TWM253057U - An airtight jointing and high thermal conductivity packaging structure - Google Patents

Description

M253057 g. Creation Instructions (l) [Technical Field to which the New Type belongs] This creation relates to a packaging structure that strengthens the heat dissipation pipe and has high thermal conductivity. In addition to saving power consumption and improving the luminous quality of the chip ', it can also do The single-layer or multi-layer rubber-coated structure has diversified the types of products. This is referred to as "hermetically sealed and highly thermally conductive packaging structure. [Prior technology] According to the conventional technology, light-emitting diodes (LEDs; Light Emitted Diodes) It can be applied to single or array packaging technology (as shown in Figure 1). It is mainly used to place the a and 'groove B1' on the circuit board B (pc) 3) compounded by the substrate A into the lamp cup. The chip D is implanted in the lamp cup c and is connected to the circuit board B with a wire e, and the circuit of the chip D and the wire E is covered with a mold injecting epoxy resin F (Epoxy). However, this packaging technology After actual use, the following defects are found: 差 Poor heat dissipation-epoxy resin F and circuit board b (Pcb) have the function of heat insulation. The only place that can conduct heat is below the lamp cup C. Due to the limited heat dissipation area, pass this list. The heat transfer efficiency of the scattered points is poor, while the other parts are epoxy. Resin F and other plastic materials are formed by this kind of material to form a nearly heat-insulated seal = action% environment. When the wafer D acts to emit light, its central light-emitting layer generates heat of about two hundred degrees Celsius, which is due to epoxy resin. ^^ The heat caused by the coating cannot be dissipated, so it is easy to have the illusion of no heat, so that the light-emitting diode 2 has the name of cold light, but in this state of insufficient heat exchange rate efficiency, it is easy to affect the luminous power and use of chip D. Life. "“ High cost, less change-epoxy resin F coated wafer β and wire e

Page 6 M253057 IV. Creation instructions (2) The mold set used in the circuit must emphasize high precision, and the manufacturing cost cannot be reduced. Furthermore, in the face of various array products with very different specifications, it is necessary to produce relative Higher cost mold sets to match. [New content] In view of this, the creators of this case devoted themselves to research and production of electronic components with “knowledge of materials science, thermodynamics, optics, fluid mechanics, etc.” related research and development experiments. 1 67361 No. 1 "Mu Tonglu Road Stops Pulling Threatened Hair" The patent case of the birth of the cold-type light-emitting diode created in this case "Structure book: Chip pull-up: The base made of metal can quickly receive the heat generated by the contact surface of the film, and evenly enhance the dissipation performance by the substrate or its heat-dissipating fins. The heat dissipation of the pipe, the brightness of light = 丨 promote the chip to make higher power transmission 丨, strengthen the structure of the book =: to provide-a kind of air-tight high thermal conductivity package

ϊΐϊί do special coating treatment, * to make single-or multi-underfilled 埴 I layer of rubberized structure or different coatings 'make * single layer or composite investment benefits under the conditions of various I light effects' So it can compete. / 、, 7 products are diversified and have the largest competition in the industry

Page 7 [Embodiment] The further structure, characteristics and purpose of this creation will be fully understood by the two better artists after detailed descriptions in conjunction with the drawings in specific embodiments. In order to be proficient in this technique, the preferred embodiment of this creation will be described in detail in conjunction with the drawings. First, please refer to FIG. 2 for a system diagram of a preferred embodiment of this creation. Its main components include:] The three-dimensional base 10 is made of highly thermally conductive metal. Its longitudinal section is convex (as shown in Figure 4), and the upper part is a dish-shaped depression with a small vertical cross-section. Cup groove 12 for wafer 40 implantation, and in the lower base 13 with a larger cross-section, fins (not shown) for heat dissipation are directly arranged on the outer surface 0 substrate 20, which is made of metal and provided with a base Seat 10 vertical column u installation = through opening 21 (manufactured with the cross section of vertical column 11 or its fin distribution shape) and fisheye groove 24 communicating with valley plate base 13 and a plurality of light transmitting covers 5 Positioning holes 22 for inserting and injection holes 23 for covering rubber 60. The circuit board 30 is located at the same position as the substrate 20, and is provided with a through hole 31 for mounting the base 10 on the pillar 11 (manufactured in accordance with the vertical cross section of the vertical column η or its fin distribution shape), and a plurality of The positioning hole 32 of the transparent cover 50 is inserted, and the injection hole 3 3 ′ covering the win 60 is provided with a circuit 34. Chip 40 is a semiconductor with light efficiency, for example: ld (Laser Diode laser diode) or LED (Light Emitted Diode) ... etc. A considerable number of cup slots 12 ′ of the base 10 are connected to the circuit board 30 circuit 34 with wires 41.

Page 8 M253057 IV. Creation instructions (4) Production mask 50, which can be made into a variety of materials with high transmittance. The mask is provided with positioning feet 51. The fluorescent layer 52 can be prefabricated in the mask or special coating treatment can be done. Cover 60 is made of a material with insulation effect. The melted state is from the substrate μ. The injection hole 2 3 passes through the circuit cup m ψ and the square QQ «Zd U / the main material hole 3 3. Sequentially filled with 2 colors, the same or different material 60, and covered in the 10 cup groove 12 of the base covered by the transparent cover 50 (as shown in Figures 4 and 5), resulting in or multi-layer Covered with 60 structure. 9

I // has the characteristics of the above-mentioned component structure, and the array assembly process is described in detail. Please refer to FIG. 6, which is a stereo system diagram of a specific embodiment of a multi-mask array. As shown in the figure, the through holes 21 (through holes 31) of the substrate 20 and the circuit board 30 are arranged in a plurality of combinations, and positioning holes 22 and injection materials are provided around each through hole (through hole 31). Holes 23, after the relative number of bases 10 are installed, the chip 40 in the cup groove 12 is connected to the circuit 34 with a wire 41, and the positioning pins 51 of the transparent cover 50 (using a one-to-one covering method) are inserted one by one In each group of positioning holes "(location holes 22) t, the filling hole 60 is filled by the injection hole 23. Please continue to refer to Figure 8 for a three-dimensional system diagram of the specific embodiment of the single mask array. The same as above, the through holes 21 (through holes 3 1) of the substrate 20 and the circuit board 30 are arranged in a plurality of combinations, and only positioning holes 22 and injection holes 23 are provided around the outside of the circuit board 30 (required in the transparent cover 50 ° coverage), § Relative number 3: After the base 10 is installed, the chip in the cup groove 12 is connected to the circuit 34 with a wire 41, and the light-transmitting cover 50 (one-to-many coverage method = foot 51 is inserted) It is installed in the positioning hole 32 (positioning hole 22) and filled with rubber through the injection hole 23. Page 9 M253057 4. Creation instructions (5) 60 〇 Multi-mask array type and single-mask array type can be combined Use: It is a one-to-one and one-to-many light-transmitting cover 50 on the circuit board 30 to interact and cover.

It has the characteristics of the above-mentioned element structure, and its use effect is described as follows: Please refer to FIGS. 4 and 5. When the wafer 40 in the cup groove 12 emits light due to the action, the action heat 70 is quickly absorbed by the base 10, and Evenly conductive to the contact surface of the substrate 20 or its fins for effective heat exchange and improved heat dissipation power, the chip 40 can output higher power and enhance the brightness effect of light emission! The physics of the heddle 20 should meet the requirements. Although "variety description means that the general should still belong to the law formed by the above and go to the industry and because of penetration", it is said that it is obviously based on the original creation device. Fully improve the "the purpose of improving the production of the photomask 50, when Heming Book is already familiar with the efficiency of such technologies for applying patents and patents covering the use of materials and exchange rates," and the injection hole 33 is based on the patent law. This case is within the limits of what the surgeon can do with that range. The structure of the base of sex 10 and the structure of the basic electronic characteristics, the southern creation of technical ideas, and the structure of "reducing production costs" can make the products present new regulations. The specific embodiments are combined with the drawings. The embodiments are subject to modification and should be equally changed and modified.

M253057 Simple illustration of the pattern ~-一 " " [Simplified description of the pattern] Figure * 一 系 @ Β 剖面 / Schematic diagram of the cross-sectional state of the structure using traditional packaging technology. = This is a three-dimensional system diagram of a specific embodiment of Xu Jia. FIG. 1 is a schematic perspective view of a preferred embodiment of the present invention. Figure 4 is a sectional view of the use of the embodiment of the single-layer coating of the present invention. Figure 5 is a sectional view of the use of the embodiment of the multiple-layer coating of the present invention. Figure 7 is a three-dimensional schematic diagram of a multiple mask array embodiment of the present invention Figure eight is a three-dimensional system diagram of a single mask array embodiment of the present invention Figure nine is a three-dimensional schematic diagram of a single mask array embodiment of the present invention

M253057 Brief description of the drawing [reference number of the drawing] Conventional method (traditional packaging technology structure) A Ming substrate B circuit board (Pcb) B1 groove C lamp cup D chip E wire F epoxy (Epoxy) This case (airtight High thermal conductivity packaging structure) 10 base 11 vertical column 20 substrate 21 through hole 2 4 fisheye slot 30 circuit board (Pcb) 31 through hole 34 circuit 4 0 chip 41 wire 50 light transmission cover 5 1 positioning foot 60 covered with rubber 70 Hot 12 cup slot 13 tray base 2 2 positioning hole 3 2 positioning hole 52 fluorescent layer 2 3 injection hole 3 3 injection hole

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Claims (1)

M253057 5. Scope of patent application 1. An air-tight, highly thermally conductive packaging structure, the main structure of which is composed of a vertical pillar with a small cross section at the upper part of the base, and a cup-shaped recess for the chip implantation cup The substrate is provided with through holes, positioning holes and injection holes; the circuit board is provided with through holes, positioning holes and injection holes; It is installed in the cup slot of the base, and the circuit board circuit is connected with a wire. The light-transmitting cover is provided with positioning feet at the bottom of the cover. The rubber cover is inserted into the through hole of the base plate and the circuit board. The cup is internally connected to the circuit with a wire. The positioning pin of the transparent cover is inserted into the positioning hole to cover the entire wire, the cup slot and the injection hole. The self-injection hole is filled with glue in the transparent cover. The action generated when the light is emitted is uniformly conducted to the contact surface of the substrate by the absorption of the base, and the contact surface is quickly scattered. Hermetically sealed and highly thermally conductive packaging structure, Korean films and fins with vertical cross sections or hermetically sealed and highly thermally conductive packaging structures. The hermetically sealed high-thermal-conducting package junction described above; a hole-piercing and accommodating base plate base 2 · The shape of the ten base surfaces provided with a heat-dissipating function as described in item 1 of the scope of patent application to make the mouth-piercing. 3. The heat dissipation function is provided on the outer surface of the substrate as described in item 1 of the scope of the patent application. 4. The structure is provided in item 1 or 3 of the scope of the patent application. 5. As described in item 1 of the scope of patent application Hermetically sealed high thermal conductivity packaging structure, M253057, the scope of patent application Among them, the shape of the translucent cover can be made into various styles. .: The airtight high-thermal-conduction package structure described in the patent application No. 145, in which the translucent cover is specially treated to coat the fluorescent layer. Q: The air-packed structure described in item 1, 5 or 6 of the scope of patent application, in which the light-transmitting cover can be “guided to many”, sealed for array package cover. BB wire group please patent The air-tight type described in the first item of the range in which the glue is coated with a plurality of materials, such as A…, the packaging structure, or the glued structure that is filled multiple times in the reading water to produce a double layer. Neighbors, Page 14