M265698 創作說明（1) 新型所屬之技術領域 二t創$係有關於一種可拆式散熱裝置，尤指一種使用 在纪憶體模組上的散熱裝置，俾令該可拆式散 成裝設迅速、操作簡便之功效者，且可令散熱; 之風力能更為集中者。 【先前技術】 按，由於資訊時代的來臨，電腦已經為每個人所不可 或缺的配備，而業者亦無不致力於電腦配備及週邊產品的 升級，例如隨機存取記憶體已由64〇發展至128*4mg ，未 來甚至會研發出更大容量之隨機存取記憶體，而現在的隨 機存取記憶體運作時的功率因較小，所以並不需設 熱裝置，但隨著隨機存取記憶體的記憶容量會越來越大， 相對的工作溫度也會越來越高，目此，亦需要散熱裝置來 有效降低溫度。 故，即有设汁出一種供隨機存取記憶體使用的散埶 置，如第一圖所示，該散熱裝置包含有兩散熱夾板ua、、、、 ^扇座12a及散熱風扇13a等構件，其中，兩散熱夾板u 係分別夾貼於記憶體14a的基板10a表面，風扇座i2a係自 其中一政熱夾板lla的縱長邊緣一體延伸，並懸置於M265698 Creative Instructions (1) The new technology belongs to the field of a detachable heat sink, especially a heat sink used on the Ji Yi body module, ordering the detachable bulk installation Those who are fast and easy to operate and can dissipate heat; those whose wind energy can be more concentrated. [Previous technology] According to the advent of the information age, the computer has been indispensable for everyone, and the industry has been committed to the upgrade of computer equipment and peripheral products. For example, the random access memory has been developed from 64. To 128 * 4mg, in the future, even a larger capacity random access memory will be developed. The current power of the random access memory is relatively small, so there is no need to install a thermal device, but with random access The memory capacity of the memory will be larger and larger, and the relative operating temperature will be higher and higher. Therefore, a heat sink is also required to effectively reduce the temperature. Therefore, there is a dispersive device for random access memory. As shown in the first figure, the heat dissipation device includes two heat dissipation plates ua ,,,, fan base 12a, and heat dissipation fan 13a. Among them, the two heat-dissipating plates u are respectively clamped on the surface of the substrate 10a of the memory 14a, and the fan base i2a is integrally extended from the longitudinal edge of one of the thermal-welding plates 11a, and is suspended from the
排豎立的基板LGa上方，該風扇座⑴具有通風孔，以K 引散熱風扇13a所吹出之冷風接對準記憶體Ha吹送， 熱風扇1 3a係藉由螺拴元件裝設於上述風扇座丨2&，以= 複數排暨立的基板l〇a $向吹送冷@，以I生積 女 熱效果。 π政 h創作說明（2) 惟，上=知散熱裝置雖可對記憶體^ 但因散熱風扇13a在組裝於基板1〇a上時非常二政熱， 熱風扇13a所產生的冷風並無法集中的吹送更;且散 ，而整個散熱裝置的散熱效果不佳。 。己體143處 有鑑於上述習知所產生之各問題，本案 事該行業多年之經驗，並本著精益求精之：乍二：以從 【新型内容】 了拆式政熱裝置』之產生。 本創作之一目的在於提供一 :該散熱裝置…上能達成裝設迅速以:之 係令-種可拆式散熱裝置，其 以提昇散熱效率者熱風扇所吸入之風力能更為集中， 熱之Π ί括ϊ徵ί於該散熱裝置係作為記憶體模組散 風口，而在4= 一風罩，風罩之頂面處形成有至少-通 熱風扇，另通風口處的風罩底面内則固設有散 可將該散熱裝置=兩側邊處則各設有扣具；如此，即 罩固定在記if憶體模組上’並利用該扣具使風 風扇將冷風吸入p、，且、扣座上方處，而藉由風罩内的散熱 :創：ΐ記憶體模組内以進行散熱。 板的-端係徵在於該扣具包括有-支樓板，支撐 中，並利用^ ββ軸，以樞接在風罩兩端所延設的樞接槽 丨生元件使支撐板與風罩相樞設，形成一可活 、創作說明（3) 動式的扣具，在未使用時支撐板係可往 而在支撐板的另一端則係形成有扣合槽，、σ在風罩内， 模組的扣座中。 9 以扣合在記憶體 【實施方式】 配合圖式說明如 並非用來對本創 睛參照第二圖及 有關本創作之詳細說明及技術内容 下，然而所附圖式僅提供參考與說明用 作加以限制者。 本創作係一種「可拆式散熱裝置」 π 々 第三圖所示，該散熱裝置〗〇係作為記愫二參」照第二圖 圖所示）散熱之用，該散熱裝置10包括有=，、且20 (如第四 之長度略相同於記憶體模組2〇，風星彳+ 一風罩1，風罩1 少-通風口 u，本實施例中係安;。處形成：至 有併列的兩通風口11，而散熱風扇2即用、H2 ，故具 設在相對應於通風口114的風軍U部内面用處累权^件21固 另，在風罩1的兩側邊處則各設有扣且3，哕且 J有：支樓板31，支樓板31的_端係具有樞軸3二以樞二 在風罩1兩端所延設的樞接槽12中，並在支撐板31與風罩i 之間樞設有彈性元件33 ’該彈性元件33係可為一彈菩，以 形成-可活動式的扣具3 ，且具有彈性回復力在未使 用時支撐板31係可往内收合在風罩！内，而在支撐板31的 另一端則係形成有扣合槽34，以扣合在記憶體模組2〇的扣 座201 C如第四圖所示）+’當然’該扣具3亦可為固定式 的垂直於風罩1的兩側邊處。 請續參照第二、三圖所示，本創作組裝時，即令兩散 M265698 四、創作說明（4) --- 熱風扇2藉由螺栓元件21鎖設在風罩丨内，且分別對應於通 風口 11，嗣將扣具3安裝在風罩丨的兩側邊處，使支^板“ 一端的樞接軸32扣合在風罩1的樞接槽12中，且由^性元 件33分別抵持在風罩1與支撐板31之間，而令支撐板^可 旋轉扳動，此即可大致完成一散熱裝置丨〇之組裝^ 请參照第四圖所示，當欲將散熱裝置丨〇安裝在複數排 記憶體模組20上時，即先將扣具3先往外旋轉扳動至與風 罩1略呈垂直狀態，嗣將支撐板31再略往外的扳動，使風 罩1兩支撐板31間的距離略大於記憶體模組2〇的扣座2〇1， 如第五圖所示。 此時田支撐板3 1底端之扣合槽3 4對應於記憶體模組 20，扣座201時，即利用支撐板31上的彈性元件33之彈性 力畺，使扣合槽34緊扣合住扣座2〇1，而令風罩1藉由扣具 3固定在記憶體模組20上方，如第六圖所示。 ^創作散熱裝置1 〇使用時，該散熱風扇2會將外界的 冷風藉由通風口 11吹送至記憶體模組2〇内，利用該冷風而 有效的降低§己憶體2 〇 2上的工作溫度，而達到散熱之目的 經由上述之結構說明後可知，俾利用該風罩1之設置 ’而令散熱風扇2可直接安裝在風罩1上，且可直接利用風 罩1上的扣具3 ’將整個散熱裝置丨〇安裝在記憶體模組2 〇上 ’以達成裝設迅速、操作簡便之功效。此外，藉由該風罩 L之圍設’令散熱風扇2吹送至記憶體模組2 〇上的冷風能更 為集中’以提昇散熱效率者。Above the vertical substrate LGa, the fan holder ⑴ has ventilation holes, and the cold air blown by the K-lead cooling fan 13a is aligned with the memory Ha to blow. The hot fan 1 3a is installed on the fan holder by a screw element. 2 &, with a plurality of rows of substrates 10a $ and blowing cold @ to I, to accumulate female heat effect. π 政 h creation description (2) However, the above means that although the heat dissipation device can treat the memory ^, because the cooling fan 13a is very hot when it is assembled on the substrate 10a, the cold wind generated by the hot fan 13a cannot be concentrated. The blowing is more; and scattered, and the heat dissipation effect of the entire heat sink is not good. . In view of the problems caused by the above-mentioned knowledge, this case is based on years of experience in the industry, and in the spirit of excellence: Second: the "new content" of the dismantled political heating device ". One of the purposes of this creation is to provide one: the heat sink can be installed quickly: the order-a detachable heat sink, which enhances the efficiency of heat dissipation, the wind energy absorbed by the heat fan is more concentrated, the heat Π ϊ includes the sign of the cooling device as the air outlet of the memory module, and at least 4 = a hood, the top surface of the hood is formed with at least-ventilation fan, and the bottom of the hood at the other vent The heat dissipation device is fixed inside, and the heat dissipation device is provided with buckles on both sides; in this way, the cover is fixed on the memory module, and the buckle is used to draw the cold air into the p, And, at the upper part of the buckle seat, and through the heat dissipation in the windshield: create: ΐ memory module for heat dissipation. The -end feature of the plate is that the fastener includes a -supported floor slab, which is supported, and uses a ^ ββ axis to pivotally extend the pivoting grooves extended at both ends of the windshield to make the support plate and the windshield relative to each other. It is pivoted to form a movable and creative description (3). The support plate is accessible when not in use, and the other side of the support plate is formed with a fastening groove, and σ is in the wind hood. The buckle of the module. 9 with buckle in the memory [Embodiment] If the illustration is not used to refer to the second figure and the detailed description and technical content of this creation, the drawings are provided for reference and description only. Limiters. This creation is a kind of "detachable heat sink" π 々 shown in the third picture, the heat sink 〖〇 is used as a record of two reference "(shown in the second picture) for heat dissipation, the heat sink 10 includes: , And 20 (for example, the length of the fourth is slightly the same as the memory module 20, the wind star 罩 + a wind hood 1, the wind hood 1 is less-the vent u, the system is installed in this embodiment; where: There are two vents 11 in parallel, and the cooling fan 2 is ready for use, H2, so it is provided on the inner side of the U part corresponding to the vent 114. The weight 21 is fixed on the other side of the hood 1 There are buckles 3 at each place, and J has: branch slab 31, the _ end of branch slab 31 is provided with a pivot shaft 3, and pivot 2 is provided in a pivot groove 12 extended at both ends of the windshield 1, and An elastic element 33 is provided pivotally between the support plate 31 and the windshield i. The elastic element 33 can be a spring to form a movable buckle 3, and has an elastic restoring force when not in use. The support plate The 31 series can be folded in inside the hood !, and the other end of the support plate 31 is formed with a buckling groove 34 to buckle the buckle seat 201 C of the memory module 20 as shown in the fourth figure. Show) + 'Of course' The buckle 3 may also be fixed perpendicular to both sides of the hood 1. Please continue to refer to the second and third pictures. When this creation is assembled, the two pieces of M265698 will be ordered. 4. Creation instructions (4) --- The heat fan 2 is locked in the windshield by bolt elements 21, and corresponds to Ventilation opening 11: The fasteners 3 are installed at both sides of the windshield 丨, so that the pivot shaft 32 at one end of the support plate is fastened in the pivot groove 12 of the windshield 1, and the flexible member 33 They are respectively held between the windshield 1 and the support plate 31, so that the support plate ^ can be rotated and pulled, which can roughly complete the assembly of a heat sink 丨 〇 ^ Please refer to the fourth figure.丨 〇 When installing on multiple rows of memory modules 20, first rotate the buckle 3 outwards to be slightly perpendicular to the windshield 1, and then pull the support plate 31 slightly outward to make the windshield 1 The distance between the two support plates 31 is slightly larger than the buckle seat 201 of the memory module 20, as shown in the fifth figure. At this time, the bottom groove 3 of the Tian support plate 3 1 corresponds to the memory module. 20, when the buckle seat 201 is used, the elastic force of the elastic element 33 on the support plate 31 is used to make the buckle groove 34 tightly buckle the buckle seat 201, and the windshield 1 is fixed by the buckle 3 Above the memory module 20, as shown in the sixth figure. ^ When the creative heat dissipation device 10 is used, the cooling fan 2 blows cold air from the outside into the memory module 20 through the vent 11 and uses the The cold wind effectively reduces the working temperature of § Self-remembering body 02, and achieves the purpose of heat dissipation. After the structural description above, it can be known that the use of the setting of the air hood 1 allows the cooling fan 2 to be directly installed on the air hood. 1 and the fastener 3 on the windshield 1 can be directly used to 'install the entire heat sink 丨 〇 on the memory module 2〇' in order to achieve rapid installation and easy operation. In addition, the windshield The enclosure of L is to 'concentrate the cold wind energy blown by the cooling fan 2 onto the memory module 20' to improve the cooling efficiency.
M265698 担、創作說明（5) 綜上所述，本創作之「可柝式散熱裝置」，的禮处^ 由上述所揭露之構造，達到所述之功效。且本 =f J 口物亦未公開使用…符合新型專利二= 惟，上、十、仏 已，非為限^太f之圖式及說明，僅為本創作之實施例而 ，其所依本創作】作^實施例，大凡熟悉該項技藝之人士 ，皆應涵蓋在 ^特徵範嘴’所作之其它等效變化或修飾 本案之申請專利範圍内。M265698 Description of the creation (5) In summary, the etiquette of the "Knife-type heat sink" of this creation ^ achieves the stated effect from the structure disclosed above. And this article is not used publicly ... following the new patent II = But, the upper, the ten, and the last are not limited. The drawings and descriptions of the too f are only the examples of this creation, and it is based on [This creation] As an example, anyone who is familiar with the technique should be covered by other equivalent changes or modifications made to the feature patent application.
M265698 圖式簡單說明 【圖式簡單說明】 第一圖係習知散熱裝置之立體外觀分解圖。 第二圖係本創作散熱裝置之立體外觀分解圖。 第三圖係本創作散熱裝置之立體外觀組合圖。 第四圖係本創作散熱裝置欲安裝在記憶體模組之立體圖。 第五圖係本創作散熱裝置組裝情形之平面示意圖。 第六圖係本創作散熱裝置組裝後之平面示意圖。 〔元件代表符號〕 <習知> 基板 10a 散熱夾板 11a 風扇座 12a 散熱風扇 13a 記憶體 14a <本創作> 散熱裝置 10 風罩 1 通風口 11 樞接槽 12 散熱風扇 2 螺栓元件 21 扣具 3 支撐板 31 樞軸 32 彈性元件 33 扣合槽 34 記憶體模組 20 扣座 201 記憶體 202M265698 Brief description of the drawings [Simplified description of the drawings] The first figure is an exploded perspective view of a conventional heat sink. The second figure is an exploded view of the three-dimensional appearance of the heat sink of this creation. The third picture is a combined three-dimensional appearance of the heat sink of this creation. The fourth picture is a perspective view of the original heat sink to be installed in the memory module. The fifth figure is a schematic plan view of the assembling situation of the heat sink of this creation. The sixth figure is a schematic plan view of the assembled heat sink after assembly. [Representative Symbols of Components] < Knowledge > Substrate 10a Radiating Plywood 11a Fan Holder 12a Radiating Fan 13a Memory 14a < Original Creation > Radiating Device 10 Air Hood 1 Vent Port 11 Pivot Groove 12 Radiating Fan 2 Bolt Element 21 Buckle 3 Support plate 31 Pivot 32 Elastic element 33 Buckle slot 34 Memory module 20 Buckle 201 Memory 202
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