TWI844545B - Device for producing molten silicon - Google Patents
Device for producing molten silicon Download PDFInfo
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- TWI844545B TWI844545B TW108119384A TW108119384A TWI844545B TW I844545 B TWI844545 B TW I844545B TW 108119384 A TW108119384 A TW 108119384A TW 108119384 A TW108119384 A TW 108119384A TW I844545 B TWI844545 B TW I844545B
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- molten silicon
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- 239000010703 silicon Substances 0.000 title claims abstract description 98
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 97
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 97
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 54
- 239000000843 powder Substances 0.000 claims abstract description 25
- 238000010438 heat treatment Methods 0.000 claims abstract description 23
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 16
- 239000002245 particle Substances 0.000 claims description 24
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 23
- 235000012239 silicon dioxide Nutrition 0.000 claims description 12
- 238000007711 solidification Methods 0.000 claims description 7
- 230000008023 solidification Effects 0.000 claims description 7
- 239000011856 silicon-based particle Substances 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- 238000002844 melting Methods 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- 229910002804 graphite Inorganic materials 0.000 description 7
- 239000010439 graphite Substances 0.000 description 7
- 238000001816 cooling Methods 0.000 description 6
- 239000008187 granular material Substances 0.000 description 6
- 238000002955 isolation Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- 238000009825 accumulation Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 230000014509 gene expression Effects 0.000 description 3
- 230000006698 induction Effects 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 239000002470 thermal conductor Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000004320 controlled atmosphere Methods 0.000 description 2
- 239000000110 cooling liquid Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 238000003921 particle size analysis Methods 0.000 description 2
- 238000000746 purification Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 239000011819 refractory material Substances 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B14/00—Crucible or pot furnaces
- F27B14/08—Details peculiar to crucible or pot furnaces
- F27B14/10—Crucibles
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/02—Silicon
- C01B33/021—Preparation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B3/00—Hearth-type furnaces, e.g. of reverberatory type; Tank furnaces
- F27B3/10—Details, accessories, or equipment peculiar to hearth-type furnaces
- F27B3/12—Working chambers or casings; Supports therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D3/00—Charging; Discharging; Manipulation of charge
- F27D3/14—Charging or discharging liquid or molten material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D3/00—Charging; Discharging; Manipulation of charge
- F27D3/15—Tapping equipment; Equipment for removing or retaining slag
- F27D3/1509—Tapping equipment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Silicon Compounds (AREA)
Abstract
Description
本發明關於用於產生熔融矽的裝置及包括此裝置的用於純化矽的設施,特別是用於藉由光電效應而產生電能產生電池。The invention relates to a device for producing molten silicon and a facility for purifying silicon comprising the device, in particular for producing an electric energy generating cell by means of a photovoltaic effect.
目前,被用來供光電應用之用的大多數矽藉由類似於用於產生用來供電子應用之用的矽之處理的化學處理而被產生。這些化學方法被充分瞭解,但需要非常大量的投資而且導致增加的產生成本。光電能量的成本上的壓力已經導致搜尋化學方式的替代純化方法。這樣的方法包括從矽顆粒粉末產生熔融矽,該矽顆粒粉末能對應在微電子或光電工業中來自矽塊的割鋸(sawmilling)、來自用於研磨矽的方法或來自用於藉由流體床而產生多晶矽的方法的廢料,該熔融矽能接著被重結晶而形成矽塊。At present, most of the silicon used for photovoltaic applications is produced by chemical processes similar to those used to produce silicon for electronic applications. These chemical methods are well understood, but require very large investments and lead to increased production costs. The pressure on the cost of photovoltaic energy has led to a search for alternative purification methods to the chemical ones. Such methods consist in producing molten silicon from a silicon particle powder that can correspond to waste from sawmilling of silicon blocks in the microelectronics or photovoltaic industry, from processes for grinding silicon or from processes for producing polycrystalline silicon by means of fluid beds, which molten silicon can then be recrystallized to form silicon blocks.
然而,在傳統熔融裝置中製作這樣的矽顆粒粉末熔融物(melt)是難的,該傳統熔融裝置包括坩堝,其中該粉末能被引入、熔融然後重結晶。的確,矽顆粒能包含高氧含量,介於以質量計的1%及5%之間,這是因為二氧化矽層自然形成於顆粒的表面上。的確,在矽的熔融溫度,二氧化矽不熔融,傾向於變成更稠糊而且形成海綿形式結構。此外,有氧化矽顆粒粉末的坩堝的填充率是低的,使得熔融矽的重結晶之後所產生的鑄錠是易碎的。However, it is difficult to make such a melt of silicon granule powder in a conventional melting device comprising a crucible in which the powder can be introduced, melted and then recrystallized. Indeed, silicon granules can contain a high oxygen content, between 1% and 5% by mass, due to the silica layer that naturally forms on the surface of the granules. Indeed, at the melting temperature of silicon, silica does not melt, tending to become a thicker paste and forming a sponge-like structure. Moreover, the filling rate of the crucible with silica granule powder is low, making the ingot produced after the recrystallization of the molten silicon brittle.
因此,實施例的目標是提供用以從氧化矽顆粒粉末產生熔融矽的裝置,其克服上述裝置的缺點的至少其中一些。It is therefore an object of embodiments to provide an apparatus for producing molten silicon from silicon oxide particle powder that overcomes at least some of the disadvantages of the above-mentioned apparatuses.
根據實施例的另一目標,用於產生熔融矽的裝置讓從氧化矽顆粒粉末的矽分離二氧化矽是可能的。According to another object of the embodiment, the apparatus for producing molten silicon makes it possible to separate silicon dioxide from silicon of silicon oxide particle powder.
根據實施例的另一目標,用於產生熔融矽的裝置讓連續或半連續產生熔融矽是可能的。According to another object of the embodiment, the apparatus for producing molten silicon makes it possible to produce molten silicon continuously or semi-continuously.
根據另一目標,用於產生熔融矽的裝置有生產力,其適用於工業規模操作。According to another object, an apparatus for producing molten silicon is productive and suitable for operation on an industrial scale.
因此,實施例提供用於產生熔融矽的裝置,包括外殼並在該外殼中包括: 坩堝,被用來接收氧化矽顆粒粉末,該坩堝包括內容積以及排空通道,該內容積被用來包含熔融狀態中的矽及二氧化矽,該排空通道用於內容積外的熔融狀態中的矽,該坩堝包括連接內容積到坩堝之至少兩個孔洞或至少一狹槽,每一個孔洞的直段(straight section)有大於或等於1mm及10mm之間的值的最大尺寸,狹槽的直段有大於或等於1mm與10mm之間的值的最大尺寸;及 加熱系統,至少部分圍繞該坩堝。Thus, embodiments provide an apparatus for producing molten silicon, comprising a housing and comprising in the housing: a crucible for receiving silicon oxide granular powder, the crucible comprising a content volume for containing silicon and silicon dioxide in a molten state and an exhaust channel for molten silicon outside the content volume, the crucible comprising at least two holes or at least one slot connecting the content volume to the crucible, the straight section of each hole having a maximum dimension greater than or equal to a value between 1 mm and 10 mm, the straight section of the slot having a maximum dimension greater than or equal to a value between 1 mm and 10 mm; and a heating system at least partially surrounding the crucible.
根據實施例,孔洞的其中之一是位於另一孔洞之上。According to an embodiment, one of the holes is located above the other hole.
根據實施例,每一孔洞或狹槽之直段的最小尺寸從0.5mm到5mm變化。According to an embodiment, the minimum dimension of the straight section of each hole or slot varies from 0.5 mm to 5 mm.
根據實施例,排空通道的直段的最小尺寸及最大尺寸從1mm到50mm變化。According to an embodiment, the minimum and maximum dimensions of the straight section of the exhaust channel vary from 1 mm to 50 mm.
根據實施例,坩堝包括底部與側壁及在側壁上開孔的孔洞或狹槽。According to an embodiment, the crucible includes a bottom and a side wall and holes or slots opened in the side wall.
根據實施例,最靠近底部的孔之間或狹槽與底部之間的最小距離是大於坩堝之高度的10%。According to an embodiment, the minimum distance between the holes closest to the bottom or between the slot and the bottom is greater than 10% of the height of the crucible.
實施例提供設施,包括: 用於產生如上所述的熔融矽之裝置; 用於對坩堝提供裝置的系統,該裝置用於產生氧化矽顆粒粉末中的熔融矽;以及 用於固化藉由裝置所提供熔融矽之系統,該裝置用於產生矽塊中的熔融矽。Embodiments provide facilities including: An apparatus for producing molten silicon as described above; A system for providing the apparatus to a crucible, the apparatus being used to produce molten silicon in a silicon oxide particle powder; and A system for solidifying the molten silicon provided by the apparatus, the apparatus being used to produce molten silicon in a silicon block.
根據實施例,固化系統包括額外坩堝,該額外坩堝接收熔融矽,該熔融矽藉由用於產生熔融矽並加熱額外坩堝的元件的裝置而提供。According to an embodiment, the solidification system includes an additional crucible that receives molten silicon provided by means of a device for generating molten silicon and heating elements of the additional crucible.
相同元件已經被不同圖式中的相同參考指定。為了清楚的理由,只有用於產生熔融矽之裝置的用於所述實施例的瞭解所需之元件已經在不同圖式中被表示且被詳述。在下面描述中,修飾語“較低”、“較高”、“朝向頂部”及、“朝向底部”相對於軸D被使用,軸D被視為垂直。然而,清楚的是軸D能針對垂直被稍微傾斜(例如小於或等於20°的角度)。進一步地,措辭“實質地”、“大概”、“近似地”及“大約”意思是“幾乎10%”,較佳是“幾乎5%”。此外,當措辭“實質地”、“大概”、“近似地”及“大約”被用於角度時,它們意思是“幾乎10°”,較佳是“幾乎5°”。The same elements have been designated by the same references in the different figures. For reasons of clarity, only the elements of the apparatus for producing molten silicon that are necessary for an understanding of the described embodiments have been represented and described in detail in the different figures. In the following description, the modifiers "lower", "higher", "towards the top" and "towards the bottom" are used relative to the axis D, which is considered to be vertical. However, it is clear that the axis D can be slightly tilted with respect to the vertical (for example, an angle less than or equal to 20°). Further, the expressions "substantially", "approximately", "approximately" and "about" mean "almost 10%", preferably "almost 5%". In addition, when the expressions "substantially", "approximately", "approximately" and "approximately" are used for angles, they mean "almost 10°", preferably "almost 5°".
在本發明之中,至少一垂直狹槽及/或至少兩孔洞(一個位於另一個之上)至少有允許熔融矽通過排空通道的連續通行之功能。特別地,如果二氧化矽阻礙排空通道的通行(例如在靠近坩堝的底部之坩堝的較低部之中),則較高孔洞或狹槽之較高部允許維護排空通道的未受阻礙通行。In the present invention, at least one vertical slot and/or at least two holes (one above the other) have at least the function of allowing the continuous passage of molten silicon through the drain channel. In particular, if silicon dioxide blocks the passage of the drain channel (for example in the lower part of the crucible near the bottom of the crucible), the higher holes or the higher part of the slot allow maintaining unobstructed passage of the drain channel.
本發明因此未限於沿垂直D軸精確地對準之狹槽或孔洞。垂直狹槽被定義為主要垂直地定向之狹槽。然而,其可針對垂直D軸被傾斜小於30°的角度,較佳是小於20°,較佳是小於10°。The present invention is therefore not limited to slots or holes that are precisely aligned along the vertical D axis. A vertical slot is defined as a slot that is primarily vertically oriented. However, it may be tilted at an angle of less than 30°, preferably less than 20°, more preferably less than 10° with respect to the vertical D axis.
一個位於另一個之上的孔洞不需要沿著垂直D軸對準。它們能例如以交替的形式被安置。The holes located one above the other do not need to be aligned along the vertical D axis. They can, for example, be arranged in an alternating manner.
像是在本申請範圍中使用的術語“顆粒”必須在廣義中被瞭解且不僅對應於有點球形的小顆粒,而且還對應於有菱角的顆粒、扁平顆粒、片狀形式的顆粒、纖維形式顆粒、或纖維狀顆粒、等等。可以瞭解,本申請的範圍中顆粒的“大小”意思是顆粒的最小橫截尺寸。例如,在纖維形式的顆粒的情況中,顆粒的大小對應於纖維的直徑。The term "particles" as used in the context of this application must be understood in a broad sense and corresponds not only to small particles that are somewhat spherical, but also to angular particles, flat particles, particles in the form of flakes, particles in the form of fibers, or fiber-like particles, etc. It is understood that the "size" of a particle within the context of this application means the smallest cross-sectional dimension of the particle. For example, in the case of particles in the form of fibers, the size of the particle corresponds to the diameter of the fiber.
藉由顆粒的措辭“平均大小”,這根據本申請意思是大於顆粒之以容積計的50%的大小及小於顆粒的以容積計的50%的大小之大小。這對應於d50。顆粒的粒度分析可以藉由雷射粒度分析透過使用例如Malvern Mastersizer 2000而被測量。By the expression "average size" of the particles, this means according to the present application the size which is larger than 50% of the particles by volume and the size which is smaller than 50% of the particles by volume. This corresponds to d50. The particle size analysis of the particles can be measured by laser particle size analysis using, for example, a Malvern Mastersizer 2000.
用於產生熔融矽之裝置的範例將現在被描述,熔融矽特別是被用來獲得有足夠純度之矽塊,以用於產生光伏產品的直接用途。然而,熔融矽也能被用於獲得矽塊,該矽塊有一純度(低於用於產生光伏產品的直接用途所需之等級)且用來之後被處理,以具有產生光伏產品的足夠純度。An example of an apparatus for producing molten silicon will now be described, which is particularly used to obtain silicon blocks with sufficient purity for direct use in the production of photovoltaic products. However, molten silicon can also be used to obtain silicon blocks that have a purity (lower than the level required for direct use in the production of photovoltaic products) and are then processed to have sufficient purity to produce photovoltaic products.
第1圖表示用於產生熔融矽11之裝置10的第一實施例。FIG. 1 shows a first embodiment of an apparatus 10 for producing molten silicon 11.
裝置10包括氣密外殼12,氣密外殼藉由氣密壁13而被形成,氣密壁將外殼12與外界隔離。至少一開孔(未被表示)通過壁13被設置且使得可能讓外殼12的內容積與外界相通。裝置10能包括系統,該系統用於提供(未被表示)中性氣體或中性氣體的混合物(例如氬氣或氦氣)於外殼12中。The device 10 comprises a gas-tight housing 12, which is formed by a gas-tight wall 13, which isolates the housing 12 from the outside. At least one opening (not shown) is provided through the wall 13 and makes it possible to communicate the content volume of the housing 12 with the outside. The device 10 can include a system for providing (not shown) a neutral gas or a mixture of neutral gases (e.g. argon or helium) in the housing 12.
裝置10包括用於熔融矽的熔爐14,該熔爐安置於外殼12之中。熔爐14包括坩堝15,坩堝界定內容積16。坩堝15包括底部17與側壁18。根據實施例,坩堝15由材料製成,該材料是良好熱導體。良好熱導體是熱導性大於或等於5W/(m*K)之材料。例如,坩堝15是由石墨製成。根據實施例,坩堝15是進一步由良好電導體的材料製成。良好電導體是電導性大於或等於1000S/m之材料。根據另一實施例,坩堝15是由材料製成,該材料不是良好熱導體,甚至為良好熱隔離體。良好熱隔離體是熱導性低於或等於5W/(m*K)的材料。例如,坩堝15是由矽氧化物、矽氮化物或矽碳化物製成。The device 10 includes a furnace 14 for melting silicon, which is placed in an outer shell 12. The furnace 14 includes a crucible 15, which defines an internal volume 16. The crucible 15 includes a bottom 17 and side walls 18. According to an embodiment, the crucible 15 is made of a material that is a good thermal conductor. A good thermal conductor is a material with a thermal conductivity greater than or equal to 5 W/(m*K). For example, the crucible 15 is made of graphite. According to an embodiment, the crucible 15 is further made of a material that is a good electrical conductor. A good electrical conductor is a material with an electrical conductivity greater than or equal to 1000 S/m. According to another embodiment, the crucible 15 is made of a material that is not a good thermal conductor, or even a good thermal insulator. A good thermal insulator is a material with a thermal conductivity lower than or equal to 5 W/(m*K). For example, the crucible 15 is made of silicon oxide, silicon nitride or silicon carbide.
坩堝15包括例如軸D的圓形底座,其外徑能從100mm變化到800mm。坩堝15有例如從100mm變化到800mm的高度。坩堝15靠著支撐(未被表示)。支撐能由耐火材料製成,例如由關聯於材料的堆疊的耐火混凝土製成,該材料的堆疊確保坩堝15之底部的良好熱隔離。當運作的時候,氧化矽顆粒粉末19被注入坩堝15。The crucible 15 comprises, for example, a circular base with axis D, whose outer diameter can vary from 100 mm to 800 mm. The crucible 15 has, for example, a height that varies from 100 mm to 800 mm. The crucible 15 rests on a support (not shown). The support can be made of refractory material, for example of refractory concrete associated with a stack of materials that ensures good thermal insulation of the bottom of the crucible 15. When in operation, a silicon oxide granular powder 19 is injected into the crucible 15.
裝置10更包括用於加熱存在於坩堝15中的矽的系統20。根據實施例,加熱系統20是感應加熱系統。加熱系統20包括例如圍繞坩堝15之線圈22。線圈22能是中空的且包括內開孔24,該內開孔用於藉由冷卻液體的循環而冷卻線圈22。坩堝15能因此被熱與電隔離壁26(例如由可撓或剛性石墨氈製成)圍繞。特別地,隔離蓋體(未被表示)能覆蓋坩堝15,該蓋體包括用於將氧化矽顆粒粉末19引入坩堝15中的開孔。隔離支撐、壁26、及蓋體利於在坩堝15中將溫度保持均勻以及降低熱損失。在坩堝15之中使液體矽保持在期望溫度是藉由在坩堝15(當其由電傳導材料製成)中,及/或矽中生成由線圈22所感應之電流而被獲得。在變體中,坩堝15與包含在坩堝15中的矽的加熱能藉由電加熱系統達成,該電加熱系統包括電阻,其在坩堝15周圍被安置並藉由熱隔離元件而被熱隔離於外殼12。The device 10 further comprises a system 20 for heating the silicon present in the crucible 15. According to an embodiment, the heating system 20 is an induction heating system. The heating system 20 comprises, for example, a coil 22 surrounding the crucible 15. The coil 22 can be hollow and comprise an inner opening 24 for cooling the coil 22 by the circulation of a cooling liquid. The crucible 15 can thus be surrounded by a thermally and electrically isolating wall 26, for example made of flexible or rigid graphite felt. In particular, an isolating cover (not shown) can cover the crucible 15, the cover comprising an opening for introducing silicon oxide granular powder 19 into the crucible 15. The isolation support, wall 26, and lid facilitate maintaining a uniform temperature and reducing heat losses in the crucible 15. Maintaining the liquid silicon at a desired temperature in the crucible 15 is achieved by generating an electric current in the crucible 15 (when it is made of an electrically conductive material), and/or in the silicon, which is induced by the coil 22. In a variation, heating of the crucible 15 and the silicon contained in the crucible 15 can be achieved by an electric heating system that includes a resistor that is positioned around the crucible 15 and is thermally isolated from the housing 12 by a thermal isolation element.
坩堝15包括通道28,以用於排空坩堝15的內容積16中存在的熔融矽11。較佳地,排空通道28延伸通過底部17及/或進入坩堝15的側壁18以及通過鼻部31的孔口30而開孔,該鼻部設置於坩堝15的較低面部之上。排空通道28能實質垂直。排空通道28能具有圓形、方形、或矩形直段。排空通道28之直段的最小尺寸從1mm變化到30mm。排空通道28的直段的最大尺寸從10mm變化到50mm。例如,排空通道28可以具有圓形直段,其有大於5mm的直徑,較佳從10mm變化到15mm。坩堝15包括至少兩孔洞32(其開孔於坩堝15之側壁18上),較佳至少三孔洞,更佳至少四孔洞,每一孔洞將坩堝15的內容積16連接到排空通道28。孔洞32能沿實質垂直柱而被安置。每一個孔洞32能具有圓形、方形、或矩形直段。每一個孔洞32的直段的最大尺寸從5mm變化到15mm以及每一個孔洞32的直段的最小尺寸從0.5mm變化到5mm。根據實施例,孔洞32的其中之一開孔於側壁18之上而同時實質正切於底部17。在排空通道28與孔洞32有圓形直段的情況中,每一個孔洞32的直徑較佳小於或等於排空通道28的直徑。根據另一實施例,孔洞32被垂直或傾斜狹槽取代。狹槽的直段有從5mm變化到15mm的最大尺寸以及從0.5mm變化到5mm的最小尺寸。根據另一個實施例,孔洞32或孔洞32的至少一些位於坩堝15的底部17上。Crucible 15 comprises a channel 28 for evacuating molten silicon 11 present in the content volume 16 of crucible 15. Preferably, the evacuation channel 28 extends through the bottom 17 and/or into the side wall 18 of the crucible 15 and is opened by an orifice 30 of a nose 31, which is arranged on the lower face of the crucible 15. The evacuation channel 28 can be substantially vertical. The evacuation channel 28 can have a circular, square, or rectangular straight section. The minimum dimension of the straight section of the evacuation channel 28 varies from 1 mm to 30 mm. The maximum dimension of the straight section of the evacuation channel 28 varies from 10 mm to 50 mm. For example, the evacuation channel 28 can have a circular straight section having a diameter greater than 5 mm, preferably varying from 10 mm to 15 mm. The crucible 15 comprises at least two holes 32 (which open on the side wall 18 of the crucible 15), preferably at least three holes, more preferably at least four holes, each hole connecting the content volume 16 of the crucible 15 to the emptying channel 28. The holes 32 can be arranged along a substantially vertical column. Each hole 32 can have a circular, square, or rectangular straight section. The maximum dimension of the straight section of each hole 32 varies from 5 mm to 15 mm and the minimum dimension of the straight section of each hole 32 varies from 0.5 mm to 5 mm. According to an embodiment, one of the holes 32 opens on the side wall 18 and is substantially tangential to the bottom 17. In the case where the emptying channel 28 and the holes 32 have a circular straight section, the diameter of each hole 32 is preferably smaller than or equal to the diameter of the emptying channel 28. According to another embodiment, the holes 32 are replaced by vertical or inclined slots. The straight section of the slot has a maximum dimension varying from 5 mm to 15 mm and a minimum dimension varying from 0.5 mm to 5 mm. According to another embodiment, the holes 32 or at least some of the holes 32 are located on the bottom 17 of the crucible 15.
界定鼻部31的坩堝15的面部僅在其間形成小於120°的角度。裝置10能包括用於加熱鼻部31的元件(未被表示)。The faces of the crucible 15 which define the nose 31 only form an angle between them which is less than 120°. The device 10 can comprise elements for heating the nose 31 (not represented).
裝置10的運作如下。惰性氣氛被維持在外殼12之中。根據實施例,外殼12中的壓力是在0.1atm (10132.5Pa)與1atm (101325Pa)之間。較佳地,外殼中的壓力實質等於氣氛壓力。氧化矽顆粒粉末19利用第1圖與第2圖中未被表示的手段而被引入坩堝15中。根據實施例,氧化矽顆粒的平均大小小於300µm,較佳在100nm以及100µm之間。對坩堝15提供氧化矽顆粒粉末19能根據連續流體或藉由不提供粉末的周期所分離之相繼批料而被進行。對於以小於5kg/h供應氧化矽顆粒粉末19之流體,有增加的流體之不連續供應讓將氧化矽顆粒粉末19最佳地分配於坩堝15的底部17上成為可能。The operation of the apparatus 10 is as follows. An inert atmosphere is maintained in the housing 12. According to an embodiment, the pressure in the housing 12 is between 0.1 atm (10132.5 Pa) and 1 atm (101325 Pa). Preferably, the pressure in the housing is substantially equal to the atmospheric pressure. A powder 19 of silicon oxide particles is introduced into the crucible 15 by means not shown in FIGS. 1 and 2. According to an embodiment, the average size of the silicon oxide particles is less than 300 μm, preferably between 100 nm and 100 μm. The provision of the silicon oxide particle powder 19 to the crucible 15 can be carried out according to a continuous flow or in successive batches separated by periods in which no powder is provided. For a fluid supplying the silicon oxide particle powder 19 at less than 5 kg/h, discontinuous supply of the increased fluid makes it possible to optimally distribute the silicon oxide particle powder 19 on the bottom 17 of the crucible 15.
在坩堝15內部,氧化矽顆粒粉末19與熔融矽11直接藉由用於加熱之系統20及/或藉由控管坩堝15的壁與底部於1400°C之矽的熔融溫度之上(較佳是1600°C之上)而被加熱,該系統用於加熱及/或輻照坩堝15的壁。存在於熔融粉末中的矽與二氧化矽分離,二氧化矽形成坩堝15中的積聚物33。熔融矽11通過孔洞32以及通道28流動,以例如在熔融矽液滴34的形式中通過孔口30而流動。有利的是,排空通道28之直段的尺寸足以讓將氣泡推入排空通道28所需之壓力降低成為可能。界定鼻部31之坩堝15的面部僅在其間形成小於120°之角度的事實讓矽不側向流到隔離壁26,但以液滴34形式掉落成為可能。根據實施例,通過孔口30逸出之液滴34與鄰近隔離壁26之間的距離大於5mm,以避免讓矽滲入隔離壁26。Inside the crucible 15, the silicon oxide granular powder 19 and the molten silicon 11 are heated directly by a system 20 for heating and/or irradiating the walls of the crucible 15 and/or by controlling the walls and the bottom of the crucible 15 above the melting temperature of silicon of 1400° C., preferably above 1600° C. The silicon present in the molten powder separates from the silicon dioxide, which forms an agglomerate 33 in the crucible 15. The molten silicon 11 flows through the holes 32 and the channel 28, for example in the form of molten silicon droplets 34, through the orifice 30. Advantageously, the straight section of the emptying channel 28 is dimensioned sufficiently to make it possible to reduce the pressure required to push the gas bubbles into the emptying channel 28. The fact that the faces of the crucible 15 defining the nose 31 only form an angle of less than 120° therebetween makes it possible that the silicon does not flow laterally to the partition wall 26, but falls off in the form of droplets 34. According to an embodiment, the distance between the droplets 34 escaping through the orifice 30 and the adjacent partition wall 26 is greater than 5 mm, in order to avoid allowing the silicon to penetrate the partition wall 26.
二氧化矽仍在坩堝15之中且被累積。孔洞32在坩堝15之底部17與頂部之間被分配,使得當孔洞32被填充二氧化矽時,熔融矽11能通過接下來的孔洞32而流動。孔洞32之直徑小於或等於排空通道28之直徑的事實讓避免二氧化矽通過排空通道28中之孔洞32而流動成為可能而且不在排空通道28中造成阻塞。The silicon dioxide remains in the crucible 15 and is accumulated. The holes 32 are distributed between the bottom 17 and the top of the crucible 15 so that when the holes 32 are filled with silicon dioxide, the molten silicon 11 can flow through the next hole 32. The fact that the diameter of the hole 32 is smaller than or equal to the diameter of the drain channel 28 makes it possible to avoid silicon dioxide flowing through the hole 32 in the drain channel 28 and not causing a blockage in the drain channel 28.
裝置10能包括用於攪拌坩堝15中的熔融矽11之系統。攪拌能至少部分藉由加熱系統20是感應加熱的時候之感應而被進行。供應感應線圈22之電流的頻率能因此被調適,以利於坩堝15中熔融矽的攪拌。The apparatus 10 can include a system for stirring the molten silicon 11 in the crucible 15. The stirring can be performed at least in part by induction when the heating system 20 is inductively heated. The frequency of the current supplied to the induction coil 22 can therefore be adjusted to facilitate stirring of the molten silicon in the crucible 15.
根據實施例,在坩堝15是由石墨製成之情形中,電子級的矽塗層能被置於坩堝15之中,使得在此矽塗層的熔融之後以及氧化矽顆粒粉末19被引入坩堝15之前,碳矽化物層能被形成於坩堝15的內壁上。這讓避免坩堝15的石墨與熔融於坩堝15中之氧化矽顆粒粉末19反應成為可能。碳矽化合物層的形成能藉由將外殼12中的壓力暫時降至低於10mbr而被加速,較佳低於1mbar。根據另一實施例,碳矽化物塗層是被形成於坩堝15的內壁上,該坩堝15是藉另一方法(例如化學氣相沉積(CVD))而由石墨製成。According to an embodiment, in the case where the crucible 15 is made of graphite, an electronic grade silicon coating can be placed in the crucible 15, so that after melting of this silicon coating and before the silicon oxide granular powder 19 is introduced into the crucible 15, a carbon silicide layer can be formed on the inner wall of the crucible 15. This makes it possible to avoid the graphite of the crucible 15 from reacting with the silicon oxide granular powder 19 melted in the crucible 15. The formation of the carbon silicide layer can be accelerated by temporarily reducing the pressure in the housing 12 to below 10 mbar, preferably below 1 mbar. According to another embodiment, the carbon silicide coating is formed on the inner wall of the crucible 15, which is made of graphite by another method such as chemical vapor deposition (CVD).
當熔融矽的產生結束的時候,在冷卻之後,二氧化矽能藉由機械手段而被移除。塗層可被安置在坩堝15之中,以避免二氧化矽黏到坩堝15,該塗層由至少一材料組成,該材料例如是石墨、碳矽化物、矽氧化物及矽氮化物。When the production of molten silicon is finished, after cooling, the silicon dioxide can be removed by mechanical means. A coating can be placed in the crucible 15 to prevent the silicon dioxide from sticking to the crucible 15, the coating being composed of at least one material such as graphite, carbon silicide, silicon oxide and silicon nitride.
第2圖是用於產生熔融矽11之裝置35的另一實施例的截面圖。裝置35包括第1圖中所表示的裝置10的元件的全部,差別是最靠近底部17之開孔在側壁18的孔洞32遠離底部17一距離,該距離比坩堝的高度大超過10%。例如,孔洞32位於坩堝15的上半部。FIG. 2 is a cross-sectional view of another embodiment of an apparatus 35 for producing molten silicon 11. Apparatus 35 includes all of the elements of apparatus 10 shown in FIG. 1, with the difference that the hole 32 in side wall 18 closest to the opening of bottom 17 is located at a distance from bottom 17 that is greater than 10% of the height of the crucible. For example, hole 32 is located in the upper half of crucible 15.
在運作的時候,熔融矽11的其中一些仍在坩堝15之中,使得二氧化矽積聚物33浮在熔融矽11之上而且不與坩堝15接觸。二氧化矽能因此藉由機械手段而被移除,同時坩堝15也在矽的熔融溫度之上。用於產生熔融矽的方法能被連續執行而不冷卻坩堝15。在坩堝15中不存在熔融矽的攪拌之情況中,存在於坩堝15中的熔融矽11之浴液(bath)的高度能為大約10mm。在坩堝15中的熔融矽的攪拌被進行的情況中,存在於坩堝15中的熔融矽的浴液的高度能大約是坩堝15的直徑,例如大約200mm。During operation, some of the molten silicon 11 remains in the crucible 15, so that the silicon dioxide aggregate 33 floats on the molten silicon 11 and is not in contact with the crucible 15. The silicon dioxide can thus be removed by mechanical means while the crucible 15 is above the melting temperature of silicon. The method for producing molten silicon can be performed continuously without cooling the crucible 15. In the absence of stirring of the molten silicon in the crucible 15, the height of the bath of molten silicon 11 present in the crucible 15 can be about 10 mm. In the case where stirring of the molten silicon in the crucible 15 is performed, the height of the bath of molten silicon present in the crucible 15 can be approximately the diameter of the crucible 15, for example, approximately 200 mm.
第3圖表示用於產生矽鑄錠或塊的設施40的實施例。設施40包括第1圖及第2圖中表示的用於產生熔融矽之裝置10或35,且更包括由氣密壁44所形成的外殼42,氣密壁44將外殼42與外界隔離。開孔(未被表示)能通過外殼42的壁44而被設置以及讓外殼42與外界相通成為可能。開孔46通過外殼12的壁13而被設置以及讓外殼12的內容積與外殼42的內容積相通成為可能。設施40包括在開孔46的高度封住的風門48,以將外殼12的內容積16與外殼42的內容積密封地隔離。風門48例如是框架(casement)或滑動形式,由機構(未被表示)致動。 FIG. 3 shows an embodiment of a facility 40 for producing silicon ingots or blocks. The facility 40 comprises the device 10 or 35 for producing molten silicon shown in FIGS. 1 and 2 and further comprises a housing 42 formed by a gas-tight wall 44 which isolates the housing 42 from the outside. Openings (not shown) can be provided through the wall 44 of the housing 42 and allow the housing 42 to communicate with the outside. Openings 46 can be provided through the wall 13 of the housing 12 and allow the internal volume of the housing 12 to communicate with the internal volume of the housing 42. The device 40 includes a damper 48 sealed at the height of the opening 46 to seal the internal volume 16 of the housing 12 from the internal volume of the housing 42. The damper 48 is, for example, in the form of a casement or a slide, actuated by a mechanism (not shown).
設施40能包括用於對熔融融爐14提供氧化矽顆粒粉末之系統50。供應系統50能包括氣密槽52以及氣密系統54,氣密系統用於提供槽52所提供的氧化矽顆粒,其包括例如震動加料器(vibrating feeder)或螺桿旋轉加料器(worm screw rotating feeder)。 The facility 40 can include a system 50 for providing silicon oxide granule powder to the melting furnace 14. The supply system 50 can include an airtight tank 52 and an airtight system 54 for providing the silicon oxide granules provided by the tank 52, which includes, for example, a vibrating feeder or a worm screw rotating feeder.
設施40在外殼42之中更包括系統56,該系統56用於固化熔融融爐14所提供的熔融矽。系統56能包括坩堝58,其中熔融矽被固化,以獲得矽塊。系統56能進一步包括加熱元件60,加熱元件60設置在坩堝58的頂部。加熱元件60能包括電阻。系統56能進一步包括設置於坩堝58之下的冷卻及/或加熱元件62,以獲得從底部引導到頂部的坩堝58之中矽的固化。冷卻元件62能包括管道,其中冷卻液體循環。熱隔離壁64能在坩堝58、加熱元件60以及加熱/冷卻元件62四周被設置。特別地,有孔洞68之由熱隔離材料製成(例如由石墨或氮矽化物製成)的蓋體66能被置放於坩堝58之上,以避免熔融矽的濺射觸及加熱元件60。 The facility 40 further includes a system 56 in the housing 42 for solidifying molten silicon provided by the melting furnace 14. The system 56 can include a crucible 58, wherein the molten silicon is solidified to obtain silicon blocks. The system 56 can further include a heating element 60, which is disposed at the top of the crucible 58. The heating element 60 can include a resistor. The system 56 can further include a cooling and/or heating element 62 disposed below the crucible 58 to obtain solidification of silicon in the crucible 58 directed from the bottom to the top. The cooling element 62 can include a pipe in which a cooling liquid circulates. A thermal isolation wall 64 can be disposed around the crucible 58, the heating element 60, and the heating/cooling element 62. In particular, a cover 66 made of a thermally insulating material (e.g., graphite or silicide) having holes 68 can be placed on the crucible 58 to prevent the spattering of molten silicon from contacting the heating element 60.
設施40能包括至少一真空泵浦(未被表示),真空泵浦被連接於每一外殼12以及42。泵浦被調適以建立外殼12或42之中的所控制氣氛。根據另一個實施例,對於每一個外殼12以及42,設施40能包括真空泵浦(未被表示),以及用於將一或若干惰性氣體注入每一外殼12或42的裝置,以在該外殼12與42之中維持所控制氣氛(可能是不同的),該真空泵浦被連接於外殼12或42。The installation 40 can include at least one vacuum pump (not shown) connected to each housing 12 and 42. The pump is adapted to establish a controlled atmosphere inside the housing 12 or 42. According to another embodiment, the installation 40 can include, for each housing 12 and 42, a vacuum pump (not shown) connected to the housing 12 or 42, and means for injecting one or more inert gases into each housing 12 or 42, in order to maintain a controlled atmosphere (possibly different) inside the housing 12 and 42.
在運作的時候,坩堝58被填充用於產生熔融矽的裝置10所產生的熔融矽,而且坩堝58中所存在的熔融矽的被控制固化被進行,例如有從底部進展到頂部的矽的固化前端。在坩堝58之頂部設置的加熱元件60能被用於有利地加熱坩堝58的鼻部31。In operation, the crucible 58 is filled with molten silicon produced by the device 10 for producing molten silicon, and a controlled solidification of the molten silicon present in the crucible 58 is carried out, for example, there is a solidification front of silicon that progresses from the bottom to the top. The heating element 60 provided at the top of the crucible 58 can be used to advantageously heat the nose 31 of the crucible 58.
有各種變體的各種實施例已經如上被描述。將注意到,本領域一般技術者能結合這些各種實施例以及各種變體的各種元件而無須證明任何進步性。本發明的特定實施例已經被描述。各種變體與修改將是本領域一般技術者可見的。特別地,雖然第3圖表示熔融矽提供用於矽的被引導固化之系統56之實施例,熔融矽可提供隨後處理的坩堝(其中矽被固化而無需被引導的固化),例如,純化,其在矽塊上被進行。Various embodiments with various variations have been described above. It will be noted that a person skilled in the art can combine various elements of these various embodiments and variations without demonstrating any advancement. Specific embodiments of the invention have been described. Various variations and modifications will be apparent to a person skilled in the art. In particular, although FIG. 3 shows an embodiment of a system 56 in which molten silicon is provided for guided solidification of silicon, the molten silicon can provide a crucible for subsequent processing (wherein the silicon is solidified without guided solidification), for example, purification, which is performed on a block of silicon.
10、35:裝置 11:熔融矽 12、42:氣密外殼 13:氣密壁 14:熔爐 15、58:坩堝 16:內容積 17:底部 18:側壁 19:氧化矽顆粒粉末 20:加熱系統 22:線圈 24:內開孔 26:隔離壁 28:通道 30:孔口 31:鼻部 32、68:孔洞 33:積聚物 34:液滴 40:設施 44:氣密壁 46:開孔 48:風門 50:供應系統 52:提供槽 56:系統 60、62:加熱元件 64:熱隔離壁 66:蓋體10, 35: device 11: molten silicon 12, 42: airtight shell 13: airtight wall 14: furnace 15, 58: crucible 16: content volume 17: bottom 18: side wall 19: silicon oxide granular powder 20: heating system 22: coil 24: inner opening 26: isolation wall 28: channel 30: orifice 31: nose 32, 68: hole 33: accumulation 34: droplet 40: facility 44: airtight wall 46: opening 48: damper 50: supply system 52: supply slot 56: system 60, 62: heating element 64: thermal isolation wall 66: cover
在與附圖的關係中,這些特徵與優點及其他的將在非限制方式做出的特定實施例的以下描述中被詳細描述,其中: 第1圖與第2圖是用於產生熔融矽的裝置的實施例之截面、部分與示意視圖;及 第3圖是用於產生矽鑄錠的設施的實施例的截面、部分及示意視圖。These features and advantages and others are described in detail in the following description of specific embodiments made in a non-limiting manner in relation to the accompanying drawings, in which: Figures 1 and 2 are cross-sectional, partial and schematic views of embodiments of an apparatus for producing molten silicon; and Figure 3 is a cross-sectional, partial and schematic view of an embodiment of an apparatus for producing silicon ingots.
10:裝置 10: Device
11:熔融矽 11: Molten Silicon
12:氣密外殼 12: Airtight outer shell
13:氣密壁 13: Airtight wall
14:熔爐 14: Furnace
15:坩堝 15: Crucible
16:內容積 16: Content accumulation
17:底部 17: Bottom
18:側壁 18: Side wall
19:氧化矽顆粒粉末 19: Silicon oxide granular powder
20:加熱系統 20: Heating system
22:線圈 22: Coil
24:內開孔 24: Inner opening
26:隔離壁 26: Isolation wall
28:通道 28: Channel
30:孔口 30: Orifice
31:鼻部 31: Nose
32:孔洞 32: Holes
33:積聚物 33: Accumulation
34:液滴 34: Droplets
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