TWI843407B - Server power supply - Google Patents

Abstract

A power supply for a server includes an outer shell, an inner space in the outer shell has an air path, and the air path is connected to a wind tunnel opening; a transformer module in the outer shell receives power and then reduces the power to a low-voltage power to supply a power control circuit and a heat dissipation fan in the wind tunnel opening; the power control circuit receives the low-voltage power and generates a power control signal to the transformer module and an output power control signal to a power output module arranged on at least one ceramic substrate in the outer shell, so that the transformer module outputs a quasi-output voltage to the power output module; the power output module receives the quasi-output voltage and generates an output voltage signal to the power output port; the at least one ceramic substrate is located in the air path, so that it can be effectively blown by the heat dissipation fan to dissipate heat.

Description

Server power supply

A power supply, especially one for a server.

With the advancement of information technology, network servers responsible for transmitting information are becoming more modular in hardware design. In this way, modular servers can provide multiple configuration options in a single product line and provide customers with more flexible hardware configurations for flexible deployment.

A good server needs to operate stably, reliably and safely, and in order to achieve the above conditions, the server also needs a good power supply. With the increase in the power used in industrial networks, the operating power of the server and the waste heat temperature generated during operation also increase. Therefore, the server's power supply needs a good heat dissipation design to facilitate the stable operation of the server.

However, the heat dissipation structure of the power supply is affected by the limited internal space. That is, when a protruding non-planar circuit group is provided inside the power supply of the server, the ventilation duct for heat dissipation will be blocked by these non-planar circuit modules and cannot be properly ventilated, thereby causing the temperature of the power supply to rise and fail to stably provide power to the server operation.

Specifically, the existing server power supply uses a plurality of discrete components to be mounted on a plurality of sub-printed circuit boards (PCBs), and then the sub-PCBs are plugged or soldered on a mother PCB. In this way, the mother PCB is provided with the sub-PCBs, and the sub-PCBs are relatively thick due to the size of the discrete components. Therefore, the power supply is provided with the thick sub-PCBs inside, resulting in protruding, non-planar circuits, which affects the heat dissipation effect of the air duct.

The present invention provides a power supply for a server, wherein a circuit is arranged on a ceramic substrate to increase the heat dissipation space inside the power supply, and the higher thermal conductivity of the ceramic substrate is utilized to accelerate the heat dissipation speed, so that the power supply can dissipate heat more efficiently and output power more stably.

The power supply of the present invention includes: An outer shell, which is formed with a wind tunnel opening and an inner space; wherein the inner space has an air path, and the air path is connected to the wind tunnel opening; A power input port, which is arranged on the outer shell; A power output port, which is arranged on the outer shell; A heat dissipation fan, which is arranged in the wind tunnel opening on the outer shell; A transformer module, which is arranged in the inner space and is electrically connected to the power input port and the heat dissipation fan respectively; A substrate, which is arranged in the inner space; A power control circuit, which is arranged on the substrate and is electrically connected to the transformer module; At least one ceramic substrate, which is arranged in the inner space and is located on the air path; A power output module is disposed on the at least one ceramic substrate and is electrically connected to the power control circuit, the transformer module and the power output port respectively; wherein the power input port is electrically connected to a power source to receive a power, the transformer module reduces the power to a low voltage power, and supplies the low voltage power to the heat dissipation fan and the power control circuit respectively; wherein the power control circuit receives the low voltage power and generates a power control signal to the transformer module and an output power control signal to the power output module, so that the transformer module outputs a quasi-output voltage to the power output module, and the power output module generates an output voltage signal to the power output port according to the quasi-output voltage.

The thermal conductivity of the at least one ceramic substrate of the present invention is higher than that of a general printed circuit board (PCB), so the at least one ceramic substrate of the present invention can conduct heat and dissipate heat more quickly. In addition, the power output module can be directly arranged on the at least one ceramic substrate, without the need to first arrange the electronic components on a sub-PCB board and then combine the sub-PCB board with a mother PCB board as in the prior art. In this way, the internal space of the power supply of the present invention can free up more space for heat dissipation. Furthermore, because the at least one ceramic substrate is arranged on the wind path in the internal space, the at least one ceramic substrate can be efficiently blown by the heat dissipation fan to dissipate heat.

Referring to FIG. 1 and FIG. 2 , the present invention provides a power supply 1 for a server, which is used to provide a stable power supply to the server. The power supply 1 of the present invention includes a housing 10, a power input port 20, a transformer module 30, a heat dissipation fan 40, a power control circuit 50, a power output module 60, a power output port 70, a substrate and at least one ceramic substrate.

The outer shell 10 is formed with a wind tunnel opening 11 and an inner space, and the inner space has an air path, and the air path is connected to the wind tunnel opening 11. The heat dissipation fan 40 is arranged in the wind tunnel opening 11 on the outer shell 10, and the power input port 20 and the power output port 70 are arranged on the outer shell 10, and the transformer module 30, the power control circuit 50 and the power output module 60 are arranged in the inner space of the outer shell 10.

The transformer module 30 is electrically connected to the power input port 20, the heat dissipation fan 40 and the power control circuit 50, and the power output module 60 is electrically connected to the transformer module 30, the power control circuit 50 and the power output port 70. The power input port 20 is electrically connected to a power source to receive power. The transformer module 30 receives the power through the power input port 20, and steps down the power into a low-voltage power, and sends the low-voltage power to the heat dissipation fan 40 and the power control circuit 50, respectively.

The heat dissipation fan 40 receives the low voltage power and rotates the fan to generate a heat dissipation wind blowing in a first axial direction. The power control circuit 50 receives the low voltage power and generates a power control signal to the transformer module 30 and an output power control signal to the power output module 60, so that the transformer module 30 outputs a quasi-output voltage to the power output module 60, and the power output module 60 generates an output voltage signal to the power output port 70 according to the quasi-output voltage. The power output port 70 is connected to the server for power supply, and the output voltage signal output from the power output port 70 of the present invention is a stable power supply for the server.

The substrate and the at least one ceramic substrate of the present invention are respectively disposed in the internal space, and the substrate and the at least one ceramic substrate are disposed in the internal space on the wind path so as to be blown by the heat dissipation fan 40. Specifically, the power control circuit 50 is disposed on the substrate, and the power output module 60 is disposed on the at least one ceramic substrate. A plane of the substrate and a plane of the at least one ceramic substrate are respectively parallel to the first axial direction in which the heat dissipation wind force generated by the heat dissipation fan 40 blows. In this way, because the plane of each ceramic substrate does not protrude vertically in the first axial direction toward which the heat dissipation fan 40 blows to become a wind resistance, the heat dissipation fan 40 can generate a heat dissipation wind flow with lower resistance and faster wind speed between the at least one ceramic substrate, thereby assisting the power output module 60 on the at least one ceramic substrate to dissipate heat efficiently.

Furthermore, the thermal conductivity of the at least one ceramic substrate of the present invention is higher than that of a general printed circuit board (PCB). Specifically, the thermal conductivity of ceramic is about 1.22 Watt per meter per Kelvin (W*m ^-1 *K ^-1 ), while the thermal conductivity of the FR4 glass fiber material of a general PCB is about 0.3~0.9 W*m ^-1 *K ^-1 . Thus, compared to a general PCB, the at least one ceramic substrate of the present invention can conduct heat and dissipate heat more quickly. Furthermore, the power output module 60 can be directly disposed on the at least one ceramic substrate, without the need to firstly place electronic components on a sub-PCB and then combine the sub-PCB with a mother PCB as in the prior art. In this way, the inner space of the power supply 1 of the present invention can also leave more space to facilitate the flow of the heat dissipation wind.

Referring to FIG. 2 and FIG. 3 , in one embodiment of the present invention, the housing 10 has an upper surface 12, a lower surface 13, an air inlet surface 14, and an air outlet surface 15. The upper surface 12 is opposite to the lower surface 13, and the air inlet surface 14 is opposite to the air outlet surface 15. The wind tunnel opening 11 is formed on the lower surface 13 and the air outlet surface 15, and a plurality of air inlet openings 16 are formed on the air inlet surface 14, and the power input port 20 and the heat dissipation fan 40 are disposed on the air outlet surface 15. The wind path is formed between the air inlet openings 16 and the wind tunnel opening 11, and the wind path is parallel to the first axial direction, so that the heat dissipation fan 40 draws the heat dissipation wind from the air inlet openings 16 into the housing 10, and then blows the heat dissipation wind out of the housing 10 through the wind tunnel opening 11. In addition, the upper surface 12 is provided with the power output port 70, and the lower surface 13 is provided with a control signal port 80.

Please refer to FIG. 4 , the control signal port 80 is electrically connected to the power control circuit 50 , so that an external device can transmit a setting signal to the power control circuit 50 through the electrical connection to the control signal port 80 to modify the logic setting in the power control circuit 50 .

Furthermore, the transformer module 30 includes a first transformer 31 and a second transformer 32, and the power output module 60 includes a first power output circuit 61 and a second power output circuit 62.

The first transformer 31 is electrically connected to the power input port 20, the heat dissipation fan 40 and the power control circuit 50. The first transformer 31 receives the power from the power input port 20, and the first transformer 31 steps down the power into the low-voltage power, and then outputs the low-voltage power to the heat dissipation fan 40 and the power control circuit 50, so that the heat dissipation fan 40 and the power control circuit 50 receive the low-voltage power to operate. The second transformer 32 is electrically connected to the power input port 20, the power control circuit 50 and the power output module 60. The second transformer 32 receives the power from the power input port 20 and the power control signal from the power control circuit 50 , and adjusts the voltage of the received power according to the power control signal to output the quasi-output voltage to the first power output circuit 61 of the power output module 60 .

The first power output circuit 61 of the power output module 60 is electrically connected to the second transformer 32 of the transformer module 30 and the power control circuit 50, respectively, and the second power output circuit 62 is electrically connected to the first power output circuit 61, the power control circuit 50 and the power output port 70, respectively.

After receiving the quasi-output voltage from the second transformer 32 of the transformer module 30 and the output power control signal from the power control circuit 50, the first power output circuit 61 adjusts the power factor of the quasi-output voltage according to the output power control signal to generate a power factor correction (PFC) signal, and the first power output circuit 61 outputs the PFC signal to the second power output circuit 62. After receiving the PFC signal from the first power output circuit 61, the second power output circuit 62 adjusts the pulse width of the PFC signal to generate a pulse width modulation (PWM) signal, and the second power output circuit 62 outputs the PWM signal to the power output port 70. The PWM signal is the output voltage signal mentioned above.

In addition, in this embodiment, the at least one ceramic substrate includes two ceramic substrates, and the first power output circuit 61 and the second power output circuit 62 are respectively arranged on different ceramic substrates. In this way, electromagnetic interference caused by the first power output circuit 61 and the second power output circuit 62 being too close to each other can be avoided.

Please refer to FIG. 5, which is a top view of the inner space of the power supply 1 in another embodiment of the present invention. The plurality of ceramic substrates disposed in the inner space include a first ceramic substrate 91, a second ceramic substrate 92, a third ceramic substrate 93 and a fourth ceramic substrate 94. The planes of the ceramic substrates 91-94 and the plane of the substrate 100 are parallel to the first axial direction X, and the planes of the ceramic substrates 91-94 and the substrate 100 face a second axial direction Y perpendicular to the first axial direction X. The first power output circuit 61 is disposed on the plane of the first ceramic substrate 91, the second power output circuit 62 is disposed on the plane of the second ceramic substrate 92, and the third power output circuit 63 is disposed on the plane of the third ceramic substrate 93. A fourth power output circuit is provided on the plane of the fourth ceramic substrate 94. The fourth power output circuit is a metal-oxide-semiconductor field-effect transistor (MOSFET) circuit, and the MOSFET circuit is connected to the power control circuit 50. Furthermore, the MOSFET circuit of the fourth ceramic substrate 94 can be a MOSFET circuit using a ring (ORing) structure. The circuit of this ORing structure can maintain the flow direction of the output current to prevent the current from flowing back. The use of this Oring MOSFET circuit is already a known technology, so it will not be elaborated here.

The first power output circuit 61, the second power output circuit 62 and the third power output circuit 63 of the power output module 60 are all plated on the planes of the first ceramic substrate 91 and the second ceramic substrate 92 respectively using a direct bonded copper (DBC) technology or a direct plated copper (DPC) technology, and the first power output circuit 61, the second power output circuit 62 and the third power output circuit 63 have a copper circuit layer. Furthermore, the multiple pins of the first power output circuit 61, the second power output circuit 62 and the third power output circuit 63 are respectively perpendicular to the planes of the first ceramic substrate 91, the second ceramic substrate 92 and the third ceramic substrate 93, and extend from the first power output circuit 61, the second power output circuit 62 and the third power output circuit 63 to a planar circuit board 130 located at the bottom of the internal space of the power supply 1.

In addition, an electromagnetic interference filter (EMI Filter) 110, at least one capacitor and at least one inductor are further disposed in the inner space of the power supply 1. The at least one capacitor is, for example, a buck capacitor 33 and a plurality of voltage-stabilizing capacitors 34, and the at least one inductor is, for example, a choke 120.

The electromagnetic filter 110 is disposed between the power input port 20 and the transformer module 30 so that the electromagnetic filter 110 can filter out noise and surges of the power input from the power input port 20 before the transformer module 30 steps down the power.

The step-down capacitor 33 is part of a step-down circuit in the first transformer 31, but due to its large size, it needs to be separately placed in the internal space. The step-down capacitor 33 is large because it is the capacitor mainly used for stepping down the voltage in the power supply 1, and therefore requires a larger storage capacity to supply the operation of the step-down circuit. The step-down circuit is a known circuit that can be responsible for stepping down the mains to the low voltage, that is, for example, stepping down 110 volts (Volt; V) to 4V.

The choke 120 is a part of the first power output circuit 61, but due to its large size, it needs to be separately disposed in the internal space. The choke 120 is a low-pass filter for filtering the PFC signal generated by the first power output circuit 61. In other words, the choke 120 can ensure that the PFC signal output by the first power output circuit 61 of the present invention does not have high-frequency noise.

Please refer to FIG. 6 and FIG. 7 , the first ceramic substrate 91 in the inner space has a first plane 91A and a second plane 91B of the first ceramic substrate 91. The first plane 91A is opposite to the second plane 91B, and the first plane 91A and the second plane 91B are parallel to the first axial direction X, and the first plane 91A and the second plane 91B are perpendicular to the second axial direction Y. The first power output circuit 61 is provided on the first plane 91A, and a first heat dissipation metal layer 910 is provided on the second plane 91B. The first power output circuit 61 has the aforementioned copper circuit layer and a plurality of first pins 610, and the first pins 610 extend out to a third axial direction Z. The first axial direction X, the second axial direction Y and the third axial direction Z are perpendicular to each other. The first pins 610 are used to fix the first power output circuit 61 to the planar circuit board 130 connected to the bottom surface of the inner space. The first pins 610 are electrically connected to the second transformer 32, the power control circuit 50 and the second power output circuit 62 through the planar circuit board 130 in the inner space.

The first heat dissipation metal layer 910 not only helps the first power output circuit 61 disposed on the first plane 91A to dissipate heat through the first ceramic substrate 91 to the first heat dissipation metal layer 910, but also can serve as an electromagnetic insulation sheet for the first power output circuit 61. This is because, in this embodiment, the substrate 100 is disposed in the inner space on a side close to the outer shell 10 on the second axis Y, and the ceramic substrates 91-94 are disposed in the inner space opposite to this side on the second axis Y. In this way, the power control circuit 50 and the first power output circuit 61 on the substrate 100 are disposed separately. The second plane 91B of the first ceramic substrate 91 faces the substrate 100 and the power control circuit 50, the first plane 91A of the first ceramic substrate 91 faces away from the substrate 100 and the power control circuit 50, and the heat dissipation metal layer 140 is spaced between the first power output circuit 61 and the substrate 100 and the power control circuit 50. In this way, the first heat dissipation metal layer 910 can serve as an electromagnetic barrier between the power control circuit 50 and the first power output circuit 61 on the first ceramic substrate 91, so that the power control circuit 50 and the first power output circuit 61 do not electromagnetically interfere with each other.

As shown in FIG. 8 , the second ceramic substrate 92 in the inner space has a first plane 92A and a second plane 92B of the first ceramic substrate 92. The second power output circuit 62 is disposed on the first plane 92A of the second ceramic substrate 92, and a second heat sink metal layer 920 is disposed on the second plane 92B of the second ceramic substrate 92. The second power output circuit 62 has the aforementioned copper circuit layer and a plurality of second pins 620, and the second pins 620 extend out in a third axial direction Z. The second power output circuit 62 is also connected and fixed to the planar circuit board 130 in the internal space through the second pins 620 , and is electrically connected to the planar circuit board 130 through the second pins 620 to further electrically connect the first power output circuit 61 , the power control circuit 50 and the power output port 70 .

As shown in FIG. 9 and FIG. 10 , the third ceramic substrate 93 in the inner space has a first plane 93A and a second plane 93B of the third ceramic substrate 93. The third power output circuit 63 is disposed on the first plane 93A of the third ceramic substrate 93, and a third heat dissipation metal layer 930 is disposed on the second plane 93B of the third ceramic substrate 93. The third heat dissipation metal layer 930 and the second heat dissipation metal layer 920 have the same function as the first heat dissipation metal layer 910, which is to dissipate heat for the circuit on the other side of the corresponding ceramic substrate, so it is not described in detail here. The third power output circuit 63 has a plurality of discrete components, and in this embodiment, a packaging shell 150 and a control circuit board 160 are further disposed on the third power output circuit 63 on the first plane 93A.

The third power output circuit 63 includes a circuit layer 131, a plurality of bare die power devices 132, a plurality of vertical signal terminals 133, a plurality of aluminum conductive strips and a plurality of third pins 630. The package housing 150 includes a plurality of pin openings 151 and a plurality of signal terminal openings 152. The control circuit board 160 includes a plurality of circuit control signal ports 161.

The circuit layer 131 disposed on the first plane 93A has a patterned circuit, and four bare die power devices 132 are disposed on the circuit layer 131. The bare die power devices 132 are unpackaged bare dies, and therefore have better heat dissipation efficiency than semiconductor devices packaged with dielectrics. The bare die power devices 132 can be general semiconductor power devices such as MOSFET or insulated gate bipolar transistor (IGBT). In the present embodiment, the bare die power devices 132 are bulk driven MOSFET (BD MOS).

The bare die power elements 132 are electrically connected to the circuit layer 131, and the bare die power elements 132 are electrically connected to each other through the aluminum conductive strips. The circuit layer 131 is also provided with four third pins 630 extending from the third power output circuit 63 toward the third axial direction Z. The third pins 630 are also electrically connected to the bare die power elements 132 and the circuit layer 131 through the aluminum conductive strips to facilitate the transmission of current in and out of the aluminum conductive strips. The third pins 630 extend along the first plane 90A toward the third axial direction Z and are electrically connected to the power control circuit 50 to obtain power.

In this embodiment, each of the four bare die power elements 132 is equipped with an electrically connected vertical signal terminal 133. A total of four vertical signal terminals 133 are vertically connected to the circuit layer 131, and each of the vertical signal terminals 133 has a pin socket 134. The four pin sockets 134 respectively penetrate the four pin openings 151 of the package shell 150 to electrically connect to the four circuit control signal ports 161 on the control circuit board 160. When the control circuit board 160 is powered on, it generates a plurality of circuit control signals to control the operation of the bare die power elements 132 in the third power output circuit 63. The control circuit board 160 outputs the circuit control signal to the four bare die power devices 132 through the circuit control signal ports 161. The four signal terminal openings 152 on the package shell 150 are respectively arranged corresponding to the four third pins 630, so that the package shell 150 covers and protects the third power output circuit 63 while allowing the third pins 630 to extend out from the signal terminal openings 152.

In summary, in this embodiment, the third power output circuit 63, the package shell 150 for protecting the third power output circuit 63, and the control circuit board 160 for controlling the operation of the third power output circuit 63 are arranged on the first plane 93A of the third ceramic substrate 93. The package shell 150 and the control circuit board 160 are fixed on the circuit layer 131 in the third power output circuit 63 through the vertical signal terminals 133 and the pin sockets 134, and the control circuit board 160 is electrically connected to the bare die power elements 132 on the circuit layer 131 in the third power output circuit 63 through the vertical signal terminals 133 and the pin sockets 134. The third power output circuit 63, the package housing 150 and the control circuit board 160 disposed on the first plane 93A can be effectively heat-dissipated by the heat conduction of the third ceramic substrate 93 and the third heat dissipation metal layer 930 on the second plane 93B. In addition, the third power output circuit 63, the package housing 150 and the control circuit board 160 are also located on the wind path to be further heat-dissipated by the cooling fan 40. The third power output circuit 63, the package housing 150 and the control circuit board 160 are also electromagnetically protected because the third heat dissipation metal layer 930 on the second plane 93B serves as an electromagnetic barrier.

The heat dissipation wind force drawn in by the heat dissipation fan 40 from the air inlet openings 16 blows on the wind path, in which the substrate 100 and the ceramic substrates 91-94 are arranged parallel to the first axis X. Due to the arrangement of the substrate 100 and the ceramic substrates 91-94, the heat dissipation wind force can flow between the ceramic substrates 91-94 with low wind resistance to efficiently cool the ceramic substrates 91-94. In addition, because the thermal conductivity coefficient of the ceramic substrates 91-94 is higher than that of a general PCB, the waste heat generated by all the circuits on the ceramic substrates 91-94 can be more easily dissipated through the ceramic substrates 91-94, thereby improving the overall heat dissipation efficiency. The power supply 1 which is efficiently heat-dissipated in this way can more stably output the output voltage signal from the power output port 70 to the connected server, so as to facilitate the stable operation and information transmission of the server.

1: Power supply 10: Housing 11: Wind tunnel opening 12: Upper surface 13: Lower surface 14: Air inlet surface 15: Air outlet surface 16: Air inlet opening 20: Power input port 30: Transformer module 31: First transformer 32: Second transformer 33: Step-down capacitor 34: Voltage regulator capacitor 40: Cooling fan 50: Power control circuit 60: Power output module 61: First power output circuit 62: Second power output circuit 63: Third power output circuit 70: Power output port 80: Control signal port 91: First ceramic substrate 91A: First plane 91B: Second plane 92: Second ceramic substrate 92A: First plane 92B: Second plane 93: Third ceramic substrate 93A: First plane 93B: Second plane 94: Fourth ceramic substrate 100: Substrate 110: Electromagnetic filter 120: Choke 130: Planar circuit board 131: Circuit layer 132: Bare die power element 133: Vertical signal terminal 134: Pin socket 140: Heat dissipation metal layer 150: Package housing 151: Pin opening 152: Signal terminal opening 160: Control circuit board 161: Circuit control signal port 610: First pin 620: Second pin 630: Third pin 910: First heat dissipation metal layer 920: Second heat dissipation metal layer 930: Third heat dissipation metal layer X: First axis Y: Second axis Z: Third axis

FIG. 1 is a block diagram of a power supply of a server according to the present invention.

FIG. 2 is an external view of the power supply of the server of the present invention.

FIG. 3 is another external view of the power supply of the server of the present invention.

FIG. 4 is a block diagram of a power supply of a server according to an embodiment of the present invention.

FIG. 5 is a top view of an inner space of a power supply of a server according to another embodiment of the present invention.

FIG. 6 is a schematic diagram of a first ceramic substrate of the power supply of the server according to the present invention.

FIG. 7 is another schematic diagram of the first ceramic substrate of the power supply of the server according to the present invention.

FIG. 8 is a schematic diagram of a second ceramic substrate of the power supply of the server according to the present invention.

FIG. 9 is a schematic diagram of a third ceramic substrate of the power supply of the server of the present invention.

FIG. 10 is a schematic diagram of a circuit disposed on the third ceramic substrate of the power supply of the server of the present invention.

1: Power supply

20: Power input port

31: First transformer

32: Second transformer

33: Buck capacitor

34: Voltage regulator capacitor

40: Cooling fan

50: Power control circuit

60: Power output module

61: First power output circuit

62: Second power output circuit

63: The third power output circuit

91: First ceramic substrate

92: Second ceramic substrate

93: The third ceramic substrate

94: Fourth ceramic substrate

100: Substrate

110: Electromagnetic filter

120: Choke

130: Planar circuit board

150: Encapsulation shell

160: Control circuit board

910: First heat dissipation metal layer

920: Second heat dissipation metal layer

930: The third heat dissipation metal layer

X: First axis

Y: Second axis

Claims (9)

A power supply for a server comprises: an outer shell, which is formed with a wind tunnel opening and an inner space; wherein the inner space has an air path, and the air path is connected to the wind tunnel opening; a power input port, which is arranged on the outer shell; a power output port, which is arranged on the outer shell; a heat dissipation fan, which is arranged in the wind tunnel opening on the outer shell; a transformer module, which is arranged in the inner space and is electrically connected to the power input port and the heat dissipation fan respectively; a substrate, which is arranged in the inner space; a power control A circuit is arranged on the substrate and electrically connected to the transformer module; at least one ceramic substrate is arranged in the internal space and is located on the wind path; a power output module is arranged on the at least one ceramic substrate and is electrically connected to the power control circuit, the transformer module and the power output port respectively; wherein the power input port is electrically connected to a power source to receive power, the transformer module reduces the power to a low voltage power, and supplies the low voltage power to the heat dissipation fan and the power control circuit respectively; wherein The power control circuit receives the low voltage power and generates a power control signal to the transformer module and an output power control signal to the power output module, so that the transformer module outputs a quasi-output voltage to the power output module, and the power output module generates an output voltage signal to the power output port according to the quasi-output voltage; wherein the transformer module further includes: a first transformer electrically connected to the power input port, the heat dissipation fan and the power control circuit; wherein the first transformer is self- The power input port receives the power, steps down the power to the low voltage power, and then outputs the low voltage power to the heat dissipation fan and the power control circuit; and a second transformer electrically connects the power input port, the power output module and the power control circuit; wherein the second transformer receives the power from the power input port and the power control signal from the power control circuit, and outputs the quasi-output voltage to the power output module according to the power control signal; wherein the first transformer includes a step-down capacitor. The power supply as described in claim 1, wherein: the housing has an air inlet surface and an air outlet surface, and the air inlet surface is opposite to the air outlet surface; the wind tunnel opening is formed on the air outlet surface, an air inlet opening is formed on the air inlet surface, and the power input port and the heat dissipation fan are arranged on the air outlet surface; the air path is formed between the air inlet opening and the wind tunnel opening. A power supply as described in claim 1, wherein: the power output module is a copper circuit layer coated on the at least one ceramic substrate using a direct bonded copper (DBC) technology or a direct plated copper (DPC) technology. The power supply as described in claim 1 further includes: an electromagnetic filter (EMI Filter) disposed between the power input port and the transformer module. A power supply as described in claim 1, wherein the power output module further comprises: a first power output circuit electrically connected to the transformer module and the power control circuit; wherein the first power output circuit adjusts the power factor after receiving the quasi-output voltage from the transformer module to generate and output a power factor correction (PFC) signal; wherein the at least one ceramic substrate comprises a first ceramic substrate, and the first ceramic substrate has a first plane and a second plane, the first power output circuit is disposed on the first plane of the first ceramic substrate, and a first heat dissipation metal layer is disposed on the second plane of the first ceramic substrate. A power supply as described in claim 5, wherein: The second plane of the first ceramic substrate faces the substrate. A power supply as described in claim 5, wherein: the first power output circuit includes a choke. The power supply as claimed in claim 5, wherein the power output module further comprises: a second power output circuit electrically connected to the first power output circuit, the power control circuit and the power output port; wherein the second power output circuit adjusts the pulse width of the power factor correction signal to generate a pulse width modulation (PWM) after receiving the power factor correction signal from the first power output circuit. modulation; PWM) signal, and output the pulse width modulation signal to the power output port; wherein the at least one ceramic substrate also includes a second ceramic substrate, and the second ceramic substrate has a first plane and a second plane, the second power output circuit is arranged on the first plane of the second ceramic substrate, and a second heat dissipation metal layer is arranged on the second plane of the second ceramic substrate; wherein the pulse width modulation signal is the output voltage signal. A power supply as described in any one of claims 1 to 8, wherein the power output module further includes a third power output circuit, a packaging shell and a control circuit board; wherein the at least one ceramic substrate includes a third ceramic substrate, and the third ceramic substrate has a first plane and a second plane; wherein the third power output circuit includes: a circuit layer, arranged on the first plane of the third ceramic substrate; a plurality of bare die power components, arranged on the circuit layer and electrically connected to the circuit layer; a plurality of vertical signal terminals, arranged on the circuit layer and electrically connected to the bare die power components respectively; a plurality of pins, arranged on the circuit layer and electrically connected to the bare die power components and the circuit layer, and extending out along the first plane of the third ceramic substrate; Wherein, the package shell includes: a plurality of pin openings, arranged corresponding to the pins; wherein the pins penetrate the pin openings; a plurality of signal terminal openings, arranged corresponding to the upright signal terminals; wherein the control circuit board includes: a plurality of circuit control signal ports, arranged corresponding to the signal terminal openings; wherein the upright signal terminals penetrate the signal terminal openings to electrically connect the circuit control signal ports; wherein the control circuit board outputs a plurality of circuit control signals to the bare die power components on the circuit layer through the circuit control signal ports; wherein the pins are electrically connected to the power control circuit.

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