M341960 八、新型說明： 【新型所屬之技術領域】 本創作涉及一種電連接器，尤指一種將晶片模組電性連接至印刷 板之電連接器。 【先前技#r】M341960 VIII. New Description: [New Technology Field] The present invention relates to an electrical connector, and more particularly to an electrical connector for electrically connecting a chip module to a printed board. [前技术#r]
習知用於電性連接晶片模組至印刷電路板之電連接器，其一般包括絕 緣本體、收容於絕緣本體内之複數導電端子及一將晶片模組固定=絕緣: 體内之鎖固裝置，該鎖固裝置包括樞接於絕緣本體外圍之加強片、、樞接於 加強片一端用於抵壓晶片模組之壓板以及樞接於加強片相對另一端用於鎖 住壓板之撥桿。該種鎖固裝置由於撥桿比較長，佔用空間較大，適合用於 台式電腦，而對於筆記本型電腦則不適用。 、 目丽筆記本型電腦通常用扣片來將晶片模組固定於絕緣本體内，如第 :圖所示，其爲一種扣壓晶片模組（未圖示）之扣片2,該扣片2大致呈矩 形，其按壓於晶片模組之部分爲矩形側邊之兩個板簧21，扣片2與絕緣本 體（未圖示）、晶片模組、散熱裝置（未圖示）等組裝之後，散熱裝置等會 對扣片2施加載力，使扣片2發生彈性變形，壓緊晶片模板。由^ 這種扣片2之彈性係數較大，如果施加在扣片2上之力太大，則會導致& 片2變形太大，損害晶片模組，故此種扣片2對承載於其上之負載力大小 有所限制。 雲於此，實有必要提供-觀進之電連接器，以克服上述電連接器之 【新型内容】 本創作崎決讀㈣題雜供—齡有扣# 以降低電連接器對施加在其上之負載力之要求。 =紅述技制題，本卿提供—輯連接器，騰紐連接晶片 Ϊ魏板’ ί ίΓ緣本體、收容於絕緣本體内之複數導電端子 附設有附加元件。 其中，所述扣片覆蓋晶片模組之區域 與習知技術相比，本創作在扣片上附著有附加元件，該附加元件可以 6 M341960 改變扣片之彈性係數，使扣片之彈性係數變小，使扣片可以承受更大之力 擴大了扣片承載力之範圍，從而降低對施加在扣片上之負載力之要求。 【實施方式】 請參閱第二圖至第五圖所示，本創作爲電連接器，該電連接器用於電 性連接電路板4與晶片模組（未標號），其包括絕緣本體5、收容於絕緣本 體5内之複數導電端子（未圖示）及將晶片模組壓入絕緣本體5之扣片7。 參閱第三圖所示，絕緣本體5由橡膠等絕緣材料製造，其大致呈矩形， 絶緣本體5包括基部50，基部5〇周圍向上延伸有側壁51，基部5〇和側壁 51共同圍成收容晶片模組之收容腔52。基部5〇上設有複數成矩陣排列之The electrical connector for electrically connecting the chip module to the printed circuit board generally comprises an insulating body, a plurality of conductive terminals received in the insulating body, and a fixing of the chip module = insulation: a locking device in the body The locking device includes a reinforcing piece pivotally connected to the periphery of the insulating body, a pressing plate pivoted to one end of the reinforcing piece for pressing the chip module, and a lever pivoted to the other end of the reinforcing piece for locking the pressing plate. This kind of locking device is suitable for desktop computers because it has a long lever and takes up a lot of space, but it is not suitable for notebook computers. The notebook computer usually uses a buckle to fix the chip module in the insulating body. As shown in the figure: it is a buckle 2 of a crimping chip module (not shown). a rectangular shape, which is pressed against two leaf springs 21 of a rectangular side of the wafer module, and the fuse 2 is assembled with an insulating body (not shown), a chip module, a heat sink (not shown), and the like, and is cooled. The device or the like applies a load to the cleat 2 to elastically deform the cleat 2 to press the wafer template. The elastic modulus of the clip 2 is large, and if the force applied to the cleat 2 is too large, the sheet 2 is too deformed to damage the wafer module, so that the cleat 2 is carried on it. The amount of load on the load is limited. In this case, it is necessary to provide - the electrical connector of the observation to overcome the above-mentioned electrical connector [new content] This creation of the original reading (four) questions miscellaneous - age has buckle # to reduce the electrical connector pair applied to it The load force requirement. = Red text technical questions, the Secretary provides a series of connectors, Teng New Zealand connected to the chip Ϊ Wei board ' ί ί Γ 本体 body, a plurality of conductive terminals housed in the insulation body with additional components. Wherein, the area of the buckle covering the chip module is compared with the prior art, and the creation has an additional component attached to the buckle, and the additional component can change the elastic coefficient of the buckle by 6 M341960, so that the elastic modulus of the buckle is reduced. Therefore, the buckle can withstand greater force to expand the range of the bearing capacity of the buckle, thereby reducing the load force imposed on the buckle. [Embodiment] Please refer to the second to fifth figures. The present invention is an electrical connector for electrically connecting the circuit board 4 and the chip module (not labeled), including the insulative housing 5, and receiving A plurality of conductive terminals (not shown) in the insulative housing 5 and a clip 7 for pressing the wafer module into the insulative housing 5. Referring to the third figure, the insulative housing 5 is made of an insulating material such as rubber and has a substantially rectangular shape. The insulative housing 5 includes a base portion 50. A side wall 51 extends upwardly around the base portion 5, and the base portion 5 and the side wall 51 collectively enclose the wafer. The receiving cavity 52 of the module. a plurality of matrixes arranged on the base 5
端子收容槽，導電端子收容於端子收容射，導電端子上端具有與晶片模 組按壓式接觸之接觸部，導電端子下端焊接有錫球（未圖示）。相鄰兩側壁 5」上裝配有彈性臂510，該彈性臂51〇可以將晶片模組推向絕緣本體5收 容腔52之Γ個角落，以定位晶腹組。絕緣本體5底部财複數凸塊（未 圖不）’當導電端子底部之錫球焊接於電路板4時，凸塊支撐於電路板4上， 防止錫球溶化過度。 〜參閱第四圖與第五圖所示，扣片7大致呈矩形，在本實施例中爲金屬 片實’其包括固持部7卜抵壓部73及連接固持部71與抵壓部73之過渡部 72抵壓# 73低於過渡部72，可抵壓在晶片模組上，過渡部72自抵壓部 73兩端傾斜向上延伸至固定部7卜固定部力包括自過渡部72末端向下彎 折延伸之·折部711及於騎部711末端中部_設置之向上彎折形成之延 伸部712，延伸部712之間形成收容連接件8之開槽713。在扣片7中部， ^致^抵壓部73上設有矩賴σ 74，可以散發晶賴組在運作時産生之熱 i a 1片7下表面開π 74 _設置麵加元件75，該附加元件75在本 2列，塑膠材料製成並胁扣片7上。附加元件75觸口 74之寬度 伸至扣片7之兩側壁。附加元件75可以減小扣片7之彈性係 數，增加扣片7之承載力。 /曰tU主要用於當晶片模組定位於絕緣本體5之收容腔52内時，扣麼 在曰曰片权組上’保證^触鱗電奸 。 日日換組上％ ’晶片模組报容易被導電端子彈起或二者之間 7 M341960 接觸不緊密而導致接觸不良。 模組上，將連接件8放枰7入曰曰片模組，取後將扣片7放置於晶片 8 7 ^ 75抵接在晶片模組上/、 &一起。組裝後扣片7之附加元件 於塑=======本創針，附加元料並不局限 接等手段附著於扣片7上'，且物/V、他一些材料，其可以採用無或焊 表面上，本創作之範圍括又/'、、、口讀75可以設於扣# 7之上表面或下 士援依本創叙精神所作施方式爲限，舉凡《本紐藝之人 圍内。 作之4效修舞或變化，皆應涵蓋於以下申請專利範 【圖式簡單說明】 弟―圖爲-種習知之電連接器扣片之立體圖； 第二圖爲本創作電連接驗裝於電路板上之立體圖； 从二圖爲第二11所*電連接器之立體分解圖； >图爲本創作電連接器扣#之仰視立體圖； 五圖爲本創作電連接器扣片之側視圖。 要元件符號說明】 4 絕緣本體 50 基部 510 收容腔 7 固持部 711 延伸部 713 過渡部 73 開口 75 連接件 電路板 5 51 52 71 712 72 74 部 元件 基部 彈性臂 扣片 彎軒部 開槽 抵壓 附力ϋ 8 8The terminal receiving groove has a conductive terminal received in the terminal, and the upper end of the conductive terminal has a contact portion that is in pressing contact with the wafer module, and a solder ball (not shown) is soldered to the lower end of the conductive terminal. The adjacent side walls 5" are equipped with elastic arms 510 which can push the wafer modules toward the corners of the insulating body 5 receiving cavity 52 to position the crystal belly groups. The bottom of the insulating body 5 has a plurality of bumps (not shown). When the solder balls at the bottom of the conductive terminals are soldered to the circuit board 4, the bumps are supported on the circuit board 4 to prevent the solder balls from being excessively melted. Referring to the fourth and fifth figures, the cleat 7 is substantially rectangular. In the present embodiment, the metal piece is a metal piece which includes a retaining portion 7 and a pressing portion 73 and a connecting portion 71 and a pressing portion 73. The transition portion 72 is pressed against the transition portion 72 and can be pressed against the wafer module. The transition portion 72 extends obliquely upward from the opposite ends of the pressing portion 73 to the fixing portion 7. The fixing portion includes the end from the end of the transition portion 72. The folded portion 711 and the extending portion 712 formed by bending the upper portion of the bottom portion of the riding portion 711 are formed, and the extending portion 712 forms a groove 713 for receiving the connecting member 8. In the middle of the cleat 7, the pressing portion 73 is provided with a yoke σ 74, which can dissipate the heat generated by the lyophilized group during operation, and the lower surface of the slab 7 is opened π 74 _ setting surface plus element 75, the additional The element 75 is in the second column, made of plastic material and attached to the buckle piece 7. The width of the contact member 74 of the additional member 75 extends to both side walls of the cleat 7. The additional member 75 can reduce the elastic modulus of the cleat 7 and increase the bearing capacity of the cleat 7. /曰tU is mainly used when the wafer module is positioned in the receiving cavity 52 of the insulative housing 5, and the button is secured on the breeze weight group. The %' wafer module reported on the daily change group is easily bounced by the conductive terminals or the contact between the two is not tight, resulting in poor contact. On the module, the connector 8 is placed in the cymbal module, and the shackle 7 is placed on the wafer 8 7 ^ 75 to abut on the wafer module /, & After assembly, the additional component of the clasp 7 is molded on the plastic film =======, and the additional material is not limited to the attachment on the clasp 7, and the material/V, some materials thereof, can be used. On the surface of no or welding, the scope of this creation includes /',,, and oral reading 75 can be set on the surface of the buckle #7 or the corporal aid is based on the spirit of the creation of the spirit of the creation, the person of the present New Art Inside. The 4 effects of the dance or change should be covered in the following patent application [simplified description of the drawing] Brother - Picture is a three-dimensional diagram of the electrical connector clip of the conventional; the second picture is the inspection of the creative electrical connection The perspective view on the circuit board; from the second picture is the stereoscopic exploded view of the second 11* electrical connector; > the figure is the bottom view of the creative electrical connector buckle#; the fifth figure is the side of the creative electrical connector buckle view. Explanation of the symbol of the component] 4 Insulating body 50 Base 510 Receiving cavity 7 Retaining part 711 Extension part 713 Transition part 73 Opening 75 Connector circuit board 5 51 52 71 712 72 74 Part element base elastic arm clasp bending sill part slotting pressure Attached to ϋ 8 8