M302869 八、新型說明： 【新型所屬之技術領域】 種散熱裝置，尤其涉及-種可以防止散 散熱裝置。 $子讀接觸發生短路的 【先前技術】 隨著積體電路朝密集化、複雜化方向發展，電子元哭 件在工作時產生的熱量也隨之- 對元器件的正常工作產生夺變。复曰由便，件派度升南， 產座的挪旦杜，忭座生心备。其中，中央處理器工作時 處理哭::m。因此’必須安裝散熱裝置以確保令央 羼理為此在較低的溫度下正常工作。 的广t'l國大陸專利第"235746· 2號所示的散執哭A座 4 v 用於“傳熱能力的熱傳介質，另外鮮 吕又有一個用於保護埶傳介 、 卜^衣 質保護蓋在將散埶;熱傳介質保護蓋，該熱傳介 散熱器的基座直接路板時需要移除，而將 埶，伸是系雄〜接在中央處理器的頂面上為其散 …仁疋系統電路板上還裝設有大量1侦批 :器是由導電的金屬材料(如銘、銅等的而散 果放熱器的基座底部盥 、）衣k而成的，如 間隔較近，容易造点、板的攻些電子元件之間的 此，有必要對上才員壞電路板上的電子元件。因 生。 返放熱器進行改良以防止短路現象的發 究並=學==有c之可改善’乃特潛心研 上述缺失之本創作。、、出一種設計合理且有效改善 M302869 【新型内容】 本創作的主要目的在於提供一種防止散熱器及背板 與電路板上的其他電子元件接觸發生短路的散熱裝置。 為了實現上述的目的，本創作提供一種散熱裝置，其 包括一散熱器、一背板以及裝設在該散熱器上的若干固定 裝置，該散熱器包括一基座及若干散熱鰭片，該散熱器是 裝設在一電路板上，該電路板的一侧設有一電子晶片，該 背板裝設在該電路板與電子晶片相對的另一侧’這些固定 裝置穿過電路板固定到該背板上，從而將該散熱器鎖固到 該電路板的電子晶片上方，該散熱裝置還包括一第一絕緣 聚酯薄膜、一第二絕緣聚酯薄膜及第三絕緣聚酯薄膜，該 第一絕緣聚酯薄膜裝設在該基座的底面，該第一絕緣聚酯 薄膜上開設有一開口，該電子晶片的頂面可以穿過該第一 絕緣聚酯薄膜的開口貼接到該散熱器的基座底面。該電路 板上還設有若干其他電子元件，該第二絕緣聚酯薄膜及第 三絕緣聚酯薄膜分別裝設在該背板的上下兩侧，上述這些 絕緣聚酯薄膜可以防止電路板上的其他電子元件與散熱 器或背板表面接觸發生短路。 本創作具有以下有益效果：該散熱器基座的底面上設 有一層第一絕緣聚酯薄膜，該電子晶片可以穿過第一絕緣 聚酯薄膜的開口貼接到該散熱器的基座的底面，從而給電 子晶片有效地散熱，而其他電子元件則由於第一絕緣聚酯 薄膜的阻隔不能和散熱器的基座接觸，防止發生短路；該 背板的上表面和下表面分別設有一第二絕緣聚酯薄膜和 一第三絕緣聚酯薄膜，可以防止背板與電路板背面的電子 M302869 元件接觸發生短路。 為使能更進-步瞭解本創作之特徵 閱以下有關本創作之詳細說明與附 τ内谷明翏 i、茶考與說明用，並非用來對本創作加以限 美 【實施方式】 第τ圖至第四圖，本創作為-種散熱裝置，其 包括一散熱器 第 第二r#…：絕緣聚酯薄膜2、一背板3、— ，在二二H、一弟三絕緣聚醋薄膜5以及分別裝 二固定裝置6。該散熱器1安裝在 該電路板7的一側設有一電子晶片 二二還IT干其他電子元件74及咖 片72相對的另-側也設有若干其他電 若千1是由紹合金製成的，其包括-基座12及 Γ上突伸出的散熱鳍片14。該散熱器1 的基座12的四角各開設有—安 孔内對應裝設有一固定裝置6。 ; ^女衣 該第一絕緣聚酯薄膜2田QAir彳n。 貼到該基錢的底面122上木Λ/不乾膠直接钻 開設有-開口 22,該開口 =中二對應該電子晶片72 1 22的大小與該電子晶片72的 β士目：1者略诞大一點點。該散熱器1裝設在電路板7 膜二7子：片72的頂面722穿過該第-絕緣聚醋薄 ^ ΓΓ 接貼㈣該餘11 1的基座12的底面 122’而其他電子元件74與該散熱器i的基座12的底面 M302869M302869 VIII. New description: [New technical field] A kind of heat dissipating device, especially related to the kind of anti-scattering device. $Sub-reading contact is short-circuited [Prior Art] As the integrated circuit develops toward the intensive and complicated direction, the heat generated by the electronic element crying device during operation also changes - the normal operation of the component is changed. Rehabilitation is due to the fact that the piece is sent to the south, and the seat of the New Ordo, the seat is ready. Among them, when the central processor is working, it handles crying::m. Therefore, a heat sink must be installed to ensure that the central unit works properly at lower temperatures. The singular crying A-seat 4 v shown in the Continental Patent No. 235746. 2 is used for the heat transfer medium of heat transfer capacity, and another one is used to protect the 埶 、 , , ^The clothing protection cover will be dimmed; the heat transfer medium protection cover, the heat transfer heat sink base needs to be removed when the base plate is directly connected, and the 埶, 伸, extension is the tying ~ connected to the top surface of the central processor The board is also equipped with a large number of 1 detectors: the device is made of conductive metal materials (such as Ming, copper, etc., and the bottom of the base of the fruit-release radiator). If the interval is relatively close, it is easy to make a point, and the board is attacking some electronic components. It is necessary to damage the electronic components on the circuit board. The heat release device is modified to prevent the short circuit phenomenon. Research and ============================================================================================== A heat sink that is short-circuited with other electronic components on the board. The above object provides a heat dissipating device, which includes a heat sink, a back plate, and a plurality of fixing devices mounted on the heat sink. The heat sink includes a base and a plurality of heat dissipating fins. Mounted on a circuit board, one side of the circuit board is provided with an electronic chip, and the back board is mounted on the other side of the circuit board opposite to the electronic chip. The fixing devices are fixed to the back board through the circuit board. The heat sink is further secured to the electronic chip of the circuit board, the heat sink further comprising a first insulating polyester film, a second insulating polyester film and a third insulating polyester film, the first insulating poly An ester film is disposed on a bottom surface of the base, and an opening is formed in the first insulating polyester film, and a top surface of the electronic chip can be attached to the base of the heat sink through an opening of the first insulating polyester film a plurality of other electronic components are disposed on the circuit board, and the second insulating polyester film and the third insulating polyester film are respectively disposed on upper and lower sides of the back plate, and the insulating polyester film can prevent The other electronic components on the circuit board are short-circuited in contact with the surface of the heat sink or the backplane. The present invention has the following advantages: the bottom surface of the heat sink base is provided with a first insulating polyester film, and the electronic chip can pass through the first An opening of an insulating polyester film is attached to the bottom surface of the base of the heat sink to effectively dissipate heat from the electronic chip, and other electronic components cannot be in contact with the base of the heat sink due to the barrier of the first insulating polyester film. The short circuit is prevented from being formed; a second insulating polyester film and a third insulating polyester film are respectively disposed on the upper surface and the lower surface of the back plate to prevent short circuit between the back plate and the electronic M302869 component on the back surface of the circuit board. Read more about the characteristics of this creation. Read the following detailed description of the creation and the attached τ 内谷明翏i, tea examination and explanation, not used to limit the creation of this creation [Implementation] τ 图至四Figure, the creation is a kind of heat sink device, which comprises a heat sink second r#...: insulating polyester film 2, a back plate 3, -, in the second two H, one brother three insulating poly Film 5 and 6 are respectively mounted two fixing means. The heat sink 1 is mounted on one side of the circuit board 7 and is provided with an electronic chip 22 and IT. The other electronic components 74 and the other side of the coffee chip 72 are also provided with a plurality of other electric wires. The utility model comprises a base 12 and heat dissipation fins 14 protruding from the upper surface. The four corners of the base 12 of the heat sink 1 are respectively provided with a fixing device 6 corresponding to the inside of the hole. ^ Women's clothing The first insulating polyester film 2 Tian QAir彳n. Attached to the bottom surface 122 of the base money, the raft/adhesive directly drills the opening-opening 22, and the opening=the middle two corresponds to the size of the electronic wafer 72 1 22 and the β-mesh of the electronic chip 72: Birthday is a little bigger. The heat sink 1 is mounted on the circuit board 7 film 7: the top surface 722 of the sheet 72 passes through the first insulating polyester sheet, and the bottom surface 122' of the base 12 of the remaining 11 1 and other electrons The bottom surface M302869 of the element 74 and the base 12 of the heat sink i
12 2之間間隔有n p & μ ^ _ I 、、、巴、、彖®曰溥膜2，因而該第一絕绫夸 酯薄膜2可以防止兮帝4 7 ' 忒屯路板7上的其他電子元件74與散 t °° 1的基座12的底面122接觸發生短路。 該背板3是由鋼材製成的，其裝設在該電路板 子晶片72相對的另—側，該背板3呈方框狀，其中部開 設-開孔32 ’該背板3的四角對應該電路板？的 76開設有四螺接孔34。 孩弟一、、，巴緣來酯溥膜4是採用3M 467不There are np & μ ^ _ I , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The other electronic component 74 is short-circuited in contact with the bottom surface 122 of the susceptor 12 having a dispersion of ° ° ° 1 . The back plate 3 is made of steel and is disposed on the opposite side of the circuit board sub-wafer 72. The back plate 3 has a square shape, and the middle portion is opened-opened 32'. Should the board be? The 76 is provided with a four screw hole 34. Child brother,,,,,,,,,,,,,,,,,,,,,,,,,,,,,
貼在該背板3朝向電路板7的7罝接拈 电峪板7的上表面，戎第二絕緣聚酯薄 ^ 4可以防止，板3與電路板7f面的電子元件μ接觸 舍生短路。該第二絕緣㈣薄膜4也呈方框狀，其上 ?板3的開孔32開設一開孔42，其四角對應該背板; 的四螺接孔34開設四通孔44。 該第三絕緣聚酯薄膜5是採用3M 467 =背板”向電路板7的下表面，該第三絕緣= 、5可以防止背板3與另一相鄰的電路板（圖未示）上 電子元件接觸發生短路。該第三絕緣㈣_5也呈方框 狀’其上對應該背板3的開孔32開設一開孔52,其 對應該背板3的四螺接孔34開設四通孔54。 /、 每一固定裝置6包括一螺栓62及一彈菁⑽。該螺检 的桿體後端是一螺帽64，桿體前端開設有外螺紋Μ。 該彈簧68套設在該螺栓62的桿體上。料時將 ^的前端制穿過該電路板7的穿孔76、第二絕緣聚醋 物4的通孔44後，再螺接到該背板3的螺接孔％ 即可將該散熱器1穩固地鎖固固定到電路板7的電子晶片 M302869 72上方。該彈簧6δ抵頂在該螺栓 器1的基座12之間，使㈣^ 1α〇螺巾目64和该散熱 到該電子晶片72的頂面;的底面彈性屢接 一声2:: J '亥散熱器1的基座12的底面122上設有 絕二膜2’該電子…可以穿過第-底面〗从二 以貼接到該散熱器1的基座12的 元件74列’^電子晶片72有效地散熱，而其他電子 1的基座旨薄膜2的阻隔不能和散熱器 3 板7背面的電子元件接納0 ::防止为板3與電路 醋薄膜5可_ 8 生短路’而該第三絕緣聚 上的電子元件==另一相鄰的電路板(圖未示） ·〆專膜2、弟一絕緣聚酯薄膜4、第二绍 不僅僅限定為聚酉旨材料，從作^ 可奋規i曰^ 有絕緣功能的薄膜（如塑膠薄片）即 二5、白、，目的和效果。而這些技術特徵的替換，都是 的，通技術人員不需要創造性勞動就能實現 相應牛的改變和變H技術方案和技術構思做出其他各種 含於本創作之 【圖式簡單說明】 M302869 第-圖是本創作散熱裝置及電路板的立體分解圖。 第二圖是本創作散㈣置及電路板另—角度的立體分解 圖。 =二圖是本創作散熱裝置及電路板的立體組合圖。 弔四圖是本創作散熱裝置及電路板的側視圖。 【主要元件符號說明】 散熱器 12基座 14散熱鰭片 第一絕緣聚酯薄膜 22開口 背板 %開孔 第二絕緣聚酯薄膜 開孔 第二絕緣聚酯薄膜 52開孔 1固定裝置 ”螺栓 66外螺紋 電路板 ^電子晶片 電子元件 122底面 34螺接孔 44通孔 54通孔 64螺帽 68彈簧 722頂面 76穿孔 M302869 78電子元件The second insulating polyester film 4 is attached to the upper surface of the back plate 3 facing the circuit board 7, and the second insulating polyester film 4 prevents the electronic component μ of the board 3 and the circuit board 7f from being in contact with each other. . The second insulating film 4 is also in the shape of a square. The opening 32 of the upper plate 3 defines an opening 42 which is opposite to the back plate. The four screw holes 34 define four through holes 44. The third insulating polyester film 5 is a lower surface of the circuit board 7 using a 3M 467 = back plate, and the third insulation = 5 prevents the back plate 3 from being on another adjacent circuit board (not shown). A short circuit occurs in the contact of the electronic component. The third insulation (4)_5 is also in the shape of a box. The opening 32 corresponding to the back plate 3 defines an opening 52, and a four-hole hole is formed in the four screw holes 34 of the back plate 3. 54. Each of the fixing devices 6 includes a bolt 62 and an elastic crest (10). The rear end of the screw body is a nut 64, and the front end of the rod body is provided with an external thread Μ. The spring 68 is sleeved on the bolt. The front end of the rod is passed through the through hole 76 of the circuit board 7, the through hole 44 of the second insulating polycondensate 4, and then screwed to the screw hole of the back plate 3, that is, The heat sink 1 can be firmly fixedly fixed to the electronic chip M302869 72 of the circuit board 7. The spring 6δ is abutted between the bases 12 of the bolter 1, so that the (four) ^ 1α 〇 巾 目 64 and the Dissipating heat to the top surface of the electronic chip 72; the bottom surface is elastically repeated 2:: J' The bottom surface 122 of the base 12 of the heat sink 1 is provided with an absolute film 2' - bottom surface from the element 74 attached to the base 12 of the heat sink 1 "electronic wafer 72 effectively dissipates heat, while the base of the other electrons 1 does not block the film 2 and the back of the heat sink 3 The electronic component accepts 0:: prevent the board 3 from the circuit vinegar film 5 can be _ 8 short circuited 'and the third insulation gathers the electronic component == another adjacent circuit board (not shown) 2, the brother of an insulating polyester film 4, the second is not only limited to the material of the polythene, from the work can be used to test the i曰^ film with insulating function (such as plastic sheet) that is two, white, purpose and The effect is replaced by these technical features. The technicians can realize the change and change of the corresponding cows without any creative labor. The technical solutions and technical ideas are made in various other forms. M302869 The first picture is an exploded view of the heat sink and the circuit board of the creation. The second picture is the three-dimensional exploded view of the creation (four) and the other angle of the circuit board. The second picture is the three-dimensional image of the heat sink and the circuit board. Combination diagram. Hang four map is the creation of heat sink and electricity Side view of the board. [Main component symbol description] Heat sink 12 base 14 heat sink fins First insulating polyester film 22 Open back plate % opening Second insulating polyester film opening Second insulating polyester film 52 open Hole 1 fixing device" bolt 66 external thread circuit board ^ electronic chip electronic component 122 bottom surface 34 screw hole 44 through hole 54 through hole 64 nut 68 spring 722 top surface 76 perforation M302869 78 electronic components