TWI843169B - Manufacturing method for microlens array - Google Patents

Manufacturing method for microlens array Download PDF

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TWI843169B
TWI843169B TW111129218A TW111129218A TWI843169B TW I843169 B TWI843169 B TW I843169B TW 111129218 A TW111129218 A TW 111129218A TW 111129218 A TW111129218 A TW 111129218A TW I843169 B TWI843169 B TW I843169B
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light
microlens array
manufacturing
photocurable resin
transparent substrate
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TW111129218A
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Chinese (zh)
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TW202407393A (en
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陳品銓
葉青松
謝智宇
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國立臺灣科技大學
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Abstract

A manufacturing method for microlens array includes steps as following. A grayscale digital photomask data corresponded to a microlens array pattern is provided. A transparent plate is provided. A light device is disposed below the transparent plate, the light device includes a light source and a light modulator. The light source is configured to emit a light. The light modulator is disposed on the path of the light and configured to reflect and modulate the light. A liquid photocurable resin is disposed on the top surface of the transparent plate. the light source is switched on, the emitted light would be reflected to the photocurable resin by the light modulator to form the microlens array pattern on the photocurable resin. The photocurable resin which is not cured is clean, and a microlens array is obtained.

Description

微透鏡陣列的製造方法 Method for manufacturing microlens array

一種微結構的製造方法,特別是一種微透鏡陣列的製造方法。 A method for manufacturing a microstructure, in particular a method for manufacturing a microlens array.

微透鏡陣列是一種被廣為應用的微結構元件之一,在生醫、光電、資訊儲存、通訊與發光二極體等不同的科技領域都能看到微透鏡陣列的應用。 Microlens array is one of the widely used microstructure components. It can be seen in different technology fields such as biomedicine, optoelectronics, information storage, communications and LEDs.

微透鏡陣列多採用軟微影技術(Soft Ligthography)作為基礎輔以不同的製程如回流、蝕刻、擠壓等等來製作,此技術在製程上有諸多限制,例如生產成本較高且製程時間長導致無法大量製作。 Microlens arrays are mostly manufactured based on soft lithography technology supplemented by different processes such as reflow, etching, extrusion, etc. This technology has many limitations in the process, such as high production costs and long process time, which makes it impossible to mass produce.

近年來,基於DLP的列印技術也逐漸被使用在高精密的3D微結構,DLP(Digital Light Process)-SLA(Stereolithography)3D列印技術原理為利用電腦數值控制紫外線UV(Ultraviolet)光源的投影來觸發的局部樹脂交聯反應來形成固化。目前,DLP-SLA列印機中的DMD晶片可以達到單像素尺寸級別的固化調整,但是DLP技術製作出的微結構仍無法滿足光學等級的要求。 In recent years, DLP-based printing technology has gradually been used in high-precision 3D microstructures. The principle of DLP (Digital Light Process)-SLA (Stereolithography) 3D printing technology is to use computer numerical control of the projection of ultraviolet UV (Ultraviolet) light source to trigger local resin cross-linking reaction to form solidification. At present, the DMD chip in the DLP-SLA printer can achieve single-pixel size level solidification adjustment, but the microstructure produced by DLP technology still cannot meet the requirements of optical level.

因此,如何解決上述問題辨識本領域具通常知識者值得去思量的。 Therefore, how to solve the above problems and identify the knowledgeable people in this field is worth considering.

有鑑於上述問題,本發明提出一種微透鏡陣列的製造方法,透過光固化樹脂製作微透鏡陣列,以製作出符合光學等級要求的微透鏡陣列。其具體技術手段如下: 一種微透鏡陣列的製造方法,包括:S10:提供對應一灰階數位光罩的資料,該灰階數位光罩對應到一微透鏡陣列圖案;S20:提供一透明基板;S30:在該透明基板下方設置一光機,該光機包括:一光源,適於發射一光線;及一光調變器,該光調變器是設置於該光線的路徑,適於反射與調變該光線,使該光線射向該透明基板;S40;根據該灰階數位光罩控制該光調變器;S50:在該透明基板的一上表面設置液態的一光固化樹脂;S60:啟動該光源,該光源發射的該光線經由該光調變器反射而射入至該光固化樹脂,以在該光固化樹脂上形成該微透鏡陣列圖案;及S70:清除未固化的該光固化樹脂,得到一微透鏡陣列。 In view of the above problems, the present invention proposes a method for manufacturing a microlens array, which is made by photocuring resin to produce a microlens array that meets the optical grade requirements. The specific technical means are as follows: A method for manufacturing a microlens array, including: S10: providing data corresponding to a grayscale digital mask, the grayscale digital mask corresponds to a microlens array pattern; S20: providing a transparent substrate; S30: setting an optical machine under the transparent substrate, the optical machine includes: a light source, suitable for emitting a light; and a light modulator, the light modulator is set in the path of the light, suitable for reflecting and modulating the light, The light is directed to the transparent substrate; S40; the light modulator is controlled according to the grayscale digital mask; S50: a liquid photocurable resin is disposed on an upper surface of the transparent substrate; S60: the light source is activated, and the light emitted by the light source is reflected by the light modulator and is directed to the photocurable resin to form the microlens array pattern on the photocurable resin; and S70: the uncured photocurable resin is removed to obtain a microlens array.

其中,步驟S40中還包括S41:在該光調變器與該透明基板之間設置一聚焦鏡,使穿過該聚焦鏡的該光線的反射焦點位置不在該透明基板的該上表面。 Wherein, step S40 also includes S41: a focusing lens is arranged between the light modulator and the transparent substrate so that the reflection focal point of the light passing through the focusing lens is not on the upper surface of the transparent substrate.

於上述的微透鏡陣列的製造方法中,其中,在步驟S10,在灰階的灰度值範圍分布在0至255時,該灰階數位光罩的灰度值為50至200。 In the above-mentioned method for manufacturing a microlens array, in step S10, when the grayscale value range of the grayscale is distributed between 0 and 255, the grayscale value of the grayscale digital mask is between 50 and 200.

於上述的微透鏡陣列的製造方法中,其中,步驟S40中還包括: S42:設定該光源的灰度值與持續時間。 In the above-mentioned method for manufacturing a microlens array, step S40 further includes: S42: Setting the grayscale value and duration of the light source.

於上述的微透鏡陣列的製造方法中,其中,在步驟S41中,該焦點位置與該透明基板的該上表面的距離是大於0μm並小於3000μm。 In the above-mentioned method for manufacturing a microlens array, in step S41, the distance between the focal point and the upper surface of the transparent substrate is greater than 0 μm and less than 3000 μm.

於上述的微透鏡陣列的製造方法中,其中,在步驟S50中,該光固化樹脂還包括光抑制劑。 In the above-mentioned method for manufacturing a microlens array, in step S50, the photocurable resin also includes a photoinhibitor.

於上述的微透鏡陣列的製造方法中,其中,光抑制劑的重量百分濃度為0.4wt%。 In the above-mentioned method for manufacturing the microlens array, the weight percent concentration of the light inhibitor is 0.4wt%.

於上述的微透鏡陣列的製造方法中,其中,在步驟S70中,是使用酒精與氣槍清除未固化的該光固化樹脂。 In the above-mentioned method for manufacturing a microlens array, in step S70, alcohol and an air gun are used to remove the uncured photocurable resin.

於上述的微透鏡陣列的製造方法中,其中,該光調變器為數位微鏡裝置。 In the above-mentioned method for manufacturing a microlens array, the light modulator is a digital microlens device.

於上述的微透鏡陣列的製造方法中,其中,在步驟S70中,該微透鏡陣列為多焦距微透鏡陣列或高填充因子微透鏡陣列。 In the above-mentioned method for manufacturing a microlens array, in step S70, the microlens array is a multi-focal length microlens array or a high filling factor microlens array.

S10~S70:流程圖步驟 S10~S70: Flowchart steps

110:透明基板 110: Transparent substrate

120:光機 120: Optical machine

121:光源 121: Light source

1211:光線 1211: Light

122:光調變器 122: Optical modulator

1221:底板 1221: Base plate

1222a~1222e:微鏡 1222a~1222e: Microscope

1223:微控制器 1223:Microcontroller

123:透鏡組 123: Lens set

124:稜鏡 124: Prism

125:聚焦鏡 125: Focusing lens

126:透明工作台 126: Transparent workbench

130:光固化樹脂 130: Light-curing resin

131:捨棄部 131: Abandonment Department

132、232a、232b、232c:微結構 132, 232a, 232b, 232c: microstructure

140:微透鏡陣列 140: Microlens array

240:多焦距微透鏡陣列 240: Multi-focal microlens array

300:圖案 300: Pattern

F、F’:焦點位置 F, F’: focus position

H、H’:距離 H, H’: distance

A-A:線 A-A: Line

圖1所繪示為本發明之微透鏡陣列的製造方法。 FIG1 shows the manufacturing method of the microlens array of the present invention.

圖2A所繪示為灰階數位光罩的示意圖。 Figure 2A shows a schematic diagram of a grayscale digital mask.

圖2B所繪示為投影圖案的示意圖。 Figure 2B shows a schematic diagram of the projection pattern.

圖2C所繪示為光調變器的示意圖。 FIG2C is a schematic diagram of an optical modulator.

圖3A所繪示為設定光線的方法。 Figure 3A shows how to set the light.

圖3B所繪示為焦點位置的示意圖。 Figure 3B shows a schematic diagram of the focal position.

圖4A所繪示為光固化樹脂固化的示意圖。 Figure 4A shows a schematic diagram of the curing of a light-curing resin.

圖4B所繪示為清除為固化的光固化樹脂示意圖。 FIG4B is a schematic diagram of the photocurable resin being cleared and cured.

圖5所繪示為光機設置的示意圖。 Figure 5 shows a schematic diagram of the optical machine setup.

圖6A所繪示失焦距離對表面粗糙度的影響。 Figure 6A shows the effect of defocus distance on surface roughness.

圖6B所繪示為失焦距離對解析度的影響。 Figure 6B shows the effect of defocus distance on resolution.

圖7A所繪示為多焦距微透鏡陣列的示意圖。 FIG7A is a schematic diagram of a multi-focal microlens array.

圖7B所繪示為多焦聚微透鏡陣列Z軸高低差圖。 Figure 7B shows the Z-axis height difference diagram of the multi-focal microlens array.

圖7C所繪示為高填充因子的微透鏡陣列示意圖。 Figure 7C shows a schematic diagram of a microlens array with a high fill factor.

請參閱圖1,圖1所繪示為本發明之微透鏡陣列的製造方法。首先,進行步驟S10,提供對應於一灰階數位光罩的資料,此灰階數位光罩是對應到一微透鏡陣列圖案。具體來說,在DLP(Direct Light Processing)的光固化3D列印機中,數位光罩的灰度值是與曝光能量成正比,而曝光能量則與欲形成的微透鏡高度成正比,因此可透過設計具有灰度值變化的數位光罩,亦即:灰階數位光罩,以達到形成曲面的功效。 Please refer to FIG. 1, which shows the manufacturing method of the microlens array of the present invention. First, step S10 is performed to provide data corresponding to a grayscale digital mask, which corresponds to a microlens array pattern. Specifically, in a DLP (Direct Light Processing) photocuring 3D printer, the grayscale value of the digital mask is proportional to the exposure energy, and the exposure energy is proportional to the height of the microlens to be formed. Therefore, a digital mask with a grayscale value change, that is, a grayscale digital mask, can be designed to achieve the effect of forming a curved surface.

請參閱圖2A,圖2A所繪示為灰階數位光罩的示意圖。在本實施例中,是使用MathWorks的MATLAB軟體來製作灰階數位光罩,是將灰階遞減的公式帶入程式碼,來產生灰階遞減的功效,從而產生圖2A的灰階數位光罩,灰色的圓點即為微透鏡結構的位置。其中,此程式碼還能定義數位光罩中圖案的數位光罩中圖形的尺寸、形狀和灰度值。 Please refer to FIG. 2A, which is a schematic diagram of a grayscale digital mask. In this embodiment, the grayscale digital mask is produced using the MATLAB software of MathWorks. The grayscale reduction formula is introduced into the code to produce the grayscale reduction effect, thereby producing the grayscale digital mask of FIG. 2A. The gray dots are the positions of the microlens structures. Among them, this code can also define the size, shape and grayscale value of the pattern in the digital mask.

請返參圖1,接著進行步驟S20,提供一透明基板,在本實施例中選用玻璃作為透明基板。然後,進行步驟S30,在透明基板下方設置一光機,光機包括一光源與一光調變器。其中,光源適於發射一光線,而光調變器是設置在光線的路徑上,光調變器適於調變光線,並使光線能夠射向透明基板。光調變器例如為數位微鏡裝置(Digital Micromirror Device,DMD),其反射面是由多個微形鏡面組成,可經由調整這些鏡面的角度來控制光線反射。 Please refer back to Figure 1, and then proceed to step S20 to provide a transparent substrate. In this embodiment, glass is selected as the transparent substrate. Then, proceed to step S30 to set an optical machine under the transparent substrate. The optical machine includes a light source and a light modulator. Among them, the light source is suitable for emitting a light ray, and the light modulator is set on the path of the light ray. The light modulator is suitable for modulating the light ray and allowing the light ray to be emitted to the transparent substrate. The light modulator is, for example, a digital micromirror device (DMD), whose reflective surface is composed of multiple micro-mirrors, and the light reflection can be controlled by adjusting the angles of these mirrors.

接著進行步驟S40,根據灰階數位光罩控制光調變器,也就是說透過所輸入的灰階數位光罩的資料,控制光調變器的反射表面(例如多個微形鏡面的反射角度),讓光線經由光調變器反射之後,照射物件時能夠形成對應微透鏡陣列圖案。 Then proceed to step S40, controlling the light modulator according to the grayscale digital mask, that is, controlling the reflective surface of the light modulator (such as the reflection angle of multiple micro-mirrors) through the input grayscale digital mask data, so that after the light is reflected by the light modulator, it can form a corresponding micro-lens array pattern when irradiating the object.

請參閱圖2B與圖2C,圖2B所繪示為投影圖案的示意圖,圖2C所繪示為光調變器的示意圖。對應灰階數位光罩的資料即是一種光調變器122的控制指令,讓 光調變器122以此控制每一個微鏡。光調變器122包括了一底板1221、多個微鏡1222a~1222e與一微控制器1223,這些微鏡1222a~1222e是設置在底板1221上,並且由微控制器1223控制這些微鏡1222a~1222e的角度。對應灰階數位光罩的資料便是輸入到光調變器122的微控制器1223中,讓微控制器1223根據對應灰階數位光罩的資料來控制微鏡1222a~1222e的角度,在光線1211被微鏡1222a~1222e反射之後,從而形成圖案300。 Please refer to FIG. 2B and FIG. 2C. FIG. 2B is a schematic diagram of a projection pattern, and FIG. 2C is a schematic diagram of a light modulator. The data corresponding to the grayscale digital mask is a control instruction of the light modulator 122, which allows the light modulator 122 to control each micromirror. The light modulator 122 includes a base plate 1221, a plurality of micromirrors 1222a~1222e, and a microcontroller 1223. The micromirrors 1222a~1222e are arranged on the base plate 1221, and the angles of the micromirrors 1222a~1222e are controlled by the microcontroller 1223. The data corresponding to the grayscale digital mask is input into the microcontroller 1223 of the light modulator 122, so that the microcontroller 1223 controls the angles of the micromirrors 1222a~1222e according to the data corresponding to the grayscale digital mask. After the light 1211 is reflected by the micromirrors 1222a~1222e, the pattern 300 is formed.

在圖案300中,剖面線越密集的區塊表示灰度值越低,而中心點則是灰度值較高的區塊,灰度值較高意味著需要較多的曝光能量,這是由微鏡1222a、1222b、1222d與1222e的旋轉角度,反射較多的光線1211至圖案300中心,而在圖300中心形成灰度值較高的區塊,同時形成周邊灰度值較低的區塊。須注意的是,圖案300的灰度值分佈僅是示意,並非代表真實的情況。在本實施例中,在整體灰階的灰度值範圍分布在0-255時,灰階數位光罩中像素的灰度值是落在50至200的範圍。因此,當光線1211射向光調變器122後,經由不同角度的微鏡1222a~1222e反射,即可在被照射的物件(例如光固化樹脂)上形成對應灰階數位光罩的圖案300。 In the pattern 300, the block with denser cross-section lines indicates a lower grayscale value, while the center point is a block with a higher grayscale value. A higher grayscale value means that more exposure energy is required. This is because the rotation angles of the microlenses 1222a, 1222b, 1222d, and 1222e reflect more light 1211 to the center of the pattern 300, and form a block with a higher grayscale value in the center of the pattern 300, while forming a block with a lower grayscale value in the periphery. It should be noted that the grayscale value distribution of the pattern 300 is only for illustration and does not represent the actual situation. In this embodiment, when the grayscale value range of the overall grayscale is distributed in the range of 0-255, the grayscale value of the pixel in the grayscale digital mask falls in the range of 50 to 200. Therefore, when the light 1211 is directed to the light modulator 122, it is reflected by the micro-mirrors 1222a-1222e at different angles, and a pattern 300 corresponding to a grayscale digital mask can be formed on the irradiated object (such as light-cured resin).

換言之,本發明所指之灰階數位光罩,即是一種對於光線投影後所期望得到的圖案,並以此做成控制光調變器的控制指令,控制光調變器讓光線反射後投影出對應的圖案,從而產生類似於光罩的效果,但須注意本發明所指之灰階數位光罩並非實體光罩。 In other words, the grayscale digital mask referred to in the present invention is a pattern that is expected to be obtained after light projection, and is used to control the light modulator, which controls the light modulator to project the corresponding pattern after light reflection, thereby producing an effect similar to a mask. However, it should be noted that the grayscale digital mask referred to in the present invention is not a physical mask.

請參閱圖3A,圖3A所繪示為設定光線的方法。在一實施例中,在進行步驟S40時,還包括步驟S41與S42。其中,步驟S41為在光調變器與透明基板之間設置一聚焦鏡,使穿過聚焦鏡的光線的反射焦點位置不在透明基板的上表面上。如此做的原因在於:DMD晶片上每個微鏡的間距(Gap)使投影的像素間會產生微小的死區(Dead space),導致在固化過程中會產生微米尺寸的鋸齒粗糙表面, 而本案的發明人發現可經由調整光線焦點,讓光線以失焦的狀態照射光固化樹脂,此方法或可稱為失焦法,從而修飾固化形成的微結構表面,使其具備更低的表面粗糙度。而在本實施例中,便是透過聚焦鏡加以控制光線的焦點,以達到失焦的功效。 Please refer to FIG. 3A , which shows a method for setting light. In one embodiment, when performing step S40, steps S41 and S42 are also included. Among them, step S41 is to set a focusing lens between the light modulator and the transparent substrate so that the reflection focus position of the light passing through the focusing lens is not on the upper surface of the transparent substrate. The reason for doing so is that the gap between each micro-mirror on the DMD chip will produce a tiny dead space between the projected pixels, resulting in a micron-sized saw-tooth rough surface during the curing process. The inventor of this case has found that the light can be adjusted to irradiate the light-curing resin in a defocused state. This method may be called a defocusing method, thereby modifying the microstructure surface formed by curing to have a lower surface roughness. In this embodiment, the focus of the light is controlled through a focusing lens to achieve a defocusing effect.

具體來說,請參閱圖3B,圖3B所繪示為焦點位置的示意圖。光固化樹脂130設置在透明基板110的上表面111,光固化樹脂130會是由與上表面111接觸的部位受到光線1211照射,而讓光線1121的焦點位置不落在透明基板110的上表面111,即是讓光線1211的焦點位置不落在光固化樹脂130受到光線1211照射的位置上,從而達到失焦的效果。 Specifically, please refer to FIG. 3B , which is a schematic diagram of the focal position. The photocurable resin 130 is disposed on the upper surface 111 of the transparent substrate 110 , and the photocurable resin 130 is irradiated by the light 1211 at the portion in contact with the upper surface 111 , so that the focal position of the light 1121 does not fall on the upper surface 111 of the transparent substrate 110 , that is, the focal position of the light 1211 does not fall on the position where the photocurable resin 130 is irradiated by the light 1211 , thereby achieving a defocusing effect.

例如,在圖3B中,可將光線1211的焦點設定在上表面之下的焦點位置F或是上表面之上的焦點位置F’,其中焦點位置F與上表面111的距離為H,焦點位置F’與上表面111的距離為H’。在一實施例中,距離H或H’為大於0μm且小於或等於3000μm。透過失焦法的設置,可有效降低光固化樹脂固化後的表面粗糙度。 For example, in FIG. 3B , the focus of the light 1211 can be set at a focus position F below the upper surface or a focus position F' above the upper surface, wherein the distance between the focus position F and the upper surface 111 is H, and the distance between the focus position F' and the upper surface 111 is H'. In one embodiment, the distance H or H' is greater than 0 μm and less than or equal to 3000 μm. By setting the defocus method, the surface roughness of the photocurable resin after curing can be effectively reduced.

而步驟S42則為設定灰度值與持續時間。需特別注意的是,灰度值乘上持續時間等於曝光能量,因此在步驟S42中便是控制光源的輸出能量,而不同的曝光能量則決定了光固化樹脂固化後的高度與直徑。 Step S42 is to set the grayscale value and duration. It should be noted that the grayscale value multiplied by the duration equals the exposure energy. Therefore, in step S42, the output energy of the light source is controlled, and different exposure energies determine the height and diameter of the photocurable resin after curing.

請返參圖1,光源設定好後,進行步驟S50,在透明基板的上表面設置液態的一光固化樹脂,光固化樹脂是一種高分子聚合物,受到特定波長照射之後便會固化成固體。在一實施例中,步驟S50中所設置的光固化樹脂中還添加了光抑制劑,所添加的重量百分濃度為0.4wt%,添加光抑制劑可讓光固化樹脂更適合製作光學元件。具體來說,本實施例是使用了由帆益科技自行開發之透明樹脂Durable,額外添加0.4wt%之光抑制劑,其最大抗拉強度為45MPa,最大延伸率為60%,拉伸模數為1.6GPa,蕭氏硬度為83。 Please refer back to Figure 1. After the light source is set, step S50 is performed to set a liquid photocurable resin on the upper surface of the transparent substrate. The photocurable resin is a high molecular polymer that will solidify into a solid after being irradiated with a specific wavelength. In one embodiment, a photoinhibitor is also added to the photocurable resin set in step S50, and the added weight percentage concentration is 0.4wt%. The addition of the photoinhibitor makes the photocurable resin more suitable for making optical components. Specifically, this embodiment uses the transparent resin Durable developed by Fanyi Technology, and an additional 0.4wt% photoinhibitor is added. Its maximum tensile strength is 45MPa, the maximum elongation is 60%, the tensile modulus is 1.6GPa, and the Schroeder hardness is 83.

將光固化樹脂設置於透明基板上後,進行步驟S60,啟動光源,光源發射的光線經由光調變器反射而射入至光固化樹脂。此時,光固化樹脂受到光線照射,被照射的部位便會開始固化,以在光固化樹脂上形成該微透鏡陣列。 After the photocurable resin is placed on the transparent substrate, step S60 is performed to start the light source, and the light emitted by the light source is reflected by the light modulator and injected into the photocurable resin. At this time, the photocurable resin is irradiated by the light, and the irradiated part will begin to cure to form the microlens array on the photocurable resin.

由於光線經過光調變器反射後,是在光固化樹脂上形成微透鏡陣列圖案(如圖2A的圖案),因此並不會使光固化樹脂全部固化,僅有受到照射的部位會固化,並且根據照射的曝光能量不同,將固化成不同的高度與直徑與形狀。接下來,進行步驟S70,將未固化的光固化樹脂清除,得到一微透鏡陣列。例如是使用酒精與氣槍清除還是液態的光固化樹脂,在透明基板上留下已固化而沒有被洗去的光固化樹脂,即是形成了微透鏡陣列。 Since the light is reflected by the light modulator, a microlens array pattern is formed on the photocurable resin (such as the pattern in Figure 2A), so the photocurable resin will not be completely cured, only the irradiated part will be cured, and it will be cured into different heights, diameters and shapes according to the different exposure energy. Next, step S70 is performed to remove the uncured photocurable resin to obtain a microlens array. For example, alcohol and air gun are used to remove liquid photocurable resin, and the cured photocurable resin that has not been washed away is left on the transparent substrate, which is to form a microlens array.

請參閱圖4A,圖4A所繪示為光固化樹脂固化的示意圖。光固化樹脂130被設置在透明基板110上,而經過調變後的光線1211會從下方穿過透明基板110照射光固化樹脂130。此時被照射的光固化樹脂130會固化形成多個微結構132,而未被照射的捨棄部131則會維持液態。 Please refer to FIG. 4A , which is a schematic diagram of curing of a photocurable resin. The photocurable resin 130 is disposed on the transparent substrate 110 , and the modulated light 1211 passes through the transparent substrate 110 from below to irradiate the photocurable resin 130 . At this time, the irradiated photocurable resin 130 will be cured to form a plurality of microstructures 132 , while the discarded portion 131 that is not irradiated will remain in a liquid state.

接著請參閱圖4B,圖4B所繪示為清除為固化的光固化樹脂示意圖。接著將捨棄部131清除,例如使用酒精與風槍清除捨棄部131。而固化的微結構132是黏著在透明基板110上,因此不會被清除。之後,留在透明基板110上的多個微結構132即形成了微透鏡陣列140。 Next, please refer to FIG. 4B , which is a schematic diagram of removing the uncured light-cured resin. Then, the discarded portion 131 is removed, for example, using alcohol and an air gun to remove the discarded portion 131. The cured microstructure 132 is adhered to the transparent substrate 110 and therefore will not be removed. Afterwards, the multiple microstructures 132 remaining on the transparent substrate 110 form a microlens array 140.

請參閱圖5,圖5所繪示為光機設置的示意圖。光機120是設置在透明基板110下方。透明基板110上則設置了光固化樹脂130。光機120包括了一光源121、一透鏡組123、一稜鏡124、一光調變器122、一聚焦鏡125與一透明工作台126。而光源121所發射的光線1211,會依序穿過透鏡組123與稜鏡124,之後與光調變器122接觸。透鏡組123適於折射光源121所發出的光線1211,並將使光線1211趨近於平行光,而稜鏡124則適於改變光線1211的光路,使光線1211射向光調變器122的反射面。光調變器122即為DMD晶片,適於將光線1211調變為對應灰階數位光 罩的投射圖案。聚焦鏡125則設置在光調變器與透明基板110之間,適於調整光調變器122所反射的光的焦點,讓穿過聚焦鏡的光線的反射焦點位置不在透明基板的上表面。透明工作台126設置在聚焦鏡125上方,用以乘載透明基板110。 Please refer to FIG. 5 , which is a schematic diagram of the optical machine configuration. The optical machine 120 is disposed below the transparent substrate 110. A photocurable resin 130 is disposed on the transparent substrate 110. The optical machine 120 includes a light source 121, a lens assembly 123, a prism 124, a light modulator 122, a focusing lens 125, and a transparent workbench 126. The light 1211 emitted by the light source 121 passes through the lens assembly 123 and the prism 124 in sequence, and then contacts the light modulator 122. The lens assembly 123 is suitable for refracting the light 1211 emitted by the light source 121 and making the light 1211 approach parallel light, while the prism 124 is suitable for changing the optical path of the light 1211 so that the light 1211 is directed toward the reflective surface of the light modulator 122. The light modulator 122 is a DMD chip, which is suitable for modulating the light 1211 into a projection pattern corresponding to a grayscale digital mask. The focusing lens 125 is arranged between the light modulator and the transparent substrate 110, and is suitable for adjusting the focus of the light reflected by the light modulator 122 so that the reflection focus position of the light passing through the focusing lens is not on the upper surface of the transparent substrate. The transparent workbench 126 is arranged above the focusing lens 125 to carry the transparent substrate 110.

透過光機120的設置,便可用於進行上述的步驟S10~S70,已完成微透鏡陣列的製作。光機120可為DLP的光固化3D列印機,在本實施例中,光機120為帆益科技生產之高精度3D列印機U-light。而經過實驗後,本發明微透鏡陣列的製造方法透過失焦法與光固化方式製作微透鏡陣列,可有效降低微透鏡陣列的表面粗糙度,並提高其解析度。以下將說明實驗的結果。 Through the setting of the optical machine 120, the above steps S10~S70 can be used to complete the production of the microlens array. The optical machine 120 can be a DLP light-curing 3D printer. In this embodiment, the optical machine 120 is a high-precision 3D printer U-light produced by Fanyi Technology. After experiments, the manufacturing method of the microlens array of the present invention uses the defocusing method and light-curing method to make the microlens array, which can effectively reduce the surface roughness of the microlens array and improve its resolution. The results of the experiment will be described below.

請參閱圖6A,圖6A所繪示失焦距離對表面粗糙度的影響。其中,失焦距離相當於圖3B中的距離H或H’,即是光線焦點距離透明基板上表面的距離,表面粗糙度則是形成微透鏡陣列時,微結構的表面粗糙度。而從圖6A中可以看出,在失焦距離為0時(即無失焦),表面粗糙度約為0.55μm,隨著失焦距離增加,表面粗糙度也逐步下降,當失焦距離達到3000μm時,表面粗糙度可達到0.1μm(100nm),明顯低於無失焦距離下的表面粗糙度。 Please refer to Figure 6A, which shows the effect of defocus distance on surface roughness. The defocus distance is equivalent to the distance H or H' in Figure 3B, that is, the distance between the light focus and the upper surface of the transparent substrate, and the surface roughness is the surface roughness of the microstructure when the microlens array is formed. As can be seen from Figure 6A, when the defocus distance is 0 (i.e., no defocus), the surface roughness is about 0.55μm. As the defocus distance increases, the surface roughness gradually decreases. When the defocus distance reaches 3000μm, the surface roughness can reach 0.1μm (100nm), which is significantly lower than the surface roughness without defocus distance.

接著,請參閱圖6B,圖6B所繪示為失焦距離對解析度的影響。從圖6B中可以看出,在失焦距離為0時,解析度為0 lp/mm,當失焦距離達到約1500μm時,解析度上升至約47 lp/mm。當失焦距離在1500μm至3000μm時,解析度則落在30~45 lp/mm之間,並沒有持續的提升。但仍可看出,相對於無失焦距離,失焦距離在1500μm之前,解析度都有顯著的提升。可見本發明之微透鏡陣列的製造方法可製作出品質更佳的微透鏡陣列。 Next, please refer to FIG. 6B, which shows the effect of defocus distance on resolution. As can be seen from FIG. 6B, when the defocus distance is 0, the resolution is 0 lp/mm, and when the defocus distance reaches about 1500μm, the resolution rises to about 47 lp/mm. When the defocus distance is between 1500μm and 3000μm, the resolution falls between 30~45 lp/mm, and there is no continuous improvement. However, it can still be seen that compared with no defocus distance, the resolution is significantly improved before the defocus distance is 1500μm. It can be seen that the manufacturing method of the microlens array of the present invention can produce a microlens array of better quality.

請參閱圖7A至圖7C,圖7A所繪示為多焦距微透鏡陣列的示意圖,圖7B所繪示為多焦聚微透鏡陣列Z軸高低差圖,圖7C所繪示為高填充因子的微透鏡陣列示意圖。其中圖7B為圖7A中A-A線的Z軸高低差圖。透過變更灰階數位光罩中灰度值的配置,本發明之微透鏡陣列的製造方法還能夠製作多焦距微透鏡陣列240以 及高填充因子的微透鏡陣列。從圖7A與圖7B中可以看出多焦距微透鏡陣列240包括了多個高度不同的微結構232a、232b、232c。圖7C則為填充因子77.98%的微透鏡陣列。 Please refer to FIG. 7A to FIG. 7C. FIG. 7A is a schematic diagram of a multi-focal microlens array, FIG. 7B is a Z-axis height difference diagram of a multi-focal microlens array, and FIG. 7C is a schematic diagram of a microlens array with a high filling factor. FIG. 7B is a Z-axis height difference diagram of line A-A in FIG. 7A. By changing the configuration of the grayscale value in the grayscale digital mask, the manufacturing method of the microlens array of the present invention can also manufacture a multi-focal microlens array 240 and a microlens array with a high filling factor. It can be seen from FIG. 7A and FIG. 7B that the multi-focal microlens array 240 includes a plurality of microstructures 232a, 232b, and 232c with different heights. Figure 7C shows a microlens array with a fill factor of 77.98%.

本發明之微透鏡陣列的製造方法,使用光固化來製作微透鏡陣列的微結構,能製作出表面粗糙度更低,解析度更高的微透鏡陣列,能夠滿足光學元件的低表面粗糙度要求。 The manufacturing method of the microlens array of the present invention uses photocuring to manufacture the microstructure of the microlens array, which can produce a microlens array with lower surface roughness and higher resolution, and can meet the low surface roughness requirements of optical components.

本發明說明如上,然其並非用以限定本創作所主張之專利權利範圍。其專利保護範圍當視後附之申請專利範圍及其等同領域而定。凡本領域具有通常知識者,在不脫離本專利精神或範圍內,所作之更動或潤飾,均屬於本創作所揭示精神下所完成之等效改變或設計,且應包含在下述之申請專利範圍內。 The invention is described above, but it is not intended to limit the scope of the patent rights claimed by this creation. The scope of patent protection shall be determined by the scope of the patent application attached hereto and its equivalent field. Any changes or modifications made by those with common knowledge in this field without departing from the spirit or scope of this patent shall be considered as equivalent changes or designs completed under the spirit disclosed by this creation, and shall be included in the scope of the patent application described below.

S10~S70:流程圖步驟 S10~S70: Flowchart steps

Claims (9)

一種微透鏡陣列的製造方法,包括:S10:提供對應一灰階數位光罩的資料,該灰階數位光罩對應到一微透鏡陣列圖案;S20:提供一透明基板;S30:在該透明基板下方設置一光機,該光機包括:一光源,適於發射一光線;及一光調變器,該光調變器是設置於該光線的路徑,適於反射與調變該光線,使該光線射向該透明基板;S40;根據該灰階數位光罩控制該光調變器;S50:在該透明基板的一上表面設置液態的一光固化樹脂;S60:啟動該光源,該光源發射的該光線經由該光調變器反射而射入至該光固化樹脂,以在該光固化樹脂上形成該微透鏡陣列圖案;及S70:清除未固化的該光固化樹脂,得到一微透鏡陣列;其中,步驟S40中還包括S41:在該光調變器與該透明基板之間設置一聚焦鏡,使穿過該聚焦鏡的該光線的反射焦點位置不在該透明基板的該上表面。 A method for manufacturing a microlens array includes: S10: providing data corresponding to a grayscale digital mask, the grayscale digital mask corresponding to a microlens array pattern; S20: providing a transparent substrate; S30: setting an optical machine under the transparent substrate, the optical machine including: a light source, suitable for emitting a light; and a light modulator, the light modulator is set in the path of the light, suitable for reflecting and modulating the light, so that the light is emitted to the transparent substrate; S40; controlling the light modulator according to the grayscale digital mask; S50: A liquid photocurable resin is disposed on an upper surface of a transparent substrate; S60: the light source is activated, and the light emitted by the light source is reflected by the light modulator and injected into the photocurable resin to form the microlens array pattern on the photocurable resin; and S70: the uncured photocurable resin is removed to obtain a microlens array; wherein step S40 further includes S41: a focusing lens is disposed between the light modulator and the transparent substrate, so that the reflection focus position of the light passing through the focusing lens is not on the upper surface of the transparent substrate. 如請求項1所述的微透鏡陣列的製造方法,其中,在步驟S10,在灰階的灰度值範圍分布在0至255時,該灰階數位光罩的灰度值為50至200。 The manufacturing method of the microlens array as described in claim 1, wherein, in step S10, when the grayscale value range of the grayscale is distributed between 0 and 255, the grayscale value of the grayscale digital mask is between 50 and 200. 如請求項1所述的微透鏡陣列的製造方法,其中,步驟S40中還包括:S42:設定該光源的灰度值與持續時間。 The manufacturing method of the microlens array as described in claim 1, wherein step S40 further includes: S42: setting the grayscale value and duration of the light source. 如請求項1所述的微透鏡陣列的製造方法,其中,在步驟S41中,該焦點位置與該透明基板的該上表面的距離是大於0μm並小於等於3000μm。 The method for manufacturing a microlens array as described in claim 1, wherein, in step S41, the distance between the focal point and the upper surface of the transparent substrate is greater than 0 μm and less than or equal to 3000 μm. 如請求項1所述的微透鏡陣列的製造方法,其中,在步驟S50中,該光固化樹脂還包括光抑制劑。 The method for manufacturing a microlens array as described in claim 1, wherein in step S50, the photocurable resin further includes a photoinhibitor. 如請求項5所述的微透鏡陣列的製造方法,其中,光抑制劑的重量百分濃度為0.4wt%。 A method for manufacturing a microlens array as described in claim 5, wherein the weight percent concentration of the light inhibitor is 0.4wt%. 如請求項1所述的微透鏡陣列的製造方法,其中,在步驟S70中,是使用酒精與氣槍清除未固化的該光固化樹脂。 The method for manufacturing a microlens array as described in claim 1, wherein in step S70, alcohol and an air gun are used to remove the uncured photocurable resin. 如請求項1所述的微透鏡陣列的製造方法,其中,該光調變器為數位微鏡裝置。 A method for manufacturing a microlens array as described in claim 1, wherein the light modulator is a digital microlens device. 如請求項1所述的微透鏡陣列的製造方法,其中,在步驟S70中,該微透鏡陣列為多焦距微透鏡陣列或高填充因子微透鏡陣列。 The method for manufacturing a microlens array as described in claim 1, wherein in step S70, the microlens array is a multi-focal length microlens array or a high filling factor microlens array.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200119312A1 (en) 2013-06-05 2020-04-16 Universal Display Corporation Microlens array architectures for enhanced light outcoupling from an oled array

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