TWI843846B - Laser processing device - Google Patents
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- TWI843846B TWI843846B TW109114265A TW109114265A TWI843846B TW I843846 B TWI843846 B TW I843846B TW 109114265 A TW109114265 A TW 109114265A TW 109114265 A TW109114265 A TW 109114265A TW I843846 B TWI843846 B TW I843846B
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- 230000002950 deficient Effects 0.000 claims description 15
- 239000004973 liquid crystal related substance Substances 0.000 claims description 8
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- 238000005401 electroluminescence Methods 0.000 description 9
- 230000006870 function Effects 0.000 description 6
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- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 1
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
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Abstract
在處理大型之被處理物的雷射處理裝置中,為了使從照射單元照射於被處理物的雷射光之照射位置及/或焦點正確地對準於被處理物上之目標位置,而構成一種實施朝向被處理物(O)上之目標位置照射雷射光(L)來進行處理的雷射處理裝置(1),其具備:照射單元(2),其是具有用以將雷射光(L)朝向被處理物(O)上之目標位置聚光的物鏡;及第一XY載置台(3),其是可以使前述照射單元(2)之至少物鏡(24)對被處理物(O)相對地朝向與雷射光軸正交或大致正交的二維方向移動;以及第二XY載置台(7),其是可以使前述照射單元(2)及前述第一XY載置台(3)對被處理物(O)相對地朝向與雷射光軸正交或大致正交的二維方向移動,且往二維方向的可動範圍是比第一XY載置台(3)更大。In a laser processing device for processing a large object to be processed, in order to make the irradiation position and/or focus of the laser light irradiated from the irradiation unit to the object to be processed correctly aligned with the target position on the object to be processed, a laser processing device (1) is constructed to perform processing by irradiating the laser light (L) toward the target position on the object to be processed (O), which comprises: an irradiation unit (2) having an objective lens for focusing the laser light (L) toward the target position on the object to be processed (O); and a first XY A loading table (3) which can move at least the objective lens (24) of the aforementioned irradiation unit (2) relative to the object to be processed (O) in a two-dimensional direction which is orthogonal or substantially orthogonal to the laser light axis; and a second XY loading table (7) which can move the aforementioned irradiation unit (2) and the aforementioned first XY loading table (3) relative to the object to be processed (O) in a two-dimensional direction which is orthogonal or substantially orthogonal to the laser light axis, and the movable range in the two-dimensional direction is larger than that of the first XY loading table (3).
Description
本發明係關於一種雷射處理裝置,用以實施朝向被處理物上之目標位置照射雷射光而進行的處理。The present invention relates to a laser processing device for implementing processing by irradiating laser light toward a target position on a processed object.
作為雷射處理裝置之一種,係可以列舉對液晶顯示器模組、電漿顯示器模組、有機EL(Electro-Luminescence;電致發光)顯示器模組、無機EL顯示器模組、微發光二極體(Micro LED)顯示器模組、透明導電膜基板或彩色濾光片(color filter)等所產生的不良(或缺陷)部位照射雷射光的雷射修補裝置(laser repair device)(例如,參照下述專利文獻)。As a type of laser processing device, there can be cited a laser repair device that irradiates defective (or defective) parts of a liquid crystal display module, a plasma display module, an organic EL (Electro-Luminescence) display module, an inorganic EL display module, a micro-LED display module, a transparent conductive film substrate, or a color filter with laser light (for example, refer to the following patent document).
在雷射修補裝置方面,係被要求以被處理物上之不良部位作為目標位置,並對該目標位置正確地照射雷射光。當照射雷射光之位置或雷射光之焦點從目標位置些微偏離時,只要無法適當地修正不良部位,就很有可能使與不良部位鄰接的正常之元件或電路損傷。In the case of laser repair equipment, it is required to use the defective part on the object to be processed as the target position and accurately irradiate the laser light to the target position. If the position of the irradiated laser light or the focus of the laser light deviates slightly from the target position, as long as the defective part cannot be properly corrected, it is very likely that the normal components or circuits adjacent to the defective part will be damaged.
雷射光對被處理物的照射位置之操作,通常是透過XY載置台(stage)來進行。亦即,使XY載置台支撐具有將雷射光聚光於被處理物之物鏡(objective lens)的照射單元,且使照射單元對被處理物相對地朝向X軸方向及Y軸方向移動,藉此定位以使雷射光能照射於目標位置。The operation of the laser beam irradiation position on the object to be processed is usually performed through an XY stage. That is, the XY stage supports an irradiation unit having an objective lens that focuses the laser beam on the object to be processed, and the irradiation unit moves relative to the object to be processed in the X-axis direction and the Y-axis direction, thereby positioning the object so that the laser beam can irradiate the target position.
近來,作為被處理物的液晶顯示器等顯著大型化,而不得不配合此也使XY載置台大型化。Recently, liquid crystal displays and the like, which are objects to be processed, have become significantly larger in size, and accordingly, the XY stage must also be larger in size.
然而,已大型化的XY載置台之構成構件無論尺寸或重量都會變大。然後,會招來構成構件間的摩擦或背隙之增大、無效運動(lost motion)之擴大等,且發生照射單元不到達正確的位置、或越過正確的位置而走過頭之滑動的疑慮會變高。However, the components of the large-scale XY stage are larger in size and weight, which leads to increased friction and backlash between the components, increased lost motion, and increased risk of the irradiation unit not reaching the correct position or slipping past the correct position.
又,為了對被處理物操作雷射光之焦點,係使具有將雷射光聚光於被處理物之物鏡的照射單元,透過螺桿進給機構(screw feed mechanism)或其他的調節機構,朝向與雷射光軸平行或大致平行的Z軸方向移動。Furthermore, in order to manipulate the focus of the laser light on the object to be processed, the irradiation unit having an objective lens for focusing the laser light on the object to be processed is moved in the Z-axis direction parallel or substantially parallel to the laser light axis through a screw feed mechanism or other adjustment mechanism.
而且,可考慮執行以下的回授控制(feedback control):將能夠精密地計測從照射單元至被處理物為止之間隔距離的位移計(例如,參照下述非專利文獻)附設於照射單元,且沿Z軸方向調節照射單元之位置,以便藉由該位移計所計測的間隔距離與物鏡之焦點距離一致。只要是如此,則即便振動及其他的擾動是在正當照射雷射光的處理中施加於雷射處理裝置上,仍可以使雷射光之焦點持續對準於被處理物上之目標位置。Furthermore, it is conceivable to implement the following feedback control: a displacement meter (for example, see the following non-patent document) capable of accurately measuring the interval distance from the irradiation unit to the object to be processed is attached to the irradiation unit, and the position of the irradiation unit is adjusted along the Z-axis direction so that the interval distance measured by the displacement meter is consistent with the focal distance of the objective lens. As long as this is done, even if vibration and other disturbances are applied to the laser processing device during the process of irradiating the laser light, the focus of the laser light can be continuously aligned with the target position on the object to be processed.
可是,大型之被處理物,無論如何也無法避開部分地或整體地彎曲變形。更且,被處理物中的照射單元之物鏡所指向的位置,亦即透過物鏡而射出的雷射光碰到被處理物的位置、與位移計計測與照射單元之間之距離的位置,係不一致(偏移(offset))。從而,無法保證藉由位移計所計測而獲得的間隔距離,會與從物鏡至被處理物上之目標位置為止的距離確實地一致。而且,兩者的乖離,係隨著被處理物之彎曲變形的程度如何而增減。 [先前技術文獻] [專利文獻]However, large processed objects cannot avoid partial or total bending and deformation. Moreover, the position of the object lens of the irradiation unit in the processed object, that is, the position where the laser light emitted through the object lens hits the processed object, is inconsistent with the position of the distance between the displacement meter and the irradiation unit (offset). Therefore, it cannot be guaranteed that the interval distance measured by the displacement meter will be exactly the same as the distance from the object lens to the target position on the processed object. Moreover, the deviation between the two increases or decreases with the degree of bending and deformation of the processed object. [Prior technical literature] [Patent literature]
專利文獻1:日本特開2005-274709號公報 [非專利文獻]Patent document 1: Japanese Patent Publication No. 2005-274709 [Non-patent document]
非專利文獻1:“雷射位移計|基恩斯(KEYENCE)(註冊商標)”、[online]、令和1年、[令和1年6月26日檢索]、網際網路https://www.keyence.co.jp/products/measure/laser-positioning/Non-patent document 1: “Laser displacement meter | KEYENCE (registered trademark)”, [online], 2011, [retrieved on June 26, 2011], Internet https://www.keyence.co.jp/products/measure/laser-positioning/
[發明所欲解決之問題][The problem the invention is trying to solve]
本發明係在處理大型之被處理物的雷射處理裝置中,以使從照射單元照射於被處理物的雷射光之照射位置及/或焦點正確地對準於被處理物上之目標位置作為預期之目的。 [解決問題之手段]The present invention is intended to accurately align the irradiation position and/or focus of the laser light irradiated from the irradiation unit to the object to be processed with the target position on the object to be processed in a laser processing device for processing a large object to be processed. [Means for solving the problem]
本發明係構成一種實施朝向被處理物上之目標位置照射雷射光來進行處理的雷射處理裝置,其具備:照射單元,其是具有用以將雷射光朝向被處理物上之目標位置聚光的物鏡;及第一XY載置台,其是可以使前述照射單元之至少物鏡對被處理物相對地朝向與雷射光軸正交或大致正交的二維方向移動;以及第二XY載置台,其是可以使前述照射單元及前述第一XY載置台對被處理物相對地朝向與雷射光軸正交或大致正交的二維方向移動,且往二維方向的可動範圍是比第一XY載置台更大。The present invention is a laser processing device for performing processing by irradiating a target position on an object to be processed with laser light, and comprises: an irradiation unit having an objective lens for focusing the laser light toward the target position on the object to be processed; and a first XY stage, which can move at least the objective lens of the irradiation unit relative to the object to be processed in a two-dimensional direction that is orthogonal or substantially orthogonal to the axis of the laser light; and a second XY stage, which can move the irradiation unit and the first XY stage relative to the object to be processed in a two-dimensional direction that is orthogonal or substantially orthogonal to the axis of the laser light, and the movable range in the two-dimensional direction is larger than that of the first XY stage.
亦即,本發明係使第二XY載置台負責對應於大型之被處理物使照射單元大幅地移動的任務,且使第一XY載置台負責細緻且精密地調節照射單元之特別是物鏡之位置的任務。更具體而言,一邊進行以下的控制,且一邊將雷射光照射於被處理物,該控制係藉由前述第二XY載置台將前述照射單元以透過前述物鏡而照射於被處理物的雷射光之照射位置定位於被處理物上之目標位置或其附近之後,藉由前述第一XY載置台來維持前述照射單元之物鏡以使雷射光之照射位置對準於目標位置。That is, the present invention makes the second XY stage responsible for the task of moving the irradiation unit in a large scale corresponding to the large-scale processed object, and makes the first XY stage responsible for the task of finely and precisely adjusting the position of the irradiation unit, especially the objective lens. More specifically, the laser light is irradiated to the processed object while the following control is performed, and the control is that after the irradiation position of the laser light irradiated to the processed object by the irradiation unit through the objective lens is positioned at the target position on the processed object or its vicinity by the second XY stage, the objective lens of the irradiation unit is maintained by the first XY stage so that the irradiation position of the laser light is aligned with the target position.
較佳是,前述照射單元,是具有透過前述物鏡而拍攝被處理物之局部的攝影機感測器,且執行以下的回授控制:以透過前述攝影機感測器拍攝到的影像為基礎,檢測現在的前述物鏡之位置、與雷射光之照射位置對準於目標位置時的物鏡之位置的偏差,且為了縮小該偏差而藉由前述第一XY載置台來調節照射單元的物鏡之位置。Preferably, the irradiation unit has a camera sensor that photographs a portion of the object to be processed through the objective lens, and performs the following feedback control: based on the image photographed by the camera sensor, the deviation between the current position of the objective lens and the position of the objective lens when the irradiation position of the laser light is aligned with the target position is detected, and in order to reduce the deviation, the position of the objective lens of the irradiation unit is adjusted by the first XY stage.
只要具備可以使前述照射單元之至少物鏡對被處理物相對地朝向與雷射光軸平行或大致平行的方向移動的Z軸調節機構,就可以藉由該Z軸調節機構之功能,來使從物鏡射出的雷射光之焦點正確地對準於被處理物上之目標位置。As long as there is a Z-axis adjustment mechanism that can move at least the objective lens of the aforementioned irradiation unit relative to the object to be processed in a direction parallel or approximately parallel to the laser light axis, the focus of the laser light emitted from the objective lens can be correctly aligned with the target position on the object to be processed by the function of the Z-axis adjustment mechanism.
在本雷射處理裝置所設置且所運用的工廠等之現場中,有時會因台車或堆高機(forklift)行駛於周圍等而在地板面產生震動。為此,較佳是使用以抑制頻率比既定值更高的震動從地板面傳遞至架台的防震(或制震)構件,中介設置於用以支撐被處理物、前述照射單元、前述第一XY載置台及前述第二XY載置台的架台與地板面之間。In a factory or other site where the laser processing device is installed and used, vibration may sometimes be generated on the floor surface due to a trolley or forklift driving around. For this reason, it is preferable to use a vibration-proof (or vibration-damping) member for suppressing vibration with a frequency higher than a predetermined value from being transmitted from the floor surface to the stage, and the member is interposed between the stage supporting the object to be processed, the irradiation unit, the first XY stage, and the second XY stage, and the floor surface.
而且,本發明係構成一種實施朝向被處理物上之目標位置照射雷射光來進行處理的雷射處理裝置,其具備:照射單元,其是具有用以將雷射光朝向被處理物上之目標位置聚光的物鏡;及Z軸調節機構,其是可以使前述照射單元之至少物鏡對被處理物相對地朝向與雷射光軸平行或大致平行的方向移動;以及位移計,其是計測從前述照射單元至被處理物為止之距離;一邊執行回授控制,且一邊將雷射光照射於被處理物,該回授控制係在將前述照射單元,不依據前述位移計地以透過前述物鏡而照射於被處理物的雷射光之焦點對準於被處理物上之目標位置的方式予以定位後的狀態下,藉由前述位移計來計測從照射單元至被處理物為止之距離,且將該距離設定成目標距離之後,為了縮小前述位移計現在正計測的距離與前述目標距離之偏差而藉由前述Z軸調節機構來調節前述照射單元的物鏡之位置。Furthermore, the present invention is a laser processing device for processing by irradiating a laser beam toward a target position on a processed object, and comprises: an irradiation unit having an objective lens for focusing the laser beam toward the target position on the processed object; and a Z-axis adjustment mechanism, which can move at least the objective lens of the irradiation unit relative to the processed object in a direction parallel or substantially parallel to the laser beam axis; and a displacement meter, which measures the distance from the irradiation unit to the processed object; while performing feedback control, the laser beam is directed to the target position on the processed object; and the Z-axis adjustment mechanism can move at least the objective lens of the irradiation unit relative to the processed object in a direction parallel or substantially parallel to the laser beam axis; and the displacement meter can measure the distance from the irradiation unit to the processed object; and the displacement meter can adjust the laser beam to the target position on ... Light is irradiated onto the object to be processed. The feedback control is performed by positioning the irradiation unit in a manner that the focus of the laser light irradiated onto the object to be processed through the objective lens is aligned with the target position on the object to be processed without relying on the displacement meter. After the distance from the irradiation unit to the object to be processed is measured by the displacement meter and the distance is set to the target distance, the position of the objective lens of the irradiation unit is adjusted by the Z-axis adjustment mechanism in order to reduce the deviation between the distance currently measured by the displacement meter and the target distance.
更具體而言,前述照射單元,是具有透過前述物鏡來拍攝被處理物之局部的攝影機感測器,且以透過前述攝影機感測器拍攝到的影像為基礎,在將前述照射單元以透過前述物鏡而照射於被處理物的雷射光之焦點對準於被處理物上之目標位置的方式予以定位後的狀態下,藉由前述位移計來計測從照射單元至被處理物為止之距離,且將該距離設定成前述目標距離。More specifically, the irradiation unit has a camera sensor that photographs a portion of the object to be processed through the objective lens, and based on the image photographed by the camera sensor, after the irradiation unit is positioned in such a way that the focus of the laser light irradiated on the object to be processed through the objective lens is aligned with the target position on the object to be processed, the distance from the irradiation unit to the object to be processed is measured by the displacement meter, and the distance is set to the target distance.
只要具備可以使前述照射單元之至少物鏡對被處理物相對地朝向與雷射光軸正交或大致正交的二維方向移動的XY載置台,就可以藉由該XY載置台之功能,將從物鏡射出的雷射光之照射位置正確地對準於被處理物上之目標位置。在此情況下,係在藉由前述XY載置台將前述照射單元以透過前述物鏡而照射於被處理物的雷射光之照射位置對準於被處理物上之目標位置的方式予以定位後,且在藉由前述Z軸調節機構將照射單元以雷射光之焦點對準於被處理物上之目標位置的方式予以定位後的狀態下,藉由前述位移計來計測從照射單元至被處理物為止之距離,且將該距離設定成前述目標距離。As long as an XY stage is provided that can move at least the objective lens of the irradiation unit relative to the object to be processed in a two-dimensional direction that is orthogonal or substantially orthogonal to the laser light axis, the irradiation position of the laser light emitted from the objective lens can be accurately aligned with the target position on the object to be processed by the function of the XY stage. In this case, after the irradiation unit is positioned by the XY stage in such a manner that the irradiation position of the laser light irradiated on the object to be processed is aligned with the target position on the object to be processed, and after the irradiation unit is positioned by the Z-axis adjustment mechanism in such a manner that the focus of the laser light is aligned with the target position on the object to be processed, the distance from the irradiation unit to the object to be processed is measured by the displacement meter, and the distance is set to the target distance.
在本雷射處理裝置所設置且所運用的工廠等之現場中,有時會因台車或堆高機行駛於周圍等而在地板面產生震動。為此,較佳是使用以抑制頻率比既定值更高的震動從地板面傳遞至架台的防震(或制震)構件,中介設置於用以支撐被處理物、前述照射單元、前述第Z軸調節機構及前述位移計的架台與地板面之間。In the factory where the laser processing device is installed and used, vibration may be generated on the floor surface due to the movement of a trolley or a forklift around. For this reason, it is preferable to use a vibration-proof (or vibration-damping) member for suppressing the vibration with a frequency higher than a predetermined value from being transmitted from the floor surface to the platform, and the member is interposed between the platform supporting the object to be processed, the irradiation unit, the Z-axis adjustment mechanism and the displacement meter and the floor surface.
本雷射處理裝置,特別是可以較佳地作為對液晶顯示器模組、電漿顯示器模組、有機EL顯示器模組、無機EL顯示器模組、微發光二極體顯示器模組、透明導電膜基板或彩色濾光片等所產生的不良部位照射雷射光的雷射修補裝置來使用。 [發明效果]This laser processing device can be preferably used as a laser repair device for irradiating defective parts of a liquid crystal display module, a plasma display module, an organic EL display module, an inorganic EL display module, a micro-luminescent diode display module, a transparent conductive film substrate or a color filter with laser light. [Effect of the invention]
依據本發明,則在處理大型之被處理物的雷射處理裝置中,可以使從照射單元照射於被處理物的雷射光之照射位置及/或焦點正確地對準於被處理物上之目標位置。According to the present invention, in a laser processing device for processing a large object to be processed, the irradiation position and/or focus of the laser light irradiated from the irradiation unit to the object to be processed can be accurately aligned with the target position on the object to be processed.
參照圖式來說明本發明之一實施形態。本實施形態之雷射處理裝置1,係指對液晶顯示器模組、電漿顯示器模組、有機EL顯示器模組、無機EL顯示器模組、微發光二極體顯示器模組、透明導電膜基板或彩色濾光片等被處理物O所產生的不良(或缺陷)部位照射雷射光L並修正該不良部位的雷射修補裝置。One embodiment of the present invention is described with reference to the drawings. The laser processing device 1 of the present embodiment refers to a laser repair device that irradiates laser light L to a defective (or defective) portion of a processed object O such as a liquid crystal display module, a plasma display module, an organic EL display module, an inorganic EL display module, a micro-luminescent diode display module, a transparent conductive film substrate or a color filter and corrects the defective portion.
圖1係顯示本雷射處理裝置1之整體概要。本雷射處理裝置1之主要的構成要素,係包含:照射單元2,其是將雷射光L朝向被處理物O上之目標位置(亦即液晶顯示器模組等之不良部位)照射;及XY載置台3、7,其是使照射單元2朝向與雷射光L之光軸正交或大致正交的X軸及Y軸之二維方向移動;及Z軸調節機構3、6,其是使照射單元2朝向與雷射光L之光軸平行或大致平行的Z軸方向移動;以及位移計4,其是計測從照射單元2至被處理物O為止的距離。FIG1 shows the overall outline of the laser processing device 1. The main components of the laser processing device 1 include: an
架台9,係支撐照射單元2、XY載置台3、7、Z軸調節機構3、6、位移計4及被處理物O。架台9,係透過防震構件91接地於地板面。防震構件91,例如是防震(制震)橡膠或空氣彈簧(air spring)等的被動懸架(passive suspension),用以執行抑制頻率比既定值(例如5Hz)更高之震動從地板面傳遞至架台9的作用。The
被處理物O,係藉由夾具(clamp)、吸附及其他適當的手段固定於架台9。正當對被處理物O照射雷射光L的處理中,被處理物O為不動。The object O is fixed to the
本雷射處理裝置1中的XY載置台3、7,係將第一XY載置台3及第二XY載置台7之二個組合在一起。第二XY載置台7,係設立於架台9上,用以支撐照射單元2、第一XY載置台3、Z軸調節機構3、6及位移計4,且可以使此等朝向X軸方向及Y軸方向之二維方向移動。第二XY載置台7之要件,例如是包含:一對Y軸軌道71,其是架設於架台9之兩側部且朝向Y軸方向延伸;及一對Y軸線性馬達台車72,其是沿各個Y軸軌道71行駛;及X軸軌道73,其是使兩側部分別支撐於Y軸線性馬達台車72且沿X軸方向延伸;以及X軸線性馬達台車74,其是沿X軸軌道73行駛。然後,X軸線性馬達台車74,係支撐照射單元2、Z軸調節機構3、6及位移計4。照射單元2及位移計4,係從被處理物O之正上方沿Z軸方向面對於被處理物O。一般說來,第二XY載置台7,係使照射單元2、Z軸調節機構3、6及位移計4,對架台9及被處理物O相對地朝向X軸方向及Y軸方向位移。The
在Y軸軌道71與Y軸線性馬達台車72之組係附設線性編碼器(linear encoder),且藉由該線性編碼器來檢測Y軸線性馬達台車72之Y軸方向的位置座標。在X軸軌道73與X軸線性馬達台車74之組也附設線性編碼器,且藉由該線性編碼器來檢測X軸線性馬達台車74之現在的X軸方向之位置座標。總之,透過兩個線性編碼器,來檢測支撐著照射單元2的X軸線性馬達台車74之現在的XY位置座標。A linear encoder is attached to the set of the Y-
本雷射處理裝置1中的Z軸調節機構3、6,係將第一Z軸調節機構3及第二Z軸調節機構6之二個組合在一起。第二Z軸調節機構6,係中介在殼體5與上述X軸線性馬達台車74之間,且可以使殼體5對X軸線性馬達台車74相對地朝向Z軸方向移動,該殼體5係用以將照射單元2、第一XY載置台3及位移計4一體化。沿著X軸線性馬達台車74之Z軸方向的高度位置,為不變。第二Z軸調節機構6,例如是包含滾珠螺桿(ball screw)的已知之螺桿進給機構,用以使螺桿軸軸承於X軸線性馬達台車74與殼體5當中一方,且將與該螺桿軸螺合的螺帽(nut)固定於另一方,藉由伺服馬達(servo motor)或步進馬達(stepping motor)等來旋轉驅動螺桿軸,藉此使螺帽沿螺桿軸進退,且誘發殼體5之Z軸方向的上下運動。第二Z軸調節機構6,係使照射單元2及位移計4,對架台9及被處理物O相對地朝向Z軸方向位移。The Z-
在X軸線性馬達台車74與殼體5之組係附設線性編碼器,且藉由該線性編碼器來檢測殼體5之現在的Z軸方向之位置座標。A linear encoder is attached to the combination of the X-axis
圖2係顯示容納於殼體5內的照射單元2之構成。照射單元2,係包含:用以觀測被處理物O上之目標位置及其周邊區域的光學系統;以及用以對被處理物O上之目標位置照射雷射光L的光學系統。前者的光學系統,係至少包含落射照明光源21、分束鏡(beam splitter)(或半反射鏡(half mirror))22、二向分光鏡(dichroic mirror)23、物鏡24、成像透鏡(imaging lens)251及攝影機感測器(camera sensor)25。從落射照明光源21所供給的落射光,係藉由分束鏡22所反射,且轉向與被處理物O相對的物鏡24之光軸的方向。該落射光,係在穿透二向分光鏡23之後,透過物鏡24來照明被處理物O上之目標位置及其周邊區域。碰到被加工物而彈回來的光束,係入射於物鏡24,且穿透二向分光鏡23及分束鏡22並入射於成像透鏡251,進而在作為攝影機感測器25的CCD(Charge-Coupled Device;電荷耦合元件)或CMOS(Complementary Metal-Oxide-Semiconductor;互補式金屬氧化物半導體)等的固態攝像元件上成像。如此地實施,藉由攝影機感測器25,對被處理物O上之目標位置及其周邊區域進行拍攝而可以取得影像。FIG2 shows the structure of the
物鏡24,係存在著倍率互異的複數種。此等物鏡24係安裝於電動式旋轉器(electric revolver)241,藉由使旋轉器241旋轉就可以選擇其中任一個物鏡24並配置於光軸上。亦即,能夠變更所適用的物鏡24之倍率。There are multiple types of
後者的光學系統,係至少包含作為雷射光L之光源的振盪器26、衰減器(attenuator)27、偏光板28、擴束器(beam expander)29、可變狹縫(variable slit)20、二向分光鏡23及物鏡24。二向分光鏡23及物鏡24,係與前者的光學系統共通。從雷射振盪器26所供給的雷射光L,係藉由衰減器27所衰減,藉由偏光板28所偏光,且藉由擴束器29及可變狹縫20所整形。可變狹縫20,係可以使透過此的雷射光束之形狀變化。更且,雷射光L,係藉由二向分光鏡23所反射,且轉向與被處理物O相對的物鏡24之光軸的方向。該雷射光L,係透過物鏡24而聚光於被處理物O上之目標位置。如此,可以將雷射光L照射於被處理物O上之目標位置。The optical system of the latter includes at least an
但是,前者的光學系統、後者的光學系統,都不妨礙圖2所未顯示的其他之光學要件,例如包含光纖或鏡片、稜鏡(prism)、透鏡、光閥(shutter)等。However, the former optical system and the latter optical system do not hinder other optical elements not shown in Figure 2, such as optical fibers or lenses, prisms, lenses, shutters, etc.
位移計4,係用以計測沿著從照射單元2之物鏡24至被處理物O上之目標位置為止的Z軸方向之間隔距離。位移計4,例如是已知的雷射位移計,用以朝向被處理物O照射雷射光R,且透過接收碰到被處理物O而彈回的雷射光R,來精密地計測從該位移計4至被處理物O為止的距離。位移計4,係容納於殼體5內或附設於殼體5外。藉由已述的第二Z軸調節機構6之功能,位移計4就會與殼體5、照射單元2及第一XY載置台3成為一體並朝向Z軸方向上下運動。The
第一XY載置台3,係容納於殼體5內,用以支撐照射單元2之至少物鏡24及旋轉器241,且可以使之朝向X軸方向及Y軸方向之二維方向移動。第一XY載置台3,例如是已知的壓電載置台(piezo stage),其能使支撐物鏡24及旋轉器241的載置台,藉由壓電馬達(piezo motor)(超音波馬達)朝向X軸方向及Y軸方向精密地移動。第一XY載置台3,係使照射單元2之物鏡24,對殼體5相對地,進而對架台9及被處理物O相對地,朝向X軸方向及Y軸方向位移。The
第一Z軸調節機構3,也容納於殼體5內,用以支撐照射單元2之至少物鏡24及旋轉器241,且可以使之朝向Z軸方向移動。第一Z軸調節機構3,例如是已知的壓電載置台,其能使支撐物鏡24及旋轉器241的載置台,藉由壓電馬達朝向Z軸方向精密地移動。第一Z軸調節機構3,係使照射單元2之物鏡24,對殼體5相對地,進而對架台9及被處理物O相對地,朝向Z軸方向位移。The first Z-
再者,在本實施形態中,係藉由單一的壓電馬達XYZ載置台來實現第一XY載置台3及第一Z軸調節機構3之兩個功能。該壓電XYZ載置台3,係能夠使支撐物鏡24及旋轉器241的載置台,朝向X軸方向、Y軸方向及Z軸方向之三維方向移動。Furthermore, in this embodiment, a single piezoelectric motor XYZ stage is used to realize the two functions of the
照射單元2之物鏡24以外的要件或位移計4,係不一定要搭在於壓電XYZ載置台3。其意圖是在於削減壓電XYZ載置台3之裝載量,且盡可能地提高藉由壓電XYZ載置台3所為的物鏡24之位置控制的精度及響應性。可是,並不是要排除將照射單元2之物鏡24以外的要件之至少一部分搭載於壓電XYZ載置台3並使之與物鏡24一起移動,且不是要排除將位移計4搭載於壓電XYZ載置台3並使之與物鏡24一起移動。The components other than the
在作為第一XY載置台及第一Z軸調節機構的壓電XYZ載置台3係附設光學式線性編碼器,且藉由該線性編碼器來檢測載置台的X軸方向、Y軸方向及Z軸方向之位置座標。The
沿著在本實施形態中所假定的被處理物O之X軸方向及Y軸方向的寬度尺寸,係超過1m。為了能夠執行對如此大型之被處理物O的大致全區照射雷射光L之處理,第二XY載置台7之行程(stroke)(亦即往二維方向之可動範圍),係有1m以上。亦即,Y軸線性馬達台車72之Y軸方向的可動範圍是有1m以上,且X軸線性馬達台車74之X軸方向的可動範圍也是有1m以上。The width of the object O assumed in this embodiment along the X-axis direction and the Y-axis direction is more than 1m. In order to be able to perform the process of irradiating the laser light L to the substantially entire area of such a large object O, the stroke (i.e., the movable range in the two-dimensional direction) of the
反過來說,第一XY載置台3之行程(亦即往X軸方向及Y軸方向之可動範圍),係遠小於第二XY載置台7之行程,而支撐物鏡24的載置台之X軸方向及Y軸方向的可動範圍係分別為100μm以下,且盡可能為40μm至50μm程度。取而代之,第一XY載置台3之最小位移量,係比第二XY載置台7更細得多。第一XY載置台3,係可以比第二XY載置台7,更細微地且精密地調節物鏡24的X軸方向及Y軸方向之位置。此外,藉由附隨於第一XY載置台3的光學式線性編碼器所為的位置座標之檢測的解像度,係比藉由附隨於第二XY載置台7的線性編碼器所為的位置座標之檢測的解像度更高。On the other hand, the stroke of the first XY stage 3 (i.e., the movable range in the X-axis direction and the Y-axis direction) is much smaller than that of the
又,第一Z軸調節機構3之行程(亦即往Z軸方向之可動範圍),係遠小於第二Z軸調節機構6之行程,而支撐物鏡24的載置台之Z軸方向的可動範圍為10μm至30μm程度。取而代之,第一Z調節機構3之最小位移量,係比第二Z軸調節機構6更細小得多。第一Z軸調節機構3,係可以比第二Z軸調節機構6,更細微地且精密地調節物鏡24的Z軸方向之位置。此外,藉由附隨於第一Z軸調節機構3的光學式線性編碼器所為的位置座標之檢測的解像度,係比藉由附隨於第二Z軸調節機構6的線性編碼器所為的位置座標之檢測的解像度更高。
Furthermore, the stroke of the first Z-axis adjustment mechanism 3 (i.e., the movable range in the Z-axis direction) is much smaller than that of the second Z-
掌管本雷射處理裝置1之控制的控制用控制器8,例如是以通用的個人電腦或工作站等作為主體而構成。如圖3所示,控制用控制器8,係具備CPU(Central Processing Unit;中央處理單元)81、主記憶體82、輔助記憶裝置83、視訊編碼解碼器(video codec)84、顯示器85、通信介面86、操作輸入裝置87等的硬體資源,且此等進行協調動作。
The
輔助記憶裝置83,為快閃記憶體、硬碟機、光碟機等。視訊編碼解碼器84,係以GPU(Graphics Processing Unit;繪圖處理單元)、視訊記憶體(video memory)等作為要件,該GPU係生成以從CPU81所接收到的描繪指示為基礎並使之應顯示的畫面且將該畫面信號朝向顯示器85送出,該視訊記憶體係事先暫時地儲存畫面或影像之資料。視訊編碼解碼器84,也能夠當作軟體來安裝,而非硬體。通信介面86,係指該控制用控制器8與外
部的裝置進行資訊通信用的裝置。操作輸入裝置87,係指操作員以手指來操作的鍵盤、按下用按鈕、操縱桿(joystick)、滑鼠或觸控面板(有時是與顯示器85疊合)的指向裝置(pointing device)以及其他。
The
在控制用控制器8中,應藉由CPU81所執行的程式係儲存於輔助記憶裝置83,在執行程式時會從輔助記憶裝置83讀入至主記憶體82,且藉由CPU81所解讀。控制用控制器8,係按照程式使上述硬體資源作動,並貫徹本雷射處理裝置1之控制。
In the
圖4係顯示控制用控制器8在藉由本雷射處理裝置1所為之雷射處理時所進行的處理之順序例。首先,控制用控制器8,係對第二XY載置台7提供控制信號,且驅動第二XY載置台7以包含照射單元2的殼體5朝向X軸方向及/或Y軸方向移動,以便透過物鏡24之光軸(亦即物鏡24)而照射於被處理物O的雷射光L之照射位置一致於被處理物O上之目標位置或位於其附近,來作為從雷射處理裝置1之照射單元2朝向被處理物O上之目標位置照射雷射光L的準備(步驟S1)。控制用控制器8,係事先將被處理物O上之目標位置的XYZ座標,記憶保持於主記憶體82或是輔助記憶裝置83。目標位置之XYZ座標,例如是藉由分析拍攝作為被處理物O的液晶顯示器面板等所得之影像,且檢測存在於該被處理物O的不良部位等所取得。
Fig. 4 shows an example of the processing sequence performed by the
接著,控制用控制器8,係對第一XY載置台3提供控制信號,且驅動第一XY載置台3微調節照射單元2的物鏡24之X軸方向及/或Y軸方向的位置,以便透過物鏡24而照射於被處理物O的雷射光L之照射位置精密地對準於被處理物O上之目標位置(步驟S2)。此時,透過照射單元2所具有的攝影機感測器25,來拍攝與被處理物O中的物鏡24之光軸相交的位置及其周邊區域,且分析所獲得的影像並檢測作為目標位置的被處理物O之不良部位,並可以為了使光軸正確地對位於該不良部位,而微細地修正藉由第一XY載置台3所致的位移量。但是,藉由攝影機感測器25所為的被處理物O之攝像,較佳是在使物鏡24之焦點對準於被處理物O之後才進行。Next, the
與上述步驟S2幾乎同時,控制用控制器8,係對Z軸調節機構3、6提供控制信號,且驅動Z軸調節機構3、6微調節包含照射單元2的殼體5及/或物鏡24之Z軸方向的位置,以便透過物鏡24之焦點、以及透過該物鏡24而照射於被處理物O的雷射光L之焦點精密地對準於被處理物O上之目標位置(步驟S3)。在該步驟S3中,係不使用位移計4之功能。在步驟S3中,例如是透過照射單元2所具有的攝影機感測器25,來反覆地拍攝與被處理物O中的物鏡24之光軸相交的位置及其周邊區域,且分析所獲得的影像來逐次求出其對比(contrast)(明暗差),並且使殼體5及/或物鏡24上下運動直至拍攝影像之對比成為最大或接近最大的高度位置為止。Almost simultaneously with the above step S2, the
在步驟S3不使用位移計4的理由,係基於如下:如圖2所示,為了對被處理物O施予雷射處理而透過物鏡24所照射的雷射光L之照射位置、與為了計測從位移計4至被處理物O為止之間隔距離所照射的雷射光R之照射位置,會相互不一致地偏移(offset)。物鏡24之倍率較大,且物鏡24本身之尺寸也較大。為了避開與物鏡24之干涉,不得不使位移計4從物鏡24離開來配置,且一定很難使位移計4之光軸一致於物鏡24之光軸。大型之被處理物O,有時會整體或部分地彎曲變形。只要也一併考慮其彎曲變形之程度並非恆常為固定,就無法將藉由位移計4所計測到的間隔距離,立即看作是從物鏡24至被處理物O上之目標位置為止的距離。換句話說,位移計4計測著間隔距離的位置,係與從物鏡24射出的雷射光L所碰到的位置不同,且兩個位置之沿著Z軸方向的高度有可能性因被照射物之彎曲而不相同,而且兩個位置之高度的差異事先不顯著。故而,在步驟S3中,係不使用位移計4,而是藉由對比AF(AutoFocus;自動對焦)法等使雷射光L之焦點對準於被處理物O上之照射位置。The reason why the
經過上述步驟S1至S3,照射單元2之物鏡24,會到達對被處理物O上之目標位置照射雷射光L之處理所需的基本位置。以後,控制用控制器8,係開始將物鏡24維持於該基本位置的回授控制(步驟S4及S5)。之所以要執行位置回授控制,係為了要防止在雷射光L之光軸或焦點因擾動而從被處理物O上之目標位置偏離後的狀態下將雷射光L照射於被處理物O所致。典型的擾動,係指從設置著本雷射處理裝置1的工廠等之地板面傳遞至架台9、被處理物O、XY載置台7、Z軸調節機構6及照射單元2的震動。某種程度以上之頻率較高(超過5Hz)的震動,係藉由中介在地板面與架台9之間的防震構件91所阻斷或充分地衰減。但是,頻率較低(未滿5Hz,2Hz至3Hz左右的)震動,係不一定能藉由防震構件91所阻斷,而可能會從地板面傳遞至架台9、被處理物O、XY載置台7、Z軸調節機構6及照射單元2。
After the above steps S1 to S3, the
在X軸方向及Y軸方向之位置回授控制步驟S4中,控制用控制器8,係在將照射單元2定位於基本位置之後,透過照射單元2所具有的攝影機感測器25,反覆地拍攝與被處理物O中的物鏡24之光軸相交的位置及其周邊區域,且分析所獲得的影像,以逐次求出現在的照射單元2之位置從基本位置,亦即從雷射光L之照射位置對準於目標位置時的位置朝向X軸方向及Y軸方向偏離了多少,或其偏差。然後,對第一XY載置台3提供控制信號,且朝向縮小該偏差的方向驅動第一XY載置台3,以將物鏡24之位置朝向基本位置修正。藉此,可以將物鏡24之光軸,換言之雷射光L之照射位置,持續保持於被處理物O上之目標位置或其近旁。
In the position feedback control step S4 in the X-axis direction and the Y-axis direction, the
在Z軸方向之位置回授控制步驟S5中,控制用控制器8,係在已將照射單元2定位於基本位置時,透過位移計4來計測到達被處理物O的間隔距離,且將該距離設定成回授控制之目標距離。而且,以後,透過位移計4來反覆地計測到達被處理物O的間隔距離,且逐次求出所計
測到之現在的間隔距離與目標距離之偏差。該偏差,係暗示現在的照射單元2之位置從基本位置,亦即從雷射光L之焦點對準於目標位置時的位置朝向Z軸方向偏離了多少。然後,對第一Z軸調節機構3提供控制信號,且朝向縮小該偏差的方向驅動第一Z軸調節機構3,以將物鏡24之位置朝向基本位置修正。藉此,可以將雷射光L之焦點,持續保持於被處理物O上之目標位置或其近旁。
In the Z-axis position feedback control step S5, the
能夠根據位置回授控制,來迅速地修正起因於從地板面傳遞至架台9、被處理物O、XY載置台7、Z軸調節機構6及照射單元2的低頻之震動而產生的偏差。作為第一XY載置台及第一Z軸調節機構的壓電馬達載置台3,係具有足以修正起因於低頻震動而產生之偏差的響應速度。
It is possible to quickly correct the deviation caused by low-frequency vibration transmitted from the floor to the
又,支撐物鏡24的壓電馬達載置台3之可動範圍,係微小到100μm以下。且,從雷射振盪器26所供給並入射於物鏡24的雷射光L,係指已被準直(collimate)過的平行光。從而,即便不將照射單元2之物鏡24以外的要件搭載於壓電馬達載置台3,在已透過壓電馬達載置台3使物鏡24朝向X軸方向或Y軸方向位移時,被處理物O上之攝影機感測器25所拍攝的位置、以及照射雷射光L的位置仍會僅位移相同的量。即便透過壓電馬達載置台3使物鏡24朝向Z軸方向位移仍沒有問題。
In addition, the movable range of the
然後,控制用控制器8,係一邊執行位置回授控制,且一邊將雷射光L照射於被處理物O上之目標位置(步驟S6)。Then, the
在本實施形態中,係構成一種實施朝向被處理物O上之目標位置照射雷射光L來進行處理的雷射處理裝置1,其具備:照射單元2,其是具有用以將雷射光L朝向被處理物O上之目標位置聚光的物鏡24;及第一XY載置台3,其是可以使前述照射單元2之至少物鏡24對被處理物O相對地朝向與雷射光軸正交或大致正交的二維方向移動;以及第二XY載置台7,其是可以使前述照射單元2及前述第一XY載置台3對被處理物O相對地朝向與雷射光軸正交或大致正交的二維方向移動,且往二維方向的可動範圍是比第一XY載置台3更大。In the present embodiment, a laser processing device 1 is provided for performing processing by irradiating a laser light L toward a target position on an object O to be processed, and comprises: an
在本實施形態中,係使第二XY載置台7負責對應於大型之被處理物O使照射單元2大幅地移動的任務,且使第一XY載置台3負責細緻且精密地調節照射單元2之特別是物鏡24之位置的任務。更具體而言,一邊進行以下的控制,且一邊將雷射光L照射於被處理物O,該控制係藉由前述第二XY載置台7將前述照射單元2以透過前述物鏡24而照射於被處理物O的雷射光L之照射位置對準於被處理物O上之目標位置或其附近的方式來予以定位之後,藉由前述第一XY載置台3來維持前述照射單元2之物鏡24以使雷射光L之照射位置對準於目標位置。依據本實施形態,可以使從雷射處理裝置1之照射單元2透過物鏡24而照射於被處理物O的雷射光L之照射位置正確地對準於被處理物O上之目標位置。In the present embodiment, the
因前述照射單元2,是具有透過前述物鏡24而拍攝被處理物O之局部的攝影機感測器25,且以透過前述攝影機感測器25拍攝到的影像為基礎,檢測現在的前述物鏡24之位置、與雷射光L之照射位置對準於目標位置時的物鏡24之位置的偏差,且為了縮小該偏差而藉由前述第一XY載置台3來調節照射單元2的物鏡24之位置,故而可提高位置回授控制之精度,且可以相對於擾動將來自雷射光L之照射位置之目標位置的偏移抑制在最小限。Since the
在支撐被處理物O、前述照射單元2、前述XY載置台3、7、前述Z軸調節機構3、6及前述位移計4的架台9、與地板面之間,中介設置用以抑制頻率比既定值更高的震動從地板面傳遞至架台9的防震構件91,可以使影響較大且不易修正之造成擾動的高頻之震動適當地阻斷或衰減。Between the
而且,本發明係構成一種實施朝向被處理物O上之目標位置照射雷射光L來進行處理的雷射處理裝置1,其具備:照射單元2,其是具有用以將雷射光L朝向被處理物O上之目標位置聚光的物鏡24;及Z軸調節機構3、6,其是可以使前述照射單元2之至少物鏡24對被處理物O相對地朝向與雷射光軸平行或大致平行的方向移動;以及位移計4,其是計測從前述照射單元2至被處理物O為止之距離;一邊執行回授控制,且一邊將雷射光L照射於被處理物O,該回授控制係在將前述照射單元2,不依據前述位移計4地以透過前述物鏡24而照射於被處理物O的雷射光L之焦點對準於被處理物O上之目標位置的方式予以定位後的狀態下,藉由前述位移計4來計測從照射單元2至被處理物O為止之距離,且將該距離設定成目標距離之後,為了縮小前述位移計4現在正計測的距離與前述目標距離之偏差而藉由前述Z軸調節機構3來調節前述照射單元2之物鏡24的位置。Furthermore, the present invention is a laser processing device 1 for performing processing by irradiating a laser beam L toward a target position on an object O to be processed, and comprises: an
更具體而言,前述照射單元2,是具有透過前述物鏡24來拍攝被處理物O之局部的攝影機感測器25,且以透過前述攝影機感測器25拍攝到的影像為基礎,在將前述照射單元2以透過前述物鏡24而照射於被處理物O的雷射光L之焦點對準於被處理物O上之目標位置的方式予以定位後的狀態下,藉由前述位移計4來計測從照射單元2至被處理物O為止之距離,且將該距離設定成前述目標距離。依據本實施形態,則在處理大型之被處理物O的雷射處理裝置1中,可以使從照射單元2照射於被處理物O的雷射光L之焦點正確地對準於被處理物O上之目標位置。More specifically, the
本實施形態之雷射處理裝置1,係具備可以使前述照射單元2對被處理物O相對地朝向與雷射光軸正交或大致正交的二維方向移動的XY載置台3、7,且藉由該XY載置台3、7之功能,可以使從物鏡24射出的雷射光L之照射位置正確地對準於被處理物O上之目標位置。本實施形態之雷射處理裝置1,係在藉由前述XY載置台3、7將前述照射單元2以透過前述物鏡24而照射於被處理物O的雷射光L之照射位置對準於被處理物O上之目標位置的方式予以定位後,且在藉由前述Z軸調節機構3、6將照射單元2以雷射光L之焦點對準於被處理物O上之目標位置的方式予以定位後的狀態下,藉由前述位移計4來計測從照射單元2至被處理物O為止之距離,且將該距離設定成前述目標距離。The laser processing device 1 of this embodiment is equipped with
本實施形態之雷射處理裝置1,係可以較佳地作為對液晶顯示器模組、電漿顯示器模組、有機EL顯示器模組、無機EL顯示器模組、微發光二極體顯示器模組、透明導電膜基板或彩色濾光片等所產生的不良部位照射雷射光L的雷射修補裝置來使用。The laser processing device 1 of this embodiment can be preferably used as a laser repair device for irradiating laser light L to defective parts produced by liquid crystal display modules, plasma display modules, organic EL display modules, inorganic EL display modules, micro-luminescent diode display modules, transparent conductive film substrates or color filters.
再者,本發明並非被限定於以上所詳述的實施形態。例如,本發明的雷射處理裝置1之用途,係不被限定於雷射修補裝置。Furthermore, the present invention is not limited to the above-described embodiments. For example, the use of the laser processing device 1 of the present invention is not limited to a laser repair device.
其他,各部之具體的構成或處理之順序等,係能夠在不脫離本發明之趣旨的範圍內進行各種變化。 [產業上之可利用性]In addition, the specific structure of each part or the processing order can be changed in various ways without departing from the scope of the present invention. [Industrial Applicability]
本發明係可以適用於對被處理物照射雷射光並施予所期望之處理的雷射處理裝置。The present invention is applicable to a laser processing device that irradiates a processing object with laser light and performs a desired processing.
1:雷射處理裝置 2:照射單元 3:第一XY載置台兼第一Z軸調節機構(壓電XYZ載置台) 4:位移計 5:殼體 6:第二Z軸調節機構(螺桿進給機構) 7:第二XY載置台 9:架台 20:可變狹縫 21:落射照明光源(雷射振盪器) 22:分束鏡 23:二向分光鏡 24:物鏡 25:攝影機感測器 26:振盪器 27:衰減器 28:偏光板 29:擴束器 71:Y軸軌道 72:Y軸線性馬達台車 73:X軸軌道 74:X軸線性馬達台車 81:CPU 82:主記憶體 83:輔助記憶裝置 84:視訊編碼解碼器 85:顯示器 86:通信介面 87:操作輸入裝置 91:防震構件 241:電動旋轉器(旋轉器) 251:成像透鏡 L,R:雷射光 O:被處理物1: Laser processing device 2: Irradiation unit 3: First XY stage and first Z axis adjustment mechanism (piezoelectric XYZ stage) 4: Displacement meter 5: Housing 6: Second Z axis adjustment mechanism (screw feed mechanism) 7: Second XY stage 9: Stand 20: Variable slit 21: Falling illumination light source (laser oscillator) 22: Beam splitter 23: Two-way beam splitter 24: Objective lens 25: Camera sensor 26: Oscillator 27: Attenuator 28: Polarizing plate 29: Beam expander 71: Y-axis track 72: Y-axis linear motor trolley 73: X-axis track 74: X-axis linear motor trolley 81: CPU 82: Main memory 83: Auxiliary memory device 84: Video encoder/decoder 85: Display 86: Communication interface 87: Operation input device 91: Anti-vibration component 241: Electric rotator (rotator) 251: Imaging lens L, R: Laser light O: Object to be processed
[圖1]係顯示本發明之一實施形態的雷射處理裝置之整體概要之示意圖。 [圖2]係示意性地顯示同實施形態的雷射處理裝置之照射單元的光學系統、第一XY載置台及位移計之示意圖。 [圖3]係顯示該實施形態的雷射處理裝置之控制用控制器之構成的示意圖。 [圖4]係顯示按照程式(program)來實施該實施形態的雷射處理裝置之控制用控制器的處理之順序例之流程圖。[FIG. 1] is a schematic diagram showing the overall outline of a laser processing device of one embodiment of the present invention. [FIG. 2] is a schematic diagram showing the optical system, the first XY stage and the displacement meter of the irradiation unit of the laser processing device of the same embodiment. [FIG. 3] is a schematic diagram showing the structure of the control controller of the laser processing device of the embodiment. [FIG. 4] is a flow chart showing an example of the sequence of processing of the control controller of the laser processing device of the embodiment according to a program.
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