TWM248012U - The arrangement mechanism for tin balls on a ball grid array - Google Patents

Description

MZ48U12 IV. Creation Instructions (1) [Technical Field to which the New Type belongs] This creation is related to-the tin ball arrangement mechanism (3) of i Shaodou 3w ball planting machine, especially referring to a kind of use of倾 倾 ^ 1 The forward and reverse linkage mold of the servo motor tilts at a certain angle, so that the solder balls in the ball pool on the side of the 徂 and 隹 -τ side of the mold cavity are used in the mold cavity and dropped into the mold. Innovative design of the solder ball arrangement mechanism that moves the solder ball to the 1c substrate step by step. [Previous technology] Chip packaging technology can be divided into two types: one is QFP [Quad Flat P / Ckage] square is flat package and BGA [Ball Grid Arrag] ball array 2 package; the QFP packaging method refers to the chip ^ Four, 'However, in this packaging method, if the number of chip pins is too large / they are prone to bend in the foot valleys; as for the packaging method of the BGA, the pins are arranged in a dot-hashing manner with comprehensive character , And use solder balls as pins and solder joints' This packaging method can overcome the phenomenon that there are many pins and they are bent; and the BGA packaging method uses a ball planter to place the solder balls on the pins X of the wafer Please refer to the eleventh and twelfth pictures shown in the top 0. It is a conventional ball planting machine. The ball planting machine is set up between the rack plates (8 1) on the two sides of the machine (8). The mold base (8 2) has a plurality of holes (821) on the mold base (8 2), and the mold base (82) is provided with a mold base (82j); 2) Ball pools (8 3) at a certain distance to accommodate solder balls, and the sliding of the ball pools (8 3) is driven by the power assembled on one side of the rack plate (8 1) (84) and the skin ^ (8 5) driven by the power source, so that the ball pool (83) can move back and forth on the mold base (8 2) and the creation instructions (2); ^ 七 仃The solder ball is sucked into the mold cavity. However, this ball planting machine is as follows: π # i ι Because the ball planting machine is to facilitate the ball planting action, so the ball planting is 2 · In the course of passing south or Adding personnel at the time plus follow-up operations3 · It will again create a certain number of places, and Chuangji will use this period, and at the same time, it will go through a better (new book creation), which is the rotation of the shaft system, Reversing Fan This ball can not be plagued by the shovel of the ball. When the ball is in the ball pool, the ball knife is saved on the knife. With the help of long and versatile, it is mainly used in the two-frame servo horse. The planting of the ball fell in time, so that it should be known and inconvenient. The blades of the pool changed back and forth. It is because of the accumulation of thoughts and tests used by Xi in the absence of the chip, which is driven by the provision of a board.

(8 2 1). In practice, there are many defects in the use of the ball. It takes a long time to move the ball pool back and forth on the mold base, and the work efficiency is poor. If the solder ball is stuck in the mold cavity, the ball pool will go back and forth. Moving the solder ball becomes a defective product, but because the work needs to be found until the wafer is re-soldered. When the solder ball is cut during the increase process, the blade is also damaged. Therefore, the industry must be prepared to know that the ball ball placement mechanism of the wafer ball planter is practical In order to provide corrections, improvements, and supplements with professional knowledge, technology, and experience, this creation was created to provide a ball planting mechanism. The solder ball arrangement mechanism of the ball planting machine (a triaxial shaft sets up a mold base with a mold cavity, and the feeding motor will move the mold base in a certain position to make a tilting motion, so that one stand

Page 7 M248012

4. Creation description (3) The solder ball in the ball pool on the side of the mold base falls into the mold 6 of mold 2 during the tilting movement of the mold base, for the IC substrate in the solder ball to be placed to achieve the ball planting action. It is fast and fast, and there is no need to prepare a spare ball pool blade. [Embodiment] Please refer to the first to seventh drawings, 'The ball planting mechanism of the wafer ball planter of this creation is mainly based on a rack plate (11) on both sides of a machine (1), A shaft (12) is horizontally arranged between the two frame plates (11), and a weight seat (13) is fixed on the shaft (12). The upper surface of the mold base (13) is provided with a plurality of mold cavities (131). And each mold cavity (131) is not shown]), 夂 space (3),] is fitted to the mold base and the solder ball is shifted, 3 1) the seat (1, not 4) and 2) the pulley After the penetration die connection, the tin 14) and the top slide rail (13 height detection and detection of the solder ball 3) side] are connected at the sliding end in the shape of (51 seats (1 3), 'can attract the drop The mold ball (2) is accommodated in the space, and the lifting platform (3) in this space (1 4) is formed by a measuring element (3 1) on each side of the square (the mold base ((2)) Side reciprocating rodless iris unit penetrating machine) fixed connection 4) can be on 1 3) 'and the tin is moved (4〇) (41) shelf plate (1' This drive is provided for connection with the true hole (1 3 Place the solder ball height on the mold base ( The degree of detection is mainly to promote and achieve; the other 1) and the group (5) 1) in the 13) set up a power source lifting detector 3) the remaining undetected device (by the ball height) The aforesaid transmission has a device (a solder ball in the figure (2, a concave lifting platform at the rear (not shown or lowered in the figure; following (4), and the side edges are reciprocated into the mold cavity (1 4)) in the mold. Power source [Picture detector (Axial rod (1 set (5) servo motor (

M248012 (4) The servo force shaft passes through this leather 5 4) 1) and 2) The other (6) side machine) is set) The tilt time is based on the original 3) back ball machine, platform (position [2) Positive (52 due to the mold 3) will be shown], due to the mold base 13) 13 1 Motor (over the frame pulley (by borrowing the belt (end at the 'the carved frame (the vertical mold base elevation angle 0 made by the plant side) At this time, 3) turn to the eighth direction, and) the drive base (1 with this time, (13 surface,) kick 5 2) is fixed to the inner plate (11) of the rack plate (1 1), A servo motor (5 2) is connected between a pulley (53 5 3) and the aforementioned pulley (5 1) via a transmission shaft (1 2) of the pulley (5 3 5 4); After that, the one-degree disk (6) is provided with a momentary tilt angle detector (7) on the scale (6 1) 1 1) corresponding to the scale disk (6) to detect the mold and thereby control Servo motor (5 2) ball machine progressing room (1 4 lifting power to move to the figure), after passing the pulley shaft (1 3) tie rod (1 2 was originally located) tilted and fell into the mold ball (2 ) Ball planting) Built-in source actuation With the mold seat, pass the (53 2), set on the axis), and turn away from the top cavity (1 will be true IV, creative instructions 5 2), and its out) is fixed, there are belts (), (5 axis Lever (1 scale disc, and at this degree (6 1 seat (1 3 forward rotation and reverse when the mold seat (1 start the plant, so that the lifting motor (5 and the positive rotation of the pulley, the mold seat ( 1 The ninth and tenth (2) will reach the mold base (into the mold cavity (in the case of industry, that is, into the solder ball (sliding unit (13) moving group (5), the belt makes the shaft (1 2 moves and tilts) The platform (3) lifting platform (3 1) can be installed on the servo (54) 1 2) along with (2) and (31) the top surface, etc.). ) Going in parallel, while resting

Page 9 M248012 IV. Creation instructions (5) 疋 'The tilt angle of the mold base (1 3) reaches the preset tilt angle of the disc (6) 5 2), so that the return belt pulley 5 (5 2) After the shaft (1 2 is mainly to the lifting platform disc (6)) and the motor (5 2 (1 3)) is known, the power source will pass the starting position again, and the device (4) will, The reciprocating residual solder ball (to the solder ball (2 falls into the mold cavity), the warning informs the solder ball (2) that the solder ball () will be detected to detect the action, and open the pulley (5 rods (1 2) (1 3) To the mold cavity (1 3 to the mold seat (1 degree, and the mold tilt angle detection action, and make the mold seat tilt (5 2) stop 3 1)) to link the mold seat (1 3 with it When the standard value of the mold cavity solder ball (2) is detected, the whole value will be excluded and the standard value of the IC substrate is not issued, and it is the mold servo motor (the temple service motor ((54), this order is fixed, this The action ball (2) returns to the scale detector (7 will notify the servo 'until the mold base (7) detects' jacking 3') to the ball height detection (4 1) whether it exists or not (4) Detection ball 2) 'Not stopped' and issued if it is not detected, it can continue to move. The detector (7 stop forward rotation will go through the 2) interlocking shaft) to let the die not fall into (3), At the preset moment, the mold base) stops rotating in a horizontal state until the servo motor slide unit (finally, is located in the power source continuous displacement action, 2): if) the height exceeds 1 3 1) When the height exceeds the standard 2), it will be notified to start turning after being absorbed; and 3), the belt is turning, and it is tilted according to the tin in the other side 1) 3) tilt angle seat tilt angle measuring device (7) it is turning forward again The detector stops; the lifting unit () on the two sides of the tin slide unit (13 1) The south detector is the table ητ has a wrong ball-planting action and is closed. Otherwise, when the warning is issued, the next step of 4 is

M248012, Creation Instructions (6) Compared with the above structure, 1 · The solder ball in the space on the side of the creation does not need to be prepared quite 2 · It is because of the original process that it can be shortened 3 · Because the Detect whether the cavity is removed, so it can ensure that the situation occurs. Implementation instructions, there are a number of excellent use of a large number of different knives created by the mold holder implanted in the mold cavity to accommodate the creation of the ball planting operation in the mold holder There is residual tin in the mold holder to avoid the adsorption mold can know this point, such as In the middle of the back, the backside time of the ball with the blade size is 5 and the ball is set on both sides, and it has a downward pressure, so that it is not necessary to use the conventional ball pool structure after it is placed in the mold base. The operation is to use the solder ball of the mold base in the tilting room to fall into the mold cavity to improve work efficiency. There is a tin ball double detector, so as to inform the staff to inadvertently damage the mold when attracting the tin ball.

In summary, the specific structure disclosed in this creative embodiment is indeed expected, and the specific structure disclosed is not only not seen in the same category and not disclosed before the application. It has fully complied with the patent law and filed a new patent application in accordance with the law. Thanks for censorship, 'I really feel good. The use effect of the product is also determined and required, and granted a patent

Page 11 M248012 Schematic description [Schematic description] The first picture: the three-dimensional appearance of this creation. The second picture: the three-dimensional appearance of this creation from another angle. The third picture: the view before this creation. The fourth picture: this creation. The fifth view from the back: the side view of this creation. The sixth view: the top view of this creation. The seventh view: the bottom view of this creation. The eighth illustration: the action illustration of this creation (1). The ninth illustration: the action illustration of this creation ( (2) Figure 10: Action diagram of this creation (3) Figure 11: Conventional three-dimensional external view Figure 12: Conventional front view [Refer to the drawing number]) Machine (1 1) Frame board 2) Axis Rod (1 3) Mold base 3 1) Cavity (1 4) Space) Solder ball (3) Lifting platform 1) Slide unit (4) Solder ball height detector 0) Rodless cylinder (4 1) Slide unit) Transmission unit (5 1) Pulley 2) Servo motor (5 3) Pulley 4) Belt (6) Scale disc 1 2 3 4 5 M248012 Brief description of the diagram (7) Mold base tilt angle detector

Claims (1)

M248012 V. Scope of Patent Application 1. A solder ball arrangement mechanism (3) of a ball planting machine, which is fixed on the two sides of the machine with rack boards, and a shaft is arranged between the two rack boards, and The shaft is fixed with a mold base. The upper surface of the mold base is provided with a plurality of mold cavities, and each mold is in the shape of a penetrating mold base for connection with a vacuum suction device; and, a solder ball is accommodated in In the recessed space behind the mold base, the group formed in this space is a lifting platform that is linked by a lifting power source; and the aforementioned shaft is connected with a transmission group, so that the transmission group is connected to the mold base through the shaft. The reciprocating tilting action at a predetermined angle inserts the solder ball into the cavity. 2 · The solder ball arrangement mechanism (1) of the ball planter according to item 1 of the scope of the patent application, wherein the transmission unit is composed of a pulley fixed to one end of the shaft, and a frame plate fixed to the machine. It consists of an upper servo motor, a pulley that is not connected with the output shaft of the shrine clothing motor, and a circle of leather ^ on the two pulleys. 3. The solder ball arrangement mechanism (3) of the ball planter according to item 1 or item 2 of the scope of patent application, wherein a scale disc is fixed on the other end of the shaft, and a scale is set on the scale disc. Following the tilt angle detector on the other frame of the machine, the tilt angle detector of the mold base corresponds to the scale on the scale U & to control the transmission group to drive the mold base. The angle at which the tilt is performed. 4 · The solder ball placement machine of the ball planting machine as described in item 1 of the scope of the patent application_ Structure (3) ', wherein the two sides of the mold base are provided with solder ball height detection for the power source to move it back and forth. Detector to detect if there are residual ^ balls in the cavity. Page 14