M294118 八、新型說明： 【新型所屬之技術領域】 本新型是有關於一種電連接器組合，特別是指一種具 有信號轉接板的電連接器組合。 ^ 【先前技術】 為了提高訊號傳輸速度’目前電腦系統的積體電路封 、 裝（central Processing unit，簡稱CPU)傳導接腳多採用鲜 鲁 墊（Pad)式的平面導接點，取代傳統的針腳（pin)式插接 。而且，由於CPU朝向尺寸小型化發展，當CPU尺寸越趨 縮小，其表面的導接點之間的間距也越來越窄，傳統的球 腳袼栅陣列（ball grid array，簡稱BGA)封裝技術因為錫 球體積的限制，已經不能應用在導電端子間距較窄的插座 連接器與電路板的封裝製程上。因此而相應發展出平面格 栅陣列（land grid array，簡稱LGA)插座連接器（s〇cket) ’以供CPU與電路板電連接。 • LGA插座連接器之導電端子具有一供CPU電連接的第 一壓接部，及一與電路板電連接的第二壓接部。而電路板 上則鍍有與該等第二壓接部相對應的厚金（Au )以作為導 接點，並利用金優越的導電性質來提高導電端子與電路板 之間的導電性。由於插座連接器是以壓接方式與電路板電 連接，所以在製程上具有可重置的優點，即能夠容易地更 換设置在不同的電路板上。 然而’呈格柵陣列式的導接點（厚金）在電路板上分 P的面積僅佔電路板的一小部份區域，而且各導接點之間 5 M294118 必須控制在一預定間距，以使各導接點相互絕緣。因此， 要在大面積的電路板上鍍製僅分布小區域的導接點，除了 需避免電路板的其他區域被鍵著，也要精確控制各導接點 之間距，使其製程較難以控制，產品良率較低，而導致製 程時間及成本增加。此外，因為電路板面積很大而需要較 大型的電鍍設備來處理，也增加使用設備的成本。 - 【新型内容】 因此，本新型之目的，即在提供一種製程較易控制， _ 、、 可以減少製程時間及成本的信號轉接板，並利用該信號轉 接板將插座連接器與電路板電連接的電連接器組合。 於疋’本新型電連接器組合適用於電連接一積體電路 封裝與一電路板，該電連接器組合包含：一插座連接器及 一信號轉接板。該插座連接器包括一絕緣基座及複數導電 端子，該絕緣基座具有一底壁並定義一可安裝一積體電路 封裝的安裝面，各該導電端子固設於該底壁並具有分別凸 g 伸於該底壁兩相反側之一第一壓接部及一第二壓接部，該 第一壓接部用以供該積體電路封裝壓接。該信號轉接板包 括一板體及複數導接單元。該板體具有一供該插座連接器 組接的第一接觸面，及一與供該電路板組接的第二接觸面 。各該導接單元具有一位於該第一接觸面的導接點，及一 位於該第二接觸面並與該導接點相對應且電連接的銲接點 。各該導接點是由導電金屬所製成，用以供各該導電端子 之第一壓接部壓接，各該銲接點與該電路板銲接。 【實施方式】 6 M294118 有關本新型之前述及其他技術内容、特點與功效，在 乂下配合參考圖式之二較佳實施例的詳細說明中，將可清 楚的呈現。 在本新型被詳細描述之前，要注意的是，在以下的說 明内容中，類似的元件是以相同的編號來表示。 參閱圖1與圖2，本新型電連接器組合之第一較佳實施 例適用於電連接一積體電路封裝9與一電路板8，電連接器 組合1包含一插座連接器2及一信號轉接板3。插座連接器 2包括一絕緣基座21及複數導電端子22。絕緣基座21具 有底壁2Π及一由底壁211周緣往上延伸的圍壁212，底 壁211與圍壁212共同界定一可容置積體電路封裝9的容室 214 (底壁211位於容室214之一面定義為一安裝面）。底壁 211形成複數谷置邊等導電端子22的端子容置槽213，各該 導電端子22固設於底壁211之端子容置槽213並具有分別 凸伸於底壁211兩相反側之一第一壓接部221及一第二壓接 部222，第一壓接部221用以供積體電路封裝9之導接點 91壓接，第二壓接部222用以與信號轉接板3壓接。 信號轉接板3包括一板體3丨及複數導接單元32。板體 31具有一供插座連接器2組接的第一接觸面311，及一與電 路板8組接的第二接觸面3 12。各該導接單元32具有一位 於第一接觸面311的導接點321，及一位於第二接觸面312 並與導接點321相對應且電連接的銲接點322。各導接點 321是由導電金屬所製成，用以供各該導電端子22之第二 壓接部222壓接，該等導接點321以金（Au)材質鍍製為 7 M294118 較佳。各銲接點322可藉由錫球7與電路板8銲接。在本 實施例中，各銲接點322是位於相對應的各導接點321正 下方，並由各相對應貫穿板體3丨的導接線（圖未標示）電 連接。製作時，可先在形成有導接線的板體31上鍍製導接 點（厚金）321，再植上錫球7於各銲接點322並以表面黏 著技術將信號轉接板3銲接於電路板8上。 多閱圖3與圖4，將先行組裝完成的插座連接器2安裝 於設有信號轉接板3的電路板8上，使各導電端子22的第 二壓接部222壓接於相對應的各導接點321，而與電路板8 形成電連接。插座連接H 2可用螺鎖的方式固定於電路板8 。再將積體電路封裝9壓接於插座連接器2，使積體電路封 裝9的各導接點91與各相對應導電端子22的第一導接部 221壓接，即能使積體電路封裝9與電路板8形成電連接。 由於將積體電路封| 9目定於插座連接器、2白勺方式已經是 成热技術且非為本新型之重點，在此不再詳述。 參閱圖5與圖6,本新型本新型電連接器組合之第二較 佳實施例與該第一較佳實施例大致相同，盆 於信號轉接板3之板體31具有四電路走線層313^ = 31為一多^ t路板之結構。在本實施例中，是以四層結構 為例說明’但也可以是兩層、三層或四層以上。各電路走 線層313上佈設有複數電路走線314，使得位於第—接觸面 311上間距較窄的導接點321，可以藉由上下層之間的電路 走線3M之連接，讓位於第二接觸面312上相對應的各銲 接點322之間的距離擴大。所以當該等導接點32ι為了配 8 M294118 合積體電路封裝9 芬彡士、^ ϊ 击魂”4 1 成較小間距時，即可藉由該等電路 走線314之連接，將該等銲 士兮榮》曰1 守坪接點322之間的間距放大。因 此，該等銲接點322依鈇 口 電路祐… 依，，、、了以精由錫球7(BGA製程）與 =板8知接，不會受到積體電路封裝9尺寸縮小的影響 圖：且，由於積體電路封裝9上會安裝風扇等散熱裝置（ L不丨Μ電路板8的面積會大於積體電路封裝9， k號轉接板3即可利用此吝ψ沾；# 用此夕出的面積，擴大該等銲接點322 # 之間距，並不會增加在電路板8上估用的面積。 歸納上述，藉由較小面積的信號轉接板、3可以使導接 點321容易鍵製，再者，利用多 J用夕層玉路走線層313能放大 :等銲接點322的間距，以適用BGA製程，而能減少製程 日守間及成本，故確實能達成本新型之目的。 惟以上所述者，僅為本新型之較佳實施例而已，當不 能以此限定本新型實施之範圍，即大凡依本新型申請專利 範圍及新型說明内容所作之簡單的等效變化與修飾，皆仍 屬本新型專利涵蓋之範圍内。 【圖式簡單說明】 圖1是一立體分解圖，說明本新型電連接器組合之第 一較佳實施例； 圖2疋圖1之另一角度視圖，說明該第一較佳實施例 圖3是一不意圖，說明該第一較佳實施例之組合狀態 圖4疋一類似於圖3之視圖，說明該第一較佳實施例 M294118 之複數導電端子與一積體電路封裝及一信號轉接板之壓接 關係，其中，一絕緣基座被移除； 圖5是一分解圖，說明本新型電連接器組合之第二較 佳實施例的一信號轉接板；及 圖6是圖5之另一角度視圖，說明該第二較佳實施例 之該信號轉接板。M294118 VIII. New description: [New technical field] The present invention relates to an electrical connector assembly, and more particularly to an electrical connector combination having a signal adapter plate. ^ [Prior Art] In order to improve the signal transmission speed, the current computer system's integrated circuit unit (central processing unit, CPU) conduction pin uses the flat pad-type planar contact point instead of the traditional one. Pin-type plug. Moreover, due to the miniaturization of the CPU toward the size, as the CPU size shrinks, the spacing between the conductive points on the surface becomes narrower and narrower. The conventional ball grid array (BGA) packaging technology Because of the limitation of the volume of the solder ball, it has not been applied to the packaging process of the socket connector and the circuit board with narrow spacing of the conductive terminals. Accordingly, a planar grid array (LGA) socket connector is developed correspondingly for the CPU to be electrically connected to the circuit board. • The conductive terminal of the LGA socket connector has a first crimping portion for electrical connection of the CPU and a second crimping portion electrically connected to the circuit board. The circuit board is plated with thick gold (Au) corresponding to the second crimping portions as a guiding point, and utilizes the superior conductive properties of gold to improve the electrical conductivity between the conductive terminals and the circuit board. Since the socket connector is electrically connected to the board in a crimped manner, there is a resettable advantage in the process, that is, it can be easily replaced on a different board. However, the grid-shaped junction point (thick gold) on the board is only a small area of the board, and the 5 M294118 between the junctions must be controlled at a predetermined distance. In order to insulate the respective conductive points from each other. Therefore, it is necessary to plate the conductive points on only a small area on a large-area circuit board. In addition to avoiding the other areas of the circuit board being keyed, it is necessary to accurately control the distance between the conductive joints, making the process more difficult to control. The product yield is low, which leads to an increase in process time and cost. In addition, because of the large board area, large-scale plating equipment is required for processing, which also increases the cost of using the equipment. - [New content] Therefore, the purpose of the present invention is to provide a signal adapter board that is easier to control, _, can reduce process time and cost, and utilize the signal adapter board to connect the socket connector and the circuit board. Electrically connected electrical connector combination. The present invention is suitable for electrically connecting an integrated circuit package to a circuit board, the electrical connector combination comprising: a socket connector and a signal adapter plate. The socket connector includes an insulating base and a plurality of conductive terminals. The insulating base has a bottom wall and defines a mounting surface on which an integrated circuit package can be mounted. Each of the conductive terminals is fixed to the bottom wall and has a convex shape respectively. And a second crimping portion extending from the opposite sides of the bottom wall, wherein the first crimping portion is used for crimping the integrated circuit package. The signal transfer board includes a board body and a plurality of lead units. The board has a first contact surface for assembly of the socket connector and a second contact surface for assembly with the circuit board. Each of the guiding units has a guiding point on the first contact surface, and a soldering point on the second contact surface corresponding to and electrically connected to the guiding point. Each of the guiding points is made of a conductive metal for crimping the first crimping portions of the conductive terminals, and each of the soldering points is soldered to the circuit board. [Embodiment] 6 M294118 The foregoing and other technical contents, features and effects of the present invention will be clearly described in the detailed description of the preferred embodiment of the second embodiment with reference to the drawings. Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals. Referring to FIG. 1 and FIG. 2, the first preferred embodiment of the present invention is suitable for electrically connecting an integrated circuit package 9 and a circuit board 8. The electrical connector assembly 1 includes a socket connector 2 and a signal. Adapter plate 3. The receptacle connector 2 includes an insulative base 21 and a plurality of conductive terminals 22. The insulating base 21 has a bottom wall 2A and a surrounding wall 212 extending upward from the periphery of the bottom wall 211. The bottom wall 211 and the surrounding wall 212 together define a chamber 214 for receiving the integrated circuit package 9 (the bottom wall 211 is located). One side of the chamber 214 is defined as a mounting surface). The bottom wall 211 forms a terminal receiving groove 213 of the conductive terminal 22 such as a plurality of valleys, and each of the conductive terminals 22 is fixed to the terminal receiving groove 213 of the bottom wall 211 and has one of opposite sides of the bottom wall 211 respectively. The first crimping portion 221 and the second crimping portion 222 are used for crimping the guiding points 91 of the integrated circuit package 9 , and the second crimping portion 222 is used for the signal adapter board 3 crimping. The signal distribution board 3 includes a board body 3 and a plurality of guiding units 32. The board body 31 has a first contact surface 311 for the socket connector 2 to be assembled, and a second contact surface 312 for assembly with the circuit board 8. Each of the guiding units 32 has a guiding point 321 of the first contact surface 311, and a soldering point 322 located at the second contact surface 312 and corresponding to the guiding point 321 and electrically connected. Each of the guiding points 321 is made of a conductive metal for crimping the second crimping portion 222 of each of the conductive terminals 22. The conductive contacts 321 are made of gold (Au) material and are preferably 7 M294118. . Each solder joint 322 can be soldered to the circuit board 8 by a solder ball 7. In this embodiment, each of the solder joints 322 is located directly below the corresponding lead-points 321 and is electrically connected by respective conductive wires (not shown) that extend through the board body 3''. In the production, the guiding point (thick gold) 321 is first plated on the plate body 31 on which the guiding wire is formed, and the solder ball 7 is implanted on each soldering point 322, and the signal adapter plate 3 is soldered by surface adhesion technology. On the circuit board 8. Referring to FIG. 3 and FIG. 4, the socket connector 2 assembled in advance is mounted on the circuit board 8 provided with the signal adapter board 3, so that the second crimping portion 222 of each conductive terminal 22 is crimped to the corresponding one. Each of the contact points 321 is electrically connected to the circuit board 8. The socket connection H 2 can be fixed to the circuit board 8 by means of a screw lock. Then, the integrated circuit package 9 is crimped to the socket connector 2, and the respective conductive contacts 91 of the integrated circuit package 9 are crimped to the first conductive portions 221 of the corresponding conductive terminals 22, thereby enabling the integrated circuit. The package 9 is electrically connected to the circuit board 8. Since the integrated circuit is sealed in the socket connector and the two-way method is already a heating technology and is not the focus of the present invention, it will not be described in detail herein. Referring to FIG. 5 and FIG. 6, the second preferred embodiment of the present invention is substantially the same as the first preferred embodiment. The board 31 of the signal adapter board 3 has a four-circuit trace layer. 313^ = 31 is the structure of a multi-channel board. In the present embodiment, a four-layer structure is taken as an example to illustrate 'but it may be two, three or four or more layers. A plurality of circuit traces 314 are disposed on each of the circuit trace layers 313, so that the conductive traces 321 located on the first contact surface 311 are narrowly connected by the circuit traces 3M between the upper and lower layers. The distance between the corresponding solder joints 322 on the second contact surface 312 is enlarged. Therefore, when the conductive contacts 32ι are arranged to have a smaller pitch for the 8 M294118 integrated circuit package, the connection of the circuit traces 314 can be used. Wait for the welder 兮荣》曰1 The spacing between the Guarding Sockets 322 is enlarged. Therefore, the soldering points 322 are based on the 电路 电路 佑 ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... The board 8 is connected, and is not affected by the size reduction of the integrated circuit package 9. Moreover, since a heat sink such as a fan is mounted on the integrated circuit package 9, the area of the circuit board 8 is larger than that of the integrated circuit package. 9. The k-plate adapter plate 3 can utilize the smear; # use the area of the eve to enlarge the distance between the solder joints 322 #, and does not increase the area estimated on the circuit board 8. The guiding point 321 can be easily formed by a small area of the signal adapter board, and the wiring layer 313 can be enlarged by using a multi-J layer of the jade layer, and the spacing of the soldering points 322 can be applied. The BGA process can reduce the daily schedule and cost of the process, so it can achieve the purpose of this new type. The preferred embodiment of the present invention, when it is not possible to limit the scope of the present invention, that is, the simple equivalent changes and modifications made by the novel application scope and the novel description are still covered by the novel patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view showing a first preferred embodiment of the novel electrical connector assembly; FIG. 2 is another perspective view of FIG. 1 illustrating the first preferred embodiment. FIG. 3 is a schematic view showing a combined state of the first preferred embodiment. FIG. 4 is a view similar to FIG. 3, illustrating a plurality of conductive terminals and an integrated circuit package of the first preferred embodiment M294118. a crimping relationship of a signal adapter board, wherein an insulating base is removed; FIG. 5 is an exploded view showing a signal adapter board of the second preferred embodiment of the novel electrical connector assembly; 6 is another perspective view of FIG. 5 illustrating the signal transfer board of the second preferred embodiment.
10 M294118 【主要元件符號說明】 1 · · · 電連接器組合 311 · •第一接觸面 2 · · · 插座連接器 312 · •第二接觸面 21 · · 絕緣基座 313 · •電路走線層 211 · · 底壁 314 · •電路走線 212 · · 圍壁 32· · •導接單元 213 · · 端子容置槽 321 · « •導接點 214 · · 容室 322 _ _ •銲接點 22· · · 導電端子 7 · ·. 錫球 221 · · 第一壓接部 8 · · 電路板 222 · · 第二壓接部 9 ... 積體電路封裝 3 · · · 信號轉接板 91*… 導接點 31 · · · 板體10 M294118 [Description of main component symbols] 1 · · · Electrical connector assembly 311 · • First contact surface 2 · · · Receptacle connector 312 · • Second contact surface 21 · · Insulated base 313 · • Circuit trace layer 211 · · Bottom wall 314 · • Circuit trace 212 · · Fence 32 · · • Guide unit 213 · · Terminal accommodating groove 321 · « • Guide point 214 · · Room 322 _ _ • Soldering point 22· · · Conductive terminal 7 · ·. Tin ball 221 · · First crimping part 8 · · Circuit board 222 · · Second crimping part 9 · Integrated circuit package 3 · · · Signal adapter board 91*... Guide point 31 · · · Plate body