M246686 捌、新型說明： 【新型所屬之技術領域】 特別是指一種以自力 5 本新型是有關於一種散熱裝置 循環提供良好散熱效果之散熱裝置 【先前技術】 隨著科技發展的日新月里，々i ^ 各式電子產品的功能也曰 盈增強，因此如何有效率的散執 J月文熟也成為電子產品設計者極 需面對的問題。 以電腦為例，其處理速度之愈加快速，造成電腦内部 的核心70件—中央處理器伽）往往會有溫度過高的問 題。為避免此-溫度過高的問題影響其他周邊零件產生損 壞’甚至導致電腦當機，附加—散熱器於cpu上以輔助其 散熱成為必要之措施。 如圖1，一般散熱器1之構造設計通常具有一鰭片座 11，以及一固定於該鰭片座n頂面之散熱風扇12。鰭片 座11上表面間隔向上凸伸有複數個散熱鰭片1U。藉此將 鰭片座11鎖固定位於一電路板2之發熱元件21上，如此 發熱兀件21所產生之熱量傳遞至鰭片座u後，可進一步 I由各散熱鰭片Π 1而向外發散，同時配合散熱風扇之送 風’以加速散熱鰭片111之散熱，然而此種習知散熱器1 定位於發熱元件21後，整體高度為發熱元件21、鰭片座 11、散熱鰭片111之加總，使得用以容裝該等元件之機殼 的高度無法有效縮小，因此難以滿足現今電子產品日漸小 型化及薄型化之需求。 M246686 【新型内容】 因此’本新型之目的，Η扁接 疋在棱供-種無需外加動力而 可自力循％以達到散熱作用之散熱裝置。 於是，本新型散熱裳置，包含一第—座體、 ίο 體，以及兩導管。第一座體内部形成有相連通之-第二 収一第二空間。第二座體内部充填有導熱介質。而㈣ 官，連接各該第-、二座體，且分別使該第―座體之第… 二空間與第二座體内部相連通，使得該第二座體内部之導 熱介質可經由一導管輸入該第一座體之第一空間内，進而 由該第二空間及另一導管輸回該第二座體中。藉此利用第 座體置於-發熱元件上，使得發熱元件所產生之熱量可 傳遞給第-座體，再由導熱介質之循環流動而孰 達到散熱之作用。 ^ 15 本新型之功效是利科熱介質自力㈣流動與接收 ♦熱兀件熱量之第-座體進行熱交換作用，提供良好之散 熱效果。 【實施方式】 有關本新型之前述及其他技術内容、特點與功效，在 以下配合參考圖式之數較佳實施例的詳細說明中，將可清 楚的明白。 如圖2所示，是本新型散熱裝置3第一較佳實施例， 包含有一第一座體31、一第二座體32,以及二導管33、 34弟座體具有複數座壁311、一由該等座壁311所 界疋而成之容置空間312，以及由一座壁311朝其相對座 20 M246686 壁311’方向延伸但未連接該趋3i ^ 〇1〇 ^ 、 1网板 313，猎隔 板將各置空間312區隔成可相連通之—第—空間314 及一第二空間315。另夕卜，一座壁311之外表面:有B 一入 口 Γ6及—出口317,且入口316及出口如處分別設有 一弟一、一 25 > 而第二座體32内部形成有一容室32卜容室321内並 充填有導熱介質322，導熱介質322係為可進行液、汽二 相變化之冷媒’於室溫下導熱介f奶呈液態，其膨服係 ίο 婁勺為1 1. 2，蚁著溫度的升高，導熱介質322將漸呈 氣態’膨脹係數比則為！ ： 15。另外，且第二座體犯對 應於各入〇 316與出α 317處分別相對形成有可與容室 321連通之—輸出日323、—進入口 324,輸出口 323及進 入口 324處分別設有—第三單向控制閥325及—第四單向 控制閥326。 15 單向控制閥318、319 導管33的兩端係分別連接於第一座體31之入口 316 及第二座體32之輸出口 323間，而另一導管“則是分別 連接於第-座體31之出口 312及第二座體32之進入口 m 間，藉此利用前述第-單向控制閥318控制導熱介質挪 只能透過入口 311流入第一座體31、第二單向控· 319 控制導熱介質322只能由第—座體31之出口 317流出， 而第三單向控制閥325控制第二座體32之容室321内的 導熱介質322只能輸出’第四單向控制閥326 %是控制導 熱介質322只能輸入第二座體32之容室321。 配合圖3所示，在使用上，當本新型之散熱裝置3運 20 M246686 用於電腦系統時，是將第一座體31置於電腦機殼41中主 機板42之一發熱元件421上，而第二座體32則可置放在 鄰近形成於電腦機殼41側壁411之散熱孔412處，藉此 發熱元件421所產生的熱量可傳遞給第一座體31，同時第 二座體32之容室321内的導熱介質322可由輸出口 323 輸出至導管33中，進而在第一單向控制閥318控制下由 入口 316輸入第一座體31之第一空間314,此時導熱介質 322將因與第一座體31進行熱交換作用而受熱膨脹成氣 態，受熱膨脹後的導熱介質322因分子重量減輕，更能順 暢且快速地由第一座體31之第一空間314進入第二空間 315,進而在第二方向控制閥319控制下由出口 317輸出， 循另一導管34及第四單向控制閥326之控制而回輸至第 二座體32之容室321中。 導熱介質322於離開第一座體31後，溫度即會隨著 流動而逐漸下降並冷凝成液態，配合第二座體32置於散 熱孔412附近，更可加速容室321内的導熱介質322散熱 並保持在室溫狀態，如此，藉著密閉空間中導熱介質322 膨脹係數比的變化，使得導熱介質322可以自力循環流 動’無需任何動力源輔助驅動，提供良好散熱效果。另外， 散熱裝置3與發熱元件421組合後之整體高度僅為發熱元 件421之高度與第一座體μ之高度總和，因此，電腦機 殼41之高度可因此有效縮小，而能滿足現今電子產品日 漸小型化及薄型化之需求。 如圖4所示，本新型散熱裝置5第二較佳實施例，與 剞述第一較佳貫施例不同處僅在於第一座體5 1頂面具有 一鰭片座54，鰭片座54頂面向上間隔凸伸有複數個鰭片 541，藉此於使用上，發熱元件的熱量於傳遞至第一座體 51，進而透過與導管53内之導熱介質322進行熱交換之 同日守，第一座體51所吸收之熱量也可以經由鰭片座54之 该等鰭片541向外發散，因而更可提昇散熱效率，另外， 即使本實施例之第一座體51頂面設置有鰭片座54，其與 t…、元件組合後之總南度，仍較前述習知需再配合於鰭片 座54頂面鎖固一散熱風扇之設計的總高度為低，因此， 本實施例之散熱裝置5仍能符合滿足現今電子產品日漸小 型化及薄型化之需求。 歸納上述，本新型散熱裝置藉由第一、二座體間連接 二導管，使得充填於第一座體内之導熱介質可透過一導管 輸入第一座體，並由另一導管輸入第一座體，利用可液、 一相曼化之$熱介質膨脹係數的變化達到自力循環流 動之作用’以提供良好之散熱效果，並能符合滿足現今電 子產品日漸小型化及薄型化之需求，因此，確實能達到上 述本新型之目的。 惟以上所述者，僅為本新型之較佳實施例而已，當不 ，以此限定本新型實施之範圍，即大凡依本新型中請專利 範圍及新型說明書内容所作之簡單的等效變化與修飾，皆 應仍屬本新型專利涵蓋之範圍内。 【圖式簡單說明】 圖1是習知散熱器示意圖； M246686 圖2是本新型散熱裝置第一較佳實施例之立體示意 圖， 圖3是該第一較佳實施例之使用狀態示意圖；及 圖4是本新型散熱裝置第二較佳實施例之側視圖。 M246686 【圖式之主要元件代表符號說明】 3、5散熱裝置 3 1、51第一座體 32第二座體 33、34導管 41電腦機殼 54鰭片座 3 11、3 11 ’座壁 312容置空間 3 13隔板 3 14第一空間 3 1 5第二空間 3 16 入口 317 出口 3 1 8第一單向控制閥 319第二單向控制閥 321容室 322導熱介質 323輸出口 324進入口 3 2 6第四單向控制閥 325第三單向控制閥 411側壁 412散熱孔 541鰭片 4 21發熱元件M246686 新型 、 New type description: [Technical field to which the new type belongs] In particular, it refers to a self-supporting 5 heat dissipation device. The new type is a heat dissipation device that provides a good heat dissipation effect in a cycle. [Previous technology] With the development of science and technology, 々I ^ The functions of various electronic products are also enhanced. Therefore, how to effectively disperse Jie Wenshu has become a problem that designers of electronic products need to face. Taking a computer as an example, its processing speed is getting faster and faster. As a result, the 70 cores inside the computer—the central processing unit (CPU) —will often have high temperature problems. In order to avoid this problem of excessive temperature affecting other peripheral parts from being damaged ’and even causing the computer to crash, it is necessary to attach a heat sink to the CPU to assist its heat dissipation. As shown in FIG. 1, the structure design of the general heat sink 1 generally has a fin base 11 and a heat dissipation fan 12 fixed on the top surface of the fin base n. A plurality of heat dissipation fins 1U are protruding upward from the upper surface of the fin base 11 at intervals. In this way, the fin base 11 is locked and fixed on the heating element 21 of a circuit board 2. After the heat generated by the heating element 21 is transferred to the fin base u, it can be further outward from each radiating fin Π 1 Diffuse, and at the same time cooperate with the air supply of the cooling fan to accelerate the heat dissipation of the heat dissipation fin 111. However, the conventional heat sink 1 is positioned after the heat generating element 21, and the overall height is the height of the heat generating element 21, the fin base 11, and the heat dissipation fin 111. The summation makes it impossible to effectively reduce the height of the casing used to house these components, so it is difficult to meet the needs of increasingly small and thin electronic products today. M246686 [What's new] Therefore, ‘the purpose of this new model is to provide flat heat sinks—a type of heat sink that requires no external power and can perform self-reliance by% to achieve heat dissipation. Therefore, the new type of heat dissipation device includes a first base body, a body, and two ducts. Inside the first building body, a connected second space and a second space are formed. The second base is filled with a thermally conductive medium. The eunuch is connected to each of the first and second bases, and the second space of the first and second bases is communicated with the inside of the second base, so that the heat conducting medium inside the second base can pass through a duct. It is input into the first space of the first base body, and is then returned to the second base body by the second space and another catheter. In this way, the first base is placed on the heating element, so that the heat generated by the heating element can be transferred to the first base, and then circulated by the heat conductive medium to achieve heat dissipation. ^ 15 The effect of this new model is the free flow and reception of Ricoh's heat medium. ♦ The heat-transfer effect of the heat of the heat element, which provides a good heat dissipation effect. [Embodiment] The foregoing and other technical contents, features, and effects of the present invention will be clearly understood in the following detailed description of preferred embodiments with reference to the drawings. As shown in FIG. 2, it is a first preferred embodiment of the novel heat sink 3, which includes a first base body 31, a second base body 32, and two ducts 33 and 34. The base body has a plurality of base walls 311, one An accommodation space 312 bounded by these seat walls 311, and a wall 311 extending in the direction of the opposite seat 20 M246686 wall 311 'but not connected to the trend 3i ^ 〇1〇 ^, 1 screen plate 313, The hunting partition partitions each set space 312 into a communicable first-space 314 and a second space 315. In addition, the outer surface of a wall 311: B has an inlet Γ6 and an outlet 317, and the inlet 316 and the outlet are respectively provided with a brother 1, 25 > and a container 32 is formed inside the second base 32 The volume chamber 321 is filled with a thermally conductive medium 322. The thermally conductive medium 322 is a refrigerant capable of performing liquid-vapor two-phase changes. The thermally conductive medium f is liquid at room temperature, and its swelling system is 1 1. 2. As the temperature of the ant increases, the thermally conductive medium 322 will gradually assume a gaseous state. The expansion coefficient ratio is then! : 15. In addition, the second body criminal corresponds to each of the entrance 316 and the exit α 317, which are respectively formed to be connected to the chamber 321—output day 323, —entry port 324, output port 323, and entrance port 324, respectively. There are-a third one-way control valve 325 and-a fourth one-way control valve 326. 15 One-way control valves 318, 319 The two ends of the conduit 33 are respectively connected between the inlet 316 of the first base 31 and the outlet 323 of the second base 32, and the other conduit "is connected to the- Between the outlet 312 of the body 31 and the inlet m of the second seat body 32, the aforementioned one-way control valve 318 is used to control the heat transfer medium to flow into the first seat body 31 and the second one-way control through the inlet 311. 319 The control heat-conducting medium 322 can only flow out from the outlet 317 of the first base 31, and the third one-way control valve 325 controls the heat-conducting medium 322 in the chamber 321 of the second base 32 to output only the fourth one-way control The valve 326% is used to control the heat-conducting medium 322 and can only be input into the container 321 of the second seat body 32. As shown in Figure 3, in use, when this new type of heat sink 3 is used in a computer system, M246686 is the first A base 31 is placed on a heating element 421 of the motherboard 42 in the computer case 41, and a second base 32 can be placed adjacent to the heat dissipation hole 412 formed on the side wall 411 of the computer case 41 to generate heat. The heat generated by the element 421 can be transferred to the first base body 31, and at the same time, the receiving space 321 of the second base body 32 The heat conducting medium 322 can be output to the conduit 33 through the output port 323, and is then input into the first space 314 of the first seat 31 by the inlet 316 under the control of the first one-way control valve 318. The body 31 undergoes heat exchange and expands into a gaseous state when heated. The thermally expanded thermally conductive medium 322 is reduced in molecular weight and can smoothly and quickly pass from the first space 314 of the first base body 31 into the second space 315. Under the control of the two-directional control valve 319, it is output by the outlet 317, and is controlled by another conduit 34 and the fourth one-way control valve 326 to return to the container 321 of the second seat 32. The heat-conducting medium 322 leaves the first seat After the body 31, the temperature will gradually decrease and condense to a liquid state with the flow. With the second base body 32 placed near the heat dissipation hole 412, the heat transfer medium 322 in the chamber 321 can accelerate heat dissipation and be maintained at room temperature. In this way, by changing the expansion coefficient ratio of the heat-conducting medium 322 in the enclosed space, the heat-conducting medium 322 can circulate on its own. It does not require any power source to drive and provides a good heat dissipation effect. In addition, the heat dissipation device 3 and heat generation The overall height of the combination of the pieces 421 is only the sum of the height of the heating element 421 and the height of the first base μ. Therefore, the height of the computer case 41 can be effectively reduced, and it can meet the current miniaturization and thinness of electronic products. As shown in FIG. 4, the second preferred embodiment of the novel heat sink 5 is different from the first preferred embodiment described above only in that the first base body 51 has a fin base 54 and a fin base. A plurality of fins 541 protrude from the top surface of the sheet base 54 at an upward interval, so that in use, the heat of the heating element is transmitted to the first base body 51, and the heat is exchanged with the heat conducting medium 322 in the duct 53 on the same day. The heat absorbed by the first base body 51 can also be dissipated outward through the fins 541 of the fin base 54, so that the heat dissipation efficiency can be improved. In addition, even if the top surface of the first base body 51 in this embodiment is disposed There is a fin base 54, and the total south degree after combining with t ... and the components is still lower than the total height of the previous design that needs to be matched with the top surface of the fin base 54 to lock a cooling fan. Therefore, the present The heat dissipation device 5 of the embodiment can still meet Product growing needs of small type and thickness of. To sum up, the new heat dissipation device connects the two conduits between the first and second bases, so that the heat-conducting medium filled in the first base can be input into the first base through one conduit and the other base into the first base. In order to provide a good heat dissipation effect, the change of the expansion coefficient of the liquid and one-phase manganese $ heat medium can be used to provide a good heat dissipation effect, and can meet the needs of today's increasingly miniaturized and thin electronic products. Therefore, It can really achieve the purpose of the above-mentioned novel model. However, the above are only the preferred embodiments of the present invention, and if not, the scope of implementation of the present invention is limited, that is, the simple equivalent changes made according to the scope of the patents and the description of the new specification in the novel Modifications should still fall within the scope of this new patent. [Brief description of the drawings] FIG. 1 is a schematic diagram of a conventional heat sink; M246686 FIG. 2 is a perspective diagram of a first preferred embodiment of the novel heat sink, FIG. 3 is a schematic diagram of a use state of the first preferred embodiment; 4 is a side view of the second preferred embodiment of the novel heat sink. M246686 [Description of the main components of the diagram] 3, 5 heat sink 3, 51 first base body 32 second base body 33, 34 conduit 41 computer case 54 fin base 3 11, 3 11 'seat wall 312 Storage space 3 13 partition 3 14 first space 3 1 5 second space 3 16 inlet 317 outlet 3 1 8 first one-way control valve 319 second one-way control valve 321 chamber 322 heat transfer medium 323 output port 324 to enter Port 3 2 6 Fourth unidirectional control valve 325 Third unidirectional control valve 411 Side wall 412 Heat dissipation hole 541 Fin 4 21 Heating element
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