上側，如第六圖所示，同樣具有透 氣不透水之效果；且該殼體2 0與散熱層2 2可設置於電 腦機體2上側之外，亦可設置於機體2之下側、左側與右 側，可使電腦内部之熱源經由四方之散熱層2 2及殼體2 0之穿透孔2 1散發出；又當人為不小心將流體翻倒，該 流體雖經由殼體2 0之穿透孔2 1穿透至散熱層2 2，但 散熱層2 2利用該透氣不透水材質，亦使其電腦機體2不 受流體之損害，兼具散熱及防水功能；另，該殼體2 0及 散熱層2 2可視電腦機體2之功能及外形作調整，以增加 本創作可變性與通用性。 另，本創作亦可設置於各式3C產品機體之一侧，而該 7 M304063 3C產品可以PDA為例，如第七圖所示，於PDA之背面殼體内 設置散熱層22,該殼體20上亦設有複數個穿透孔2 1，亦是利用該散熱層2 2之透氣不透水材質，使其不受 流體之損害，兼具散熱及防水功能。 如上所述，本創作提供一較佳可行之透氣散熱結構， 爰依法提呈新型專利之申請，以上之實施說明及圖式所 示，係本創作較佳實施例者，並非以此侷限本創作，是以， 舉凡與本創作之構造、裝置、特徵等近似、雷同者，均應 屬本創作之創設目的及申請專利範圍之内。 【圖式簡單說明】 第一圖係為習有立體示意圖。 第二圖係為本創作第一立體示意圖。 第三圖係為本創作第一立體分解圖。 第四圖係為本創作殼體示意圖。 第五圖係為本創作散熱層示意圖。 第六圖係為本創作第二立體分解圖。 第七圖係為本創作第二立體示意圖。 【主要元件符號說明】 10- --電源供應器 2 0- 一 一殼體 11- --風扇 2 1- ——穿透孔 12- --散熱孔 2 2- --散熱層 2 -- 一一機體 2 3- --透氣孔M304063 VIII, new description: [New technology field] This creation department is about a kind of ventilation and heat dissipation structure, especially for the general 3C products such as: computer host, PDA and other bodies with a breathable heat dissipation structure to reduce the body The system heat source that is emitted. "Previous technology" Press, the computer is already a very popular device, but the average user often encounters a problem when using the computer, which is also a problem faced by general computer manufacturers, especially the computer performs many applications. When the program is driven by too many peripheral electronic devices, the system temperature is too high. Usually, such high-temperature heat sources are generated by electronic components on the board, and the CpU (Central Processing Unit) performance is followed. As the processing speed continues to increase, the heat dissipation problem becomes more and more important. Although the computer has a fan, a heat sink or a heat dissipation hole on the CPU or an important component, and the fans or heat sinks are inside the computer. The range of the vent hole is not large, so even if the fan, heat sink or vent hole can eliminate the heat source generated by the CPU and important components, the heat source will remain in the computer. In addition to noise, it is often impossible to achieve the reservation. Reduce the temperature of the system, making the computer slower or even crash the computer; and if In case of accidentally pouring the liquid onto the fan or vent of the computer, the liquid may enter the inside of the computer due to its gap, causing damage to the computer. As shown in the first figure, the power supply has a The fan 1 1 and the cooling hole 1 2 can help the fan 1 1 and the M304063 hot seat on the CPU and the important components to remove the heat source to the outside of the computer, or draw cold air into the interior of the computer, but the fan 1 1 and the power supply The suppliers 1 〇 are combined, and the heat generated by the power supply 10 must be eliminated or cooled. Secondly, the area of the fan 11 is limited, and the heat source is not aligned, and the heat source that can be excluded is limited. In view of this, the present invention is a ventilating heat dissipation structure, the structure of which comprises a casing, and the casing is provided with a plurality of through holes, the focus of which is to provide a heat dissipation layer at a suitable position on one side of the casing. The heat dissipating layer is provided with a plurality of extremely small venting holes, and the heat dissipating layer itself is a gas permeable but water impermeable material, so that the heat dissipation and waterproof functions are combined; the heat source inside the computer can be dispersed through the heat dissipation layer and the penetration hole. The air-permeable and impervious material of the heat-dissipating layer is also protected from fluid damage, and has the functions of heat dissipation and waterproofing. Especially, the ventilation and heat-dissipating structure is disposed in one of various 3C products such as a computer, a PDA, and the like. The side can effectively dissipate the heat source emitted by the body work, and has a waterproof function, so that the external liquid is not easy to enter the inside of the body, and the internal parts of the body are damaged. [Embodiment] In order to make the reviewer aware of the creation The structural composition and the overall operation mode are as follows: The "breathable heat dissipation structure" of the present invention, as shown in the second and third embodiments, is disposed on the side of the computer body 2, and its structure The housing 20 is provided with a plurality of through holes 2 1 , and a heat dissipation layer 2 2 is disposed at a suitable position on one side of the housing 2 , and the heat dissipation layer 2 2 is breathable Impervious material. The housing 20 is particularly provided with a ventilating heat dissipation structure for the body 2 of the computer main body. The housing 20 is disposed on the upper side of the body 2 and covers the body 2; and the housing 20 is provided with a plurality of The penetration hole 2 1, as shown in the fourth figure, the penetration hole 2 1 has a gas permeable heat dissipation function; and the housing 20 itself can be made of metal or plastic material. Β A heat dissipation layer 2 2 is disposed at a suitable position on the side of the casing 20, and the heat dissipation layer 2 2 is provided with a plurality of extremely small vent holes 23, as shown in FIG. 5, because the vent hole 2 3 is larger than the gas molecules It is smaller than water molecules, so that the heat dissipation layer 22 is a material that is breathable but not water permeable. The heat dissipating layer 2 2 may be disposed below the side of the casing 20, or may be disposed on the upper side of the casing 20, as shown in the sixth figure, and has the effect of being breathable and impervious; The housing 20 and the heat dissipation layer 2 2 may be disposed on the upper side of the computer body 2, or may be disposed on the lower side, the left side, and the right side of the body 2, so that the heat source inside the computer can pass through the heat dissipation layer 2 and the housing of the square. The penetration hole 2 1 of 20 is emitted; when the fluid is accidentally turned over, the fluid penetrates through the penetration hole 2 1 of the housing 20 to the heat dissipation layer 2 2 , but the heat dissipation layer 2 2 utilizes the The permeable and impervious material also protects the computer body 2 from fluid damage, and has both heat dissipation and waterproof functions. In addition, the housing 20 and the heat dissipation layer 2 2 can be adjusted according to the function and shape of the computer body 2 to increase the present. Creative variability and versatility. In addition, the creation can also be set on one side of various 3C product bodies, and the 7 M304063 3C product can be exemplified by a PDA. As shown in the seventh figure, a heat dissipation layer 22 is disposed in the back casing of the PDA. There are also a plurality of penetrating holes 2 1 on the 20, and the gas permeable and impervious material of the heat dissipating layer 2 2 is used to protect the device from heat and water. As described above, the present invention provides a preferred and permeable heat-dissipating structure, and the application for a new patent is proposed according to the law. The above description and the drawings show that the preferred embodiment of the present invention is not limited to this creation. Therefore, all the similarities and similarities to the structure, installation, and features of this creation should be within the creation purpose of the creation and the scope of patent application. [Simple description of the diagram] The first diagram is a schematic diagram of the same. The second picture is the first three-dimensional diagram of the creation. The third picture is the first exploded view of the creation. The fourth picture is a schematic diagram of the creation shell. The fifth picture is a schematic diagram of the heat dissipation layer of the creation. The sixth figure is the second exploded view of the creation. The seventh picture is the second perspective view of the creation. [Main component symbol description] 10- -- Power supply 2 0 - One-piece housing 11 - -- Fan 2 1- -- Through hole 12 - -- Heat sink 2 2- -- Heat sink 2 -- One One body 2 3- -- venting hole