TWI853469B - Substrate processing method and substrate processing apparatus - Google Patents

Abstract

A substrate processing method and a substrate processing apparatus are provided. The substrate processing method includes:(Step S12) ejecting a preceding processing liquid toward a held substrate (W) from an ejection orifice (41a) of a preceding nozzle (41) through start of supply of the preceding processing liquid to the preceding nozzle (41); (Step S14) ejecting a succeeding processing liquid toward the held substrate (W) from an ejection orifice (42a) of a succeeding nozzle (42) through start of supply of the succeeding processing liquid to the succeeding nozzle (42); (Step S15) detecting start of ejection of the succeeding processing liquid from the ejection orifice (42a) of the succeeding nozzle (42); and (Step S16) stopping the supply of the preceding processing liquid to the preceding nozzle (41) in response to detection of the start of the ejection of the succeeding processing liquid.

Description

Substrate processing method and substrate processing device

The present invention relates to a substrate processing method and a substrate processing device.

A blade-type substrate processing device is known, which is used to spray a processing liquid onto a substrate to process the substrate. The blade-type substrate processing device processes the substrate piece by piece by the processing liquid. For example, Patent Document 1 discloses a blade-type substrate processing device.

The substrate processing device of patent document 1 includes: an organic solvent valve for opening and closing the organic solvent piping; and a hydrophobic agent valve for opening and closing the hydrophobic agent piping. After a delay time from the start of the closing action of the organic solvent valve, the opening action of the hydrophobic agent valve is started before the spraying of IPA (isopropyl alcohol) from the organic solvent nozzle has completely stopped. As a result, liquid splashing caused by interference between the organic solvent and the hydrophobic agent can be suppressed or prevented, and the substrate processing performed by the organic solution can be transferred to the substrate processing performed by the hydrophobic agent without draining the liquid of the substrate. [Prior art literature] [Patent literature]

[Patent Document 1] Japanese Patent Application Publication No. 2019-192799.

[The problem that the invention wants to solve]

However, in the substrate processing apparatus of Patent Document 1, the operator needs to set the period (delay time) from the start of the closing action of the organic solution valve (pre-valve) to the start of the opening action of the hydrophobic agent valve (post-valve). Therefore, for example, the operation for setting the delay time occurs each time the spray flow rate of the processing liquid changes. The spray flow rate of the processing liquid changes, for example, due to changes in the energy cost of the factory where the substrate processing apparatus is installed. Thus, in the substrate processing apparatus of Patent Document 1, the operation for setting the delay time is also required after the substrate processing apparatus is installed. Therefore, if the burden on the operator is taken into consideration, there is room for further improvement.

The present invention is developed in view of the above-described subject, and aims to provide a substrate processing method and substrate processing device that can reduce the burden on operators. [Means for solving the subject]

According to one aspect of the present invention, a substrate processing method is used to process a substrate by means of a processing liquid, and includes: a process of holding the aforementioned substrate; a process of starting to supply a preceding processing liquid to a preceding nozzle and spraying the aforementioned preceding processing liquid from the nozzle outlet of the aforementioned preceding nozzle toward the aforementioned substrate being held; a process of starting to supply a succeeding processing liquid to a succeeding nozzle and spraying the aforementioned succeeding processing liquid from the nozzle outlet of the aforementioned succeeding nozzle toward the aforementioned substrate being held; a detection process of detecting the start of spraying the aforementioned succeeding processing liquid from the aforementioned nozzle outlet of the aforementioned succeeding nozzle; and a stopping process of stopping the supply of the aforementioned preceding processing liquid to the aforementioned preceding nozzle in response to detecting the start of spraying of the aforementioned succeeding processing liquid.

In one embodiment, in the detection step, it is detected that the subsequent processing liquid has been ejected from the ejection outlet of the subsequent ejection nozzle.

In one embodiment, in the detection step, it is detected that the subsequent processing liquid has reached the ejection outlet of the subsequent nozzle.

In one embodiment, in the detection step, it is detected that the subsequent processing liquid has reached the vicinity of the ejection outlet of the subsequent nozzle.

In one embodiment, in the detection step, the start of ejection of the post-processing liquid is detected by a photographing device.

In one embodiment, in the detection step, the start of spraying of the post-processing liquid is detected by a photo sensor.

In one embodiment, in the detection step, the ejection of the post-processing liquid is started by detecting with a capacitance sensor.

In one embodiment, in the stop step, after the start of ejection of the post-processing liquid is detected and until a predetermined time has passed, the supply of the post-processing liquid to the post-processing nozzle is stopped.

In one embodiment, the substrate processing method further includes the following steps: adjusting the start supply timing of the preceding treatment liquid based on a supply time and a set time, wherein the supply time indicates the time interval from the start of supplying the preceding treatment liquid to the stop of supplying the preceding treatment liquid in the stopping step, and the set time is a time interval set for supplying the preceding treatment liquid.

In one embodiment, the substrate processing method further comprises the following step: obtaining a timing for stopping supply of the preceding processing liquid.

In one embodiment, the substrate processing method further includes the following step: detecting the start of ejecting the preliminary processing liquid from the ejection port of the preliminary nozzle.

According to one aspect of the present invention, a substrate processing device is used to process a substrate by a processing liquid, and comprises a substrate holding portion, a leading nozzle, a leading valve, a trailing nozzle, a trailing valve, a detection portion, and a control portion. The substrate holding portion holds the substrate. The leading nozzle has a nozzle outlet, and the leading processing liquid is sprayed from the nozzle outlet toward the substrate held by the substrate holding portion. The leading valve controls the supply of the leading processing liquid to the leading nozzle and stops the supply of the leading processing liquid to the leading nozzle. The trailing nozzle has a nozzle outlet, and the trailing processing liquid is sprayed from the nozzle outlet toward the substrate held by the substrate holding portion. The after-travel valve controls the supply of the after-travel treatment liquid to the after-travel nozzle and stops the supply of the after-travel treatment liquid to the after-travel nozzle. The detection unit detects the start of spraying of the after-travel treatment liquid from the nozzle outlet of the after-travel nozzle. After the control unit controls the fore-travel valve to start supplying the fore-travel treatment liquid to the fore-travel nozzle, the control unit controls the after-travel valve to start supplying the fore-travel treatment liquid to the fore-travel nozzle. The control unit performs a closing action control process in response to the detection by the detection unit of the start of spraying of the after-travel treatment liquid, and the closing action control process controls the fore-travel valve to stop supplying the fore-travel treatment liquid.

In one embodiment, the detection section detects whether the subsequent processing liquid has been ejected from the ejection outlet of the subsequent ejection nozzle.

In one embodiment, the detection unit detects whether the subsequent processing liquid has reached the ejection outlet of the subsequent nozzle.

In one embodiment, the detection unit detects that the subsequent processing liquid has reached the vicinity of the ejection outlet of the subsequent nozzle.

In one embodiment, the detection unit includes a photographing device for detecting the start of spraying of the post-processing liquid.

In one embodiment, the detection unit includes a photo sensor for detecting the start of spraying of the post-processing liquid.

In one embodiment, the detection unit includes a capacitance sensor for detecting the start of spraying of the post-processing liquid.

In one embodiment, the control unit controls the lead valve to stop supplying the lead-in treatment liquid after a predetermined time has passed since the detection unit detects the start of spraying of the follow-in treatment liquid.

In one embodiment, the control unit adjusts the start timing of supplying the preceding treatment liquid based on a supply time and a set time, wherein the supply time indicates the time interval from the start of supplying the preceding treatment liquid to the stop of supplying the preceding treatment liquid by the closing action control process, and the set time is a time interval set for supplying the preceding treatment liquid.

In one embodiment, the control unit obtains a timing for stopping supply of the preceding treatment liquid.

In one embodiment, the detection section detects the start of ejection of the preliminary treatment liquid from the ejection outlet of the preliminary ejection nozzle.

In one embodiment, the substrate processing device further includes a plurality of processing chambers. The plurality of processing chambers respectively accommodate the substrate holding portion, the leading nozzle, and the trailing nozzle. The control portion performs the closing action control process for each of the processing chambers. [Effect of the invention]

According to the substrate processing method and substrate processing apparatus of the present invention, the burden on operators can be reduced.

Hereinafter, the implementation forms of the substrate processing method and substrate processing device of the present invention will be described with reference to the drawings (FIG. 1 to FIG. 28). However, the present invention is not limited to the following implementation forms, and can be implemented in various forms as long as it does not deviate from the spirit of the present invention. In addition, the description of the repeated parts will be appropriately omitted. In addition, the same component symbols are attached to the same or equivalent parts in the figures, and the description is not repeated.

In the substrate processing method and substrate processing device of the present invention, the "substrate" that is the object of substrate processing can be applied to various substrates such as semiconductor wafers, glass substrates for photomasks, glass substrates for liquid crystal displays, glass substrates for plasma displays, substrates for field emission displays (FED), substrates for optical disks, substrates for magnetic disks, and substrates for magneto-optical disks. Although the following mainly uses a disk-shaped semiconductor wafer as an example of the object of substrate processing to illustrate the implementation form of the present invention, the substrate processing method and substrate processing device of the present invention can also be applied to various substrates other than the semiconductor wafers described above. In addition, the shape of the substrate is not limited to a disk shape, and the substrate processing method and substrate processing device of the present invention can be applied to substrates of various shapes.

[Implementation Form One] Hereinafter, the implementation form one of the present invention will be described with reference to FIGS. 1 to 12. First, the substrate processing device 100 of the present implementation form will be described with reference to FIG. 1. FIG. 1 is a schematic diagram of the substrate processing device 100 of the present implementation form. Specifically, FIG. 1 is a schematic top view of the substrate processing device 100. The substrate processing device 100 processes the substrate W by a processing liquid. More specifically, the substrate processing device 100 is a blade-type device for processing the substrate W piece by piece. Hereinafter, the action of processing the substrate W may be referred to as "substrate processing".

As shown in FIG. 1 , the substrate processing apparatus 100 includes a plurality of processing units 1, a fluid cabinet 100A, a plurality of fluid boxes 100B, a plurality of load ports LP, an indexer robot IR, a center robot CR, and a control device 101.

The loading port LP is used to store a plurality of substrates W in a stacked manner. For example, the loading port LP is used to store a plurality of pattern wafers. The pattern wafer is a substrate (wafer) having a fine pattern formed on the surface thereof by grooves and a stacked structure. The stacked structure has a structure in which silicon nitride films and silicon oxide films are alternately stacked in the thickness direction of the stacked structure.

The index robot IR transfers the substrate W between the loading port LP and the center robot CR. The center robot CR transfers the substrate W between the index robot IR and the processing unit 1. In addition, the following device configuration may be used: a stage (path) for temporarily placing the substrate W is provided between the index robot IR and the center robot CR, and the substrate W is indirectly received and transferred between the index robot IR and the center robot CR via the stage.

The plurality of processing units 1 form a plurality of towers TW (four towers TW in FIG. 1 ). The plurality of towers TW are arranged so as to surround the central robot CR when viewed from above. Each tower TW includes a plurality of processing units 1 (three processing units 1 in FIG. 1 ) stacked one above the other.

The fluid tank 100A stores the treatment liquid. The fluid boxes 100B correspond to one of the plurality of towers TW. The treatment liquid in the fluid tank 100A is supplied to all the treatment sections 1 included in the tower TW corresponding to the fluid tank 100B through any one of the fluid boxes 100B.

The processing unit 1 supplies the processing liquid to the upper surface of the substrate W. The processing liquid includes a chemical liquid and a rinse liquid. In this embodiment, the chemical liquid includes a first chemical liquid and a second chemical liquid. In addition, the rinse liquid includes a first rinse liquid and a second rinse liquid.

The first chemical solution is, for example, DHF (dilute hydrofluoric acid). DHF is diluted hydrofluoric acid. The natural oxide film is removed from the substrate W by DHF.

The second chemical solution is, for example, SC1 (Standard clean-1; the first standard cleaning solution, i.e., ammonia-hydrogen peroxide mixed solution). SC1 is a mixed solution containing "NH ₄ OH", "H ₂ O ₂ " and "H ₂ O". When SC1 is supplied to the upper surface of the substrate W, particles attached to the upper surface of the substrate W are removed. More specifically, SC1 is used for dissolving and removing organic matter and stripping and removing insoluble particles.

The cleaning liquid is, for example, ultrapure water, carbonated water, electrolyzed ionized water, hydrogen water, ozone water, ammonia water, or diluted hydrochloric acid water (for example, hydrochloric acid water with a concentration of about 10 ppm to 100 ppm). Ultrapure water is, for example, deionized water (DIW). In this embodiment, the first cleaning liquid and the second cleaning liquid are the same type of cleaning liquid.

The processing unit 1 supplies the first chemical liquid, the second chemical liquid, the first cleaning liquid, and the second cleaning liquid in the order of the first chemical liquid, the first cleaning liquid, the second cleaning liquid, the second chemical liquid, and the second cleaning liquid to the substrate W. For example, the processing unit 1 may also supply DHF, SC1, the first cleaning liquid (deionized water), and the second cleaning liquid (deionized water) to the substrate W in the order of DHF, the first cleaning liquid (deionized water), the second cleaning liquid (deionized water), SC1, and the second cleaning liquid (deionized water).

Next, the control device 101 is described. The control device 101 controls the operation of each unit of the substrate processing device 100. For example, the control device 101 controls the loading port LP, the index robot IR, and the center robot CR. The control device 101 includes a control unit 102 and a memory unit 103.

The control unit 102 controls the operation of each unit of the substrate processing device 100 based on various information stored in the memory unit 103. The control unit 102 has, for example, a processor. The control unit 102 may also have a CPU (Central Processing Unit) or an MPU (Micro Processing Unit) as a processor. Alternatively, the control unit 102 may also have a general-purpose computer or a dedicated computer.

The memory unit 103 stores various information for controlling the operation of the substrate processing apparatus 100. For example, the memory unit 103 stores data and computer programs. The various information (data) includes, for example, recipe data. The recipe data is a recipe for specifying the processing content and processing sequence of the substrate W. The conditions (setting values) for executing the substrate processing are set in the recipe.

The memory unit 103 has a main memory device. The main memory device is, for example, a semiconductor memory. The memory unit 103 may further have an auxiliary memory device. The auxiliary memory device includes, for example, at least one of a semiconductor memory and a hard disk drive. The memory unit 103 may also include a removable media.

Next, the substrate processing apparatus 100 of the present embodiment will be further described with reference to Fig. 1 and Fig. 2. Fig. 2 is a top view schematically showing the structure of the processing unit 1 included in the substrate processing apparatus 100 of the present embodiment.

As shown in FIG2 , the processing unit 1 includes a processing chamber 2, a substrate holding unit 3, first nozzles 41 to 44, a first nozzle moving mechanism 5, a second nozzle moving mechanism 6, a liquid receiving unit 9, a camera 110, and a lighting device 111. The substrate holding unit 3, the first nozzles 41 to 44, the first nozzle moving mechanism 5, the second nozzle moving mechanism 6, the liquid receiving unit 9, the camera 110, and the lighting device 111 are provided in each processing unit 1 (processing chamber 2). In addition, the camera 110 is an example of a "detection unit".

The substrate W is carried into the processing chamber 2 and processed therein. The processing chamber 2 has a roughly box-like shape. The processing chamber 2 accommodates the substrate holding portion 3, the first nozzle 41 to the fourth nozzle 44, the first nozzle moving mechanism 5, the second nozzle moving mechanism 6, and the liquid receiving portion 9. The processing chamber 2 is, for example, a chamber.

The substrate holding part 3 holds the substrate W. The operation of the substrate holding part 3 is controlled by the control device 101 (control part 102). More specifically, the substrate holding part 3 holds the substrate W in a horizontal position. The substrate holding part 3 is, for example, a spin chuck. The substrate holding part 3 may also have a spin base 31 and a plurality of chuck components 32 (four chuck components 32 in FIG. 2 ).

The rotation base 31 is in the shape of a roughly circular plate and supports a plurality of clamp members 32 in a horizontal posture. The plurality of clamp members 32 are arranged at the periphery of the rotation base 31. The plurality of clamp members 32 clamp the periphery of the substrate W. The substrate W is held in a horizontal posture by the plurality of clamp members 32. The movement of the plurality of clamp members 32 is controlled by the control device 101 (control unit 102). The plurality of clamp members 32 are arranged in such a way that the center of the substrate W is consistent with the center CP1 of the rotation base 31.

3 and described later, the rotation base 31 rotates with the center CP1 of the rotation base 31 as the rotation center. Therefore, the substrate W rotates with the center of the substrate W as the rotation center.

Next, the first nozzle 41, the second nozzle 42, and the first nozzle moving mechanism 5 will be described.

The first nozzle 41 sprays a first chemical liquid (e.g., DHF) toward the upper surface of the substrate W held by the substrate holding portion 3. As a result, the first chemical liquid is supplied to the substrate W, and a liquid film of the first chemical liquid is formed on the upper surface of the substrate W. Specifically, the first chemical liquid is sprayed from the front end of the first nozzle 41. In addition, the first chemical liquid is sprayed from the first nozzle 41 toward the substrate W that is rotating.

The second nozzle 42 sprays a first cleaning liquid (e.g., deionized water) toward the upper surface of the substrate W held by the substrate holding portion 3. As a result, the first cleaning liquid is supplied to the substrate W, and a liquid film of the first cleaning liquid is formed on the upper surface of the substrate W. Specifically, the first cleaning liquid is sprayed from the front end of the second nozzle 42. In addition, the first cleaning liquid is sprayed from the second nozzle 42 toward the substrate W that is rotating.

The first nozzle moving mechanism 5 moves the first nozzle 41 and the second nozzle 42 simultaneously. The operation of the first nozzle moving mechanism 5 is controlled by the control device 101 (control unit 102). In more detail, the first nozzle moving mechanism 5 moves the first nozzle 41 and the second nozzle 42 between the first retreat area and the processing position. The first retreat area is an area on the outside of the substrate holding portion 3. In more detail, the first retreat area is an area on the outside of the liquid receiving portion 9. Figure 2 shows the first nozzle 41 and the second nozzle 42 located in the first retreat area. In this embodiment, the processing positions of the first nozzle 41 and the second nozzle 42 are both positions opposite to the center of the substrate W. The first nozzle 41 and the second nozzle 42 both spray the processing liquid toward the substrate W from above the substrate W.

The first nozzle moving mechanism 5 may also include a first nozzle arm 51, a second nozzle arm 52, a first nozzle base 53, and a first nozzle moving portion 54. The first nozzle base 53 extends in the vertical direction. The base ends of the first nozzle arm 51 and the second nozzle arm 52 are coupled to the first nozzle base 53. The first nozzle arm 51 and the second nozzle arm 52 extend in the horizontal direction from the first nozzle base 53. In the present embodiment, the first nozzle arm 51 and the second nozzle arm 52 are arranged at adjacent positions in a horizontal plane and extend in parallel with each other.

The first nozzle arm 51 supports the first nozzle 41. The first nozzle 41 protrudes directly downward from the first nozzle arm 51. Similarly, the second nozzle arm 52 supports the second nozzle 42. The second nozzle 42 protrudes directly downward from the second nozzle arm 52. The first nozzle 41 may also be disposed at the front end of the first nozzle arm 51. Similarly, the second nozzle 42 may also be disposed at the front end of the second nozzle arm 52.

The first nozzle moving part 54 rotates the first nozzle base 53 with the center CP2 of the first nozzle base 53 as the rotation center. As a result, the first nozzle arm 51 and the second nozzle arm 52 rotate with the center CP2 of the first nozzle base 53 as the rotation center, and the first nozzle 41 and the second nozzle 42 move along the circumferential direction with the center CP2 of the first nozzle base 53 as the center. The first nozzle moving part 54 is controlled by the control device 101 (control part 102). The first nozzle moving part 54 includes, for example, a stepping motor. Alternatively, the first nozzle moving part 54 may also include a motor and a speed reducer.

Here, the operation of the first nozzle moving mechanism 5 is described. First, the first nozzle moving mechanism 5 moves the first nozzle 41 to the processing position. At this time, the second nozzle 42 moves synchronously with the first nozzle 41. More specifically, the second nozzle 42 moves to the standby position. Here, the standby position is a position adjacent to the processing position in the horizontal plane. Therefore, the standby position is a position above the substrate W.

The first nozzle 41 supplies the first chemical solution to the substrate W from the processing position. The first nozzle moving mechanism 5 moves the second nozzle 42 from the standby position to the processing position after the first nozzle 41 stops supplying the first chemical solution. At this time, the first nozzle 41 moves synchronously with the second nozzle 42. The second nozzle 42 mainly supplies the first cleaning liquid to the substrate W from the processing position. In this embodiment, the second nozzle 42 starts to spray the first cleaning liquid when it is located at the standby position. Therefore, the second nozzle 42 also supplies the first cleaning liquid to the substrate W during the period of moving from the standby position to the processing position.

Next, the third nozzle 43, the fourth nozzle 44, and the second nozzle moving mechanism 6 will be described.

The third nozzle 43 is a fixed nozzle, and sprays the second cleaning liquid (e.g., deionized water) from a certain position toward the upper surface of the substrate W held by the substrate holding portion 3. As a result, the second cleaning liquid is supplied to the substrate W. Specifically, the second cleaning liquid is sprayed from the front end of the third nozzle 43. In addition, the third nozzle 43 is arranged on the outer side of the liquid receiving portion 9, and sprays the second cleaning liquid from the outer side of the liquid receiving portion 9 toward the center of the substrate W that is rotating.

The fourth nozzle 44 ejects the second chemical solution (e.g., SC1) toward the upper surface of the substrate W held by the substrate holding portion 3. As a result, the second chemical solution is supplied to the substrate W. Specifically, the second chemical solution is ejected from the front end of the fourth nozzle 44. In addition, the second chemical solution is ejected from the fourth nozzle 44 toward the substrate W that is rotating.

The second nozzle moving mechanism 6 moves the fourth nozzle 44 between the second retreat area and the processing position. The movement of the second nozzle moving mechanism 6 is controlled by the control device 101 (control unit 102). Like the first retreat area, the second retreat area is the area outside the liquid receiving portion 9. FIG. 2 shows the fourth nozzle 44 located in the second retreat area. Like the processing positions of the first nozzle 41 and the second nozzle 42, the processing position of the fourth nozzle 44 is a position opposite to the center of the substrate W.

The second nozzle moving mechanism 6 may also include a third nozzle arm 61, a second nozzle base 62, and a second nozzle moving portion 63. The second nozzle base 62 extends in the vertical direction. The base end of the third nozzle arm 61 is coupled to the second nozzle base 62. The third nozzle arm 61 extends from the second nozzle base 62 in the horizontal direction.

The third nozzle arm 61 supports the fourth nozzle 44. The fourth nozzle 44 protrudes directly downward from the third nozzle arm 61. The fourth nozzle 44 may also be disposed at the front end of the third nozzle arm 61.

The second nozzle moving part 63 rotates the second nozzle base 62 with the center CP3 of the second nozzle base 62 as the rotation center. As a result, the third nozzle arm 61 rotates with the center CP3 of the second nozzle base 62 as the rotation center, and the fourth nozzle 44 moves along the circumferential direction with the center CP3 of the second nozzle base 62 as the center. The second nozzle moving part 63 is controlled by the control device 101 (control part 102). The second nozzle moving part 63 includes, for example, a stepping motor. Alternatively, the second nozzle moving part 63 may also include a motor and a speed reducer.

After the second nozzle 42 stops supplying the first cleaning solution and the first nozzle 41 and the second nozzle 42 move to the first retreat area, the second nozzle moving mechanism 6 moves the fourth nozzle 44 from the second retreat area to the processing position. The fourth nozzle 44 supplies the second chemical solution to the substrate W from the processing position.

Next, the liquid receiving portion 9 will be described. The liquid receiving portion 9 surrounds the substrate holding portion 3 and receives the processing liquid discharged from the substrate W. The liquid receiving portion 9 is, for example, a cup or a guard.

Next, the photographing device 110 is described. The photographing device 110 has, for example, a photographing element, an electronic shutter, and an optical system. The photographing element can be, for example, a CCD (Charge Coupled Device). The optical system includes, for example, a lens. The photographing device 110 photographs the interior of the processing chamber 2 and generates a photographed image SG. The photographing device 110 outputs the photographed image SG to the control device 101. Specifically, the photographing device 110 outputs the photographed image SG to the control unit 102. The operation of the photographing device 110 is controlled by the control device 101 (control unit 102).

In this embodiment, the camera 110 is disposed outside the processing room 2. The processing room 2 has a side wall 2a opposite to the camera 110, and a window opposite to the camera 110 is provided on the side wall 2a. The camera 110 photographs the interior of the processing room 2 through the window of the side wall 2a. The window allows light to pass through. For example, the window allows visible light to pass through.

The photographing device 110 photographs the interior of the processing chamber 2 and detects that the second nozzle 42 starts to spray the first cleaning liquid. Similarly, the photographing device 110 photographs the interior of the processing chamber 2 and detects that the third nozzle 43 starts to spray the second cleaning liquid and that the fourth nozzle 44 starts to spray the second liquid. In this embodiment, the photographing device 110 photographs the interior of the processing chamber 2 and detects that the first cleaning liquid has been sprayed from the front end of the second nozzle 42. Similarly, the photographing device 110 photographs the interior of the processing chamber 2 and detects that the second cleaning liquid has been sprayed from the front end of the third nozzle 43. In addition, the imaging device 110 images the interior of the processing chamber 2 to detect that the second chemical solution has been ejected from the front end of the fourth nozzle 44 .

The control device 101 (control unit 102) obtains the start ejection timing of the first cleaning liquid from the second nozzle 42 based on the captured image SG input from the imaging device 110. Similarly, the control device 101 (control unit 102) obtains the start ejection timing of the second cleaning liquid from the third nozzle 43 and the start ejection timing of the second chemical solution from the fourth nozzle 44 based on the captured image SG input from the imaging device 110. In the present embodiment, the start ejection timing of the first cleaning liquid indicates the timing at which the first cleaning liquid is ejected from the front end of the second nozzle 42. Similarly, the start timing of spraying the second cleaning liquid indicates the timing when the second cleaning liquid is sprayed from the front end of the third nozzle 43 , and the start timing of spraying the second chemical liquid indicates the timing when the second chemical liquid is sprayed from the front end of the fourth nozzle 44 .

Next, the lighting device 111 is described. The lighting device 111 irradiates light to the inside of the processing chamber 2. The operation of the lighting device 111 is controlled by the control device 101 (control unit 102). By irradiating light to the inside of the processing chamber 2, it becomes easy to detect the start of spraying the first cleaning liquid, the start of spraying the second cleaning liquid, and the start of spraying the second chemical solution. The lighting device 111 irradiates light when performing substrate processing. For example, the lighting device 111 may irradiate light only when the camera 110 performs a shooting operation.

Specifically, the photographing device 110 photographs the interior of the processing chamber 2 at a predetermined frame rate (e.g., 60 frames/second). As a result, each frame of the photographed image SG is sequentially input to the control unit 102. The pixel value of each frame changes in accordance with the change in the brightness value. The brightness value changes depending on whether the processing liquid is reflected on the photographed image SG. The control unit 102 obtains the start timing of ejecting the first cleaning liquid, the start timing of ejecting the second cleaning liquid, and the start timing of ejecting the second chemical liquid based on the pixel value of each frame of the photographed image SG. According to this embodiment, by irradiating light to the inside of the processing chamber 2, the amount of change in the brightness value that changes depending on whether the processing liquid is reflected on the captured image SG becomes larger. Therefore, by irradiating light to the inside of the processing chamber 2, it becomes easy to detect the start of spraying the first cleaning liquid, the start of spraying the second cleaning liquid, and the start of spraying the second chemical liquid.

Next, the substrate processing apparatus 100 of the present embodiment will be described with reference to FIGS. 1 to 3 . FIG. 3 is a diagram schematically showing the structure of the substrate processing apparatus 100 of the present embodiment. Specifically, FIG. 3 includes a cross section schematically showing the structure of the processing unit 1 included in the substrate processing apparatus 100. In addition, for easy understanding, the fourth nozzle 44 and the second nozzle moving mechanism 6 are depicted above the first nozzle 41, the second nozzle 42 and the first nozzle moving mechanism 5 in FIG.

As shown in FIG3 , the substrate processing apparatus 100 further includes a substrate rotating portion 7, first to fourth liquid supply pipes 81 to 84, first valves VA1 to VA4, and first to fourth suck back valves SB1 to SB4. The substrate rotating portion 7, the first to fourth liquid supply pipes 81 to 84, the first to fourth valves VA1 to VA4, and the first to fourth suck back valves SB1 to SB4 are provided in each processing portion 1 (processing chamber 2). In addition, in the present embodiment, the first to fourth valves VA1 to VA4 are open/close valves.

The processing chamber 2 further accommodates a portion of each of the substrate rotating portion 7 and the first liquid supply pipe 81 to the fourth liquid supply pipe 84. The first valve VA1 to the fourth valve VA4 and the first back suction valve SB1 to the fourth back suction valve SB4 are arranged outside the processing chamber 2. Specifically, the first valve VA1 to the fourth valve VA4 and the first back suction valve SB1 to the fourth back suction valve SB4 are accommodated in the fluid box 100B described with reference to FIG. 1.

The substrate rotating unit 7 rotates the substrate W integrally with the substrate holding unit 3 around the first rotation axis AX1. The operation of the substrate rotating unit 7 is controlled by the control device 101 (control unit 102). The first rotation axis AX1 extends in the vertical direction and passes through the center CP1 of the rotation base 31 shown in FIG.

Specifically, the substrate rotating unit 7 rotates the rotation base 31 around the first rotation axis AX1. Therefore, the rotation base 31 rotates around the first rotation axis AX1. As a result, the substrate W held by the substrate holding unit 3 rotates around the first rotation axis AX1.

The substrate rotating part 7 has, for example, a motor body 71 and a shaft 72. The shaft 72 is coupled to the rotation base 31. The motor body 71 rotates the shaft 72. As a result, the rotation base 31 rotates. The movement of the motor body 71 is controlled by the control device 101 (control part 102).

Next, the first nozzle moving mechanism 5 is described. The first nozzle moving part 54 described with reference to FIG. 2 rotates the first nozzle base 53 around the second rotation axis AX2. As a result, the first nozzle 41 and the second nozzle 42 move around the first nozzle base 53 in the circumferential direction around the second rotation axis AX2. The second rotation axis AX2 extends in the vertical direction and passes through the center CP2 of the first nozzle base 53 shown in FIG.

Next, the second nozzle moving mechanism 6 is described. The second nozzle moving part 63 described with reference to FIG. 2 rotates the second nozzle base 62 around the third rotation axis AX3. As a result, the fourth nozzle 44 moves around the second nozzle base 62 in the circumferential direction around the third rotation axis AX3. The third rotation axis AX3 extends in the vertical direction and passes through the center CP3 of the second nozzle base 62 shown in FIG. 2.

Next, the first to fourth nozzles 41 to 44, the first to fourth liquid supply pipes 81 to 81, and the first to fourth valves VA1 to VA4 are described.

The first liquid supply pipe 81 is connected to the first nozzle 41. The first liquid supply pipe 81 is a tubular member and supplies the first chemical liquid to the first nozzle 41. As shown in FIG. 3 , the first nozzle 41 has a first ejection port 41a. The first ejection port 41a is formed at the front end of the first nozzle 41. The first chemical liquid supplied from the first liquid supply pipe 81 to the first nozzle 41 is ejected from the first ejection port 41a.

The first valve VA1 is provided in the first liquid supply pipe 81. The first valve VA1 controls the supply of the first chemical liquid to the first nozzle 41 and stops the supply of the first chemical liquid to the first nozzle 41.

Specifically, the first valve VA1 can be switched between an open state and a closed state. The control device 101 (control unit 102) controls the opening and closing action of the first valve VA1. When the first valve VA1 is in an open state, the first liquid medicine flows to the first nozzle 41 through the first liquid supply pipe 81. As a result, the first liquid medicine is ejected from the first ejection port 41a. On the other hand, when the first valve VA1 is in a closed state, the first liquid medicine is stopped from flowing through the first liquid supply pipe 81.

The second liquid supply pipe 82 is connected to the second nozzle 42. The second liquid supply pipe 82 is a tubular member and supplies the first cleaning liquid to the second nozzle 42. As shown in FIG. 3, the second nozzle 42 has a second nozzle 42a. The second nozzle 42a is formed at the front end of the second nozzle 42. The first cleaning liquid supplied from the second liquid supply pipe 82 to the second nozzle 42 is ejected from the second nozzle 42a. In addition, the center distance between the first nozzle 41a and the second nozzle 42a is, for example, 20 mm.

The second valve VA2 is provided in the second liquid supply pipe 82. The second valve VA2 controls the supply of the first cleaning liquid to the second nozzle 42 and stops the supply of the first cleaning liquid to the second nozzle 42. Since the configuration of the second valve VA2 is the same as that of the first valve VA1, detailed description thereof is omitted.

The third liquid supply pipe 83 is connected to the third nozzle 43. The third liquid supply pipe 83 is a tubular member and supplies the second cleaning liquid to the third nozzle 43. As shown in FIG. 3 , the third nozzle 43 has a third nozzle outlet 43a. The third nozzle outlet 43a is formed at the front end of the third nozzle 43. The second cleaning liquid supplied from the third liquid supply pipe 83 to the third nozzle 43 is ejected from the third nozzle outlet 43a.

The third valve VA3 is provided in the third liquid supply pipe 83. The third valve VA3 controls the supply of the second cleaning liquid to the third nozzle 43 and stops the supply of the second cleaning liquid to the third nozzle 43. Since the configuration of the third valve VA3 is the same as that of the first valve VA1, detailed description thereof is omitted.

The fourth liquid supply pipe 84 is connected to the fourth nozzle 44. The fourth liquid supply pipe 84 is a tubular member and sprays the second liquid to the fourth nozzle 44. As shown in FIG. 3 , the fourth nozzle 44 has a fourth spray port 44a. The fourth spray port 44a is formed at the front end of the fourth nozzle 44. The second liquid supplied from the fourth liquid supply pipe 84 to the fourth nozzle 44 is sprayed from the fourth spray port 44a.

The fourth valve VA4 is provided in the fourth liquid supply pipe 84. The fourth valve VA4 controls the supply of the second liquid chemical to the fourth nozzle 44 and stops the supply of the second liquid chemical to the fourth nozzle 44. Since the configuration of the fourth valve VA4 is the same as that of the first valve VA1, detailed description thereof is omitted.

Next, the first back suction valve SB1 to the fourth back suction valve SB4 are described. The first back suction valve SB1 to the fourth back suction valve SB4 are respectively provided in the first liquid supply piping 81 to the fourth liquid supply piping 84. Specifically, the first back suction valve SB1 to the fourth back suction valve SB4 are respectively provided downstream of the first valve VA1 to the fourth valve VA4.

The first back suction valve SB1 sucks the first liquid in the first liquid supply pipe 81 when the first nozzle 41 stops spraying the first liquid, thereby introducing the first liquid from the first nozzle 41a into the first liquid supply pipe 81. As a result, when the spraying of the first liquid stops, it is difficult for the first liquid to become a large volume (liquid droplets) and fall from the first nozzle 41a. In other words, it is difficult to produce "dripping". The operation of the first back suction valve SB1 is controlled by the control device 101 (control unit 102).

Since the structures of the second to fourth back suction valves SB2 to SB4 are the same as those of the first back suction valve SB1, detailed descriptions of the second to fourth back suction valves SB2 to SB4 are omitted.

Next, the shooting range SH of the shooting device 110 is explained with reference to FIGS. 1 to 4. FIG. 4 is a diagram showing the shooting range SH of the shooting device 110 included in the substrate processing device 100 of this embodiment. In addition, for easy understanding, FIG. 4 only shows the first nozzle 41, the second nozzle 42, the third nozzle 43, a part of the first liquid supply pipe 81, and a part of the second liquid supply pipe 82 and the third liquid supply pipe 83 among the internal components of the processing chamber 2.

As shown in FIG4 , the shooting range SH of the shooting device 110 includes a range capable of shooting the front end (second ejection port 42a) of the second nozzle 42 in the standby position, the first cleaning liquid ejected from the front end (second ejection port 42a) of the second nozzle 42, the front end (third ejection port 43a) of the third nozzle 43, and the second cleaning liquid ejected from the front end (third ejection port 43a) of the third nozzle 43. Therefore, the shooting device 110 can detect the start of ejection of the first cleaning liquid and the start of ejection of the second cleaning liquid. In this embodiment, the imaging range SH of the imaging device 110 further includes an imaging range of the tip (fourth ejection port 44a) of the fourth nozzle 44 at the processing position and the second chemical liquid ejected from the tip (fourth ejection port 44a) of the fourth nozzle 44.

The image capturing device 110 captures the image capturing range SH and generates the captured image SG. The captured image SG is input to the control device 101 (control unit 102). Therefore, the control unit 102 can obtain the start timing of ejecting the first cleaning liquid and the start timing of ejecting the second cleaning liquid.

In addition, when the first nozzle 41 and the second nozzle 42 are located in the first retreat area described with reference to FIG. 2 and the fourth nozzle 44 is located at the processing position, the shooting range SH of the shooting device 110 includes a range that can shoot the front end (fourth nozzle 44a) of the fourth nozzle 44 located at the processing position and the second liquid sprayed from the front end (fourth nozzle 44a) of the fourth nozzle 44. Therefore, the shooting device 110 can detect the start of spraying of the second liquid. In addition, the control unit 102 can obtain the start timing of spraying of the second liquid.

Next, the processing performed by the control unit 102 is explained with reference to Figures 1 to 6. Figure 5 shows a captured image SG when the first chemical liquid is being ejected from the first nozzle 41a. Figure 6 shows a captured image SG when the first cleaning liquid has started to be ejected from the second nozzle 42a. In addition, for easy understanding, only the first nozzle 41, the second nozzle 42, a part of the first liquid supply pipe 81, and the second liquid supply pipe 82 are shown in Figures 5 and 6, which are the internal components of the processing chamber 2. In addition, in Figures 5 and 6, the first nozzle 41 and the second nozzle 42 are depicted farther away than they actually are for easy understanding.

As shown in FIG5, when the second valve VA2 described with reference to FIG3 is switched from the closed state to the open state while the first chemical liquid is being ejected from the first ejection port 41a, the first cleaning liquid starts to be supplied from the second liquid supply pipe 82 to the second ejection nozzle 42. FIG5 is a frame of a captured image SG showing a stage before the first cleaning liquid has reached the second ejection port 42a. FIG6 is a frame of a captured image SG showing a stage when the first cleaning liquid has started to be ejected from the second ejection port 42a.

When the frame of the captured image SG is input, the control unit 102 cuts out the image processing area KA from the frame of the captured image SG, and obtains the start timing of ejecting the first cleaning liquid based on the image of the image processing area KA. More specifically, the control unit 102 performs image processing on the image of the image processing area KA and obtains pixel values. Then, the control unit 102 obtains the start timing of ejecting the first cleaning liquid from the second nozzle 42 based on the obtained pixel values.

In the present embodiment, the image processing area KA includes: a first image processing area KA1 extending from the front end (second nozzle 42a) of the second nozzle 42 toward the ejection direction of the first cleaning liquid. Since the first cleaning liquid is ejected toward the directly downward direction, the first image processing area KA1 has a strip shape (e.g., a rectangular shape) extending in the longitudinal direction of the captured image SG. The width of the first image processing area KA1 in the horizontal direction is set to be wider than the width of the first cleaning liquid, and the length of the first image processing area KA1 in the longitudinal direction is set to a length such that the first image processing area KA1 does not include the landing position of the first cleaning liquid. The control unit 102 obtains the timing of ejecting the first cleaning liquid from the second nozzle 42a based on the image of the first image processing area KA1.

In addition, the image processing area KA also performs the same settings on the third nozzle 43 as the second nozzle 42. Specifically, the image processing area KA includes: a second image processing area extending from the front end (third nozzle 43a) of the third nozzle 43 toward the ejection direction of the second cleaning liquid. Therefore, the control unit 102 can detect the start timing of ejection of the second cleaning liquid based on the image of the second image processing area.

Furthermore, in the case where the first nozzle 41 and the second nozzle 42 are located in the first retreat area described with reference to FIG. 2 and the fourth nozzle 44 is located in the processing position, the image processing area KA also performs the same settings on the fourth nozzle 44 as the second nozzle 42. Specifically, the image processing area KA includes: a third image processing area extending from the front end (fourth nozzle outlet 44a) of the fourth nozzle 44 toward the ejection direction of the second liquid medicine. Therefore, the control unit 102 can detect the start timing of ejection of the second liquid medicine based on the image of the third image processing area.

Next, the substrate processing method of this embodiment is described with reference to FIGS. 1 to 7. FIG. 7 is a flow chart showing the substrate processing method of this embodiment. The substrate processing method shown in FIG. 7 is executed by the substrate processing apparatus 100 described with reference to FIGS. 1 to 6. Therefore, FIG. 7 shows the operation of the substrate processing apparatus 100 of this embodiment.

The substrate processing method (operation of the substrate processing apparatus 100) shown in Fig. 7 starts in response to the central robot CR carrying the substrate W into the processing chamber 2. As shown in Fig. 7, when the central robot CR carries the substrate W into the processing chamber 2, the substrate holding unit 3 holds the substrate W (step S1).

When the substrate holding portion 3 holds the substrate W, the imaging device 110 starts imaging (step S2).

When the imaging device 110 starts imaging, the substrate rotating unit 7 rotates the substrate holding unit 3. As a result, the substrate W is rotated (step S3).

After the substrate W starts to rotate, the substrate W is processed by the processing liquid (step S4). In the present embodiment, the first chemical liquid (e.g., DHF), the second chemical liquid (e.g., SC1), the first cleaning liquid (e.g., deionized water), and the second cleaning liquid (e.g., deionized water) are supplied to the substrate W in the order of the first chemical liquid, the first cleaning liquid, the second cleaning liquid, the second chemical liquid, and the second cleaning liquid, thereby processing the substrate W. When the substrate processing is finished, the substrate rotating unit 7 stops the rotation of the substrate W.

After performing substrate processing, the photographing device 110 ends photographing (step S5).

After the imaging device 110 finishes imaging, the substrate holding portion 3 releases the substrate W. Then, the central robot CR carries the substrate W out of the processing chamber 2 (step S6), and the substrate processing method (operation of the substrate processing apparatus 100) shown in FIG.

Next, the substrate processing method (operation of the substrate processing apparatus 100) of the present embodiment will be described with reference to Figures 1 to 11. Figures 8 to 11 are flow charts showing the process of substrate processing (step S4 shown in Figure 7).

As shown in FIG8 , when substrate processing starts, first, the first nozzle moving mechanism 5 moves the first nozzle 41 from the first retreat area to the processing position (step S11 ). At this time, the second nozzle 42 moves from the first retreat area to the standby position in synchronization with the first nozzle 41 .

When the first nozzle 41 moves to the treatment position, the control device 101 (control unit 102) controls the first valve VA1 (pilot valve) to start supplying the first liquid medicine (pilot treatment liquid) to the first nozzle 41 (pilot nozzle) (step S12). Specifically, the control device 101 (control unit 102) sends an opening signal to the first valve VA1. The first valve VA1 switches from a closed state to an open state in response to receiving the opening signal. As a result, the first liquid medicine starts to be supplied to the first nozzle 41.

When the first chemical liquid (preliminary treatment liquid) starts to be supplied to the first nozzle 41 (preliminary nozzle), the first chemical liquid (preliminary treatment liquid) is ejected from the first ejection port 41a (the ejection port of the preliminary nozzle), and the first chemical liquid (preliminary treatment liquid) is supplied to the substrate W.

In addition, a delay time occurs from the start of supplying the first liquid medicine to the first nozzle 41 until the first liquid medicine is ejected from the first ejection port 41a. Specifically, when the first liquid medicine is initially ejected, a delay time of the amount of time required for the first liquid medicine to reach the first ejection port 41a occurs. When the first liquid medicine is ejected for the second time, a delay time due to the back suction process occurs. Specifically, when the supply of the first liquid medicine is stopped, the first liquid medicine is back sucked by the first back suction valve SB1. Therefore, when the supply of the first liquid medicine is started, the first liquid medicine is introduced into the first liquid supply piping 81. As a result, the first valve VA1 is in an open state, and a delay time occurs from when the first chemical liquid starts to flow until the first chemical liquid is ejected from the first ejection port 41a.

When the first chemical liquid is supplied, the control device 101 (control unit 102) determines whether the first predetermined time T1 has passed (step S13). Specifically, the control unit 102 starts timing in response to the fact that an opening signal has been sent to the first valve VA1. The first predetermined time T1 is stored in the memory unit 103 to display a value that is pre-set as a time interval for supplying the first chemical liquid to the first nozzle 41. The control unit 102 determines whether the timing result has reached the first predetermined time T1. The upper surface of the substrate W is covered with a liquid film of the first chemical liquid during the first predetermined time T1.

When it is determined that the first predetermined time T1 has not passed ("No" in step S13), the control device 101 (control unit 102) repeats the processing of step S13. When it is determined that the first predetermined time T1 has passed ("Yes" in step S13), the control device 101 (control unit 102) controls the second valve VA2 (after-line valve) to start supplying the first cleaning liquid (after-line treatment liquid) to the second nozzle 42 (after-line nozzle) (step S14). Specifically, the control device 101 (control unit 102) sends an opening signal to the second valve VA2. The second valve VA2 switches from a closed state to an open state in response to receiving the opening signal. As a result, the first cleaning liquid starts to be supplied to the second nozzle 42.

Similar to the first chemical liquid, the first delay time DT1 occurs from the start of supply of the first cleaning liquid to the second nozzle 42 until the first cleaning liquid is ejected from the second ejection port 42a.

After the first cleaning liquid (subsequent treatment liquid) starts to be supplied to the second nozzle 42 (subsequent nozzle), the control device 101 (control unit 102) determines whether the start of ejection of the first cleaning liquid (subsequent treatment liquid) from the second nozzle port 42a (the nozzle port of the subsequent nozzle) is detected (step S15).

Specifically, the control device 101 (control unit 102) determines whether the start of ejection of the first cleaning liquid from the second ejection port 42a is detected based on the captured image SG input from the imaging device 110. Specifically, the control device 101 (control unit 102) extracts the first image processing area KA1 from each frame of the captured image SG (see FIG. 5 and FIG. 6). Then, the control device 101 (control unit 102) performs image processing on each first image processing area KA1 to determine whether the start of ejection of the first cleaning liquid from the second ejection port 42a is detected.

The control device 101 (control unit 102) repeats the process of step S15 when it is determined that the start of ejection of the first cleaning liquid from the second nozzle 42a has not been detected ("No" in step S15). When it is determined that the start of ejection of the first cleaning liquid (the subsequent treatment liquid) from the second nozzle 42a (the nozzle of the subsequent nozzle) has been detected ("Yes" in step S15), the control device 101 (control unit 102) controls the first valve VA1 (pilot valve) to perform a closing motion control process (step S16), and the closing motion control process (step S16) stops the supply of the first chemical solution (the preceding treatment liquid) to the first nozzle 41 (pilot nozzle). In the present embodiment, the control device 101 (control unit 102) stops supplying the first chemical solution when the first cleaning solution is ejected from the second ejection port 42a.

Specifically, the control device 101 (control unit 102) sends a closing signal to the first valve VA1. In response to receiving the closing signal, the first valve VA1 switches from an open state to a closed state. As a result, the supply of the first chemical solution to the first nozzle 41 is stopped.

Furthermore, in this embodiment, the control device 101 (control unit 102) sends a suction signal to the first back suction valve SB1. The first back suction valve SB1 performs a suction action based on the suction signal to suck the first liquid medicine in the first liquid supply pipe 81 (back suction process). The closing action of the first valve VA1 and the suction action of the first back suction valve SB1 are performed in parallel with each other. As a result, the first liquid medicine on the front end side of the first valve 41 is sucked back and the spraying of the first liquid medicine stops.

As shown in FIG. 9 , after the supply of the first chemical solution is stopped, the first nozzle moving mechanism 5 moves the second nozzle 42 from the standby position to the processing position (step S21). In addition, when the second nozzle 42 (pre-nozzle) is at the standby position, the first cleaning liquid (pre-processing liquid) starts to be ejected from the second nozzle outlet 42a (the nozzle outlet of the pre-nozzle). Therefore, the second nozzle 42 (pre-nozzle) supplies the first cleaning liquid (pre-processing liquid) to the substrate W during the period from the standby position to the processing position. Then, after moving to the processing position, the second nozzle 42 (pre-nozzle) supplies the first cleaning liquid (pre-processing liquid) to the substrate W from the processing position.

After the second nozzle 42 moves to the processing position, the control device 101 (control unit 102) determines whether the second predetermined time T2 has passed (step S22). Specifically, the control unit 102 starts timing in response to the fact that an opening signal has been sent to the second valve VA2 (pilot valve). The second predetermined time T2 is stored in the memory unit 103 to display a value that is pre-set as a time interval for supplying the first cleaning liquid to the second nozzle 42. The control unit 102 determines whether the timing result has reached the second predetermined time T2. The upper surface of the substrate W is covered with a liquid film of the first cleaning liquid during the second predetermined time T2. In other words, the liquid film covering the upper surface of the substrate W is replaced from the liquid film of the first chemical liquid to the liquid film of the first cleaning liquid.

When the control device 101 (control unit 102) determines that the second predetermined time T2 has not passed ("No" in step S22), it repeats the processing of step S22. When it is determined that the second predetermined time T2 has passed ("Yes" in step S22), the control device 101 (control unit 102) controls the third valve VA3 (after-line valve) to start supplying the second cleaning liquid (after-line treatment liquid) to the third nozzle 43 (after-line nozzle) (step S23). Specifically, the control device 101 (control unit 102) sends an opening signal to the third valve VA3. The third valve VA3 switches from a closed state to an open state in response to receiving the opening signal. As a result, the second cleaning liquid starts to be supplied to the third nozzle 43.

Similar to the first chemical liquid, the second delay time DT2 occurs from the start of supply of the second cleaning liquid to the third nozzle 43 until the second cleaning liquid is ejected from the third ejection port 43a.

After the second cleaning liquid (subsequent treatment liquid) starts to be supplied to the third nozzle 43 (subsequent nozzle), the control device 101 (control unit 102) determines whether the start of ejection of the second cleaning liquid (subsequent treatment liquid) from the third nozzle 43a (the nozzle of the subsequent nozzle) is detected in the same manner as the first cleaning liquid (step S24).

The control device 101 (control unit 102) repeats the process of step S24 when it is determined that the start of ejection of the second cleaning liquid from the third nozzle 43a has not been detected ("No" in step S24). When it is determined that the start of ejection of the second cleaning liquid (post-treatment liquid) from the third nozzle 43a (the nozzle of the post-nozzle) has been detected ("Yes" in step S24), the control device 101 (control unit 102) controls the second valve VA2 (pilot valve) to perform a closing motion control process (step S25), and the closing motion control process (step S25) stops supplying the first cleaning liquid (pre-treatment liquid) to the second nozzle 42 (pilot nozzle). In the present embodiment, the control device 101 (control unit 102) stops supplying the first cleaning liquid when the second cleaning liquid is ejected from the third ejection port 43a.

Specifically, the control device 101 (control unit 102) sends a closing signal to the second valve VA2. In response to receiving the closing signal, the second valve VA2 switches from an open state to a closed state. As a result, the supply of the first cleaning liquid to the second nozzle 42 is stopped.

Furthermore, in this embodiment, the control device 101 (control unit 102) sends a suction signal to the second back suction valve SB2. The second back suction valve SB2 performs a suction action based on the suction signal to suck the first cleaning liquid in the second liquid supply pipe 82 (back suction processing). The closing action of the second valve VA2 and the suction action of the second back suction valve SB2 are performed in parallel with each other. As a result, the first cleaning liquid on the front end side of the second valve 42 is sucked back and the spraying of the first cleaning liquid is stopped.

After the supply of the first cleaning liquid is stopped, the first nozzle moving mechanism 5 moves the first nozzle 41 and the second nozzle 42 to the first retreat area (step S26). In addition, the second cleaning liquid is started to be sprayed before the spraying of the first cleaning liquid is stopped. Therefore, while the first nozzle 41 and the second nozzle 42 are moving to the first retreat area, the second cleaning liquid (preliminary treatment liquid) is supplied to the upper surface of the substrate W from the third nozzle 43 (preliminary nozzle).

As shown in FIG. 10 , after the first nozzle 41 and the second nozzle 42 move to the first retreat area, the second nozzle moving mechanism 6 starts to move the fourth nozzle 44 (step S31 ).

When the fourth nozzle 44 starts to move, the control device 101 (control unit 102) determines whether the third predetermined time T3 has passed (step S32). During the period until the third predetermined time T3 has passed, the fourth nozzle 44 moves from the second retreat area to the processing position.

Specifically, the control unit 102 starts timing in response to the fourth nozzle 44 starting to move. The third predetermined time T3 is stored in the memory unit 103 to display a value that is predetermined as a time interval for supplying the second cleaning liquid to the third nozzle 43. The control unit 102 determines whether the timing result has reached the third predetermined time T3.

When the control device 101 (control unit 102) determines that the third predetermined time T3 has not passed ("No" in step S32), it repeats the processing of step S32. When it is determined that the third predetermined time T3 has passed ("Yes" in step S32), the control device 101 (control unit 102) controls the fourth valve VA4 (post-flow valve) to start supplying the second liquid medicine (post-flow treatment liquid) to the fourth nozzle 44 (post-flow nozzle) (step S33). Specifically, the control device 101 (control unit 102) sends an opening signal to the fourth valve VA4. The fourth valve VA4 switches from a closed state to an open state in response to receiving the opening signal. As a result, the second liquid medicine starts to be supplied to the fourth nozzle 44.

Similar to the first chemical liquid, the third delay time DT3 occurs from the start of supply of the second chemical liquid to the fourth nozzle 44 until the second chemical liquid is ejected from the fourth ejection port 44a.

After the second liquid chemical (subsequent treatment liquid) starts to be supplied to the fourth nozzle 44 (subsequent nozzle), the control device 101 (control unit 102) determines whether the start of ejection of the second liquid chemical (subsequent treatment liquid) from the fourth nozzle 44a (the nozzle of the subsequent nozzle) is detected in the same manner as the first cleaning liquid (step S34).

The control device 101 (control unit 102) repeats the process of step S34 when it is determined that the start of ejection of the second liquid from the fourth nozzle 44a has not been detected ("No" in step S34). When it is determined that the start of ejection of the second liquid (post-treatment liquid) from the fourth nozzle 44a (the nozzle of the post-nozzle) has been detected ("Yes" in step S34), the control device 101 (control unit 102) controls the third valve VA3 (pilot valve) to perform a closing motion control process (step S35), and the closing motion control process (step S35) stops the supply of the second cleaning liquid (pre-treatment liquid) to the third nozzle 43 (pilot nozzle). In the present embodiment, the control device 101 (control unit 102) stops supplying the second cleaning liquid at the timing when the second chemical liquid is ejected from the fourth ejection port 44a.

Specifically, the control device 101 (control unit 102) sends a closing signal to the third valve VA3. The third valve VA3 switches from an open state to a closed state in response to receiving the closing signal. As a result, the supply of the second cleaning liquid to the third nozzle 43 is stopped.

Furthermore, in this embodiment, the control device 101 (control unit 102) sends a suction signal to the third back suction valve SB3. The third back suction valve SB3 performs a suction action based on the suction signal to suck the second cleaning liquid in the third liquid supply pipe 83 (back suction processing). The closing action of the third valve VA3 and the suction action of the third back suction valve SB3 are performed in parallel with each other. As a result, the second cleaning liquid on the front end side of the third nozzle 43 is sucked back and the spraying of the second cleaning liquid is stopped.

After the supply of the second cleaning liquid is stopped, the control device 101 (control unit 102) determines whether the fourth predetermined time T4 has passed (step S36). Specifically, the control unit 102 starts timing in response to the fact that an opening signal has been sent to the fourth valve VA4 (pilot valve). The fourth predetermined time T4 is stored in the memory unit 103 to display a value that is predetermined as a time interval for supplying the second liquid (preliminary treatment liquid) to the fourth nozzle 44 (pilot nozzle). The control unit 102 determines whether the timing result has reached the fourth predetermined time T4. The upper surface of the substrate W is covered with a liquid film of the second liquid during the fourth predetermined time T4. In other words, the liquid film covering the upper surface of the substrate W is replaced from the liquid film of the cleaning liquid to the liquid film of the second chemical liquid.

The control device 101 (control unit 102) repeats the processing of step S36 when it is determined that the fourth predetermined time T4 has not passed ("No" in step S36). When it is determined that the fourth predetermined time T4 has passed ("Yes" in step S36), the control device 101 (control unit 102) controls the third valve VA3 (after-action valve) to start supplying the second cleaning liquid (after-action treatment liquid) to the third nozzle 43 (after-action nozzle) (step S37) in the same manner as step S23 shown in FIG. 9. In addition, as described above, a delay time (fourth delay time DT4) occurs from the time the opening signal is sent to the third valve VA3 until the third nozzle 43 starts to spray the second cleaning liquid.

As shown in Figure 11, after the second cleaning liquid (subsequent treatment liquid) is supplied to the third nozzle 43 (subsequent nozzle), the control device 101 (control unit 102) determines whether it is detected that the second cleaning liquid (subsequent treatment liquid) is started to be sprayed from the third nozzle 43a (the nozzle of the subsequent nozzle) (step S41), similar to step S24 shown in Figure 9.

The control device 101 (control unit 102) repeats the process of step S41 when it is determined that the start of ejection of the second cleaning liquid from the third nozzle 43a has not been detected ("No" in step S41). When it is determined that the start of ejection of the second cleaning liquid (post-treatment liquid) from the third nozzle 43a (the nozzle of the post-nozzle) has been detected ("Yes" in step S41), the control device 101 (control unit 102) controls the fourth valve VA4 (pilot valve) to perform a closing motion control process (step S42), and the closing motion control process (step S42) stops the supply of the second liquid (pre-treatment liquid) to the fourth nozzle 44 (pilot nozzle). In the present embodiment, the control device 101 (control unit 102) stops supplying the second chemical solution at the timing when the second cleaning solution is ejected from the third ejection port 43a.

Specifically, the control device 101 (control unit 102) sends a closing signal to the fourth valve VA4. In response to receiving the closing signal, the fourth valve VA4 switches from an open state to a closed state. As a result, the supply of the second chemical solution to the fourth nozzle 44 is stopped.

Furthermore, in this embodiment, the control device 101 (control unit 102) sends an intake signal to the fourth back suction valve SB4. The fourth back suction valve SB4 performs an intake action based on the intake signal and inhales the second liquid medicine in the fourth liquid supply pipe 84 (back suction processing). The closing action of the fourth valve VA4 and the intake action of the fourth back suction valve SB4 are performed in parallel with each other. As a result, the second liquid medicine on the front end side of the fourth valve 44 is sucked back and the ejection of the second liquid medicine stops.

After stopping the supply of the second chemical solution, the control device 101 (control unit 102) determines whether the fifth predetermined time T5 has passed (step S43). Specifically, the control unit 102 starts timing in response to the fact that an opening signal has been sent to the third valve VA3. The fifth predetermined time T5 is stored in the memory unit 103 to display a value that is predetermined as a time interval for supplying the second cleaning liquid to the third nozzle 43. The control unit 102 determines whether the timing result has reached the fifth predetermined time T5. The upper surface of the substrate W is covered with a liquid film of the second cleaning liquid during the fifth predetermined time T5. In other words, the liquid film covering the upper surface of the substrate W is replaced from the liquid film of the second chemical solution to the liquid film of the second cleaning liquid.

When the control device 101 (control unit 102) determines that the fifth predetermined time T5 has not passed ("No" in step S43), the control device 101 (control unit 102) repeats the processing of step S43. When the control device 101 (control unit 102) determines that the fifth predetermined time T5 has passed ("Yes" in step S43), the control device 101 (control unit 102) controls the third valve VA3 to stop supplying the second cleaning liquid to the third nozzle 43, similarly to step S35 shown in FIG. 10.

After the supply of the second cleaning liquid is stopped, the substrate rotating unit 7 increases the rotation speed of the substrate W to dry the substrate W (step S45). When a predetermined time has passed after the supply of the second cleaning liquid is stopped, the substrate rotating unit 7 stops rotating the substrate W. As a result, the operation of the substrate processing apparatus 100 (substrate processing method) is transferred to step S5 shown in FIG. 7 .

The substrate processing method (operation of the substrate processing apparatus 100 ) of the present embodiment has been described above with reference to FIGS. 1 to 11 . The substrate processing method shown in FIGS. 7 to 11 is executed by the substrate processing apparatus 100 for each processing unit 1 (processing chamber 2 ).

Next, the substrate processing apparatus 100 of the present embodiment will be described with reference to Fig. 1 to Fig. 12. Fig. 12 is a timing chart showing the opening and closing actions of the first valve VA1 to the fourth valve VA4 and the detection action performed by the camera 110. In Fig. 12, the horizontal axis shows the time t, t1 to t9.

As shown in FIG12 , when the first nozzle 41 moves to the processing position, the control device 101 (control unit 102) sends an opening signal to the first valve VA1. As a result, the first valve VA1 (pilot valve) switches from a closed state to an open state, and the first chemical liquid begins to be supplied to the first nozzle 41. The first chemical liquid (pilot processing liquid) is supplied to the substrate W from the first nozzle outlet 41a (the nozzle outlet of the pilot nozzle).

When the first predetermined time T1 elapses after the first valve VA1 sends an opening signal to the first valve VA1 and the time t2 comes, the control device 101 (control unit 102) sends an opening signal to the second valve VA2. As a result, the second valve VA2 (rear valve) switches from a closed state to an open state, and starts to supply the first cleaning liquid (rear treatment liquid) to the second nozzle 42 (rear nozzle).

As described above, the second valve VA2 is switched from the closed state to the open state, and the first delay time DT1 occurs until the first cleaning liquid is sprayed out by the second nozzle 42. Therefore, the camera 110 detects the start of spraying of the first cleaning liquid at the timing from the moment t2 to the moment t3 after the first delay time DT1. As a result, the control device 101 (control unit 102) sends a closing signal to the first valve VA1 at the timing from the moment t2 to the moment t3 after the first delay time DT1, switching the first valve VA1 from the open state to the closed state. When the first valve VA1 (pilot valve) is switched from the open state to the closed state, the supply of the first chemical solution to the first nozzle 41 is stopped, and the supply of the first chemical solution (preliminary treatment solution) to the substrate W from the first ejection port 41a (the ejection port of the pilot nozzle) is stopped.

When the second predetermined time T2 elapses after the second valve VA2 (pre-valve) sends an opening signal to the second valve VA2 (pre-valve) and the time t4 is reached, the control device 101 (control unit 102) sends an opening signal to the third valve VA3 (post-valve). As a result, the third valve VA3 switches from a closed state to an open state, and starts to supply the second cleaning liquid (post-treatment liquid) to the third nozzle 43 (post-nozzle). As described above, the second delay time DT2 occurs from the time when the third valve VA3 becomes open until the second cleaning liquid is sprayed out through the third nozzle 43.

Therefore, the camera 110 detects the start of ejection of the second cleaning liquid (post-processing liquid) at the timing from the moment t4 to the moment t5 after the second delay time DT2. As a result, the control device 101 (control unit 102) sends a closing signal to the second valve VA2 at the timing from the moment t4 to the moment t5 after the second delay time DT2, switching the second valve VA2 from the open state to the closed state. When the second valve VA2 (pre-valve) switches from the open state to the closed state, the supply of the first cleaning liquid to the second nozzle 42 is stopped, thereby stopping the supply of the first cleaning liquid (pre-processing liquid) from the second nozzle outlet 42a (the nozzle outlet of the pre-nozzle) to the substrate W.

When the third predetermined time T3 elapses after the third valve VA3 (pre-valve) sends an opening signal to the third valve VA3 (pre-valve) and the time t6 is reached, the control device 101 (control unit 102) sends an opening signal to the fourth valve VA4 (pre-valve). As a result, the fourth valve VA4 switches from a closed state to an open state, and starts to supply the second liquid medicine (post-treatment liquid) to the fourth nozzle 44 (post-nozzle). As described above, the third delay time DT3 occurs during the period from when the fourth valve VA4 becomes open to when the second liquid medicine is sprayed out through the fourth nozzle 44.

Therefore, the camera 110 detects the start of ejection of the second chemical solution (post-processing solution) at the timing from the time t6 to the time t7 after the third delay time DT3. As a result, the control device 101 (control unit 102) sends a closing signal to the third valve VA3 at the timing from the time t6 to the time t7 after the third delay time DT3. The third valve VA3 is switched from the open state to the closed state. When the third valve VA3 (pre-valve) is switched from the open state to the closed state, the supply of the second cleaning solution to the third nozzle 43 is stopped, thereby stopping the supply of the second cleaning solution (pre-processing solution) from the third nozzle outlet 43a (the nozzle outlet of the pre-nozzle) to the substrate W.

When the fourth predetermined time T4 elapses after the fourth valve VA4 (pre-valve) sends an opening signal to the fourth valve VA4 (pre-valve) and the time t8 is reached, the control device 101 (control unit 102) sends an opening signal to the third valve VA3 (post-valve). As a result, the third valve VA3 switches from a closed state to an open state, and starts to supply the second cleaning liquid (post-treatment liquid) to the third nozzle 43 (post-nozzle). As described above, the fourth delay time DT4 occurs during the period from the third valve VA3 switching from a closed state to an open state until the second cleaning liquid is sprayed out by the third nozzle 43.

Therefore, the camera 110 detects the start of ejection of the second cleaning liquid (post-processing liquid) at the timing from the moment t8 to the moment t9 after the fourth delay time DT4. As a result, the control device 101 (control unit 102) sends a closing signal to the fourth valve VA4 at the timing from the moment t8 to the moment t9 after the fourth delay time DT4. The fourth valve VA4 is switched from the open state to the closed state. When the fourth valve VA4 (pre-valve) is switched from the open state to the closed state, the supply of the second liquid to the fourth nozzle 44 is stopped, thereby stopping the supply of the second liquid (pre-processing liquid) from the fourth nozzle outlet 44a (the nozzle outlet of the pre-nozzle) to the substrate W.

The first embodiment of the present invention is described above with reference to FIGS. 1 to 12. According to the present embodiment, in response to the camera 110 (detection unit) detecting the start of the ejection of the subsequent treatment liquid, the control unit 102 switches the pilot valve from the open state to the closed state. Therefore, the operator does not need to set the delay time (first delay time DT1 to fourth delay time DT4) for delaying the timing of the closing action of the pilot valve.

For example, the delay time needs to be changed every time the ejection pressure of each processing liquid changes. In addition, the delay time needs to be changed every time the air pressure used to open and close each valve or the back suction position of each processing liquid changes. Furthermore, the delay time needs to be changed every time the energy cost of the factory equipped with the substrate processing device 100 changes. Therefore, in the structure in which the operator sets the delay time, the burden of the operator increases. In contrast, according to this embodiment, since the operator does not need to set the delay time, the burden of the operator can be reduced.

Furthermore, the length of the pipe from each valve to each nozzle and the length of the delay time of each processing chamber 2 (processing part 1) due to the height difference of each nozzle are different. Therefore, it is necessary to set the delay time for each processing chamber 2 (processing part 1). According to this embodiment, since the operator does not need to set the delay time, the burden of the operator can be reduced.

In addition, in the configuration where the leading nozzle stops ejecting the leading processing liquid at the timing when the trailing nozzle has started to supply the trailing processing liquid (the timing when the trailing valve has been switched from the closed state to the open state), there is the possibility that particles are generated on the substrate W due to the delay time from the start of supplying the trailing processing liquid to the trailing nozzle until the trailing processing liquid lands on the substrate W. In particular, when a fine pattern is formed on the surface of the substrate W, the generation of particles will have a significant impact on the characteristics of the substrate W. The particles are, for example, water stains.

Specifically, there is the possibility that poor coverage occurs at the periphery of the substrate W due to the delay time from the start of supplying the subsequent processing liquid to the subsequent nozzle until the subsequent processing liquid lands on the substrate W. Poor coverage means that the upper surface of the substrate W is not covered by the liquid film of the processing liquid but is exposed. Poor coverage occurs mainly due to the surface tension of the processing liquid. When poor coverage occurs at the periphery of the substrate W and the periphery of the substrate W is dry, water stains may occur at the periphery of the substrate W.

In addition, in a configuration where the leading nozzle stops ejecting the leading processing liquid at the timing when the trailing processing liquid has started to be supplied to the trailing nozzle (the timing when the trailing valve has been switched from the closed state to the open state), there is a possibility that the pattern formed on the surface of the substrate W may collapse due to the delay time from the start of supplying the trailing processing liquid to the trailing nozzle until the trailing processing liquid lands on the substrate W. In particular, the pattern collapse is likely to occur when a fine pattern is formed on the surface of the substrate W. The pattern collapse has a significant impact on the characteristics of the substrate W.

Specifically, as described above, when poor coverage occurs on the periphery of the substrate W due to the delay time from the start of supplying the subsequent processing liquid to the subsequent nozzle until the subsequent processing liquid lands on the substrate W, the periphery of the substrate W may dry up. The collapse of the pattern occurs when the surface of the substrate W is dry.

In contrast, according to the present embodiment, the start of ejecting the following treatment liquid from the following nozzle is detected. Therefore, compared with a configuration in which the leading nozzle stops ejecting the preceding treatment liquid at the timing when the following treatment liquid has already started to be supplied to the following nozzle (at the timing when the following valve has already been switched from a closed state to an open state), the timing for stopping the ejection of the preceding treatment liquid from the leading nozzle can be controlled to reduce the delay time from when the ejection of the preceding treatment liquid stops until the following treatment liquid lands on the substrate W. Therefore, the delay time from when the ejection of the preceding treatment liquid stops until the following treatment liquid lands on the substrate W can be reduced, thereby suppressing the occurrence of water stains and the collapse of the pattern.

In addition, in this embodiment, although the photographing device 110 starts photographing after the substrate holding portion 3 holds the substrate W and ends photographing after performing substrate processing, the timing of starting photographing and ending photographing of the photographing device 110 is not particularly limited as long as the start of spraying of the first cleaning liquid, the start of spraying of the second cleaning liquid, and the start of spraying of the second chemical solution can be detected.

[Implementation Form 2] Next, the implementation form 2 of the present invention is described with reference to Figures 1 to 6, Figures 9 to 11, and Figures 13 to 15. However, the description of matters different from the implementation form 1 is omitted, and the description of matters the same as the implementation form 1 is omitted. The difference between the implementation form 2 and the implementation form 1 is that the data used to display the start timing of spraying each treatment liquid is sent to the external device GS.

Fig. 13 is a block diagram showing a part of the structure of the substrate processing apparatus 100 of the present embodiment. In addition, for easy understanding, only the control device 101 and the communication unit 112 of the components of the substrate processing apparatus 100 are shown in Fig. 13, and other components are omitted.

As shown in FIG. 13 , the substrate processing apparatus 100 of this embodiment further includes a communication unit 112. The communication unit 112 communicates with the external device GS. For example, the communication unit 112 is connected to the network NW in a wired or wireless manner and communicates with the external device GS connected to the network NW. The network NW includes, for example, the Internet, a LAN (Local Area Network), and a public telephone network. In this case, the communication unit 112 is, for example, a network interface controller.

In this embodiment, the communication unit 112 transmits data for displaying the start ejection timing of each treatment liquid (the first chemical liquid, the second chemical liquid, the first cleaning liquid, and the second cleaning liquid) to the external device GS. More specifically, the communication unit 112 transmits the start ejection timing of the first chemical liquid, the start ejection timing of the first cleaning liquid, the start ejection timing of the second cleaning liquid (first time), the start ejection timing of the second chemical liquid, and the start ejection timing of the second cleaning liquid (second time) to the external device GS.

As described with reference to FIG. 4 , the shooting range SH of the shooting device 110 further includes a range capable of shooting the front end (first nozzle 41a) of the first nozzle 41 located at the processing position and the first liquid ejected from the front end (first nozzle 41a) of the first nozzle 41. In this embodiment, the shooting device 110 further detects the start of ejection of the first liquid, similarly to the second liquid, the first cleaning liquid, and the second cleaning liquid. In addition, similarly to the second liquid, the first cleaning liquid, and the second cleaning liquid, the control unit 102 further obtains the start timing of ejection of the first liquid from the first nozzle 41.

More specifically, the control unit 102 sets the image processing area KA for the first nozzle 41 when the first nozzle 41 is located at the processing position. Specifically, the image processing area KA includes a fourth image processing area, and the fourth image processing area extends from the front end (first ejection outlet 41a) of the first nozzle 41 toward the ejection direction of the first chemical solution. The control unit 102 detects the start timing of ejection of the first chemical solution based on the image of the fourth image processing area.

The external device GS is, for example, a host computer or a server. The external device GS collects and analyzes the start ejection timing of each processing liquid. The external device GS, for example, sends a command for adjusting the time of supplying each processing liquid to the substrate W based on the collected start ejection timing of each processing liquid to the substrate processing device 100. In addition, the external device GS can also communicate with a plurality of substrate processing devices 100. In this case, the external device GS collects the start ejection timing of each processing liquid for each substrate processing device 100.

Next, the substrate processing method of this embodiment is described with reference to FIGS. 1 to 6, 9 to 11, 13 and 14. FIG. 14 is a flow chart showing the substrate processing method of this embodiment. The substrate processing method shown in FIG. 14 is performed by the substrate processing apparatus 100 described in FIGS. 1 to 6 and 13. Therefore, FIG. 14 shows the operation of the substrate processing apparatus 100 of this embodiment.

Compared to the substrate processing method (operation of the substrate processing apparatus 100) described with reference to FIG. 7, the substrate processing method (operation of the substrate processing apparatus 100) shown in FIG. 14 further includes step S7.

Specifically, when the central robot CR carries the substrate W out of the processing chamber 2 (step S6), the control device 101 (control unit 102) controls the communication unit 112 to send data for displaying the start timing of spraying of each processing liquid (first chemical liquid, second chemical liquid, first cleaning liquid, and second cleaning liquid) to the external device GS (step S7). As a result, the substrate processing method (operation of the substrate processing device 100) shown in FIG. 14 is terminated.

Next, the substrate processing method (operation of the substrate processing apparatus 100) of this embodiment will be described with reference to Fig. 1 to Fig. 6, Fig. 9 to Fig. 11, and Fig. 13 to Fig. 15. Fig. 15 is a flow chart showing the process of substrate processing (step S4 shown in Fig. 14). Specifically, Fig. 15 shows a part of the process of substrate processing.

As shown in FIG. 15 , when substrate processing starts, similarly to step S11 in FIG. 8 , the first nozzle moving mechanism 5 moves the first nozzle 41 from the first retreat area to the processing position (step S51 ).

When the first nozzle 41 moves to the treatment position, similarly to step S12 of FIG. 8 , the control device 101 (control unit 102) controls the first valve VA1 (pilot valve) to start supplying the first chemical solution (pilot treatment solution) to the first nozzle 41 (pilot nozzle) (step S52).

After the first chemical liquid is supplied, the control device 101 (control unit 102) determines whether the start of ejection of the first chemical liquid (preliminary treatment liquid) from the first ejection port 41a (the ejection port of the preliminary ejection nozzle) is detected (step S53). Specifically, the control device 101 (control unit 102) determines whether the start of ejection of the first chemical liquid from the first ejection port 41a is detected based on the captured image SG input from the imaging device 110. In detail, the control device 101 (control unit 102) extracts the fourth image processing area from each frame of the captured image SG. Next, the control device 101 (control section 102) performs image processing on each fourth image processing area, and determines whether the start of ejection of the first chemical solution from the first ejection port 41a is detected.

When the control device 101 (control unit 102) determines that the start of ejection of the first chemical liquid from the first ejection port 41a has not been detected ("No" in step S53), the control device 101 (control unit 102) repeats the processing of step S53. When the control device 101 (control unit 102) determines that the start of ejection of the first chemical liquid (preliminary treatment liquid) from the first ejection port 41a (the ejection port of the preliminary nozzle) has been detected ("Yes" in step S53), similarly to step S13 of FIG. 8, it determines whether the first predetermined time T1 has passed after the start of supply of the first chemical liquid (step S54). Since the subsequent steps (steps S55 to S57) are the same as steps S14 to S16 of FIG. 8, the description of these steps is omitted.

The second embodiment of the present invention has been described above with reference to Figures 1 to 6, Figures 9 to 11, and Figures 13 to 15. According to this embodiment, the supply timing of each treatment liquid can be adjusted with higher accuracy compared to a configuration in which the external device GS analyzes the timing of sending an opening signal to each valve (first valve VA1 to fourth valve VA4).

In detail, as described above, the timing of starting to spray each treatment liquid (first chemical liquid, first cleaning liquid, second cleaning liquid, and second chemical liquid) from each nozzle (first nozzle 41a to fourth nozzle 44a) is delayed compared to the timing of sending the opening signal to each valve (first valve VA1 to fourth valve VA4). These delay times are caused by the change of the spray pressure of each treatment liquid, the change of the air pressure used to open and close each valve, the change of the back suction position of each treatment liquid, the length of the piping from each valve to each nozzle, and the height difference of each nozzle. Therefore, the delay time is not fixed. Therefore, in order to adjust the timing of supplying each processing liquid to the substrate W in the structure for analyzing the timing of sending the opening signal to each valve (the first valve VA1 to the fourth valve VA4), various factors need to be considered. Therefore, it is not easy to adjust the timing of supplying each processing liquid to the substrate W with high precision. In contrast, according to this embodiment, since the start timing of spraying each processing liquid can be analyzed, the timing of supplying each processing liquid to the substrate W can be adjusted with high precision.

In addition, in the present embodiment, when the central robot CR carries the substrate W out of the processing chamber 2 (step S6), the control device 101 (control unit 102) controls the communication unit 112 to send data for displaying the start timing of spraying of each processing liquid to the external device GS, but the timing for sending the data for displaying the start timing of spraying of each processing liquid is not particularly limited. For example, the control device 101 (control unit 102) may also send data for displaying the start timing of spraying of each processing liquid to the external device GS each time a predetermined number of substrate processings are performed.

In addition, although the start timing of spraying of each processing liquid is detected in the present embodiment, the control unit 102 may also obtain the stop timing of supplying each processing liquid instead of the start timing of spraying of each processing liquid, or obtain the stop timing of supplying each processing liquid in addition to the start timing of spraying of each processing liquid, and send the data of these timings to the external device GS. By analyzing the stop timing of supplying each processing liquid instead of the start timing of spraying of each processing liquid, or analyzing the stop timing of supplying each processing liquid in addition to the start timing of spraying of each processing liquid, the time of supplying each processing liquid to the substrate W can be adjusted with higher accuracy.

Specifically, the control unit 102 can also obtain the timing of sending a closing signal to the first valve VA1 as the timing of stopping the supply of the first chemical solution (step S57 of FIG. 15). Similarly, the control unit 102 can also obtain the timing of sending a closing signal to the second valve VA2 (step S25 of FIG. 9), the timing of sending a closing signal to the third valve VA3 (step S35 of FIG. 10), and the timing of sending a closing signal to the fourth valve VA4 (step S42 of FIG. 11) as the timing of stopping the supply of the first cleaning solution, the second cleaning solution (first time), and the second chemical solution.

[Implementation Form Three] Next, the implementation form three of the present invention is described with reference to Figures 1 to 8, Figure 10, and Figures 16 to 20. However, the description of matters different from the implementation forms 1 and 2 is omitted for matters the same as the implementation forms 1 and 2. The difference between the implementation form 3 and the implementation forms 1 and 2 is that the timing of stopping the spraying of the first cleaning liquid (pre-treatment liquid) after the start of spraying the second cleaning liquid (post-treatment liquid) and the timing of stopping the spraying of the second chemical solution (pre-treatment liquid) after the start of spraying the second cleaning liquid (post-treatment liquid) are further delayed.

FIG16 is a block diagram showing a part of the structure of the substrate processing apparatus 100 of this embodiment. In addition, for easy understanding, FIG16 only shows the control device 101, the input unit 113 and the display unit 114 of the components of the substrate processing apparatus 100, and the other components are omitted. As shown in FIG16, the substrate processing apparatus 100 of this embodiment further has an input unit 113 and a display unit 114.

The input unit 113 is a user interface device for the operator to operate. The input unit 113 inputs instructions (control signals) corresponding to the operator's operation to the control unit 102. In addition, the input unit 113 inputs data corresponding to the operator's operation to the control unit 102. Typically, the input unit 113 has a keyboard and a mouse. In addition, the input unit 113 may also have a touch sensor. The touch sensor is superimposed on the display surface of the display unit 114, and generates a signal for displaying the operator's touch operation on the display surface. The operator can input various instructions and various data to the control unit 102 through touch operation.

In this embodiment, the operator can operate the input unit 113 to input (register or set) various information in the input fields of the screen displayed by the display unit 114. Specifically, the operator can operate the input unit 113 to input the value of the additional delay time ADT.

As described with reference to FIG. 2 , the third nozzle 43 is disposed on the outer side of the liquid receiving portion 9, and sprays the second cleaning liquid from the outer side of the liquid receiving portion 9 toward the center of the rotating substrate W. Therefore, a delay time occurs from the time when the third nozzle 43 starts spraying the second cleaning liquid until the second cleaning liquid lands on the substrate W. Hereinafter, this delay time may be referred to as a "landing delay time". The additional delay time ADT can be set according to the landing delay time.

Fig. 17 is a diagram showing an input screen GA displayed on the display unit. The input screen GA is a screen for setting the additional delay time ADT. As shown in Fig. 17, the input screen GA includes an input field NR for inputting a value of the additional delay time ADT.

The operator can input the value of the additional delay time ADT to the input field NR by operating the input unit 113 when the input screen GA is displayed on the display unit 114. The operator can also determine the value of the additional delay time ADT by considering, for example, the ejection flow rate of the second cleaning liquid and the distance from the third ejection port 43a to the substrate W.

Next, the substrate processing method (operation of the substrate processing apparatus 100) of this embodiment will be described with reference to FIGS. 1 to 8, 10, and 16 to 19. FIGS. 18 and 19 are flow charts showing the process of substrate processing (step S4 shown in FIG. 7). Specifically, FIG. 18 shows a part of the process of substrate processing. FIG. 19 shows the other part of the process of substrate processing.

As shown in Figure 18, the control device 101 (control unit 102) controls the second valve VA2 (pilot valve) to perform closing action control processing (step S25) when it is determined that the second cleaning liquid (pilot treatment liquid) starts to be sprayed from the third nozzle 43a (the nozzle of the subsequent nozzle) ("Yes" in step S24). The closing action control (step S25) stops supplying the first cleaning liquid (pilot treatment liquid) to the second nozzle 42 (pilot nozzle).

In detail, when the control device 101 (control unit 102) detects that the second cleaning liquid (subsequent processing liquid) starts to be ejected from the third ejection port 43a (the ejection port of the subsequent ejection nozzle) ("Yes" in step S24), it determines whether the additional delay time ADT described with reference to FIG. 16 and FIG. 17 has passed (step S251). Specifically, the control unit 102 starts timing in response to the detection of the start of ejection of the second cleaning liquid. The control unit 102 determines whether the timing result has reached the additional delay time ADT. The second cleaning liquid lands on the substrate W during the additional delay time ADT.

When the control device 101 (control unit 102) determines that the additional delay time ADT has not passed ("No" in step S251), the control device 101 (control unit 102) repeats the process of step S251. When the control device 101 (control unit 102) determines that the additional delay time ADT has passed ("Yes" in step S251), the control device 101 (control unit 102) controls the second valve VA2 (pilot valve) to perform a closing motion control process (step S252), and the closing motion control process (step S252) stops supplying the first cleaning liquid (pilot liquid) to the second nozzle 42 (pilot nozzle).

In addition, as shown in Figure 19, the control device 101 (control unit 102) controls the fourth valve VA4 (pilot valve) to perform a closing action control process (step S42) when it is determined that the second cleaning liquid (pilot treatment liquid) starts to be sprayed from the third nozzle 43a (the nozzle of the subsequent nozzle) ("Yes" in step S41). The closing action control process (step S42) stops the supply of the second liquid (pilot treatment liquid) to the fourth nozzle 44 (pilot nozzle).

Specifically, when the control device 101 (control unit 102) determines that the second cleaning liquid (subsequent treatment liquid) starts to be ejected from the third nozzle 43a (the nozzle of the subsequent nozzle) ("Yes" in step S41), it determines whether the additional delay time ADT has passed (step S421), similarly to step S251 shown in FIG. 18 . Next, when the control device 101 (control unit 102) determines that the additional delay time ADT has passed ("Yes" in step S421), it controls the fourth valve VA4 (pilot valve) to execute the closing action control processing (step S422), and the closing action control processing (step S422) stops supplying the second liquid (pilot treatment liquid) to the fourth nozzle 44 (pilot nozzle).

Next, the substrate processing apparatus 100 of the present embodiment will be described with reference to Fig. 1 to Fig. 8, Fig. 10, and Fig. 16 to Fig. 20. Fig. 20 is a timing chart showing the opening and closing actions of the first valve VA1 to the fourth valve VA4 and the detection action of the camera 110. In addition, the horizontal axis in Fig. 20 shows the time t, t11 to t21.

As shown in FIG. 20 , the second valve VA2 does not move to the closed state but maintains the open state at the timing (time t15) when the start of the second cleaning liquid spraying is detected. In the present embodiment, the second valve VA2 is switched from the open state to the closed state at the timing (time t16) when the additional delay time ADT has passed since the start of the second cleaning liquid spraying is detected (time t15). The fourth valve VA4 is also switched from the open state to the closed state at the timing (time t21) when the additional delay time ADT has passed since the start of the second cleaning liquid spraying is detected (time t20).

The third embodiment of the present invention is described above with reference to Figures 1 to 8, 10, and 16 to 20. According to this embodiment, after the second cleaning liquid starts to be sprayed, poor coverage due to delayed landing time is less likely to occur.

[Implementation Form 4] Next, the implementation form 4 of the present invention is described with reference to Figures 1 to 7, Figures 9 to 11, Figure 21, and Figure 22. However, the description of matters different from the implementation forms 1 to 3 is omitted, and the description of matters the same as the implementation forms 1 to 3 is omitted. The difference between the implementation form 4 and the implementation forms 1 to 3 is that the start timing of the supply of the first liquid medicine is delayed.

FIG21 is a flow chart showing the process of substrate processing (step S4 shown in FIG7 ) included in the substrate processing method of the present embodiment. Specifically, FIG21 shows a part of the process of substrate processing. As shown in FIG21 , when the substrate processing starts, similarly to step S11 of FIG8 , the first nozzle moving mechanism 5 moves the first nozzle 41 from the first retreat area to the processing position (step S71).

When the first nozzle 41 moves to the processing position, the control device 101 (control unit 102) determines whether the start delay time SDT has passed (step S72). Specifically, the control unit 102 starts timing in response to the first nozzle 41 moving to the processing position. The start delay time SDT is stored in the storage unit 103. The control unit 102 determines whether the timing result has reached the start delay time SDT.

When the control device 101 (control unit 102) determines that the start delay time SDT has not passed ("No" in step S72), the control device 101 (control unit 102) repeats the processing of step S72. When the control device 101 (control unit 102) determines that the start delay time SDT has passed ("Yes" in step S72), similarly to step S12 in FIG. 8, the control device 101 (control unit 102) controls the first valve VA1 (pilot valve) to start supplying the first chemical solution (pilot treatment solution) to the first nozzle 41 (pilot nozzle) (step S73). Since the subsequent actions (steps S74 to S77) are the same as steps S13 to S16 in FIG. 8, the description of these steps is omitted.

Next, the substrate processing apparatus 100 of this embodiment will be described with reference to Fig. 1 to Fig. 7, Fig. 9 to Fig. 11, Fig. 21 and Fig. 22. Fig. 22 is a timing chart showing the opening and closing actions of the first valve VA1 and the second valve VA2 and the detection action of the camera 110. In addition, the horizontal axis in Fig. 22 shows the time t, t21 to t24.

As shown in FIG22, the control device 101 (control unit 102) sends an opening signal to the first valve VA at the timing (time t21) when the first nozzle 41 moves to the processing position and further at the timing (time t22) when the start delay time SDT passes. As a result, the first valve VA1 becomes open, and the first chemical solution starts to be supplied to the first nozzle 41, and the first chemical solution is supplied to the substrate W from the first nozzle outlet 41a.

Here, the start delay time SDT is explained. The start delay time SDT is determined based on the first delay time DT1. For example, the control unit 102 may also obtain the first delay time DT1 when performing the first substrate processing, and set the value of the first delay time DT1 to the value of the start delay time SDT. Alternatively, the control unit 102 may also obtain the first delay time DT1 each time the substrate processing is performed, and update the start delay time SDT before performing the next substrate processing.

The fourth embodiment of the present invention has been described above with reference to FIGS. 1 to 7, 9, 10, and 21 to 22. According to this embodiment, it is possible to suppress the increase in the time for supplying the first chemical solution to the substrate W due to the first delay time DT1. Therefore, it is possible to suppress the occurrence of defects due to the increase in the time for supplying the first chemical solution (preliminary treatment solution) to the substrate W.

For example, when the substrate treatment using the first chemical solution is an etching treatment for flattening the upper surface of the substrate W, if the time for supplying the first chemical solution to the substrate W becomes longer than the first predetermined time T1, the thickness of the substrate W may become thinner than the target thickness. Therefore, the characteristics of the device manufactured using the substrate W may not be the desired characteristics.

Furthermore, when the substrate W is a patterned wafer and the substrate treatment performed by the first chemical solution is an etching treatment for removing a natural oxide film, if the time for supplying the first chemical solution to the substrate W becomes longer than the first predetermined time T1, there is a concern that the silicon oxide film used to form the pattern becomes too fine and the characteristics of the device manufactured using the substrate W cannot become the desired characteristics. Furthermore, when the silicon oxide film used to form the pattern becomes too fine, the pattern becomes easy to collapse.

Furthermore, when the metal wiring is exposed to the bottom of the groove of the pattern, the first chemical solution removes the natural oxide film covering the metal wiring. However, when the time for supplying the first chemical solution to the substrate W becomes longer than the first predetermined time T1, there is a concern that the etching may stop at the metal wiring, and the electrical characteristics of the device manufactured using the substrate W may not become the desired characteristics.

According to this embodiment, since the time for supplying the first chemical solution to the substrate W is prevented from increasing due to the first delay time DT1, the time for supplying the first chemical solution to the substrate W is unlikely to become longer than the first predetermined time T1. Therefore, the above-described defect can be prevented from occurring.

In addition, when performing the first substrate processing, the timing of sending the opening signal to the first valve VA1 cannot be adjusted by the start delay time SDT. Therefore, the first substrate W may also be a dummy wafer.

The embodiments of the present invention have been described above with reference to the drawings (FIG. 1 to FIG. 22). However, the present invention is not limited to the embodiments described above, and can be implemented in various forms without departing from the spirit of the present invention. In addition, the plurality of components disclosed in the embodiments described above can be appropriately changed. For example, a certain component of all the components shown in a certain embodiment can be added to the components of another embodiment, or some of the components of all the components shown in a certain embodiment can be deleted from the embodiment.

In order to facilitate the understanding of the present invention, the drawings mainly and schematically show each component, and the thickness, length, number, spacing, etc. of each component shown in the drawings may be different from the actual ones due to the drawing of the drawings. In addition, the configuration of each component shown in the embodiment described above is an example and is not particularly limited. Various changes can be made within the scope that does not substantially deviate from the effect of the present invention.

Next, variations of the embodiments (embodiment 1 to embodiment 4) described with reference to FIGS. 1 to 22 will be described.

(1) In the embodiments described with reference to FIGS. 1 to 22 , although the photographing device 110 detects the ejection of the processing liquid (the first cleaning liquid, the second cleaning liquid, and the second chemical liquid; or the first chemical liquid, the first cleaning liquid, the second cleaning liquid, and the second chemical liquid) from the nozzle outlet (the second nozzle 42 to the fourth nozzle 44 or the first nozzle 41 to the fourth nozzle 44) (the second nozzle 42a to the fourth nozzle 44a or the first nozzle 41a to the fourth nozzle 44), in the case where the component (material) used to constitute the nozzle is a transparent component (transparent material), the photographing device 110 may also detect the fact that the processing liquid has reached the nozzle outlet as the start of ejection of the processing liquid.

FIG. 23 is a diagram showing a first variation of the substrate processing apparatus 100 of the embodiment described with reference to FIG. 1 to FIG. 22. Specifically, FIG. 23 shows a captured image SG when the first cleaning liquid has reached the second nozzle 42a. As shown in FIG. 23, in the case where the member (material) constituting the second nozzle 42 is a transparent member (transparent material), the camera 110 can detect that the first cleaning liquid has reached the nozzle (second nozzle 42a) of the second nozzle 42.

In the case of detecting that the first cleaning liquid has reached the nozzle of the second nozzle 42, the first image processing area KA1 may be set to reflect the area from the base end to the front end of the second nozzle 42. The width of the first image processing area KA1 in the horizontal direction may be set to be wider than the width of the second nozzle 42. The length of the first image processing area KA1 in the longitudinal direction may be set to be the same as the length of the second nozzle 42. The other image processing areas KA (the second image processing area to the fourth image processing area) are also set to be the same as the first image processing area KA1.

(2) In the embodiments described with reference to FIGS. 1 to 22 , although the photographing device 110 detects the ejection of the processing liquid (the first cleaning liquid, the second cleaning liquid, and the second chemical liquid; or the first chemical liquid, the first cleaning liquid, the second cleaning liquid, and the second chemical liquid) from the nozzle outlet (the second nozzle 42 to the fourth nozzle 44 or the first nozzle 41 to the fourth nozzle 44) (the second nozzle 42a to the fourth nozzle 44a or the first nozzle 41a to the fourth nozzle 44), when the component (material) constituting the nozzle is a transparent component (transparent material), the photographing device 110 may detect the fact that the processing liquid has reached the vicinity RL of the nozzle outlet as the start of ejection of the processing liquid.

FIG. 24 is a diagram showing a second variation of the substrate processing apparatus 100 of the embodiment described with reference to FIG. 1 to FIG. 22. Specifically, FIG. 24 shows a captured image SG when the first cleaning liquid has reached the vicinity RL of the second nozzle 42a. As shown in FIG. 24, in the case where the member (material) constituting the second nozzle 42 is a transparent member (transparent material), the capturing device 110 can detect that the first cleaning liquid has reached the vicinity RL of the nozzle (second nozzle 42a) of the second nozzle 42. Here, the vicinity RL of the second nozzle 42a indicates, for example, that the range from the front end of the second nozzle 42 (the second nozzle 42a) is the same as the range L from the front end to the base end of the second nozzle 42 or the range narrowed toward the front end of the second nozzle 42. The vicinity RL of the other nozzles (the first nozzle 41a, the third nozzle 43a, and the fourth nozzle 44a) is also the same as the vicinity RL of the second nozzle 42a.

In the case of detecting that the first cleaning liquid has reached the vicinity RL of the nozzle of the second nozzle 42, the first image processing area KA1 may be set to reflect the area from the base end to the front end of the second nozzle 42. The other image processing areas KA (the second image processing area to the fourth image processing area) are also set to be the same as the first image processing area KA1.

(3) In the embodiments described with reference to FIGS. 1 to 22 , the substrate processing apparatus 100 includes the camera 110 as the detection unit. However, the detection unit is not limited to the camera 110 as long as it can detect the start of ejection of the processing liquid. For example, the substrate processing apparatus 100 may include a photo sensor 120 as the detection unit.

FIG. 25 is a diagram showing a third variation of the substrate processing apparatus 100 of the embodiment described with reference to FIG. 1 to FIG. 22. The substrate processing apparatus 100 shown in FIG. 25 has a photo sensor 120 as a detection unit. Specifically, the substrate processing apparatus 100 has three photo sensors 120. The three photo sensors 120 include a photo sensor 120 disposed relative to the second nozzle 42, a photo sensor 120 disposed relative to the third nozzle 43, and a photo sensor 120 disposed relative to the fourth nozzle 44. FIG. 25 shows the photo sensor 120 disposed relative to the second nozzle 42. Hereinafter, the photo sensor 120 provided opposite to the second nozzle 42 may be referred to as “photo sensor 121”.

As shown in FIG. 25 , the photo sensor 121 irradiates light to the area below the second nozzle 42 located at the standby position, and receives light reflected from the area below the second nozzle 42. Therefore, the first cleaning liquid is ejected from the ejection port (second ejection port 42a) of the second nozzle 42 and the first cleaning liquid passes through the area below the second nozzle 42, whereby the light received by the photo sensor 121 changes. Therefore, the photo sensor 121 can detect that the first cleaning liquid has been ejected from the ejection port of the second nozzle 42.

Similar to the photo sensor 121, the photo sensor 120 provided for the third nozzle 43 also detects that the second cleaning solution has been ejected from the ejection port (third ejection port 43a) of the third nozzle 43. Similar to the photo sensor 121, the photo sensor 120 provided for the fourth nozzle 44 also detects that the second chemical solution has been ejected from the ejection port (fourth ejection port 44a) of the fourth nozzle 44 located at the processing position. Furthermore, similarly to the camera 110 described in the second embodiment, the photo sensor 120 provided opposite to the fourth nozzle 44 can also detect that the first chemical solution has been ejected from the ejection port (first ejection port 41a) of the first nozzle 41 located at the processing position.

Similar to the shooting device 110 described with reference to Figure 23, in the case where the components (materials) used to constitute the nozzle (the first nozzle 41 to the fourth nozzle 44) are transparent components (transparent materials), the light sensor 120 can also detect that the processing liquid (the first chemical liquid, the first cleaning liquid, the second cleaning liquid, the second chemical liquid) has reached the nozzle outlet (the first nozzle 41a to the fourth nozzle 44a). Alternatively, similar to the shooting device 110 described with reference to Figure 24, in the case where the components (materials) used to constitute the nozzle (the first nozzle 41 to the fourth nozzle 44) are transparent components (transparent materials), the light sensor 120 can also detect the situation where the processing liquid (the first chemical liquid, the first cleaning liquid, the second cleaning liquid, the second chemical liquid) has reached the vicinity RL of the nozzle outlet (the first nozzle 41a to the fourth nozzle 44a).

FIG. 26 is a diagram showing a fourth variation of the substrate processing apparatus 100 of the embodiment described with reference to FIG. 1 to FIG. 22. Specifically, as shown in FIG. 26, in the case where the member (material) used to constitute the second nozzle 42 is a transparent member (transparent material), the photo sensor 121 can also irradiate light to the vicinity RL of the second nozzle 42a and receive reflected light from the vicinity RL of the second nozzle 42a. In the case where the member (material) used to constitute the second nozzle 42 is a transparent member (transparent material), the light received by the photo sensor 121 changes when the first cleaning liquid passes through the vicinity RL of the second nozzle 42a. Therefore, the photo sensor 121 can detect that the first cleaning liquid has reached the vicinity RL of the nozzle of the second nozzle 42.

Similar to the photo sensor 121, the photo sensor 120 provided for the third nozzle 43 can also detect that the second cleaning liquid has reached the vicinity RL of the third nozzle 43a. Similar to the photo sensor 121, the photo sensor 120 provided for the fourth nozzle 44 can also detect that the second chemical liquid has reached the vicinity RL of the fourth nozzle 44a. Furthermore, the photo sensor 120 provided for the fourth nozzle 44 can also detect that the first chemical liquid has reached the vicinity RL of the first nozzle 41a.

(4) In the embodiment described with reference to FIGS. 1 to 22 , although the substrate processing apparatus 100 includes the imaging device 110 as the detection unit, the substrate processing apparatus 100 may also include the capacitive sensor 130 as the detection unit.

FIG27 and FIG28 are diagrams showing a fifth variation of the substrate processing apparatus 100 of the embodiment described with reference to FIG1 to FIG22. The substrate processing apparatus 100 shown in FIG27 and FIG28 has a capacitance sensor 130 as a detection unit. The capacitance sensor 130 generates an electric field in a detection region and detects a detection object by a change in capacitance when the detection object enters the electric field.

Specifically, the substrate processing apparatus 100 includes three capacitance sensors 130. The three capacitance sensors 130 include a capacitance sensor 130 provided at the second nozzle 42, a capacitance sensor 130 provided at the third nozzle 43, and a capacitance sensor 130 provided at the fourth nozzle 44. FIG. 27 and FIG. 28 show the capacitance sensor 130 provided at the second nozzle 42. Hereinafter, the capacitance sensor 130 provided at the second nozzle 42 may be referred to as "capacitance sensor 131".

As shown in FIG. 27 and FIG. 28 , the capacitance sensor 131 is disposed in the vicinity RL of the second ejection port 42a. The capacitance sensor 131 generates an electric field in the vicinity RL of the second ejection port 42a. Therefore, when the first cleaning liquid passes through the vicinity RL of the second ejection port 42a, the capacitance sensor 131 detects the first cleaning liquid. Therefore, the capacitance sensor 131 can detect that the first cleaning liquid has reached the vicinity RL of the second ejection port 42a.

Similar to the capacitance sensor 131, the capacitance sensor 130 provided at the third nozzle 43 is also provided near the third nozzle 43a RL to detect that the second cleaning liquid has reached the third nozzle 43a near RL. Similar to the capacitance sensor 131, the capacitance sensor 130 provided at the fourth nozzle 44 is provided near the fourth nozzle 44a RL to detect that the second chemical liquid has reached the fourth nozzle 44a near RL.

In addition, the substrate processing apparatus 100 may further include a capacitance sensor 130 disposed at the first nozzle 41. Similar to the capacitance sensor 131, the capacitance sensor 130 disposed at the first nozzle 41 is disposed near the first nozzle 41a RL to detect that the first chemical solution has reached the near the first nozzle 41a RL.

(5) In the embodiments described with reference to FIGS. 1 to 22 , a clamping-type fixture for clamping the substrate W is described as a structure for holding the substrate W. However, the structure for holding the substrate W is not particularly limited as long as it can horizontally hold the substrate W. For example, the substrate holding portion 3 may be a vacuum-type fixture or a Bernoulli-type fixture.

(6) In the embodiment described with reference to FIGS. 1 to 22 , the second nozzle 42 is moved from the standby position to the processing position. However, the second nozzle 42 may not be moved from the standby position to the processing position. That is, the second nozzle 42 may supply the first cleaning liquid to the substrate W from the standby position.

(7) In the embodiments described with reference to FIGS. 1 to 22 , although the camera 110 is disposed outside the processing chamber 2 , the camera 110 may also be disposed inside the processing chamber 2 .

(8) In the embodiments described with reference to FIGS. 1 to 22 , the control unit 102 performs timing. However, the substrate processing apparatus 100 may also include a timing circuit. In this case, the control unit 102 causes the timing circuit to perform timing. The timing circuit may also be provided in the control device 101.

(9) In the embodiments described with reference to FIGS. 1 to 22 , although the substrate processing apparatus 100 has one camera 110 , the substrate processing apparatus 100 may also have a plurality of camera 110 . [Industrial Applicability]

The present invention can be effectively applied to an apparatus for processing a substrate and a method for processing a substrate. Therefore, the present invention has industrial applicability.

1: Processing unit 2: Processing chamber 2a: Side wall 3: Substrate holding unit 5: First nozzle moving mechanism 6: Second nozzle moving mechanism 7: Substrate rotating unit 9: Liquid receiving unit 31: Rotating base 32: Clamping member 41: First nozzle 41a: First nozzle outlet 42: Second nozzle 42a: Second nozzle outlet 43: Third nozzle 43a: Third nozzle outlet 44: Fourth nozzle 44a: Fourth nozzle outlet 51: First nozzle arm 52: Second nozzle arm 53: First nozzle base 54: First nozzle moving unit 61: Third nozzle arm 62: Second nozzle base 63: Second nozzle moving part 71: Motor body 72: Shaft 81: First liquid supply pipe 82: Second liquid supply pipe 83: Third liquid supply pipe 84: Fourth liquid supply pipe 100: Substrate processing device 100A: Fluid cabinet 100B: Fluid box 101: Control device 102: Control unit 103: Memory unit 110: Camera device 111: Lighting device 112: Communication unit 113: Input unit 114: Display unit 120,121: Photo sensor 130,131: Capacitive sensor ADT: Additional delay time AX1: First rotation axis AX2: Second rotation axis AX3: Third rotation axis CP1, CP2, CP3: Center CR: Center robot DT1: First delay time DT2: Second delay time DT3: Third delay time DT4: Fourth delay time GA: Input screen GS: External device IR: Index robot KA: Image processing area KA1: First image processing area L: Range LP: Loading port NR: Input field NW: Network RL: Nearby SB1: First back suction valve SB2: Second back suction valve SB3: Third back suction valve SB4: Fourth back suction valve SDT: Start delay time SG: Shooting image SH: Shooting range S1 to S7, S11 to S16, S21 to S26, S31 to S37, S41 to S45, S51 to S57, S71 to S77, S251 to S252, S421 to S422: Steps TW: Tower T1: First set time T2: Second set time T3: Third set time T4: Fourth set time T5: Fifth set time t, t1 to t9, t11 to t24: Moment VA1: First valve VA2: Second valve VA3: Third valve VA4: Fourth valve W: Base plate

[FIG. 1] is a schematic diagram showing a substrate processing device of the first embodiment of the present invention. [FIG. 2] is a top view schematically showing the structure of a processing unit included in the substrate processing device of the first embodiment of the present invention. [FIG. 3] is a diagram schematically showing the structure of the substrate processing device of the first embodiment of the present invention. [FIG. 4] is a diagram showing the shooting range of the shooting device included in the substrate processing device of the first embodiment of the present invention. [FIG. 5] is a diagram showing a shot image when the first chemical solution is being ejected from the first ejection port. [FIG. 6] is a diagram showing a shot image when the first cleaning solution has started to be ejected from the second ejection port. [FIG. 7] is a flow chart showing the substrate processing method of the first embodiment of the present invention. [Figure 8] is a flow chart showing the process of substrate processing. [Figure 9] is a flow chart showing the process of substrate processing. [Figure 10] is a flow chart showing the process of substrate processing. [Figure 11] is a flow chart showing the process of substrate processing. [Figure 12] is a timing chart showing the opening and closing actions of the first valve to the fourth valve and the detection action performed by the camera. [Figure 13] is a block diagram showing a part of the structure of the substrate processing device of the second embodiment of the present invention. [Figure 14] is a flow chart showing the substrate processing method of the second embodiment of the present invention. [Figure 15] is a flow chart showing the process of substrate processing. [Figure 16] is a block diagram showing a part of the structure of the substrate processing device of the third embodiment of the present invention. [Fig. 17] is a diagram showing an input screen displayed on the display unit. [Fig. 18] is a flow chart showing the process of substrate processing. [Fig. 19] is a flow chart showing the process of substrate processing. [Fig. 20] is a timing chart showing the opening and closing actions of the first valve to the fourth valve and the detection action performed by the camera. [Fig. 21] is a flow chart showing the process of substrate processing included in the substrate processing method of the fourth embodiment of the present invention. [Fig. 22] is a timing chart showing the opening and closing actions of the first valve and the second valve and the detection action performed by the camera. [Fig. 23] is a diagram showing a first variation of the substrate processing device of the first embodiment to the fourth embodiment of the present invention. [FIG. 24] is a diagram showing a second variation of the substrate processing apparatus of the first to fourth embodiments of the present invention. [FIG. 25] is a diagram showing a third variation of the substrate processing apparatus of the first to fourth embodiments of the present invention. [FIG. 26] is a diagram showing a fourth variation of the substrate processing apparatus of the first to fourth embodiments of the present invention. [FIG. 27] is a diagram showing a fifth variation of the substrate processing apparatus of the first to fourth embodiments of the present invention. [FIG. 28] is a diagram showing a fifth variation of the substrate processing apparatus of the first to fourth embodiments of the present invention.

S4, S11 to S16: Steps

Claims (23)

A substrate processing method is used to process a substrate by a processing liquid, and includes: A process of holding the aforementioned substrate; A process of starting to supply the preceding processing liquid to the preceding nozzle and spraying the preceding processing liquid from the nozzle of the preceding nozzle toward the aforementioned substrate being held; A process of starting to supply the following processing liquid to the following nozzle and spraying the following processing liquid from the nozzle of the following nozzle toward the aforementioned substrate being held; A detection process of detecting the start of spraying the following processing liquid from the nozzle of the following nozzle; and A stopping process of stopping the supply of the preceding processing liquid to the preceding nozzle in response to detecting the start of spraying of the following processing liquid. The substrate processing method as recited in claim 1, wherein in the detection step, the fact that the subsequent processing liquid has been ejected from the ejection outlet of the subsequent ejection nozzle is detected. The substrate processing method as recited in claim 1, wherein in the detection step, it is detected that the subsequent processing liquid has reached the nozzle outlet of the subsequent nozzle. The substrate processing method as recited in claim 1, wherein in the detection step, it is detected that the subsequent processing liquid has reached the vicinity of the nozzle outlet of the subsequent nozzle. A substrate processing method as recited in any one of claims 2 to 4, wherein in the aforementioned detection step, the spraying of the aforementioned post-processing liquid is started by detection by a photographing device. A substrate processing method as recited in any one of claims 2 to 4, wherein in the detection step, the spraying of the post-processing liquid is started by detection by a photo sensor. As described in claim 4, the substrate processing method starts to spray the post-processing liquid by detecting with a capacitive sensor in the detection process. A substrate processing method as recited in any one of claims 1 to 4, wherein in the stopping step, supply of the preceding processing liquid to the preceding nozzle is stopped after the start of spraying of the following processing liquid is detected and until a predetermined time has passed. A substrate processing method as described in any one of claim items 1 to 4, further comprising the following process: adjusting the start supply timing of the aforementioned preliminary treatment liquid based on a supply time and a set time, wherein the aforementioned supply time indicates the time interval from the start of supplying the aforementioned preliminary treatment liquid to the stop of supplying the aforementioned preliminary treatment liquid in the aforementioned stop process, and the aforementioned set time is a time interval established for supplying the aforementioned preliminary treatment liquid. The substrate processing method as recited in any one of claims 1 to 4 further comprises the following step: obtaining a timing for stopping supply of the preceding processing liquid. The substrate processing method as recited in any one of claims 1 to 4 further comprises the following step: detecting the start of ejection of the preliminary processing liquid from the ejection outlet of the preliminary nozzle. A substrate processing device is used to process a substrate with a processing liquid, and comprises: A substrate holding portion for holding the substrate; A leading nozzle having a nozzle, from which the leading processing liquid is sprayed toward the substrate held by the substrate holding portion; A leading valve for controlling the supply of the leading processing liquid to the leading nozzle and stopping the supply of the leading processing liquid to the leading nozzle; A trailing nozzle having a nozzle, from which the trailing processing liquid is sprayed toward the substrate held by the substrate holding portion; A trailing valve for controlling the supply of the trailing processing liquid to the trailing nozzle and stopping the supply of the trailing processing liquid to the trailing nozzle; The detection unit detects the start of spraying the aforementioned post-processing liquid from the aforementioned spray outlet of the aforementioned post-processing nozzle; and the control unit controls the aforementioned post-processing valve to start supplying the aforementioned post-processing liquid to the aforementioned post-processing nozzle after controlling the aforementioned post-processing valve to start supplying the aforementioned post-processing liquid to the aforementioned post-processing nozzle; the aforementioned control unit performs a closing action control process in response to the aforementioned detection unit detecting the start of spraying the aforementioned post-processing liquid, and the aforementioned closing action control process controls the aforementioned post-processing valve to stop supplying the aforementioned post-processing liquid. The substrate processing apparatus as recited in claim 12, wherein the detection unit detects whether the subsequent processing liquid has been ejected from the ejection outlet of the subsequent nozzle. The substrate processing apparatus as recited in claim 12, wherein the detection unit detects whether the subsequent processing liquid has reached the nozzle outlet of the subsequent nozzle. The substrate processing apparatus as recited in claim 12, wherein the detection unit detects whether the subsequent processing liquid has reached the vicinity of the nozzle outlet of the subsequent nozzle. A substrate processing device as recited in any one of claims 13 to 15, wherein the detection section comprises: a photographing device for detecting the start of spraying of the post-processing liquid. A substrate processing device as recited in any one of claims 13 to 15, wherein the detection unit comprises: a photo sensor for detecting the start of spraying of the post-processing liquid. As described in claim 15, the substrate processing device, wherein the aforementioned detection unit includes: a capacitive sensor, which detects the start of spraying the aforementioned post-processing liquid. As described in any one of claim 12 to 15, the control unit controls the lead valve to stop supplying the lead processing liquid after the detection unit detects the start of spraying of the post-processing liquid and after a predetermined time has passed. A substrate processing device as described in any one of claim items 12 to 15, wherein the control unit adjusts the start timing of supplying the preceding treatment liquid based on a supply time and a set time, wherein the supply time indicates the time interval from the start of supplying the preceding treatment liquid to the stop of supplying the preceding treatment liquid by the closing action control process, and the set time is a time interval established for supplying the preceding treatment liquid. As described in any one of claims 12 to 15, the control unit obtains the timing for stopping the supply of the preceding processing liquid. A substrate processing apparatus as recited in any one of claims 12 to 15, wherein the detection unit detects the start of ejection of the preliminary processing liquid from the ejection outlet of the preliminary nozzle. The substrate processing device as recited in any one of claim items 12 to 15 further comprises: a plurality of processing chambers for accommodating the aforementioned substrate holding portion, the aforementioned leading nozzle, and the aforementioned trailing nozzle; The aforementioned control portion performs the aforementioned closing action control processing for each of the aforementioned processing chambers.

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