TWM303381U - Improved structure of modulated elastic probe - Google Patents

Description

M303381 VIII. New Description: [New Technology Field] This creation is about the technical scope of a probe module, especially the composition of a probe module applied to Ic, wafer and other semiconductor components. Improvement. [Prior Art] Press, the probe has been widely used in various test fields, such as printed circuit board measurement.

Tests, wafer tests, 1C package tests, communication products, and LCD panel tests all require probes as test media. In addition, at this stage, the probes are gradually developing toward fine electronic components. The main reason is that S is an increasingly finer probe size and has the advantages of conductivity and low resistance. It can be used as a new antenna for mobile phones and other wireless products, as well as chargers for various electronic products and connectors. Future probes will no longer only play the role of testing Wei, but will also occupy an indispensable position in the field of electronic components. In addition, thanks to the development of South Technology, the current J C design has been able to add a variety of audio and video functions to a small J C chip, which greatly enhances the practicality of information products. However, the ki C crystal wheel (4) has increased, and the technical difficulty of wafer design and package testing has also been relatively raised, such as the first chip package (storage), system single chip (soc) or system-in-package (SIP). However, because the current packaging technology can not keep up with the pace of design trends such as 1..._, then, (4)_stacking. Not only is the 1 rate low, but the Lai probe module also needs to be replaced or adjusted according to the packaging technology of the 5 M303381 and the wafer structure tested, which is inconvenient and costly. Further examples of the structure of the vibrating needle module for the ''elbow'' are used.

Please refer to the second _, which is the ninth application of the 96th "Modularized Elastic Needle Set Device Structure" patent (hereinafter referred to as the "use"), which is the previous creation of the applicant's previous application. a lower cover, and a plurality of elastic needles disposed between the upper and lower covers, wherein the upper cover forms one or more hollow first-positioning holes in the axial direction, and the lower cover is coupled to the lower cover Below the upper cover, and in the mismatch with the first positioning hole, the miscellaneous direction has a second red hearing, and the rib is provided for the elastic needles, and each of the elastic needles is between the upper probe and the lower probe. Elastically compressing the element, and limiting the upper to the lower and the lower riding and the second positioning hole to 4 and protruding. The wire positioning hole and the second positioning hole are outside. This domain—a probe module specifically designed for electrical detection. In addition, the other-use of the creation of the US patent number US2〇〇4/〇14714〇 (the underside of the self-use 'cups see the third and fourth figures, the second two probe modules are mainly composed of structure and system - Slightly similar, mainly listening to the upper and lower molds, she forms a number of accommodating holes on the surface, _ for tearing and then closing, and then screwing the screw. The second difference between the second and the conventional one is the probe ( 90) Structure, conventional use - #木针(9 〇) is made up of a coil, and the two ends are in contact with the c-chip and the plate _ around the knot-like contact (g丨), and the towel The body part of the segment M303381 (9 2) is also the contact between the structure (92) and the two ends of the coil around the coil (91 V and then the body part r Q Ο , 〇 only has the elasticity of the coil section In application, the two ends of the probes (9〇) are in contact with the IC chip and the PCB board for the purpose of detection. However, if the above two are created in the structure, the upper and lower covers are combined to form and position the elastic force. Needle (probe), so system =

Large, and at the same time assembly is also inconvenient. In addition, the burden of the self-use one or two elastic needle (probe) library for the 1 wafer inspection, because its elastic strength is relatively uniform, so the Rongsi wafer caused damage, especially the wide and easy Correct

Ar(五)宜Β%>! ° and Xihong's probe is only succeeding because of the transmission power, Qingshun __ job, not only elastic, but also easy to produce elastic fatigue. At the same time, its elastic strength can not be stably provided. Cut the secret inspection (4) Lai 1 (five), the structural design of the actual loss. Secondly, because ί C crystal is inspected in a high temperature environment, it is difficult for the slab itself to succeed in the "(4)" situation, causing the position of the solder ball in the warped portion to shift, and the 4 needle needle can not be accurately and stably with the tin. The ball touches the yield to the detection k into & sound. Although the conventional two-probe (9 〇) contact with the solder ball (91) can be deflected when the force is applied, the design of the upper and the τ template cannot make the contact portion yaw. The positioning function, at the same time, the structural design of the elastic part (9 3) can not make the joint (91) even and sturdy (4), and even adversely affect the structure of the elastic part (93). M303381 In addition, the white-powered Xiaoli needle has a loose structure similar to the spring coil structure at the towel section. Therefore, the electronic gift u will follow the structure of the structure, and the resistance value is proportional to the path length, and The inductance effect is large and affects the transmission of the signal: the rate is 仏. Although the conventional two-probe system is formed by a coil-body, it is because the field carries the bullet between the body (9 2 ) and the contact between the two ends (9 1 ).

(9 3) Ya can't make the whole money turn over, so there is still a surface impact on the transmission of electrical test signals, and there is a need for further improvement. In view of this, in order to improve the lack of the above-mentioned custom creation, the creator is determined to engage in the related experience of 彳········································································ The structural improvement of the needle is to benefit all the public. [New content] The main purpose of this creation is to provide a kind of "structural improvement of the amount of hybrid probes", the system 4, and the & needle structure is more compact and practical, to enhance the competitiveness of the industry, and electronics The efficiency and stability of signal transmission. In order to achieve the above-mentioned purpose, the "structural improvement of the modular elastic probe" is composed of a module body ‘and a plurality of members such as an elastic conductive probe coupled to the forehead body. The module body has a plurality of through-holes extending along the outer edge of the module body for the purpose of setting the elastic thunderballs, and the two ends of the holes 8 M303381 are close to each other. A counterbore portion having a large aperture is formed. When the elastic probes are fixed in the holes of the module body, the two ends of the elastic probes are pierced and received, and the elastic conducting probes are formed by the coil-body. The two ends are formed with a guiding portion, which is formed as a suitable portion, and the connecting portion and the fixing portion are formed by winding the coil to form a dense contact structure, and at the same time, The part and the _ this structure are in the form of two compression contacts. When it is desired to combine, the fixed portion of each of the guide pins can be clamped to the corresponding hole wall (4). Alternatively, a vertical communication hole is formed in the outer edge of the cavity corresponding to the hole, and an adhesive such as a resin is injected into the hole to adhere the elastic conductive probe to the hole. By sewing into a simple and well-structured probe module, it collapses on the Ic chip. • When the contacts of the individual conductance probes are in contact with the zc board, the σ H brother automatically yaws. Adjusting the positioning effect of the material, and at the same time, the elastic part of the transducing power guide pin is condensed into the electronic domain of the densely-touched county. The resistance-resistance 4 is used to remove the inductance effect, and the efficiency of the electronic signal transmission during the steady detection is achieved. And stability. The above and other objects and advantages of the present invention will become more apparent from the detailed description and the appended claims. [Implementation of creation] Please refer to the fifth to eighth figure, the creation of the modular elastic probe knot M303381

The fixing portion (2 2 )' is further formed between the two guiding portions (21) and the fixing portion to form a magazine portion (23), the two guiding portions (Η) and the fixing portion (2 2) Structurally, the coil is wound to form a dense contact configuration, and the bomb (2 3 ) _, _ around the shaft loose structure, (4) has a heterozygous compression characteristic: Again, please refer to the tenth figure, this The change of the creative structure design may reduce the outer edge of the hole (1)) in the module body (1 ◦), and the convexity = the locating concave edge (1)) is used for (10) (the positioning according to the detection) The above-mentioned components are composed of compact structure and elastic strength, and have a probe for the secret position of the ball during the detection, which can reduce the cost. At the same time, when the electronic signal transmission is measured, the resistance can be reduced. Eliminate the inductance effect 'to increase the efficiency and stability of the electronic job transmission system. Please further explain the following. Clearly refer to the sixth figure, this application is used in the inspection operation, the probe module is placed Between the PCB board (30) and the 1C board (40), each of the elastic 3⁄4^wood needles (2 〇) two end guides (21) and pc B respectively The end of the plate (3 〇) (3 1), and the solder ball (41) on the ICte (4 〇) are in contact with each other. 'When the signal transmission is detected, the hybrid conductivity probe (2 〇) is bombed. The Bodhisattva (23) is compacted by pressure and is intensively contacted. It is further intensive with the receiving part (21) and the fixed part (2 2). Therefore, 11 M303381 is available for new patents. The application requirements are patented, and the feelings are sensible. The design is very practical and progressive, and the law is applied for, and the application is reviewed and early [simplified description] The first picture: the current industry 〗 〖C wafer seal I 举例 々 々 々 々 举例 举例 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二

Phase diagram: The stereoscopic appearance of the probe for the second type of creation. The fifth picture is a schematic diagram of the decomposition of the creation. Figure 6: This is a combined section view of the creation of the creation. - The seventh picture: the other is a state-integrated sectional view of the creation. ^ Figure 8: This is a schematic diagram of the state of electronic signal detection for this creation. The ninth figure is a schematic cross-sectional view of the second elastic conductivity probe combined with the module body. Xuan Tu: This is a combined sectional view of the second design structure of the creation group. Tenth-figure: This is a schematic diagram of the self-axis positioning of the elastic conducting probe. Twelfth figure: is a schematic diagram of an application example of the assembly section and automatic positioning of the second implementation of the weaving probe. The thirteenth figure is the assembly cross-section of the third implementation of the elastic conducting probe. Figure 14: The assembly of the third practical design of the hybrid probe is a cross-sectional view of the application example of M303381.

[Description of main component symbols] Module body: (1 〇) Countersinking section: (1 1 1 ) Positioning concave edge: (1 3 ) Guide part: (2 1 ) Fixing part: (2 2 ) ?〇8 board :(3〇) IC board: (4 0) Hole groove: (1 1 ) Injection hole: (1 2 ) Elastic conductivity probe: (2 0 ) Bowl-shaped positioning end: (2 1 1 ) Magazine part: (2 3 ) Connecting end · ( 3 1 ) Tin ball: (4 1 )

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Claims (1)

M303381 Nine, the scope of application for patents · 1. - The structural improvement of the group of hybrid probes, including - the module body, and a plurality of elastic conductance probes, wherein: the module body is formed along its outer edge surface a slot for fixing the elastic conducting probes after being disposed of; The far-reading conductivity probe is placed in the hole of the module body, and the two holes are pierced out of the accommodating hole. Each of the elastic conducting probes is formed by coil-body winding, and the two ends are formed. There is a guiding part, and the middle section is suitable for the singularity of the slanting part of the slot, and the sleek coils are formed into a dense contact, the coil structure of the sturdy café, and the heart is formed into a sloppy configuration. The elastic compression characteristics of the Bodhisattva; hunting this, composed of a compact structure, the elastic force average, the detection of automatic adjustment positioning 'simultaneous electronic signal transmission probe module. 2. According to the structural improvement of the modular elastic probe described in the patent application system w, the injection molding is formed on the hole of the _, and the outer surface of the two scales should be formed to form a larger aperture. In the hole portion, when the guiding portion of the elastic conducting probe is in contact with the spheroid of the i C plate, the eccentricity and bending can be automatically adjusted according to the situation, and the positioning effect can be adjusted, and the adjacent elastic conducting probes can be avoided. A situation in which a short circuit occurs due to contact. 3. According to the structure of the modular elastic probe described in the application program, M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M The outer-shaped bowl-shaped positioning end is used to increase the stability of the contact when the interface is automatically positioned. 4 According to the structure improvement of the modular elastic probe described in Item 11 of the claim, the outer diameter of the fixed portion of the elastic conductance probe is equal to the hole of the inner edge of each hole, and can be utilized. The forced-holding method causes the fixing portion of each of the conductivity probes to be clamped to the inner wall of the corresponding hole of the corresponding instrument, or the vertical connection of the ball hole to the outer edge of the module body corresponding to the hole of the module An adhesive such as a resin is injected into the hole for fixing the elastic conductive probe to the hole. • 5, according to the structural modification of the modular elastic probe described in item 1 of the patent application scope, _ which finds the body on the outer edge of the opposite groove, and can further form a positioning concave edge for Ic Positioning for board detection. 16