M290606 八、新型說明： 【新型所屬之技術領域】 本創作係為一種表面黏著型晶片電阻，尤指一種可提高電壓 負何’且加工簡單、精度需求性不高之表面黏著型晶片電阻構造 〇 【先前技術】 表面黏著型晶片電阻(SMD CHIP RESISTORS)為-種運用於pc 板上之電阻树，如第-、二圖所示，其主要係於—晶片基咖 上形成-電阻膜20，並於晶片基板1〇的兩端各形成一電極％所構 成，其中，電阻膜20係以網板印刷方式將電阻材料塗佈於晶片基 板10上所形成，而由於電阻膜_成時之#始電阻 要之笔阻值’因此在生產過中 所需要之帝阳枯、矛中义而要再以録射切割修整加工至 电值，以元成表面黏著型晶片電阻之製作。 上述之鐳射切割修整加工，前 阻·-侧上__ τ / ^之方柄簡射在電 刀鳥成—L形間_(請同時參閱第—、二圖所 此種方式生產=關之^決定所需要之電阻值；惟，雖然以 穿損壞，聯間極大之層_，而报容易造成打 因此該種表面 苍I日日片电阻亚不耐高壓 僅能達到400伏特带茂、u 用（取回文全系數約 為提古也因此被歸類為—種健電阻。 輪同表面轉型^電阻之f 種如弟三圖所示 M290606 之構&逐L被業者所研發㈣，其主要係贿射在電阻膜上切 別形f若干條上、下交錯排列之1字形間_，藉由該若干條上 、下交錯排列之1字形間_除了可修整加工出所需要之電阻值 外’同時可使加於電阻膜2〇上之電壓形成多層分屢，以降 — 形=1_^層間賴；如此’雖财可提高表面黏著型晶片電阻 之电屬負何’但以目前業者所生產之該種表面黏著型晶片電阻， 其所能負荷之賴最高安全練_僅能_細伏特；除此之 y以!田射在電阻膜2〇上切割形成若干條上、下交錯排列之1字 形間隙5G，其加工難較複雜，且精度需求性高，否則容易造成 _之粗細不均，產生負載不均，進而將容易造成 ： 降低使用壽命。 宅化 【新型内容】 本創作之目的’即在於改善上述習用表面黏著型晶片電阻所 缺失，提供—種可提高負荷，且加1簡單、精度★求 性不高之表面黏著型晶片電阻構造。 而 為達耻述目的，摘作主钱於—晶絲板切成—電阻 並於峨編物It麵μ ;純徵乃在於. 该電阻膜一側上以錯射切割形成複數條密集之直向或樺向門 藉由該複數條密集之直向或橫向間隙除了娜^ 要之電阻值外，同時可使間隙之層間電壓得 斤而 進而得以提高表面黏著型晶片電阻之 H 又有， 並使加工更為簡易。禮之㈤負何，提喊用壽命， M290606 【實施方式】 有關本創作為達到目的所運用之技術手段及其構造，兹謹再 配合第四圖至第六圖所示之實施例，詳細說明如下： 如弟四、五圖所不’本創作之表面黏著型晶片電阻主要係於 一晶片基板H)上戦-電阻賴，並於“基板_兩端各形成 全於晶片基板10上卿成，而由於電阻膜20形成時之初如带阻 =於所需要之電阻值，因此在生產過程中必需要再以：切 2正加工至所需要之電阻值，以完成表面黏著型晶片電阻之製 田惟，本創作上述之構造乃與習用表面黏著型晶片電阻大同小 二且由於=:咖訴求之重點所在，因此恕於此不再進一步 2 本創作為達到目的所運用之技術手段及其構造特徵乃 如細、五_示，在電阻卿—側上以购 之電壓形成複數的細加於電阻上 ，進而得以提4面斑乂 電壓得以降至最小 數條短而密率1直==;'片電阻之電壓負荷；再，由於該複 加狀分條電阻顧)-側，因此 ，哪晰_均或 了㈣響之負载不均亦可降低至極小，而她於上述 M290606 習用表轉著型晶片電阻可提高使用壽命。 20侧所7^ ’為糊料—可行實施例，錢在電阻膜 =上;:鋪切割形賴數條密集之橫__，該橫向間: =:Γ:至另—端的電極3°，藉由該複心 .I f 了了U工出所需要之·值外，同時由於該 複==向_嶋自1輪_物—端的電麵 ’口物__並沒有相電壓，使加於電阻 ζ平=配於電阻膜2吐，故可耐报高之使用電壓，進而:= =面齡型晶片電阻之電壓負荷；再，同樣的，由於該複數條 您木之横向卩猶_呈帶狀分佈於電_2卜側，因此加工較為 簡易，且精度需求性亦不高，即使間_之間距不均所可能影塑 之負載不均亦可降低至極小，而相較於上述習用表面黏著型晶片曰 電阻可提高使用壽命。 日乃 、，由疋’從以上之所述及圖式卿之實_可知，本創作確可 改善上述制表面黏著型晶片電阻所具有之缺失，提供一種可提 高電塵負荷，且加工簡單、精度需求性不高之表面黏著型晶片電 阻構造’·因此’本創作確具有㈣之實祕與進步性，且其構造 亦確為未曾有過，誠已符合新型專利之要件，爰依法提出專利申 口月並祈賜專利為禱’至感德便。 惟以上所述，僅為本創作之-可行實施例，該實施例主要僅 在於用以舉例綱本創作為達到目的所·之技術手段及其構造 ，因此並不能以之限定本創作之保護範圍，舉凡依本創作說明書M290606 VIII. New Description: [New Technology Field] This creation is a surface-adhesive chip resistor, especially a surface-adhesive chip resistor structure that can improve the voltage and the processing is simple and the precision is not high. [Prior Art] Surface mount type chip resistor (SMD CHIP RESISTORS) is a resistor tree applied to a pc board, as shown in the first and second figures, which is mainly formed on a wafer base coffee - a resistive film 20, And forming an electrode % at each end of the wafer substrate 1 ,, wherein the resistive film 20 is formed by applying a resistive material on the wafer substrate 10 by screen printing, and the resistive film _成时之# The resistance value of the initial resistance is required. Therefore, in the production, the imperial yang and the spear are required to be processed by the recording and cutting process to the electric value, and the surface is formed by the surface-adhesive chip resistor. The above-mentioned laser cutting and trimming processing, the front handle and the side of the __ τ / ^ square handle in the electric knife bird into the L-shaped _ (please also refer to the first - and second pictures of this way production = Guan Zhi ^ decision The required resistance value; however, although the wearer is damaged, the joint layer is extremely large, and the report is easy to cause the hit. Therefore, the surface of the surface can not reach the high voltage of 400 volts. Retrieving the full coefficient of the text is also classified as a kind of resistance resistor. The same surface transformation ^ resistance f species as shown in the third figure of M290606 &L; by L by the industry (four), its main The bribe is shot on the resistive film to form a plurality of upper and lower staggered 1-shaped spaces _, by means of the upper and lower staggered interdigitated _ _ in addition to the required resistance value can be trimmed out of the ' At the same time, the voltage applied to the resistive film 2 can be formed into multiple layers, so as to reduce the thickness of the surface of the resistive film, so that the energy of the surface-adhesive chip resistor can be increased, but it is produced by the current industry. This kind of surface-adhesive chip resistor, the highest load that can be used for its load _ can only _ Fine volts; in addition to this y to! Field shot on the resistive film 2〇 to form a number of upper and lower staggered 1-shaped gap 5G, the processing is more difficult, and the precision demand is high, otherwise it is easy to cause _ thickness Uneven, resulting in uneven load, which will easily lead to: Reduce the service life. Home [new content] The purpose of this creation is to improve the above-mentioned conventional surface-adhesive chip resistance is missing, provide a kind of increase in load, and add 1 simple, accurate ★ low-grain surface-adhesive chip resistance structure. For the purpose of shame, the main money is - the crystal plate is cut into - resistance and 峨 物 It It surface μ; pure sign is. One side of the resistive film is formed by a miscutting cut to form a plurality of dense straight or birch gates. In addition to the resistance values of the plurality of dense straight or lateral gaps, the interlayer voltage of the gap can be obtained. In addition, it is possible to increase the resistance of the surface-adhesive chip, and to make the processing easier. (5) What is the burden, the life of the call, M290606 [Embodiment] The purpose of this creation is to achieve the purpose. The method and its structure, together with the examples shown in the fourth to sixth figures, are described in detail as follows: As shown in the fourth and fifth figures, the surface-adhesive chip resistors of the present invention are mainly based on a wafer substrate. H) The upper 戦-resistance is applied to the substrate substrate 10 at both ends of the substrate, and since the resistive film 20 is formed at the beginning, such as band resistance = the required resistance value, so in the production process It is necessary to further cut: 2 to the required resistance value to complete the surface-adhesive chip resistance. The above structure is the same as the conventional surface-adhesive chip resistance and due to =: The focus of the appeal is therefore no longer further. The technical means and structural features used in this creation to achieve the purpose are as detailed as the five, indicating that the voltage is purchased on the resistance side. On the resistance, it is further improved that the voltage of the four-sided spot is reduced to a minimum number of short and the density is 1 straight ==; the voltage load of the sheet resistance; and, further, because of the complex stripe resistance, the side is , which clear _ even or (four) the load is not It can also be reduced to a minimum, and she can increase the service life of the above-mentioned M290606 switch-type wafer resistor. 20 side '7' is a paste - a feasible embodiment, the money is on the resistive film =; the paving cut depends on a number of dense horizontal __, the transverse direction: =: Γ: to the other end of the electrode 3 °, With the reinstatement, I f has the value required for the U-workout, and at the same time, since the complex == _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The resistance is flat = it is matched with the resistive film 2, so it can withstand the use voltage of the high, and then: = = the voltage load of the chip resistor of the age; again, the same, because of the multiple strips of your wood The strip shape is distributed on the side of the electricity _2, so the processing is relatively simple, and the precision requirement is not high. Even if the distance between the _ spacing is uneven, the load unevenness may be reduced to a minimum, compared with the above-mentioned conventional use. Surface-bonded wafer 曰 resistors increase lifetime. It is known from the above, and from the above, and the fact that the figure is clear, this creation can improve the defects of the above-mentioned surface-adhesive chip resistors, provide a dust load increase, and is easy to process. The surface-adhesive chip resistance structure with low precision is '· Therefore' This creation does have the secret and progressive nature of (4), and its structure is indeed unprecedented. Cheng has already met the requirements of the new patent, and has filed a patent application according to law. The month of the month and pray for the patent as a prayer. However, the above description is only a feasible embodiment of the present invention, and the embodiment is mainly used to exemplify the technical means for constructing the object and the structure thereof, and thus cannot limit the protection scope of the present creation. According to this creation manual