M272992 四、創作說明（1) 【新型所屬之 本新型涉 組中可防止其 灰塵掉落在感 【先前技術】 現有技術 路板、柔性電 塵室，即每平 的空間内，通 預期的功能， 經過如此多的 表面，也可能 感光晶片的表 檢測出來，將 晶片周圍的其 而攝像模組在 能落到感光晶 經成為攝像模 【新型内容】 本新型提 於克服現有攝 過程中容易使 為不合格產品 本實用新 技術領域】 及f像模組的零部件，具體地說是指攝像模 在，裝、振動、調焦、功測、運輸等過程中 光晶片上的防塵底座。 中’攝橡模 路板和連接 方央尺允許 過一系列自 還要經過振 程式之後， 落到感光晶 面’在出廠 該產品判定 他區域，目 經過運輸及 片表面，使 組生產企業 組由感光晶 器組裝而成 最多有1 0個 動化設備自 動、調焦、 產生的灰塵 片周圍的其 前，可通過 為不合格產 前尚沒有較 客戶振動實 該產品變成 的最大困擾 片、鏡頭 ，組裝過 直徑為0. 動完成。 功測等一 可能落在 他區域。 一系列自 品 S 若灰 好的方法 驗後，這 不良品。 、底座、電 程必須在無 5蔣的灰塵 要使產品有 系列工序。 感光晶片的 若灰塵落在 動檢測設備 塵落在感光 進行檢測， 些灰塵有可 這種現象已 供種攝像模組的防塵底座，其主要目的在 像模組在組裝、振動、調焦、功測、運輸等 灰塵落到感光晶片上，從而使該攝像模组成 的缺點。 ' 型採用如下技術方案：攝像模組的防塵底座 第5頁 M272992M272992 IV. Creation Instructions (1) [The new type of the related group can prevent its dust from falling on the ground. [Prior art] The prior art road boards and flexible electric dust rooms, that is, each flat space, pass the expected function. After so many surfaces, the surface of the photosensitive wafer may also be detected, and the other camera modules around the wafer can fall into the photosensitive crystal to become a camera module. [New content] This new model is easy to overcome in the existing photography process. For unqualified products, this utility new technical field] and the components of the f-image module, in particular, refer to the dustproof base of the optical chip on the optical chip during the process of mounting, vibration, focusing, power measurement, and transportation. "The rubber mold road board and the connecting square ruler allow a series of vibrations to fall to the light-sensitive crystal plane after going through the vibration program." At the factory, this product is determined to be in another area, and it is transported and the surface is passed, so that the production enterprise group Assembled by a photosensitive lens, there are up to 10 dynamic equipment that can automatically, focus, and generate dust chips around the front. It can be used as the most troublesome film for unqualified prenatal products that has not been shaken by customers. The lens has been assembled to a diameter of 0. The movement is completed. The power test wait may fall in other areas. A series of self-defective products are inferior. , The base, and the electric power must be free of dust, so that the product has a series of processes. If the dust on the sensor chip is detected by the motion detection device, the dust may be detected. This phenomenon is available. The dust base of the camera module has been provided. Its main purpose is to assemble, vibrate, focus, and power the image module. Measurement, transportation and other dust fall on the photosensitive wafer, which makes the composition of the camera module shortcomings. The 'type adopts the following technical solution: the dustproof base of the camera module Page 5 M272992
包括一可固 於基座上部向 固定於攝像模 光晶片接觸， 孔，該通光孔 且該隔離牆上 黏性物質層的 的可能性，而 由於該隔離牆 上，因而，可 上而產生不合 前述的基座為 柱體，並且與 座的内側壁設 前述的隔離罩 形，與感光晶 前述的基 安裝腳。 定連接於攝 上延伸形成 組感光晶片 其上部設有 的尺寸略大 表面塗布有 存在，大大 對於落在感 及其黏性物 在生產過程 格產品的機 中空且下部 基座連通， 有可與攝像 的橫截面為 片的感光區 座底面邊緣 像模組 的鏡頭 上方的 隔離牆 於攝像 黏性物 減小了 光晶片 質層的 中大大 率。 電路板 連接座 隔離罩 ，隔離 模組感 質層。 灰塵直 周圍其 保護而 減小因 上方的基 ，基座内 ，其底部 牆上開設 光晶片的 由於該隔 接落在感 他區域的 無法到達 灰塵落在 座，以及 設有一可 邊緣與感 有一通光 感光區， 離牆及其 光晶片上 灰塵，則 感光晶片 感光晶片 開口的一體連 模組的 正方形 域相適 處設有 方體’連接座為中空的圓 接於基座上表面，該連接 鏡頭配合連接的内螺紋。 ，所述的通光孔也為正方應。 四個用於與電路板裝配的 Φ 由上述對本新型結構的描述可知，和現有技術相比， 新型具=如下優點：_，原本可能落在感光晶片上的灰 ^丄在掉落過程中，可能被吸附黏固於隔離牆上表面的黏 ^物質層上，因而降低了組裝、振動、調焦、功測、運輸 專過程中灰塵直接落在感光晶片上的可能性；二，原本落 在感光晶片周圍其他區域的灰塵，由於隔離牆及其黏性物Including a possibility that the upper part of the base can be fixed to contact the optical chip fixed to the camera mold, the hole, the through hole, and the possibility of a layer of adhesive substance on the partition wall, and because of the partition wall, it can be generated The base that is not in accordance with the foregoing is a pillar, and the aforementioned isolation cover shape is provided with the inner side wall of the seat, and the aforementioned base mounting feet of the photosensitive crystal. It is connected to the camera and extended to form a group of photosensitive wafers. The upper part is provided with a slightly larger surface coated with the presence, which is great for the sensor and its sticky substances in the production process. The product is hollow and the lower base is connected. The cross-section of the camera is the partition wall above the lens of the bottom edge of the photosensitive area of the film, and the partition wall above the lens of the camera reduces the medium-to-large ratio of the quality layer of the optical wafer. Circuit board connection base Isolation cover, isolation module sensor layer. The dust is directly around its protection and is reduced due to the upper base, the bottom of the base, and the optical chip on the bottom wall. The dust can not be reached due to the partition falling in the sensitive area, and there is a rim and a sense. The light sensitive area is separated from the wall and the dust on the light chip, and the square area of the integrated module opening of the light sensor and the light sensor chip is provided with a square body at a suitable place. The connector is a hollow circle connected to the upper surface of the base. The internal fitting of the lens fits. The light-passing holes are also square. The four Φ used for assembling with the circuit board can be seen from the above description of the new structure. Compared with the prior art, the new type has the following advantages: _, the ash that may have fallen on the photosensitive wafer during the dropping process, May be adsorbed and fixed on the sticky material layer on the surface of the isolation wall, thereby reducing the possibility of dust directly falling on the photosensitive wafer during the assembly, vibration, focusing, power measurement, and transportation processes; two, it originally fell on Dust in other areas around the sensor, due to the separation wall and its stickies
，M272992, M272992
四、創作說明（3) 質層的存在，不可能在以後的 感光日日片上而使該攝像模組成 新型的隔離牆結構能夠大大提 【實施方式] 本實用新型的一個具體實施例 底座的攝像模組。 運輪、客戶貫驗過程中落到 為不合格品。由此可見，本 尚攝像模組的合格率。 ，為一採用本實用新型防塵 參照圖3，一採用本新型所提供的防塵底座的攝橡 組的剖面示意圖，包括鏡頭3、防塵底座丨、感光晶片4和 電路板5。Fourth, the creation instructions (3) the existence of the mass layer, it is impossible to make the camera mold to form a new type of partition wall structure on the next photosensitive day-to-day film [Embodiment] A specific embodiment of the utility model of the base Camera module. Ships and customers fell into non-conforming products during the inspection process. This shows that the pass rate of the original camera module. FIG. 3 is a schematic cross-sectional view of a rubber group adopting the dustproof base provided by the present invention, and includes a lens 3, a dustproof base, a photosensitive chip 4, and a circuit board 5.
參照圖1、圖2，該防塵底座1包括一基座〗丨及於基座 11上部向上延伸形成的鏡頭連接座12，基座n為中空且下 部開口的方體，連接座12為中空的圓柱體，並且其下部與 基座11連通’一體連接於基座11上表面，該連接座12的内 侧壁設有内螺紋121，並通過該内螺紋121實現與鏡頭3的 連接。 、 基座11底部四個角部設有四個安裝腳111，基座11通 過該四個安裝腳111固定安裝於電路板5上方，感光晶片4 位於電路板5上方，且位於基座1 1内部。 在基座11内設有一隔離罩2，該隔離罩2的形狀為小於 基座11的方體，其頂面與鏡頭連接座12底端面平齊，其底 部邊緣與感光晶片4密合接觸，其頂面設有一隔離牆21， 該隔離牆21上開設有一通光孔20，該通光孔20的尺寸略大 於感光晶片4的感光區，並位於該感光區正上方，且該隔 離牆2 1上表面塗布有黏性物質層，圖中未示出。Referring to FIG. 1 and FIG. 2, the dust-proof base 1 includes a base and a lens connecting base 12 extending upward from the upper part of the base 11. The base n is a hollow body with a bottom opening and the connecting base 12 is hollow. A cylindrical body and a lower portion thereof communicate with the base 11 and are integrally connected to the upper surface of the base 11. The inner wall of the connecting base 12 is provided with an internal thread 121, and the connection with the lens 3 is achieved through the internal thread 121. The four corners at the bottom of the base 11 are provided with four mounting feet 111. The base 11 is fixedly mounted on the circuit board 5 through the four mounting feet 111. The photosensitive chip 4 is located above the circuit board 5 and is located on the base 1 1 internal. A spacer 2 is provided in the base 11. The shape of the spacer 2 is smaller than that of the base 11. The top surface is flush with the bottom end surface of the lens connection base 12, and the bottom edge is in close contact with the photosensitive wafer 4. A partition wall 21 is provided on the top surface thereof. The partition wall 21 is provided with a light-passing hole 20. The size of the light-passing hole 20 is slightly larger than the photosensitive area of the photosensitive wafer 4 and is located directly above the photosensitive area. 1 The upper surface is coated with an adhesive substance layer, which is not shown in the figure.
第7頁 M272992 四、創作說明（4) 組裝、振 灰塵，原本可 ’可能被吸附 而降低了組裝 接落在感光晶 其他區域的灰 不可能在以後 而使該攝像模 構能夠有效提 前述的黏 不局限於某一 結構為現有技 ，二調焦、功測、運輸等過程中會產生少量 =洛在感光晶片4上的灰塵，在掉落過程中 * Q於隔離牆2 1上表面的黏性物質層上，因 只振動、調焦、功測、運輸等過程^灰塵直 上的可能性，而原本落在感光晶片4周圍 、’由於隔離牆21及其黏性物質層的存在， 的運輪、客戶實驗過程中落到感光晶片4上 f成為不合格品。由此可見，該隔離牆2丨結 咼攝像模組的合格率。 性物質層可以採用各種可能的黏性物質，並 ，。而鏡頭3、感光晶片4、電路板5的具體 術，並且不是本新型的重點，因此不予詳述 上述僅為本新型的一個具體實施例，但本新型的設計 心並不局限於此，凡利用此構思對本新型進行非實質性 的改動’均應屬於侵犯本新型保護範圍的行為。Page 7 M272992 IV. Creation instructions (4) Assembly and vibration dust could have been 'possibly adsorbed and reduced the ash assembled to other areas of the photosensitive crystal. It is impossible to make the camera module effective in the future. Adhesion is not limited to a certain structure. It is a prior art. A small amount of dust generated on the photosensitive wafer 4 will be generated during the two focusing, power measurement, and transportation processes. During the dropping process, * Q on the upper surface of the partition wall 2 1 On the viscous material layer, due to only the vibration, focus, power measurement, transportation and other processes ^ the possibility of direct dust, and it originally fell around the photosensitive wafer 4, 'due to the existence of the partition wall 21 and its viscous material layer, During the wheel and customer experiments, f fell on the photosensitive wafer 4 and became a defective product. It can be seen that the pass rate of the camera module of the separation wall 2 丨. The sexual substance layer can use various possible sticky substances, and. The specific techniques of the lens 3, the photosensitive wafer 4, and the circuit board 5 are not the focus of the new model, so the detailed description above is only a specific embodiment of the new model, but the design of the new model is not limited to this. Any use of this concept to make non-substantial changes to the new model 'shall be an act that violates the scope of protection of the new model.
第8頁 M272992 圖式簡單說明 【圖示簡單說明】 圖1為本新型防塵底座的立體結構示意圖。 圖2為本新型防塵底座另一角度的立體結構示意圖。 圖3為本新型實施例攝像模組的軸向剖面結構示意圖。 【主要元件符號說明】Page 8 M272992 Brief description of the drawings [Simplified illustration of the drawings] Figure 1 is a schematic view of the three-dimensional structure of the new type dustproof base. FIG. 2 is a perspective view of the new-type dustproof base at another angle. FIG. 3 is a schematic axial sectional structure diagram of a camera module according to an embodiment of the present invention. [Description of main component symbols]
第9頁 1____ 防塵底座 2____ 隔離罩 3____ 鏡頭 4____ 感光晶片 5____ 電路板 11··· .基座 12· · · .鏡頭連接座 20… .通光孔 21··· .隔離牆 121.. ..内螺紋 111· · ..安裝腳Page 9 1____ Dustproof base 2____ Isolation cover 3____ Lens 4____ Photosensitive chip 5____ Circuit board 11 ···. Base 12 ···. Lens connector 20 ... .Light hole 21 ·· .. Partition wall 121 ... Internal thread 111 ·· ..mounting feet