TWI843228B - Measurement systems and methods - Google Patents

Measurement systems and methods Download PDF

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TWI843228B
TWI843228B TW111138659A TW111138659A TWI843228B TW I843228 B TWI843228 B TW I843228B TW 111138659 A TW111138659 A TW 111138659A TW 111138659 A TW111138659 A TW 111138659A TW I843228 B TWI843228 B TW I843228B
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light beam
optical element
moment
detection information
light
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TW111138659A
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TW202305317A (en
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魯 陳
楊樂
馬硯忠
張威
李小輝
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大陸商深圳中科飛測科技股份有限公司
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Abstract

本揭露提供了一種測量系統和方法,涉及測量技術領域,該測量系統包括:光源,被配置為產生原始光束,其中,從被測物體的被測區域返回的該原始光束為返回光束;光學元件,被配置為根據該返回光束得到待處理光束,其中,至少部分該待處理光束為第一光束;第一探測裝置,被配置為根據該第一光束得到第一探測資訊;移動設備,被配置為使該光學元件與該被測物體沿該光學元件的光軸方向相對移動;和處理系統,被配置為根據複數第一時刻中每個第一時刻下的該第一探測資訊,確定在每個第一時刻下該光學元件與該被測物體的固定平面之間的實際距離。The present disclosure provides a measurement system and method, which relate to the field of measurement technology. The measurement system includes: a light source, configured to generate an original light beam, wherein the original light beam returned from a measured area of an object to be measured is a return light beam; an optical element, configured to obtain a light beam to be processed based on the return light beam, wherein at least a portion of the light beam to be processed is a first light beam; a first detection device, configured to obtain first detection information based on the first light beam; a moving device, configured to move the optical element and the object to be measured relative to each other along the optical axis direction of the optical element; and a processing system, configured to determine the actual distance between the optical element and the fixed plane of the object to be measured at each first moment in a plurality of first moments based on the first detection information at each first moment in a plurality of first moments.

Description

測量系統和方法Measurement systems and methods

本揭露涉及測量技術領域,尤其涉及一種測量系統和方法。The present disclosure relates to the field of measurement technology, and more particularly to a measurement system and method.

在積體電路製造領域,為提高產品良率,需要對晶圓的三維形貌進行測量,以檢查晶圓製造的製程是否符合標準。基於白光干涉技術的三維形貌測量方式以其無接觸、快速、高精度等特點在積體電路檢測領域廣泛使用。In the field of integrated circuit manufacturing, in order to improve product yield, it is necessary to measure the three-dimensional topography of the wafer to check whether the wafer manufacturing process meets the standards. The three-dimensional topography measurement method based on white light interferometry technology is widely used in the field of integrated circuit inspection due to its non-contact, fast and high-precision characteristics.

白光干涉技術以相干長度很短的白光作為光源,藉由干涉訊號強度的峰值可以定位被測物體的表面形貌。White light interferometry technology uses white light with a very short coherence length as the light source, and the peak value of the interference signal intensity can be used to locate the surface morphology of the object being measured.

根據本揭露實施例的一方面,提供一種測量系統,包括: 光源,被配置為產生原始光束,其中,從被測物體的被測區域返回的該原始光束形成返回光束;光學元件,被配置為根據該返回光束得到待處理光束,其中,至少部分該待處理光束為第一光束;第一探測裝置,被配置為根據該第一光束得到第一探測資訊;移動設備,被配置為使該光學元件與該被測物體沿該光學元件的光軸方向相對移動;和處理系統,被配置為根據複數第一時刻中每個第一時刻下的該第一探測資訊,確定在每個第一時刻下該光學元件與該被測物體的固定平面之間的實際距離。According to one aspect of an embodiment of the present disclosure, a measurement system is provided, comprising: a light source configured to generate an original light beam, wherein the original light beam returned from a measured area of an object to be measured forms a return light beam; an optical element configured to obtain a light beam to be processed based on the return light beam, wherein at least a portion of the light beam to be processed is a first light beam; a first detection device configured to obtain first detection information based on the first light beam; a moving device configured to move the optical element and the object to be measured relative to each other along the optical axis direction of the optical element; and a processing system configured to determine the actual distance between the optical element and a fixed plane of the object to be measured at each first moment in a plurality of first moments based on the first detection information at each first moment in a plurality of first moments.

在一些實施例中,該光學元件包括:第一分光器,被配置為將該原始光束分為參考光束和入射到該被測區域的物光束,其中,從該被測區域返回該光學元件的該物光束形成該返回光束;和參考鏡,被配置為使該參考光束沿預設軌跡傳播以得到預干涉光束,其中,該預干涉光束和該返回光束干涉以得到該待處理光束;該第一探測資訊包括該待處理光束中預定波長的光的強度。In some embodiments, the optical element includes: a first beam splitter configured to split the original light beam into a reference beam and an object beam incident on the measured area, wherein the object beam returning from the measured area to the optical element forms the return beam; and a reference mirror configured to cause the reference beam to propagate along a preset trajectory to obtain a pre-interference beam, wherein the pre-interference beam and the return beam interfere to obtain the beam to be processed; the first detection information includes the intensity of light of a predetermined wavelength in the beam to be processed.

在一些實施例中,該處理系統被配置為確定在每個第一時刻下該光學元件與被測物體的固定平面之間的實際距離包括:控制該移動設備以使該光學元件與該被測物體沿該光軸方向相對移動,以在複數第二時刻下使該光學元件與該固定平面之間具有期望的複數預定距離;獲取該複數第二時刻中的每個第二時刻下的該第一探測資訊;和根據該複數預定距離和每個第二時刻下的該複數第一探測資訊,確定在每個第一時刻下該光學元件與該固定平面之間的該實際距離。In some embodiments, the processing system is configured to determine the actual distance between the optical element and the fixed plane of the object to be measured at each first moment, including: controlling the moving device to make the optical element and the object to be measured move relative to each other along the optical axis direction, so that the optical element and the fixed plane have the desired multiple predetermined distances at multiple second moments; obtaining the first detection information at each second moment of the multiple second moments; and determining the actual distance between the optical element and the fixed plane at each first moment based on the multiple predetermined distances and the multiple first detection information at each second moment.

在一些實施例中,該處理系統被配置為根據該複數預定距離和每個第二時刻下的該複數第一探測資訊,確定在每個第一時刻下該光學元件與該固定平面之間的實際距離包括:對該複數預定距離中的每個預定距離進行線性處理,以得到移動參量;以每個第二時刻下的該移動參量和待求參量之間的差為獨立變數,以每個第二時刻下的該第一探測資訊為控制變數對待擬合函數進行擬合,以得到擬合函數;和根據該擬合函數和該複數第一時刻下的該第一探測資訊,確定在每個第一時刻下該光學元件與該固定平面之間的實際距離。In some embodiments, the processing system is configured to determine the actual distance between the optical element and the fixed plane at each first moment based on the multiple predetermined distances and the multiple first detection information at each second moment, including: linearly processing each of the multiple predetermined distances to obtain a movement parameter; fitting a function to be fitted using the difference between the movement parameter and the parameter to be determined at each second moment as an independent variable and the first detection information at each second moment as a control variable to obtain a fitting function; and determining the actual distance between the optical element and the fixed plane at each first moment based on the fitting function and the first detection information at the multiple first moments.

在一些實施例中,該光學元件包括:第一分光器,被配置為將該原始光束分為參考光束和入射到該被測區域的物光束,其中,從該被測區域返回該光學元件的該物光束形成該返回光束;和參考鏡,被配置為使該參考光束沿預設軌跡傳播以得到預干涉光束,其中,該預干涉光束和該返回光束干涉以得到該待處理光束;該第一探測資訊包括該待處理光束中預定波長的光的強度;該待擬合函數為: ,其中,該線性處理包括乘以2Π/λ,r=1;或者,該線性處理包括乘以1,r=2Π/λ,λ為該預定波長光的波長; 該處理系統被配置為以每個第二時刻下的該移動參量和待求參量之間的差為獨立變數,以每個第二時刻下的該第一探測資訊為控制變數對待擬合函數進行擬合,以得到擬合函數包括:以每個第二時刻下的該移動參量作為該待擬合函數中的x、以每個第二時刻下該預定波長的光的強度作為該待擬合函數中的I,對該待擬合函數進行擬合,以得到A、該待求參量x 0和B,從而得到該擬合函數;根據該擬合函數和該複數第一時刻下的該第一探測資訊,確定在每個第一時刻下該光學元件與該固定平面之間的實際距離包括:以每個第一時刻下該預定波長的光的強度作為該擬合函數中的I,計算該擬合函數中的x作為每個第一時刻下的該移動參量;和根據每個第一時刻下的該移動參量,確定在每個第一時刻下該光學元件與該固定平面之間的實際距離。 In some embodiments, the optical element includes: a first beam splitter configured to split the original light beam into a reference light beam and an object light beam incident on the measured area, wherein the object light beam returning from the measured area to the optical element forms the return light beam; and a reference mirror configured to propagate the reference light beam along a preset trajectory to obtain a pre-interference light beam, wherein the pre-interference light beam and the return light beam interfere to obtain the light beam to be processed; the first detection information includes the intensity of light of a predetermined wavelength in the light beam to be processed; the function to be fitted is: , wherein the linear processing includes multiplying by 2Π/λ, r=1; or, the linear processing includes multiplying by 1, r=2Π/λ, λ is the wavelength of the predetermined wavelength light; the processing system is configured to use the difference between the movement parameter and the parameter to be determined at each second moment as an independent variable, and use the first detection information at each second moment as a control variable to fit the function to be fitted, so as to obtain the fitting function, including: using the movement parameter at each second moment as x in the function to be fitted, using the intensity of the light of the predetermined wavelength at each second moment as I in the function to be fitted, fitting the function to be fitted to obtain A, the parameter to be determined x, and the intensity of the light of the predetermined wavelength at each second moment as I in the function to be fitted. 0 and B, thereby obtaining the fitting function; determining the actual distance between the optical element and the fixed plane at each first moment according to the fitting function and the first detection information at the complex first moment, including: taking the intensity of the light of the predetermined wavelength at each first moment as I in the fitting function, calculating x in the fitting function as the movement parameter at each first moment; and determining the actual distance between the optical element and the fixed plane at each first moment according to the movement parameter at each first moment.

在一些實施例中,該參考鏡被配置為藉由反射該參考光束,使該參考光束沿預設軌跡傳播以得到預干涉光束;該參考鏡和該第一分光器均為半透半反鏡,並且,該參考鏡和該第一分光器平行設置;或者,該參考鏡為反射鏡。In some embodiments, the reference mirror is configured to reflect the reference light beam so that the reference light beam propagates along a preset trajectory to obtain a pre-interference light beam; the reference mirror and the first beam splitter are both semi-transparent and semi-reflective mirrors, and the reference mirror and the first beam splitter are arranged in parallel; or, the reference mirror is a reflecting mirror.

在一些實施例中,該第一探測裝置包括:光柵和濾波片中的一個;和光強探測器。In some embodiments, the first detection device includes: one of a grating and a filter; and a light intensity detector.

在一些實施例中,該測量系統還包括:第一光闌,被配置為阻擋該待處理光束中與該待測處理光束的中心軸之間的夾角大於第一預設夾角的部分進入該第一探測裝置。In some embodiments, the measurement system further includes: a first aperture configured to prevent a portion of the light beam to be processed, the portion having an angle greater than a first preset angle with the central axis of the light beam to be processed, from entering the first detection device.

在一些實施例中,該測量系統還包括:第二探測裝置,被配置為根據第二光束得到第二探測資訊,該第二光束為部分該返回光束或部分該待處理光束,該第二探測資訊表徵該光學元件與該被測區域之間在該光學元件的光軸方向上的相對距離;該處理系統還被配置為獲取該第二探測資訊為預設探測資訊時的第一時刻作為特徵時刻;獲取該特徵時刻下的該光學元件與該固定平面之間的該實際距離;根據該特徵時刻下的該光學元件與該固定平面之間的該實際距離,確定該被測區域的高度資訊。In some embodiments, the measurement system further includes: a second detection device, configured to obtain second detection information based on a second light beam, the second light beam being part of the return light beam or part of the light beam to be processed, the second detection information characterizing the relative distance between the optical element and the measured area in the direction of the optical axis of the optical element; the processing system is also configured to obtain the first moment when the second detection information is the preset detection information as a characteristic moment; obtain the actual distance between the optical element and the fixed plane at the characteristic moment; and determine the height information of the measured area based on the actual distance between the optical element and the fixed plane at the characteristic moment.

在一些實施例中,該第二探測裝置被配置為根據第二光束得到第二探測資訊包括:根據該第二光束得到探測影像;和根據該探測影像得到該第二探測資訊,該第二探測資訊包括第二光束的光強和該探測影像的對比度中的至少一項。In some embodiments, the second detection device is configured to obtain second detection information based on the second light beam, including: obtaining a detection image based on the second light beam; and obtaining the second detection information based on the detection image, the second detection information including at least one of the light intensity of the second light beam and the contrast of the detection image.

在一些實施例中,該測量系統還包括:第二分光器,被配置為對該返回光束或該待處理光束進行分光,以得到該第二光束。In some embodiments, the measurement system further includes: a second spectrometer configured to split the return light beam or the light beam to be processed to obtain the second light beam.

在一些實施例中,該光學元件還包括:第一鏡頭,被配置為收集該返回光束,該第一光束由至少部分該第一鏡頭收集的該返回光束形成;或者,該第一鏡頭被配置為收集該待處理光束,該第一光束由至少部分該第一鏡頭收集的該待處理光束形成。In some embodiments, the optical element further includes: a first lens configured to collect the return light beam, the first light beam being formed by at least a portion of the return light beam collected by the first lens; or, the first lens being configured to collect the light beam to be processed, the first light beam being formed by at least a portion of the light beam to be processed collected by the first lens.

在一些實施例中,當該第一鏡頭被配置為收集該返回光束時,該第二分光器被配置為將該第一鏡頭收集的該返回光束進行分光,以形成該第二光束和第三光束,該光學元件被配置為根據該第三光束得到該待處理光束;當該第一鏡頭被配置為收集該待處理光束時,該第二分光器被配置為對該第一鏡頭收集的該待處理光束進行分光,以形成該第一光束和該第二光束。In some embodiments, when the first lens is configured to collect the return light beam, the second beam splitter is configured to split the return light beam collected by the first lens to form the second light beam and the third light beam, and the optical element is configured to obtain the light beam to be processed based on the third light beam; when the first lens is configured to collect the light beam to be processed, the second beam splitter is configured to split the light beam to be processed collected by the first lens to form the first light beam and the second light beam.

在一些實施例中,該光學元件還包括:第二鏡頭,被配置為收集該第二光束。In some embodiments, the optical element further includes: a second lens configured to collect the second light beam.

在一些實施例中,該第二分光器被配置為對該返回光束進行分光,以得到該第二光束,該第二鏡頭使該第二光束的中心軸平行於該光學元件的移動方向;該第二分光器與該光學元件固定連接。In some embodiments, the second beam splitter is configured to split the return beam to obtain the second beam, and the second lens makes the central axis of the second beam parallel to the moving direction of the optical element; the second beam splitter is fixedly connected to the optical element.

在一些實施例中,該光學元件被配置為相對於該第二分光器移動。In some embodiments, the optical element is configured to move relative to the second beam splitter.

在一些實施例中,該第二分光器被配置為將該返回光束進行分光,以得到該第二光束;該光學元件包括鏡頭,該鏡頭被配置為收集該返回光束並使該返回光束傳播至該第二分光器,或者該鏡頭被配置為收集該第二光束;該測量系統還包括:第二光闌,被配置為阻擋該第二光束中與該第二光束的中心軸之間的夾角大於第二預設夾角的部分進入該第二探測裝置,該第二光闌和該第二探測裝置均與該鏡頭的焦平面共軛。In some embodiments, the second beam splitter is configured to split the return beam to obtain the second beam; the optical element includes a lens, which is configured to collect the return beam and propagate the return beam to the second beam splitter, or the lens is configured to collect the second beam; the measurement system also includes: a second aperture, which is configured to block a portion of the second beam whose angle with the central axis of the second beam is greater than a second preset angle from entering the second detection device, and the second aperture and the second detection device are both concentric with the focal plane of the lens.

在一些實施例中,該原始光束包括第一原始光束和第二原始光束;該光源包括:第一子光源,被配置為產生該第一原始光束,和第二子光源,被配置為產生該第二原始光束;該返回光束包括第一返回光束和第二返回光束,該第一返回光束為從該被測區域返回的該第一原始光束,該第二返回光束為從該被測區域返回的該第二原始光束;該光學元件包括:第一光學元件,被配置為根據該第一返回光束形成該待處理光束,該第一光束為該待處理光束,和第二光學元件,被配置為收集該第二返回光束,該第二光束為該第二返回光束,該第一光學元件和第二光學元件固定連接。In some embodiments, the original light beam includes a first original light beam and a second original light beam; the light source includes: a first sub-light source, configured to generate the first original light beam, and a second sub-light source, configured to generate the second original light beam; the returned light beam includes a first returned light beam and a second returned light beam, the first returned light beam is the first original light beam returned from the measured area, and the second returned light beam is the second original light beam returned from the measured area; the optical element includes: a first optical element, configured to form the light beam to be processed according to the first returned light beam, the first light beam is the light beam to be processed, and a second optical element, configured to collect the second returned light beam, the second light beam is the second returned light beam, and the first optical element and the second optical element are fixedly connected.

在一些實施例中,該第一光學元件還被配置為收集該第一原始光束,並使該第一原始光束到達該被測區域;該第一光學元件包括:色散棱鏡,被配置為使該第一原始光束中不同波長的光彙聚至該第一光學元件的光軸的不同位置。In some embodiments, the first optical element is also configured to collect the first original light beam and make the first original light beam reach the measured area; the first optical element includes: a dispersion prism, which is configured to converge light of different wavelengths in the first original light beam to different positions of the optical axis of the first optical element.

在一些實施例中,該測量系統還包括:資料獲取系統,被配置為在每個第一時刻發出同步觸發訊號;該第一探測裝置被配置為回應於該同步觸發訊號,根據該第一光束得到該第一探測資訊;該第二探測裝置被配置為回應於該同步觸發訊號,根據該第二光束得到該第二探測資訊。In some embodiments, the measurement system further includes: a data acquisition system configured to send a synchronization trigger signal at each first moment; the first detection device is configured to respond to the synchronization trigger signal and obtain the first detection information based on the first light beam; the second detection device is configured to respond to the synchronization trigger signal and obtain the second detection information based on the second light beam.

在一些實施例中,該第二探測資訊包括該第二光束的光強;在該特徵時刻下的該第二光束的光強大於在該複數第一時刻中除該特徵時刻外的任意一個第一時刻下該第二光束的光強。In some embodiments, the second detection information includes the intensity of the second light beam; the intensity of the second light beam at the characteristic moment is greater than the intensity of the second light beam at any first moment among the multiple first moments except the characteristic moment.

在一些實施例中,該被測區域包括至少一個子區域,該探測影像包括與該至少一個子區域對應的至少一個像素,每個像素被配置為獲取一個子區域的第二光束;該第二探測資訊包括每個子區域形成的第二光束的光強,其中,在任一子區域的該特徵時刻下,該子區域的像素的灰階值大於在該複數第一時刻中除該特徵時刻外的任意一個第一時刻下該像素的灰階值;該處理系統被配置為根據該特徵時刻下該光學元件與該固定平面之間的該實際距離,確定該被測區域的高度資訊包括:根據每個子區域的特徵時刻下該光學元件與該固定平面之間的該實際距離,確定該子區域的高度資訊,從而得到該被測區域的高度資訊。In some embodiments, the measured area includes at least one sub-area, the detection image includes at least one pixel corresponding to the at least one sub-area, and each pixel is configured to obtain a second light beam of a sub-area; the second detection information includes the light intensity of the second light beam formed by each sub-area, wherein, at the characteristic moment of any sub-area, the grayscale value of the pixel of the sub-area is greater than the grayscale value of the pixel at any first moment among the multiple first moments except the characteristic moment; the processing system is configured to determine the height information of the measured area according to the actual distance between the optical element and the fixed plane at the characteristic moment, including: determining the height information of the sub-area according to the actual distance between the optical element and the fixed plane at the characteristic moment of each sub-area, thereby obtaining the height information of the measured area.

根據本揭露實施例的另一方面,提供一種測量方法,包括:光源產生原始光束,其中,從被測物體的被測區域返回的該原始光束為返回光束;光學元件根據該返回光束得到待處理光束,至少部分該待處理光束為第一光束;根據該第一光束得到第一探測資訊;使該光學元件與該被測物體沿該光學元件的光軸方向相對移動;和根據複數第一時刻中每個第一時刻下的該第一探測資訊,確定在每個第一時刻下該光學元件與該固定平面之間的實際距離。According to another aspect of the disclosed embodiment, a measurement method is provided, including: a light source generates an original light beam, wherein the original light beam returned from a measured area of the measured object is a returned light beam; an optical element obtains a light beam to be processed based on the returned light beam, and at least a portion of the light beam to be processed is a first light beam; first detection information is obtained based on the first light beam; the optical element and the measured object are moved relative to each other along the optical axis direction of the optical element; and the actual distance between the optical element and the fixed plane at each first moment in a plurality of first moments is determined based on the first detection information at each first moment in a plurality of first moments.

在一些實施例中,確定在每個第一時刻下該光學元件與被測物體之間的實際距離包括:使該光學元件與該被測物體沿該光軸方向相對移動,以在複數第二時刻下使該光學元件與該固定平面之間具有期望的複數預定距離;獲取該複數第二時刻中的每個第二時刻下的該第一探測資訊;和根據該複數預定距離和每個第二時刻下的該複數第一探測資訊,確定在每個第一時刻下該光學元件與該固定平面之間的該實際距離。In some embodiments, determining the actual distance between the optical element and the object to be measured at each first moment includes: moving the optical element and the object to be measured relative to each other along the optical axis so that the optical element has a desired plurality of predetermined distances from the fixed plane at a plurality of second moments; obtaining the first detection information at each second moment of the plurality of second moments; and determining the actual distance between the optical element and the fixed plane at each first moment based on the plurality of predetermined distances and the plurality of first detection information at each second moment.

在一些實施例中,根據該複數預定距離和每個第二時刻下的該複數第一探測資訊,確定在每個第一時刻下該光學元件與該固定平面之間的實際距離包括:對該複數預定距離中的每個預定距離進行線性處理,以得到移動參量;以每個第二時刻下的該移動參量和待求參量之間的差為獨立變數,以每個第二時刻下的該第一探測資訊為控制變數對待擬合函數進行擬合,以得到擬合函數;和根據該擬合函數和該複數第一時刻下的該第一探測資訊,確定在每個第一時刻下該光學元件與該固定平面之間的實際距離。In some embodiments, determining the actual distance between the optical element and the fixed plane at each first moment based on the multiple predetermined distances and the multiple first detection information at each second moment includes: linearly processing each of the multiple predetermined distances to obtain a movement parameter; fitting a function to be fitted using the difference between the movement parameter at each second moment and the parameter to be determined as an independent variable and the first detection information at each second moment as a control variable to obtain a fitting function; and determining the actual distance between the optical element and the fixed plane at each first moment based on the fitting function and the first detection information at the multiple first moments.

在一些實施例中,該光學元件包括第一分光器和反射鏡,該測量方法還包括:該第一分光器將該原始光束分為參考光束和入射到該被測區域的物光束,其中,從該被測區域返回該光學元件的該物光束為該返回光束;和該參考鏡使該參考光束沿預設軌跡傳播以得到預干涉光束,其中,該預干涉光束和該返回光束干涉以得到該待處理光束;該第一探測資訊包括該待處理光束中預定波長的光的強度;該待擬合函數為: ,其中,該線性處理包括乘以2Π/λ,r=1;或者,該線性處理包括乘以1,r=2Π/λ,λ為該預定波長光的波長; 以每個第二時刻下的該移動參量和待求參量之間的差為獨立變數,以每個第二時刻下的該第一探測資訊為控制變數對待擬合函數進行擬合,以得到擬合函數包括:以每個第二時刻下的該移動參量作為該待擬合函數中的x、以每個第二時刻下該預定波長的光的強度作為該待擬合函數中的I,對該待擬合函數進行擬合,以得到A、該待求參量x 0和B,從而得到該擬合函數;根據該擬合函數和該複數第一時刻下的該第一探測資訊,確定在每個第一時刻下該光學元件與該固定平面之間的實際距離包括:以每個第一時刻下該預定波長的光的強度作為該擬合函數中的I,計算該擬合函數中的x作為每個第一時刻下的該移動參量;和根據每個第一時刻下的該移動參量,確定在每個第一時刻下該光學元件與該固定平面之間的實際距離。 In some embodiments, the optical element includes a first beam splitter and a reflector, and the measurement method further includes: the first beam splitter splits the original light beam into a reference light beam and an object light beam incident on the measured area, wherein the object light beam returning from the measured area to the optical element is the return light beam; and the reference mirror propagates the reference light beam along a preset trajectory to obtain a pre-interference light beam, wherein the pre-interference light beam and the return light beam interfere to obtain the light beam to be processed; the first detection information includes the intensity of light of a predetermined wavelength in the light beam to be processed; the function to be fitted is: , wherein the linear processing includes multiplying by 2Π/λ, r=1; or, the linear processing includes multiplying by 1, r=2Π/λ, λ is the wavelength of the predetermined wavelength light; taking the difference between the movement parameter and the parameter to be determined at each second moment as an independent variable, and taking the first detection information at each second moment as a control variable to fit the function to be fitted, so as to obtain the fitting function, comprising: taking the movement parameter at each second moment as x in the function to be fitted, taking the intensity of the light of the predetermined wavelength at each second moment as I in the function to be fitted, fitting the function to be fitted, so as to obtain A, the parameter to be determined x, and the predetermined wavelength light intensity at each second moment as I in the function to be fitted. 0 and B, thereby obtaining the fitting function; determining the actual distance between the optical element and the fixed plane at each first moment according to the fitting function and the first detection information at the complex first moment, including: taking the intensity of the light of the predetermined wavelength at each first moment as I in the fitting function, calculating x in the fitting function as the movement parameter at each first moment; and determining the actual distance between the optical element and the fixed plane at each first moment according to the movement parameter at each first moment.

在一些實施例中,該測量方法還包括:根據第二光束得到第二探測資訊,該第二光束為部分該返回光束或部分該待處理光束,該第二探測資訊表徵該光學元件與該被測區域之間的相對位置;獲取該第二探測資訊為預設探測資訊時的第一時刻作為特徵時刻;獲取該特徵時刻下的該光學元件與該固定平面之間的該實際距離;和根據該特徵時刻下的該光學元件與該固定平面之間的該實際距離,確定該被測區域的高度資訊。In some embodiments, the measurement method further includes: obtaining second detection information based on a second light beam, the second light beam being part of the returned light beam or part of the light beam to be processed, the second detection information representing the relative position between the optical element and the measured area; obtaining the first moment when the second detection information is the default detection information as a characteristic moment; obtaining the actual distance between the optical element and the fixed plane at the characteristic moment; and determining the height information of the measured area based on the actual distance between the optical element and the fixed plane at the characteristic moment.

在一些實施例中,根據第二光束得到第二探測資訊包括:根據該第二光束得到探測影像;和根據該探測影像得到該第二探測資訊,該第二探測資訊包括第二光束的光強和該探測影像的對比度中的至少一項。In some embodiments, obtaining second detection information based on the second light beam includes: obtaining a detection image based on the second light beam; and obtaining the second detection information based on the detection image, the second detection information including at least one of the intensity of the second light beam and the contrast of the detection image.

在一些實施例中,該第二探測資訊包括該第二光束的光強;在該特徵時刻下的該第二光束的光強大於在該複數第一時刻中除該特徵時刻外的任意一個第一時刻下該第二光束的光強。In some embodiments, the second detection information includes the intensity of the second light beam; the intensity of the second light beam at the characteristic moment is greater than the intensity of the second light beam at any first moment among the multiple first moments except the characteristic moment.

在一些實施例中,該測量方法還包括:根據複數該被測區域相對於同一基準面的該高度資訊獲取該被測物體的形貌。In some embodiments, the measurement method further includes: obtaining the morphology of the object being measured based on the height information of multiple measured areas relative to the same reference plane.

藉由以下參照附圖對本揭露的示例性實施例的詳細描述,本揭露的其它特徵、方面及其優點將會變得清楚。Other features, aspects and advantages of the present disclosure will become apparent from the following detailed description of exemplary embodiments of the present disclosure with reference to the accompanying drawings.

現在將參照附圖來詳細描述本揭露的各種示例性實施例。對示例性實施例的描述僅僅是說明性的,決不作為對本揭露及其應用或使用的任何限制。本揭露可以以許多不同的形式實現,不限於這裡所述的實施例。提供這些實施例是為了使本揭露透徹且完整,並且向本領域技術人員充分表達本揭露的範圍。應注意到:除非另外具體說明,否則在這些實施例中闡述的部件和步驟的相對佈置、材料的組分、數位運算式和數值應被解釋為僅僅是示例性的,而不是作為限制。Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. The description of the exemplary embodiments is illustrative only and is in no way intended to limit the present disclosure and its application or use. The present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are provided to make the present disclosure thorough and complete and to fully convey the scope of the present disclosure to those skilled in the art. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, composition of materials, digital expressions and numerical values described in these embodiments should be interpreted as being exemplary only and not as limiting.

本揭露中使用的“第一”、“第二”以及類似的詞語並不表示任何順序、數量或者重要性,而只是用來區分不同的部分。“包括”或者“包含”等類似的詞語意指在該詞前的要素涵蓋在該詞後列舉的要素,並不排除也涵蓋其他要素的可能。“上”、“下”等僅用於表示相對位置關係,當被描述物件的絕對位置改變後,則該相對位置關係也可能相應地改變。The words "first", "second" and similar terms used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different parts. The words "include" or "comprise" and similar terms mean that the elements before the word include the elements listed after the word, and do not exclude the possibility of also including other elements. "Up", "down" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

在本揭露中,當描述到特定部件位於第一部件和第二部件之間時,在該特定部件與第一部件或第二部件之間可以存在居間部件,也可以不存在居間部件。當描述到特定部件連接其它部件時,該特定部件可以與該其它部件直接連接而不具有居間部件,也可以不與該其它部件直接連接而具有居間部件。In the present disclosure, when a specific component is described as being located between a first component and a second component, there may or may not be an intermediate component between the specific component and the first component or the second component. When a specific component is described as being connected to other components, the specific component may be directly connected to the other components without an intermediate component, or may not be directly connected to the other components but have an intermediate component.

本揭露使用的所有術語(包括技術術語或者科學術語)與本揭露所屬領域的普通技術人員理解的含義相同,除非另外特別定義。還應當理解,在諸如通用字典中定義的術語應當被解釋為具有與它們在相關技術的上下文中的含義相一致的含義,而不應用理想化或極度形式化的意義來解釋,除非這裡明確地這樣定義。All terms (including technical terms or scientific terms) used in this disclosure have the same meanings as those understood by ordinary technicians in the field to which this disclosure belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in an idealized or highly formalized meaning, unless explicitly defined as such here.

對於相關領域普通技術人員已知的技術、方法和設備可能不作詳細討論,但在適當情況下,該技術、方法和設備應當被視為說明書的一部分。Technologies, methods and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but where appropriate, such technologies, methods and equipment should be considered as part of the specification.

發明人注意到,帶動光學元件和被測物體相對移動時,由於移動誤差、測量系統的振動、環境振動等因素,期望使光學元件與被測物體的固定平面之間具有的預定距離往往與光學元件與被測物體的固定平面之間的實際距離並不相同。因此,根據預定距離來測量被測物體的高度資訊,將導致測量結果不準確。The inventors have noticed that when the optical element and the object to be measured are moved relative to each other, the predetermined distance between the optical element and the fixed plane of the object to be measured is often different from the actual distance between the optical element and the fixed plane of the object to be measured due to factors such as movement error, vibration of the measurement system, and environmental vibration. Therefore, measuring the height information of the object to be measured based on the predetermined distance will lead to inaccurate measurement results.

有鑑於此,本揭露實施例提供了如下技術方案。In view of this, the present disclosure provides the following technical solutions.

圖1是根據本揭露一些實施例的測量系統的結構示意圖。FIG1 is a schematic diagram of the structure of a measurement system according to some embodiments of the present disclosure.

如圖1所示,測量系統可以包括光源101、光學元件102、第一探測裝置103、移動設備104和處理系統105。As shown in FIG. 1 , the measurement system may include a light source 101, an optical element 102, a first detection device 103, a moving device 104 and a processing system 105.

光源101被配置為產生原始光束。在一些實施例中,原始光束可以為寬光譜光束,例如白光、紅外光、紫外光中的一者或多者組合。這裡,從被測物體A(例如晶圓等)的被測區域返回的原始光束為返回光束。The light source 101 is configured to generate an original light beam. In some embodiments, the original light beam may be a broad-spectrum light beam, such as a combination of one or more of white light, infrared light, and ultraviolet light. Here, the original light beam returned from the measured area of the measured object A (such as a wafer, etc.) is the return light beam.

在一些實施例中,光源101產生的原始光束可以直接入射到被測物體A。在另一些實施例中,參見圖1,光源101產生的原始光束可以經由光學元件102入射到被測物體A。例如,光源101產生的原始光束可以經整形鏡組201整形後入射到分光器202,經分光器202反射後入射到光學元件102,進而經由光學元件102入射到被測物體A。例如,整形鏡組201可以對光源101產生的原始光束進行準直、濾波等整形操作。In some embodiments, the original light beam generated by the light source 101 can be directly incident on the object A to be measured. In other embodiments, referring to FIG. 1 , the original light beam generated by the light source 101 can be incident on the object A to be measured via the optical element 102. For example, the original light beam generated by the light source 101 can be incident on the beam splitter 202 after being shaped by the shaping lens group 201, and then incident on the optical element 102 after being reflected by the beam splitter 202, and then incident on the object A to be measured via the optical element 102. For example, the shaping lens group 201 can perform shaping operations such as collimation and filtering on the original light beam generated by the light source 101.

光學元件102被配置為根據返回光束得到待處理光束。這裡,至少部分待處理光束為第一光束。The optical element 102 is configured to obtain a beam to be processed based on the returned beam. Here, at least part of the beam to be processed is a first beam.

在一些實施例中,光學元件102可以為干涉物鏡。這種情況下,待處理光束可以是干涉光束。在另一些實施例中,光學元件102可以為共聚焦物鏡。這種情況下,待處理光束可以是從被測物體A返回的返回光束。光學元件102被配置為將原始光束分為參考光束和入射到被測區域的物光束,其中,從被測區域返回光學元件的物光束形成返回光束,光學元件102還被配置為使參考光束與返回光束干涉。In some embodiments, the optical element 102 may be an interference objective. In this case, the light beam to be processed may be an interference light beam. In other embodiments, the optical element 102 may be a confocal objective. In this case, the light beam to be processed may be a return light beam returned from the object A to be measured. The optical element 102 is configured to separate the original light beam into a reference light beam and an object light beam incident on the measured area, wherein the object light beam returning to the optical element from the measured area forms a return light beam, and the optical element 102 is further configured to cause the reference light beam to interfere with the return light beam.

例如,光學元件102包括第一分光器112和參考鏡122,第一分光器112被配置為將原始光束分為參考光束和入射到被測物體A的被測區域的物光束;參考鏡122被配置為使參考光束沿預設軌跡傳播,以得到預干涉光束,其中,預干涉光束和返回光束干涉以得到待處理光束。For example, the optical element 102 includes a first beam splitter 112 and a reference mirror 122, the first beam splitter 112 is configured to split the original light beam into a reference beam and an object beam incident on the measured area of the measured object A; the reference mirror 122 is configured to make the reference beam propagate along a preset trajectory to obtain a pre-interference beam, wherein the pre-interference beam and the return beam interfere to obtain a beam to be processed.

在一個實施例中,第一分光器112被配置為將原始光束分為參考光束和入射到被測物體A的被測區域的物光束。這裡,從被測物體A的被測區域返回光學元件102的物光束為返回光束。參考鏡122被配置為藉由反射參考光束使參考光束沿預設軌跡傳播以得到預干涉光束。這裡,預干涉光束和返回光束干涉以得到待處理光束。例如,參考鏡122和第一分光器112均為半透半反鏡,並且,參考鏡122和第一分光器112平行設置。然而,本揭露實施例並不限於此。例如,在其他的實施例中,參考鏡122可以是反射鏡(例如圖6所示實施例)。In one embodiment, the first beam splitter 112 is configured to split the original light beam into a reference beam and an object beam incident on the measured area of the measured object A. Here, the object beam returning from the measured area of the measured object A to the optical element 102 is the return beam. The reference mirror 122 is configured to reflect the reference beam and cause the reference beam to propagate along a preset trajectory to obtain a pre-interference beam. Here, the pre-interference beam and the return beam interfere to obtain a beam to be processed. For example, the reference mirror 122 and the first beam splitter 112 are both semi-transparent and semi-reflective mirrors, and the reference mirror 122 and the first beam splitter 112 are arranged in parallel. However, the disclosed embodiments are not limited to this. For example, in other embodiments, the reference mirror 122 may be a reflective mirror (such as the embodiment shown in FIG. 6 ).

在其他實施例中,參考鏡122被配置為折射或衍射參考光束以得到預干涉光束。例如,參考鏡122為折射元件或衍射元件。In other embodiments, the reference mirror 122 is configured to refract or diffract the reference beam to obtain a pre-interference beam. For example, the reference mirror 122 is a refractive element or a diffractive element.

第一探測裝置103被配置為根據第一光束得到第一探測資訊。在一些實施例中,待處理光束是由上述反射光束和返回光束干涉得到的干涉光束。這種情況下,第一探測資訊可以包括待處理光束中預定波長的光的強度。例如,待處理光束包括複數波長的光。預定波長的光可以是複數波長的光中的任意一個波長的光。The first detection device 103 is configured to obtain first detection information based on the first light beam. In some embodiments, the light beam to be processed is an interference light beam obtained by interfering the above-mentioned reflected light beam and the return light beam. In this case, the first detection information may include the intensity of light of a predetermined wavelength in the light beam to be processed. For example, the light beam to be processed includes light of multiple wavelengths. The light of the predetermined wavelength may be any one of the multiple wavelengths.

移動設備104被配置為使光學元件102與被測物體A沿光學元件102的光軸方向相對移動。The moving device 104 is configured to move the optical element 102 and the object A to be measured relative to each other along the optical axis direction of the optical element 102 .

例如,移動設備104可以在處理系統105的控制下帶動光學元件102沿光學元件102的光軸方向相對於被測物體A移動。又例如,移動設備104可以在處理系統105的控制下帶動被測物體A沿光學元件102的光軸方向相對於光學元件102移動。這裡,光學元件102的光軸方向可以理解為進入光學元件102的返回光束的中心軸方向,例如圖1中的雙向箭頭所指方向。在一些實施例中,移動設備104可以是相移器。For example, the moving device 104 can drive the optical element 102 to move relative to the object A along the optical axis of the optical element 102 under the control of the processing system 105. For another example, the moving device 104 can drive the object A to move relative to the optical element 102 along the optical axis of the optical element 102 under the control of the processing system 105. Here, the optical axis of the optical element 102 can be understood as the central axis direction of the return light beam entering the optical element 102, such as the direction indicated by the bidirectional arrow in FIG. 1. In some embodiments, the moving device 104 can be a phase shifter.

沿光學元件102的光軸方向相對於被測物體A移動指的是光學元件102和被測物體A的移動方向具有沿光學元件102的光軸方向的分量,只要光學元件102和被測物體A的移動方向與光學元件102的光軸方向不垂直即可。Moving along the optical axis of the optical element 102 relative to the object A means that the moving directions of the optical element 102 and the object A have a component along the optical axis of the optical element 102, as long as the moving directions of the optical element 102 and the object A are not perpendicular to the optical axis of the optical element 102.

處理系統105被配置為根據複數第一時刻中每個第一時刻下的第一探測資訊,確定在每個第一時刻下光學元件102與被測物體A的固定平面之間的實際距離。這裡,被測物體A的固定平面可以是被測物體A的表面的任意區域所確定的平面。換言之,可以以被測物體A的任意平面作為被測物體A的固定平面。The processing system 105 is configured to determine the actual distance between the optical element 102 and the fixed plane of the measured object A at each first moment according to the first detection information at each first moment in the plurality of first moments. Here, the fixed plane of the measured object A can be a plane determined by any area of the surface of the measured object A. In other words, any plane of the measured object A can be used as the fixed plane of the measured object A.

應理解,在不同的第一時刻下,光學元件102與被測物體A的固定平面之間的實際距離不同。例如,處理系統105後續可以根據在每個第一時刻下光學元件102與被測物體A的固定平面之間的實際距離,確定被測區域的高度資訊。It should be understood that at different first moments, the actual distance between the optical element 102 and the fixed plane of the measured object A is different. For example, the processing system 105 can subsequently determine the height information of the measured area according to the actual distance between the optical element 102 and the fixed plane of the measured object A at each first moment.

處理系統105可以是電腦等其他能夠進行處理的設備。在一些實施例中,處理系統105可以包括記憶體和耦接至記憶體的處理器,處理器可以基於儲存在記憶體上的指令執行各種操作,例如,確定在每個第一時刻下光學元件102與被測物體A的固定平面之間的實際距離以及後文提到的操作。記憶體例如可以包括系統記憶體、固定非易失性儲存介質等。系統記憶體例如可以儲存有作業系統、應用程式、引導裝載程式(Boot Loader)以及其他程式等。The processing system 105 may be a computer or other device capable of processing. In some embodiments, the processing system 105 may include a memory and a processor coupled to the memory, and the processor may perform various operations based on instructions stored in the memory, for example, determining the actual distance between the optical element 102 and the fixed plane of the object A under test at each first moment and the operations mentioned later. The memory may include, for example, a system memory, a fixed non-volatile storage medium, etc. The system memory may store, for example, an operating system, an application, a boot loader, and other programs.

上述實施例中,光學元件102根據返回光束得到待處理光束,第一探測裝置103根據待處理光束的至少一部分(即第一光束)得到第一探測資訊。處理系統105根據複數第一時刻中每個第一時刻下的第一探測資訊,確定在每個第一時刻下光學元件102與被測物體A的固定平面之間的實際距離。這樣的方式下,利用複數第一時刻下的第一探測資訊可以得到在每個第一時刻下光學元件102與被測物體A的固定平面之間的實際距離。基於在每個第一時刻下光學元件102與被測物體A的固定平面之間的實際距離可以更準確地進行後續操作,例如,可以更準確地確定被測物體A的被測區域的高度資訊等。In the above embodiment, the optical element 102 obtains the light beam to be processed based on the returned light beam, and the first detection device 103 obtains the first detection information based on at least a portion of the light beam to be processed (i.e., the first light beam). The processing system 105 determines the actual distance between the optical element 102 and the fixed plane of the object A to be measured at each first moment based on the first detection information at each first moment in the plurality of first moments. In this way, the actual distance between the optical element 102 and the fixed plane of the object A to be measured at each first moment can be obtained using the first detection information at the plurality of first moments. Based on the actual distance between the optical element 102 and the fixed plane of the object A to be measured at each first moment, subsequent operations can be performed more accurately, for example, the height information of the measured area of the object A to be measured can be determined more accurately.

在一些實施例中,參見圖1,測量系統還可以包括第二探測裝置106。第二探測裝置106被配置為根據第二光束得到第二探測資訊。這裡,第二光束為部分待處理光束。例如,測量系統還包括第二分光器107,被配置為對待處理光束進行分光,以得到第二光束。例如,透過第二分光器107的待處理光束為第一光束,而被第二分光器107反射的待處理光束為第二光束,反之亦可。在其他的實施例中,第二光束可以為部分返回光束。這種情況下,第二分光器107被配置為對返回光束進行分光,以得到第二光束。後文將結合其他實施例(例如圖6所示實施例)進行說明。In some embodiments, referring to FIG1 , the measurement system may further include a second detection device 106. The second detection device 106 is configured to obtain second detection information based on the second light beam. Here, the second light beam is a portion of the light beam to be processed. For example, the measurement system further includes a second beam splitter 107, which is configured to split the light beam to be processed to obtain a second light beam. For example, the light beam to be processed that passes through the second beam splitter 107 is a first light beam, and the light beam to be processed that is reflected by the second beam splitter 107 is a second light beam, or vice versa. In other embodiments, the second light beam may be a portion of the returned light beam. In this case, the second beam splitter 107 is configured to split the returned light beam to obtain a second light beam. This will be described later in conjunction with other embodiments (such as the embodiment shown in FIG6 ).

第二探測資訊能夠表徵光學元件102與被測物體A的被測區域之間沿光學元件光軸方向的相對距離,即,第二探測資訊隨相對距離的變化而變化;根據第二探測資訊可以得到光學元件102與被測物體A的被測物體A的被測區域之間的相對距離。The second detection information can characterize the relative distance between the optical element 102 and the measured area of the measured object A along the optical axis direction of the optical element, that is, the second detection information changes with the change of the relative distance; the relative distance between the optical element 102 and the measured area of the measured object A can be obtained according to the second detection information.

在一些實施例中,第二探測裝置106可以根據第二光束得到探測影像(例如干涉影像或被測物體A的被測區域的影像),進而根據探測影像得到第二探測資訊。第二探測裝置106例如可以是照相機、攝影機等。在其他實施例中,該第二探測裝置106可以為單個光電二極體或光電倍增管。In some embodiments, the second detection device 106 can obtain a detection image (such as an interference image or an image of a detected area of the detected object A) according to the second light beam, and then obtain the second detection information according to the detection image. The second detection device 106 can be, for example, a camera, a video camera, etc. In other embodiments, the second detection device 106 can be a single photodiode or a photomultiplier tube.

這裡,第二探測資訊可以包括第二光束的光強和探測影像的對比度中的至少一項。例如,第二探測資訊可以包括第二光束的光強。又例如,第二探測資訊可以包括根據第二光束得到的探測影像的對比度。再例如,第二探測資訊可以包括第二光束的光強和探測影像的對比度。Here, the second detection information may include at least one of the intensity of the second light beam and the contrast of the detection image. For example, the second detection information may include the intensity of the second light beam. For another example, the second detection information may include the contrast of the detection image obtained based on the second light beam. For another example, the second detection information may include the intensity of the second light beam and the contrast of the detection image.

處理系統105還被配置為獲取第二探測資訊為預設探測資訊時的第一時刻作為特徵時刻;獲取特徵時刻下的光學元件102與被測物體A的固定平面之間的實際距離;根據特徵時刻下的光學元件102與被測物體A的固定平面之間的實際距離,確定被測區域的高度資訊。The processing system 105 is also configured to obtain the first moment when the second detection information is the preset detection information as a characteristic moment; obtain the actual distance between the optical element 102 and the fixed plane of the object A to be measured at the characteristic moment; and determine the height information of the measured area according to the actual distance between the optical element 102 and the fixed plane of the object A to be measured at the characteristic moment.

在一些實施例中,第二探測資訊可以包括第二光束的光強。在特徵時刻下的第二光束的光強大於在複數第一時刻中除特徵時刻外的任意一個第一時刻下第二光束的光強。換言之,在特徵時刻下的第二光束的光強最大。例如,在特徵時刻下,參考光束的光程與物光束的光程相等。又例如,在特徵時刻下,光學元件102與被測物體A的被測區域之間的距離等於光學元件102的焦距。In some embodiments, the second detection information may include the intensity of the second light beam. The intensity of the second light beam at the characteristic moment is greater than the intensity of the second light beam at any first moment other than the characteristic moment among the plurality of first moments. In other words, the intensity of the second light beam at the characteristic moment is the largest. For example, at the characteristic moment, the optical path of the reference light beam is equal to the optical path of the object light beam. For another example, at the characteristic moment, the distance between the optical element 102 and the measured area of the measured object A is equal to the focal length of the optical element 102.

對於不同的被測區域來說,在特徵時刻下,光學元件102與不同的被測區域之間的距離相同。故,特徵時刻下的光學元件102與被測物體A的固定平面之間的實際距離可以反應被測區域的高度。例如,對於被測區域A1來說,特徵時刻下的光學元件102與被測物體A的固定平面之間的實際距離為h1;對於被測區域A2來說,特徵時刻下的光學元件102與被測物體A的固定平面之間的實際距離為h2。h1與h2之間的差值即為被測區域A1和被測區域A2的高度差。For different measured areas, at the characteristic moment, the distance between the optical element 102 and the different measured areas is the same. Therefore, the actual distance between the optical element 102 and the fixed plane of the measured object A at the characteristic moment can reflect the height of the measured area. For example, for the measured area A1, the actual distance between the optical element 102 and the fixed plane of the measured object A at the characteristic moment is h1; for the measured area A2, the actual distance between the optical element 102 and the fixed plane of the measured object A at the characteristic moment is h2. The difference between h1 and h2 is the height difference between the measured area A1 and the measured area A2.

在一些實施例中,被測區域包括至少一個子區域,探測影像包括與至少一個子區域對應的至少一個像素。例如,被測區域包括複數子區域,探測影像包括與複數子區域一一對應的複數像素。第二探測資訊可以包括每個像素獲取的第二光束的光強。這種情況下,預設探測資訊為像素的最大灰階值。特徵時刻為灰階值最大的第一時刻。每個像素均具有一個特徵時刻,即每個子區域對應一個特徵時刻。在每個子區域的特徵時刻下,該子區域對應的像素的灰階值大於在複數第一時刻中除特徵時刻外的任意一個第一時刻下該像素的灰階值。換言之,對於某個像素來說,在特徵時刻下的該像素的灰階值最大。In some embodiments, the detected area includes at least one sub-area, and the detection image includes at least one pixel corresponding to the at least one sub-area. For example, the detected area includes a plurality of sub-areas, and the detection image includes a plurality of pixels corresponding one to one to the plurality of sub-areas. The second detection information may include the light intensity of the second light beam obtained by each pixel. In this case, the detection information is preset to be the maximum grayscale value of the pixel. The characteristic moment is the first moment with the largest grayscale value. Each pixel has a characteristic moment, that is, each sub-area corresponds to a characteristic moment. At the characteristic moment of each sub-area, the grayscale value of the pixel corresponding to the sub-area is greater than the grayscale value of the pixel at any first moment among the plurality of first moments except the characteristic moment. In other words, for a certain pixel, the grayscale value of the pixel at the characteristic moment is the largest.

在另一些實施例中,預設探測資訊為複數像素的灰階值的均值或總和值最大時的值;特徵時刻為複數像素的灰階值的均值或總和值最大時的第一時刻。In some other embodiments, the detection information is preset to be the value when the mean or sum of the grayscale values of the plurality of pixels is maximum; the characteristic moment is the first moment when the mean or sum of the grayscale values of the plurality of pixels is maximum.

處理系統105被配置為根據特徵時刻下光學元件102與固定平面之間的實際距離,確定每個像素對應的子區域的高度資訊。在得到每個像素對應的子區域的高度資訊後即得到了被測區域的高度資訊。The processing system 105 is configured to determine the height information of the sub-region corresponding to each pixel according to the actual distance between the optical element 102 and the fixed plane at the characteristic moment. After obtaining the height information of the sub-region corresponding to each pixel, the height information of the measured area is obtained.

子區域對應的特徵時刻下的光學元件102與被測物體A的固定平面之間的實際距離可以反應該子區域的高度。例如,對於被測區域A的子區域A11來說,特徵時刻下的光學元件102與被測物體A的固定平面之間的實際距離為h11;對於被測區域A的子區域A12來說,特徵時刻下的光學元件102與被測物體A的固定平面之間的實際距離為h12。h11與h12之間的差值即為子區域A11和子區域A12之間的高度差。The actual distance between the optical element 102 and the fixed plane of the measured object A at the characteristic moment corresponding to the sub-region can reflect the height of the sub-region. For example, for the sub-region A11 of the measured area A, the actual distance between the optical element 102 and the fixed plane of the measured object A at the characteristic moment is h11; for the sub-region A12 of the measured area A, the actual distance between the optical element 102 and the fixed plane of the measured object A at the characteristic moment is h12. The difference between h11 and h12 is the height difference between the sub-region A11 and the sub-region A12.

在一些實施例中,可以利用測量系統對被測物體的複數被測區域進行測量,從而得到每個被測區域相對於同一基準面的高度資訊。在得到每個被測區域相對於同一基準面的高度資訊後,可以得到被測物體的三維形貌。例如,可以將複數被測區域的高度資訊拼接,以被測物體的三維形貌。In some embodiments, a measurement system can be used to measure multiple measured areas of the measured object, thereby obtaining height information of each measured area relative to the same reference plane. After obtaining the height information of each measured area relative to the same reference plane, the three-dimensional shape of the measured object can be obtained. For example, the height information of multiple measured areas can be spliced to obtain the three-dimensional shape of the measured object.

在一些實施例中,參見圖1,測量系統還包括資料獲取系統108,被配置為在複數第一時刻中的每個第一時刻發出同步觸發訊號。第一探測裝置103被配置為回應於同步觸發訊號,根據第一光束得到第一探測資訊。第二探測裝置106被配置為回應於同步觸發訊號,根據第二光束得到第二探測資訊。這樣,第一探測裝置103可以得到複數第一時刻下的第一探測資訊,第二探測裝置106可以得到複數第一時刻下的第二探測資訊。資料獲取系統108可以從第一探測裝置103採集複數第一時刻下的第一探測資訊,並從第二探測裝置106採集複數第一時刻下的第二探測資訊,並傳輸至處理系統105。In some embodiments, referring to FIG. 1 , the measurement system further includes a data acquisition system 108, which is configured to send a synchronization trigger signal at each first moment in a plurality of first moments. The first detection device 103 is configured to respond to the synchronization trigger signal and obtain first detection information according to the first light beam. The second detection device 106 is configured to respond to the synchronization trigger signal and obtain second detection information according to the second light beam. In this way, the first detection device 103 can obtain the first detection information at the plurality of first moments, and the second detection device 106 can obtain the second detection information at the plurality of first moments. The data acquisition system 108 can collect the first detection information at the plurality of first moments from the first detection device 103, and collect the second detection information at the plurality of first moments from the second detection device 106, and transmit them to the processing system 105.

下面結合圖2和圖3介紹第一探測裝置103的不同實現方式。需要說明的是,本說明書中各個實施例均採用遞進的方式描述,每個實施例重點說明的都是與其它實施例的不同之處,各個實施例之間相同或相似的部分相互參見即可。Different implementations of the first detection device 103 are described below in conjunction with Figures 2 and 3. It should be noted that each embodiment in this specification is described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referenced to each other.

圖2是根據本揭露另一些實施例的測量系統的結構示意圖。FIG2 is a schematic diagram of the structure of a measurement system according to other embodiments of the present disclosure.

如圖2所示,第一探測裝置103為光譜儀。例如,第一探測裝置103可以包括光柵113和光強探測器123(例如光電探測器)。光柵113被配置為使得第一光束中不同波長的光入射到光強探測器123的不同區域,即光柵113具有分光作用。光強探測器123被配置為探測第一光束中複數波長的光的光強。處理系統105可以根據複數波長的光中預定波長的光的強度(即第一探測資訊)進行後續分析。As shown in FIG2 , the first detection device 103 is a spectrometer. For example, the first detection device 103 may include a grating 113 and a light intensity detector 123 (e.g., a photoelectric detector). The grating 113 is configured to allow light of different wavelengths in the first light beam to be incident on different regions of the light intensity detector 123, i.e., the grating 113 has a spectroscopic effect. The light intensity detector 123 is configured to detect the intensity of light of multiple wavelengths in the first light beam. The processing system 105 may perform subsequent analysis based on the intensity of light of a predetermined wavelength in the multiple wavelengths of light (i.e., the first detection information).

圖3是根據本揭露另一些實施例的測量系統的結構示意圖。FIG3 is a schematic diagram of the structure of a measurement system according to some other embodiments of the present disclosure.

如圖3所示,第一探測裝置103可以包括濾波片113’和光強探測器123。濾波片113’被配置為使第一光束中的複數波長的光中預定波長的光到達光強探測器123,而複數波長中其他波長的光不會到達光強探測器123。換言之,濾波片113’僅允許預定波長的光藉由。這種情況下,光強探測器123可以直接探測到預定波長的光的強度。As shown in FIG3 , the first detection device 103 may include a filter plate 113′ and a light intensity detector 123. The filter plate 113′ is configured to allow light of a predetermined wavelength among the light of multiple wavelengths in the first light beam to reach the light intensity detector 123, while light of other wavelengths among the multiple wavelengths will not reach the light intensity detector 123. In other words, the filter plate 113′ only allows light of a predetermined wavelength to pass through. In this case, the light intensity detector 123 can directly detect the intensity of the light of the predetermined wavelength.

在一些實施例中,參見圖2和圖3,測量系統還可以包括第一光闌109’,例如孔徑光闌。第一光闌109’被配置為阻擋待處理光束中與待測處理光束的中心軸之間的夾角大於第一預設夾角的部分進入第一探測裝置103。換言之,待處理光束中與待測處理光束的中心軸之間的夾角小於或等於第一預設夾角的部分才能進入第一探測裝置103。應理解,第一預設夾角可以根據實際情況確定。這種情況下,第一探測裝置103無需探測整個待處理光束,減小了待處理光束邊緣的光的不利影響,提高了檢測精度。 In some embodiments, referring to FIG. 2 and FIG. 3, the measurement system may further include a first aperture 109', such as an aperture aperture. The first aperture 109' is configured to prevent the portion of the beam to be processed whose angle with the central axis of the processed beam to be measured is greater than the first preset angle from entering the first detection device 103. In other words, only the portion of the beam to be processed whose angle with the central axis of the processed beam to be measured is less than or equal to the first preset angle can enter the first detection device 103. It should be understood that the first preset angle can be determined according to the actual situation. In this case, the first detection device 103 does not need to detect the entire beam to be processed, which reduces the adverse effect of the light at the edge of the beam to be processed and improves the detection accuracy.

下面結合圖4和圖5介紹處理系統確定在每個第一時刻下光學元件與被測物體的固定平面之間的實際距離的一些具體實現方式。 The following introduces some specific implementation methods of the processing system determining the actual distance between the optical element and the fixed plane of the measured object at each first moment in combination with Figures 4 and 5.

圖4是根據本揭露一些實現方式的確定在每個第一時刻下光學元件與被測物體的固定平面之間的實際距離的流程示意圖。 FIG4 is a schematic diagram of a process for determining the actual distance between an optical element and a fixed plane of a measured object at each first moment according to some implementations of the present disclosure.

在步驟402,控制移動設備以使光學元件與被測物體沿光軸方向相對移動,以在複數第二時刻下使光學元件與固定平面之間具有期望的複數預定距離。 In step 402, the moving device is controlled to move the optical element and the object to be measured relative to each other along the optical axis so that the optical element and the fixed plane have a desired plurality of predetermined distances at a plurality of second moments.

這裡,複數第二時刻與複數第一時刻可以相同、也可以不同,或者,可以部分相同。 Here, the plurality of second moments and the plurality of first moments may be the same, different, or partially the same.

控制移動設備以使光學元件與被測物體沿光軸方向相對移動包括:移動設備使光學元件移動,或者移動設備使被測物體移動中的一者或兩者組合。 Controlling the moving device to make the optical element and the object to be measured move relative to each other along the optical axis includes: the moving device moves the optical element, or the moving device moves the object to be measured, or a combination of the two.

在步驟404,獲取複數第二時刻中的每個第二時刻下的第一探測資訊。In step 404, first detection information at each second moment in a plurality of second moments is obtained.

在步驟406,根據複數預定距離和每個第二時刻下的複數第一探測資訊,確定在每個第一時刻下光學元件與被測物體的固定平面之間的實際距離。In step 406, the actual distance between the optical element and the fixed plane of the object to be measured at each first moment is determined according to the plurality of predetermined distances and the plurality of first detection information at each second moment.

當該移動設備僅使光學元件移動時,確定在每個第一時刻下光學元件與被測物體的固定平面之間的實際距離包括確定每個第一時刻下光學元件與任一固定平面之間的距離;當移動設備僅使被測物體移動時,確定在每個第一時刻下光學元件與被測物體的固定平面之間的實際距離包括確定每個第一時刻下光學元件與任一固定平面之間的距離。When the mobile device only moves the optical element, determining the actual distance between the optical element and the fixed plane of the object to be measured at each first moment includes determining the distance between the optical element and any fixed plane at each first moment; when the mobile device only moves the object to be measured, determining the actual distance between the optical element and the fixed plane of the object to be measured at each first moment includes determining the distance between the optical element and any fixed plane at each first moment.

例如,步驟406可以藉由圖5所示步驟416-步驟436來實現。For example, step 406 can be implemented by steps 416 to 436 shown in FIG. 5 .

在步驟416,對複數預定距離中的每個預定距離進行線性處理,以得到移動參量。例如,對每個預定距離乘以某個常量,以得到移動參量。In step 416, each of the plurality of predetermined distances is linearly processed to obtain a movement parameter, for example, each predetermined distance is multiplied by a constant to obtain the movement parameter.

在步驟426,以每個第二時刻下的移動參量和待求參量之間的差為獨立變數,以每個第二時刻下的第一探測資訊為控制變數對待擬合函數進行擬合,以得到擬合函數。In step 426, the function to be fitted is fitted using the difference between the moving parameter at each second moment and the parameter to be determined as an independent variable and the first detection information at each second moment as a control variable to obtain a fitting function.

例如,待擬合函數例如可以包括三角函數展開式、多項式、傅立葉展開式等。For example, the function to be fitted may include a trigonometric function expansion, a polynomial, a Fourier expansion, etc.

在步驟436,根據擬合函數和複數第一時刻下的第一探測資訊,確定在每個第一時刻下光學元件與固定平面之間的實際距離。In step 436, the actual distance between the optical element and the fixed plane at each first moment is determined based on the fitting function and the first detection information at the plurality of first moments.

下面以光學元件102包括第一分光器112和參考鏡122、待擬合函數為三角函數為例,介紹步驟416-步驟436的一些具體實現方式。第一分光器112和參考鏡122的功能可以參照上文的描述,在此不再贅述。The following takes the optical element 102 including the first beam splitter 112 and the reference mirror 122, and the function to be fitted is a trigonometric function as an example to introduce some specific implementations of step 416 to step 436. The functions of the first beam splitter 112 and the reference mirror 122 can refer to the above description, and will not be repeated here.

該實現方式中,第一探測資訊包括待處理光束中預定波長的光的強度。待擬合函數為: 。這裡,A為預定波長的光的光強的幅度,x 0為待求參量,B為預定波長的光的光強的平均強度,r為1或2Π/λ,λ為預定波長光的波長。在步驟416中的線性處理為乘以2Π/λ的情況下,r=1,移動參量為相移量;在步驟416中的線性處理為乘以1的情況下,r=2Π/λ,移動參量等於預定距離。 In this implementation, the first detection information includes the intensity of light of a predetermined wavelength in the light beam to be processed. The function to be fitted is: Here, A is the amplitude of the light intensity of the predetermined wavelength, x0 is the parameter to be determined, B is the average intensity of the light intensity of the predetermined wavelength, r is 1 or 2Π/λ, and λ is the wavelength of the predetermined wavelength light. When the linear processing in step 416 is multiplied by 2Π/λ, r=1, and the shift parameter is the phase shift; when the linear processing in step 416 is multiplied by 1, r=2Π/λ, and the shift parameter is equal to the predetermined distance.

例如,以每個第二時刻下的移動參量作為待擬合函數中的x、以每個第二時刻下預定波長的光的強度作為待擬合函數中的I,對待擬合函數進行擬合,以得到A、待求參量x 0和B,從而得到擬合函數。 For example, the moving parameter at each second moment is taken as x in the function to be fitted, and the intensity of light of a predetermined wavelength at each second moment is taken as I in the function to be fitted, and the function to be fitted is fitted to obtain A, the parameters x0 and B to be determined, thereby obtaining the fitting function.

例如,複數第二時刻下預定波長的光的強度分別為I 1、I 2、I 3…,複數第二時刻下的移動參量為x 01、x 02、x 03…。以x 01、x 02、x 03…分別作為x、以I 1、I 2、I 3…分別作為I,對上式進行擬合,例如最小二乘法擬合等,從而可以得到A、x 0和B,即得到了擬合函數。 For example, the intensity of light of a predetermined wavelength at a plurality of second moments is I 1 , I 2 , I 3 ..., and the movement parameters at the plurality of second moments are x 01 , x 02 , x 03 .... With x 01 , x 02 , x 03 ... as x, and I 1 , I 2 , I 3 ... as I, the above formula is fitted, such as by least squares fitting, so that A, x 0 and B can be obtained, that is, the fitting function is obtained.

在得到A、x 0和B後,即得到了預定波長的光的光強I與移動參量x的關係式。之後,以每個第一時刻下預定波長的光的強度作為擬合函數中的I,計算擬合函數中的x作為每個第一時刻下的移動參量。 After obtaining A, x0 and B, the relationship between the intensity I of the light of the predetermined wavelength and the movement parameter x is obtained. Afterwards, the intensity of the light of the predetermined wavelength at each first moment is used as I in the fitting function, and x in the fitting function is calculated as the movement parameter at each first moment.

例如,將複數第一時刻下預定波長的光的強度I 1’、I 2’、I 3’…代入擬合函數,即可得到複數移動參量x 11、x1 2、x 13…。 For example, by substituting the intensities of light of a predetermined wavelength at a plurality of first moments I 1 ', I 2 ', I 3 ', ... into the fitting function, the complex movement parameters x 11 , x1 2 , x 13 , ... can be obtained.

然後,根據每個第一時刻下的移動參量,確定在每個第一時刻下光學元件與固定平面之間的實際距離。Then, based on the movement parameters at each first moment, the actual distance between the optical element and the fixed plane at each first moment is determined.

例如,每個第一時刻下光學元件與固定平面之間的實際距離等於每個第一時刻下的移動參量。又例如,每個第一時刻下光學元件與固定平面之間的實際距離等於每個第一時刻下的移動參量與2Π/λ的比值。For example, the actual distance between the optical element and the fixed plane at each first moment is equal to the movement parameter at each first moment. For another example, the actual distance between the optical element and the fixed plane at each first moment is equal to the ratio of the movement parameter at each first moment to 2Π/λ.

預定波長的光的光強與移動參量之間的關係符合上式,故以上式為待擬合函數能夠簡化計算過程,提高檢測速度。The relationship between the intensity of light of a predetermined wavelength and the movement parameter conforms to the above formula, so using the above formula as the function to be fitted can simplify the calculation process and improve the detection speed.

需要說明的是,處理系統105在對每個被測區域進行測量時,均可以按照上述方式擬合出相應的A、x 0和B,然後進行後續處理。這樣的方式得到的第一時刻下光學元件與固定平面之間的實際距離更準確,從而可以得到更準確的被測區域的高度資訊。 It should be noted that when the processing system 105 measures each measured area, it can fit the corresponding A, x0 and B in the above manner and then perform subsequent processing. In this way, the actual distance between the optical element and the fixed plane at the first moment is more accurate, so that more accurate height information of the measured area can be obtained.

還需要說明的是,當待擬合函數為三角函數展開式、多項式、傅立葉展開式時,可以對待擬合函數進行三角函數擬合、多項式擬合或傅裡葉級數擬合。It should also be noted that when the function to be fitted is a trigonometric function expansion, a polynomial, or a Fourier expansion, the function to be fitted can be subjected to trigonometric function fitting, polynomial fitting, or Fourier series fitting.

圖6是根據本揭露又一些實施例的測量系統的結構示意圖。圖7是根據本揭露再一些實施例的測量系統的結構示意圖。Fig. 6 is a schematic diagram of the structure of a measurement system according to some other embodiments of the present disclosure. Fig. 7 is a schematic diagram of the structure of a measurement system according to some other embodiments of the present disclosure.

下面結合圖1至圖3、以及圖6至圖7介紹根據本揭露一些實施例的測量系統。需要說明的是,在後面的描述中,不同實施例中相同或類似的部件的功能不再贅述。The following describes a measurement system according to some embodiments of the present disclosure in conjunction with Figures 1 to 3 and Figures 6 to 7. It should be noted that in the following description, the functions of the same or similar components in different embodiments will not be repeated.

在一些實施例中,光學元件102可以包括第一鏡頭132。第一鏡頭132可以被配置為收集返回光束或待處理光束。下面結合不同實施例進行說明。In some embodiments, the optical element 102 may include a first lens 132. The first lens 132 may be configured to collect a return beam or a beam to be processed. The following is described in conjunction with different embodiments.

在一些實施例中,參見圖6,光學元件102還包括第一鏡頭132,被配置為收集返回光束。這種情況下,第一光束由至少部分第一鏡頭132收集的返回光束形成。In some embodiments, referring to FIG6 , the optical element 102 further includes a first lens 132 configured to collect the return light beam. In this case, the first light beam is formed by at least a portion of the return light beam collected by the first lens 132.

在一些實施例中,參見圖6,當第一鏡頭132被配置為收集返回光束時,第二分光器107被配置為將第一鏡頭132收集的返回光束進行分光,以形成第二光束和第三光束。光學元件102被配置為根據第三光束得到待處理光束。第二探測裝置106根據第二光束得到第二探測資訊。例如,透過第一分光器112的第三光束與被第一分光器112反射的反射光束干涉以得到待處理光束。In some embodiments, referring to FIG. 6 , when the first lens 132 is configured to collect the return beam, the second beam splitter 107 is configured to split the return beam collected by the first lens 132 to form a second beam and a third beam. The optical element 102 is configured to obtain a beam to be processed based on the third beam. The second detection device 106 obtains second detection information based on the second beam. For example, the third beam passing through the first beam splitter 112 interferes with the reflected beam reflected by the first beam splitter 112 to obtain a beam to be processed.

在一些實施例中,參見圖6,在第一鏡頭132被配置為收集返回光束的情況下,光學元件102被配置為相對於第二分光器107移動。例如,移動設備104帶動光學元件102移動的情況下,第二分光器107相對靜止。6 , when the first lens 132 is configured to collect the return light beam, the optical element 102 is configured to move relative to the second beam splitter 107. For example, when the moving device 104 drives the optical element 102 to move, the second beam splitter 107 is relatively stationary.

在另一些實施例中,參見圖1至圖3、以及圖7,光學元件102還包括第一鏡頭132,被配置為收集待處理光束。這種情況下,第一光束由至少部分第一鏡頭132收集的待處理光束形成。In some other embodiments, referring to Figures 1 to 3 and 7, the optical element 102 further includes a first lens 132 configured to collect the light beam to be processed. In this case, the first light beam is formed by at least a portion of the light beam to be processed collected by the first lens 132.

在一些實施例中,參見圖1至圖3,當第一鏡頭132被配置為收集待處理光束時,第二分光器107被配置為對第一鏡頭132收集的待處理光束進行分光,以形成第一光束和第二光束。第一探測裝置103根據第一光束得到第一探測資訊,第二探測裝置106根據第二光束得到第二探測資訊。光學元件102被配置為相對於第二分光器107移動,例如,移動設備104帶動光學元件102移動的情況下,第二分光器107相對靜止。在一些實施例中,來自第一鏡頭132的待處理光束可以經分光器202的透射和彙聚透鏡203的彙聚後入射到第二分光器107。或者,來自第一鏡頭132的待處理光束可以經分光器202的反射和彙聚透鏡203的彙聚後入射到第二分光器107。In some embodiments, referring to FIGS. 1 to 3 , when the first lens 132 is configured to collect the light beam to be processed, the second beam splitter 107 is configured to split the light beam to be processed collected by the first lens 132 to form a first light beam and a second light beam. The first detection device 103 obtains first detection information based on the first light beam, and the second detection device 106 obtains second detection information based on the second light beam. The optical element 102 is configured to move relative to the second beam splitter 107. For example, when the moving device 104 drives the optical element 102 to move, the second beam splitter 107 is relatively stationary. In some embodiments, the light beam to be processed from the first lens 132 can be incident on the second beam splitter 107 after being transmitted by the beam splitter 202 and converged by the convergence lens 203. Alternatively, the light beam to be processed from the first lens 132 may be incident on the second beam splitter 107 after being reflected by the beam splitter 202 and converged by the convergence lens 203 .

在一些實施例中,參見圖7,光學元件還可以包括第二鏡頭110,被配置為收集第二光束。這種情況下,第二分光器107被配置為對返回光束進行分光,以得到第二光束。例如,第二光束可以由反射鏡304反射後被第二鏡頭110收集。In some embodiments, referring to FIG. 7 , the optical element may further include a second lens 110 configured to collect the second light beam. In this case, the second beam splitter 107 is configured to split the return light beam to obtain the second light beam. For example, the second light beam may be reflected by the reflector 304 and then collected by the second lens 110.

在一些實施例中,參見圖7,第二鏡頭110使第二光束的中心軸平行於光學元件102的移動方向,第二分光器107與光學元件102固定連接。這種情況下,光學元件102移動的情況下,第二鏡頭110和第二分光器107可以同時移動。In some embodiments, referring to FIG7 , the second lens 110 makes the central axis of the second light beam parallel to the moving direction of the optical element 102, and the second beam splitter 107 is fixedly connected to the optical element 102. In this case, when the optical element 102 moves, the second lens 110 and the second beam splitter 107 can move simultaneously.

在一些實施例中,參見圖6或圖7,光學元件包括鏡頭(例如圖6的鏡頭132或圖7的鏡頭110),鏡頭被配置為收集返回光並使返回光傳播至第二分光器107,或者鏡頭被配置為收集第二光束。第二分光器107被配置為將返回光束進行分光,以得到第二光束。測量系統還可以包括第二光闌109,被配置為阻擋第二光束中與第二光束的中心軸之間的夾角大於第二預設夾角的部分進入第二探測裝置106。換言之,第二光束中與第二光束的中心軸之間的夾角小於或等於第二預設夾角的部分才能進入第二探測裝置106。應理解,第二預設夾角可以根據實際情況確定。這裡,第二光闌109和第二探測裝置106均與鏡頭132或鏡頭110的焦平面共軛。In some embodiments, referring to FIG. 6 or FIG. 7 , the optical element includes a lens (e.g., lens 132 of FIG. 6 or lens 110 of FIG. 7 ), which is configured to collect the return light and propagate the return light to the second beam splitter 107, or the lens is configured to collect the second light beam. The second beam splitter 107 is configured to split the return light beam to obtain the second light beam. The measurement system may further include a second aperture 109, which is configured to block the portion of the second light beam whose angle with the central axis of the second light beam is greater than the second preset angle from entering the second detection device 106. In other words, only the portion of the second light beam whose angle with the central axis of the second light beam is less than or equal to the second preset angle can enter the second detection device 106. It should be understood that the second preset angle can be determined according to actual circumstances. Here, the second aperture 109 and the second detection device 106 are both concentric with the focal plane of the lens 132 or the lens 110.

具體的,當鏡頭被配置為收集返回光並使返回光傳播至第二分光器時,即圖6所示實施例,鏡頭為第一鏡頭132;當鏡頭被配置為收集第二光束時,即圖7所示實施例,鏡頭為第二鏡頭110。Specifically, when the lens is configured to collect the return light and transmit the return light to the second spectrometer, that is, the embodiment shown in FIG. 6 , the lens is the first lens 132 ; when the lens is configured to collect the second light beam, that is, the embodiment shown in FIG. 7 , the lens is the second lens 110 .

例如,參見圖6,第二光束被彙聚透鏡301彙聚後入射到第二光闌109,透過第二光闌109的第二光束入射到彙聚透鏡302,進而由彙聚透鏡303彙聚後入射到第二探測裝置106。For example, referring to FIG. 6 , the second light beam is focused by the focusing lens 301 and then incident on the second aperture 109 . The second light beam passing through the second aperture 109 is incident on the focusing lens 302 , and then is focused by the focusing lens 303 and then incident on the second detection device 106 .

例如,參見圖7,第二鏡頭110收集的第二光束經反射鏡305反射後入射到彙聚透鏡306,第二光束被彙聚透鏡306彙聚後入射到第二光闌109,透過第二光闌109的第二光束入射到彙聚透鏡307,進而由彙聚透鏡307彙聚後入射到第二探測裝置106。For example, referring to FIG. 7 , the second light beam collected by the second lens 110 is reflected by the reflector 305 and then incident on the focusing lens 306 . The second light beam is focused by the focusing lens 306 and then incident on the second aperture 109 . The second light beam passing through the second aperture 109 is incident on the focusing lens 307 , and then focused by the focusing lens 307 and then incident on the second detection device 106 .

第二探測裝置106為成像裝置或光強探測部件。成像裝置包括:相機或攝影機,光強探測部件包括單個光電二極體或光電倍增光。The second detection device 106 is an imaging device or a light intensity detection component. The imaging device includes: a camera or a video camera, and the light intensity detection component includes a single photodiode or a photomultiplier.

在圖6、圖7所示實施例中,第二探測裝置106為成像裝置或光強探測部件時,第二探測資訊包括第二光束的光強。In the embodiments shown in FIG. 6 and FIG. 7 , when the second detection device 106 is an imaging device or a light intensity detection component, the second detection information includes the light intensity of the second light beam.

當第二探測裝置106為成像裝置時,第二探測資訊包括:被測區域的探測影像。第二探測資訊包括第二光束的光強、探測影像的對比度、探測影像的彌散度中的一者或多者組合。When the second detection device 106 is an imaging device, the second detection information includes: a detection image of the detected area. The second detection information includes one or more combinations of the intensity of the second light beam, the contrast of the detection image, and the divergence of the detection image.

第二探測資訊為探測影像的彌散度時,特徵時刻的彌散度小於除特徵時刻之外的任意一個第一時刻的彌散度。When the second detection information is the divergence of the detection image, the divergence at the characteristic moment is smaller than the divergence at any first moment other than the characteristic moment.

圖1至圖3、圖6和圖7所示實施例中,第一探測裝置103與第二探測裝置106探測的的被測區域相同,根據第一探測裝置103獲取的第一探測資訊確定的實際距離能夠表示被測區域的高度,從而能夠提高檢測精度。In the embodiments shown in Figures 1 to 3, Figure 6 and Figure 7, the first detection device 103 and the second detection device 106 detect the same detected area, and the actual distance determined based on the first detection information obtained by the first detection device 103 can represent the height of the detected area, thereby improving the detection accuracy.

圖8是根據本揭露還一些實施例的測量系統的結構示意圖。FIG8 is a schematic diagram of the structure of a measurement system according to some other embodiments of the present disclosure.

如圖8所示,光源101包括第一子光源111和第二子光源121。第一子光源111被配置為產生第一原始光束。第二子光源121被配置為產生第二原始光束。換言之,光源101產生的原始光束包括第一原始光束和第二原始光束。As shown in Fig. 8, the light source 101 includes a first sub-light source 111 and a second sub-light source 121. The first sub-light source 111 is configured to generate a first original light beam. The second sub-light source 121 is configured to generate a second original light beam. In other words, the original light beams generated by the light source 101 include a first original light beam and a second original light beam.

從被測物體A的被測區域返回的返回光束包括第一返回光束和第二返回光束。第一返回光束為從被測物體A的被測區域返回的第一原始光束。第二返回光束為從被測物體A的被測區域返回的第二原始光束。The return beam returned from the measured area of the measured object A includes a first return beam and a second return beam. The first return beam is the first original beam returned from the measured area of the measured object A. The second return beam is the second original beam returned from the measured area of the measured object A.

光學元件102包括固定連接的第一光學元件1021和第二光學元件1022。第一光學元件1021被配置為根據第一返回光束形成待處理光束。這種情況下,第一光束為待處理光束。第二光學元件1022被配置為收集第二返回光束。這種情況下,第二光束為第二返回光束。The optical element 102 includes a first optical element 1021 and a second optical element 1022 that are fixedly connected. The first optical element 1021 is configured to form a beam to be processed based on the first return beam. In this case, the first beam is the beam to be processed. The second optical element 1022 is configured to collect the second return beam. In this case, the second beam is the second return beam.

第一探測裝置103被配置為根據第一光束得到第一探測資訊。第二探測裝置106被配置為根據第二光束得到第二探測資訊。The first detection device 103 is configured to obtain first detection information according to the first light beam. The second detection device 106 is configured to obtain second detection information according to the second light beam.

在一些實施例中,第一光學元件1021還被配置為收集第一原始光束,並使第一原始光束到達被測物體A的被測區域。第一光學元件1021包括色散棱鏡,被配置為使第一原始光束中不同波長的光彙聚至第一光學元件1021的光軸的不同位置。In some embodiments, the first optical element 1021 is further configured to collect the first original light beam and make the first original light beam reach the measured area of the measured object A. The first optical element 1021 includes a dispersion prism configured to converge light of different wavelengths in the first original light beam to different positions of the optical axis of the first optical element 1021.

第一光學元件1021的光軸為第一返回光束的中心軸。The optical axis of the first optical element 1021 is the central axis of the first return light beam.

在一些實施例中,第二光學元件1022還被配置為收集第二原始光束,並使第二原始光束到達被測區域。第二光學元件1022包括色散棱鏡,被配置為使第二原始光束中不同波長的光彙聚至第二光學元件1022的光軸的不同位置。在另一些實施例中,第二光學元件1022可以包括干涉物鏡,被配置為根據第二返回光束得到干涉光束,以干涉光束作為第二光束。In some embodiments, the second optical element 1022 is further configured to collect the second original light beam and make the second original light beam reach the measured area. The second optical element 1022 includes a dispersion prism configured to converge light of different wavelengths in the second original light beam to different positions of the optical axis of the second optical element 1022. In other embodiments, the second optical element 1022 may include an interference objective lens configured to obtain an interference light beam according to the second return light beam, and use the interference light beam as the second light beam.

圖8所示實施例中,第一探測裝置103為光譜儀。In the embodiment shown in FIG8 , the first detection device 103 is a spectrometer.

處理系統105被配置為根據複數第一時刻中每個第一時刻下的第一探測資訊,確定在每個第一時刻下光學元件102與被測物體A的固定平面之間的實際距離,包括:對於某一第一時刻,藉由第一探測裝置103獲取該第一時刻下第一光束中各波長的光強;根據光強最大的光強對應的波長,獲取該第一時刻下的實際距離。The processing system 105 is configured to determine the actual distance between the optical element 102 and the fixed plane of the object A to be measured at each first moment according to the first detection information at each first moment among the multiple first moments, including: for a certain first moment, obtaining the light intensity of each wavelength in the first light beam at the first moment by the first detection device 103; and obtaining the actual distance at the first moment according to the wavelength corresponding to the light intensity with the maximum light intensity.

圖9是根據本揭露一些實施例的測量方法的流程示意圖。該測量方法可以基於上述任意一個實施例的測量系統來實現。Fig. 9 is a schematic diagram of a measurement method according to some embodiments of the present disclosure. The measurement method can be implemented based on the measurement system of any of the above embodiments.

在步驟902,光源產生原始光束。這裡,從被測物體的被測區域返回的原始光束為返回光束。例如,原始光束可以包括白光、紫外光、紅外光中的一者或多者組合。In step 902, the light source generates an original light beam. Here, the original light beam returned from the measured area of the measured object is the return light beam. For example, the original light beam may include one or more combinations of white light, ultraviolet light, and infrared light.

在步驟904,光學元件根據返回光束得到待處理光束。這裡,至少部分待處理光束為第一光束。In step 904, the optical element obtains a beam to be processed according to the returned beam. Here, at least part of the beam to be processed is the first beam.

例如,光學元件可以包括干涉物鏡或共聚焦物鏡。For example, the optical element may include an interferometer objective or a confocal objective.

在步驟906,根據第一光束得到第一探測資訊。In step 906, first detection information is obtained based on the first light beam.

例如,第一探測裝置根據第一光束得到第一探測資訊。例如,第一探測資訊包括待處理光束中預定波長的光的光強。For example, the first detection device obtains the first detection information according to the first light beam. For example, the first detection information includes the light intensity of the light of the predetermined wavelength in the light beam to be processed.

在步驟908,使光學元件與被測物體沿光學元件的光軸方向相對移動。In step 908, the optical element and the object to be measured are moved relative to each other along the optical axis direction of the optical element.

例如,藉由控制移動設備帶動光學元件和被測物體中的至少一個移動。For example, at least one of the optical element and the object to be measured is moved by controlling the moving device.

在步驟910,根據複數第一時刻中每個第一時刻下的第一探測資訊,確定在每個第一時刻下光學元件與固定平面之間的實際距離。In step 910, the actual distance between the optical element and the fixed plane at each first moment is determined according to the first detection information at each first moment among the plurality of first moments.

步驟910的實現方式可以參照以上描述,在此不再贅述。The implementation of step 910 can refer to the above description and will not be repeated here.

上述實施例中,利用複數第一時刻下的第一探測資訊可以得到在每個第一時刻下光學元件與被測物體的固定平面之間的實際距離。基於在每個第一時刻下光學元件與被測物體的固定平面之間的實際距離可以更準確地進行後續操作,例如,可以更準確地確定被測物體的被測區域的高度資訊等。In the above embodiment, the actual distance between the optical element and the fixed plane of the object to be measured at each first moment can be obtained by using the first detection information at a plurality of first moments. Based on the actual distance between the optical element and the fixed plane of the object to be measured at each first moment, subsequent operations can be performed more accurately, for example, the height information of the measured area of the object to be measured can be determined more accurately.

在一些實施例中,圖9所示測量方法還包括圖10所示步驟912-步驟918。圖10是根據本揭露另一些實施例的測量方法的流程示意圖。In some embodiments, the measurement method shown in Figure 9 further includes steps 912 to 918 shown in Figure 10. Figure 10 is a flow chart of measurement methods according to other embodiments of the present disclosure.

在步驟912,根據第二光束得到第二探測資訊,第二光束為部分返回光束或部分待處理光束,第二探測資訊表徵光學元件與被測區域之間的相對位置。In step 912, second detection information is obtained according to the second light beam, where the second light beam is a part of the returned light beam or a part of the light beam to be processed, and the second detection information represents the relative position between the optical element and the detected area.

例如,根據第二光束得到第二探測資訊包括:根據第二光束得到探測影像;和根據探測影像得到第二探測資訊,第二探測資訊包括第二光束的光強和探測影像的對比度中的至少一項。For example, obtaining the second detection information based on the second light beam includes: obtaining a detection image based on the second light beam; and obtaining the second detection information based on the detection image, wherein the second detection information includes at least one of the intensity of the second light beam and the contrast of the detection image.

在一些實施例中,第二探測資訊包括第二光束的光強;在特徵時刻下的第二光束的光強大於在複數第一時刻中除特徵時刻外的任意一個第一時刻下第二光束的光強。In some embodiments, the second detection information includes the intensity of the second light beam; the intensity of the second light beam at the characteristic moment is greater than the intensity of the second light beam at any first moment among the multiple first moments except the characteristic moment.

在步驟914,獲取第二探測資訊為預設探測資訊時的第一時刻作為特徵時刻。In step 914, the first moment when the second detection information is the default detection information is obtained as the characteristic moment.

在步驟916,獲取特徵時刻下的光學元件與固定平面之間的實際距離。In step 916, the actual distance between the optical element and the fixed plane at the characteristic moment is obtained.

在步驟918,根據特徵時刻下的光學元件與固定平面之間的實際距離,確定被測區域的高度資訊。In step 918, the height information of the measured area is determined according to the actual distance between the optical element and the fixed plane at the characteristic moment.

在一些實施例中,測量方法還包括:根據複數被測區域相對於同一基準面的高度資訊獲取待測物的形貌。In some embodiments, the measurement method further includes: obtaining the morphology of the object to be measured based on height information of multiple measured areas relative to the same reference plane.

在一些實施例中,根據複數被測區域相對於同一基準面的高度資訊獲取待測物的形貌包括:對於每個被測區域重複上述光源產生原始光束;根據特徵時刻下的光學元件與固定表面之間的實際距離,確定被測區域的高度資訊的步驟;獲取每個被測區域相對於同一基準面的高度資訊;根據每個被測區域相對於同一基準面的高度資訊獲取待測物的形貌。In some embodiments, obtaining the morphology of the object to be measured based on the height information of multiple measured areas relative to the same reference plane includes: repeating the above-mentioned light source to generate an original light beam for each measured area; determining the height information of the measured area based on the actual distance between the optical element and the fixed surface at the characteristic moment; obtaining the height information of each measured area relative to the same reference plane; and obtaining the morphology of the object to be measured based on the height information of each measured area relative to the same reference plane.

例如,獲取每個被測區域相對於同一基準面的高度資訊的步驟包括:重複步驟902至步驟918的步驟,以獲取每個被測區域相對於初始基準面的高度;將每個被測區的初始基準面統一至同一基準面。For example, the step of obtaining the height information of each measured area relative to the same reference plane includes: repeating steps 902 to 918 to obtain the height of each measured area relative to the initial reference plane; unifying the initial reference plane of each measured area to the same reference plane.

至此,已經詳細描述了本揭露的各實施例。為了避免遮蔽本揭露的構思,沒有描述本領域所公知的一些細節。本領域技術人員根據上面的描述,完全可以明白如何實施這裡揭露的技術方案。So far, various embodiments of the present disclosure have been described in detail. In order to avoid obscuring the concept of the present disclosure, some details known in the art have not been described. Based on the above description, a person skilled in the art can fully understand how to implement the technical solution disclosed here.

本領域內的技術人員應當明白,本揭露的實施例可提供為方法、系統、或電腦程式產品。因此,本揭露可採用完全硬體實施例、完全軟體實施例、或結合軟體和硬體方面的實施例的形式。而且,本揭露可採用在一個或複數其中包含有電腦可用程式碼的電腦可用非暫態性儲存介質(包括但不限於磁碟記憶體、CD-ROM、光學記憶體等)上實施的電腦程式產品的形式。It will be appreciated by those skilled in the art that embodiments of the present disclosure may be provided as methods, systems, or computer program products. Thus, the present disclosure may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present disclosure may take the form of a computer program product implemented on one or more computer-usable non-transitory storage media (including but not limited to disk memory, CD-ROM, optical memory, etc.) containing computer-usable program code.

雖然已經藉由示例對本揭露的一些特定實施例進行了詳細說明,但是本領域的技術人員應該理解,以上示例僅是為了進行說明,而不是為了限制本揭露的範圍。本領域的技術人員應該理解,可在不脫離本揭露的範圍和精神的情況下,對以上實施例進行修改或者對部分技術特徵進行等同替換。本揭露的範圍由所附申請專利範圍來限定。Although some specific embodiments of the present disclosure have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustration only and are not intended to limit the scope of the present disclosure. Those skilled in the art should understand that the above embodiments may be modified or some technical features may be replaced by equivalents without departing from the scope and spirit of the present disclosure. The scope of the present disclosure is defined by the scope of the attached patent application.

101:光源 102:光學元件101: Light source 102: Optical element

103:第一探測裝置 103: First detection device

104:移動設備 104: Mobile devices

105:處理系統 105: Processing system

106:第二探測裝置 106: Second detection device

107:第二分光器 107: Second beam splitter

108:資料獲取系統 108:Data acquisition system

109’:第一光闌 109’: The First Light

109:第二光闌 109: The Second Light

110:第二鏡頭 110: Second shot

111:第一子光源 111: The first sub-light source

112:第一分光器 112: First spectrometer

113:光柵 113: Grating

113’:濾波片 113’: Filter

121:第二子光源 121: Second sub-light source

122:參考鏡 122: Reference mirror

123:光強探測器 123: Light intensity detector

132:第一鏡頭 132: First shot

201:整形鏡組 201: Plastic lens set

202:分光器 202:Spectrometer

203、301、302、303、306、307:彙聚透鏡 203, 301, 302, 303, 306, 307: Convergence lens

304:反射鏡 304: Reflector

305:反射鏡 305: Reflector

402、404、406、416、426、436:步驟 402, 404, 406, 416, 426, 436: Steps

1021:第一光學元件 1021: First optical element

1022:第二光學元件 1022: Second optical element

A:被測物體 A: Object to be measured

附圖構成本說明書的一部分,其描述了本揭露的示例性實施例,並且連同說明書一起用於解釋本揭露的原理,在附圖中: 圖1是根據本揭露一些實施例的測量系統的結構示意圖; 圖2是根據本揭露另一些實施例的測量系統的結構示意圖; 圖3是根據本揭露又一些實施例的測量系統的結構示意圖; 圖4是根據本揭露一些實現方式的確定在每個第一時刻下光學元件與被測物體的固定平面之間的實際距離的流程示意圖; 圖5示出了圖4中的步驟406的一個具體實現方式; 圖6是根據本揭露又一些實施例的測量系統的結構示意圖; 圖7是根據本揭露再一些實施例的測量系統的結構示意圖; 圖8是根據本揭露還一些實施例的測量系統的結構示意圖; 圖9是根據本揭露一些實施例的測量方法的流程示意圖; 圖10是根據本揭露另一些實施例的測量方法的流程示意圖。 應當明白,附圖中所示出的各個部分的尺寸並不是按照實際的比例關係繪製的。此外,相同或類似的參考標號表示相同或類似的構件。 The accompanying drawings constitute a part of this specification, which describes exemplary embodiments of the present disclosure and is used together with the specification to explain the principles of the present disclosure. In the accompanying drawings: Figure 1 is a structural schematic diagram of a measurement system according to some embodiments of the present disclosure; Figure 2 is a structural schematic diagram of a measurement system according to other embodiments of the present disclosure; Figure 3 is a structural schematic diagram of a measurement system according to some other embodiments of the present disclosure; Figure 4 is a flow chart of determining the actual distance between an optical element and a fixed plane of a measured object at each first moment according to some implementations of the present disclosure; Figure 5 shows a specific implementation of step 406 in Figure 4; Figure 6 is a structural schematic diagram of a measurement system according to some other embodiments of the present disclosure; Figure 7 is a structural schematic diagram of a measurement system according to some other embodiments of the present disclosure; FIG8 is a schematic diagram of the structure of a measurement system according to some embodiments of the present disclosure; FIG9 is a schematic diagram of the process of a measurement method according to some embodiments of the present disclosure; FIG10 is a schematic diagram of the process of a measurement method according to other embodiments of the present disclosure. It should be understood that the dimensions of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. In addition, the same or similar reference numerals represent the same or similar components.

101:光源 101: Light source

102:光學元件 102:Optical components

103:第一探測裝置 103: First detection device

104:移動設備 104: Mobile devices

105:處理系統 105: Processing system

106:第二探測裝置 106: Second detection device

107:第二分光器 107: Second beam splitter

108:資料獲取系統 108:Data acquisition system

112:第一分光器 112: First spectrometer

122:參考鏡 122: Reference mirror

132:第一鏡頭 132: First shot

201:整形鏡組 201: Plastic lens set

202:分光器 202:Spectrometer

203:彙聚透鏡 203: Convergence lens

A:被測物體 A: Object to be measured

Claims (19)

一種測量系統,包括:一光源,被配置為產生一原始光束,其中,從一被測物體的一被測區域返回的該原始光束形成一返回光束;一光學元件,被配置為根據該返回光束得到一待處理光束,其中,至少部分該待處理光束為一第一光束;一第一探測裝置,被配置為根據該第一光束得到一第一探測資訊;一移動設備,被配置為使該光學元件與該被測物體沿該光學元件的一光軸方向相對移動;和一處理系統,被配置為根據複數第一時刻中每個第一時刻下的該第一探測資訊,確定在每個第一時刻下該光學元件與該被測物體的一固定平面之間的實際距離,包括:控制該移動設備以使該光學元件與該被測物體沿該光軸方向相對移動,以在複數第二時刻下使該光學元件與該固定平面之間具有期望的複數預定距離;獲取該複數第二時刻中的每個第二時刻下的該第一探測資訊;和根據該複數預定距離和每個第二時刻下的該第一探測資訊,確定在每個第一時刻下該光學元件與該固定平面之間的該實際距離。 A measurement system includes: a light source configured to generate an original light beam, wherein the original light beam returned from a measured area of a measured object forms a return light beam; an optical element configured to obtain a to-be-processed light beam according to the return light beam, wherein at least a portion of the to-be-processed light beam is a first light beam; a first detection device configured to obtain a first detection information according to the first light beam; a moving device configured to move the optical element and the measured object relative to each other along an optical axis direction of the optical element; and a processing system configured to obtain a first detection information according to each first moment in a plurality of first moments. The first detection information is used to determine the actual distance between the optical element and a fixed plane of the object under test at each first moment, including: controlling the moving device to make the optical element and the object under test move relative to each other along the optical axis direction, so that the optical element and the fixed plane have a desired plurality of predetermined distances at a plurality of second moments; obtaining the first detection information at each second moment of the plurality of second moments; and determining the actual distance between the optical element and the fixed plane at each first moment according to the plurality of predetermined distances and the first detection information at each second moment. 如請求項1所述的測量系統,其中,該光學元件包括:一第一分光器,被配置為將該原始光束分為一參考光束和入射到該被測區域的一物光束,其中,從該被測區域返回該光學元件的該物光束形成該返回光束;和 一參考鏡,被配置為使該參考光束沿預設軌跡傳播以得到一預干涉光束,其中,該預干涉光束和該返回光束干涉以得到該待處理光束;該第一探測資訊包括該待處理光束中預定波長的光的強度。 The measurement system as described in claim 1, wherein the optical element comprises: a first beam splitter configured to split the original light beam into a reference light beam and an object light beam incident on the measured area, wherein the object light beam returning from the measured area to the optical element forms the return light beam; and a reference mirror configured to propagate the reference light beam along a preset trajectory to obtain a pre-interference light beam, wherein the pre-interference light beam and the return light beam interfere to obtain the light beam to be processed; the first detection information comprises the intensity of light of a predetermined wavelength in the light beam to be processed. 如請求項1或2所述的測量系統,其中,該處理系統被配置為根據該複數預定距離和每個第二時刻下的該複數第一探測資訊,確定在每個第一時刻下該光學元件與該固定平面之間的實際距離包括:對該複數預定距離中的每個預定距離進行一線性處理,以得到一移動參量;根據每個第二時刻下的該移動參量和一待求參量之間的差為和每個第二時刻下的該第一探測資訊,得到該第一探測資訊隨著第移動參量和第待求參量之間的差而變化的函數;和根據該函數和該複數第一時刻下的該第一探測資訊,確定在每個第一時刻下該光學元件與該固定平面之間的實際距離。 The measurement system as described in claim 1 or 2, wherein the processing system is configured to determine the actual distance between the optical element and the fixed plane at each first moment according to the plurality of predetermined distances and the plurality of first detection information at each second moment, including: performing a linear processing on each of the plurality of predetermined distances to obtain a movement parameter; obtaining a function in which the first detection information changes with the difference between the movement parameter and the parameter to be determined according to the difference between the movement parameter at each second moment and the first detection information at each second moment; and determining the actual distance between the optical element and the fixed plane at each first moment according to the function and the first detection information at the plurality of first moments. 如請求項3所述的測量系統,其中,該光學元件包括:一第一分光器,被配置為將該原始光束分為一參考光束和入射到該被測區域的物光束,其中,從該被測區域返回該光學元件的該物光束形成該返回光束;和一參考鏡,被配置為使該參考光束沿預設軌跡傳播以得到一預干涉光束,其中,該預干涉光束和該返回光束干涉以得到該待處理光束;該第一探測資訊包括該待處理光束中一預定波長的光的強度;該函數為擬合函數,待擬合函數為: I=A×cos r(x-x 0 )+B ,其中,該線性處理包括乘以2Π/λ,r=1;或者,該線性處理包括乘以1,r=2Π/λ,λ為該預定波長光的波長; 該處理系統被配置為以每個第二時刻下的該移動參量和一待求參量之間的差為獨立變數,以每個第二時刻下的該第一探測資訊為控制變數對該待擬合函數進行擬合,以得到該擬合函數,包括:以每個第二時刻下的該移動參量作為該待擬合函數中的x、以每個第二時刻下該預定波長的光的強度作為該待擬合函數中的I,對該待擬合函數進行最小二乘法擬合,以得到A、該待求參量x0和B,從而得到該擬合函數;根據該函數和該複數第一時刻下的該第一探測資訊,確定在每個第一時刻下該光學元件與該固定平面之間的實際距離包括:以每個第一時刻下該預定波長的光的強度作為該擬合函數中的I,計算該擬合函數中的x作為每個第一時刻下的該移動參量;和根據每個第一時刻下的該移動參量,確定在每個第一時刻下該光學元件與該固定平面之間的實際距離。 A measurement system as described in claim 3, wherein the optical element comprises: a first beam splitter configured to split the original light beam into a reference light beam and an object light beam incident on the measured area, wherein the object light beam returning from the measured area to the optical element forms the return light beam; and a reference mirror configured to propagate the reference light beam along a preset trajectory to obtain a pre-interference light beam, wherein the pre-interference light beam and the return light beam interfere to obtain the light beam to be processed; the first detection information comprises the intensity of light of a predetermined wavelength in the light beam to be processed; the function is a fitting function, and the function to be fitted is: I = A × cos r ( x - x 0 ) + B , wherein the linear processing comprises multiplication by 2Π/λ, r=1; or, the linear processing comprises multiplication by 1, r=2Π/λ, λ is the wavelength of the light of the predetermined wavelength; The processing system is configured to use the difference between the movement parameter at each second moment and a parameter to be determined as an independent variable, and use the first detection information at each second moment as a control variable to fit the function to be fitted, so as to obtain the fitting function, including: using the movement parameter at each second moment as x in the function to be fitted, using the intensity of the light of the predetermined wavelength at each second moment as I in the function to be fitted, and fitting the function to be fitted by the least square method to obtain A, the parameter to be determined x, and the control variable. 0 and B, thereby obtaining the fitting function; determining the actual distance between the optical element and the fixed plane at each first moment according to the function and the first detection information at the complex first moment, including: taking the intensity of the light of the predetermined wavelength at each first moment as I in the fitting function, calculating x in the fitting function as the movement parameter at each first moment; and determining the actual distance between the optical element and the fixed plane at each first moment according to the movement parameter at each first moment. 如請求項1所述的測量系統,其中,該第一探測裝置包括:一光柵和一濾波片中的一個;和一光強探測器。 A measurement system as described in claim 1, wherein the first detection device includes: one of a grating and a filter; and a light intensity detector. 如請求項1或請求項2所述的測量系統,還包括:一第二探測裝置,被配置為根據一第二光束得到一第二探測資訊,該第二光束為部分該返回光束或部分該待處理光束,該第二探測資訊表徵該光學元件與該被測區域之間在該光學元件的光軸方向上的相對距離;該處理系統還被配置為獲取該第二探測資訊為預設探測資訊時的第一時刻作為一特徵時刻;獲取該特徵時刻下的該光學元件與該固定平面之間的該實際 距離;根據該特徵時刻下的該光學元件與該固定平面之間的該實際距離,確定該被測區域的高度資訊。 The measurement system as described in claim 1 or claim 2 further comprises: a second detection device, configured to obtain a second detection information according to a second light beam, the second light beam being part of the return light beam or part of the light beam to be processed, the second detection information characterizing the relative distance between the optical element and the measured area in the direction of the optical axis of the optical element; the processing system is further configured to obtain the first moment when the second detection information is the preset detection information as a characteristic moment; obtain the actual distance between the optical element and the fixed plane at the characteristic moment; determine the height information of the measured area according to the actual distance between the optical element and the fixed plane at the characteristic moment. 如請求項6所述的測量系統,其中,該第二探測裝置被配置為根據第二光束得到一第二探測資訊包括:根據該第二光束得到一探測影像;和根據該探測影像得到該第二探測資訊,該第二探測資訊包括第二光束的光強和該探測影像的對比度中的至少一項。 The measurement system as described in claim 6, wherein the second detection device is configured to obtain a second detection information according to the second light beam, including: obtaining a detection image according to the second light beam; and obtaining the second detection information according to the detection image, wherein the second detection information includes at least one of the light intensity of the second light beam and the contrast of the detection image. 如請求項6所述的測量系統,還包括:一第二分光器,被配置為對該返回光束或該待處理光束進行分光,以得到該第二光束;一第一鏡頭,被配置為收集該返回光束,該第一光束由至少部分該第一鏡頭收集的該返回光束形成;或者,該第一鏡頭被配置為收集該待處理光束,該第一光束由至少部分該第一鏡頭收集的該待處理光束形成。 The measurement system as described in claim 6 further comprises: a second beam splitter configured to split the return beam or the beam to be processed to obtain the second beam; a first lens configured to collect the return beam, the first beam is formed by at least part of the return beam collected by the first lens; or the first lens is configured to collect the beam to be processed, the first beam is formed by at least part of the beam to be processed collected by the first lens. 如請求項8所述的測量系統,其中:當該第一鏡頭被配置為收集該返回光束時,該第二分光器被配置為將該第一鏡頭收集的該返回光束進行分光,以形成該第二光束和一第三光束,該光學元件被配置為根據該第三光束得到該待處理光束;當該第一鏡頭被配置為收集該待處理光束時,該第二分光器被配置為對該第一鏡頭收集的該待處理光束進行分光,以形成該第一光束和該第二光束。 A measurement system as described in claim 8, wherein: when the first lens is configured to collect the return beam, the second beam splitter is configured to split the return beam collected by the first lens to form the second beam and a third beam, and the optical element is configured to obtain the beam to be processed according to the third beam; when the first lens is configured to collect the beam to be processed, the second beam splitter is configured to split the beam to be processed collected by the first lens to form the first beam and the second beam. 如請求項8所述的測量系統,其中,該光學元件還包括:一第二鏡頭,被配置為收集該第二光束; 該第二分光器被配置為對該返回光束進行分光,以得到該第二光束,該第二鏡頭使該第二光束的中心軸平行於該光學元件的移動方向;該第二分光器與該光學元件固定連接。 The measurement system as described in claim 8, wherein the optical element further comprises: a second lens configured to collect the second light beam; the second beam splitter is configured to split the return light beam to obtain the second light beam, and the second lens makes the central axis of the second light beam parallel to the moving direction of the optical element; the second beam splitter is fixedly connected to the optical element. 如請求項9所述的測量系統,其中:該光學元件被配置為相對於該第二分光器移動。 A measurement system as described in claim 9, wherein: the optical element is configured to move relative to the second beam splitter. 如請求項8所述的測量系統,其中:該第二分光器被配置為將該返回光束進行分光,以得到該第二光束;該光學元件包括一鏡頭,該鏡頭被配置為收集該返回光束並使該返回光束傳播至該第二分光器,或者該鏡頭被配置為收集該第二光束;該測量系統還包括:一第二光闌,被配置為阻擋該第二光束中與該第二光束的中心軸之間的夾角大於第二預設夾角的部分進入該第二探測裝置,該第二光闌和該第二探測裝置均與該鏡頭的焦平面共軛。 The measurement system as described in claim 8, wherein: the second beam splitter is configured to split the return beam to obtain the second beam; the optical element includes a lens, the lens is configured to collect the return beam and propagate the return beam to the second beam splitter, or the lens is configured to collect the second beam; the measurement system further includes: a second aperture, configured to block the portion of the second beam whose angle with the central axis of the second beam is greater than a second preset angle from entering the second detection device, and the second aperture and the second detection device are both concentric with the focal plane of the lens. 如請求項6所述的測量系統,其中:該原始光束包括一第一原始光束和一第二原始光束;該光源包括:一第一子光源,被配置為產生該第一原始光束,和一第二子光源,被配置為產生該第二原始光束;該返回光束包括一第一返回光束和一第二返回光束,該第一返回光束為從該被測區域返回的該第一原始光束,該第二返回光束為從該被測區域返回的該第二原始光束;該光學元件包括: 一第一光學元件,被配置為根據該第一返回光束形成該待處理光束,該第一光束為該待處理光束,和一第二光學元件,被配置為收集該第二返回光束,該第二光束為該第二返回光束,該第一光學元件和第二光學元件固定連接。 The measurement system as described in claim 6, wherein: the original beam includes a first original beam and a second original beam; the light source includes: a first sub-light source configured to generate the first original beam, and a second sub-light source configured to generate the second original beam; the return beam includes a first return beam and a second return beam, the first return beam is the first original beam returned from the measured area, and the second return beam is the second original beam returned from the measured area; the optical element includes: a first optical element configured to form the beam to be processed according to the first return beam, the first beam is the beam to be processed, and a second optical element configured to collect the second return beam, the second beam is the second return beam, and the first optical element and the second optical element are fixedly connected. 如請求項6所述的測量系統,還包括:一資料獲取系統,被配置為在每個第一時刻發出一同步觸發訊號;該第一探測裝置被配置為回應於該同步觸發訊號,根據該第一光束得到該第一探測資訊;該第二探測裝置被配置為回應於該同步觸發訊號,根據該第二光束得到該第二探測資訊。 The measurement system as described in claim 6 further includes: a data acquisition system configured to send a synchronization trigger signal at each first moment; the first detection device is configured to respond to the synchronization trigger signal and obtain the first detection information according to the first light beam; the second detection device is configured to respond to the synchronization trigger signal and obtain the second detection information according to the second light beam. 如請求項6所述的測量系統,其中:該第二探測資訊包括該第二光束的光強;在該特徵時刻下的該第二光束的光強大於在該複數第一時刻中除該特徵時刻外的任意一個第一時刻下該第二光束的光強。 A measurement system as described in claim 6, wherein: the second detection information includes the light intensity of the second light beam; the light intensity of the second light beam at the characteristic moment is greater than the light intensity of the second light beam at any first moment among the plurality of first moments except the characteristic moment. 一種測量方法,包括:一光源產生一原始光束,其中,從一被測物體的被測區域返回的該原始光束為一返回光束;一光學元件根據該返回光束得到一待處理光束,至少部分該待處理光束為一第一光束;根據該第一光束得到一第一探測資訊;使該光學元件與該被測物體沿該光學元件的光軸方向相對移動;和 根據複數第一時刻中每個第一時刻下的該第一探測資訊,確定在每個第一時刻下該光學元件與一固定平面之間的實際距離,包括:使該光學元件與該被測物體沿該光軸方向相對移動,以在複數第二時刻下使該光學元件與該固定平面之間具有期望的複數預定距離;獲取該複數第二時刻中的每個第二時刻下的該第一探測資訊;和根據該複數預定距離和每個第二時刻下的該第一探測資訊,確定在每個第一時刻下該光學元件與該固定平面之間的該實際距離。 A measurement method, comprising: a light source generates an original light beam, wherein the original light beam returned from a measured area of a measured object is a return light beam; an optical element obtains a to-be-processed light beam according to the return light beam, at least a portion of the to-be-processed light beam is a first light beam; a first detection information is obtained according to the first light beam; the optical element and the measured object are moved relative to each other along the optical axis direction of the optical element; and according to the first detection information at each first moment in a plurality of first moments, a first detection information is determined at each first moment. The actual distance between the optical element and a fixed plane at a second moment includes: moving the optical element and the object to be measured relative to each other along the optical axis direction so that the optical element and the fixed plane have a desired plurality of predetermined distances at a plurality of second moments; obtaining the first detection information at each second moment of the plurality of second moments; and determining the actual distance between the optical element and the fixed plane at each first moment according to the plurality of predetermined distances and the first detection information at each second moment. 如請求項16所述的測量方法,其中,根據該複數預定距離和每個第二時刻下的該複數第一探測資訊,確定在每個第一時刻下該光學元件與該固定平面之間的實際距離包括:對該複數預定距離中的每個預定距離進行線性處理,以得到一移動參量;根據每個第二時刻下的該移動參量和一待求參量之間的差和每個第二時刻下的該第一探測資訊,得到該第一探測資訊隨著該移動參量和該待求參量之間的差而變化的函數;和根據該函數和該複數第一時刻下的該第一探測資訊,確定在每個第一時刻下該光學元件與該固定平面之間的實際距離。 The measurement method as described in claim 16, wherein determining the actual distance between the optical element and the fixed plane at each first moment according to the plurality of predetermined distances and the plurality of first detection information at each second moment comprises: performing linear processing on each of the plurality of predetermined distances to obtain a movement parameter; obtaining a function of the first detection information varying with the difference between the movement parameter and the parameter to be determined according to the difference between the movement parameter and the parameter to be determined at each second moment; and determining the actual distance between the optical element and the fixed plane at each first moment according to the function and the first detection information at the plurality of first moments. 如請求項16所述的測量方法,還包括:根據一第二光束得到一第二探測資訊,該第二光束為部分該返回光束或部分該待處理光束,該第二探測資訊表徵該光學元件與該被測區域之間的相對位置;獲取該第二探測資訊為預設探測資訊時的第一時刻作為一特徵時刻;獲取該特徵時刻下的該光學元件與該固定平面之間的該實際距離;和 根據該特徵時刻下的該光學元件與該固定平面之間的該實際距離,確定該被測區域的高度資訊。 The measurement method as described in claim 16 further includes: obtaining a second detection information based on a second light beam, the second light beam being part of the return light beam or part of the to-be-processed light beam, the second detection information representing the relative position between the optical element and the measured area; obtaining the first moment when the second detection information is the preset detection information as a characteristic moment; obtaining the actual distance between the optical element and the fixed plane at the characteristic moment; and determining the height information of the measured area based on the actual distance between the optical element and the fixed plane at the characteristic moment. 如請求項18所述的測量方法,其中:該第二探測資訊包括該第二光束的光強;在該特徵時刻下的該第二光束的光強大於在該複數第一時刻中除該特徵時刻外的任意一個第一時刻下該第二光束的光強。 The measurement method as described in claim 18, wherein: the second detection information includes the light intensity of the second light beam; the light intensity of the second light beam at the characteristic moment is greater than the light intensity of the second light beam at any first moment other than the characteristic moment in the plurality of first moments.
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