TWM253974U - Elastic grounding member with attachable surface - Google Patents

Elastic grounding member with attachable surface Download PDF

Info

Publication number
TWM253974U
TWM253974U TW93204331U TW93204331U TWM253974U TW M253974 U TWM253974 U TW M253974U TW 93204331 U TW93204331 U TW 93204331U TW 93204331 U TW93204331 U TW 93204331U TW M253974 U TWM253974 U TW M253974U
Authority
TW
Taiwan
Prior art keywords
circuit board
ground
elastic
creation
shrapnel
Prior art date
Application number
TW93204331U
Other languages
Chinese (zh)
Inventor
Chen-Yi Lin
Original Assignee
U Tek Emi Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by U Tek Emi Corp filed Critical U Tek Emi Corp
Priority to TW93204331U priority Critical patent/TWM253974U/en
Publication of TWM253974U publication Critical patent/TWM253974U/en

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Description

M253974 四、創作說明(l) 一、 新型所屬之技術領域 本創作係有關一種可表面黏 連結於印刷電路板與一可導電結構之以=仞,指一種 谭接,且可減少電路板上路板的焊·點,以方便 的使用面積的結構,適用於筆記二進而增加電子元件 PDA)、網路撥接器用( = 電腦莖:人數位助理( 接地使用之可表面黏著之接地4數位電子產品的 二、 先前技術 按,由於科技發展日新月 的生活密不可分,而為了提高 效能,科技產品製造時的精度 愈小,而科技產品内部的印刷 由於該印刷電路板上電子元件 速度加快的需求,積體電路所 ,但卻因此使得印刷電路板上 ectro— magneti c e )提高,該電磁波對於人 性的干擾,可能導致人體漸進 靈,甚至造成車輛暴衝、飛行 故今日高頻線路之設計, 以降低因印刷電路板之地迴路 異’數位電子產品已與我們 產品的品質,以達到更佳的 要求愈來愈高,體積也愈來 電路板的面積亦相對縮小, 更加密集,且為了達到執行 產生的頻率不得不逐漸提高 的電磁干擾(EMI ,e 1 c interferen 體或電子產品皆會造成相互 式的傷害或是儀器的立即失 器失控等嚴重後果。 一般係以多點接地之方式, (Ground Retu r η )阻抗所造成之雜訊干擾源,進而改善電路設計之性 能及降低電磁幅射。M253974 4. Creation instructions (l) I. New type of technical field This creation is about a surface that can be adhered to a printed circuit board and a conductive structure = 仞, which means a type of connection and can reduce the number of circuit boards on the circuit board. The structure of the soldering point is convenient for the use area, suitable for note 2 and then adding electronic components PDA), network adapter (= computer stem: digital assistant (ground use, surface-adhesive ground 4 digital electronics) According to the previous technology, life is inseparable due to the rapid development of science and technology. In order to improve efficiency, the accuracy of technology products is smaller, and the internal printing of technology products is due to the need to accelerate the speed of electronic components on the printed circuit board. Integrated Circuits Institute, but it has made ectro- magneti ce on the printed circuit board. The interference of this electromagnetic wave on human nature may lead to the progressive spirit of the human body, and even cause the vehicle to storm and fly. Reduce the digital circuit products due to the ground circuit of printed circuit boards. The requirements are getting higher and higher, and the size of the circuit board is also relatively smaller and denser, and in order to achieve the electromagnetic interference (EMI, e 1 c interferen body or electronic products that will have to gradually increase the frequency of the implementation) will cause mutual interference Serious consequences such as damage to equipment or immediate loss of control of the instrument. Generally, it is a multi-point grounding method, which is a source of noise interference caused by (Ground Retu r η) impedance, thereby improving the performance of circuit design and reducing electromagnetic radiation. .

M253974 四、創作說明(2) 而為了 H u * 示,傳統上地之目的,請參閱第7、第8圖所 彈片(Α、β、 直條的金屬片體一體彎折而成為接地 部該接地彈片(Α、Β)下端設有一焊接 而丨彈片(Α、Β)上端設有-接觸部 f a e e ^ 並利用表面黏著技術(SMT,S ^ c M〇unt T e c h η n 1 、 焊接部(A 1 、R Th η ο I 〇 g y },以使 2、B2H)與印刷電路板結合,而接觸部(A )與金屬機殼連結,使得g别堂 金屬機殼連接卩刷電路板的地迴路與 之目的。連接’以降低迴路阻抗’進而達到降低電磁幅射 上述習用接地彈片雖然可以逹 ,惟其接觸部的長度盥焊拉邮认降低電磁幅射之目的 與機喊間一定的支撐面積時, 田欲維持 度,*由於該焊接部的長度心接=具有相當的長 能使用的空間受到限縮,對於印“路:=:元件所 有較長的焊接,,當與印刷㊁路上::接地彈片-般係具 大的焊點,在精確結合ΚΠΞ結合時’亦相對需要較 有鑑於此,為了改善上沭 地彈片與印刷電路板的焊點端、•·” ,使可表面黏著之接 接地彈片所佔用的空間,進、方便焊接,且可減少 創作人積多年的經驗及不斷的子7^件的使用面積’ 生。 -的研發改進,遂有本創作之產 三 新型内容 睡M253974 IV. Creation Instructions (2) For the purpose of Hu *, traditionally, please refer to the shrapnels (A, β, and straight metal sheet body in Figures 7 and 8 as a whole. The bottom of the ground spring (Α, B) is provided with a welding, and the top of the spring (Α, B) is provided with a -contact portion faee ^, and the surface bonding technology (SMT, S ^ c Mount T ech η n 1), the welding portion ( A 1, R Th η ο I 〇gy}, so that 2, B2H) is combined with the printed circuit board, and the contact portion (A) is connected to the metal casing, so that the g betong metal casing is connected to the ground of the circuit board The purpose of the circuit is to reduce the electromagnetic radiation by connecting 'to reduce the impedance of the circuit'. Although the conventional grounding shrapnel mentioned above can be used, the length of the contact part can be reduced by welding to reduce the electromagnetic radiation. In order to maintain the degree, * due to the length of the welded portion, the space available for use is limited due to the length of the welded joint. For printed roads: =: all long welding of components, when on the road with printing: : Grounding shrapnel-generally with large solder joints. When combined with ΚΠΞ, it is relatively necessary to take this into consideration. In order to improve the solder joint ends of the upper shrapnel and the printed circuit board, the space occupied by the ground-attached ground shrapnel can be easily and conveniently welded. And can reduce the creator's accumulated years of experience and the continuous use of 7 ^ pieces of the area's production.-R & D and improvement, so there are three new types of content produced by this creation

liHl M253974 四、創作說明(3) 本創作之主a »# j., ,其所設的焊接供-種可表面黏著之接地彈片 的下方形成的長度短,以在彈性: 的一支撐結構,可在堪=牛的工間’並配合該彈片所設 子元件,俾能增縮[不會碰觸上述電 電子兀件的使用面積。 本創作之次要目的在 _ ' ,其所設的焊接部&具種可表面黏著之接地彈片 ,可縮小與印刷雷跤仏 接也彈片的焊接部 路板JL戍、接觸焊點,俾能在密集配置於電 iiC邊時,可方便焊接作業。 ,其^ 目的在提供一種可表面黏著之接地彈片 斑金屬曰機=接5 i端所設的一*性結構,俾能在彈片上端 〃金屬機设接觸時,可減少接觸阻抗。 a上鳊 為達上述之創作之目的,本創作一 著之接地彈片係、配置於印刷電路板與一;黏 焊接部-端設;:::=端板電性連接,該 = = …15…二支〜部上端 ,使烊接部的長度比彈性部的長度短,ί =:頂…接觸部’可與上述可導電元件連結乂 四m =本創作能有更深入的瞭解’兹詳述於後: 明參閱第1、第2圖所示,其為本創作可表面黏著之 第8頁 M253974 、創作說明(4) 接地彈? 1之較佳實施例。其中, 續彎折而ΐ面係以-長條形的金屬片連 接部…端設端=:",該焊 ,該支擇部i、2i=;:2\5…15…間 部ί 3的底部,哼彈眭邱W向彎折延伸,並成為一彈性 折,該彎折處端呈一角度向上蠻 1,相對使得該= = 的自由端1 1 ^ 丄的長度b比彈性部1?的且疮 c短,又該彈性部! 3頂端設為接觸 。” 3的長度 =第3、第4圖所示,該接地彈 =係與印刷電路板2呈電性連接,而 = =觸部1 4與-可導電元件3 (例如:電腦主機以 二形成接地,可降低印刷電路板2的迴路阻抗i 而降低因地迴路阻抗所造成之電磁幅射〆 進 之η:接Ϊ彈片1配置於印刷電路板2與-可導電元件3 由於該接地彈片丄的彈性部工3具有彈性,以 壓力下’即有非常低的接觸阻抗。另,由於兮 ’使得該彈性部13的下方可形成-避讓電子元i 二::間’當彈性部"被壓縮時,因該接地彈片心 ^ 1 2的高度值a仍可維持在5mm 間,可避免彈性部1 3的底部碰觸到電子元件9 ,而 短路現象;且由於焊接部i工的長度b短於習用接地彈片 第9頁 M253974 四、創作說明(5) 的焊接部’可縮小與印刷電路板2的接觸焊點2 1 ,在焊 接作業上更為便利,且可有效地應用在各種密集配置電子 元件9的印刷電路板2上。 請參閱第5、第6圖所示,為使本創作在焊接加工的 =錫較為牢固,該接地彈片4的焊接部41的中央部設有 $孔4 2 ,使得該焊接部4丄在與印刷電路板2結合時 悝上的焊錫可融入通孔42巾;而本創作亦可在 焊接:設有複數個相對稱的缺口 5 2,以加強 ~接部41與電路板2的結合力。 因此’本創作具有以下之優點: 2 1、i ί ϊ f設的焊接部的長度比彈性部的長度短,使得 ”性㈣下方可形成-避讓電子元件的冑間,當彈 =受力壓縮後,該彈片可藉由其所設的支“:: 彈性°卩底部不會碰觸到上述電子元件。 ^ m!用的接地彈片所設定的彈性支撐力量相 的焊接部,可有饮:長度短於習用接地彈片 方# 丨愈μ f縮小與印刷電路板的接觸焊點,以 件週邊,可有教、“ 業,且由於貼近於電子元 3 .有效達到降低電磁幅射的最佳效果。 本創作上端所設的彈性部盥 要提供適當的接觸力量,可;:==威接觸,並依需 =下,將接觸阻抗在達到電性連接功能的原 作之ίΐπ: 内容,本創作確可達到創 種可縮小與印刷電路板的焊點,以 第10頁 M253974 四、創作說明(6) 方便焊接,且可減少佔用的空間,進而增加電子元件的使 用面積之可表面黏著之接地彈片,極具實用之價值,爰依 法提出新型專利申請。liHl M253974 IV. Creation Instructions (3) The main creator of this creation a »# j.,, the welding supply provided by it is a kind of surface-attachable grounding spring that is formed short under the elasticity of a supporting structure, It can be used in the workshop of the cattle and matched with the sub-components set by the shrapnel, and it can not be increased or reduced [without touching the use area of the above-mentioned electrical and electronic components. The secondary purpose of this creation is _ '. The welding part & it has a kind of surface-adhesive grounding shrapnel, which can reduce the welding board of the welding part, which is also connected to the printed thunder. It can be convenient for welding when it is densely arranged on the electric iiC side. Its purpose is to provide a surface-attachable grounding shrapnel. The metal structure is a simple structure that is connected to the 5i end. It can reduce the contact resistance when the top end of the shrapnel is placed in contact with the metal machine. a For the purpose of the above-mentioned creation, the grounding spring sheet of this creation is arranged on the printed circuit board and the one; the adhesive soldering section-end setting; ::: = the end plate is electrically connected, the = =… 15 … The upper part of the two branches makes the length of the contact part shorter than the length of the elastic part, ί =: the top ... the contact part can be connected with the conductive element mentioned above 乂 four m = this creation can have a deeper understanding of the details It is described later: Please refer to Figures 1 and 2 for details. It is the surface-adhesive M253974 on the 8th surface of the creation, and the description of the creation (4) Grounding bomb? The preferred embodiment of 1. Among them, the bending is continued and the surface is connected by a -strip-shaped metal sheet connecting end ... end end =: ", the welding, the selection part i, 2i = ;: 2 \ 5 ... 15 ... At the bottom of 3, the humming ball Qiu W extends toward the bend and becomes an elastic fold. The end of the bend is at an angle up to 1. The relative length of the free end of the == 1 1 ^ 丄 is longer than the elastic part. 1? And the sore c is short, and the elastic part! 3 Make the top contact. The length of 3 = shown in Figures 3 and 4, the grounding spring = is electrically connected to the printed circuit board 2, and = = the contact part 1 4 and-conductive element 3 (for example: the computer host is formed by two Grounding can reduce the circuit impedance i of the printed circuit board 2 and reduce the η of electromagnetic radiation caused by the ground circuit impedance: the connecting spring 1 is arranged on the printed circuit board 2 and the conductive element 3 due to the ground spring 丄The elastic part 3 has elasticity, and under pressure, it has a very low contact resistance. In addition, because of Xi, the lower part of the elastic part 13 can be formed-avoiding the electronic element i 2 :: "When the elastic part" is During compression, the height value a of the ground spring core ^ 1 2 can still be maintained at 5 mm, which can avoid the short circuit phenomenon of the bottom of the elastic portion 13 touching the electronic component 9; and the length b of the welding portion i. Shorter than the conventional grounding spring. Page 9 M253974 4. The soldering section of the creative description (5) 'can reduce the contact with the printed circuit board 2 and the solder joint 2 1, which is more convenient for soldering operations and can be effectively applied to various dense The printed circuit board 2 on which the electronic components 9 are arranged. As shown in FIG. 6, in order to make the soldering process stronger in this work, the central portion of the soldering portion 41 of the ground spring 4 is provided with a hole 4 2 so that the soldering portion 4 is combined with the printed circuit board 2. The solder on the timepiece can be integrated into the through-hole 42 towel, and this creation can also be soldered: there are a plurality of symmetrical notches 5 2 to strengthen the bonding force between the connection portion 41 and the circuit board 2. Therefore, 'this creation has The following advantages: 2 1. The length of the soldering part provided by i ϊ ϊ f is shorter than the length of the elastic part, so that the space between the electronic components can be formed below the “㈣”, and the elastic piece can be compressed when the elasticity = the force is compressed. With its support ":: Elastic ° 卩 The bottom will not touch the above electronic components. ^ M! Welding part of the elastic support strength set by the grounding spring sheet can have a drink: the length is shorter than the conventional grounding弹片 方 # 丨 The more μ f shrinks the contact solder joints with the printed circuit board, the periphery of the piece can be taught, and because it is close to the electronic element 3, it effectively achieves the best effect of reducing electromagnetic radiation. The upper end of this creation The elastic part provided should provide appropriate contact force, but can be used: == Contact, and if necessary, the contact resistance will be the original of the original connection to achieve the electrical connection function: content, this creation can indeed achieve the creation of shrinkable solder joints with the printed circuit board, with M253974 on page 10 IV. Creation instructions (6) It is convenient for soldering, and it can reduce the occupied space, which can increase the use area of the electronic components. The surface-attachable grounding spring sheet has very practical value, and has filed a new patent application in accordance with the law.

M253974M253974

第1圖係為本創作 第2圖係為本創作 第3圖係為本創作 第4圖係為本創作 第5圖係為本創作 圖。 之貫施例之立體外觀圖。 之實施例之侧視圖。 之實施例之使用狀態圖。 之貫施例被壓縮時之使用狀態圖。 之實施例之焊接部設有通孔之立體外觀 缺 第6 為本創作之實施例之焊接部周緣設有複數個 之立體外觀圖。 =:係為習用接地彈片之立體外觀圖。 圖係為另—習用接地彈片之立體外觀圖。 【圖式符號說明】 接地彈片A、B 接觸部A 2、B 2 烊接部1 1、4 1 支撐部1 2 彈性部1 3 接觸部1 4 印刷電路板2 導電元件3 彈性部的長度c 缺口 5 2 焊接部A 1、B 1 接地彈片1 、4 令 自由端1 1 1 支撐部的高度值a 彎折處1 3 1 可表面黏著之接地彈片 焊點2 1 焊接部的長度b 通孔4 2 電子元件9Picture 1 is the creation Picture 2 is the creation Picture 3 is the creation Picture 4 is the creation Picture 5 is the creation. The three-dimensional appearance of the consistent embodiment. Side view of an embodiment. Example of the use state diagram. The state diagram when the consistent embodiment is compressed. The three-dimensional appearance of the welded part of the embodiment is provided with through holes. Section 6 is a three-dimensional appearance view of the welded part provided with a plurality of peripheral edges. =: This is a three-dimensional appearance of a conventional grounding spring. The picture shows the three-dimensional appearance of another conventional grounding spring. [Symbol description] Grounding spring A, B, contact part A 2, B 2 butt joint part 1 1, 4 1 support part 1 2 elastic part 1 3 contact part 1 4 printed circuit board 2 conductive element 3 length of elastic part c Notch 5 2 Welding part A 1, B 1 Grounding springs 1, 4 Let the free end 1 1 1 Height value of support part a Bend 1 3 1 Surface-attachable grounding spring welding point 2 1 Length of welding part b Through hole 4 2 Electronic components 9

第12頁Page 12

Claims (1)

2 M253974 五、申請專利範圍 1、一種可表面黏著之接地彈片,係供配置於g 與一可導電元件之間,該接地彈片的底端言 ,供與電路板電性連接,該烊接部一端設2 另端向上垂直延伸一支撐部,其高度值界萍 :=1 5mm之間’該支撐部上端設有一 以捏技呈一角度向上彎折,且該彈性部的 越烊接4的自由端,使焊接部的長度比彈性 :、表i該彈性部頂端設為接觸部,供與上述 件連結,以形成接地。 如Πί利範圍第1項所述之可表面黏著之 如申請專利範圍第續考折成型者 電路板的結合過程:央2設有通孔,以在 ,以加強焊接部盥電' 板上的焊錫可融 如申請專利範圍第G板的結合力者。 ^ ^ ^ •項所述之可表面盔 ’ Ί焊接部的周緣係設有複數個缺口者 f刷電路板 為焊接部 自由端, 於2· 5 彈性部, 彎折處超 部的長度 可導電元 接地彈片 〇 接地彈片 其與印刷 入該通孔 接地彈片 42 M253974 V. Application for patent scope 1. A surface-attachable grounding spring is provided between g and a conductive component. The bottom end of the ground spring is for electrical connection with a circuit board. One end is provided with a support portion extending vertically upward at the other end, and the height value of the support portion is between 1 and 5 mm. 'The upper end of the support portion is provided with a bending upward at an angle by pinch technique, and the elastic portion is connected to the 4 The free end makes the length of the welded part more elastic than the following: Table i The top end of the elastic part is set as a contact part for connecting with the above-mentioned parts to form a ground. The bonding process of the circuit board that can be adhered to the surface as described in item 1 of the scope of the patent application, as described in the scope of the patent application renewal: the central 2 is provided with a through hole to strengthen the soldering part on the board. The solder can be melted like the bonding force of the G plate of the patent application. ^ ^ ^ • The surface-capable helmet described in the item 'Ί The periphery of the soldering part is provided with a plurality of notches. The f brush circuit board is the free end of the soldering part. It is conductive at the 2 · 5 elastic part. Element ground shrapnel 0 Ground shrapnel and ground shrapnel printed into the through hole 4
TW93204331U 2004-03-22 2004-03-22 Elastic grounding member with attachable surface TWM253974U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93204331U TWM253974U (en) 2004-03-22 2004-03-22 Elastic grounding member with attachable surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93204331U TWM253974U (en) 2004-03-22 2004-03-22 Elastic grounding member with attachable surface

Publications (1)

Publication Number Publication Date
TWM253974U true TWM253974U (en) 2004-12-21

Family

ID=34589084

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93204331U TWM253974U (en) 2004-03-22 2004-03-22 Elastic grounding member with attachable surface

Country Status (1)

Country Link
TW (1) TWM253974U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107834234A (en) * 2017-11-03 2018-03-23 成都芯通科技股份有限公司 Electronic component earthing or grounding means and earthing method
CN113259510A (en) * 2021-05-13 2021-08-13 维沃移动通信有限公司 Electronic equipment, grounding elastic sheet and test socket assembly

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107834234A (en) * 2017-11-03 2018-03-23 成都芯通科技股份有限公司 Electronic component earthing or grounding means and earthing method
CN113259510A (en) * 2021-05-13 2021-08-13 维沃移动通信有限公司 Electronic equipment, grounding elastic sheet and test socket assembly
CN113259510B (en) * 2021-05-13 2023-07-21 维沃移动通信有限公司 Electronic equipment, grounding spring piece and test seat assembly

Similar Documents

Publication Publication Date Title
CN106449589A (en) Embedded components in interposer board for improving power gain (distribution) and power loss (dissipation) in interconnect configuration
CN106099318A (en) The assembling structure of a kind of antenna and mobile terminal
TWM419248U (en) Electrical connector
TWI364138B (en) Electrical contact
CN108511935A (en) Two-side contact spring
TWM253974U (en) Elastic grounding member with attachable surface
CN206118162U (en) FPC tin point ground structure and FPC module
TWM320841U (en) Structure of combined slim-type battery
JP2014096332A (en) Probe pin
CN207150827U (en) A kind of new piezo
CN206301983U (en) Multi-pin connector
TWI414222B (en) Flexible print circuit bending method for connecting in a phone and flexible print circuit thereof
CN205793642U (en) A kind of flexible circuit board BGA conductive via structure
CN206117608U (en) Three pin crystal resonator that damping is good
CN211457541U (en) SIG soft and hard circuit board connection structure
CN209897264U (en) Loudspeaker
TWM562502U (en) Elastic connector and wearable device having the same
CN210723446U (en) Electrical connector
CN208094894U (en) A kind of FPC circuit boards
CN205510535U (en) Cell -phone USB soft or hard combines board
TW201043104A (en) Electronic apparatus and flexible printed circuit thereof
TWI358168B (en) Electrical contact
TWM289241U (en) Electric connector
CN101330793A (en) Electrostatic safeguard structure
CN206758700U (en) A kind of network connector

Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees