TWM258419U - Optical subassembly for LED module - Google Patents

Description

M258419 9. Creation Instructions (1) [The original creation of the new model is composed of an optical fiber connector. [Previous technology] The above-mentioned technical field relates to a light sub-module structure. The light sub-module is a component used for assembly. The light sub-module is mainly composed of a socket and a light-emitting device. Diode. Generally, the optical sub-module is composed of a socket. The socket system is designed to provide a component that can be converted into light on the socket to pass the optical signal to the optical surface. The light efficiency can be obtained from the intensity of the sub-module. The lens structure or, for example, the light emitting device can be installed due to the lens. However, this structure is better because the surface is small and the optical sub-modules that are easy to match are sold south. The traditional light receiving light signal is converted from the optical fiber and converted into a light-emitting laser lens which is important to determine the degree and consumption of the connection position and the light condensing. So set the shot, end, but. Therefore, the transmission of the optical sub-module fiber can be performed by the light emitting device used for the signal in a large light-emitting channel to the electronic signal position, and the signal is set at one end of the channel with the light efficiency and light intensity. An optical fiber, if used, enables the light module to shoot diode light on the surface to achieve the desired component. The light emitting line is focused and emits a better type of laser. The head of the device is located in the light and light. After the information is obtained, it is known that the light can provide a quality light sub-mode device and the lens device is introduced into the diode to emit light. Set, and the number of the transmitting end is guided by the light provided by the receiving end sub-module. Achieved in the group. The transmitted optical fiber is used as the divergence angle, but the manufacturing of the optical electronic signal is for receiving the light intensity and raising the light or the lens is used for the light. Compared with the laser device, the cost of the light device is still the same as that of the light emitting diode (LED).

M258419 IV. Creation Instructions (2) " B 一 '-It is a light-emitting device with a speed of up to a155Mb / s, which can meet the speed requirements of general users. The number of users is large, and the cost is equivalent. It has advantages, but the light divergence angle of the LED is very large, so it is not enough to focus the light by a lens set in the socket, so the lens structure can be added to the LED structure to increase the effect of condensing light. . Please refer to the first figure. The LED crystal 10 includes an epitaxial portion 2 which is composed of a plurality of semiconductor material layers, and further includes an active region 14 which can provide a light source. . Secondly, the epitaxial portion 12 is bonded to a substrate 16 on one side and a microlens 18 is formed on the substrate 14. After the light is emitted from the active area 14 in this way, because the substrate is transparent to the light, the light can penetrate the substrate, and the light is collected by the micro lens 丨 8 to increase the light coupling efficiency. However, it must be formed on the surface of the substrate 16 For a micro lens 1 g, the uniformity of etching of the entire wafer must be accurately controlled, so it is quite difficult to control the yield of the process', which relatively increases the cost of the LED. In addition, the large thickness of the substrate 16 will affect the light condensing efficiency. Although the light condensing efficiency can be effectively increased by grinding the substrate 16 to increase the light coupling efficiency, but Thin 16 substrates are easy to cause cracks in the wafer, so they conflict with each other in terms of component characteristics and process yield. On the other hand, since the light is transmitted from the direction of the substrate 16, that is, the light is emitted from the backside of the wafer ', the wafer itself cannot be inspected completely, which makes it difficult to control the post-process yield. And when the light passes through the crystal 10, it is first collected by the micro lens 18 and then collected by the lens of the mount 'if the optical axis shift occurs, such as an error in the production of the micro lens when the component is aligned on the substrate surface , The coupling efficiency will be obvious

M258419 Fourth, the creation description (3) is reduced, so that the optical sub-module composed of the LED and the socket will be a finished product and cannot be effectively used. 'People are, as can be seen from the aforementioned traditional technology, the use of LED monolithic integrated lenses (Monolithic lntegrai Lens) and other packaging components single-combination, the combined light focusing effect of the two lenses can make the light intensity weaker transmission = LEDs meet the requirements of optical sub-modules, but must overcome the problem of inconvenience in production, increased cost, and easy alignment of light due to the need to make the first 18: full inspection. Heat & [New Content] One of the goals of this creation is to provide a light that uses LEDs. It has the advantages of simple production and low cost. The second purpose of this work is to provide a light sub-mode using LED, which has good light coupling efficiency, and the LED chip can be used for full inspection. According to the purpose of this creation, Efficacy, the optical sub-module consists of a docking fish and an LED device, wherein the docking station is provided with two opposite lens parts, and the 7-position light-emitting crystal has no micro lens structure. On the production of the mount ^ The aspheric size and optical axis of the glue lens-sub-H lens;; = can be precisely controlled today, and can be easily adjusted to be close to the LED light emitting surface ^, so that the large divergent light of the LED can be effective Receiving into the optical fiber, for example, in the manufacture of the LED crystal, the inconvenience and cost increase caused by the micro-etching can be avoided. In addition, the UD crystal has no micro junction, which can avoid the poor coupling rate caused by the inaccurate optical axis of the LED crystal: the problem. Secondly, because two opposite lenses are made on the adapter, so

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Through the ^ of the two lens parts, the light transmission can still obtain sufficient light intensity, so that the thickness of the substrate is two. In addition, since the lens is not provided on the crystal, the LED crystal I # ，， 可 益 涛 'makes the difficulty of the process greatly reduced; in addition-the side is emitted instead of the back: the way of Λ light emission, so that the light from the top of the stupid crystal is suitable for full inspection, and C is emitted in the opposite direction. In this way, the LED chip can be used, and the traditional low-cost packaging method is easy. Yes, ::: = The purpose, effect, and structure revealed in the creation are illustrated with examples ^ and illustrated in detail with drawings. [Embodiment] As shown in the second figure, the light exposure module is composed of a socket 20 and an LED device 40. Among them, the gift socket 20 has a channel 22, and an optical axis 2 4 is defined in the channel 22. One end of the channel 22 is an open end 26 and the other end is a closed end 28. A lens portion 32, 34 is formed on the opposite surface of the closed end 28, and the two lens portions 32, 34 can be aligned with the Optical axis 24. In addition, an accommodation chamber 36 is formed at one end of the socket 20, and the lens portion 34 corresponds to the accommodation chamber 36. The LED device 40 is arranged in the accommodation chamber 36 of the socket 20 and corresponds to the lens portion 34. The LED device 40 is composed of a light-emitting crystal 44 inside a package 42. The package 42 is made of epoxy resin, and the light-emitting crystal 44 is completely enclosed and sealed inside. The device is a traditional type of light emitting diode. Please refer to the third figure. The light-emitting crystal 4 4 is composed of a stupid crystal portion 46 and a substrate 48. The substrate 48 is disposed on one side of the epitaxial portion 46, and the other side of the epitaxial portion 46 is combined with a P-type material layer 52. When a larger thickness of p is used,

M258419 Creation note (5) type material layer 52 and fixed with silver glue can prevent the light-emitting crystal from short-circuiting during packaging. The P-type material layer 52 can be a plated metal layer or a substrate combined with a chip ( Wafer-bonded Substrate) and so on. In other words, the stupid crystal portion 46 is composed of a plurality of stupid crystal layers, and further includes an active region 4 6 2 which can provide a light source. It is worth noting that the surface of the substrate 48 is not specially fabricated with a microlens structure, but a light-transmitting surface 54 is formed on the surface of the substrate 48 so that the light emitted from the active area 462 can pass through the light-transmitting surface 54. . The LED element through which the above-mentioned light passes through the substrate 48 is called a back-emitting flat LED (Back-side

Emitting Flat LED). As shown in the fourth figure, the light-emitting crystal 4 4 of another structural form of this creation is formed on a side surface of the far epitaxial portion 46 to form a planar light-transmitting surface 52 ′, and the light-transmitting surface 52 is located at Away from the substrate 48. Therefore, the light emitted from the active area 462 will be transmitted / not transmitted by the substrate 48 through the light-transmitting surface 52 located on the side of the epitaxial portion 46. The above-mentioned LED that is emitted from the side of the epitaxial section 46 is called a top-side Emitting Flat LED. The value of 疋 'has no micro-lens structure in the direction in which the light from the edge-emitting crystal 44 is transmitted. μ ^ The surface of the light-emitting crystal 44 in the back-fired or front-emitting LED is uncontrolled = $, and the mirror has two structures. Therefore, when the light-emitting crystal 44 is manufactured, it can be removed accordingly = the micro-lens structure of the control process, This makes the production of the light-emitting crystal 44 more convenient and J can significantly reduce the manufacturing cost. % Please refer to the second figure again, when the LED device 40 and the socket 20 form a light sub-mode meeting, and the light is emitted from the LED device 40, it can pass through first. through

M258419 23, Creative Instructions (6) ^ Biao Qiao's first-time light collection, and then the second light collection by the lens portion 32: To: The light collecting effect by a lens 32, 34 can reduce the light intensity = -Come, although the divergence angle of the LED light is very large, there will still be enough :: the first line is introduced into the optical fiber, so it can meet the regulatory requirements of optical fiber communication. In addition, since the light-emitting crystal 44 does not have a microlens structure design, after the light exits the light-transmitting surface 52, it is condensed by the opposite lens portions 32 and 34, so there is no condensing. In other words, the disclosure of this creation The combination of the pass-through device 40 and the socket 20 can make coupling light easier. # On the one hand, the packaging type of the LED device 40 is the same as that of the traditional LED, so the packaging of the LED device 4G is easy ', and the combined packaging of the LED device 4Q and the socket ⑶ can be compatible with the existing process 'And can achieve the effect of easy packaging. In addition, the light-emitting crystal 44 is not provided with a micro-lens structure, so the light-emitting crystal "can select different light emission directions, especially when the light-emitting crystal" is selected as a front-emitting type (light is emitted from the side surface of the epitaxial part), The light-emitting crystal "can be fully inspected. In the above description, the light-emitting crystal 44 can be matched with a large thickness of the p-type material layer 52, so the light-emitting crystal 44 can be closer to the lens portion 34, so that the lens portion 34 can In addition to the above method, referring to the fifth figure, the top surface of the package 42 is provided with an opening M, and the length of the lens portion 34 is two, so that the light-emitting crystal 44 The distance between the lens portion 34 and the lens portion 34 is shortened, so that the lens portion 34 can enter the opening, so that the lens portion 34 is closer to the light-emitting crystal 44. Thus, although the LED device 40 The divergence angle of the light is large, but most of the light will still reach the lens portion 34 to achieve a better light concentrating effect, which is consistent with the use of the optical sub-module.

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M258419 IV. Creation Instructions (7) Requirements. Based on the above description, the design concept of this creation and the effects it can achieve are as follows: (1) The surface of the light-emitting crystal in the LED device disclosed in this creation does not have a micro-lens structure, and it is combined with the LED device to form an optical sub-module. There are two opposite lens parts on the socket, so although the light emitted by the LED device has a large divergence angle, it can still achieve the expected light intensity and coupling light under the light collecting effect of the two lens parts. Efficiency to meet the requirements of the optical sub-modules. (2) Since the surface of the light-emitting crystal disclosed in this work has no micro-lens structure, the LED device is simpler to manufacture, and the manufacturing cost can be reduced accordingly. (3) Since the LED device disclosed in this creation has the same form as the traditional LEJ), the packaging of the LED device itself is easy, and the packaging process of the LEd device and the socket to form an optical sub-module can be compared with the existing process. Content. (4) Since there is no micro-lens structure on the surface of the light-emitting crystal, the light-emission means T selects a different light-emitting form, so that the light-emitting crystal can be completely inspected to remove defective products. (5) By opening an opening on the remote package, the lens portion can be made close to the light-emitting crystal, so the light-concentrating and light-coupling efficiency can be improved, which meets the requirements of the use standard. The above are the examples and design drawings of Che Fujia for this creation. However, the preferred embodiment is only an example for illustration. It is not used to restrict the right of this creation technique. Or the following

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Page 13 M258419 Brief Description of Drawings The first drawing is a schematic diagram of the light-emitting crystal structure of the prior art. The second picture is a schematic diagram of the structure of the optical submodule of this creation. The third picture is one of the schematic diagrams of the light-emitting crystal structure of this creation. The fourth picture is the second schematic diagram of the light-emitting crystal structure of this creation. The fifth figure is a schematic diagram of the structure of another optical sub-module in this creation.

1 〇Light emitting crystal 1 2Stupid crystal part 1 4Active area 16 substrate 1 8Micro lens 20 socket 22 channel 2 4 optical axis 2 6open end 2 8closed end 3 2 lens part

3 4 lens section 36 accommodating chamber 40 LED device 42 package 44 light emitting crystal 4 6 stupid crystal section 4 6 2 active area

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Claims (1)

M258419 V. Application for patent scope 1. An optical sub-module structure using LEDs includes: a socket, which has an optical axis and two lens portions; the two lens portions are opposite and formed in the direction of the optical axis; LED The device is arranged on the socket and aligned with the optical axis of the socket; wherein the LED device is assembled with a light-emitting crystal inside a package, and a light-transmitting surface is formed on one surface of the light-emitting crystal, and the transparent The light surface is a planar structure, and accordingly, the light of the light-emitting crystal can pass through the light-transmitting surface without a lens action. 2. The light sub-module structure using LEDs as described in item 1 of the scope of the patent application, wherein the light-emitting crystal system in the LED device includes at least a substrate and an epitaxial portion, and the light-transmitting surface is formed on the substrate. 3. The light sub-module structure using LEDs as described in item 1 of the scope of patent application, wherein the light-emitting crystal system in the LED device includes at least a substrate and an epitaxial portion, and the light-transmitting surface is formed on the stupid crystal. Ministry side. 4. The light sub-module structure using LED as described in item 1 of the scope of the patent application, wherein the packaging system in the LED device refers to an epoxy resin layer, and the package body encapsulates the light-emitting crystal. 5. The light sub-module structure as described in item 1 of the patent scope], wherein the packaging system in the LED device is an epoxy resin layer, and a and a openings are opened on the package. 'Make the open mouth correspond to the light-emitting crystal and a lens portion. 6. According to the scope of the patent application (1), the light sub-module structure using LEDs returned by item 1, where the socket is provided with a-channel, one end of the channel is open, and the other _ end is closed ... The closed end is opposite One lens portion is formed on each side so that M258419