TWI846161B - System and device for adjusting chuck deformation - Google Patents

Abstract

The present application relates to a system for adjusting chuck deformation. In one embodiment of the present application, the system for adjusting chuck deformation includes: a chuck having an adsorption surface for adsorbing a wafer; a chuck deformation adjustment device located below the adsorption surface and having a plurality of deformable units, each of which generates a deformation corresponding to the magnitude of the controlled voltage in the plane direction of the adsorption surface based on a controlled voltage; and a processor, which determines the deformation amount of the plurality of deformable units based on wafer warp data, and inputs a controlled voltage corresponding to the degree of wafer warp to the plurality of deformable units, so that the adsorption surface is deformed.

Description

System and device for adjusting chuck deformation

This application relates generally to the field of semiconductor processing equipment and, more particularly, to a system and apparatus for adjusting chuck deformation.

Wafer direct bonding technology has been applied in the fields of integrated circuit manufacturing, micro-electromechanical system (MEMS) packaging and multi-functional chip integration. Wafer direct bonding is a technology that bonds two homogeneous or heterogeneous wafers with clean surfaces and atomically flat surfaces into one under certain conditions.

After the wafer has gone through multiple processes, the surface will be warped to varying degrees. Direct bonding will cause the wafer to deviate after bonding. The above deviation can be compensated by deforming the lower chuck to bring the warp of the upper and lower wafers closer. Currently, chuck deformation is achieved by controlling the internal pressure of the airbag under the chuck, but this airbag control method can only cause the center area of the wafer to warp and deform, the control accuracy is also low, and the airbag is prone to leaking.

This application provides a system and device for adjusting the deformation of a chuck, which realizes the deformation of the chuck by means of a bump-shaped piezoelectric ceramic embedded in the chuck. The deformation and deformation time of any bump can be accurately controlled, and the system is adapted to various warp deformations of the wafer with high control accuracy.

In one embodiment, the present application provides a system for adjusting chuck deformation, comprising: a chuck having an adsorption surface for adsorbing a wafer; a chuck deformation adjustment device, which is located below the adsorption surface and has a plurality of deformable units, each of which generates a deformation corresponding to the magnitude of the controlled voltage in the planar direction of the adsorption surface based on a controlled voltage; and a processor, which determines the deformation amount of the plurality of deformable units based on wafer warp data, so that a controlled voltage corresponding to the degree of wafer warp is input to the plurality of deformable units to cause the adsorption surface to deform.

According to an embodiment of the present application, the plurality of deformable units include piezoelectric ceramics.

According to an embodiment of the present application, the piezoelectric ceramic comprises a lead-free barium carbonate-based material.

According to an embodiment of the present application, each of the deformable units is in the shape of a convex point.

According to an embodiment of the present application, the plurality of deformable units are arranged in an array.

According to an embodiment of the present application, the chuck comprises silicon carbide.

According to an embodiment of the present application, the system further includes: a matching network, which is connected to the multiple deformable units and outputs the controlled voltage to the multiple deformable units based on the deformation amount determined by the processor.

According to an embodiment of the present application, the chuck deformation adjustment device further includes a substrate, wherein the plurality of deformable units are located on the substrate.

According to an embodiment of the present application, the matching network is located in the substrate.

In another embodiment, the present application also provides a device for adjusting the deformation of a chuck, comprising: a substrate; and a plurality of deformable units located on the substrate, each of the deformable units generating a deformation corresponding to the magnitude of the controlled voltage in the planar direction of the substrate based on the controlled voltage, thereby causing the chuck to generate a corresponding deformation.

The details of one or more embodiments of the present application are set forth in the following drawings and description. Other features, objects and advantages will be apparent from the description and drawings and the scope of the application.

In order to better understand the spirit of the present invention, some embodiments of the present invention are further described below.

The terms "in one embodiment" or "according to an embodiment" used in this specification do not necessarily refer to the same specific embodiment, and the terms "in other (some/certain) embodiments" or "according to other (some/certain) embodiments" used in this specification do not necessarily refer to different specific embodiments. The purpose is, for example, that the claimed subject matter includes a combination of all or part of the exemplary specific embodiments. The meaning of "upper" and "lower" referred to herein is not limited to the relationship directly presented in the drawings, and should include descriptions with a clear corresponding relationship, such as "left" and "right", or the opposite of "upper" and "lower". The term "connected" as used herein should be understood to cover "directly connected" and "connected via one or more intermediate components". The names of various components used in this manual are for illustrative purposes only and are not limiting. Different manufacturers may use different names to refer to components with the same function.

Various implementations of the present invention are discussed in detail below. Although specific implementations are discussed, it should be understood that these implementations are for illustrative purposes only. Those skilled in the art will recognize that other components and configurations may be used without departing from the spirit and scope of the present invention.

FIG. 1 is a schematic diagram of a system 100 for adjusting chuck deformation according to some embodiments of the present application.

The function of the chuck deformation adjustment system 100 is to simulate the warp shape of the wafer so that the chuck that adsorbs the wafer generates a corresponding deformation on its adsorption surface, so that the warp of the wafer is compensated, thereby improving the accuracy of wafer bonding and avoiding deviations that may be caused by direct wafer bonding.

Referring to FIG. 1 , the system 100 for adjusting chuck deformation includes a processor 12, a chuck deformation adjustment device 14, and a matching network 16. The processor 12 determines the degree of chuck deformation based on wafer warp data 105. According to some embodiments of the present application, the wafer warp data 105 is provided by a supplier and can present a warp amount w(x, y) of the wafer at a certain coordinate point (x, y). The processor 12 determines the chuck deformation amount d(x, y) corresponding to the warp amount w(x, y) based on the warp amount w(x, y) in the wafer warp data 105.

The processor 12 provides the information of the chuck deformation d(x, y) to the matching network 16. The matching network 16 is connected to the power supply 18, and based on the information of the chuck deformation d(x, y), the matching network 16 provides a controlled voltage V(x, y) corresponding to the chuck deformation d(x, y) to the chuck deformation adjustment device 14 under the supply voltage Vs of the power supply 18, so that the chuck generates a deformation corresponding to the magnitude of the controlled voltage V(x, y). According to some embodiments of the present application, the matching network 16 includes a resistor, inductor or capacitor (RLC) network. The processor 12 has related hardware and computer programs to support the reading of the wafer warp data 105 and the calculation of the chuck deformation d(x, y).

FIG. 2 is a schematic diagram of the chuck deformation adjustment device 14 in FIG. 1 .

Please refer to Figure 2, the chuck deformation adjustment device 14 includes a substrate 147 and a plurality of deformable units 140 located on the substrate 147. The chuck deformation adjustment device 14 is disposed in the chuck 25. The chuck 25 has an adsorption surface 258 for adsorbing the wafer 28 on the upper surface 25a of the chuck 25. The plurality of deformable units 140 of the chuck deformation adjustment device 14 are located below the adsorption surface 258 of the chuck 25, so that the plane direction n of the substrate 147 is parallel to the plane direction n of the adsorption surface 258. According to some embodiments of the present application, the chuck 25 is selected from a material having the characteristics of low density, high elasticity, low expansion coefficient, fast thermal conductivity, wear resistance, high hardness and easy handling. Therefore, the adsorption surface 258 of the chuck 25 also has the above-mentioned characteristics. According to one embodiment of the present application, the material of the chuck 25 is silicon carbide. In addition, the diameter of the chuck 25 is about 360 mm and the thickness is about 23 mm.

The multiple deformable units 140 of the chuck deformation adjustment device 14 can be distributed in a circular shape or a spiral shape. According to one embodiment of the present application, the multiple deformable units 140 of the chuck deformation adjustment device 14 are arranged in an array, as shown in FIG3A. The array arrangement is conducive to the coordinateization of the deformable units 140, so that the deformable units 140 of the corresponding coordinate points are addressed by the controlled voltage V(x, y) based on the warp amount w(x, y) of the coordinate point (x, y) of the wafer. According to another embodiment of the present application, the multiple deformable units 140 of the chuck deformation adjustment device 14 are arranged irregularly, as shown in FIG3B. According to one embodiment of the present application, each deformable unit 140 of the chuck deformation adjustment device 14 is in the shape of a convex point. According to one embodiment of the present application, the cross section of each deformable unit 140 can be rectangular, circular or triangular. According to one embodiment of the present application, the material of each deformable unit 140 is piezoelectric ceramic, such as a lead-free barium carbonate-based material.

Please also refer to FIG. 1 , the multiple deformable units 140 of the chuck deformation adjustment device 14 are connected to the matching network 16. The matching network 16 outputs the controlled voltage V(x, y) to the multiple deformable units 140 based on the deformation amount determined by the processor 12. As shown in FIG. 4 , each deformable unit 140 generates a deformation corresponding to the magnitude of the controlled voltage V(x, y) in the plane direction n of the substrate 147 based on the controlled voltage V(x, y) from the matching network 16, so that the adsorption surface 258 of the chuck 25 generates a corresponding deformation in the plane direction n of the adsorption surface 258.

According to an embodiment of the present application, the substrate 147 of the chuck deformation adjustment device 14 is a semiconductor substrate, and the components of the matching network 16 are prepared by a semiconductor process so that the matching network 16 is located in the substrate 147.

Compared to existing systems or devices, each deformable unit of the system and device for adjusting the deformation of the chuck in this application can be independently controlled. When the number of deformable units is sufficient, the deformation amount and deformation time of any deformable unit can be accurately controlled, thereby realizing the precise deformation of the chuck and the subsequent precise bonding of the wafer. The system and device for adjusting the deformation of the chuck in this application are suitable for various warp deformations of the wafer and have high control accuracy.

The description herein is provided to enable one skilled in the art to make or use the invention. Various modifications to the invention will be readily apparent to one skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the invention. Therefore, the invention is not limited to the examples and designs described herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

12: Processor 14: Chuck deformation adjustment device 16: Matching network 18: Power supply 25: Chuck 25a: Upper surface 28: Wafer 100: Chuck deformation adjustment system 105: Wafer warp data 140: Deformable unit 147: Substrate 258: Adsorption surface

The public contents in this manual refer to and include the following figures:

FIG. 1 is a schematic diagram of a system for adjusting chuck deformation according to some embodiments of the present application;

FIG2 is a schematic diagram of the chuck deformation adjustment device in FIG1;

3A and 3B are schematic diagrams showing the arrangement of deformable units according to some embodiments of the present application;

FIG. 4 is a schematic diagram showing the operation of the chuck deformation adjustment device in FIG. 1 .

As is customary, the various features illustrated in the drawings may not be drawn to scale. Therefore, the sizes of the various features may be arbitrarily enlarged or reduced for clarity. The shapes of the components illustrated in the drawings are exemplary shapes only and do not limit the actual shapes of the components. In addition, the implementations illustrated in the drawings may be simplified for clarity. Therefore, the drawings may not illustrate all components of a given device or apparatus. Finally, the same reference numerals may be used throughout the specification and drawings to represent the same features.

12: Processor

14: Chuck deformation adjustment device

16: Matching network

18: Power supply

100: System for adjusting chuck deformation

105: Wafer warp data

Claims (13)

A system for adjusting chuck deformation includes: a chuck having an adsorption surface for adsorbing a wafer; a chuck deformation adjustment device located below the adsorption surface and having a plurality of deformable units, each of which generates a deformation corresponding to the magnitude of the controlled voltage in the plane direction of the adsorption surface based on a controlled voltage; a processor, which determines the deformation amount of the plurality of deformable units based on wafer warp data, and inputs a controlled voltage corresponding to the degree of wafer warp to the plurality of deformable units to cause the adsorption surface to deform; and a matching network, which is connected to the plurality of deformable units and outputs the controlled voltage to the plurality of deformable units based on the deformation amount determined by the processor. A system as claimed in claim 1, wherein the plurality of deformable units comprise piezoelectric ceramics. A system as claimed in claim 2, wherein the piezoelectric ceramic comprises a lead-free barium carbonate-based material. A system as claimed in claim 1, wherein each of the deformable units is in the shape of a convex point. A system as claimed in claim 1, wherein the plurality of deformable units are arranged in an array. A system as claimed in claim 1, wherein the chuck comprises silicon carbide. A system as claimed in claim 1, wherein the chuck deformation adjustment device further comprises a substrate, wherein the plurality of deformable units are located on the substrate. A system as claimed in claim 7, wherein the matching network is located within the substrate. A device for adjusting the deformation of a chuck comprises: a substrate; a plurality of deformable units located on the substrate, each of which generates a deformation corresponding to the magnitude of the controlled voltage in the plane direction of the substrate based on a controlled voltage, thereby causing the chuck to generate a corresponding deformation; and a matching network, which is located in the substrate and is used to input the controlled voltage to the plurality of deformable units based on the degree of wafer warping. A device as claimed in claim 9, wherein the plurality of deformable units comprise piezoelectric ceramics. A device as claimed in claim 10, wherein the piezoelectric ceramic comprises a lead-free barium carbonate-based material. A device as claimed in claim 9, wherein each of the deformable units is in the shape of a convex point. A device as claimed in claim 9, wherein the plurality of deformable units are arranged in an array.