TWM256568U - Assembling structure of electronic card - Google Patents

Description

M256568 4. Creation Instructions (1) [Technical Field to which the New Type belongs] This case is about a packaging structure of an electronic card, especially a packaging structure of a small electronic card. [Previous technology] Commonly used electronic cards are widely used today, and they are gradually becoming smaller, such as modern cards, local area network cards (LAN cards), and memory cards (raemory cards). . Common international standard specifications for electronic cards include PCMCIA cards, Compact Flash cards (CF cards), secure digital cards (secure _ digital card) or multimedia memory cards (multimedia memory card, MMC CARD), etc., and new The specifications are constantly being developed. Although the specifications and details of these electronic cards are different, their packaging methods are the same as: 22 Ξ Small difference: Generally speaking, the packaging of electronic cards must provide sufficient, ★ and electrical performance, and at least must meet certain specific standards (standard ) Norms. Furthermore, the method used to package electronic cards must be too large to enable mass production. Of course, the consideration of structural strength and packaging costs is the focus of developing electronic cards. The edge electronic card packaging structure mostly combines the upper and lower conductive shells. The conductive shell is combined with the plastic frame and the spoon is snapped together. The mouthpiece "001" rivetes the upper and lower conductive shells together. 'Not only makes the conductive shell and the plastic frame not tightly connected.

M256568 3. Creation instructions (2) It becomes 'so the overall structure is sufficient'. When the electronic card is easily exposed, there are many introductions to the structure that can be loosened from the plastic frame due to the small external energy. The electronic card is subject to external force or caused bending deformation, and the severe area may also be disengaged. Refer to US Patent No. 5,490,891 No. 577624 and No. The lack of conventional technology and the strengthening of the packaging structure is actually the current situation. Since the conductive shell is made by bending, the mechanical strength is poor. The external force of the torsional or flexural force can withstand the conductive shell. Occurrence of dents or deformation, which can also be related to falling off. Although the current industry is about electronic card seals, etc., because the three-dimensional conductive shell is still made in this way, the anti-torsion force of the conductive shell is still not enough. When the flexural force acts, the conductive shell is very easy. The conductive shell and the plastic frame Dropping and separation of the joints. Regarding the technical certificate numbers of this part No. 5,379,587, No. 5,475,91 9, In addition, you can also refer to Taiwan Patent Publication Nos. 311188, 489590, and 549688. Therefore, how to develop a kind of electronic card that can improve the strength of the above-mentioned small electronic cards The problem of the urgent need to solve with the flexible electronic card. [New content]

The main purpose of this case is to provide an electronic card packaging structure, in which the three-dimensional conductive shell is formed by a metal material using metal ductility in a draft manner, and is formed by INSERT molding or Ultrasound implantation and other methods make part of the plastic material of the plastic frame fixed in the connecting parts around the three-dimensional conductive shell to strengthen

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The plastic frame and the three-dimensional light guide are conductive to the electronic card's conductive case. Due to the strong junction of the J junction, its system can solve the traditional small, while the electronic card is outside the sixty = the mechanical strength of the structure is poor, the anti-torsion force easily makes the electronic Card occurrence structure ^ continuous production = dagger body conductive shell problem. Then ask the electrons if the strength of the private machine is not good or it is falling off. The case-a more general implementation mode is to provide-a ^ a card seal σ structure, which is packaged by a processing method, which is a dagger 3 · 〃, plastic frame; and --- shaped three-dimensional conductive shell, which has a plurality of connecting parts; wherein, the three-dimensional conductive shell is stretch-molded from a metal material and is placed in the processing method. In the plastic frame body, a part of the plastic material of the plastic frame body is fixed to the connecting portions of the three-dimensional conductive shell to combine the three-dimensional conductive shell and the plastic frame. According to the above-mentioned concept of the case, the metal material is a metal plate, and the connection portions are arranged on the metal plate, and the three-dimensional conductive shell is formed by stretching the metal plate between the connection portions, and the The iso-connections are shaped like holes, sawtooth, and / or barbs. In the embodiment, the above-mentioned processing method is a special method of INSERT MOLDING, implantation, buckle, ultrasonic bonding, or high frequency bonding. According to the above-mentioned concept of the present case, the three-dimensional conductive shell comprises a recessed groove 'which is disposed on a side edge of the outer surface of the three-dimensional conductive shell. According to the above-mentioned concept of the present case, the inside of the plastic frame is provided with

Page 8 M256568 3. Creation instructions (4) An accommodating space for accommodating the internal electricity of the electronic card. According to the above-mentioned concept of the case, the electronic card (secure digital card, SD CARD), (multimedia memory card, MMC) CARD) flash drive or a smart memory card. This case further provides an electronic card packaged by a processing method, which includes:-an electrical shell 'which is formed by stretching from a metal material and has a plastic frame, which is partially made three-dimensional by the processing method. The connection portions of the conductive shell; and a substrate body combination. In the embodiment, the above-mentioned processing method is (INSERT MOLDING), implantation, buckle, supersonic and other methods. According to the above-mentioned concept of the present case, wherein the three-dimensional groove is provided on the outer surface of the three-dimensional conductive shell according to the above-mentioned concept of the present case, wherein the secure digital card (SD CARD), (multimedia memory card, MMC CARD) Smart memory card. According to the above-mentioned concept of the present case, the connection portion is arranged on the metal plate 'edge metal plate, and the metal plate is formed by stretching the connection portion between the 4th connection portion and other shapes, such as holes, sawtooth, and / or barbs.路 Elements. The card is a packaging structure and a packaging structure of a secure digital multimedia multimedia card, which is formed by a three-dimensional guide formed by a body, and has a plurality of connecting parts; a plastic material is fixed on the 'the system and the plastic frame are buried incident waves The bonded or high frequency conductive shell system includes one edge. The card is a secure digital, a multimedia memory card, a USB flash drive, or a smart material. The material is a metal. The three-dimensional conductive shell is on and the connecting parts are concave.

Creation Note (5) According to the above-mentioned concept of the present case, the substrate is a printed circuit board and is provided with a memory and / or electronic components. According to the above-mentioned concept of this case, 'Zhongfeng said its blood ^ ^ naa, T4 storm plate and the plastic frame system use INSERT MOLDING, implantation, + Shiliu Liuyi, A value into the buckle, super Sonic bonding, cycle bonding, welding or adhesive bonding, etc .: In-depth understanding of this case: This case can be illustrated by the following illustrations and examples, and a more simple illustration can be obtained to briefly explain the number of metal plates forming a three-dimensional conductive shell. -The first preferred embodiment of the packaging structure of the second sub-card packaging structure, the conductive plate of the Li Zhao conductive body, the metal plate of the solid conductive housing, and the three-dimensional conductive housing. The second figure (A): This is the shape of this case. A schematic diagram of the structure of the established embodiment. The second figure (B) is a schematic diagram of the electronic card packaging structure of the second preferred embodiment. Illustration of the preferred embodiment f4: This is the first intention of the three-dimensional conductive case of the present case. Description of pictograms 10: Three-dimensional conductive case 101

M256568

1 ο 2: Hole 201: Metal plate 30: Three-dimensional conductive case 3 1: Plastic frame 3 2: Printed circuit board 3 21: Electronic component 40 1 Groove 2 0 · Three-dimensional conductive case 202: Saw tooth 3 0 1. · Hole 311: accommodating space 322: memory 40. Three-dimensional conductive case [Embodiment] This case discloses an electronic card case by drawing (draft) plus: a three-dimensional conductive case that is formed, which is resistant to distortion The strength is larger than the conventional conductive case made of bent by the three-dimensional conductive case and plastic frame (INSERT MOLDING).

It can be fixed to the three-dimensional conductive so that the three-dimensional conductive shell and plastic frame can solve the conventional technology. The electronic card is easy to suffer from structural looseness and mechanical strength due to insufficient anti-torsion force. The packaging structure of digital card, SD has the conductive-method that stretches the metallic material to form the conductive structure of the mechanical strength technology of the three-dimensional conductive shell, so as to avoid the lack of easy breakage and breakout. At the same time, the connection structure of the original Cuoyou shot the wave to implant the special way to make the plastic kick frame around the multiple joints of the soft shell to be more tightly fixed together, so that when the force or flexing force affects, the conductive shell is deformed and broken. Or it may make the electronics poor or the case fall off. The structure is mainly used in small electronic cards such as secure digital card (CARD) or multimedia memory card (multimedia memory card, MMC CARD).

M256568 IV. Creation Instructions (7) '-η Of course, common electronic cards on the market, such as flash drives, smart memory cards, data cards (modern cards), network cards (Local Area Netw ^ k card, LAN card) and memory card (memory card) and so on. The main packaging components of the packaging structure of the electronic card in this case include three-dimensional conductive, plastic frame and a substrate. The substrate is preferably a printed circuit board, and the three-dimensional conductive shell is formed by stretching a metal plate. Please refer to the first diagram (a), which is a schematic structural diagram of a first preferred embodiment of a metal plate used to form a three-dimensional conductive shell in this case. As shown in the first figure (a), the edge of the metal plate 丨 0 ^ is provided with a plurality of holes 丨 02, which are used as a connection part for the combination of the three-dimensional conductive shell and the plastic frame. As for the three-dimensional conductive shell 10, it is formed by stretching the metal plate 101 between the holes 102 according to the required size, and extending the structure of the metal plate 101 upward, as shown in the first figure (b), The holes 10 02 are disposed on different sides of the three-dimensional conductive shell. Of course, the connecting part attached to the metal plate can also use different shapes and sizes to achieve the effect of combining the plastic frame with the three-dimensional conductive plate. Please refer to the second figure (a), which is a three-dimensional conductive shell formed in this case. Schematic diagram of the second preferred embodiment of the metal plate. As shown in the figure, the plurality of connecting portions arranged on the edge of the metal plate 201 are of a sawtooth 202 structure, which is used to fix part of the plastic material of the plastic frame body to the three-dimensional conductive shell. Stretching between the serrations 202 to the metal plate 201 makes the structure of the metal plate 2 01 to extend upward, and it becomes the three-dimensional conductive shell 20 shown in the second figure (b), where the serrations 20 2 is disposed on different sides of the three-dimensional conductive shell 20. Because the three-dimensional conductive shell is made of a stretched metal material

M256568 ^ Creation instructions (8) f Compared with the conductive case of electronic cards made by bending, the following: The overall anti-twisting force of the conductive body of the body will be stronger, and the position of the electric ... The mechanical strength of the premises will also be greater. When the 2 is added to the electricity: the card's case, the three-dimensional conductive shell can absorb the foreign recognition and resist the deformation torque. In this way, it can ensure that Electron 2 ',,. Structure, to avoid the deformation of the three-dimensional conductive shell of the electronic card, or even the problems of moving, lifting or falling off. Of course, the metal plate used to form the three-dimensional conductive shell in this case is not limited to the structure of the hole 102 shown in the first figure, or the second figure is attached with a connecting portion for combining the plastic frame with the three-dimensional conductive plate. The structure of the saw and tooth 202 shown in (a), any structure that can fix the plastic material of the plastic frame to the three-dimensional conductive shell, such as the scope of protection of barbs or other shapes. 1 + corpse / Γ Next, please refer to the third figure, which is a schematic diagram of the first preferred embodiment of the electronic card seal of the present application. As shown in the third figure, the package structure of 4 = in this case is a combination of a three-dimensional conductive shell 30, a plastic frame 31, and a substrate 32 that are integrally formed. The substrate 32 is preferably a printed circuit board. The three-dimensional conductive shell 30 is disposed on the top surface of the plastic frame 31. It is formed by stretching a metal material. The metal material is preferably a metal plate. For example, the first figure (a) and the second figure (a )), And the three sides of the three-dimensional conductive shell 30 have a plurality of holes 301, and the shape and size are not limited. The plastic material of the plastic frame 31 can be fixed to the knot of the three-dimensional conductive shell 30. All are protected by this case. M 'Plastic frame 31 is made by INSERT M0LDING, planting on page 13 M256568 IV. Creation instructions (9) entry, snap, ultrasonic joint or high frequency joint, etc. The processing method softens part of the plastic material, and causes the softened plastic material to flow into the plurality of holes 30 1 on the side of the three-dimensional conductive shell 30, and is fixed in the plurality of holes 301 with the plastic material, so that the plastic frame 31 and the three-dimensional body The conductive shells 30 are tightly coupled together, so that when the electronic card is affected by external or flexing forces, there will be no structural looseness, poor mechanical strength, or falling off between the plastic frame 31 and the three-dimensional conductive shell 30. Question. As for 'India The circuit board 32 is provided with a memory 322 and an electronic element 321. In this embodiment, the printed circuit board 32 can be embedded (UNSERT MOLDING), implanted, snapped, ultrasonic bonded, high frequency bonded, soldered Or bonding with the plastic frame 31 so that the printed circuit board 3 2 is arranged in the accommodating space 3 丨 1 inside the plastic frame 3 1. In this way, the electronic card can be tightly packaged. In addition, the use of the printed circuit board 32 as the housing of the electronic card can also save the cost of materials required for the electronic card. Further, because it must cooperate with the electronic device, and the space provided by the electronic device to accommodate the electronic card Usually it is very small, so users often face the difficulty of taking out the electronic card. Please refer to the fourth figure, which is a schematic diagram of the preferred embodiment of the three-dimensional conductive shell. As shown in the fourth figure, it is convenient For the user, the three-dimensional conductive case 402 of the electronic card packaging structure of the present case may further have a groove 401 at a position near the side edge, so that the user can use the fingernail to hold the groove 401 to place the electronic Kayu FIG 〃 the child device does not) to the extracted. Thus, the manufacturing process can be used for drawing the perspective 40 of the groove 4〇1 formed simultaneously, two further

M256568

4. Creation instructions (10) Disturbance. 0 Of course, 5 can be formed by three-dimensional voltage-conducting methods, etc. to accommodate the use of 5 grooves if necessary. 0 The daughter card's seal is formed. The recessed joint processing method focuses on the three-dimensional conductor conductive shell and the body and the load. Because the method is better than strength, it is prone to the recessed plastic material. The shape of the square groove is larger than that of other electricity extraction. The conductive shell outside the substrate is a conductive body made of a conductive shell. The twisted and trapped frame made of the conductive shell softens the connection part, and uses the substrate of the joint to develop the electronic body. The value of the conductive shell is higher than that of the traditional connection part that is easier to bend. The value of the electronic card is not limited. At the same time, the method of drawing out, such as the tool surface of the small and infinite stator card, can be the same. In summary, the tensile metal structure used is stronger than the previous mechanical strength. And the conductive shell is easy to disturb. After the other party, the middle part, so the plastic processing method is used to complete the packaging of the electronic card. The mechanical strength of the electronic card is stronger than the electronic card. For example, the grooves can also be seen as mechanical punches, as long as they are ok, and there are similar descriptions. The conductive anti-twist strength of the electrical material method technology in this case is small. On the other hand, this case uses the plastic material solid rubber frame body and the stand-up packaging method of the plastic frame card, which is traditionally strong, anti-distortion, not only not tolerated, but also by exempting traditional electricity from the application in this case. The body of the conductive shell forming the groove is shaped and then manufactured, and the nails of the concave or the three-dimensional structure of the process are so made to strengthen the three-dimensional knowledge of the plastic electric case by bending, deformation, or law. It can be closely combined with the required electronic elements. Compared with this technology, it is relatively deformed, and it is not easy to loosen due to the metal material. The method is very productive.

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Page 16 M256568 Brief description of the drawings (a) (A): This is the structure diagram of the first preferred embodiment of the metal plate forming a three-dimensional conductive shell in this case. First figure (B): It is a schematic structural diagram of the first preferred embodiment of the three-dimensional conductive shell of the electronic card packaging structure of the present case. The second figure (A) is a schematic structural view of the second preferred embodiment of the metal plate forming the three-dimensional conductive shell of the present invention. The second figure (B) is a schematic structural view of the second preferred embodiment of the three-dimensional conductive shell of the electronic card packaging structure of the present application. Third figure: It is a schematic structural diagram of the first preferred embodiment of the electronic card packaging structure of this case. Figure 4: It is the schematic diagram of the third preferred embodiment of the three-dimensional conductive shell of the present invention. Explanation of Symbols 10: Three-dimensional conductive case 1 0 2: Hole 2 0 1: Metal plate 30: Three-dimensional conductive case 3 1: Plastic frame 3 2: Printed circuit board 321: Electronic component 401 groove 1 0 1: Metal plate 20: three-dimensional conductive case 202: sawtooth 3 0 1: hole 3 11: accommodation space 3 2 2: memory 40: three-dimensional conductive case

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Claims (1)

M256568 Five patent application scopes 1. An electronic card packaging structure that is installed by a processing method, which includes: a plastic frame; and a three-dimensional conductive shell formed by a body, which has a plurality of connecting portions. The three-dimensional conductive shell is stretch-formed from a metal material and placed into the plastic frame by the processing method, so that a part of the plastic frame body is fixed to the connection portions of the three-dimensional conductive shell. To combine the two j ^ electric cases with the plastic frame. Body guide 2. The packaging structure of an electronic card as described in item 1 of the scope of patent application, wherein the metal material is a metal plate. 3. The packaging structure of the electronic card according to item 2 of the scope of the patent application, wherein the connection parts are arranged on the metal plate, and the three-dimensional conductive shell is formed by stretching the metal plate between the connection parts. Μ 4 4 · The packaging structure of the electronic card as described in item 3 of the scope of the patent application, wherein the connection portions are in the shape of holes, sawtooth, and / or barbs. 5 · The packaging structure of the electronic card according to item 1 of the scope of the patent application, wherein the processing method is INSERT MOLDING, implantation / snap, ultrasonic bonding or high frequency bonding. 6. The packaging structure of the electronic card according to item 1 of the scope of the patent application, wherein the three-dimensional conductive shell includes a groove, which is disposed on a side edge of an outer surface of the three-dimensional conductive shell. 7. The packaging structure of the electronic card according to item 1 of the scope of patent application, wherein the inside of the plastic frame body has a containing space for containing the internal circuit components of the electronic card. Of M256568 5. Scope of patent application 8. The package structure of the electronic card as described in item 1 of the scope of patent application, in which the electronic card or Ma Yi secure digital card (SD CARD) 〇9. The packaging structure of the electronic card according to item i, wherein the electronic device is a 1 A / "Mid Card Memory Card (MMC CARD) 〇1 0 · As described in the first item of Shenyan Patent Scope The packaging method of the electronic card is such that the electronic card is a flash drive. /, 1 ^ · The packaging method of the electronic card as described in item 1 of the patent application scope, and the electronic card is a smart memory card. The packaging structure of the electronic card is dry-loaded by a processing method, which includes: # 日 II body shaped three-dimensional conductive shell, which is stretched from a metal material to open y and has a plurality of connecting portions ; A into a plastic frame, which is partially molded into the connecting parts of the f-body conductive shell by the processing method; and a shaker-substrate, which is combined with the plastic frame. Electronic card as described in item 2 Packaging structure. The processing method is INSERT MOLDING, implantation, buckle, ultrasonic bonding or high frequency bonding. Card 14 ^ The electronic card described in item 12 of the scope of patent application In the packaging structure, the three-dimensional conductive shell of the middle part includes a groove, which is arranged on one side edge of the outer surface of the standing body. Package structure, <1 M256568 5. In the scope of the patent application, the electronic card is a secure digital card (SD CARD). 1 6 • The electronic card described in item 12 of the scope of patent application Packaging structure, wherein the electronic card is a mul timedia memory card (MMC CARD). 1 7 · The method for packaging an electronic card as described in item i 2 of Shen Qing's patent scope, wherein the electronic card is A flash drive. 1 8 · The method for packaging an electronic card as described in item 12 of the scope of patent application, wherein the electronic card is a smart memory card. 19 · The packaging structure of the electronic card as described in Item 12 of the scope of the patent application, wherein the metal material is a metal plate, and the metal plate is provided with the connection parts, and the three-dimensional conductive shell is formed by The connecting portions are formed by stretching the metal plate. 20 • The packaging structure of the electronic card as described in item 19 of the scope of patent application, wherein the connection parts are in the shape of holes, sawtooth, and / or barbs. 21 • The packaging structure of an electronic card as described in item 12 of the scope of patent application, wherein the substrate is a printed circuit board, and is provided with a memory and / or electronic components. 22 ^ The electronic card packaging structure described in item 12 of the scope of the patent application, wherein the substrate and the plastic frame system are INSERT MOLDING, implantation, snapping, ultrasonic bonding, high frequency bonding, welding Or adhesive bonding.