TWI841487B - Expansion card - Google Patents
Expansion card Download PDFInfo
- Publication number
- TWI841487B TWI841487B TW112134634A TW112134634A TWI841487B TW I841487 B TWI841487 B TW I841487B TW 112134634 A TW112134634 A TW 112134634A TW 112134634 A TW112134634 A TW 112134634A TW I841487 B TWI841487 B TW I841487B
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- TW
- Taiwan
- Prior art keywords
- hook
- connection
- area
- circuit board
- elastic sheets
- Prior art date
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- 239000000463 material Substances 0.000 claims description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- 239000011133 lead Substances 0.000 claims description 7
- 239000011135 tin Substances 0.000 claims description 7
- 229910052718 tin Inorganic materials 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- 230000007423 decrease Effects 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 8
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 4
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 4
- 230000006870 function Effects 0.000 description 2
- 101000827703 Homo sapiens Polyphosphoinositide phosphatase Proteins 0.000 description 1
- 102100023591 Polyphosphoinositide phosphatase Human genes 0.000 description 1
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 1
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 1
- 210000005069 ears Anatomy 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Abstract
Description
本發明是有關於一種板卡,且特別是有關於一種擴充卡。 The present invention relates to a board card, and in particular to an expansion card.
現有的顯示卡在組裝後越來越重,使用者使用時受外力或應力影響,易導致位於金手指旁的卡勾(或稱為小耳朵)斷裂以及附近記憶體晶片壞掉等不良,進而導致整個顯示卡需要報廢。 Existing graphics cards are getting heavier after assembly. When users use them, they are affected by external forces or stress, which can easily cause the hooks (or small ears) next to the gold fingers to break and nearby memory chips to break, which in turn causes the entire graphics card to be scrapped.
本發明提供一種擴充卡,其具有較佳的結構可靠度。 The present invention provides an expansion card having better structural reliability.
本發明的擴充卡,包括一電路板體、二彈性片以及多個連接結構。電路板體包括一本體部以及一卡勾連接部。卡勾連接部具有一連接區以及一卡勾區。連接區位於本體部與卡勾區之間。卡勾區從本體部的一側向外延伸。彈性片配置於電路板體的卡勾連接部上,且覆蓋卡勾連接部彼此相對的一第一表面與一第二表面。連接結構貫穿彈性片及卡勾連接部,且位於卡勾區。彈性片與電路板體透過連接結構而固定。 The expansion card of the present invention includes a circuit board body, two elastic sheets and a plurality of connection structures. The circuit board body includes a main body and a hook connection part. The hook connection part has a connection area and a hook area. The connection area is located between the main body and the hook area. The hook area extends outward from one side of the main body. The elastic sheet is arranged on the hook connection part of the circuit board body and covers a first surface and a second surface of the hook connection part that are opposite to each other. The connection structure penetrates the elastic sheet and the hook connection part and is located in the hook area. The elastic sheet and the circuit board body are fixed through the connection structure.
在本發明的一實施例中,上述的每一彈性片的材質包括 金、銀、銅、鐵、鋁、錫、鎳、鉛、鋅或上述金屬的合金。 In one embodiment of the present invention, the material of each of the above-mentioned elastic sheets includes gold, silver, copper, iron, aluminum, tin, nickel, lead, zinc or alloys of the above-mentioned metals.
在本發明的一實施例中,上述的每一連接結構包括一貫孔以及一連接材料。貫孔貫穿彈性片及卡勾連接部,而連接材料填滿貫孔以連接彈性片與電路板體。 In one embodiment of the present invention, each of the above-mentioned connection structures includes a through hole and a connection material. The through hole penetrates the elastic sheet and the hook connection portion, and the connection material fills the through hole to connect the elastic sheet and the circuit board.
在本發明的一實施例中,上述的連接材料包括錫、鉛或樹脂。 In one embodiment of the present invention, the above-mentioned connecting material includes tin, lead or resin.
在本發明的一實施例中,上述的貫孔的孔徑為一定值,或者是,貫孔的孔徑由二彈性片其中的一者往二彈性片其中的另一者逐漸變小。 In one embodiment of the present invention, the aperture of the through hole is a certain value, or the aperture of the through hole gradually decreases from one of the two elastic sheets to the other of the two elastic sheets.
在本發明的一實施例中,上述的擴充卡還包括二防焊層,覆蓋電路板體的本體部彼此相對的一上表面與一下表面、彈性片以及連接結構。 In one embodiment of the present invention, the expansion card further includes two solder resist layers, covering an upper surface and a lower surface of the main body of the circuit board body that are opposite to each other, an elastic sheet, and a connection structure.
在本發明的一實施例中,上述的卡勾連接部的連接區與本體部的連接處為圓弧曲面。 In one embodiment of the present invention, the connection area of the hook connection part and the connection part of the main body are arc surfaces.
在本發明的一實施例中,上述的每一彈性片與卡勾連接部呈共形設置。 In one embodiment of the present invention, each of the elastic sheets and the hook connection portion are arranged conformally.
在本發明的一實施例中,上述的電路板體更包括一連接介面,配置於本體部的該側,且與卡勾連接部之間存在一槽口。 In one embodiment of the present invention, the above-mentioned circuit board body further includes a connection interface, which is arranged on the side of the main body, and there is a notch between the hook connection part.
在本發明的一實施例中,上述的卡勾連接部的卡勾區為沒有電路佈局的區域。 In one embodiment of the present invention, the hook area of the hook connection portion is an area without circuit layout.
基於上述,在本發明的擴充卡的設計中,彈性片是配置於電路板體的卡勾連接部上,且覆蓋卡勾連接部彼此相對的第一表 面與第二表面,而位於卡勾區的連接結構貫穿彈性片及卡勾連接部以固定彈性片與電路板體。藉此設計,可增加電路板體的卡勾連接部的結構強度,且可提升卡勾連接部的卡勾區後續卡扣扣件時的穩固性,可有效地提升擴充卡的品質。簡言之,本發明的擴充卡可具有較佳的結構可靠度。 Based on the above, in the design of the expansion card of the present invention, the elastic sheet is arranged on the hook connection part of the circuit board body and covers the first surface and the second surface of the hook connection part opposite to each other, and the connection structure located in the hook area penetrates the elastic sheet and the hook connection part to fix the elastic sheet and the circuit board body. With this design, the structural strength of the hook connection part of the circuit board body can be increased, and the stability of the hook area of the hook connection part when the subsequent buckle fastener is fastened can be improved, which can effectively improve the quality of the expansion card. In short, the expansion card of the present invention can have better structural reliability.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 In order to make the above features and advantages of the present invention more clearly understood, the following is a detailed description of the embodiments with the accompanying drawings.
100a、100b:擴充卡 100a, 100b: Expansion card
110:電路板體 110: Circuit board
112:本體部 112: Headquarters
114:卡勾連接部 114: Hook connection part
115:連接區 115: Connection area
117:卡勾區 117: Kagou District
118:連接介面 118: Connection interface
120、130:彈性片 120, 130: elastic sheet
140a、140b:連接結構 140a, 140b: connection structure
142a、142b:貫孔 142a, 142b: Through hole
144:連接材料 144:Connection materials
150、160:防焊層 150, 160: solder mask
170:處理器 170: Processor
180:晶片 180: Chip
A1:上表面 A1: Upper surface
A2:下表面 A2: Lower surface
C:連接處 C: Connection point
E:一側 E: One side
S1:第一表面 S1: First surface
S2:第二表面 S2: Second surface
T:槽口 T: Notch
圖1是依照本發明的一實施例的一種擴充卡的立體俯視示意圖。 Figure 1 is a three-dimensional top view schematic diagram of an expansion card according to an embodiment of the present invention.
圖2是圖1的擴充卡的局部分解示意圖。 Figure 2 is a partial exploded schematic diagram of the expansion card in Figure 1.
圖3是圖1的擴充卡的局部俯視示意圖。 Figure 3 is a partial top view of the expansion card in Figure 1.
圖4是圖1的擴充卡的局部剖面示意圖。 Figure 4 is a partial cross-sectional schematic diagram of the expansion card in Figure 1.
圖5是依照本發明的另一實施例的一種擴充卡的局部剖面示意圖。 Figure 5 is a partial cross-sectional schematic diagram of an expansion card according to another embodiment of the present invention.
本發明實施例可配合圖式一併理解,本發明的圖式亦被視為揭露說明之一部分。應理解的是,本發明的圖式並未按照比例繪製,事實上,可能任意的放大或縮小元件的尺寸以便清楚表現出 本發明的特徵。 The embodiments of the present invention can be understood together with the drawings, and the drawings of the present invention are also considered as part of the disclosure. It should be understood that the drawings of the present invention are not drawn to scale. In fact, the size of the components may be arbitrarily enlarged or reduced in order to clearly show the features of the present invention.
圖1是依照本發明的一實施例的一種擴充卡的立體俯視示意圖。圖2是圖1的擴充卡的局部分解示意圖。圖3是圖1的擴充卡的局部俯視示意圖。圖4是圖1的擴充卡的局部剖面示意圖。 FIG1 is a schematic diagram of a three-dimensional top view of an expansion card according to an embodiment of the present invention. FIG2 is a schematic diagram of a partial exploded view of the expansion card of FIG1. FIG3 is a schematic diagram of a partial top view of the expansion card of FIG1. FIG4 is a schematic diagram of a partial cross-section of the expansion card of FIG1.
請同時參考圖1、圖2、圖3及圖4,在本實施例中,擴充卡100a包括一電路板體110、二彈性片120、130以及多個連接結構140a。電路板體110包括一本體部112以及一卡勾連接部114。卡勾連接部114具有一連接區115以及一卡勾區117。連接區115位於本體部112與卡勾區117之間。卡勾區117從本體部112的一側E向外延伸。彈性片120、130配置於電路板體110的卡勾連接部114上,且覆蓋卡勾連接部114彼此相對的一第一表面S1與一第二表面S2。連接結構140a貫穿彈性片120、130及卡勾連接部114,且位於卡勾區117。彈性片120、130與電路板體110透過連接結構140a而固定。
Please refer to FIG. 1, FIG. 2, FIG. 3 and FIG. 4 simultaneously. In this embodiment, the
詳細來說,在本實施例中,擴充卡100a例如是一顯示卡,但不以此為限。電路板體110例如是印刷電路板的內層結構層,其中本體部112及卡勾連接部114的連接區115為具有線路佈局的區域,而卡勾連接部114的卡勾區117為沒有電路佈局的區域。再者,本實施例的電路板體110還包括一連接介面118,配置於本體部112的一側E,且與卡勾連接部114之間存在一槽口T。於此,連接介面118例如是金手指,而擴充卡100a可透過連接介面
118插設於連接器(未繪示)內。
Specifically, in this embodiment, the
請再同時參考圖1及圖2,在本實施例中,卡勾連接部114的連接區115與本體部112的連接處C為圓弧曲面,可有效地分散應力。於此,彈性片120、130與卡勾連接部114具體化呈共形(conformally)設置,意即彈性片120、130與卡勾連接部114具有相同形狀。於一實施例中,彈性片120、130的材質可例如是金、銀、銅、鐵、鋁、錫、鎳、鉛、鋅或上述金屬的合金。
Please refer to FIG. 1 and FIG. 2 at the same time. In this embodiment, the
接著,請再同時參考圖3及圖4,在本實施例中,每一連接結構140a包括一貫孔142a以及一連接材料144。貫孔142a貫穿彈性片120、130及電路板體110的卡勾連接部114,而連接材料144填滿貫孔142a以連接彈性片120、130與電路板體110。於此,貫孔142a的孔徑例如為一定值,但不以此為限。於另一實施例中,請參考圖5,於擴充卡100b的結構中,連接結構140b的貫孔142b的孔徑可由彈性片120往彈性片130的方向逐漸變小。於一未繪示的實施例中,連接結構的貫孔的孔徑可由二彈性片中的一個往二彈性片中的另一個逐漸變大;或者是,連接結構的貫孔的孔徑在二彈性片中的孔徑大於在電路板體中的孔徑,上述皆屬於本發明所欲保護的範圍。
Next, please refer to FIG. 3 and FIG. 4 at the same time. In this embodiment, each
再者,連接結構140a的連接材料144可例如是錫、鉛或樹脂。於一實施例中,當連接材料144為金屬材料,如錫或鉛時,則連接結構140a僅具有固定的功能,可增強卡勾連接部114的結構強度。於另一實施例中,當連接材料144為樹脂時,則連接結構
140a可具有散熱的功能。
Furthermore, the
此外,請再同時參考圖1及圖4,本實施例的擴充卡100a還包括二防焊層150、160,覆蓋電路板體110的本體部112彼此相對的一上表面A1與一下表面A2、彈性片120、130以及連接結構140a,用以保護電路板體110、彈性片120、130以及連接結構140a。另外,本實施例的擴充卡100a還包括一處理器170與多個晶片180,其中處理器170與晶片180設置於電路板體110的本體部112上,且晶片180位於處理器170旁。於此,處理器170可例如是中央處理器,而晶片180可例如是記憶體晶片,但不以此為限。
In addition, please refer to Figures 1 and 4 at the same time. The
由於本實施例的擴充卡100a、100b於電路板體110的卡勾連接部114上配置彈性片120、130,且透過位於卡勾區117的連接結構140a、140b來連接彈性片120、130與電路板體110,因此可增加卡勾連接部114的結構強度,以避免卡勾連接部114發生斷裂以及附近晶片180壞掉等不良現象產生,可提升擴充卡100a、100b的品質。此外,透過上述的設計,當卡勾連接部114的卡勾區117後續卡扣扣件時,則可具有較佳的穩固性。簡言之,本實施例的擴充卡100a、100b可具有較佳的結構可靠度。
Since the
綜上所述,在本發明的擴充卡的設計中,彈性片是配置於電路板體的卡勾連接部上,且覆蓋卡勾連接部彼此相對的第一表面與第二表面,而位於卡勾區的連接結構貫穿彈性片及卡勾連接部以固定彈性片與電路板體。藉此設計,可增加電路板體的卡勾連 接部的結構強度,且可提升卡勾連接部的卡勾區後續卡扣扣件時的穩固性,可有效地提升擴充卡的品質。簡言之,本發明的擴充卡可具有較佳的結構可靠度。 In summary, in the design of the expansion card of the present invention, the elastic sheet is disposed on the hook connection portion of the circuit board body and covers the first surface and the second surface of the hook connection portion that are opposite to each other, and the connection structure located in the hook area penetrates the elastic sheet and the hook connection portion to fix the elastic sheet and the circuit board body. With this design, the structural strength of the hook connection portion of the circuit board body can be increased, and the stability of the hook area of the hook connection portion when the subsequent buckle fastener is fastened can be improved, which can effectively improve the quality of the expansion card. In short, the expansion card of the present invention can have better structural reliability.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed as above by the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the attached patent application.
110:電路板體 110: Circuit board
114:卡勾連接部 114: Hook connection part
115:連接區 115: Connection area
117:卡勾區 117: Kagou District
120、130:彈性片 120, 130: elastic sheet
C:連接處 C: Connection point
S1:第一表面 S1: First surface
S2:第二表面 S2: Second surface
Claims (10)
Publications (1)
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TWI841487B true TWI841487B (en) | 2024-05-01 |
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CN217640087U (en) | 2022-04-27 | 2022-10-21 | 华硕电脑股份有限公司 | PCI-E expansion card module |
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN217640087U (en) | 2022-04-27 | 2022-10-21 | 华硕电脑股份有限公司 | PCI-E expansion card module |
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