TWM296470U - Module of supporting rotating disc for wafers - Google Patents

Module of supporting rotating disc for wafers Download PDF

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Publication number
TWM296470U
TWM296470U TW095203136U TW95203136U TWM296470U TW M296470 U TWM296470 U TW M296470U TW 095203136 U TW095203136 U TW 095203136U TW 95203136 U TW95203136 U TW 95203136U TW M296470 U TWM296470 U TW M296470U
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Taiwan
Prior art keywords
fitting portion
wafer
circular disk
grooves
turntable module
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TW095203136U
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Chinese (zh)
Inventor
Ben-Neng Liau
Shiu-Ming Shie
Chang-Ching Jau
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Quick Serve Entpr Co Ltd
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Priority to TW095203136U priority Critical patent/TWM296470U/en
Publication of TWM296470U publication Critical patent/TWM296470U/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

M296470 八、新型說明: 【新型所屬之技術領域】 本創作係有關於一種晶圓片之支撐轉盤模組,尤指一 種在其上6又有彼此保持在同一平面之至少二又體,各該二 叉體可供至少一晶圓片(Wafer)放置其上,當各該二叉 體k位置移至另-位置時,該晶圓片可平穩地被放置在 忒另一位置處,以解決習知各該二叉體容易向下傾斜,導 致無法支撐該晶圓片所衍生之缺點。 【先前技術】 按’年來,由於半導體產業之蓬勃發展,各式各樣 之金屬氧化物半導體⑽8)電晶體之結構及其製造方法, 不斷地被研究與開發出來,此—發展趨勢,不僅加速了資 afUL通之速度及效率,亦為人們在生活及讀上帶來極大 之便利性。 兩業界在對—晶圓片(Wafer)進行各項製程作業 時,係當將該晶圓片從—位置移至另-位置時,大都係透 過:支撐魅來進行,絲,習知該描難結構,請參 閱第1圖所不’係、包括-圓形麵10、至少二又體H )至乂疋位條12(Retainer)及至少一壓板13, 體10之表面上係設有至少二槽溝m ’各該 曰^ 彼此間隔—定距離且係沿該圓形盤體10之外 f緣走向設置’各該二槽溝m在彼此對應側之間係連接 有二且及各該二槽溝101在彼此另-側係各設 彳 且4另一槽溝1〇2之一側邊係與該二凹溝 M296470 103之另一側邊同在一直線上,這使得該另一槽溝1〇2與 該二凹溝103距離該圓形盤體10之外周緣的距離不相 同,且该圓形盤體1〇上並設有一中心軸孔。 再者,各該二叉體n之一端表面上係設有一溝缝 111各違—叉體Π在設有該溝縫ill之一端部分恰可伸 入該圓形盤體10上之各該二槽溝1G1内,另一端則伸出 該圓形盤體10外,且該溝縫U1係與該另—槽溝1〇2之 一侧邊及該二凹溝103之另一側邊同在-直線上,並在該M296470 VIII. New description: [New technical field] This creation is about a supporting turntable module for wafers, especially a kind of at least two bodies on which 6 are kept in the same plane. The diver body can be placed on at least one wafer (Wafer), and when each of the two forks k is moved to another position, the wafer can be smoothly placed at another position to solve It is known that each of the dip bodies is easily tilted downward, resulting in the inability to support the disadvantages derived from the wafer. [Prior Art] According to the 'years of the year, due to the booming development of the semiconductor industry, various metal oxide semiconductors (10) 8) crystal structures and their manufacturing methods have been continuously researched and developed. This development trend not only accelerates The speed and efficiency of the afUL pass also bring great convenience to people in life and reading. When the two industries perform various process operations on the Wafer, when moving the wafer from the position to the other position, most of them are through the support of the charm, and the wire is known. For the difficult structure, please refer to Fig. 1 for the structure, including - the circular surface 10, the at least two body H), the retaining strip 12 (Retainer) and the at least one pressing plate 13, and the surface of the body 10 is provided with at least The two grooves m' are each spaced apart from each other by a distance and are disposed along the outer edge of the circular disk body 10. The two grooves m are connected between the corresponding sides and each of the two grooves The two grooves 101 are disposed on the other side of each other and the side of one of the other grooves 1〇2 is in line with the other side of the two grooves M296470 103, which makes the other groove The groove 1〇2 and the two grooves 103 are different in distance from the outer circumference of the circular disk body 10, and a circular shaft hole is disposed on the circular disk body 1 . Furthermore, one end surface of each of the two fork bodies n is provided with a groove 111, and each of the two ends of the two sides of the second body n is inserted into the circular disk body 10 at one end portion of the groove ill In the groove 1G1, the other end protrudes out of the circular disk body 10, and the groove U1 is co-located with one side of the other groove 1 2 and the other side of the second groove 103 - on the line, and in the

溝縫111上係嵌入有各該定位條12 定位在該_盤㈣上之各該二槽_=—又體11 另,各該驗13之職及A,M蚊以錄在該圓形盤 體10表面之各該二槽溝101 ±,且各該壓板13之一壓設 面係設有另—溝縫131,該另—騎ΐ3ι恰可與該溝縫⑴ 相對應,以使各該壓板13可穩固地將各該二又體u之一 端定位在該圓形盤體10上之各該二槽溝而内。 藉此,當欲將該晶圓片從一健移至另一 圓形健1〇之中心軸孔⑽在受到-驅動軸(圖中未干°) 之驅動,並使各該二叉體11支擇在該晶圓片之底部,經 該驅動轴旋轉使_職體1G旋轉—駿,再透過各兮 二叉體11將其上之該晶圓片移至另_位置放置。- 惟,習知該切馳結構在實際作#上 幾項缺點: I碉如以下 1由於。亥支樓轉盤之作業環境係處在一化學 因此,該支撐轉盤在長期使用 ^ -豆中, 下,各易受到該化學氣體之 6 M296470 影響而顧,導致該定位條12之剛性脆弱。 2、由於,鍵位條12受到賴,辟翻彳性,導致該 壓板13無法穩固地將各該_ ^ 上之AUf, 體疋位在該圓形盤體仞 下傾ί 如此各該二又體11向 fMO Γί其上之該晶㈣雜,或者在該圓形盤 ϊ㈣―角度時,受到離心之影響,以將各該二叉體 Η上之該晶圓片甩出。 3、由於該支撐轉盤之作業完全自動化,因此,前述第 1及2,問題發生時,不健個製程將停擺,同時該晶圓 亦將叉損’在維修處理上亦造成嚴重困擾 體製程與工時。 疋叩心曰正 基於此,由前述第卜2及3項缺點可知,透過習知 該支撐轉魅構在實際作業上,將紐提高生產良率,降 低生產錯辭與生產成本,且達者所賊之要求, 然而,前述該支撐轉盤結構卻是目前所採用,故有必要對 其作新的設計以解決前述之缺點。 【新型内容】 有鑑於上述之介紹,得知f知晶圓片之支撐轉般社 構,由於該_舰上之各該二叉體容易因柄處環=因° 素而造成向下傾斜,導致對該晶圓片在整個製程作業上產 生影響,進而無法提高生產良率,降低生產錯誤率與生產 成本,因此,創作人以從事該行業多年之經驗,乃經過長 久努力研究與實驗,終於開發設計出本創作之—種「晶圓 片之支撐轉盤核組」,以提南該晶圓片之生產良率。 M296470 本=作之目的,在提供—種晶圓片之支撐轉盤模組, 透〜支榜轉盤模組可確保其上所設之至少二叉體不會 同時使位在各該又體上之該晶圓片得以因製程 地從—位置移至另—位置放置,而採用該支撲 轉盤核組有下列之優點: 上⑴不再設有原先結構中之該定位條,因此,不再受 到视學讀之辟而賴,導致奴位條之曝脆弱。The groove 111 is embedded with each of the two slots _=-the body 11 of the positioning bar 12 positioned on the disk (four), and the respective 13 and A, M mosquitoes are recorded on the circular disk. Each of the two grooves 104 of the surface of the body 10, and one of the pressing plates 13 is provided with a further groove 131, and the other rider 3 ι corresponds to the groove (1) so that each The pressure plate 13 can stably position one end of each of the two bodies u in each of the two grooves on the circular disk body 10. Thereby, when the central axis hole (10) of the wafer is moved from one to the other, the central shaft hole (10) is driven by the drive shaft (not dry in the figure), and each of the two forks 11 is driven. At the bottom of the wafer, the drive shaft rotates to rotate the body 1G, and then moves the wafer on the wafer to the other position through the respective yokes 11. - However, there are several shortcomings in the actual implementation of the Chelsea structure: I碉 as follows 1 due to. The working environment of the Haizhulou turntable is in a chemical. Therefore, the support turntable is affected by the 6 M296470 of the chemical gas in the long-term use of the bean, which causes the rigidity of the positioning strip 12 to be weak. 2. Because the key bar 12 is subjected to turbulence, the platen 13 cannot firmly hold the AUf on the _ ^, and the body is placed under the circular disk body. The body 11 is incident on the fMO Γ 晶 , or in the case of the circular ϊ (4) ― angle, is subjected to centrifugation to pry the wafer on each of the yokes. 3. Since the operation of the support turntable is completely automated, therefore, in the first and second cases, when the problem occurs, the non-heavy process will be stopped, and the wafer will also cause a serious problem in the maintenance process. Working hours. Based on this, it is known from the shortcomings of Chapters 2 and 3 that, through the know-how, the support will be used to improve the production yield, reduce production errors and production costs, and achieve The thief's request, however, the aforementioned support carousel structure is currently used, so it is necessary to make a new design to solve the aforementioned shortcomings. [New content] In view of the above introduction, it is known that the supporting structure of the wafer is turned into a structure, because each of the two forks on the ship is easily tilted downward due to the ring at the handle. As a result, the wafer has an impact on the entire process, which in turn cannot improve the production yield and reduce the production error rate and production cost. Therefore, the creator has been working hard for many years in the industry and has been working hard for a long time. Developed and designed this kind of "wafer support turntable core set" to promote the production yield of the wafer. M296470 This is for the purpose of providing a kind of wafer supporting turntable module, and the through-supporting turntable module can ensure that at least the two forks disposed on it are not at the same time. The wafer can be moved from the position to the other position by the process, and the use of the set of the turntable core has the following advantages: (1) no longer has the positioning strip in the original structure, and therefore no longer receives It depends on the learning and reading, which leads to the fragility of slavery.

力,⑵各該二叉體不再受龍定位條之影響而向下傾 ^,意即各該叉體可確保在同一平面,有效解決習知位在 -之名曰曰圓片滑落,或者在該圓形盤體旋轉一角度時, 受到離心之影響,將各該二又體上之該晶圓片甩出之缺 點0 (3)可確健讀碰結構在作社,運作順暢,以 提南生產良率,降低生產錯誤率與生產成本。 為達成前述之目的及優點,其技術手段係在設計出一 種晶圓片之支撐轉盤模組,該支撐轉盤模組包括一圓形盤 體’其表面上設有至少二槽溝,各該二槽溝彼此間隔一定 =離且^該圓形盤體之外周緣走向設置,其二側邊分別 一有_ ί瓜〇 °卩,至少二又體,其一端二侧邊分別設有 第-瓜σ。卩’並在插入各該二槽溝中時,該第一嵌合部 恰可與該第二嵌合部相嵌合,且將各該二又體之一端穩固 ,夾持住,其另-酬伸出該_盤體外,以支撐至少〆 Β曰圓片’至壓板,其形狀及大小係足以壓緊在該圓形 瓜體表面之各紅麟上’使各賴板可翻地將各該二 8 M296470 叉體之一端壓抵在該圓形盤體之各該二槽溝中,並保持在 同一平面;如此’當各該二叉體經由該圓形盤體旋轉從一 位置移至另一位置時’該晶圓片即可平穩地被放置在該另 一位置處。 為便於貴審查委員能對本創作之技術手段及運作過 程有更進一步之認識與瞭解,茲舉實施例配合圖式,詳細 說明如下: 【實施方式】 •本創作係一種「晶圓片之支撐轉盤模組」,請參閱第2 圖所不,係本創作之一較佳實施例,該支撐轉盤模組包括 一圓形盤體20、至少二又體21 (tine)及至少一壓板22, 其中该圓形盤體20之表面上係設有至少二槽溝2〇1,各該 彡槽溝201彼此間隔一定距離且係沿該圓形盤體2〇之外 周緣走向叹置’各该二槽溝⑼丨之二對應側邊係分別設有 -第-嵌合部2G2 ’在該較佳實施例中,該第一嵌合部2〇2 • 係、呈一鸠尾狀之凸肋,且該圓形盤體20上並設有-中心 轴孔203。 再者,各该一又體21之一端二對應側邊係分別設有一 第了欣口口F 211,在該較佳實施例中,該第二嵌合部211 槽’該凹槽的形狀及大小恰與該凸肋吻 口 了相互肷合在—起,故當各該二叉體Μ之〆端在插 入各κ才曰’冓201巾時,該第-嵌合部202恰可與該第二 甘人&卩1相肷合,並將各該二叉體21之一端穩固地夾 持住,各該二叉辦 | d之另一端則伸出該圓形盤體20外, M296470 各該二叉體21之一端表面上並分別設有一第三嵌合部 212,在該較佳實施例中,該第三嵌合部212係為一凸柱。 另,各該壓板22之形狀及大小係足以壓緊在該圓形盤 體20表面之各該二槽溝2〇1上,且各該壓板22之一壓設 面係没有一第四嵌合部221,在該較佳實施例中,該第四 嵌合部221係為一溝縫,該溝縫的形狀及大小恰與該凸枉 對應嵌合,以使各該壓板22可穩固地將各該二叉體21之 一端壓抵在該圓形盤體20上之各該二槽溝2〇1中。 除此之外,復請參閱第2圖所示,為使各該壓板22 能順利地壓緊在該圓形盤體2〇表面上,係在各該壓板22 及該圓形盤體20表面上設有至少一對應之螺合孔222、 204,並藉由一螺絲205鎖固在該等螺合孔222、204中。 藉上述之構件,可清楚得知,由於各該二叉體21之一 端二側邊所設有之該第二嵌合部211,在插入各該二槽溝 201 一側邊所設有之該第一散合部2Q2後,恰可形成一段 穩固地支撐效果,再加上各該二叉體21之一端表面上所 設有之該第三嵌合部212,可被各該壓板22之壓設面上所 a又有之该弟四散合部221對應嵌合,因此,有效發揮對各 该二叉體21之穩固支撐效果,並使其始終保持在同一平 面,而不致產生向下傾斜之現象。 當欲將一晶圓片(圖中未示)從一位置移至另一位置 時,該圓形盤體20之中心軸孔203,在受到一驅動轴(圖 中未示)之驅動,並使各該二又體21支撐在該晶圓片之 底部,經該驅動軸旋轉使該圓形盤體2〇旋轉一角度,再 M296470 透過各該二叉體21將苴上 ,、 亥日日圓片移至另一位置放置0 透過本創作之構件可確保各該二叉體以始終保 wil平面’而不致產生向下傾斜之現象,如此一來, =讀盤在作業上,即可運作順暢,並提高生產良率, 降低生產錯誤率與生產成本。 惟’在此需特別注意者,乃以上所述僅係本創作之一 較佳實_,其在實際施作時,財舰於此,按凡熟悉 >員技Θ人士,根據&述較佳實施例之S計理念,藉改變 該圓形盤體20、槽溝謝、叉體2“戈壓板22之形狀,或 改變該槽溝2G卜又體21或壓板22之數量,以達成前述 使各該二讀21始終保持在同—平面,而不致產生向下 傾斜之現象者,均係賴作在此欲主張保護之範圍。 按,以上所述,僅為本創作最佳之一具體實施例,惟 本創作之技巧特徵料讎於此,雜何熟悉該項技藝者 在本創作領域内’可輕易思及之變化或修飾,應均被涵蓋 在以下本案之申請專利範圍内。 【圖式簡單說明】 第1圖係習知晶圓片之支撐轉盤結構部分分解示意圖; 第2圖係本創作晶圓片之支撐轉盤模組部分分解示 【主要元件符號說明】 圓形盤體 •••20 槽溝 ··· 201 第一嵌合部 •••202 中心軸孔 ··· 203 叉體 •••21 第二嵌合部 ··· 211 弟三嵌合部 •••212 壓板 … 22 M296470 第四嵌合部…221螺合孔 …222、204 螺絲 …205Force, (2) each of the two forks is no longer affected by the dragon positioning strip and is tilted downwards, meaning that each of the fork bodies can be ensured to be in the same plane, effectively solving the problem that the known position is falling, or When the circular disk rotates at an angle, it is affected by the centrifugal force, and the disadvantage of the wafer on each of the two bodies is 0 (3), and the structure can be operated smoothly, and the operation is smooth. Timan's production yield reduces production error rates and production costs. In order to achieve the foregoing objects and advantages, the technical means is to design a supporting turntable module for a wafer, the supporting turntable module comprising a circular disk body having at least two grooves on its surface, each of which The grooves are spaced apart from each other by a certain distance = and the outer circumference of the circular disk body is disposed, and the two sides thereof have a _ 〇 〇 卩 卩 卩 卩 卩 卩 卩 卩 卩 卩 卩 卩 卩 至少 至少 至少 至少 至少 至少 至少σ.卩' and when inserted into each of the two grooves, the first fitting portion can be fitted into the second fitting portion, and one end of each of the two bodies is stabilized and clamped, and the other - Rewarding the outside of the disk to support at least the wafer 'to the platen, the shape and size of which is sufficient to press on the red lining of the surface of the round body' One end of the two 8 M296470 fork body is pressed into each of the two grooves of the circular disk body and maintained in the same plane; thus 'when each of the two fork bodies is rotated from a position to the circular disk body At another location, the wafer can be placed smoothly at the other location. In order to facilitate your review committee to have a better understanding and understanding of the technical means and operation process of this creation, the following examples are combined with the drawings, and the details are as follows: [Embodiment] • This creation is a kind of "wafer support turntable" In a preferred embodiment of the present invention, the support turntable module comprises a circular disk body 20, at least two bodies 21 and at least one pressure plate 22, wherein The surface of the circular disk body 20 is provided with at least two grooves 2〇1, and each of the groove grooves 201 is spaced apart from each other by a distance and is slanted along the outer periphery of the circular disk body 2〇. The two corresponding sides of the groove (9) are respectively provided with a first-fitting portion 2G2'. In the preferred embodiment, the first fitting portion 2〇2 is a rib-like rib. And the circular disk body 20 is provided with a central shaft hole 203. Furthermore, each of the two ends of the body 21 is provided with a first opening port F 211. In the preferred embodiment, the second engaging portion 211 defines a shape of the groove and The size is exactly the same as the ribs of the ribs. Therefore, when the ends of the bismuth bodies are inserted into the κ 冓 冓 冓 201, the first fitting portion 202 can be The second genus & 卩 1 is coupled, and one end of each of the two fork bodies 21 is firmly clamped, and the other end of each of the two forks | d extends out of the circular disk body 20, M296470 A third fitting portion 212 is disposed on one end surface of each of the two fork bodies 21. In the preferred embodiment, the third fitting portion 212 is a stud. In addition, each of the pressing plates 22 is shaped and sized to be pressed against each of the two grooves 2〇1 of the surface of the circular disk body 20, and one of the pressing plates 22 is pressed against the surface without a fourth fitting. In the preferred embodiment, the fourth fitting portion 221 is a groove, and the shape and size of the groove are exactly matched with the protrusion, so that each of the pressing plates 22 can be stably One end of each of the two fork bodies 21 is pressed into each of the two grooves 2〇1 on the circular disk body 20. In addition, as shown in FIG. 2, in order to enable each of the pressure plates 22 to be smoothly pressed against the surface of the circular disk 2, the pressure plate 22 and the surface of the circular disk 20 are attached. At least one corresponding screw hole 222, 204 is provided thereon and is locked in the screw holes 222, 204 by a screw 205. With the above-mentioned members, it is clear that the second fitting portion 211 provided on one of the two sides of each of the two fork bodies 21 is provided on the side of each of the two grooves 201. After the first dispersing portion 2Q2, a stable supporting effect is formed, and the third fitting portion 212 provided on one end surface of each of the diverging bodies 21 can be pressed by each of the pressing plates 22. In the upper surface, the four overlapping portions 221 are correspondingly fitted, so that the stable supporting effect on each of the two forks 21 is effectively exerted and kept in the same plane at all times without causing downward tilting. phenomenon. When a wafer (not shown) is to be moved from one position to another, the central shaft hole 203 of the circular disk 20 is driven by a drive shaft (not shown), and Supporting each of the two bodies 21 at the bottom of the wafer, rotating the driving shaft to rotate the circular disk 2 by an angle, and then M296470 passes through the two forks 21, and the sunday Move the piece to another position and place it 0. The components created by this creation can ensure that each of the two-pronged body always keeps the wil-plane' without causing downward tilting. Thus, the reading plate can be operated smoothly on the job. And increase production yield and reduce production error rate and production cost. However, the person who needs special attention here is only one of the best examples of this creation. In the actual application, the financial ship here, according to the person familiar with the technical staff, according to & The S meter concept of the preferred embodiment is achieved by changing the shape of the circular disk body 20, the groove, the fork body 2, or the number of the groove 2G or the pressure plate 22. In the foregoing, the phenomenon that each of the second readings 21 is always maintained in the same plane without causing downward tilting is determined to be within the scope of protection claimed herein. In the specific embodiment, only the skill characteristics of the creation are based on this, and those who are familiar with the skill of the artist in the field of creation can easily change or modify, and should be covered in the scope of the patent application of the following case. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a partially exploded perspective view of a support turntable structure of a conventional wafer; Fig. 2 is a partial exploded view of a support turntable module of the present wafer [Key component symbol description] Circular disk body•• • 20 grooves ··· 201 First fitting part •• 202 Center shaft hole··· 203 Fork body•••21 Second fitting part··· 211 Brother three fitting parts•••212 Platen... 22 M296470 Fourth fitting part...221 screwing hole...222,204 Screw...205

1212

Claims (1)

M296470 九、申請專利範圍: 1、一種晶圓片之支撐轉盤模組,包括·· -圓形盤體,其表面上係設有至少二槽溝,各該二槽溝 彼此間隔一疋距離且係沿該圓形盤體之外周緣走向設置, 各該二槽溝之二對應侧邊分別設有一第一嵌合部,該圓形 盤體上並設有一中心轴孔; 至少二叉體,各該二叉體之一端二對應側邊分別設有一 第二嵌合部,其一端在插入各該二槽溝中時,該第一嵌合 口合可與該第一嵌合部相嵌合,並將各該二叉體之一端穩 固地夾持住,其另一端則伸出該圓形盤體外,以支撐至少 一晶圓片;及 至少一壓板,各該壓板之形狀及大小係足以壓緊在該 圓形盤體表面之各該二槽溝上,使各該壓板可穩固地將各 該二又體之一端壓抵在該圓形盤體上之各該二槽溝中。 2、 如請求項1所述之晶圓片之支撐轉盤模組,其中各 该二叉體之一端表面上分別設有一第三嵌合部。 3、 如請求項2所述之晶圓片之支撐轉盤模組,其中各 該壓板之一壓設面係設有一第四嵌合部,該第四嵌合部恰 可與該第三嵌合部對應嵌合。 4、 如請求項3所述之晶圓片之支撐轉盤模組,其中各 該壓板及該圓形盤體表面上設有至少一對應之螺合孔,並 藉由一螺絲鎖固在該等螺合孔中。 5、 如請求項4所述之晶圓片之支撐轉盤模組,其中該 弟二肷合部係為一凸柱。 13 M296470 6、 如請求項5所述之晶圓片之支撐轉盤模組,其中該 第四嵌合部係為一溝縫。 7、 如請求項4所述之晶圓片之支撐轉盤模組,其中該 第三嵌合部係為一溝縫。 8、 如請求項7所述之晶圓片之支撐轉盤模組,其中該 第四欲合部係為一凸柱。 9、 如請求項4所述之晶圓片之支撐轉盤模組,其中該 第一嵌合部係呈一鸠尾狀之凸肋。 10、 如請求項9所述之晶圓片之支撐轉盤模組,其中 該第二嵌合部係呈一鳩尾狀之凹槽。M296470 IX. Scope of application: 1. A supporting turntable module for a wafer, comprising: a circular disk body having at least two grooves on its surface, each of which is spaced apart from each other by a distance Provided along the outer circumference of the circular disk body, each of the two corresponding grooves of the two grooved grooves is respectively provided with a first fitting portion, and the circular disk body is provided with a central shaft hole; at least two fork bodies, each One end of the two ends of the two forks is respectively provided with a second fitting portion, and when one end is inserted into each of the two grooves, the first fitting mouth can be engaged with the first fitting portion, and Holding one end of each of the two fork bodies firmly, the other end of which protrudes outside the circular disk to support at least one wafer; and at least one pressure plate, each of which is shaped and sized to be compacted On each of the two grooves on the surface of the circular disk, each of the pressure plates can firmly press one end of each of the two bodies against each of the two grooves on the circular disk. 2. The support turntable module of the wafer according to claim 1, wherein a third fitting portion is respectively disposed on one end surface of each of the two fork bodies. 3. The supporting turntable module of the wafer according to claim 2, wherein a pressing portion of each of the pressing plates is provided with a fourth fitting portion, and the fourth fitting portion is just engaged with the third fitting portion. The part corresponds to the fitting. 4. The supporting turntable module of the wafer according to claim 3, wherein each of the pressing plate and the circular disk body is provided with at least one corresponding screwing hole, and is locked by a screw Screw in the hole. 5. The support turntable module of the wafer according to claim 4, wherein the two coupling portions are a stud. 13 M296470. The support turntable module of the wafer according to claim 5, wherein the fourth fitting portion is a groove. 7. The support turntable module of the wafer according to claim 4, wherein the third fitting portion is a groove. 8. The support turntable module of the wafer of claim 7, wherein the fourth portion is a stud. 9. The support turntable module of the wafer of claim 4, wherein the first fitting portion is a dovetail rib. 10. The support turntable module of the wafer according to claim 9, wherein the second fitting portion has a dovetail groove. 1414
TW095203136U 2006-02-24 2006-02-24 Module of supporting rotating disc for wafers TWM296470U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160091014A1 (en) * 2014-09-25 2016-03-31 Yung-Chiu Huang Structure of Sextant Rotary Disk

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160091014A1 (en) * 2014-09-25 2016-03-31 Yung-Chiu Huang Structure of Sextant Rotary Disk
US9765433B2 (en) * 2014-09-25 2017-09-19 Yung-Chiu Huang Structure of sextant rotary disk

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