TWI848301B - Electronic device with cable interface and manufacturing method thereof - Google Patents

Abstract

An electronic device includes a printed circuit board, an integrated circuit, a connector, a choke module and a compensation module. The integrated circuit is disposed on the printed circuit board. The connector is disposed on the printed circuit board. The choke module is disposed on the printed circuit board and coupled between the integrated circuit and the connector. The compensation module is disposed on the printed circuit board and coupled between the choke module and the connector.

Description

Electronic device with cable interface and manufacturing method thereof

The present disclosure relates to an electronic device having a cable interface, and in particular to an electronic device capable of reducing common mode noise on the cable interface.

For electronic products with communication functions, digital electronic products often include antenna circuits and high-speed connector interfaces, such as universal serial bus (USB), high definition multimedia interface (HDMI) port or display connection port.

Designers of electronic products need to avoid possible radio frequency interference (RFI) and/or electromagnetic interference (EMI) between antenna circuits and high-speed connector interfaces. Modern electronic product designs generally tend to be miniaturized. Therefore, in some cases, the antenna circuits and high-speed connector interfaces in electronic products are forced to be placed at a closer distance, which will make it more difficult to reduce the radio frequency interference or electromagnetic interference between the two.

One embodiment of the present disclosure discloses an electronic device, including a printed circuit board, an integrated circuit, a connector, a choke module, and a compensation module. The integrated circuit is disposed on the printed circuit board. The connector is disposed on the printed circuit board. The choke module is disposed on the printed circuit board and coupled between the integrated circuit and the connector. The compensation module is disposed on the printed circuit board and coupled between the choke module and the connector.

Another aspect of the present disclosure discloses a manufacturing method for manufacturing an electronic device, the manufacturing method comprising: providing a printed circuit board, the printed circuit board comprising a first layout line and a second layout line; attaching an integrated circuit to the printed circuit board, and connecting the integrated circuit to the first layout line and the second layout line; attaching a connector to the printed circuit board, and connecting the connector to the first layout line and the second layout line; attaching a choke module to the printed circuit board between the integrated circuit and the connector, and connecting the choke module to the first layout line and the second layout line; and attaching a compensation module to the printed circuit board between the choke module and the connector, and connecting the compensation module to the first layout line and the second layout line.

It should be noted that the above explanation and subsequent detailed description are illustrative examples of this case and are used to assist in the explanation and understanding of the invention content claimed in this case.

100: Electronic devices

110: Printed circuit board

120: Integrated circuits

140: Choke module

160: Compensation module

160a,160b,160c,160d,160e: Compensation module

180: Connector

200: Cable

210: First end

220: Second end

500: Manufacturing method

W1: First layout line

W2: Second layout line

X-X: hatch line

DIF: Differential signal

DIF+: Positive signal

DIF-: Negative signal

PORT1,PORT2,PORT3,PORT4:Port

P1: Part 1

P2: Part 2

CMN1: First common mode noise

CMN2: Second common mode noise

IOp: positive input output port

IOn: negative input and output terminal

mPORT1, mPORT2: port

PC1: First passive element

PC2: Second passive element

PC3: The third passive element

PC4: Fourth passive element

PC5: The fifth passive element

PC6: Sixth passive element

S510, S520, S530, S540, S550: Steps

In order to make the above and other purposes, features and embodiments of the present disclosure more clearly understandable, the attached drawings are described as follows: FIG. 1 is a schematic diagram of a top view of an electronic device according to some embodiments of the present disclosure; FIG. 2 is a schematic diagram of a cross-section of the electronic device shown in FIG. 1 along the section line X-X according to some embodiments; FIG. 3A to FIG. 3E are schematic diagrams of various compensation modules with different configurations according to some embodiments; FIG. 4 is a schematic diagram of the connection port definition of the compensation module, connector and cable in S parameter measurement; and FIG. 5 is a schematic diagram of a method flow of a manufacturing method according to some embodiments of the present disclosure.

The following disclosure provides many different embodiments or examples for implementing different features of the present disclosure. The components and configurations in the specific examples are used to simplify the present disclosure in the following discussion. Any examples discussed are used for illustrative purposes only and do not limit the scope and meaning of the present disclosure or its examples in any way. Where appropriate, the same reference numerals are used between the drawings and in the corresponding text description to represent the same or similar components.

Please refer to FIG. 1, which shows a schematic top view of an electronic device 100 according to some embodiments of the present disclosure. As shown in FIG. 1, the electronic device 100 includes a printed circuit board 110, an integrated circuit (IC) 120, a choke module 140, a compensation module 160, and a connector 180. The integrated circuit 120, the choke module 140, the compensation module 160, and the connector 180 are respectively disposed on the surface of the printed circuit board 110.

In some embodiments, the connector 180 is used to connect to the first end 210 of the cable 200. The cable 200 is used to carry a pair of differential signals DIF. The connector 180 connected to the cable 200 is used to receive the differential signal DIF from the cable 200, or the connector 180 is used to transmit the differential signal DIF generated by the electronic device 100 to the cable 200.

In one example, connector 180 is a universal serial bus (USB) connector; cable 200 is a USB cable for connecting to the USB connector; and differential signal DIF includes digital data suitable for transmission by the USB cable (such as files, documents, commands, instructions or packets). In another example, connector 180 is a high definition multimedia interface (HDMI) port; cable 200 is an HDMI cable for connecting to the HDMI port; and differential signal DIF includes display information (such as photos, images, frames or streaming data).

As shown in FIG. 1 , the printed circuit board 110 includes a first layout line W1 and a second layout line W2, which are respectively coupled between the integrated circuit 120 and the connector 180. The first layout line W1 and the second layout line W2 are used to transmit the differential signal DIF between the integrated circuit 120 and the connector 180 (and further transmitted to the cable 200 by the connector 180).

In some embodiments, the first layout line W1 is used to transmit the positive signal DIF+ in the differential signal DIF between the integrated circuit 120 and the cable 200. In some embodiments, the second layout line W2 is used to transmit the negative signal DIF- in the differential signal DIF between the integrated circuit 120 and the cable 200.

In some embodiments, the differential signal DIF is an input direction signal transmitted from the cable 200 to the integrated circuit 120 on the electronic device 100. In this case, the integrated circuit 120 is used to receive the differential signal DIF from the cable 200 through the choke module 140, the compensation module 160 and the connector 180.

In some embodiments, the differential signal DIF is an output signal generated by the electronic device 100 and transmitted to the cable 200. In this case, the integrated circuit 120 generates the differential signal DIF and transmits it to the cable 200 through the choke module 140, the compensation module 160 and the connector 180. In some embodiments, the differential signal DIF generated by the integrated circuit 120 can be transmitted to an external device (such as a computer, a screen, a TV, etc., not shown in the figure) through the cable 200, and the external device is connected to the second end 220 of the cable 200.

Please further refer to FIG. 2, which shows a schematic cross-sectional view of the electronic device 100 shown in FIG. 1 along the section line X-X according to some embodiments.

As shown in FIG. 1 and FIG. 2, when the differential signal DIF is transmitted along the cable 200 and the connector 180, the differential signal DIF transmitted through the cable 200 will induce the first common mode noise CMN1 to accumulate on multiple connection pins of the connector 180. This is because the multiple connection pins in the connector 180 connected to the cable 200 may have mismatched impedances and/or inconsistent ground reference levels. In other words, the first common mode noise CMN1 is caused by the differential mode to common mode conversion of the differential signal DIF. This first common mode noise CMN1 may interfere with other components (such as antennas, RF circuits, etc., not shown in the figure) disposed on the printed circuit board and located near the connector 180.

In some practical examples, the first common mode noise CMN1 accumulated between the multiple connection pins of the connector 180 may induce a current. This induced current may flow through the shielding surface of the connector and the cable, which may cause noise wave interference to other components (such as antennas, RF circuits, etc., not shown in the figure), wherein this noise wave cannot be ignored. For example, when the electronic device 100 (such as a mobile device or a laptop) is connected to a USB cable, the noise wave induced by the USB cable may interfere with a wireless mouse connected to the electronic device 100 for communication, or cause the bandwidth throughput of the wireless network on the electronic device 100 to decrease. Similar noise wave problems also occur when the electronic device 100 is connected to other signal cables, such as a Peripheral Component Interconnect Express (PCIE) cable, a Serial Advanced Technology Attachment (SATA) cable, a high definition multimedia interface (HDMI) cable, a Display Port (DP) cable, a Digital Visual Interface (DVI) cable, or a Video Graphics Array (VGA) cable.

In some examples, as shown in FIG. 1 and FIG. 2, there may be an imbalance between the positive input/output terminal IOp and the negative input/output terminal IOn of the integrated circuit 120. In one example, the driving power of the positive signal driving circuit (not shown) of the integrated circuit 120 is different from the driving power of the negative signal driving circuit (not shown) of the integrated circuit 120, and this difference causes an imbalance and further generates the second common mode noise CMN2. In another example, the impedance of the first layout line W1 may be different from the impedance of the second layout line W2. When the integrated circuit 120 generates (or receives) a differential signal DIF, the second common mode noise CMN2 is accumulated on the positive input/output terminal IOp and the negative input/output terminal IOn of the integrated circuit 120.

As shown in FIG. 1 and FIG. 2 , the choke module 140 is disposed on the printed circuit board 110 and coupled between the integrated circuit 120 and the connector 180. More specifically, in some embodiments, the choke module 140 is coupled between the integrated circuit 120 and the compensation module 160. In some embodiments, the choke module 140 is connected to the first layout line W1 and the second layout line W2 and is disposed adjacent to the integrated circuit 120. In some embodiments, the choke module 140 includes a common mode choke coil, which can be used to compensate or reduce the second common mode noise CMN2 accumulated on the positive input/output terminal IOp and the negative input/output terminal IOn of the integrated circuit 120.

In some embodiments, the common mode choke (i.e., the choke module 140) is disposed adjacent to the integrated circuit 120 and can be designed as a noise filter to compensate or reduce the second common mode noise CMN2 on the second portion P2 (including the integrated circuit 120 and the choke module 140) shown in FIG. 1. In some embodiments, the choke module 140 is generally not used to compensate or reduce the first common mode noise CMN1 on the first portion P1 (including the compensation module 160, the connector 180 and the cable 200) shown in FIG. 1, because the distance between the choke module 140 and the connector 180 is relatively far, and the influence of the cable 200 is not considered when designing the choke module 140.

As shown in FIG. 1 and FIG. 2 , the compensation module 160 is disposed on the printed circuit board 110 and coupled between the choke module 140 and the connector 180. In some embodiments, the compensation module 160 is used to compensate or reduce the first common mode noise CMN1 on the connector 180 in the first portion P1. In some embodiments, the compensation module 160 is used to reduce the scattering parameter (also called S parameter) of the differential to common mode conversion (SCD21) in the first portion P1 (including the compensation module 160, the connector 180 and the cable 200). The details of how the compensation module 160 reduces the S parameters in the differential-to-common-mode conversion (SCD21) will be further described in the following paragraphs.

Please refer to FIGS. 3A to 3E, which illustrate schematic diagrams of various compensation modules 160a-160e with different configurations according to some embodiments. Each of the compensation modules 160a-160e can be used to implement the compensation module 160 shown in FIGS. 1 and 2.

As shown in FIG. 3A , the compensation module 160a includes a first passive element PC1 and a second passive element PC2. The first passive element PC1 is coupled in series with the first layout line W1 and is located between the choke module 140 and the connector 180. The second passive element PC2 is coupled in series with the second layout line W2 and is located between the choke module 140 and the connector 180. The first passive element PC1 and the second passive element PC2 each include at least one of a resistor (R), an inductor (L), and a capacitor (C).

As shown in FIG. 3B , the compensation module 160b includes a first passive element PC1 and a second passive element PC2. The first end of the first passive element PC1 is coupled to the first layout line W1 and the coupling position is located between the choke module 140 and the connector 180, and the second end of the first passive element PC1 is grounded. The first end of the second passive element PC2 is coupled to the second layout line W2 and the coupling position is located between the choke module 140 and the connector 180, and the second end of the second passive element PC2 is grounded. The first passive element PC1 and the second passive element PC2 each include at least one of a resistor (R), an inductor (L), and a capacitor (C).

As shown in FIG. 3C , the compensation module 160c includes a first passive element PC1, a second passive element PC2, a third passive element PC3, and a fourth passive element PC4. The first passive element PC1 is coupled in series with the first layout line W1 and is located between the choke module 140 and the connector 180. The second passive element PC2 is coupled in series with the second layout line W2 and is located between the choke module 140 and the connector 180. A first end of the third passive element PC3 is coupled to the first layout line W1 and the coupling position is located between the choke module 140 and the first passive element PC1, and a second end of the third passive element PC3 is grounded. A first end of the fourth passive element PC4 is coupled to the second layout line W2 and the coupling position is located between the choke module 140 and the second passive element PC2, and a second end of the fourth passive element PC4 is grounded. The first passive element PC1, the second passive element PC2, the third passive element PC3 and the fourth passive element PC4 each include at least one of a resistor (R), an inductor (L) and a capacitor (C).

As shown in FIG. 3D, the compensation module 160d includes a first passive component PC1, a second passive component PC2, a third passive component PC3, and a fourth passive component PC4. Compared with FIG. 3C, in the embodiment shown in FIG. 3D, the first end of the third passive component PC3 is coupled to the first layout line W1 and the coupling position is located between the first passive component PC1 and the connector 180, and the first end of the fourth passive component PC4 is coupled to the second layout line W2 and the coupling position is located between the second passive component PC2 and the connector 180. Other structural features of the compensation module 160d shown in FIG. 3D are similar to those of the compensation module 160c shown in FIG. 3C.

As shown in FIG. 3E , the compensation module 160e includes a first passive component PC1, a second passive component PC2, a third passive component PC3, a fourth passive component PC4, a fifth passive component PC5, and a sixth passive component PC6. Compared with FIG. 3C , the embodiment shown in FIG. 3E adds a fifth passive component PC5 and a sixth passive component PC6. The first end of the fifth passive component PC5 is coupled to the first layout line W1 and the coupling position is located between the first passive component PC1 and the connector 180, and the first end of the sixth passive component PC6 is coupled to the second layout line W2 and the coupling position is located between the second passive component PC2 and the connector 180. The third passive component PC3 and the fifth passive component PC5 are coupled to different ends of the first passive component PC1. The fourth passive component PC4 and the sixth passive component PC6 are coupled to different ends of the second passive component PC2. Other structural features of the compensation module 160e shown in FIG. 3E are similar to those of the compensation module 160c shown in FIG. 3C.

It should be noted that one of the compensation modules 160a-160e shown in FIGS. 3A to 3E can be selected as the compensation module 160 in the embodiments of FIGS. 1 and 2. The selection of various configurations of the compensation modules 160a-160e and the setting of the resistance, inductance or capacitance values of the passive components therein are determined according to the results of the S parameter measurement of the first part P1 in FIG. 2.

Please also refer to Figure 4, which shows a schematic diagram of the compensation module 160, connector 180, and cable 200 for port definition in S parameter measurement.

As shown in Figures 1 and 4, port PORT1 is defined on cable 200 and corresponds to the positive signal DIF+ and the first layout line W1, and another port PORT3 is defined on cable 200 and corresponds to the negative signal DIF- and the second layout line W2. Port PORT2 is defined on compensation module 160 and coupled to the first layout line W1 (towards choke module 140) corresponding to the positive signal DIF+. Port PORT4 is defined on compensation module 160 and coupled to the second layout line W2 (towards choke module 140) corresponding to the negative signal DIF-.

The above four ports PORT1~PORT4 can be connected to a network analyzer to perform scattering parameter (S parameter) analysis under the four-port single-ended model. The result of this S parameter analysis will generate a single-ended S parameter matrix as shown below:

In this single-ended S parameter matrix, S parameter S _XY represents the response level measured at port PORTY when a trigger signal is input at port PORTX. For example, S parameter S ₁₂ represents the response at port PORT1 when a trigger signal is input at port PORT2; S parameter S ₂₃ represents the response at port PORT2 when a trigger signal is input at port PORT3; S parameter S ₁₁ represents the response at port PORT1 when a trigger signal is input at port PORT1. If a pair of transmission lines is driven by two signals in a single-ended manner, the single-ended S-parameter matrix is usually used to analyze the pair of transmission lines to obtain the crosstalk between the two transmission lines, or to analyze the reflected power and incident power of the differential signal passing through the pair of transmission lines.

In some examples, as shown in FIG. 4 , two ports PORT1 and PORT3 may be defined together as a logical port mPORT1, and two ports PORT2 and PORT4 may be defined together as a logical port mPORT2. Then the single-ended S parameter matrix may be converted into a mixed-mode S parameter matrix as shown below:

In the mixed mode S parameter matrix, the S parameter S _CD21 represents the common mode response on the port mPORT2 when the differential mode excitation signal is input from the port mPORT1. In other words, the S parameter S _CD21 represents the differential mode to common mode conversion when the differential signal DIF is transmitted through the cable 200 to the port mPORT2 (i.e., the ports PORT2 and PORT4 on the compensation module).

In some embodiments, the S parameter S _CD21 in the mixed mode S parameter matrix can be obtained by calculation based on the known S parameters in the single-ended S parameter matrix. The calculation method is as follows: S _{CD 21} =( S ₂₁ + S ₄₁ - S ₂₃ - S ₄₃ )/2

Similarly, other S parameters in the mixed-mode S parameter matrix can also be calculated based on the measured S parameters in the single-ended S parameter matrix.

In some embodiments, after the S parameter analysis based on the four connection ports PORT1-PORT4 is completed, the S parameter S _CD21 can be monitored and measured. The compensation module 160 is adjusted (by selecting different configurations in FIG. 3A to FIG. 3E, or changing the resistance, inductance or capacitance of the passive element) to reduce or minimize the value of the S parameter S _CD21 in the mixed mode S parameter matrix.

After selecting the optimal configuration of the compensation module 160, the compensation module 160 can reduce or minimize the S parameter _SCD21 measured in the entire first portion P1 (including the compensation module 160, the connector 180 and the cable 200). In this example, the compensation module 160 can be used to reduce the first common mode noise CMN1 on the connector 180.

Please refer to FIG. 5, which is a schematic diagram of a method flow of a manufacturing method 500 according to some embodiments of the present disclosure. The manufacturing method 500 is used to produce the electronic device 100 in the embodiments shown in FIG. 1 and FIG. 2. As shown in FIG. 1, FIG. 2 and FIG. 5, step S510 is performed to provide a printed circuit board 110, and the printed circuit board 110 includes a first layout line W1 and a second layout line W2. Step S520 is performed by a bonding machine and/or a welding machine to attach an integrated circuit 120 to the printed circuit board 110, and connect the integrated circuit 120 to the first layout line W1 and the second layout line W2. The bonding machine and/or welding machine executes step S530 to attach the connector 180 to the printed circuit board 110, and connects the connector 180 to the first layout line W1 and the second layout line W2. The bonding machine and/or welding machine executes step S540 to attach the choke module 140 to the printed circuit board 110 and between the integrated circuit 120 and the connector 180, and connects the choke module 140 to the first layout line W1 and the second layout line W2.

The step S550 is performed by a bonding machine and/or a welding machine to attach the compensation module 160 to the printed circuit board 110 and between the choke module 140 and the connector 180, and connect the compensation module 160 to the first layout line W1 and the second layout line W2. The compensation module 160 provided in step S550 can be one of the compensation modules 160a-160e discussed in the embodiments of Figures 3A to 3E. The configuration of the compensation module 160 and the resistance, inductance or capacitance values of the passive components in the compensation module 160 can be determined by the S parameter analysis discussed in the above embodiments, which will not be elaborated here.

It should be noted that the order of steps S520 to S550 is not limited to the order shown in FIG. 5. In some other embodiments, steps S520 to S550 may also be performed in a different order than the embodiment shown in FIG. 5.

Although the above embodiments have disclosed the relevant specific contents of this disclosure document, other implementation methods are also possible. The meaning and scope of the claims of this disclosure document are not limited to the text of the above embodiments.

A person skilled in the art may make various substitutions and improvements to the above-mentioned framework without departing from the principles and spirit of this disclosure document. Furthermore, the scope of protection of this disclosure document is determined by the scope of the attached patent application and covers various modifications and changes of the practices and frameworks referred to in the scope of the patent application.

100: electronic device 110: printed circuit board 120: integrated circuit 140: choke module 160: compensation module 180: connector 200: cable 210: first end 220: second end W1: first layout line W2: second layout line X-X: cross section line DIF: differential signal DIF+: positive signal DIF-: negative signal PORT1, PORT2, PORT3, PORT4: connection port IOp: positive input/output port IOn: negative input/output port

Claims (16)

An electronic device includes: a printed circuit board; an integrated circuit disposed on the printed circuit board; a connector disposed on the printed circuit board, the connector being connected to a cable, the cable being used to carry a pair of differential signals; a choke module disposed on the printed circuit board and coupled between the integrated circuit and the connector; and a compensation module disposed on the printed circuit board and coupled between the choke module and the connector, the compensation module being used to compensate or reduce a first common mode noise on the connector, the first common mode noise being caused by a differential-to-common mode conversion of the pair of differential signals. An electronic device as described in claim 1, wherein the integrated circuit is used to generate the pair of differential signals, and the pair of differential signals are transmitted from the integrated circuit through the choke module, the compensation module to the cable. An electronic device as described in claim 1, wherein the integrated circuit is used to receive the pair of differential signals through the choke module, the compensation module and from the cable. An electronic device as described in claim 1, wherein the choke module is used to compensate or reduce a second common mode noise caused by an imbalance between a positive input/output terminal and a negative input/output terminal of the integrated circuit. An electronic device as described in claim 1, wherein the printed circuit board comprises: a first layout line for transmitting a positive signal of the pair of differential signals between the integrated circuit and the cable; and a second layout line for transmitting a negative signal of the pair of differential signals between the integrated circuit and the cable. An electronic device as described in claim 5, wherein the compensation module comprises: a first passive element coupled in series with the first layout circuit; and a second passive element coupled in series with the second layout circuit. An electronic device as described in claim 5, wherein the compensation module comprises: a first passive element, a first end of the first passive element is coupled to the first layout line, and a second end of the first passive element is grounded; and a second passive element, a first end of the second passive element is coupled to the second layout line, and a second end of the second passive element is grounded. An electronic device as described in claim 5, wherein the compensation module comprises: a first passive element coupled in series with the first layout line; a second passive element coupled in series with the second layout line; a third passive element, a first end of the third passive element coupled to the first layout line, and a second end of the third passive element grounded; and a fourth passive element, a first end of the fourth passive element coupled to the second layout line, and a second end of the fourth passive element grounded. The electronic device as described in claim 5, wherein the compensation module comprises: a first passive element coupled in series with the first layout line; a second passive element coupled in series with the second layout line; a third passive element, a first end of the third passive element coupled to the first layout line, and a second end of the third passive element grounded; a fourth passive element, a first end of the fourth passive element coupled to the second layout line, and a second end of the fourth passive element grounded; A fifth passive element, a first end of the fifth passive element is coupled to the first layout line, a second end of the fifth passive element is grounded, wherein the third passive element and the fifth passive element are coupled to different ends of the first passive element; and a sixth passive element, a first end of the sixth passive element is coupled to the second layout line, a second end of the sixth passive element is grounded, wherein the fourth passive element and the sixth passive element are coupled to different ends of the second passive element. A manufacturing method for manufacturing an electronic device, the manufacturing method comprising: providing a printed circuit board, the printed circuit board comprising a first layout line and a second layout line; attaching an integrated circuit to the printed circuit board, and connecting the integrated circuit to the first layout line and the second layout line; attaching a connector to the printed circuit board, and connecting the connector to the first layout line and the second layout line, wherein the connector is used to connect to a cable, and the cable is used to carry a pair of differential signals; attaching A choke module is connected to the printed circuit board between the integrated circuit and the connector, and the choke module is connected to the first layout line and the second layout line; and a compensation module is attached to the printed circuit board between the choke module and the connector, and the compensation module is connected to the first layout line and the second layout line, wherein the compensation module is used to compensate or reduce a first common mode noise on the connector, the first common mode noise is caused by a differential mode to common mode conversion of the pair of differential signals. The manufacturing method as described in claim 10, wherein the integrated circuit is used to generate the pair of differential signals, and the pair of differential signals are transmitted from the integrated circuit through the choke module, the compensation module to the cable. A manufacturing method as described in claim 10, wherein the integrated circuit is used to receive the pair of differential signals through the choke module, the compensation module and from the cable. A manufacturing method as described in claim 10, wherein the choke module is used to compensate or reduce a second common mode noise, and the second common mode noise is caused by an imbalance between a positive input/output terminal and a negative input/output terminal of the integrated circuit. The manufacturing method as described in claim 10, wherein the first layout line is used to transmit a positive signal of the pair of differential signals between the integrated circuit and the cable, and the second layout line is used to transmit a negative signal of the pair of differential signals between the integrated circuit and the cable. A manufacturing method as described in claim 10, wherein the compensation module comprises: at least one first passive element coupled to the first layout circuit; and at least one second passive element coupled to the second layout circuit. The manufacturing method as described in claim 15, wherein the at least one first passive element and the at least one second passive element include a resistor, an inductor or a capacitor.

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