TWM258819U - Etching device for quartz chip - Google Patents

Etching device for quartz chip Download PDF

Info

Publication number
TWM258819U
TWM258819U TW93207212U TW93207212U TWM258819U TW M258819 U TWM258819 U TW M258819U TW 93207212 U TW93207212 U TW 93207212U TW 93207212 U TW93207212 U TW 93207212U TW M258819 U TWM258819 U TW M258819U
Authority
TW
Taiwan
Prior art keywords
machine
cleaning
water collecting
water
patent application
Prior art date
Application number
TW93207212U
Other languages
Chinese (zh)
Inventor
Sheng-Yan Xiao
Original Assignee
Sheng-Yan Xiao
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sheng-Yan Xiao filed Critical Sheng-Yan Xiao
Priority to TW93207212U priority Critical patent/TWM258819U/en
Publication of TWM258819U publication Critical patent/TWM258819U/en

Links

Landscapes

  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Description

M258819 9、創作說明(1) 【新型所屬之技術領域】 本創作係有關於一種石英晶 利用壓缸可將清洗籃分別置入於 洗,並利用輸出軸呈偏心轉動, 片不致重疊,以達到最佳之清洗 【先前技術】 由於現今於石英晶片製造生 石英晶片由於表面係沾附有研磨 有蝕刻液之餘刻槽内蝕刻,再用 洗槽内清洗,但由於在蝕刻及清 貼合,而致清洗效果不佳,影響 在使用上並不夠理想。 胃 爰此,本創作人有鑑於習知 述種種之缺失’因此乃潛心加以 良,遂得以首創出本創作。 【新型内容】 本創作之目的係在提供一種 回循環清洗,並可同時進行攪動 =達到最佳之清洗致果,以及保 英晶片钱刻機。 其特徵係在於··機台,其係 水盤,係設於機台上,該集水盤 械手臂,係供固定於機A ^, 及轉動之壓缸,又機夂㊁之; 片蝕刻機 餘刻槽及 而可使托 效果。 產過程中 膏,因此 人工將石 洗時,石 到後續之 石英晶片 研究,並 ,特別是指一種 清洗槽 籃擾動 中進行清 及石英晶 ,切割 必須置 英晶片 央晶片 製程品 清洗方 經多次 完成後之 入於盛裝 放入於清 容易互相 質,所以 式具有上 試作及改 可於蝕刻 ’使石英 持機台上 設有蝕刻 之側邊開 機械手臂 ^處設有 槽及清 晶片不 清潔及 槽及清 設有排 係設有 馬達, 洗槽中來 致重疊, 乾燥之石 洗槽;集 水口;機 活動昇降 該馬達則M258819 9. Creation description (1) [Technical field to which the new type belongs] This creation relates to a quartz crystal that can be placed in the washing basket separately using a pressure cylinder and rotated eccentrically using the output shaft, so that the pieces do not overlap to achieve Optimal cleaning [Previous technology] Since the raw quartz wafers are currently manufactured on quartz wafers, the surface is etched with a grinding etchant while the surface is stained with etching solution, and then cleaned in a washing tank. However, the cleaning effect is not good, and the influence is not ideal in use. As a result of this, the author, in view of the various shortcomings in the knowledge and description, therefore devoted himself to making good, and was able to create this creation for the first time. [New content] The purpose of this creation is to provide a kind of back-loop cleaning, which can be stirred at the same time = to achieve the best cleaning results, and the British chip money engraving machine. It is characterized by a machine, which is a water plate, which is arranged on the machine. The water collecting plate mechanical arm is for fixing to the machine A ^, and the rotating pressure cylinder, and the machine is ;; The groove is notched and the supporting effect can be made. During the production process, so when the stone is washed by hand, the stone will be researched on the subsequent quartz wafer, and especially refers to the cleaning and quartz crystal during the disturbance of a cleaning tank basket. The cutting must be placed on the central wafer. After the completion of the second time, it is easy to interact with each other in the container. Therefore, the formula has a trial operation and can be modified in the etching. The quartz holding machine is equipped with an etched side opening robot arm. There is a groove and a clear wafer. Motors for cleaning and tanks and cleaning systems are arranged in the washing tank, overlapping and dry stone washing tanks; water collecting ports;

透過齒輪組,而設有偏心轉動 M258819 設有托架;清洗籃,係供套設於另於輸出軸上接 孔。 〃 ’其外緣設有漏水 【實施方式】 首先,請參閱第一圖所示,本 (1)、集水盤(2)、機械手臂(3)及 要包括有機台 豆中: ㈧及…冼監(4)所組合而成 2 口(1)其上係^刀別设有蝕刻槽(11)及& () ,其中該蝕刻槽(1 1)内係供盛裝有 α冼槽(12) φ Pl, ^ ^ ^ ^ ,甘士 +伢碰裝有蝕刻液,而清洗槽(12: τ則盛裝有清水,其中清泱捧μ w ,^ 丫,月/无槽U2)内没有入水口(13)及溢 水官(14),利用入水口(13)可於X、主^ 了輸入清水,而再由溢水管 (14)將夕餘的水排出,以供清水可以循環保持潔淨,又於 該機台(1)上分別設有一嵌合塊(15)及排水孔(16),其中 該嵌合塊(1 5 )係設呈傾斜狀。 集水盤(2) ’係嵌合於機台(丨)之嵌合塊(15)上,該集 水盤(2)之底部設有一嵌合槽(21),以供與機台(丨)上之嵌 合塊(1 5 )互相巍合定位,而可使集水盤(2 )呈傾斜狀態, 又於集水盤之側邊開設有一排水口( 2 2 ),該排水口( 2 2 )係 為集水盤(2)内傾斜之最低點,並朝向於蝕刻槽(11 )内。 機械手臂(3 ),係供固定於蝕刻槽(π )及清洗槽(1 2 ) 之間適當位置處,該機械手臂(3 )係設有一可活動昇降及 轉動之氣壓式的壓缸(31),又機機手臂(3)之前端處設有 一可調速之馬達(3 2 ),該馬達(3 2 )則可透過一齒輪組(3 3 ) ,而設有一輸出軸(3 4 ),該輸出軸(3 4 )係呈偏心轉動’又Through the gear set, eccentric rotation is provided. The M258819 is equipped with a bracket. The cleaning basket is set to be mounted on another hole on the output shaft. 〃 'The outer edge is provided with water leakage. [Embodiment] First, please refer to the first figure, the book (1), the water collecting tray (2), the robot arm (3), and the organic Taiwan bean: ㈧ and ... 冼The 2 (1) combined by the monitor (4) is provided with an etching groove (11) and & () on the knife, wherein the etching groove (1 1) is provided with an α 冼 groove (12). ) φ Pl, ^ ^ ^ ^, Ganshi + 伢 is filled with an etching solution, and the cleaning tank (12: τ is filled with clean water, of which 泱 泱 μ w, ^ ah, month / slotless U2) does not enter The water inlet (13) and the overflow officer (14) can use the water inlet (13) to input fresh water at X, and then discharge the excess water through the overflow pipe (14), so that the clean water can be kept clean by circulation. A fitting block (15) and a drainage hole (16) are respectively provided on the machine (1), wherein the fitting block (1 5) is inclined. The water collecting pan (2) 'is fitted on the fitting block (15) of the machine table (丨), and a fitting groove (21) is provided at the bottom of the water collecting plate (2) for being connected to the machine table (丨). The fitting blocks (1 5) are positioned tightly to each other, so that the water collecting pan (2) can be inclined, and a drainage port (2 2) is opened on the side of the collecting pan. The drainage port (2 2) is The lowest point of inclination in the water collecting pan (2) faces the inside of the etching tank (11). The robot arm (3) is for fixing at an appropriate position between the etching tank (π) and the cleaning tank (1 2). The robot arm (3) is provided with a pneumatic cylinder (31) which can move up and down and rotate. ), And a speed-adjustable motor (3 2) is provided at the front end of the machine arm (3), and the motor (3 2) can pass through a gear set (3 3) and an output shaft (3 4) , The output shaft (3 4) rotates eccentrically 'again

第6頁 M258819 四、創作說明(3) 於輸出軸(34)上接設有一環狀之托架(35) 清洗藍u) ’係供套設於托架(35)上,該 緣設有漏水孔(4 1 ) 〇 兀j η 使用時,如第二、三圖所示,係可先將該清洗链⑷ ΐ = 之石英晶片’然後啟動機械手臂(3),利用 刻液之姓刻槽(1D中’當可週速之馬達(32)開始轉動有時, 可透過齒輪組(33)帶動輸出軸(34)呈偏心轉動,而使托竿 (35)上之清洗籃(4)於蝕刻槽〇1)中呈偏心攪動〔如第四、 圖所不〕,可使石英晶片散開而順利洗淨,當清 時間後’則壓缸(31)上昇至定位,然後再旋轉 ^ 臂⑻位於清洗槽(12)之上方處〔如第五圖所示〕,=手 缸(31)再下降,使該清洗籃(4)完全浸入於盛裝有清2 清洗槽(12)中,同樣利用該可調速之馬達(32)轉動 透過齒輪組(33)帶動輸出軸(34)呈偏心轉動,而 05)上之清洗籃(4)於清洗槽(12)中呈偏心攪動,可使^ 英晶片散開而順利將所沾附之清洗液完全洗滌乾 1最佳之清洗效果,最後壓缸(31)再上昇帶動機械手 (3)上移,如此,則可以完成清洗之程序。 又本創作為使清洗可更徹底,係可另行設定機 =蝕刻槽(11)及清洗槽(1 2)間來回循環清洗之次數, 疋一次以上之清洗程序時,則可於清洗槽(丨2 )中完 = 之晶片,則再被機械手臂(3)透過壓缸(31)之轉動,而月i 送回蝕刻槽(1 1 )之上方處,然後重覆前述之清洗程序,直 M258819 創作說明(4) 到完全清洗乾淨為止。 同時在機械手臂(3)於蝕刻槽(11)及清洗槽(13)中移 動時〔如六圖所示〕,由清洗籃(4 )之漏水孔(4 1 )所流出 之清洗液〔或水份〕,則可落入於集水盤(2 )中,並利用 邊集水盤(2 )係呈傾斜狀態,而使餘刻液〔或水份〕可由 排水口(22)再流回至蝕刻槽(11)中收集,而濺出於集水盤 (2 )外之清洗液〔或水份〕,則可由機台(1 )上之排水孔 (1 6 )被排出另外收集,以保持整個機台之乾燥及清潔。 故由以上說明可知,本創作實施例確實具有下列之優 點: 1 ·本創作係於機台上分別設有盛裝蝕刻液及清水之蝕 刻槽及清洗槽,利用機械手臂可將裝有石英晶片之托籃浸 入於其中,而可達到清洗之作用。 2 ·本創作又於機械手臂上設有可週速之馬達所帶動 〜紋轉之輸出軸,使該輸出軸上之托籃得以於蝕刻、太 洗槽中進行攪動,传石某曰_ 久’ 清洗效果。 曰片不致重疊,而可達到最佳之 *之3主t:作另於機台上設有集水盤及排水孔,而可使濺 燥。月/之及水伤被另外收集’以保持機台上之清潔及乾 綜上所述,本創作確實可 ,且於同類產品中更未見;二用目的,功效 者,故本創作當能符合新型專利知:^用在先 專利申請’懇請早曰審結,並賜:要=$依法提出 I賜准專利,實深任感荷。Page 6 M258819 IV. Creation instructions (3) A ring-shaped bracket (35) is mounted on the output shaft (34), and the cleaning blue u) is set on the bracket (35). Leak hole (4 1) 〇 Wu j η When used, as shown in the second and third figures, the cleaning chain 先 ΐ = the quartz wafer can be used first, and then the robot arm (3) is started, and carved with the last name of the engraving liquid In the slot (1D, when the peripheral speed motor (32) starts to rotate, sometimes the output shaft (34) can be rotated eccentrically through the gear set (33), so that the cleaning basket (4) on the supporting rod (35) Agitated eccentrically in the etching bath (1) [as shown in the fourth and the figure], the quartz wafers can be scattered and cleaned smoothly. After the cleaning time, the pressure cylinder (31) rises to the position, and then rotates the ^ arm ⑻ is located above the cleaning tank (12) [as shown in the fifth figure], = the hand cylinder (31) is lowered again, so that the cleaning basket (4) is completely immersed in the cleaning tank (12) containing the Qing 2 The adjustable speed motor (32) is used to drive the output shaft (34) to rotate eccentrically through the gear set (33), and the cleaning basket (4) on 05) is eccentrically agitated in the cleaning tank (12). The wafer can be spread out and the attached cleaning liquid can be completely washed and dried. The best cleaning effect is achieved. Finally, the pressure cylinder (31) is raised again to drive the robot arm (3) to move up. In this way, the cleaning process can be completed. . In addition, in order to make the cleaning more thorough, the machine can be separately set to the number of times of cleaning cycle back and forth between the etching tank (11) and the cleaning tank (12). For more than one cleaning process, you can use the cleaning tank (丨2) If the chip is finished, the robot arm (3) rotates through the pressure cylinder (31), and the moon i is returned to the top of the etching tank (1 1), and then the cleaning process is repeated until M258819. Creation instructions (4) until completely cleaned. At the same time, when the robot arm (3) moves in the etching tank (11) and the cleaning tank (13) [as shown in the six figures], the cleaning liquid flowing out of the leakage hole (4 1) of the cleaning basket (4) [or Water], it can fall into the water collecting pan (2), and use the side water collecting pan (2) to be inclined, so that the remaining liquid [or water] can flow back to the etching from the drainage port (22) Collected in the tank (11), and the cleaning liquid [or water] splashed out of the water collecting pan (2) can be drained and collected by the drainage hole (16) on the machine (1) to keep the whole machine The table is dry and clean. Therefore, from the above description, this creative embodiment does have the following advantages: 1 This creative system is equipped with an etching tank and a cleaning tank containing etching solution and clear water on the machine, respectively. The basket is immersed in it, which can achieve the cleaning effect. 2 · This creation is also equipped with an output shaft driven by a motor capable of peripheral speed on the mechanical arm, so that the basket on the output shaft can be agitated in the etching and washing tank. 'Cleaning effect. The films do not overlap, but can achieve the best * 3. Main t: It is equipped with a water collecting tray and drainage holes on the machine to make it dry. Month / zhi and water damage are collected separately to keep the machine clean and dry. As mentioned above, this creation is indeed possible, and it is even less seen in similar products; for the purpose of use and efficacy, this creation should be able to In line with the new patent knowledge: ^ Use of the previous patent application 'please early review, and give: I would like to file a quasi-patent in accordance with the law.

M258819 圖式簡單說明 第一圖係為本創作之立體分解圖。 第二圖係為本創作之組合剖視圖。 第三圖係為本創作壓缸下降之示意圖。 第四圖係為本創作輸出軸帶動托籃偏轉之示意圖。 第五圖係為本創作機械手臂移動示意圖。 第六圖係為本創作集水盤排水之示意圖。 【元件符號說明】M258819 Schematic illustration The first picture is a three-dimensional exploded view of this creation. The second picture is a sectional view of the composition of this creation. The third picture is a schematic diagram of the descending pressure cylinder. The fourth picture is a schematic diagram of the deflection of the basket driven by the output shaft of the creation. The fifth picture is a schematic diagram of the movement of the creative robot arm. The sixth figure is a schematic diagram of drainage of the water collecting tray of this creation. [Description of component symbols]

(1) 機台 (11) 蝕刻槽 (12) 清洗槽 (13) 入水口 (14) 溢水管 (15) 欲合塊 (16) 排水孔 (2) 集水盤 (21) 散合槽 (22) 排水口 (3) 機械手臂 (31) 壓缸 (32) 馬達 (33) 齒輪組 (34) 輸出轴 (35) 托架 (4) 清洗藍 (41) 漏水孔(1) Machine table (11) Etching tank (12) Cleaning tank (13) Water inlet (14) Overflow pipe (15) Block to be assembled (16) Drain hole (2) Drain pan (21) Coupling tank (22) Drain (3) Robotic arm (31) Cylinder (32) Motor (33) Gear set (34) Output shaft (35) Bracket (4) Cleaning blue (41) Leak hole

Claims (1)

M258819 五、申請專利範圍 1· 一種石英晶片餘刻機,包括有: 機台’其係設有韻刻槽及清洗槽; 集水盤,係設於機台上,該集水盤之側邊開設有排水 口 ; 機械手臂,係供固定於機台上,該機械手臂係設有活 動昇降及轉動之壓缸,又機機手臂之前端處設有馬達’該 馬達則透過齒輪組,而設有偏心轉動之輸出軸,另於輸出 軸上接設有托架; 清洗籃,係供套設於托架上,其周緣設有漏水孔。 2·如申請專利範圍第1項所述之石英晶片蝕刻機’其 中該清洗槽内設有入水口及溢水管。 3 ·如申請專利範圍第1項所述之石英晶片蝕刻機’其 中該機台上設有傾斜狀之嵌合塊,又集水盤之底部設有嵌 合槽,以供與嵌合塊互相嵌合定位。 4·如申請專利範圍第1項所述之石英晶片蝕刻機,其 中6亥機台上設有排水孔。M258819 5. Scope of patent application 1. A quartz wafer engraving machine, including: Machine 'which is equipped with rhyme groove and cleaning tank; Water collecting tray is set on the machine, and the side of the water collecting tray is provided with Drain port; mechanical arm for fixing on the machine platform, the mechanical arm is provided with a movable cylinder for lifting and rotating, and a motor is located at the front end of the machine arm. The motor is provided with an eccentric through the gear set The rotating output shaft is also provided with a bracket on the output shaft. The cleaning basket is sleeved on the bracket, and its periphery is provided with water leakage holes. 2. The quartz wafer etching machine according to item 1 of the scope of the patent application, wherein the cleaning tank is provided with a water inlet and an overflow pipe. 3 · The quartz wafer etching machine according to item 1 of the scope of the patent application, wherein the machine is provided with an inclined fitting block, and a bottom of the water collecting pan is provided with a fitting groove for mutual fitting with the fitting block. Suitable positioning. 4. The quartz wafer etching machine as described in item 1 of the scope of patent application, wherein a drainage hole is provided on the machine.
TW93207212U 2004-05-10 2004-05-10 Etching device for quartz chip TWM258819U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93207212U TWM258819U (en) 2004-05-10 2004-05-10 Etching device for quartz chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93207212U TWM258819U (en) 2004-05-10 2004-05-10 Etching device for quartz chip

Publications (1)

Publication Number Publication Date
TWM258819U true TWM258819U (en) 2005-03-11

Family

ID=36071354

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93207212U TWM258819U (en) 2004-05-10 2004-05-10 Etching device for quartz chip

Country Status (1)

Country Link
TW (1) TWM258819U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113853064A (en) * 2021-10-08 2021-12-28 重庆御光新材料股份有限公司 Etching device is used in circuit board processing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113853064A (en) * 2021-10-08 2021-12-28 重庆御光新材料股份有限公司 Etching device is used in circuit board processing
CN113853064B (en) * 2021-10-08 2023-08-08 重庆御光新材料股份有限公司 Etching device for circuit board processing

Similar Documents

Publication Publication Date Title
US5626159A (en) Apparatus for cleaning semiconductor wafers
CN206434427U (en) A kind of scalpel cleaning device
CN206289333U (en) A kind of eider down washing and disinfecting machine for being easy to take out eider down
CN207681090U (en) A kind of auto parts and components cleaning equipment
CN106963313B (en) A kind of automatic goblet cleaner of Multi-station rotary type
CN212826087U (en) Concrete mixing host computer of convenient washing
TWM258819U (en) Etching device for quartz chip
CN212977873U (en) Semiconductor wafer polishing device
CN206045838U (en) Glue preparation rabbling mechanism
CN116274140A (en) Rust removal equipment and rust removal method for hardware
JP2002119886A (en) Method and device for separation
CN214022286U (en) Cleaning device for quartz wafer production
CN112536299B (en) Automatic intelligent cleaning device for putty powder mixing drum for building decoration
CN205463404U (en) Dental model cleaning machine
CN210560513U (en) Fur leather cleaning device for eliminating electrostatic action in fur leather product processing process
CN210146558U (en) Follow-on bolt belt cleaning device
CN208733801U (en) A kind of drainpipe hybrid stain release cleaning device based on hydraulic transmission mode
CN219781480U (en) Soybean cleaning machine capable of preventing pesticide residues
CN221046791U (en) Ultrasonic cleaner is used in metalwork processing
CN206604807U (en) A kind of advanced manufacturing industry solid waste treatment device
CN217748392U (en) Cleaning equipment for aluminum veneer
CN216026719U (en) Ultrasonic cleaning device
CN220635557U (en) Cleaning device for chip
CN213558673U (en) Mould washing unit
CN216539802U (en) Multifunctional water pump accessory cleaning device

Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees