M3 03^H〇c/e 八、新型說明： 【新型所屬之技術領域】 本創作是有關於一種電磁干擾防護裝置，且特別是有 關於一種可攜式電子裝置的電磁干擾防護裝置。 【先前技術】 電磁干擾(Electromagnetic Interference 5 EMI ) 之防護為電子產品一項非常重要的安規指標，以電腦 為例，微處理器（CPU)為其内部最大的電磁干擾來 源，隨著微處理器的運算速度越來越快，其所產生之 電磁干擾也愈加嚴重。此外，隨著電子裝置的體積愈 來愈小，其中電路板的佈線密度也會相對增高，結果 則會導致接地平面的破碎與不足，因此造成在輻射測 試及靜電測試上皆難以符合要求。 一般電子裝置對電磁干擾防護的設計，是以導電 材質做為主結構體，而將電磁干擾封閉於整台電子裝 置之内部，以桌上型電腦為例，其機殼大多採用金屬 材質，而像是筆記型電腦或是個人數位助理等體積較 小的可攜式電子裝置，則必須使用較輕薄的塑膠外 殼，並在其外殼内面喷塗導電漆等導電物質，以做為 封阻電磁干擾之屏障。 然而，採用上述方式不僅會因為喷塗導電漆而造 成壞保上的問題’且因為導電漆的成本南’相對的也 會提高製造可攜式電子裝置的成本。 此外，靜電放電（Electrostatic Discharge，ESD)會對 5 M303Ml〇c/e =體:路（integrated Circuit，IC)中的半導體元件產生嚴重 t破，，使其無法工作，此乃因為ESD會在極短的時間内產 j量電流，此電流通常會超過半導體元件所能貞荷的範 而對可攜式電子裝置造成損壞。 電路:ΪΓΓ為了防止ESD對1C電路造成損害，會在ZC 片中整合ESD防護電路，其通常為一開關電路。 電产=發ff，ESD轉祕會被導通轉高麵之咖 別的路徑傳導至別的地方，而不會使ESD電流進入 對1C 身/而在一般操作時，ESD電路為關閉狀態，不會 對1c电路的運作造成影響。 然而，採用上述方式必須在汇電路中額 ’對1C電路的空間及製造成本皆有影響，且 貝限’亦難以達到理想的靜電放電防護功效。：、、、、兒 【新型内容】 有鑑於此，本創作的目的就是在 護;置由增加電子装置主機板的接地平Ξ電 面貝而此夠減少電子裝置内電磁干擾的二 電放電的防制能力。 畸亚相加諍 為達上述或其他目的，本創作提出 裝置，其適於防護—可攜式電子裝置運 干擾，包括至少一個接地焊塾片、至少=生的㈣ 個導電金屬薄片。1Φ 4.lll ^ u尹、片，以及一 子裝置之-印刷電路板）彳Θ是配置㈣可攜式電 攜式電子裳 地焊墊片。此外，導電金屬薄片則配置七接於這些接M3 03^H〇c/e VIII. New description: [New technical field] This creation is related to an electromagnetic interference protection device, and in particular to an electromagnetic interference protection device for a portable electronic device. [Prior Art] Electromagnetic interference (Electromagnetic Interference 5 EMI) protection is a very important safety indicator for electronic products. Taking a computer as an example, a microprocessor (CPU) is the largest source of electromagnetic interference inside it, along with a microprocessor. The computing speed is getting faster and faster, and the electromagnetic interference generated by it is getting worse. In addition, as the volume of the electronic device becomes smaller and smaller, the wiring density of the circuit board is relatively increased, and as a result, the ground plane is broken and insufficient, so that it is difficult to meet the requirements in both the radiation test and the static test. The design of electromagnetic interference protection of general electronic devices is based on conductive materials as the main structure, and the electromagnetic interference is enclosed inside the whole electronic device. Taking a desktop computer as an example, the casing is mostly made of metal material, and For a portable electronic device such as a notebook computer or a personal digital assistant, a thinner plastic housing must be used, and conductive materials such as conductive paint should be sprayed on the inner surface of the housing to block electromagnetic interference. The barrier. However, in the above manner, not only the problem of poor maintenance is caused by the spraying of the conductive paint, but also because the cost of the conductive paint is relatively high, the cost of manufacturing the portable electronic device is also increased. In addition, Electrostatic Discharge (ESD) can cause serious t-breaking of semiconductor components in 5 M303Ml〇c/e = body: integrated circuit (IC), making it inoperable because ESD will be in the pole The current is generated in a short period of time, and this current usually exceeds the load of the semiconductor component and causes damage to the portable electronic device. Circuit: In order to prevent ESD damage to the 1C circuit, the ESD protection circuit is integrated in the ZC chip, which is usually a switching circuit. Electricity production = ff, ESD transfer will be conducted to other places, and will not lead the ESD current into the 1C body / in normal operation, the ESD circuit is off, not Will affect the operation of the 1c circuit. However, in the above manner, it is necessary to have an influence on the space and manufacturing cost of the 1C circuit in the sink circuit, and it is difficult to achieve the desired electrostatic discharge protection effect. :,,,,, children [new content] In view of this, the purpose of this creation is to protect the two electric discharges that increase the electromagnetic interference in the electronic device by increasing the grounding level of the electronic device motherboard. Control ability. Teratogenic Addition For these or other purposes, the present author proposes a device suitable for protection-portable electronic device interference, including at least one grounding pad, at least = raw (four) conductive foil. 1Φ 4.lll ^ u Yin, film, and a sub-device - printed circuit board) 彳Θ is configured (4) portable electric portable electronic skirt welding pad. In addition, the conductive metal foil is arranged in seven connections to these connections.
M303^,OCA =路電路板上的該些-，修 之印面實 在本創t 印刷電路板的接地平面。 置於該可攜式電攜；電子裝置的方式包括配 攜式電子壯w衣機忒背盍内面，或是配置於該可 “式：：衣置之-液晶顯示面板的背面。 亥了 寻片匕括鋁殆片及銅箔片其中之一。 在本創作之一實施例 之接地焊墊片配置於該可攜式電子=!:广上述 一特=離内，以減少該微處理器的迴路面積Γ理為周圍 之可實施例所述電磁干擾防護裳置中，上述 顯示可攜式電子裳置的機殼背蓋或是液晶 效。 ι電磁干擾及增加靜電放電防制能力的功 易和其他目的、特徵和優點能更明顯 明如下寸舉幸父佳實施例，並配合所附圖式，作詳細說 U303^IL·,, 【實施方式】 ^了，本創作之内容更為明瞭’以下特舉實施例作為 本創作確實能夠據以實施的範例。 圖丄是依照本創作較佳實施例所緣示的電磁干擾防護 圖'，本實施例是藉由在可攜式電子裝置的 irt 貼上—層導電金屬薄片，並接觸印刷電 ί板上的黃片，而能夠增加印刷電路板的接地平面，達到 ;曰奸擾的功效。其中，上述會可攜式電子裝置可以 ^實施例的可攜式電子裝置⑽包括一個印刷電路板 電路板二Γ120及一個液晶顯示面板121。其中，印刷 更配置有微處理器113,且印刷電路板n〇之 ^此始i正面或反面）則配置有4個接地焊墊片111， <些接地焊墊片ηι分別遠接 平面，並分別焊接有;:：印刷電路板110中的接地 金屬薄片122 j液晶顯示面板121的背面則貼有導電 ‘二;;的=,:電金屬薄片m可以是郎或銅 告 、 屬厚片，並不限制其範圍。 =刷電路板11〇安裳於機殼 金屬薄心，編;= 的接地=也因此， 有效減少電磁干擾的問題。此外， 8 W導電金屬薄片122增大了 面積由增加了靜電放電的防;能力，置1 °。的¥電 置可内最大的電磁干擾來 4 100之微處理器113周圍 =置於可攜式電子裝 以减少微處理器113的迴路面積，距離（例如1公分）内， 式電ΐ=:ί:!:§導電金屬薄片122是配置於可攜 于衣置100的液日日頒示面板 蓋内面或其它位置。以電子裝置⑽的機殼背 在本^彳’丨Ϊ頻產品的設計通常是採關殼多點接地，而 板電源平面之地阻抗以及減少迴路面積b可二 回電流能夠快速地經由地平面返回。 令l琥的返 綜上所述，在本創作之電磁干擾防護裝置中， 二攜式電子裝置的機殼練晶顯示面板的背面貼上二 導電材質的金屬薄片，並與配置於電路板上的簧片以 ，加電路板的接地平面，減少迴路面積，而能夠減少電子 衣置内电磁干擾的問題，並增加靜電放電的防制能力。 雖y本創作已以較佳貫施例揭露如上，然其並非用以 限定本創作，任何熟習此技藝者，在不脫離本創作之精神 Μ303^；1,〇〇, 和範圍内，當可作些許之更動與潤飾，因此本創作之保護 範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1是依照本創作較佳實施例所繪示的電磁干擾防護 裝置。 【主要元件符號說明】 100 :可攜式電子裝置 110 :印刷電路板 111 :接地焊墊片 112 :簧片 113 :微處理器 120 :機殼 121 ·液晶顯不面板 122 :導電金屬薄片 10M303^, OCA = these on the circuit board, the repaired surface is the ground plane of the printed circuit board. The portable electronic device is provided on the back side of the portable electronic device, or is disposed on the back of the liquid crystal display panel. The sheet includes one of an aluminum foil and a copper foil. In one embodiment of the present invention, the grounding pad is disposed on the portable electronic=!: the above-mentioned one-in-one to reduce the microprocessor The loop area is treated as the electromagnetic interference protection device in the surrounding embodiment, and the above-mentioned portable back cover is provided with a back cover or a liquid crystal effect. ι electromagnetic interference and the work of increasing the electrostatic discharge prevention capability Easy and other purposes, features and advantages can be more clearly described below, and with the accompanying drawings, the details of U303^IL·,, [Embodiment] ^, the content of this creation is more The following specific embodiments are taken as examples of the actual implementation of the present invention. The figure is an electromagnetic interference protection diagram according to the preferred embodiment of the present invention, and the present embodiment is implemented in a portable electronic device. Irt is attached to a layer of conductive foil and is in contact Brushing the yellow sheet on the board, and increasing the ground plane of the printed circuit board to achieve the effect of smuggling. Among the above, the portable electronic device (10) of the embodiment can include a printing a circuit board circuit board 220 and a liquid crystal display panel 121. wherein the printing is further provided with a microprocessor 113, and the printed circuit board is equipped with four grounding pads 111, <Some grounding pads ηι are respectively connected to the plane and are respectively soldered;:: the grounded metal foil 122 in the printed circuit board 110. The back surface of the liquid crystal display panel 121 is affixed with a conductive 'two;; The metal foil m can be a lang or a copper slab, and is a thick slab, and does not limit its range. = Brush circuit board 11 〇 裳 in the thin metal of the casing, edited; = grounding = also, effectively reducing the problem of electromagnetic interference In addition, the 8 W conductive foil 122 increases the area by increasing the electrostatic discharge resistance; the capacity is set to 1 °. The maximum internal electromagnetic interference can be placed around the microprocessor 100 of the 4 100 = placed Portable electronic device to reduce the microprocessor 113 The road area, the distance (for example, 1 cm), the type of electric ΐ =: ί:!: § The conductive metal foil 122 is disposed on the inner surface of the liquid-panel display panel cover or other position that can be carried on the clothes 100. (10) The back of the casing is designed to be multi-point grounded, and the grounding resistance of the board power plane and the reduction of the loop area b can be quickly returned through the ground plane. l In the electromagnetic interference protection device of the present invention, in the electromagnetic interference protection device of the present invention, the back surface of the casing of the second portable electronic device is affixed with a metal foil of two conductive materials, and is disposed on the circuit board. Reeds, adding the ground plane of the circuit board, reducing the loop area, can reduce the electromagnetic interference inside the electronic clothing, and increase the electrostatic discharge prevention ability. Although y has created the above example with a better example, it is not intended to limit the creation of this work. Anyone who is familiar with this art, without departing from the spirit of this creation, 303^;1,〇〇, and Make some changes and refinements, so the scope of protection of this creation is subject to the definition of the scope of the patent application attached. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an electromagnetic interference protection device according to a preferred embodiment of the present invention. [Main component symbol description] 100 : Portable electronic device 110 : Printed circuit board 111 : Grounded pad 112 : Reed 113 : Microprocessor 120 : Case 121 · Liquid crystal display panel 122 : Conductive foil 10