TWI844186B - Silicone composition for vibration damper, viscous fluid for vibration damper, and vibration damper - Google Patents
Silicone composition for vibration damper, viscous fluid for vibration damper, and vibration damper Download PDFInfo
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- TWI844186B TWI844186B TW111146653A TW111146653A TWI844186B TW I844186 B TWI844186 B TW I844186B TW 111146653 A TW111146653 A TW 111146653A TW 111146653 A TW111146653 A TW 111146653A TW I844186 B TWI844186 B TW I844186B
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- silicone
- vibration damper
- silicone composition
- mass
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- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 187
- 239000000203 mixture Substances 0.000 title claims abstract description 74
- 239000012530 fluid Substances 0.000 title claims abstract description 32
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 52
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 26
- 239000003054 catalyst Substances 0.000 claims abstract description 24
- 239000004970 Chain extender Substances 0.000 claims abstract description 18
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 27
- 239000003431 cross linking reagent Substances 0.000 claims description 19
- 230000035939 shock Effects 0.000 claims description 14
- 239000003795 chemical substances by application Substances 0.000 claims description 13
- 239000006096 absorbing agent Substances 0.000 claims description 9
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 4
- 239000007795 chemical reaction product Substances 0.000 claims description 3
- 230000000379 polymerizing effect Effects 0.000 claims description 2
- 230000008859 change Effects 0.000 abstract description 10
- 239000000463 material Substances 0.000 description 30
- 239000007788 liquid Substances 0.000 description 15
- 238000006116 polymerization reaction Methods 0.000 description 14
- 238000010276 construction Methods 0.000 description 13
- 238000011049 filling Methods 0.000 description 12
- 238000005259 measurement Methods 0.000 description 11
- 229920000642 polymer Polymers 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 9
- 229920001083 polybutene Polymers 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- -1 polybutylene Polymers 0.000 description 8
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 125000001931 aliphatic group Chemical group 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 239000004971 Cross linker Substances 0.000 description 4
- 239000005062 Polybutadiene Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 3
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 3
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 238000013016 damping Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 150000003003 phosphines Chemical class 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000011345 viscous material Substances 0.000 description 3
- 239000003643 water by type Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical compound C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 229920003049 isoprene rubber Polymers 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 150000002898 organic sulfur compounds Chemical class 0.000 description 2
- 150000002903 organophosphorus compounds Chemical class 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920001748 polybutylene Polymers 0.000 description 2
- 239000002954 polymerization reaction product Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000011359 shock absorbing material Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- ROGIWVXWXZRRMZ-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1 ROGIWVXWXZRRMZ-UHFFFAOYSA-N 0.000 description 1
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical compound N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 1
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 1
- UIEXFJVOIMVETD-UHFFFAOYSA-N P([O-])([O-])[O-].[Pt+3] Chemical compound P([O-])([O-])[O-].[Pt+3] UIEXFJVOIMVETD-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 1
- 239000002174 Styrene-butadiene Substances 0.000 description 1
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- VLLYOYVKQDKAHN-UHFFFAOYSA-N buta-1,3-diene;2-methylbuta-1,3-diene Chemical compound C=CC=C.CC(=C)C=C VLLYOYVKQDKAHN-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- AFZSMODLJJCVPP-UHFFFAOYSA-N dibenzothiazol-2-yl disulfide Chemical compound C1=CC=C2SC(SSC=3SC4=CC=CC=C4N=3)=NC2=C1 AFZSMODLJJCVPP-UHFFFAOYSA-N 0.000 description 1
- 150000004683 dihydrates Chemical class 0.000 description 1
- LDCRTTXIJACKKU-ARJAWSKDSA-N dimethyl maleate Chemical compound COC(=O)\C=C/C(=O)OC LDCRTTXIJACKKU-ARJAWSKDSA-N 0.000 description 1
- IUNMPGNGSSIWFP-UHFFFAOYSA-N dimethylaminopropylamine Chemical compound CN(C)CCCN IUNMPGNGSSIWFP-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000005243 fluidization Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000004128 high performance liquid chromatography Methods 0.000 description 1
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 150000002688 maleic acid derivatives Chemical class 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- LDIPAUVCWRHLAM-UHFFFAOYSA-N n',n'-dibutylbutane-1,4-diamine Chemical compound CCCCN(CCCC)CCCCN LDIPAUVCWRHLAM-UHFFFAOYSA-N 0.000 description 1
- PWNDYKKNXVKQJO-UHFFFAOYSA-N n',n'-dibutylethane-1,2-diamine Chemical compound CCCCN(CCN)CCCC PWNDYKKNXVKQJO-UHFFFAOYSA-N 0.000 description 1
- KYCGURZGBKFEQB-UHFFFAOYSA-N n',n'-dibutylpropane-1,3-diamine Chemical compound CCCCN(CCCC)CCCN KYCGURZGBKFEQB-UHFFFAOYSA-N 0.000 description 1
- UDGSVBYJWHOHNN-UHFFFAOYSA-N n',n'-diethylethane-1,2-diamine Chemical compound CCN(CC)CCN UDGSVBYJWHOHNN-UHFFFAOYSA-N 0.000 description 1
- DILRJUIACXKSQE-UHFFFAOYSA-N n',n'-dimethylethane-1,2-diamine Chemical compound CN(C)CCN DILRJUIACXKSQE-UHFFFAOYSA-N 0.000 description 1
- DIHKMUNUGQVFES-UHFFFAOYSA-N n,n,n',n'-tetraethylethane-1,2-diamine Chemical compound CCN(CC)CCN(CC)CC DIHKMUNUGQVFES-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- PKELYQZIUROQSI-UHFFFAOYSA-N phosphane;platinum Chemical compound P.[Pt] PKELYQZIUROQSI-UHFFFAOYSA-N 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F9/00—Springs, vibration-dampers, shock-absorbers, or similarly-constructed movement-dampers using a fluid or the equivalent as damping medium
- F16F9/30—Springs, vibration-dampers, shock-absorbers, or similarly-constructed movement-dampers using a fluid or the equivalent as damping medium with solid or semi-solid material, e.g. pasty masses, as damping medium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F2224/00—Materials; Material properties
- F16F2224/04—Fluids
- F16F2224/048—High viscosity, semi-solid pastiness
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Engineering & Computer Science (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Mechanical Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Buildings Adapted To Withstand Abnormal External Influences (AREA)
- Vibration Prevention Devices (AREA)
- Fluid-Damping Devices (AREA)
Abstract
本發明提供一種由溫度變化引起的黏度變化少、即便在高溫環境下亦可以少量表現出高衰減、以及耐負荷性、密接性優異、施工性亦優異的減震阻尼器用矽酮組成物、減震阻尼器用黏性流體、及減震阻尼器。藉由以下述(A)及(B)為主要成分並含有下述(C)~(E)的減震阻尼器用矽酮組成物來解決課題:(A)直鏈型兩末端乙烯基改質矽酮;(B)分支型矽酮;(C)鉑觸媒;(D)延遲劑;(E)鏈延長劑。The present invention provides a silicone composition for a vibration damper, a viscous fluid for a vibration damper, and a vibration damper that has little viscosity change due to temperature change, can exhibit high attenuation even in a high temperature environment with a small amount, and has excellent load resistance, adhesion, and workability. The problem is solved by a silicone composition for a vibration damper that has the following (A) and (B) as main components and contains the following (C) to (E): (A) linear two-terminal vinyl-modified silicone; (B) branched silicone; (C) platinum catalyst; (D) retarder; (E) chain extender.
Description
本發明是有關於一種減震阻尼器用矽酮組成物、減震阻尼器用黏性流體、及減震阻尼器,詳細而言,是有關於一種適合土木、建築領域中的減震或抗震等用途的減震阻尼器用矽酮組成物、減震阻尼器用黏性流體、及減震阻尼器。The present invention relates to a silicone composition for a vibration damper, a viscous fluid for a vibration damper, and a vibration damper. Specifically, the present invention relates to a silicone composition for a vibration damper, a viscous fluid for a vibration damper, and a vibration damper suitable for vibration reduction or earthquake resistance in the fields of civil engineering and construction.
關於土木、建築領域中的減震裝置或抗震裝置、特別是橋樑或大廈等大型建築物中所使用的減震阻尼器,是出於抑制由地震或風等引起的振動、由大型車的行駛等引起的交通振動等的目的而使用。 為了吸收大地震的能量,需要高應變的高衰減化,但於大地震後亦多發生中小地震,對於如於高樓大廈觀測到的長週期地震般由所述中小地震引起的多次連續的重覆變形而言,特性穩定化的需求亦不斷提高。 作為用於此種用途的減震阻尼器的機構,可列舉黏彈性阻尼器、黏性阻尼器、油壓阻尼器、鋼材阻尼器等作為主要的機構,其中黏性阻尼器的衰減力大且重覆性優異,而且僅存在黏性項,因此設計簡單,於高樓大廈等大型設施中被廣泛導入。 Seismic devices or earthquake-resistant devices in the fields of civil engineering and construction, especially seismic dampers used in large buildings such as bridges and buildings, are used to suppress vibrations caused by earthquakes or wind, traffic vibrations caused by the movement of large vehicles, etc. In order to absorb the energy of a large earthquake, high attenuation of high strain is required, but small and medium earthquakes often occur after a large earthquake. For multiple continuous repeated deformations caused by these small and medium earthquakes, such as long-term earthquakes observed in high-rise buildings, the demand for characteristic stabilization is also increasing. As the mechanism of the shock absorbing damper used for this purpose, viscoelastic damper, viscous damper, hydraulic damper, steel damper, etc. can be listed as the main mechanisms. Among them, the viscous damper has a large attenuation force and excellent repeatability, and only has a viscosity term, so the design is simple, and it is widely introduced in large facilities such as high-rise buildings.
作為所述黏性阻尼器中所使用的黏性體,例如一般而言使用聚異丁烯等聚丁烯系材料(例如,參照專利文獻1)。 [現有技術文獻] [專利文獻] As the viscous body used in the viscous damper, a polybutylene-based material such as polyisobutylene is generally used (for example, refer to Patent Document 1). [Prior Art Document] [Patent Document]
[專利文獻1]日本專利特開2018-132104號公報[Patent Document 1] Japanese Patent Publication No. 2018-132104
[發明所欲解決之課題] 然而,聚丁烯系材料的溫度依存性大,因此為了於高溫環境下(30℃以上)獲得高衰減性,需要增多黏性阻尼器中使用的聚丁烯系材料的使用量。因此,於使用聚丁烯系材料作為黏性阻尼器的黏性體時,需要配合聚丁烯系材料的使用量增大,使所述設備大型化。 [Problems to be solved by the invention] However, polybutene-based materials have a large temperature dependence, so in order to obtain high attenuation in a high temperature environment (above 30°C), it is necessary to increase the amount of polybutene-based materials used in the viscous damper. Therefore, when using polybutene-based materials as the viscous body of the viscous damper, it is necessary to increase the amount of polybutene-based materials used, making the device larger.
另外,由於聚丁烯系材料的溫度依存性大,因此於減震壁等減震阻尼器中填充聚丁烯系材料時,若不暫時加熱至130℃~170℃而降低聚丁烯系材料的黏度則無法進行填充。如此,亦存在於施工時加熱費工夫的問題。In addition, since polybutene-based materials have a high temperature dependency, when filling a vibration-absorbing damper such as a vibration-absorbing wall with polybutene-based materials, filling cannot be performed without temporarily heating the material to 130°C to 170°C to reduce the viscosity of the polybutene-based materials. Thus, there is also a problem that heating is laborious during construction.
因此,本發明者等人研究了使用溫度依存性小的矽酮作為所述黏性體的材料。 然而,關於作為矽酮的特徵的「低強度」、「高的非黏著性」,於將矽酮用於黏性阻尼器時,成為耐負荷性弱,由與構成阻尼器的金屬配件的低密接引起的激振中的減震性能強烈下降的弱點。因此,於所述方面而言,有進一步研究的餘地。 Therefore, the inventors and others studied the use of silicone with low temperature dependence as the material of the viscous body. However, regarding the "low strength" and "high non-adhesiveness" that are the characteristics of silicone, when silicone is used in a viscous damper, it becomes a weakness that the load resistance is weak and the shock absorption performance during excitation is greatly reduced due to the low close contact with the metal parts constituting the damper. Therefore, there is room for further research in this regard.
本發明是鑒於此種情況而成者,其目的在於提供一種由溫度變化引起的黏度變化少、即便在高溫環境下亦可以少量表現出高衰減、以及耐負荷性、密接性優異、施工性亦優異的減震阻尼器用矽酮組成物、減震阻尼器用黏性流體、及減震阻尼器。 [解決課題之手段] The present invention is made in view of such a situation, and its purpose is to provide a silicone composition for a vibration damper, a viscous fluid for a vibration damper, and a vibration damper that has little viscosity change caused by temperature change, can exhibit high attenuation with a small amount even in a high temperature environment, and has excellent load resistance, adhesion, and construction properties. [Means for solving the problem]
本發明者等人為了解決所述課題而反覆努力研究。於其研究的過程中,研究了如下內容:如所述般採用黏性阻尼器作為減震阻尼器的減震機構,並使用溫度依存性小的矽酮作為其黏性材料。而且,為了成為由溫度變化引起的黏度變化少、即便在高溫環境下亦可以少量表現出高衰減、以及耐負荷性、密接性優異、施工性亦優異的黏性材料,反覆進行了各種實驗、研究。 結果,作為所述黏性材料,開發一種矽酮組成物,含有併用有直鏈型兩末端乙烯基改質矽酮(A)與分支型矽酮(B)的主要成分、以及鉑觸媒(C)、延遲劑(D)、及鏈延長劑(E)。本開發的矽酮組成物隨著其聚合反應(黏性流體化)的進行,如圖3所示,共存有藉由所述(A)與(E)的聚合反應(二維交聯反應)而高分子量化的直鏈結構的矽酮(圖示的11)、以及所述(B)的分支型矽酮(圖示的12)。而且,發現所述分支型矽酮12藉由其分子結構,容易與所述直鏈結構的矽酮11纏結,藉由該纏結,可改善作為矽酮的弱點的耐負荷性,進而,藉由併用分支型矽酮12,有助於密接性的聚合物末端增加,從而密接性提高。 而且,包含所述矽酮組成物的黏性流體(減震阻尼器用黏性流體)顯示出使用聚丁烯系材料的先前的黏性流體的2倍以上的黏度,實現高衰減,並且較聚丁烯系材料而言可大幅減少溫度依存性,因此結果可達成所期望的目的。 The inventors of the present invention have repeatedly made efforts to solve the above-mentioned problems. In the process of their research, they studied the following contents: as described above, a viscous damper is used as the shock absorbing mechanism of the shock absorbing damper, and silicone with low temperature dependence is used as its viscous material. In addition, in order to make a viscous material with less viscosity change caused by temperature change, high attenuation can be shown in a small amount even in a high temperature environment, and excellent load resistance, adhesion, and construction performance, various experiments and studies were repeatedly conducted. As a result, a silicone composition was developed as the viscous material, which contains a main component of a linear two-terminal vinyl-modified silicone (A) and a branched silicone (B), a platinum catalyst (C), a delay agent (D), and a chain extender (E). As the polymerization reaction (viscous fluidization) of the silicone composition developed in the present invention proceeds, as shown in FIG3, a linear silicone (11 in the figure) with a high molecular weight obtained by the polymerization reaction (two-dimensional crosslinking reaction) of (A) and (E) and a branched silicone (12 in the figure) of (B) coexist. Furthermore, it was found that the branched silicone 12 can easily be entangled with the straight chain silicone 11 due to its molecular structure, and the entanglement can improve the load resistance, which is the weakness of silicone. Furthermore, by using the branched silicone 12 in combination, the polymer ends that contribute to the adhesion are increased, thereby improving the adhesion. Furthermore, the viscous fluid (viscous fluid for shock absorbers) containing the silicone composition shows a viscosity more than twice that of the previous viscous fluid using polybutene-based materials, achieving high attenuation, and can significantly reduce temperature dependence compared to polybutene-based materials, so the desired purpose can be achieved as a result.
然而,本發明將以下的[1]~[12]作為其主旨。 [1] 一種減震阻尼器用矽酮組成物,將下述(A)及(B)作為主要成分,並含有下述(C)~(E)。 (A)直鏈型兩末端乙烯基改質矽酮。 (B)分支型矽酮。 (C)鉑觸媒。 (D)延遲劑。 (E)鏈延長劑。 [2] 如[1]所述的減震阻尼器用矽酮組成物,其中所述(B)為於一分子中具有三個以上矽氫基的交聯劑與直鏈型兩末端乙烯基改質矽酮的反應產物。 [3] 如[2]所述的減震阻尼器用矽酮組成物,其中所述(A)的質量a與構成所述(B)的直鏈型兩末端乙烯基改質矽酮的質量b的比率(a:b)為a:b=95:5~10:90。 [4] 如[1]至[3]中任一項所述的減震阻尼器用矽酮組成物,其中所述(A)於30℃下的黏度為2000 mPa·s~100000 mPa·s。 [5] 如[2]至[4]中任一項所述的減震阻尼器用矽酮組成物,其中構成所述(B)的直鏈型兩末端乙烯基改質矽酮於30℃下的黏度為2000 mPa·s~100000 mPa·s。 [6] 如[1]至[5]中任一項所述的減震阻尼器用矽酮組成物,其中相對於所述(A)100質量份,所述(C)的含有比例為0.00003質量份~0.003質量份。 [7] 如[1]至[6]中任一項所述的減震阻尼器用矽酮組成物,其中相對於所述(A)100質量份,所述(D)的含有比例為0.01質量份~1質量份。 [8] 如[1]至[7]中任一項所述的減震阻尼器用矽酮組成物,其中所述減震阻尼器用矽酮組成物中的所述(E)相對於所述(A)的莫耳比為0.01~4。 [9] 一種減震阻尼器用黏性流體,是由如[1]至[8]中任一項所述的減震阻尼器用矽酮組成物聚合而成。 [10] 如[9]所述的減震阻尼器用黏性流體,於30℃下的黏度為6000 Pa·s~150000 Pa·s。 [11] 一種減震阻尼器,是填充有如[9]或[10]所述的減震阻尼器用黏性流體而成。 [12] 如[11]所述的減震阻尼器,其為減震壁。 [發明的效果] However, the present invention takes the following [1] to [12] as its main purpose. [1] A silicone composition for a vibration damper, comprising the following (A) and (B) as main components, and containing the following (C) to (E). (A) Straight-chain silicone modified with vinyl groups at both ends. (B) Branched silicone. (C) Platinum catalyst. (D) Retardant. (E) Chain extender. [2] A silicone composition for a vibration damper as described in [1], wherein the (B) is a reaction product of a crosslinking agent having three or more silane groups in one molecule and a straight-chain silicone modified with vinyl groups at both ends. [3] The silicone composition for a vibration damper as described in [2], wherein the ratio (a:b) of the mass a of (A) to the mass b of the linear vinyl-modified silicone constituting (B) is a:b=95:5 to 10:90. [4] The silicone composition for a vibration damper as described in any one of [1] to [3], wherein the viscosity of (A) at 30°C is 2000 mPa·s to 100000 mPa·s. [5] The silicone composition for a vibration damper as described in any one of [2] to [4], wherein the viscosity of the linear vinyl-modified silicone constituting (B) at 30°C is 2000 mPa·s to 100000 mPa·s. [6] The silicone composition for a vibration damper as described in any one of [1] to [5], wherein the content ratio of the (C) is 0.00003 mass parts to 0.003 mass parts relative to 100 mass parts of the (A). [7] The silicone composition for a vibration damper as described in any one of [1] to [6], wherein the content ratio of the (D) is 0.01 mass parts to 1 mass parts relative to 100 mass parts of the (A). [8] The silicone composition for a vibration damper as described in any one of [1] to [7], wherein the molar ratio of the (E) to the (A) in the silicone composition for a vibration damper is 0.01 to 4. [9] A viscous fluid for a shock absorber is formed by polymerizing a silicone composition for a shock absorber as described in any one of [1] to [8]. [10] The viscous fluid for a shock absorber as described in [9] has a viscosity of 6000 Pa·s to 150000 Pa·s at 30°C. [11] A shock absorber is filled with the viscous fluid for a shock absorber as described in [9] or [10]. [12] The shock absorber as described in [11] is a shock absorbing wall. [Effect of the invention]
根據以上內容,本發明的減震阻尼器用矽酮組成物作為由溫度變化引起的黏度變化少、即便在高溫環境下亦可以少量表現出高衰減、以及耐負荷性、密接性優異的黏性流體的材料,可發揮優異的性能。 另外,由於本發明的減震阻尼器用矽酮組成物於常溫下亦反應,因此能夠於黏度低的狀態下填充至減震壁等減震阻尼器中,於減震阻尼器內在常溫下進行高分子量化。而且,於所述填充時,不需要暫時加熱而降低黏度後進行填充等工夫,因此於施工時有利。 而且,本發明的減震阻尼器是填充有所述黏性流體而成的阻尼器,即便其填充量為少量亦可表現出高衰減,因此與先前的使用聚丁烯系材料的黏性阻尼器相比,能夠實現小型化。另外,由溫度變化引起的衰減性的變動少(特別是高溫環境下的衰減性的降低得到抑制),因此作為減震阻尼器可發揮優異的性能。 According to the above, the silicone composition for the vibration damper of the present invention can exert excellent performance as a material of a viscous fluid with little viscosity change caused by temperature change, high attenuation even in a high temperature environment with a small amount, and excellent load resistance and adhesion. In addition, since the silicone composition for the vibration damper of the present invention also reacts at room temperature, it can be filled into the vibration damper such as the vibration damper wall in a low viscosity state, and high molecular weight can be obtained at room temperature in the vibration damper. Moreover, during the filling, there is no need to temporarily heat to reduce the viscosity before filling, so it is advantageous during construction. Furthermore, the vibration damper of the present invention is a damper filled with the viscous fluid, and can exhibit high attenuation even with a small amount of filling, so it can be miniaturized compared to the previous viscous damper using polybutylene-based materials. In addition, the attenuation changes caused by temperature changes are small (especially the reduction in attenuation in a high temperature environment is suppressed), so it can demonstrate excellent performance as a vibration damper.
接下來,對本發明的實施方式進行詳細說明。但是,本發明並不限於該實施方式。 再者,於本發明中表達為「X~Y」(X、Y為任意的數字)的情況下,只要無特別說明,則於包含「X以上且Y以下」的含義的基礎上,亦包含「較佳為大於X」或「較佳為小於Y」的含義。 另外,於表達為「X以上」(X為任意的數字)或「Y以下」(Y為任意的數字)的情況下,亦包含「較佳為大於X」或「較佳為未滿Y」的主旨的意圖。 Next, the implementation of the present invention is described in detail. However, the present invention is not limited to this implementation. Furthermore, when "X to Y" (X and Y are arbitrary numbers) is expressed in the present invention, unless otherwise specified, the meaning of "preferably greater than X" or "preferably less than Y" is also included on the basis of the meaning of "greater than X and less than Y". In addition, when "greater than X" (X is an arbitrary number) or "less than Y" (Y is an arbitrary number) is expressed, the intention of the subject matter of "preferably greater than X" or "preferably less than Y" is also included.
本發明的減震阻尼器用矽酮組成物(以下,表示為「本矽酮組成物」)是將下述(A)及(B)作為主要成分並含有下述(C)~(E)的矽酮組成物。 (A)直鏈型兩末端乙烯基改質矽酮。 (B)分支型矽酮。 (C)鉑觸媒。 (D)延遲劑。 (E)鏈延長劑。 The silicone composition for a vibration damper of the present invention (hereinafter referred to as "the present silicone composition") is a silicone composition having the following (A) and (B) as main components and containing the following (C) to (E). (A) Straight-chain dual-terminal vinyl-modified silicone. (B) Branched silicone. (C) Platinum catalyst. (D) Delay agent. (E) Chain extender.
此處,所述的所謂「將(A)及(B)作為主要成分」,是指相對於作為本矽酮組成物的必需成分的所述(A)~(E)的總質量,(A)及(B)的合計質量佔超過90質量%的比例,且是指佔較佳為92質量%~98質量%、更佳為94質量%~97質量%。 再者,於所述(B)的分支型矽酮為使用直鏈型兩末端乙烯基改質矽酮而合成者的情況下,作為其材料的直鏈型兩末端乙烯基改質矽酮不包含於所述(A)中。 Here, the so-called "(A) and (B) as main components" means that the total mass of (A) and (B) accounts for more than 90 mass% relative to the total mass of (A) to (E) as essential components of the silicone composition, and preferably accounts for 92 mass% to 98 mass%, and more preferably 94 mass% to 97 mass%. In addition, when the branched silicone of (B) is synthesized using a straight-chain two-terminal vinyl-modified silicone, the straight-chain two-terminal vinyl-modified silicone as its material is not included in the (A).
以下,對本矽酮組成物的結構材料進行詳細說明。The structural materials of this silicone composition are described in detail below.
《直鏈型兩末端乙烯基改質矽酮(A)》 作為直鏈型兩末端乙烯基改質矽酮(A),可使用顯示直鏈的分子結構且於其兩末端具有乙烯基的矽酮,例如可使用下述通式(1)所表示的乙烯基改質矽酮。 《Linear-type dual-terminal vinyl-modified silicone (A)》 As the linear-type dual-terminal vinyl-modified silicone (A), silicone having a linear molecular structure and vinyl groups at both ends thereof can be used. For example, a vinyl-modified silicone represented by the following general formula (1) can be used.
[化1] [Chemistry 1]
於所述通式(1)中,n較佳為50~5000的整數,更佳為80~4000的整數,進而佳為100~3000的整數。即,其原因在於,若n的值過小,則反應會變得過快,若n的值過大,則反應會變得過慢。In the general formula (1), n is preferably an integer of 50 to 5000, more preferably an integer of 80 to 4000, and further preferably an integer of 100 to 3000. That is, if the value of n is too small, the reaction becomes too fast, and if the value of n is too large, the reaction becomes too slow.
另外,所述直鏈型兩末端乙烯基改質矽酮(A)於30℃下的黏度較佳為400 mPa·s~5000000 mPa·s。而且,所述黏度更佳為500 mPa·s~4000000 mPa·s,進而佳為1000 mPa·s~1000000 mPa·s。即,若為顯示所述般的黏度者,則衰減特性會進一步提高。再者,所述黏度是利用旋轉式流變儀(TA儀器(TA Instruments)公司製造,ARES-G2)於測定溫度30℃下測定而得的值。In addition, the viscosity of the linear two-terminal vinyl-modified silicone (A) at 30°C is preferably 400 mPa·s to 5000000 mPa·s. Moreover, the viscosity is more preferably 500 mPa·s to 4000000 mPa·s, and further preferably 1000 mPa·s to 1000000 mPa·s. That is, if the viscosity is as described above, the attenuation characteristics will be further improved. Furthermore, the viscosity is a value measured at a measurement temperature of 30°C using a rotational rheometer (manufactured by TA Instruments, ARES-G2).
《分支型矽酮(B)》 作為分支型矽酮(B),並無特別限定,較佳為可使用於一分子中具有三個以上矽氫基的交聯劑與直鏈型兩末端乙烯基改質矽酮的反應產物。 此處,作為用作所述分支型矽酮(B)的結構材料的直鏈型兩末端乙烯基改質矽酮,可較佳地使用與所述(A)相同者。因此,可較佳地使用下述通式(1)所表示的乙烯基改質矽酮。 《Branched silicone (B)》 The branched silicone (B) is not particularly limited, and is preferably a reaction product of a crosslinking agent having three or more silyl groups in one molecule and a linear two-terminal vinyl-modified silicone. Here, as the linear two-terminal vinyl-modified silicone used as the structural material of the branched silicone (B), the same as the above (A) can be preferably used. Therefore, the vinyl-modified silicone represented by the following general formula (1) can be preferably used.
[化2] [Chemistry 2]
於所述通式(1)中,n較佳為50~5000的整數,更佳為80~4000的整數,進而佳為100~3000的整數。即,其原因在於,若n的值過小,則反應會變得過快,若n的值過大,則反應會變得過慢。In the general formula (1), n is preferably an integer of 50 to 5000, more preferably an integer of 80 to 4000, and further preferably an integer of 100 to 3000. That is, if the value of n is too small, the reaction becomes too fast, and if the value of n is too large, the reaction becomes too slow.
另外,用作所述分支型矽酮(B)的結構材料的直鏈型兩末端乙烯基改質矽酮於30℃下的黏度較佳為400 mPa·s~5000000 mPa·s。而且,所述黏度更佳為500 mPa·s~4000000 mPa·s,進而佳為1000 mPa·s~1000000 mPa·s。即,若為顯示所述般的黏度者,則衰減特性會進一步提高。再者,所述黏度是利用旋轉式流變儀(TA儀器(TA Instruments)公司製造,ARES-G2)於測定溫度30℃下測定而得的值。In addition, the viscosity of the linear two-terminal vinyl-modified silicone used as the structural material of the branched silicone (B) at 30°C is preferably 400 mPa·s to 5000000 mPa·s. Moreover, the viscosity is more preferably 500 mPa·s to 4000000 mPa·s, and further preferably 1000 mPa·s to 1000000 mPa·s. That is, if the viscosity is as described above, the attenuation characteristics will be further improved. Furthermore, the viscosity is a value measured at a measurement temperature of 30°C using a rotational rheometer (manufactured by TA Instruments, ARES-G2).
接下來,作為用作所述分支型矽酮(B)的結構材料的交聯劑,如之前所述般,可使用於一分子中具有三個以上矽氫基的交聯劑。作為此種交聯劑,例如可列舉於其分子鏈的單末端或兩末端具有矽氫基並且於分子鏈中具有矽氫基的化合物、或者於分子鏈末端不具有矽氫基且僅於分子鏈中具有三個以上矽氫基的化合物等。 此處,作為於分子鏈末端不具有矽氫基且僅於分子鏈中具有三個以上矽氫基的化合物,例如可使用下述通式(2)所表示的化合物。於下述通式(2)中,n、m為任意的整數。 Next, as a crosslinking agent used as a structural material of the branched silicone (B), a crosslinking agent having three or more silyl groups in one molecule can be used as described above. As such a crosslinking agent, for example, a compound having a silyl group at one end or both ends of its molecular chain and having a silyl group in the molecular chain, or a compound having no silyl group at the molecular chain end and having only three or more silyl groups in the molecular chain can be listed. Here, as a compound having no silyl group at the molecular chain end and having only three or more silyl groups in the molecular chain, for example, a compound represented by the following general formula (2) can be used. In the following general formula (2), n and m are arbitrary integers.
[化3] [Chemistry 3]
所述交聯劑的矽氫基量較佳為0.015 mmol/g~0.4 mmol/g的範圍,更佳為0.02 mmol/g~0.11 mmol/g的範圍。The silyl content of the crosslinking agent is preferably in the range of 0.015 mmol/g to 0.4 mmol/g, and more preferably in the range of 0.02 mmol/g to 0.11 mmol/g.
作為如所述般的交聯劑,關於市售者,可較佳地使用信越化學公司製造的KF-9901、贏創(Evonik)公司製造的交聯劑(crosslinker)100等。As the crosslinking agent as described above, KF-9901 manufactured by Shin-Etsu Chemical Co., Ltd., Crosslinker 100 manufactured by Evonik Co., Ltd., and the like can be preferably used among commercially available ones.
而且,所述交聯劑相對於用作所述分支型矽酮(B)的結構材料的直鏈型兩末端乙烯基改質矽酮的莫耳比較佳為0.01~4,更佳為0.01~3。 藉由以此種比例使所述交聯劑反應,可良好地獲得所期望的分支型矽酮(B)。 Furthermore, the molar ratio of the crosslinking agent to the linear vinyl-modified silicone used as the structural material of the branched silicone (B) is preferably 0.01 to 4, and more preferably 0.01 to 3. By reacting the crosslinking agent at such a ratio, the desired branched silicone (B) can be obtained well.
再者,通常可使如所述般的於一分子中具有三個以上矽氫基的交聯劑、直鏈型兩末端乙烯基改質矽酮、以及鉑觸媒、延遲劑等一起,於5℃~35℃的環境下,使用葉片攪拌機、捏合機、行星式混合機、混合輥、雙軸螺桿式攪拌機等進行混練並攪拌,藉此使其反應來獲得所述分支型矽酮(B)。 此處,作為所述鉑觸媒,並無特別限定,可較佳地使用與作為本矽酮組成物的必需成分的鉑觸媒(C)相同者。另外,作為所述延遲劑,亦無特別限定,可較佳地使用與作為本矽酮組成物的必需成分的延遲劑(D)相同者。 再者,相對於所述直鏈型兩末端乙烯基改質矽酮100質量份,獲得所述分支型矽酮(B)時的所述鉑觸媒的比例較佳為0.00003質量份~0.005質量份,更佳為0.00009質量份~0.003質量份的範圍。 另外,相對於所述直鏈型兩末端乙烯基改質矽酮100質量份,獲得所述分支型矽酮(B)時的所述延遲劑的比例較佳為0.01質量份~1質量份,更佳為0.05質量份~0.5質量份的範圍。 Furthermore, the crosslinking agent having three or more silanol groups in one molecule, the linear two-terminal vinyl-modified silicone, the platinum catalyst, the delay agent, etc. are usually mixed and stirred at 5°C to 35°C using a blade stirrer, a kneader, a planetary mixer, a mixing roll, a twin-screw stirrer, etc., to obtain the branched silicone (B) by reacting. Here, the platinum catalyst is not particularly limited, and the same platinum catalyst as the essential component of the silicone composition (C) can be preferably used. In addition, the retarder is not particularly limited, and the same retarder (D) as the essential component of the silicone composition can be preferably used. Furthermore, the ratio of the platinum catalyst when obtaining the branched silicone (B) is preferably 0.00003 to 0.005 parts by mass, and more preferably 0.00009 to 0.003 parts by mass, relative to 100 parts by mass of the linear vinyl-modified silicone at both ends. In addition, the ratio of the retarder when obtaining the branched silicone (B) is preferably 0.01 to 1 part by mass, and more preferably 0.05 to 0.5 parts by mass, relative to 100 parts by mass of the linear two-terminal vinyl-modified silicone.
以所述方式獲得的分支型矽酮(B)於30℃下的黏度較佳為400 mPa·s~5000000 mPa·s。而且,所述黏度更佳為500 mPa·s~4000000 mPa·s,進而佳為1000 mPa·s~1000000 mPa·s。即,若為顯示所述般的黏度者,則衰減特性會進一步提高。再者,所述黏度是利用旋轉式流變儀(TA儀器(TA Instruments)公司製造,ARES-G2)於測定溫度30℃下測定而得的值。The viscosity of the branched silicone (B) obtained in the above manner at 30°C is preferably 400 mPa·s to 5000000 mPa·s. Moreover, the viscosity is more preferably 500 mPa·s to 4000000 mPa·s, and further preferably 1000 mPa·s to 1000000 mPa·s. That is, if the viscosity is as described above, the attenuation characteristics will be further improved. Furthermore, the viscosity is a value measured at a measurement temperature of 30°C using a rotational rheometer (manufactured by TA Instruments, ARES-G2).
而且,於本矽酮組成物中,直鏈型兩末端乙烯基改質矽酮(A)(構成分支型矽酮(B)的直鏈型兩末端乙烯基改質矽酮除外。以下相同)的質量a與構成分支型矽酮(B)的直鏈型兩末端乙烯基改質矽酮的質量b的比率(a:b)較佳為a:b=95:5~10:90的範圍,更佳為a:b=90:10~15:85的範圍,進而佳為a:b=80:20~20:80的範圍。就於本矽酮組成物所要求的耐負荷性、密接性兩者均獲得優異的結果的方面而言,理想的是以成為此種範圍的方式調配(A)與(B)。Furthermore, in the present silicone composition, the ratio (a:b) of the mass a of the linear vinyl-modified silicone (A) (excluding the linear vinyl-modified silicone constituting the branched silicone (B). The same shall apply hereinafter) to the mass b of the linear vinyl-modified silicone constituting the branched silicone (B) is preferably in the range of a:b=95:5 to 10:90, more preferably in the range of a:b=90:10 to 15:85, and further preferably in the range of a:b=80:20 to 20:80. In order to obtain excellent results in both load resistance and adhesion required of the present silicone composition, it is desirable to blend (A) and (B) in such a range.
《鉑觸媒(C)》 作為調配至本矽酮組成物中的所述鉑觸媒(C),例如可將鉑-烯烴錯合物、氯鉑酸、鉑的單質、載體(氧化鋁、二氧化矽、碳黑等)上擔載固體鉑而成者、鉑-乙烯基矽氧烷錯合物、鉑-膦錯合物、鉑-亞磷酸鹽錯合物等單獨使用或併用兩種以上。 另外,所述鉑觸媒(C)亦可使用溶解於二甲苯、甲苯等溶媒中者。此種物質中,關於市售品,可列舉蓋勒斯特(Gelest)公司製造的SIP6830等。 《Platinum Catalyst (C)》 As the platinum catalyst (C) to be formulated in the silicone composition, for example, platinum-olefin complex, chloroplatinic acid, platinum alone, solid platinum supported on a carrier (alumina, silica, carbon black, etc.), platinum-vinylsiloxane complex, platinum-phosphine complex, platinum-phosphite complex, etc. can be used alone or in combination of two or more. In addition, the platinum catalyst (C) can also be used in a solvent such as xylene and toluene. Among such substances, SIP6830 manufactured by Gelest can be cited as a commercial product.
而且,相對於所述直鏈型兩末端乙烯基改質矽酮(A)100質量份,所述鉑觸媒(C)的含有比例較佳為0.00003質量份~0.003質量份,更佳為0.00006質量份~0.0027質量份的範圍,進而佳為0.00009質量份~0.0024質量份的範圍。即,其原因在於,藉由將鉑觸媒(C)的含量抑制於此種範圍內,可於抑制本矽酮組成物的聚合反應((A)成分與(E)成分的聚合反應)急遽地進行的同時,充分地進行該聚合反應,可抑制聚合體的黏度產生偏差,從而獲得所期望的黏度(所期望的高衰減性)。 再者,所述鉑觸媒(C)的含有比例是對不包含所述般的二甲苯、甲苯等溶媒的鉑觸媒其本身的量進行規定者。 Moreover, the content ratio of the platinum catalyst (C) is preferably 0.00003 to 0.003 parts by mass, more preferably 0.00006 to 0.0027 parts by mass, and further preferably 0.00009 to 0.0024 parts by mass relative to 100 parts by mass of the linear two-terminal vinyl-modified silicone (A). That is, by suppressing the content of the platinum catalyst (C) within such a range, the polymerization reaction of the silicone composition (polymerization reaction of component (A) and component (E)) can be suppressed from proceeding rapidly while the polymerization reaction can be fully carried out, thereby suppressing the deviation of the viscosity of the polymer, thereby obtaining the desired viscosity (desired high attenuation). Furthermore, the content ratio of the platinum catalyst (C) is defined as the amount of the platinum catalyst itself excluding the above-mentioned solvents such as xylene and toluene.
《延遲劑(D)》 作為所述延遲劑(D),例如可將含有脂肪族不飽和鍵的化合物、有機磷化合物、有機硫化合物、含氮化合物、錫系化合物、有機過氧化物等單獨使用或併用兩種以上。 《Delay agent (D)》 As the delay agent (D), for example, a compound containing an aliphatic unsaturated bond, an organic phosphorus compound, an organic sulfur compound, a nitrogen-containing compound, a tin-based compound, an organic peroxide, etc. can be used alone or in combination of two or more.
作為所述含有脂肪族不飽和鍵的化合物,具體而言,可列舉:乙炔醇、1-乙炔基-1-環己醇等含有脂肪族不飽和鍵的醇類、馬來酸酐、馬來酸二甲酯等馬來酸酯類等。Specific examples of the aliphatic unsaturated bond-containing compound include alcohols containing aliphatic unsaturated bonds such as acetylene alcohol and 1-ethynyl-1-cyclohexanol, and maleic acid esters such as maleic anhydride and dimethyl maleate.
另外,作為所述有機磷化合物,具體而言,可列舉:三有機膦類、二有機膦類、有機膦類、三有機亞磷酸鹽類等。In addition, specific examples of the organic phosphorus compound include triorganic phosphines, diorganic phosphines, organic phosphines, triorganic phosphites, and the like.
另外,作為所述有機硫化合物,具體而言,可列舉:有機硫醇類、二有機硫醚類、硫化氫、苯並噻唑、噻唑、苯並噻唑二硫醚等。In addition, specific examples of the organic sulfur compound include organic mercaptans, diorganic sulfides, hydrogen sulfide, benzothiazole, thiazole, benzothiazole disulfide, and the like.
另外,作為所述含氮化合物,具體而言,可列舉:N,N,N',N'-四甲基乙二胺、N,N-二甲基乙二胺、N,N-二乙基乙二胺、N,N-二丁基乙二胺、N,N-二丁基-1,3-丙二胺、N,N-二甲基-1,3-丙二胺、N,N,N',N'-四乙基乙二胺、N,N-二丁基-1,4-丁二胺、2,2'-聯吡啶等。In addition, specific examples of the nitrogen-containing compound include N,N,N',N'-tetramethylethylenediamine, N,N-dimethylethylenediamine, N,N-diethylethylenediamine, N,N-dibutylethylenediamine, N,N-dibutyl-1,3-propylenediamine, N,N-dimethyl-1,3-propylenediamine, N,N,N',N'-tetraethylethylenediamine, N,N-dibutyl-1,4-butylenediamine, and 2,2'-bipyridine.
另外,作為所述錫系化合物,具體而言,可列舉鹵化亞錫二水合物、羧酸亞錫等。In addition, specific examples of the tin-based compound include stannous halogenide dihydrate and stannous carboxylate.
另外,作為所述有機過氧化物,具體而言,可列舉:二-第三丁基過氧化物、二枯基過氧化物、過氧化苯甲醯、過苯甲酸第三丁酯等。In addition, specific examples of the organic peroxide include di-t-butyl peroxide, dicumyl peroxide, benzoyl peroxide, t-butyl perbenzoate, and the like.
而且,於所述各種延遲劑中,就通用性的觀點而言,較佳為含有脂肪族不飽和鍵的化合物,更佳為含有脂肪族不飽和鍵的醇類,特佳為乙炔醇。Furthermore, among the various delay agents, compounds containing an aliphatic unsaturated bond are preferred from the viewpoint of versatility, alcohols containing an aliphatic unsaturated bond are more preferred, and acetylene alcohol is particularly preferred.
而且,相對於所述直鏈型兩末端乙烯基改質矽酮(A)100質量份,所述延遲劑(D)的含有比例較佳為0.01質量份~1質量份,更佳為0.05質量份~0.5質量份的範圍。即,其原因在於,藉由在所述範圍內加入延遲劑(D),可抑制直鏈型兩末端乙烯基改質矽酮(A)與鏈延長劑(E)的聚合反應急遽地進行,抑制聚合體的黏度產生偏差,從而獲得所期望的黏度(所期望的高衰減性)。Furthermore, the content ratio of the retarder (D) is preferably 0.01 to 1 part by mass, and more preferably 0.05 to 0.5 parts by mass, relative to 100 parts by mass of the linear vinyl-modified silicone (A). That is, by adding the retarder (D) within the above range, the polymerization reaction of the linear vinyl-modified silicone (A) and the chain extender (E) can be suppressed from proceeding rapidly, and the viscosity of the polymer can be suppressed from deviating, thereby obtaining the desired viscosity (desired high attenuation).
《鏈延長劑(E)》 作為所述鏈延長劑(E),例如可列舉下述通式(3)所表示般的於分子鏈的兩末端具有矽氫基(Si-H基)的低分子量的化合物。 《Chain extender (E)》 As the chain extender (E), for example, there can be cited low molecular weight compounds having silane groups (Si-H groups) at both ends of the molecular chain as represented by the following general formula (3).
[化4] [Chemistry 4]
於所述通式(3)中,n較佳為1~100的整數,更佳為1~90的整數,進而佳為1~80的整數。即,其原因在於,若n的值過小,則反應會變得過快,若n的值過大,則反應會變得過慢。In the general formula (3), n is preferably an integer of 1 to 100, more preferably an integer of 1 to 90, and further preferably an integer of 1 to 80. That is, if the value of n is too small, the reaction becomes too fast, and if the value of n is too large, the reaction becomes too slow.
而且,於本矽酮組成物中,所述鏈延長劑(E)相對於所述直鏈型兩末端乙烯基改質矽酮(A)的莫耳比較佳為0.01~4,更佳為0.1~2。 即,其原因在於,藉由以如所述般的比例調配所述直鏈型兩末端乙烯基改質矽酮(A)與鏈延長劑(E),可獲得所期望的黏性。 Furthermore, in the present silicone composition, the molar ratio of the chain extender (E) relative to the linear vinyl-modified silicone (A) is preferably 0.01 to 4, and more preferably 0.1 to 2. That is, the reason is that the desired viscosity can be obtained by mixing the linear vinyl-modified silicone (A) and the chain extender (E) in the above-mentioned ratio.
《其他成分》 於本矽酮組成物中,除調配所述(A)~(E)各成分以外,亦能夠於不損害本發明的效果的範圍內,視需要調配填料、矽酮以外的液狀聚合物、消泡劑、流變控制劑、內添加接著劑、偶合劑等各種添加劑。 《Other ingredients》 In addition to the above-mentioned components (A) to (E), various additives such as fillers, liquid polymers other than silicone, defoamers, rheology control agents, internal adhesives, coupling agents, etc. can be added to the silicone composition as needed within the scope that does not impair the effects of the present invention.
作為所述填料,例如可列舉:碳黑、二氧化矽、滑石、碳酸鈣、碳纖維、碳奈米管等,該些可單獨使用或併用兩種以上。Examples of the filler include carbon black, silica, talc, calcium carbonate, carbon fiber, carbon nanotube, etc. These may be used alone or in combination of two or more.
相對於所述直鏈型兩末端乙烯基改質矽酮(A)100質量份,適宜調配至本矽酮組成物中的所述填料的含有比例較佳為1質量份~100質量份的範圍,更佳為5質量份~50質量份的範圍。若為此種含有比例,則衰減特性會進一步提高。The content ratio of the filler appropriately formulated into the silicone composition is preferably in the range of 1 to 100 parts by mass, and more preferably in the range of 5 to 50 parts by mass, relative to 100 parts by mass of the linear two-terminal vinyl-modified silicone (A). If it is such a content ratio, the attenuation characteristics will be further improved.
作為所述的矽酮以外的液狀聚合物,例如可列舉:液狀異戊二烯橡膠(液狀IR)、液狀丁二烯橡膠(液狀BR)、液狀苯乙烯-丁二烯橡膠(液狀SBR)、液狀苯乙烯-異戊二烯橡膠(液狀SI)、液狀苯乙烯-乙烯-丙烯橡膠(液狀SEP)、液狀異戊二烯-丁二烯橡膠(液狀IR-BR)等,該些可單獨使用或併用兩種以上。Examples of liquid polymers other than silicone include liquid isoprene rubber (liquid IR), liquid butadiene rubber (liquid BR), liquid styrene-butadiene rubber (liquid SBR), liquid styrene-isoprene rubber (liquid SI), liquid styrene-ethylene-propylene rubber (liquid SEP), liquid isoprene-butadiene rubber (liquid IR-BR), etc. These may be used alone or in combination of two or more.
相對於所述直鏈型兩末端乙烯基改質矽酮(A)100質量份,適宜調配至本矽酮組成物中的所述液狀聚合物的含有比例較佳為1質量份~100質量份的範圍,更佳為5質量份~50質量份的範圍。若為此種含有比例,則衰減特性會進一步提高。The content ratio of the liquid polymer appropriately formulated into the silicone composition is preferably in the range of 1 to 100 parts by mass, and more preferably in the range of 5 to 50 parts by mass, relative to 100 parts by mass of the linear two-terminal vinyl-modified silicone (A). If it is such a content ratio, the attenuation characteristics will be further improved.
例如可將所述(A)成分~(E)成分、以及視需要的其他成分等於5℃~35℃的環境下,使用葉片攪拌機、捏合機、行星式混合機、混合輥、雙軸螺桿式攪拌機等進行混練並攪拌,藉此製備本矽酮組成物。再者,作為所述(B)的分支型矽酮理想的是於藉由先前所述的方法預先合成後,與所述(A)成分、(C)成分~(E)成分等一起加入。 以所述方式獲得的本矽酮組成物即便在常溫(5℃~35℃)下亦進行反應(高分子量化),成為黏性流體,因此能夠於所述製備後不久的黏度低的狀態下填充至減震壁等減震阻尼器中,於減震阻尼器內在常溫下進行高分子量化。而且,於進行所述填充時,不需要如先前般的暫時加熱而降低黏度後進行填充等工夫,因此於施工時有利。 另外,如所述般製備的本矽酮組成物於所述製備後不久,根據氣溫的不同,有12小時左右不會進行高分子量化(不會成為黏性流體),因此於該情況下,亦能夠將預先製備的所述矽酮組成物運送至施工現場而使用。 再者,所述矽酮組成物藉由在5℃~35℃環境下靜置1小時~24小時,(A)成分與(E)成分的聚合反應(二維交聯反應)完成而進行高分子量化,從而成為黏性流體(減震阻尼器用黏性流體。以下表示為「本黏性流體」)。 For example, the silicone composition can be prepared by kneading and stirring the components (A) to (E) and other components as needed at 5°C to 35°C using a blade stirrer, kneader, planetary mixer, mixing roll, twin-screw stirrer, etc. Furthermore, the branched silicone (B) is preferably pre-synthesized by the method described above and then added together with the components (A), (C) to (E), etc. The silicone composition obtained in the above manner reacts (becomes highly molecular) even at room temperature (5°C to 35°C) and becomes a viscous fluid. Therefore, it can be filled into a vibration damper such as a vibration damper wall in a low viscosity state immediately after the above preparation, and the molecular weight can be increased at room temperature in the vibration damper. Moreover, when performing the above filling, there is no need for the previous work of temporarily heating to reduce the viscosity and then filling, which is advantageous during construction. In addition, the silicone composition prepared as described above will not be highly molecular (will not become a viscous fluid) for about 12 hours immediately after the above preparation, depending on the temperature. Therefore, in this case, the silicone composition prepared in advance can also be transported to the construction site for use. Furthermore, the silicone composition is placed in an environment of 5°C to 35°C for 1 hour to 24 hours, and the polymerization reaction (two-dimensional crosslinking reaction) of component (A) and component (E) is completed and the molecular weight is increased, thereby becoming a viscous fluid (viscous fluid for shock absorbers. hereinafter referred to as "this viscous fluid").
此處,本黏性流體於30℃下的黏度較佳為6000 Pa·s~100000 Pa·s。而且,所述黏度更佳為6500 Pa·s~80000 Pa·s,進而佳為7000 Pa·s~60000 Pa·s。即,若為顯示所述般的黏度者,則衰減特性會進一步提高。再者,所述黏度是利用旋轉式流變儀(TA儀器(TA Instruments)公司製造,ARES-G2)於測定溫度30℃下測定而得的值。Here, the viscosity of the viscous fluid at 30°C is preferably 6000 Pa·s to 100000 Pa·s. Moreover, the viscosity is more preferably 6500 Pa·s to 80000 Pa·s, and further preferably 7000 Pa·s to 60000 Pa·s. That is, if the viscosity is as described above, the attenuation characteristics will be further improved. Furthermore, the viscosity is a value measured at a measurement temperature of 30°C using a rotational rheometer (manufactured by TA Instruments, ARES-G2).
另外,本黏性流體中的(A)成分與(E)成分的聚合反應產物的重量平均分子量(Mw)較佳為80000~2000000,更佳為100000~1800000。即,若為顯示所述般的重量平均分子量者,則衰減特性會進一步提高。 另外,就更有效果地發揮本發明的效果的觀點而言,所述聚合反應產物的分子量分佈(重量平均分子量(Mw)/數量平均分子量(Mn))較佳為1.5~40,更佳為2~30。 再者,所述重量平均分子量(Mw)是藉由標準聚苯乙烯分子量換算而得的重量平均分子量,藉由在高效液相層析儀(沃特世(Waters)公司製造,「沃特世(Waters)2695(主體)」與「沃特世(Waters)2414(檢測器)」)中串聯使用管柱:索得克斯(Shodex)GPC KF-806L(排除界限分子量:2×10 7、分離範圍:100~2×10 7、理論段數:10000段/根、填充劑材質:苯乙烯-二乙烯基苯共聚物、填充劑粒徑:10 μm)此三根來測定。另外,數量平均分子量(Mn)亦利用相同的方法來測定,由所述數量平均分子量(Mn)與重量平均分子量(Mw),求出所述聚合反應產物的分子量分佈(重量平均分子量(Mw)/數量平均分子量(Mn))。 In addition, the weight average molecular weight (Mw) of the polymerization product of the components (A) and (E) in the present viscous fluid is preferably 80,000 to 2,000,000, and more preferably 100,000 to 1,800,000. That is, if the weight average molecular weight is as described above, the attenuation characteristics will be further improved. In addition, from the viewpoint of more effectively exerting the effects of the present invention, the molecular weight distribution (weight average molecular weight (Mw)/number average molecular weight (Mn)) of the polymerization product is preferably 1.5 to 40, and more preferably 2 to 30. The weight average molecular weight (Mw) is the weight average molecular weight converted from the standard polystyrene molecular weight, and is measured by using three columns in series: Shodex GPC KF-806L (exclusion cutoff molecular weight: 2×10 7 , separation range: 100 to 2×10 7 , theoretical number of steps: 10,000 steps/column, filler material: styrene-divinylbenzene copolymer, filler particle size: 10 μm) in a high performance liquid chromatography (manufactured by Waters Corporation, “Waters 2695 (main body)” and “Waters 2414 (detector)”). In addition, the number average molecular weight (Mn) is also measured by the same method, and the molecular weight distribution of the polymerization product is calculated from the number average molecular weight (Mn) and the weight average molecular weight (Mw) (weight average molecular weight (Mw)/number average molecular weight (Mn)).
而且,作為填充有如所述般製備的本黏性流體而成的減震阻尼器(以下,表示為「本減震阻尼器」),例如可列舉圖1所示的減震壁等。Furthermore, as a vibration-absorbing damper filled with the present viscous fluid prepared as described above (hereinafter referred to as "the present vibration-absorbing damper"), for example, there can be cited the vibration-absorbing wall shown in FIG. 1 .
圖1是示意性地表示減震壁的一例的立體圖。而且,圖示的減震壁1是於垂下壁2與立起壁3的間隙填充有本黏性流體而成者,所述垂下壁2包括固定於上層的建築結構體的骨架而垂下、並與下層的建築結構體的骨架分離的一張或多張板,所述立起壁3包括與該垂下壁2平行地固定於下層的建築結構體的骨架以包圍垂下壁2的方式立起、並與上層的建築結構體的骨架分離的多張板。 再者,於圖1所示的結構的減震壁1的情況下,就所述減震壁1的製造步驟的觀點而言,較佳為藉由在所述垂下壁2與立起壁3的間隙中填充本矽酮組成物後進行聚合反應來製成本黏性流體。 FIG1 is a perspective view schematically showing an example of a vibration-absorbing wall. The vibration-absorbing wall 1 shown in the figure is formed by filling the gap between the hanging wall 2 and the standing wall 3 with the viscous fluid. The hanging wall 2 includes one or more plates that are fixed to the frame of the building structure of the upper layer and hang down and are separated from the frame of the building structure of the lower layer. The standing wall 3 includes a plurality of plates that are fixed to the frame of the building structure of the lower layer in parallel with the hanging wall 2 and stand up in a manner surrounding the hanging wall 2 and are separated from the frame of the building structure of the upper layer. Furthermore, in the case of the shock-absorbing wall 1 of the structure shown in FIG1 , from the perspective of the manufacturing steps of the shock-absorbing wall 1 , it is preferable to fill the gap between the hanging wall 2 and the standing wall 3 with the silicone composition and then perform a polymerization reaction to produce the viscous fluid.
作為構成所述減震壁1中的垂下壁2及立起壁3的材料,除可使用鋼板以外,可使用纖維強化樹脂板。作為所述纖維強化樹脂板,例如可使用以不飽和聚酯樹脂、環氧樹脂等熱硬化性樹脂、或聚醯胺、聚丙烯、丙烯腈-丁二烯-苯乙烯(Acrylonitrile Butadiene Styrene,ABS)樹脂等熱塑性樹脂為基質樹脂,並於其中分散有玻璃纖維、碳纖維、硼纖維、氧化鋁纖維、醯胺纖維等而成的樹脂板。As a material constituting the hanging wall 2 and the standing wall 3 in the shock-absorbing wall 1, a fiber-reinforced resin sheet can be used in addition to a steel sheet. As the fiber-reinforced resin sheet, for example, a resin sheet can be used which uses a thermosetting resin such as an unsaturated polyester resin, an epoxy resin, or a thermoplastic resin such as a polyamide, a polypropylene, or an acrylonitrile-butadiene-styrene (ABS) resin as a base resin, and in which glass fibers, carbon fibers, boron fibers, alumina fibers, amide fibers, etc. are dispersed.
進而,作為所述減震壁1的具體的結構,亦可為如下結構:沿著減震壁1的水平方向及鉛垂方向空出規定的間隔,開設將垂下壁2與立起壁3貫通的螺栓孔(未圖示),於該些兩壁的螺栓孔中插通有保持兩壁間的間隙的間隙調整螺栓,利用螺母進行螺合,並根據間隙調整螺栓對螺母的螺合長度來對兩壁間的間隙的大小進行調整。Furthermore, the specific structure of the shock-absorbing wall 1 may be as follows: bolt holes (not shown) are provided at prescribed intervals along the horizontal and vertical directions of the shock-absorbing wall 1 to connect the hanging wall 2 and the standing wall 3, gap adjusting bolts for maintaining the gap between the two walls are inserted into the bolt holes of the two walls, which are screwed together with nuts, and the size of the gap between the two walls is adjusted according to the screwing length of the gap adjusting bolts on the nuts.
另外,本矽酮組成物向所述減震壁1內的填充可於將垂下壁2建造在立起壁3之前、或建造在立起壁3之後進行,其方法並無特別限定。作為建造前的填充方法,例如有如下方法:自立起壁3的上部向壁內安裝長的流入管而流入並填充本矽酮組成物的方法、於立起壁3的下部設置多個注入口(未圖示),並利用灌漿注入機等泵自該注入口填充本矽酮組成物的方法等。 藉由該些方法,如圖2所示,於立起壁3內完成本矽酮組成物(矽酮組成物4)的填充後,將垂下壁2建造在立起壁3內,所述矽酮組成物4的聚合反應完成(成為黏性流體),藉此完成所述減震壁1。 再者,關於填充的時期,可於預先填充矽酮組成物4並搬入至施工現場、或者於施工現場製備並填充矽酮組成物4等任意的時期進行。 另外,於在將垂下壁2建造在立起壁3後填充矽酮組成物4的情況下,較佳為應用在立起壁3的下部設置注入口並注入的方法。 In addition, the filling of the silicone composition into the shock-absorbing wall 1 can be carried out before the hanging wall 2 is built on the upright wall 3 or after the hanging wall 2 is built on the upright wall 3, and the method is not particularly limited. As the filling method before construction, there are, for example, the following methods: a method of installing a long inlet pipe from the upper part of the upright wall 3 into the wall to flow and fill the silicone composition, a method of providing multiple injection ports (not shown) at the lower part of the upright wall 3, and using a pump such as a grouting injection machine to fill the silicone composition from the injection ports, etc. By these methods, as shown in FIG. 2, after the filling of the silicone composition (silicone composition 4) in the upright wall 3 is completed, the hanging wall 2 is built in the upright wall 3, and the polymerization reaction of the silicone composition 4 is completed (becoming a viscous fluid), thereby completing the shock-absorbing wall 1. Furthermore, regarding the timing of filling, the silicone composition 4 can be filled in advance and carried to the construction site, or the silicone composition 4 is prepared and filled at the construction site. In addition, when the silicone composition 4 is filled after the vertical wall 2 is built on the vertical wall 3, it is better to use a method of setting an injection port at the bottom of the vertical wall 3 and injecting.
本減震阻尼器並不限定於如所述般圖示的形狀的減震阻尼器,只要是使用本矽酮組成物、或本黏性流體者,則可列舉各種形狀的減震阻尼器。 而且,本減震阻尼器作為土木用、建築用的減震阻尼器、家電用或電子設備用的減震阻尼器等,可發揮優異的功能。 其中,作為橋樑或大廈等大型建築物中所使用的減震阻尼器、特別是作為高樓大廈用減震阻尼器,可發揮更優異的功能。 [實施例] The present seismic damper is not limited to the seismic damper of the shape shown in the figure, and various shapes of seismic dampers can be listed as long as the present silicone composition or the present viscous fluid is used. Moreover, the present seismic damper can play an excellent role as a seismic damper for civil engineering, construction, home appliances or electronic equipment, etc. Among them, as a seismic damper used in large buildings such as bridges or buildings, especially as a seismic damper for high-rise buildings, it can play a more excellent role. [Example]
接下來,與比較例一併來說明實施例。其中,本發明只要不超出其主旨,則並不限定於該些實施例。Next, embodiments are described together with comparative examples. However, the present invention is not limited to these embodiments as long as it does not exceed the gist of the present invention.
首先,於實施例及比較例之前,準備了下述所示的材料。再者,下述所示的材料所示的各數值是基於所述測定方法而測定的值。First, before the Examples and Comparative Examples, the following materials were prepared. Note that the values shown for the following materials are values measured based on the above-mentioned measurement methods.
〔兩末端乙烯基改質矽酮(i)〕 下述通式(1)所表示的n=100~300的兩末端乙烯基改質矽酮(珀利瑪(Polymer)VS 2000(30℃下的黏度:2000 mPa·s),贏創(Evonik)公司製造) [Silicone modified with vinyl groups at both ends (i)] Silicone modified with vinyl groups at both ends and n=100 to 300 represented by the following general formula (1) (Polymer VS 2000 (viscosity at 30°C: 2000 mPa·s), manufactured by Evonik)
[化5] [Chemistry 5]
〔兩末端乙烯基改質矽酮(ii)〕 所述通式(1)所表示的n=500~800的兩末端乙烯基改質矽酮(珀利瑪(Polymer)VS 10000(30℃下的黏度:10000 mPa·s),贏創(Evonik)公司製造) [Silicone modified with vinyl groups at both ends (ii)] Silicone modified with vinyl groups at both ends and having n=500 to 800 represented by the general formula (1) (Polymer VS 10000 (viscosity at 30°C: 10000 mPa·s), manufactured by Evonik)
〔兩末端乙烯基改質矽酮(iii)〕 所述通式(1)所表示的n=1100~1400的兩末端乙烯基改質矽酮(珀利瑪(Polymer)VS 65000(30℃下的黏度:65000 mPa·s),贏創(Evonik)公司製造) [Silicone modified with vinyl groups at both ends (iii)] Silicone modified with vinyl groups at both ends and having n=1100 to 1400 represented by the general formula (1) (Polymer VS 65000 (viscosity at 30°C: 65000 mPa·s), manufactured by Evonik)
〔兩末端乙烯基改質矽酮(iv)〕 所述通式(1)所表示的n=1350~1650的兩末端乙烯基改質矽酮(珀利瑪(Polymer)VS 100000(30℃下的黏度:100000 mPa·s),贏創(Evonik)公司製造) [Silicone modified with vinyl groups at both ends (iv)] Silicone modified with vinyl groups at both ends and having n=1350 to 1650 represented by the general formula (1) (Polymer VS 100000 (viscosity at 30°C: 100000 mPa·s), manufactured by Evonik)
〔鉑觸媒〕 SIP6830,蓋勒斯特(Gelest)公司製造 [Platinum Catalyst] SIP6830, manufactured by Gelest
〔延遲劑〕 乙炔醇(薩非諾爾(Surfynol)61,日信化學工業公司製造) [Delay agent] Acetylene alcohol (Surfynol 61, manufactured by Nissin Chemical Industries, Ltd.)
〔鏈延長劑〕 下述通式(3)所表示的n=1~18的鏈延長劑(DMS-H11,贏創(Evonik)公司製造) [Chain extender] Chain extender represented by the following general formula (3) with n=1 to 18 (DMS-H11, manufactured by Evonik)
[化6] [Chemistry 6]
〔交聯劑(i)〕 下述通式(2)所表示的矽氫基量7 mmol/g的交聯劑(KF-9901,信越化學公司製造) [Crosslinking agent (i)] Crosslinking agent represented by the following general formula (2) with a silyl group content of 7 mmol/g (KF-9901, manufactured by Shin-Etsu Chemical Co., Ltd.)
[化7] [Chemistry 7]
〔交聯劑(ii)〕 所述通式(2)所表示的矽氫基量8 mmol/g的交聯劑(交聯劑(crosslinker)100,贏創(Evonik)公司製造) [Crosslinker (ii)] Crosslinker represented by the general formula (2) with a silane group content of 8 mmol/g (crosslinker 100, manufactured by Evonik)
[實施例1~實施例11、比較例1、比較例2] 首先,將下述表1所示的各材料以該表所示的比例調配,於30℃的環境下,利用葉片攪拌機進行攪拌使其發生交聯反應,藉此獲得分支型矽酮(I)~分支型矽酮(V)。 再者,下述表1所示的交聯劑的調配量是以交聯劑相對於兩末端乙烯基改質矽酮的莫耳比來記載。另外,下述表1所示的鉑觸媒的比例表示除去藥劑(SIP6830)中包含的溶媒等後的鉑觸媒本身的含有比例。 另外,下述表1所示的分支型矽酮(I)~分支型矽酮(V)的黏度是基於所述測定方法而測定的30℃環境下的值。 [Example 1 to Example 11, Comparative Example 1, Comparative Example 2] First, the materials shown in Table 1 below were mixed in the proportions shown in the table, and stirred with a blade stirrer at 30°C to cause a crosslinking reaction, thereby obtaining branched silicone (I) to branched silicone (V). In addition, the amount of the crosslinking agent shown in Table 1 below is recorded as the molar ratio of the crosslinking agent to the silicone modified with vinyl groups at both ends. In addition, the proportion of the platinum catalyst shown in Table 1 below represents the content ratio of the platinum catalyst itself after removing the solvent etc. contained in the agent (SIP6830). In addition, the viscosity of branched silicone (I) to branched silicone (V) shown in Table 1 below is the value measured at 30°C based on the above-mentioned measurement method.
[表1]
接下來,將所述各材料及所述表1所示的分支型矽酮(I)~分支型矽酮(V)以後述的表2及表3所示的比例調配,於30℃的環境下,利用葉片攪拌機進行攪拌,藉此製備實施例及比較例的矽酮組成物。 再者,後述的表2及表3所示的鏈延長劑(E)的調配量是以鏈延長劑(E)相對於兩末端乙烯基改質矽酮(A)的莫耳比來記載。另外,後述的表2及表3所示的鉑觸媒(C)的含有比例表示除去藥劑(SIP6830)中包含的溶媒等後的鉑觸媒本身的含有比例。 Next, the above materials and the branched silicone (I) to branched silicone (V) shown in Table 1 are mixed in the ratios shown in Tables 2 and 3 described below, and stirred with a blade stirrer at 30°C to prepare silicone compositions of the embodiments and comparative examples. Furthermore, the amount of the chain extender (E) mixed shown in Tables 2 and 3 described below is recorded as the molar ratio of the chain extender (E) to the silicone (A) with vinyl groups at both ends. In addition, the content ratio of the platinum catalyst (C) shown in Tables 2 and 3 described below represents the content ratio of the platinum catalyst itself after removing the solvent etc. contained in the reagent (SIP6830).
然後,使用實施例及比較例的矽酮組成物,測定下述各特性,並按照下述基準進行評價。將該些結果一併示於後述的表2及表3。Then, the following properties were measured using the silicone compositions of the examples and comparative examples, and evaluated according to the following criteria. These results are shown together in Tables 2 and 3 described below.
《黏度》 使所述製備的矽酮組成物於30℃下進行聚合反應一天後,利用旋轉式流變儀(TA儀器(TA Instruments)公司製造,ARES-G2)於測定溫度30℃下測定黏度。 "Viscosity" After the prepared silicone composition was polymerized at 30°C for one day, the viscosity was measured at a measurement temperature of 30°C using a rotational rheometer (manufactured by TA Instruments, ARES-G2).
《溫度依存性》 使所述製備的矽酮組成物於30℃下進行聚合反應一天後,利用旋轉式流變儀(TA儀器(TA Instruments)公司製造,ARES-G2)於測定溫度10℃下測定黏度。然後,於測定溫度30℃下亦進行所述測定,算出「測定溫度10℃下的黏度/測定溫度30℃下的黏度」。 《Temperature dependence》 After the prepared silicone composition was polymerized at 30°C for one day, the viscosity was measured at a measurement temperature of 10°C using a rotational rheometer (ARES-G2 manufactured by TA Instruments). Then, the above measurement was also performed at a measurement temperature of 30°C, and "viscosity at a measurement temperature of 10°C/viscosity at a measurement temperature of 30°C" was calculated.
《動態彈性係數》 使所述製備的矽酮組成物於30℃下進行聚合反應一天後,利用旋轉式流變儀(TA儀器(TA Instruments)公司製造,ARES-G2)於30℃下進行黏彈性測定,求出此時的動態彈性係數的最大值。 《Dynamic elastic coefficient》 After the prepared silicone composition was polymerized at 30°C for one day, the viscoelasticity was measured at 30°C using a rotational rheometer (ARES-G2, manufactured by TA Instruments) to determine the maximum value of the dynamic elastic coefficient at that time.
《密接性》 準備各一張直徑30 mm、厚度2 mm的圓板狀的金屬配件、以及50 mm見方的金屬配件,以夾在該些兩張金屬配件之間的方式,以厚度1 mm的方式填充所述製備的矽酮組成物,並於30℃下靜置一天,促進所述矽酮組成物的聚合反應。之後,利用測力計(依夢達(Imada)公司製造,普及型機械測力計),向剝離方向拉伸所述兩張金屬配件。然後,按照下述基準,對剝離後的金屬配件的剝離面進行目視評價。 ○:於剝離面的50%以上,確認到所述矽酮組成物的聚合反應產物的材料破壞。 ×:確認到界面剝離,或者剝離面未滿50%時所述矽酮組成物的聚合反應產物的材料破壞。 《Adhesion》 Prepare a circular plate-shaped metal fitting with a diameter of 30 mm and a thickness of 2 mm, and a metal fitting with a square of 50 mm, and fill the prepared silicone composition with a thickness of 1 mm in a manner of sandwiching between the two metal fittings, and leave it at 30°C for one day to promote the polymerization reaction of the silicone composition. After that, use a dynamometer (manufactured by Imada, a popular mechanical dynamometer) to stretch the two metal fittings in the peeling direction. Then, visually evaluate the peeled surface of the metal fitting after peeling according to the following criteria. ○: Material damage of the polymerization reaction product of the silicone composition is confirmed on more than 50% of the peeled surface. ×: Interface peeling is confirmed, or when the peeling area is less than 50%, the material of the polymerization reaction product of the silicone composition is destroyed.
<綜合評價> 關於所述各測定的結果,將全部滿足黏度為6000 Pa·s~100000 Pa·s、溫度依存性為2以下、動態彈性係數為5000 Pa以上、密接性評價為「○」等要件者設為綜合評價「○」,將不滿足該些要件之一者設為綜合評價「×」。 <Comprehensive evaluation> Regarding the results of the above-mentioned measurements, those that satisfy all the requirements such as viscosity of 6000 Pa·s to 100000 Pa·s, temperature dependence of 2 or less, dynamic elastic coefficient of 5000 Pa or more, and adhesion evaluation of "○" are given a comprehensive evaluation of "○", and those that do not satisfy any of these requirements are given a comprehensive evaluation of "×".
[表2]
[表3]
由所述表2及表3的結果可知,實施例的試樣中由於聚合反應完成後的黏性流體的黏度高(6000 Pa·s~100000 Pa·s),故衰減性均高,進而由於所述黏性流體的溫度依存性亦低,故由溫度變化引起的黏度變化均少。而且,實施例的試樣均顯示出高的動態彈性係數,均顯示出良好的密接性。From the results in Table 2 and Table 3, it can be seen that the samples of the examples have high attenuation properties because the viscosity of the viscous fluid after the polymerization reaction is completed is high (6000 Pa·s to 100000 Pa·s), and further, because the temperature dependence of the viscous fluid is also low, the viscosity change caused by temperature change is small. In addition, the samples of the examples all show high dynamic elastic coefficients and good adhesion.
相對於此,比較例1的試樣由於不含分支型矽酮,因此結果未顯示出所期望的動態彈性係數,亦無法獲得密接性。比較例2的試樣僅為分支型矽酮,不包含直鏈型矽酮,但結果該試樣亦未顯示出所期望的動態彈性係數。 [產業上之可利用性] In contrast, the sample of Comparative Example 1 did not contain branched silicone, so the results did not show the expected dynamic elastic coefficient and could not obtain close adhesion. The sample of Comparative Example 2 was only branched silicone and did not contain straight-chain silicone, but the results of this sample also did not show the expected dynamic elastic coefficient. [Industrial Applicability]
本發明的減震阻尼器用矽酮組成物、減震阻尼器用黏性流體藉由用於土木用、建築用的減震阻尼器、家電用或電子設備用的減震阻尼器等,可發揮優異的功能。其中,藉由用於橋樑或大廈等大型建築物中所使用的減震阻尼器、特別是高樓大廈用減震阻尼器,可發揮更優異的功能。 另外,使用了本發明的減震阻尼器用矽酮組成物或減震阻尼器用黏性流體的建築用的減震壁等減震裝置或抗震裝置、家電用或電子設備用的減震材料或衝擊吸收材料、汽車用的減震材料或衝擊吸收材料等亦能夠用作本發明的減震阻尼器。 The silicone composition for vibration dampers and the viscous fluid for vibration dampers of the present invention can exert excellent functions by being used in vibration dampers for civil engineering, construction, home appliances or electronic equipment, etc. Among them, by being used in vibration dampers used in large buildings such as bridges or buildings, especially vibration dampers for high-rise buildings, they can exert more excellent functions. In addition, the silicone composition for vibration dampers or viscous fluid for vibration dampers of the present invention, such as vibration damping walls for buildings or vibration-resistant devices, vibration damping materials or shock absorbing materials for home appliances or electronic equipment, and vibration damping materials or shock absorbing materials for automobiles can also be used as vibration dampers of the present invention.
1:減震壁 2:垂下壁 3:立起壁 4:矽酮組成物 11:直鏈結構的矽酮 12:分支型矽酮 1: Shock-absorbing wall 2: Vertical wall 3: Vertical wall 4: Silicone composition 11: Straight chain silicone 12: Branched silicone
圖1是示意性地表示減震壁的一例的立體圖。 圖2是表示所述減震壁的組裝前的狀態的立體圖。 圖3是示意性地表示聚合物的分散狀況的說明圖。 FIG1 is a perspective view schematically showing an example of a vibration-absorbing wall. FIG2 is a perspective view showing the vibration-absorbing wall before assembly. FIG3 is an explanatory view schematically showing the dispersion state of a polymer.
2:垂下壁 2: Hang down the wall
3:立起壁 3: Set up the wall
4:矽酮組成物 4: Silicone composition
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