TWI838757B - Electronic assembly - Google Patents
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- TWI838757B TWI838757B TW111120429A TW111120429A TWI838757B TW I838757 B TWI838757 B TW I838757B TW 111120429 A TW111120429 A TW 111120429A TW 111120429 A TW111120429 A TW 111120429A TW I838757 B TWI838757 B TW I838757B
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- 230000005855 radiation Effects 0.000 claims abstract description 70
- 230000002093 peripheral effect Effects 0.000 abstract description 14
- 238000010586 diagram Methods 0.000 description 22
- 230000001629 suppression Effects 0.000 description 6
- 239000011358 absorbing material Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 1
- 101000827703 Homo sapiens Polyphosphoinositide phosphatase Proteins 0.000 description 1
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 1
- 102100023591 Polyphosphoinositide phosphatase Human genes 0.000 description 1
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
Abstract
Description
本發明係關於一種電子組件，特別係關於一種包含天線的電子組件。 The present invention relates to an electronic component, in particular to an electronic component including an antenna.
近年來，為了追求如筆記型電腦之電子裝置的輕薄化，許多廠商會將天線改設置在主機板附近，這使得設置於主機板上如電壓調節模組(Voltage Regulator Module，VRM)的干擾源會對天線產生電磁干擾。 In recent years, in order to pursue the thinness and lightness of electronic devices such as laptops, many manufacturers have moved the antenna to the vicinity of the motherboard, which causes interference sources such as the voltage regulator module (VRM) installed on the motherboard to generate electromagnetic interference to the antenna.
有鑑於此，電路板上通常會設置屏蔽罩來減緩天線受到的電磁干擾。此外，為了滿足干擾源的散熱需求以及電子裝置內部的空間限制，屏蔽罩上會開設開口以使干擾源設置在此開口。屏蔽罩上的開口雖然能滿足干擾源的散熱需求以及電子裝置內部的空間限制，卻也降低了屏蔽罩減緩天線受到的電磁干擾之效果。因此，廠商會於屏蔽罩上設置用於吸收電磁波的吸波材料，以減緩天線受到的電磁干擾。 In view of this, a shielding cover is usually set on the circuit board to reduce the electromagnetic interference received by the antenna. In addition, in order to meet the heat dissipation requirements of the interference source and the space limitations inside the electronic device, an opening is opened on the shielding cover so that the interference source is set in this opening. Although the opening on the shielding cover can meet the heat dissipation requirements of the interference source and the space limitations inside the electronic device, it also reduces the effect of the shielding cover in reducing the electromagnetic interference received by the antenna. Therefore, manufacturers will set absorbing materials for absorbing electromagnetic waves on the shielding cover to reduce the electromagnetic interference received by the antenna.
然，為了有效地利用吸波材料減緩天線受到的電磁干擾，會需要針對不同規格的干擾源以及天線設計吸波材料的導磁係數、厚度等特徵。也就是說，吸波材料難以共用於不同規格的干擾源以及天線。此外，吸波材料的使用也會增加電子裝置的 製造成本。 However, in order to effectively use absorbing materials to mitigate electromagnetic interference on antennas, it is necessary to design the permeability, thickness and other characteristics of the absorbing materials according to the interference sources and antennas of different specifications. In other words, absorbing materials are difficult to be used for interference sources and antennas of different specifications. In addition, the use of absorbing materials will also increase the manufacturing cost of electronic devices.
本發明在於提供一種電子組件，以透過近屏蔽墊或遠屏蔽墊有效地減緩不同規格的干擾源與天線之間產生的電磁干擾，同時降低電子組件的製造成本。 The present invention provides an electronic component that can effectively reduce the electromagnetic interference generated between interference sources of different specifications and antennas through a near shielding pad or a far shielding pad, while reducing the manufacturing cost of the electronic component.
本發明一實施例所揭露之電子組件包含一電路板、一干擾源、一屏蔽罩、一天線以及一近屏蔽墊。干擾源設置並電性連接於電路板。屏蔽罩包含一側周板以及一頂板。側周板立於電路板。頂板連接於側周板遠離電路板的一側。頂板具有一開口。側周板環繞干擾源。干擾源位於開口。天線位於屏蔽罩的一側。近屏蔽墊設置於屏蔽罩的頂板遠離側周板的一側且位於開口以及天線之間。干擾源發出的電磁波具有一波長λ。天線具有一輻射場型。干擾源與輻射場型所指出的具有天線峰值增益最大值之處之間的最小距離X符合不等式X<
本發明另一實施例所揭露之電子組件包含一電路板、一干擾源、一屏蔽罩、一天線以及一遠屏蔽墊。干擾源設置並電性連接於電路板。屏蔽罩包含一側周板以及一頂板。側周板立於電路板。頂板連接於側周板遠離電路板的一側。頂板具有一開口。側周板環繞干擾源。干擾源位於開口。天線位於屏蔽罩的一側。遠屏蔽墊分離於屏蔽罩且位於開口以及天線之間。干擾源發出的電磁波具有一波長λ。天線具有一輻射場型。干擾源與輻射場型所指出的具有天線峰值增益最大值之處之間的最小距離X符合不
等式X<
根據上述實施例所揭露之電子組件，透過位於開口以及天線之間的近屏蔽墊或是分離於屏蔽罩且位於開口以及天線之間的遠屏蔽墊，干擾源所發出的電磁波在傳播到天線之前會對近屏蔽墊或是遠屏蔽墊產生反射、繞射、與穿透之現象而產生衰減。如此一來，便能有效地減緩不同規格的干擾源與天線之間產生的電磁干擾，同時降低電子組件的製造成本。 According to the electronic components disclosed in the above embodiments, through the near shielding pad located between the opening and the antenna or the far shielding pad separated from the shielding cover and located between the opening and the antenna, the electromagnetic waves emitted by the interference source will reflect, diffract, and penetrate the near shielding pad or the far shielding pad before propagating to the antenna, resulting in attenuation. In this way, the electromagnetic interference generated between interference sources of different specifications and the antenna can be effectively mitigated, while reducing the manufacturing cost of the electronic components.
此外，干擾源與輻射場型所指出的具有天線峰值增益最大值之處之間的最小距離X符合不等式X<
10,10a,10b,10c,10d,10e,10f,10g,10h,10i,10j,10k,10l,10m,10n,10p,10q,10r,10s,10t,10u,10v:電子組件 10,10a,10b,10c,10d,10e,10f,10g,10h,10i,10j,10k,10l,10m,10n,10p,10q,10r,10s,10t,10u,10v: electronic components
100,100k,550k,100l,550l,100m,550m,100n,550n,100t,550t,100v,550v:電路板 100,100k,550k,100l,550l,100m,550m,100n,550n,100t,550t,100v,550v:Circuit board
200:干擾源 200: Interference source
300,300p,300q,300r:屏蔽罩 300,300p,300q,300r: Shielding cover
310:側周板 310: Side plate
311:第一外表面 311: First outer surface
312:第二外表面 312: Second outer surface
313:第三外表面 313: Third outer surface
314:第四外表面 314: Fourth outer surface
320,320p,320q,320r:頂板 320,320p,320q,320r:Top panel
321,321p,321q,321r:開口 321,321p,321q,321r: Opening
322:底面 322: Bottom
323:頂面 323: Top
350:屏蔽夾 350: Shielding clip
400,401h,402h,401i,402i,401j,402j,403j:近屏蔽墊 400,401h,402h,401i,402i,401j,402j,403j: Near shielding pad
450,450k,450l,450m,450n,450t,450v:第一擴充電路板 450,450k,450l,450m,450n,450t,450v: The first expansion circuit board
500,500a,500b,500c,500d,500e,500f,500g,500h,500i,501j,502j:天線 500,500a,500b,500c,500d,500e,500f,500g,500h,500i,501j,502j:antenna
600s,600t:第二擴充電路板 600s,600t: Second expansion circuit board
650s:殼體 650s: Shell
700s,700u:遠屏蔽墊 700s,700u: tele-shielding pad
G:間隔 G: Interval
L:長度 L: Length
H1,H2:高度 H1,H2:Height
B:基準面 B: Datum surface
C:中心點 C: Center point
F,F1,F2,F3,F4,F5,F6,F7:輻射場型 F,F1,F2,F3,F4,F5,F6,F7: Radiation field type
F4a,F5a,F6a:主延伸部 F4a, F5a, F6a: Main extension
F7a:環形輻射場 F7a: Ring of radiation fields
F4b,F5b,F6b:第一次延伸部 F4b, F5b, F6b: First extension
F4c,F5c,F6c:第二次延伸部 F4c, F5c, F6c: Second extension
X,X1,X2,X3,X4,X5,X6,X7:最小距離 X,X1,X2,X3,X4,X5,X6,X7: minimum distance
D:間隔距離 D: Spacing distance
p4,p5,p6:基準點 p4,p5,p6:base point
F7D:直徑 F7D: Diameter
圖1為根據本發明第一實施例的電子組件之上視圖。 Figure 1 is a top view of an electronic component according to the first embodiment of the present invention.
圖2為圖1中的電子組件的側視圖。 Figure 2 is a side view of the electronic assembly in Figure 1.
圖3為呈現圖1中的電子組件的天線之輻射場型之示意圖。 FIG3 is a schematic diagram showing the radiation pattern of the antenna of the electronic component in FIG1.
圖4為呈現根據本發明第二實施例的電子組件的天線之輻射場型之示意圖。 FIG4 is a schematic diagram showing the radiation pattern of the antenna of the electronic component according to the second embodiment of the present invention.
圖5為呈現根據本發明第三實施例的電子組件的天線之輻射場型之示意圖。 FIG5 is a schematic diagram showing the radiation pattern of the antenna of the electronic component according to the third embodiment of the present invention.
圖6為呈現根據本發明第四實施例的電子組件的天線之輻射場型之示意圖。 FIG6 is a schematic diagram showing the radiation pattern of the antenna of the electronic component according to the fourth embodiment of the present invention.
圖7為呈現根據本發明第五實施例的電子組件的天線之輻射場型之示意圖。 FIG7 is a schematic diagram showing the radiation pattern of the antenna of the electronic component according to the fifth embodiment of the present invention.
圖8為呈現根據本發明第六實施例的電子組件的天線之輻射場型之示意圖。 FIG8 is a schematic diagram showing the radiation pattern of the antenna of the electronic component according to the sixth embodiment of the present invention.
圖9為呈現根據本發明第七實施例的電子組件的天線之輻射場型之示意圖。 FIG9 is a schematic diagram showing the radiation pattern of the antenna of the electronic component according to the seventh embodiment of the present invention.
圖10為呈現根據本發明第八實施例的電子組件的天線之輻射場型之示意圖。 FIG10 is a schematic diagram showing the radiation pattern of the antenna of the electronic component according to the eighth embodiment of the present invention.
圖11為根據本發明第九實施例的電子組件之上視圖。 Figure 11 is a top view of an electronic component according to the ninth embodiment of the present invention.
圖12為根據本發明第十實施例的電子組件之上視圖。 Figure 12 is a top view of an electronic component according to the tenth embodiment of the present invention.
圖13為根據本發明第十一實施例的電子組件之上視圖。 Figure 13 is a top view of the electronic component according to the eleventh embodiment of the present invention.
圖14為根據本發明第十二實施例的電子組件之上視圖。 Figure 14 is a top view of the electronic component according to the twelfth embodiment of the present invention.
圖15為根據本發明第十三實施例的電子組件之上視圖。 Figure 15 is a top view of an electronic component according to the thirteenth embodiment of the present invention.
圖16為根據本發明第十四實施例的電子組件之上視圖。 Figure 16 is a top view of the electronic component according to the fourteenth embodiment of the present invention.
圖17為根據本發明第十五實施例的電子組件之上視圖。 Figure 17 is a top view of the electronic component according to the fifteenth embodiment of the present invention.
圖18為根據本發明第十六實施例的電子組件之屏蔽罩及近屏蔽墊的上視圖。 Figure 18 is a top view of the shielding cover and the near shielding pad of the electronic component according to the sixteenth embodiment of the present invention.
圖19為根據本發明第十七實施例的電子組件之屏蔽罩及近屏蔽墊的上視圖。 FIG. 19 is a top view of the shielding cover and the near shielding pad of the electronic component according to the seventeenth embodiment of the present invention.
圖20為根據本發明第十八實施例的電子組件之屏蔽罩及近屏 蔽墊的上視圖。 FIG. 20 is a top view of the shielding cover and the near-shielding pad of the electronic assembly according to the eighteenth embodiment of the present invention.
圖21為根據本發明第十九實施例的電子組件之上視圖。 Figure 21 is a top view of an electronic component according to the nineteenth embodiment of the present invention.
圖22A為呈現圖21中的電子組件的遠屏蔽墊及天線之間的間隔距離之示意圖。 FIG. 22A is a schematic diagram showing the spacing distance between the remote shielding pad and the antenna of the electronic component in FIG. 21 .
圖22B為呈現遠屏蔽墊與天線之間在不同間隔距離下的抑制效果。 Figure 22B shows the suppression effect at different spacing distances between the teleshield and the antenna.
圖23為根據本發明第二十實施例的電子組件之上視圖。 Figure 23 is a top view of an electronic component according to the twentieth embodiment of the present invention.
圖24為根據本發明第二十一實施例的電子組件之上視圖。 Figure 24 is a top view of the electronic component according to the twenty-first embodiment of the present invention.
圖25為根據本發明第二十二實施例的電子組件之上視圖。 Figure 25 is a top view of the electronic component according to the twenty-second embodiment of the present invention.
圖26為呈現根據本發明的電子組件之屏蔽效果的曲線圖。 FIG. 26 is a graph showing the shielding effect of the electronic component according to the present invention.
圖27為呈現根據本發明的電子組件之屏蔽效果的另一曲線圖。 FIG. 27 is another curve diagram showing the shielding effect of the electronic component according to the present invention.
以下在實施方式中詳細敘述本發明之實施例之詳細特徵以及優點，其內容足以使任何本領域中具通常知識者了解本發明之實施例之技術內容並據以實施，且根據本說明書所揭露之內容、申請專利範圍及圖式，任何本領域中具通常知識者可輕易地理解本發明相關之目的及優點。以下之實施例係進一步詳細說明本發明之觀點，但非以任何觀點限制本發明之範疇。 The detailed features and advantages of the embodiments of the present invention are described in detail in the following implementation method. The content is sufficient to enable any person with ordinary knowledge in the field to understand the technical content of the embodiments of the present invention and implement it accordingly. According to the content disclosed in this specification, the scope of the patent application and the drawings, any person with ordinary knowledge in the field can easily understand the relevant purposes and advantages of the present invention. The following embodiments are to further illustrate the viewpoints of the present invention, but do not limit the scope of the present invention by any viewpoint.
請參閱圖1及圖2，圖1為根據本發明第一實施例的電子組件之上視圖。圖2為圖1中的電子組件的側視圖。 Please refer to Figures 1 and 2. Figure 1 is a top view of an electronic component according to the first embodiment of the present invention. Figure 2 is a side view of the electronic component in Figure 1.
於本實施例中，電子組件10包含一電路板100、一干擾源200、一屏蔽罩300、多個屏蔽夾350、一近屏蔽墊400、 一第一擴充電路板450以及一天線500。干擾源200設置並電性連接於電路板100。 In this embodiment, the electronic component 10 includes a circuit board 100, an interference source 200, a shielding cover 300, a plurality of shielding clips 350, a near shielding pad 400, a first expansion circuit board 450 and an antenna 500. The interference source 200 is disposed and electrically connected to the circuit board 100.
於本實施例中，干擾源200例如為電壓調節模組(Voltage Regulator Module，VRM)並發出具有一波長λ的電磁波。於本實施例中，干擾源200所發出的電磁波之頻率例如大於等於700百萬赫(MHz)且小於等於8十億赫(GHz)。 In this embodiment, the interference source 200 is, for example, a voltage regulator module (VRM) and emits an electromagnetic wave having a wavelength λ. In this embodiment, the frequency of the electromagnetic wave emitted by the interference source 200 is, for example, greater than or equal to 700 MHz and less than or equal to 800 GHz.
屏蔽罩300包含一側周板310以及一頂板320。側周板310立於電路板100。頂板320連接於側周板310遠離電路板100的一側。頂板320具有一開口321、一底面322以及一頂面323。底面322及頂面323彼此背對。底面322面對電路板100。開口321貫穿底面322及頂面323。側周板310環繞干擾源200。干擾源200位於開口321。於本實施例中，屏蔽罩300上的所有開口321之剖面的總周長例如小於等於λ/2且大於等於λ/32。於本實施例中，屏蔽罩300上僅有一個開口321，因此屏蔽罩300上的所有開口321之剖面的總周長即為開口321之剖面的周長，但並不以此為限。於屏蔽罩具有多個開口的實施例中，屏蔽罩上的所有開口之剖面的總周長亦小於等於λ/2且大於等於λ/32。此外，於本實施例中，開口321的剖面例如呈正方形。 The shielding cover 300 includes a side plate 310 and a top plate 320. The side plate 310 stands on the circuit board 100. The top plate 320 is connected to a side of the side plate 310 away from the circuit board 100. The top plate 320 has an opening 321, a bottom surface 322 and a top surface 323. The bottom surface 322 and the top surface 323 are opposite to each other. The bottom surface 322 faces the circuit board 100. The opening 321 penetrates the bottom surface 322 and the top surface 323. The side plate 310 surrounds the interference source 200. The interference source 200 is located at the opening 321. In this embodiment, the total perimeter of the cross-section of all openings 321 on the shielding cover 300 is, for example, less than or equal to λ/2 and greater than or equal to λ/32. In this embodiment, there is only one opening 321 on the shielding cover 300, so the total perimeter of the cross-section of all openings 321 on the shielding cover 300 is the perimeter of the cross-section of the opening 321, but it is not limited to this. In the embodiment where the shielding cover has multiple openings, the total perimeter of the cross-section of all openings on the shielding cover is also less than or equal to λ/2 and greater than or equal to λ/32. In addition, in this embodiment, the cross-section of the opening 321 is, for example, square.
這些屏蔽夾350位於側周板310與電路板100的連接處且將屏蔽罩300固定於電路板100。屏蔽罩300透過屏蔽夾350電性連接於電路板100的接地層(未繪示)。於本實施例中，相鄰屏蔽夾350之間的間隔G例如小於等於λ/2且大於等於λ/32。 These shielding clips 350 are located at the connection between the side plate 310 and the circuit board 100 and fix the shielding cover 300 to the circuit board 100. The shielding cover 300 is electrically connected to the ground layer (not shown) of the circuit board 100 through the shielding clips 350. In this embodiment, the interval G between adjacent shielding clips 350 is, for example, less than or equal to λ/2 and greater than or equal to λ/32.
近屏蔽墊400設置於屏蔽罩300的頂板320遠離側周板310的一側，即設置於頂板320的頂面323。近屏蔽墊400例如由導電材料製成，如金屬。於本實施例中，近屏蔽墊400的長度L例如小於等於λ/2且大於等於λ/32。於本實施例中，近屏蔽墊400與屏蔽罩300例如分別為獨立的構件且相互組合在一起，但並不以此為限。於其他實施例中，近屏蔽墊與屏蔽罩亦可為一體成型。 The near shielding pad 400 is disposed on a side of the top plate 320 of the shielding cover 300 away from the side plate 310, that is, disposed on the top surface 323 of the top plate 320. The near shielding pad 400 is made of, for example, a conductive material, such as metal. In this embodiment, the length L of the near shielding pad 400 is, for example, less than or equal to λ/2 and greater than or equal to λ/32. In this embodiment, the near shielding pad 400 and the shielding cover 300 are, for example, independent components and are combined with each other, but are not limited thereto. In other embodiments, the near shielding pad and the shielding cover can also be integrally formed.
第一擴充電路板450位於電路板100的一側。天線500設置並電性連接於第一擴充電路板450。天線500位於屏蔽罩300的一側。近屏蔽墊400位於開口321以及天線500之間。於本實施例中，第一擴充電路板450及電路板100彼此分離且彼此電性絕緣。因此，於本實施例中，電性連接於第一擴充電路板450的天線500與電性連接於電路板100的屏蔽罩300不共地。需注意的是，於本實施例中，屏蔽罩300以及天線500係分別電性連接於不同電路板中的接地層而不共地，以進一步降低因屏蔽罩300以及天線500共地而使天線500的運作受到干擾之機率，但本發明並不以此為限。於其他實施例中，屏蔽罩以及天線亦可分別電性連接於同一個電路板中彼此電性絕緣的兩個接地層而達成不共地之關係。 The first expansion circuit board 450 is located at one side of the circuit board 100. The antenna 500 is disposed and electrically connected to the first expansion circuit board 450. The antenna 500 is located at one side of the shielding cover 300. The near shielding pad 400 is located between the opening 321 and the antenna 500. In this embodiment, the first expansion circuit board 450 and the circuit board 100 are separated from each other and electrically insulated from each other. Therefore, in this embodiment, the antenna 500 electrically connected to the first expansion circuit board 450 and the shielding cover 300 electrically connected to the circuit board 100 do not share a common ground. It should be noted that in this embodiment, the shielding cover 300 and the antenna 500 are electrically connected to the grounding layers in different circuit boards respectively and do not share the same ground, so as to further reduce the probability of interference to the operation of the antenna 500 due to the shielding cover 300 and the antenna 500 sharing the same ground, but the present invention is not limited to this. In other embodiments, the shielding cover and the antenna can also be electrically connected to two grounding layers that are electrically insulated from each other in the same circuit board respectively to achieve a non-shared ground relationship.
於本實施例中，近屏蔽墊400遠離電路板100的一側相對電路板100的高度H1大於干擾源200遠離電路板100的一側相對電路板100的高度H2，以提升近屏蔽墊400減緩干擾源 200對天線500造成的電磁干擾，但並不以此為限。於其他實施例中，近屏蔽墊遠離電路板的一側相對電路板的高度亦可小於或等於干擾源遠離電路板的一側相對電路板的高度。 In this embodiment, the height H1 of the side of the near shielding pad 400 far from the circuit board 100 relative to the circuit board 100 is greater than the height H2 of the side of the interference source 200 far from the circuit board 100 relative to the circuit board 100, so as to improve the near shielding pad 400 to mitigate the electromagnetic interference caused by the interference source 200 to the antenna 500, but it is not limited to this. In other embodiments, the height of the side of the near shielding pad far from the circuit board relative to the circuit board can also be less than or equal to the height of the side of the interference source far from the circuit board relative to the circuit board.
此外，於本實施例中，側周板310具有一第一外表面311、一第二外表面312、一第三外表面313以及一第四外表面314。第一外表面311、第二外表面312、第三外表面313以及第四外表面314背對干擾源200。第一外表面311面對天線500。第二外表面312背對於第一外表面311。第三外表面313以及第四外表面314彼此背對且連接第一外表面311及第二外表面312。於本實施例中，近屏蔽墊400介於第一外表面311以及開口321之間。定義一基準面B，基準面B垂直於側周板310的第一外表面311以及頂板320的頂面323。並且，基準面B通過開口321的中心點C。於本實施例中，至少部分的天線500與基準面B重疊，且至少部分的近屏蔽墊400也與基準面B重疊。 In addition, in this embodiment, the side plate 310 has a first outer surface 311, a second outer surface 312, a third outer surface 313 and a fourth outer surface 314. The first outer surface 311, the second outer surface 312, the third outer surface 313 and the fourth outer surface 314 are opposite to the interference source 200. The first outer surface 311 faces the antenna 500. The second outer surface 312 is opposite to the first outer surface 311. The third outer surface 313 and the fourth outer surface 314 are opposite to each other and connect the first outer surface 311 and the second outer surface 312. In this embodiment, the near shielding pad 400 is between the first outer surface 311 and the opening 321. A reference plane B is defined, and the reference plane B is perpendicular to the first outer surface 311 of the side plate 310 and the top surface 323 of the top plate 320. And, the reference plane B passes through the center point C of the opening 321. In this embodiment, at least part of the antenna 500 overlaps with the reference plane B, and at least part of the near shielding pad 400 also overlaps with the reference plane B.
請參閱圖3，圖3為呈現圖1中的電子組件的天線之輻射場型之示意圖。天線500具有一輻射場型F。於本實施例中，輻射場型F呈橢圓外形，且從天線500沿靠近干擾源200的方向延伸。干擾源200與輻射場型F所指出的具有天線峰值增益最大值之處之間的最小距離X符合不等式X<
於本實施例中，僅有屏蔽罩300的頂板320具有開 口321，屏蔽罩300的側周板310不具有開口，但並不以此為限。於其他實施例中，屏蔽罩的側周板亦可具有一或多個開口，只要開口並非開設於側周板靠近天線的一側。在這樣的實施例中，屏蔽罩上的所有開口之剖面的總周長為頂板上的所有開口之剖面的總周長與側周板上的所有開口之剖面的總周長的總和。 In this embodiment, only the top plate 320 of the shielding cover 300 has an opening 321, and the side plate 310 of the shielding cover 300 has no opening, but the present invention is not limited thereto. In other embodiments, the side plate of the shielding cover may also have one or more openings, as long as the opening is not opened on the side of the side plate close to the antenna. In such an embodiment, the total circumference of the cross section of all the openings on the shielding cover is the sum of the total circumference of the cross section of all the openings on the top plate and the total circumference of the cross section of all the openings on the side plate.
於其他實施例中，電子組件亦可包含位於屏蔽罩的頂板以及電路板之間並電性連接於電路板的脈衝寬度調變(Pulse-width modulation，PWM)積體電路以及電容。 In other embodiments, the electronic component may also include a pulse-width modulation (PWM) integrated circuit and a capacitor located between the top plate of the shielding cover and the circuit board and electrically connected to the circuit board.
須注意的是，於本說明書中，除非另有說明，否則相同的標號指相同或相似的元件。 It should be noted that in this manual, unless otherwise specified, the same reference numerals refer to the same or similar components.
須注意的是，本發明並不以天線的輻射場型之形式為限。請參閱圖4，圖4為呈現根據本發明第二實施例的電子組件的天線之輻射場型之示意圖。須注意的是，根據本發明第二實施例的電子組件10a與圖1至圖3中根據本發明第一實施例的電子組件10之間的差異僅在於天線的輻射場型之形式。根據本發明第二實施例的電子組件10a亦可包含圖1至圖3中根據本發明第一實施例的電路板100、干擾源200、屏蔽罩300、多個屏蔽夾350、近屏蔽墊400及第一擴充電路板450，且可參考圖1至圖3中的天線500之相關敘述理解根據本發明第二實施例的天線500a的其他特徵。因此，以下僅詳細說明天線500a的輻射場型F1，不再贅述其他相似的內容。於本實施例中，天線500a的輻射場型F1呈橢圓外形且相對天線500a為對稱的。於本實施例中，干擾
源200與輻射場型F1所指出的具有天線峰值增益最大值之處之間的最小距離X1亦符合不等式X1<
或者，請參閱圖5，圖5為呈現根據本發明第三實施例的電子組件的天線之輻射場型之示意圖。須注意的是，根據本發明第三實施例的電子組件10b與圖1至圖3中根據本發明第一實施例的電子組件10之間的差異僅在於天線的輻射場型之形式。根據本發明第三實施例的電子組件10b亦可包含圖1至圖3中根據本發明第一實施例的電路板100、干擾源200、屏蔽罩300、多個屏蔽夾350、近屏蔽墊400及第一擴充電路板450，且可參考圖1至圖3中的天線500之相關敘述理解根據本發明第三實施例的天線500b的其他特徵。因此，以下僅詳細說明天線500b的輻射場型F2，不再贅述其他相似的內容。於本實施例中，天線500b的輻射場型F2呈橢圓外形且從天線500b沿靠近干擾源200的方向以及遠離第一擴充電路板450之方向延伸。於本實施例中，干擾源200與輻射場型F2所指出的具有天線峰值增益最大值之處之間的最小距離X2亦符合不等式X2<
或者，請參閱圖6，圖6為呈現根據本發明第四實施例的電子組件的天線之輻射場型之示意圖。須注意的是，根據本發明第四實施例的電子組件10c與圖1至圖3中根據本發明第一實施例的電子組件10之間的差異僅在於天線的輻射場型之形式。根據本發明第四實施例的電子組件10c亦可包含圖1至圖3中根據本發明第一實施例的電路板100、干擾源200、屏蔽罩300、多
個屏蔽夾350、近屏蔽墊400及第一擴充電路板450，且可參考圖1至圖3中的天線500之相關敘述理解根據本發明第四實施例的天線500c的其他特徵。因此，以下僅詳細說明天線500c的輻射場型F3，不再贅述其他相似的內容。於本實施例中，天線500c的輻射場型F3呈橢圓外形且從天線500c沿遠離干擾源200的方向以及遠離第一擴充電路板450之方向延伸。於本實施例中，干擾源200與輻射場型F3所指出的具有天線峰值增益最大值之處之間的最小距離X3亦符合不等式X3<
或者，請參閱圖7，圖7為呈現根據本發明第五實施例的電子組件的天線之輻射場型之示意圖。須注意的是，根據本發明第五實施例的電子組件10d與圖1至圖3中根據本發明第一實施例的電子組件10之間的差異僅在於天線的輻射場型之形式。根據本發明第五實施例的電子組件10d亦可包含圖1至圖3中根據本發明第一實施例的電路板100、干擾源200、屏蔽罩300、多個屏蔽夾350、近屏蔽墊400及第一擴充電路板450，且可參考圖1至圖3中的天線500之相關敘述理解根據本發明第五實施例的天線500d的其他特徵。因此，以下僅詳細說明天線500d的輻射場型F4，不再贅述其他相似的內容。於本實施例中，天線500d的輻射場型F4包含一主延伸部F4a、多個第一次延伸部F4b以及多個第二次延伸部F4c，且輻射場型F4具有一基準點p4。主延伸部F4a的涵蓋範圍比第一次延伸部F4b以及第二次延伸部F4c各自的涵蓋範圍大。相較於天線500d遠離第一擴充電路板450的一
側來說，基準點p4較靠近天線500d靠近第一擴充電路板450的一側。主延伸部F4a從基準點p4沿遠離第一擴充電路板450的方向延伸。這些第一次延伸部F4b從基準點p4沿靠近干擾源200的方向延伸並以基準點p4為中心環狀排列。這些第二次延伸部F4c從基準點p4沿遠離干擾源200的方向延伸並以基準點p4為中心環狀排列。於本實施例中，干擾源200與輻射場型F4所指出的具有天線峰值增益最大值之處之間的最小距離X4亦符合不等式X4<
或者，請參閱圖8，圖8為呈現根據本發明第六實施例的電子組件的天線之輻射場型之示意圖。須注意的是，根據本發明第六實施例的電子組件10e與圖1至圖3中根據本發明第一實施例的電子組件10之間的差異僅在於天線的輻射場型之形式。根據本發明第六實施例的電子組件10e亦可包含圖1至圖3中根據本發明第一實施例的電路板100、干擾源200、屏蔽罩300、多個屏蔽夾350、近屏蔽墊400及第一擴充電路板450，且可參考圖1至圖3中的天線500之相關敘述理解根據本發明第六實施例的天線500e的其他特徵。因此，以下僅詳細說明天線500e的輻射場型F5，不再贅述其他相似的內容。於本實施例中，天線500e的輻射場型F5包含一主延伸部F5a、多個第一次延伸部F5b以及多個第二次延伸部F5c，且輻射場型F5具有一基準點p5。主延伸部F5a的涵蓋範圍比第一次延伸部F5b以及第二次延伸部F5c各自的涵蓋範圍大。相較於天線500e遠離第一擴充電路板450的一
側來說，基準點p5較靠近天線500e靠近第一擴充電路板450的一側。主延伸部F5a從基準點p5沿靠近干擾源200的方向延伸。這些第一次延伸部F5b從基準點p5沿靠近第一擴充電路板450的方向延伸並以基準點p5為中心環狀排列。這些第二次延伸部F5c從基準點p5沿遠離第一擴充電路板450的方向延伸並以基準點p5為中心環狀排列。於本實施例中，干擾源200與輻射場型F5所指出的具有天線峰值增益最大值之處之間的最小距離X5亦符合不等式X5<
或者，請參閱圖9，圖9為呈現根據本發明第七實施例的電子組件的天線之輻射場型之示意圖。須注意的是，根據本發明第七實施例的電子組件10f與圖1至圖3中根據本發明第一實施例的電子組件10之間的差異僅在於天線的輻射場型之形式。根據本發明第七實施例的電子組件10f亦可包含圖1至圖3中根據本發明第一實施例的電路板100、干擾源200、屏蔽罩300、多個屏蔽夾350、近屏蔽墊400及第一擴充電路板450，且可參考圖1至圖3中的天線500之相關敘述理解根據本發明第七實施例的天線500f中的其他特徵。因此，以下僅詳細說明天線500f的輻射場型F6，不再贅述其他相似的內容。於本實施例中，天線500f的輻射場型F6包含二主延伸部F6a、二第一次延伸部F6b以及二第二次延伸部F6c，且輻射場型F6具有一基準點p6。主延伸部F6a各自的涵蓋範圍比各個第一次延伸部F6b的涵蓋範圍以及各個第二次延伸部F6c的涵蓋範圍還大。相較於天線500f靠近第一
擴充電路板450的一側來說，基準點p6較靠近天線500f遠離第一擴充電路板450的一側。其中一個主延伸部F6a從基準點p6沿靠近干擾源200的方向以及遠離第一擴充電路板450的方向延伸。另一個主延伸部F6a從基準點p6沿遠離干擾源200的方向以及靠近第一擴充電路板450的方向延伸。二第一次延伸部F6b從基準點p6沿靠近干擾源200的方向延伸並以基準點p6為中心環狀排列。二第二次延伸部F6c從基準點p6沿遠離干擾源200的方向延伸並以基準點p6為中心環狀排列。於本實施例中，干擾源200與輻射場型F6所指出的具有天線峰值增益最大值之處之間的最小距離X6亦符合不等式X6<
或者，請參閱圖10，圖10為呈現根據本發明第八實施例的電子組件的天線之輻射場型之示意圖。須注意的是，根據本發明第八實施例的電子組件10g與圖1至圖3中根據本發明第一實施例的電子組件10之間的差異僅在於天線的輻射場型之形式。根據本發明第八實施例的電子組件10g亦可包含圖1至圖3中根據本發明第一實施例的電路板100、干擾源200、屏蔽罩300、多個屏蔽夾350、近屏蔽墊400及第一擴充電路板450，且可參考圖1至圖3中的天線500之相關敘述理解根據本發明第八實施例的天線500g的其他特徵。因此，以下僅詳細說明天線500g的輻射場型F7，不再贅述其他相似的內容。於本實施例中，天線500g的輻射場型F7包含以天線500g為中心的多個環形輻射場F7a，且越靠近天線500g的兩端之環形輻射場F7a的直徑F7D越小。
於本實施例中，干擾源200與輻射場型F7所指出的具有天線峰值增益最大值之處之間的最小距離X7亦符合不等式X7<
本發明並不以天線的設置位置、近屏蔽墊的數量以及近屏蔽墊的設置位置為限。請參閱圖11，圖11為根據本發明第九實施例的電子組件之上視圖。須注意的是，根據本發明第九實施例的電子組件10h與圖1至圖3中根據本發明第一實施例的電子組件10之間的差異僅在於天線的設置位置、近屏蔽墊的數量以及近屏蔽墊的設置位置。根據本發明第九實施例的電子組件10h亦可包含圖1至圖3中根據本發明第一實施例的電路板100、干擾源200、屏蔽罩300、多個屏蔽夾350及第一擴充電路板450，且可參考圖1至圖3中的近屏蔽墊400及天線500之相關敘述理解根據本發明第九實施例的近屏蔽墊401h、402h及天線500h的其他特徵。因此，以下僅詳細說明天線500h的設置位置、近屏蔽墊401h、402h的數量以及近屏蔽墊401h、402h的設置位置，不再贅述其他相似的內容。於本實施例中，電子組件10h包含兩個近屏蔽墊401h、402h。於本實施例中，這兩個近屏蔽墊401h、402h設置於頂板320的頂面323且介於開口321以及天線500h之間。詳細來說，近屏蔽墊401h介於開口321以及第一外表面311之間，近屏蔽墊402h介於開口321以及第三外表面313之間，且第三外表面313比第四外表面314還靠近天線500h。於本實施例中，天線500h位於基準面B的一側，近屏蔽墊401h的至少一部分與基準面B重疊，近屏蔽墊402h與天線500h位於基準 面B的同一側。於本實施例中，這兩個近屏蔽墊401h、402h係彼此分離，但並不以此為限。於其他實施例中，兩個近屏蔽墊亦可彼此直接相連而共同呈L狀外形。 The present invention is not limited to the location of the antenna, the number of near shielding pads, and the location of the near shielding pads. Please refer to FIG. 11, which is a top view of the electronic assembly according to the ninth embodiment of the present invention. It should be noted that the difference between the electronic assembly 10h according to the ninth embodiment of the present invention and the electronic assembly 10 according to the first embodiment of the present invention in FIGS. 1 to 3 is only the location of the antenna, the number of near shielding pads, and the location of the near shielding pads. The electronic assembly 10h according to the ninth embodiment of the present invention may also include the circuit board 100, the interference source 200, the shielding cover 300, the plurality of shielding clips 350 and the first expansion circuit board 450 according to the first embodiment of the present invention in FIGS. 1 to 3 , and other features of the near shielding pads 401h, 402h and the antenna 500h according to the ninth embodiment of the present invention may be understood by referring to the relevant descriptions of the near shielding pad 400 and the antenna 500 in FIGS. 1 to 3 . Therefore, the following only describes in detail the setting position of the antenna 500h, the number of the near shielding pads 401h, 402h and the setting position of the near shielding pads 401h, 402h, and other similar contents are not repeated. In this embodiment, the electronic component 10h includes two near shielding pads 401h and 402h. In this embodiment, the two near shielding pads 401h and 402h are disposed on the top surface 323 of the top plate 320 and between the opening 321 and the antenna 500h. Specifically, the near shielding pad 401h is between the opening 321 and the first outer surface 311, and the near shielding pad 402h is between the opening 321 and the third outer surface 313, and the third outer surface 313 is closer to the antenna 500h than the fourth outer surface 314. In this embodiment, the antenna 500h is located on one side of the reference plane B, at least a portion of the near shielding pad 401h overlaps with the reference plane B, and the near shielding pad 402h and the antenna 500h are located on the same side of the reference plane B. In this embodiment, the two near shielding pads 401h and 402h are separated from each other, but not limited to this. In other embodiments, the two near shielding pads can also be directly connected to each other and form an L-shaped shape together.
或者，請參閱圖12，圖12為根據本發明第十實施例的電子組件之上視圖。須注意的是，根據本發明第十實施例的電子組件10i與圖1至圖3中根據本發明第一實施例的電子組件10之間的差異僅在於天線的設置位置、近屏蔽墊的數量以及近屏蔽墊的設置位置。根據本發明第十實施例的電子組件10i亦可包含圖1至圖3中根據本發明第一實施例的電路板100、干擾源200、屏蔽罩300、多個屏蔽夾350及第一擴充電路板450，且可參考圖1至圖3中的近屏蔽墊400及天線500之相關敘述理解根據本發明第十實施例的近屏蔽墊401i、402i及天線500i的其他特徵。因此，以下僅詳細說明天線500i的設置位置、近屏蔽墊401i、402i的數量以及近屏蔽墊401i、402i的設置位置，不再贅述其他相似的內容。於本實施例中，電子組件10i包含兩個近屏蔽墊401i、402i。於本實施例中，這兩個近屏蔽墊401i、402i設置於頂板320的頂面323且介於開口321以及天線500i之間。詳細來說，近屏蔽墊401i介於開口321以及第一外表面311之間，近屏蔽墊402i介於開口321以及第四外表面314之間，且第四外表面314比第三外表面313還靠近天線500i。於本實施例中，天線500i位於基準面B的另一側，近屏蔽墊401i的至少一部分與基準面B重疊，近屏蔽墊402i與天線500i位於基準面B的同一側。於本實施例 中，這兩個近屏蔽墊401i、402i係彼此分離，但並不以此為限。於其他實施例中，兩個近屏蔽墊亦可彼此直接相連而共同呈L狀外形。 Alternatively, please refer to Figure 12, which is a top view of the electronic assembly according to the tenth embodiment of the present invention. It should be noted that the difference between the electronic assembly 10i according to the tenth embodiment of the present invention and the electronic assembly 10 according to the first embodiment of the present invention in Figures 1 to 3 is only the setting position of the antenna, the number of near shielding pads and the setting position of the near shielding pads. The electronic assembly 10i according to the tenth embodiment of the present invention may also include the circuit board 100, the interference source 200, the shielding cover 300, the plurality of shielding clips 350 and the first expansion circuit board 450 according to the first embodiment of the present invention in FIGS. 1 to 3 , and other features of the near shielding pads 401i, 402i and the antenna 500i according to the tenth embodiment of the present invention may be understood by referring to the relevant descriptions of the near shielding pad 400 and the antenna 500 in FIGS. 1 to 3 . Therefore, the following only describes in detail the setting position of the antenna 500i, the number of the near shielding pads 401i, 402i and the setting position of the near shielding pads 401i, 402i, and other similar contents are not repeated. In this embodiment, the electronic component 10i includes two near shielding pads 401i and 402i. In this embodiment, the two near shielding pads 401i and 402i are disposed on the top surface 323 of the top plate 320 and between the opening 321 and the antenna 500i. Specifically, the near shielding pad 401i is between the opening 321 and the first outer surface 311, and the near shielding pad 402i is between the opening 321 and the fourth outer surface 314, and the fourth outer surface 314 is closer to the antenna 500i than the third outer surface 313. In this embodiment, the antenna 500i is located on the other side of the reference plane B, at least a portion of the near shielding pad 401i overlaps with the reference plane B, and the near shielding pad 402i and the antenna 500i are located on the same side of the reference plane B. In this embodiment, the two near shielding pads 401i and 402i are separated from each other, but not limited to this. In other embodiments, the two near shielding pads can also be directly connected to each other and form an L-shaped shape together.
或者，請參閱圖13，圖13為根據本發明第十一實施例的電子組件之上視圖。須注意的是，根據本發明第十一實施例的電子組件10j與圖1至圖3中根據本發明第一實施例的電子組件10之間的差異僅在於天線的數量、天線的設置位置、近屏蔽墊的數量以及近屏蔽墊的設置位置。根據本發明第十一實施例的電子組件10j亦可包含圖1至圖3中根據本發明第一實施例的電路板100、干擾源200、屏蔽罩300、多個屏蔽夾350及第一擴充電路板450，且可參考圖1至圖3中的近屏蔽墊400及天線500之相關敘述理解根據本發明第十一實施例的近屏蔽墊401j、402j、403j及天線501j、502j的其他特徵。因此，以下僅詳細說明天線501j、502j的數量、天線501j、502j的設置位置、近屏蔽墊401j、402j、403j的數量以及近屏蔽墊401j、402j、403j的設置位置，不再贅述其他相似的內容。於本實施例中，電子組件10j包含兩個天線501j、502j以及三個近屏蔽墊401j、402j、403j。於本實施例中，這三個近屏蔽墊401j、402j、403j設置於頂板320的頂面323且介於開口321以及天線501j、502j之間。詳細來說，近屏蔽墊401j介於開口321以及第一外表面311之間，近屏蔽墊402j介於開口321以及第三外表面313之間，近屏蔽墊403j介於開口321以及第四外表面314之間，第三外表面313比第四外表 面314還靠近天線501j，第四外表面314比第三外表面313還靠近天線502j。於本實施例中，天線501j、502j分別位於基準面B的相對兩側，近屏蔽墊401j的至少一部分與基準面B重疊，近屏蔽墊402j與天線501j位於基準面B的同一側，近屏蔽墊403j與天線502j位於基準面B的同一側。 Alternatively, please refer to FIG. 13, which is a top view of the electronic assembly according to the eleventh embodiment of the present invention. It should be noted that the difference between the electronic assembly 10j according to the eleventh embodiment of the present invention and the electronic assembly 10 according to the first embodiment of the present invention in FIGS. 1 to 3 is only the number of antennas, the location of the antennas, the number of near shielding pads, and the location of the near shielding pads. The electronic component 10j according to the eleventh embodiment of the present invention may also include the circuit board 100, the interference source 200, the shielding cover 300, the plurality of shielding clips 350 and the first expansion circuit board 450 according to the first embodiment of the present invention in FIGS. 1 to 3 , and other features of the near shielding pads 401j, 402j, 403j and the antennas 501j, 502j according to the eleventh embodiment of the present invention may be understood by referring to the relevant descriptions of the near shielding pad 400 and the antenna 500 in FIGS. 1 to 3 . Therefore, the following only describes in detail the number of antennas 501j, 502j, the locations of the antennas 501j, 502j, the number of near shielding pads 401j, 402j, 403j, and the locations of the near shielding pads 401j, 402j, 403j, and other similar contents are not repeated. In this embodiment, the electronic component 10j includes two antennas 501j, 502j and three near shielding pads 401j, 402j, 403j. In this embodiment, the three near shielding pads 401j, 402j, 403j are arranged on the top surface 323 of the top plate 320 and between the opening 321 and the antennas 501j, 502j. Specifically, the near shielding pad 401j is between the opening 321 and the first outer surface 311, the near shielding pad 402j is between the opening 321 and the third outer surface 313, the near shielding pad 403j is between the opening 321 and the fourth outer surface 314, the third outer surface 313 is closer to the antenna 501j than the fourth outer surface 314, and the fourth outer surface 314 is closer to the antenna 502j than the third outer surface 313. In this embodiment, the antennas 501j and 502j are respectively located on opposite sides of the reference plane B, at least a portion of the near shielding pad 401j overlaps with the reference plane B, the near shielding pad 402j and the antenna 501j are located on the same side of the reference plane B, and the near shielding pad 403j and the antenna 502j are located on the same side of the reference plane B.
本發明並不以電路板以及第一擴充電路板之間的接地關係為限。請參閱圖14，圖14為根據本發明第十二實施例的電子組件之上視圖。須注意的是，根據本發明第十二實施例的電子組件10k與圖1至圖3中根據本發明第一實施例的電子組件10之間的差異僅在於電路板以及第一擴充電路板之間的接地關係。根據本發明第十二實施例的電子組件10k亦可包含圖1至圖3中根據本發明第一實施例的干擾源200、屏蔽罩300、多個屏蔽夾350、近屏蔽墊400及天線500，且可參考圖1至圖3中的電路板100及第一擴充電路板450之相關敘述理解根據本發明第十二實施例的電路板100k及第一擴充電路板450k的其他特徵。因此，以下僅詳細說明電路板100k及第一擴充電路板450k之間的接地關係，不再贅述其他相似的內容。於本實施例中，電路板100k及第一擴充電路板450k共同構成一個電路板550k，且屏蔽罩300及天線500電性連接於電路板550k中的同一個接地層(未繪示)而彼此共地。 The present invention is not limited to the grounding relationship between the circuit board and the first expansion circuit board. Please refer to FIG. 14, which is a top view of the electronic assembly according to the twelfth embodiment of the present invention. It should be noted that the difference between the electronic assembly 10k according to the twelfth embodiment of the present invention and the electronic assembly 10 according to the first embodiment of the present invention in FIGS. 1 to 3 is only the grounding relationship between the circuit board and the first expansion circuit board. The electronic assembly 10k according to the twelfth embodiment of the present invention may also include the interference source 200, the shielding cover 300, the plurality of shielding clips 350, the near shielding pad 400 and the antenna 500 according to the first embodiment of the present invention in FIGS. 1 to 3 , and other features of the circuit board 100k and the first expansion circuit board 450k according to the twelfth embodiment of the present invention may be understood by referring to the relevant description of the circuit board 100 and the first expansion circuit board 450 in FIGS. 1 to 3 . Therefore, only the grounding relationship between the circuit board 100k and the first expansion circuit board 450k is described in detail below, and other similar contents are not repeated. In this embodiment, the circuit board 100k and the first expansion circuit board 450k together constitute a circuit board 550k, and the shielding cover 300 and the antenna 500 are electrically connected to the same ground layer (not shown) in the circuit board 550k and share the same ground.
或者，請參閱圖15，圖15為根據本發明第十三實施例的電子組件之上視圖。須注意的是，根據本發明第十三實施例 的電子組件101與圖11中根據本發明第九實施例的電子組件10h之間的差異僅在於電路板以及第一擴充電路板之間的接地關係。根據本發明第十三實施例的電子組件101亦可包含圖1至圖3中根據本發明第一實施例的干擾源200、屏蔽罩300及多個屏蔽夾350，且可包含圖11中根據本發明第九實施例的近屏蔽墊401h、402h及天線500h，且可參考圖1至圖3中的電路板100及第一擴充電路板450之相關敘述理解根據本發明第十三實施例的電路板100l及第一擴充電路板450l的其他特徵。因此，以下僅詳細說明電路板100l及第一擴充電路板450l之間的接地關係，不再贅述其他相似的內容。於本實施例中，電路板100l及第一擴充電路板450l共同構成一個電路板550l，且屏蔽罩300及天線500h電性連接於電路板550l中的同一個接地層(未繪示)而彼此共地。 Alternatively, please refer to FIG. 15, which is a top view of the electronic assembly according to the thirteenth embodiment of the present invention. It should be noted that the difference between the electronic assembly 101 according to the thirteenth embodiment of the present invention and the electronic assembly 10h according to the ninth embodiment of the present invention in FIG. 11 is only the grounding relationship between the circuit board and the first expansion circuit board. The electronic assembly 101 according to the thirteenth embodiment of the present invention may also include the interference source 200, the shielding cover 300 and the plurality of shielding clips 350 according to the first embodiment of the present invention in FIGS. 1 to 3 , and may include the near shielding pads 401h, 402h and the antenna 500h according to the ninth embodiment of the present invention in FIG. 11 , and other features of the circuit board 1001 and the first expansion circuit board 4501 according to the thirteenth embodiment of the present invention may be understood by referring to the relevant description of the circuit board 100 and the first expansion circuit board 450 in FIGS. 1 to 3 . Therefore, only the grounding relationship between the circuit board 1001 and the first expansion circuit board 4501 is described in detail below, and other similar contents are not repeated. In this embodiment, the circuit board 1001 and the first expansion circuit board 4501 together form a circuit board 5501, and the shielding cover 300 and the antenna 500h are electrically connected to the same ground layer (not shown) in the circuit board 5501 and share the same ground.
或者，請參閱圖16，圖16為根據本發明第十四實施例的電子組件之上視圖。須注意的是，根據本發明第十四實施例的電子組件10m與圖12中根據本發明第十實施例的電子組件10i之間的差異僅在於電路板以及第一擴充電路板之間的接地關係。根據本發明第十四實施例的電子組件10m亦可包含圖1至圖3中根據本發明第一實施例的干擾源200、屏蔽罩300及多個屏蔽夾350，且可包含圖12中根據本發明第十實施例的近屏蔽墊401i、402i及天線500i，且可參考圖1至圖3中的電路板100及第一擴充電路板450之相關敘述理解根據本發明第十四實施例的電路板100m及第一擴充電路板450m的其他特徵。因此，以下僅詳細說 明電路板100m及第一擴充電路板450m之間的接地關係，不再贅述其他相似的內容。於本實施例中，電路板100m及第一擴充電路板450m共同構成一個電路板550m，且屏蔽罩300及天線500i電性連接於電路板550m中的同一個接地層(未繪示)而彼此共地。 Alternatively, please refer to Fig. 16, which is a top view of the electronic assembly according to the fourteenth embodiment of the present invention. It should be noted that the difference between the electronic assembly 10m according to the fourteenth embodiment of the present invention and the electronic assembly 10i according to the tenth embodiment of the present invention in Fig. 12 is only the grounding relationship between the circuit board and the first expansion circuit board. The electronic assembly 10m according to the fourteenth embodiment of the present invention may also include the interference source 200, the shielding cover 300 and the plurality of shielding clips 350 according to the first embodiment of the present invention in FIGS. 1 to 3 , and may include the near shielding pads 401i, 402i and the antenna 500i according to the tenth embodiment of the present invention in FIG. 12 , and other features of the circuit board 100m and the first expansion circuit board 450m according to the fourteenth embodiment of the present invention may be understood by referring to the relevant description of the circuit board 100 and the first expansion circuit board 450 in FIGS. 1 to 3 . Therefore, the following only describes in detail the grounding relationship between the circuit board 100m and the first expansion circuit board 450m, and other similar contents are not repeated. In this embodiment, the circuit board 100m and the first expansion circuit board 450m together constitute a circuit board 550m, and the shielding cover 300 and the antenna 500i are electrically connected to the same ground layer (not shown) in the circuit board 550m and share the same ground.
或者，請參閱圖17，圖17為根據本發明第十五實施例的電子組件之上視圖。須注意的是，根據本發明第十五實施例的電子組件10n與圖13中根據本發明第十一實施例的電子組件10j之間的差異僅在於電路板以及第一擴充電路板之間的接地關係。根據本發明第十五實施例的電子組件10n亦可包含圖1至圖3中根據本發明第一實施例的干擾源200、屏蔽罩300及多個屏蔽夾350，且可包含圖13中根據本發明第十一實施例的近屏蔽墊401j、402j、403j及天線501j、502j，亦可參考圖1至圖3中的電路板100及第一擴充電路板450之相關敘述理解根據本發明第十五實施例的電路板100n及第一擴充電路板450n的其他特徵。因此，以下僅詳細說明電路板100n及第一擴充電路板450n之間的接地關係，不再贅述其他相似的內容。於本實施例中，電路板100n及第一擴充電路板450n共同構成一個電路板550n，且屏蔽罩300及天線501j、502j電性連接於電路板550n中的同一個接地層(未繪示)而彼此共地。 Alternatively, please refer to Fig. 17, which is a top view of the electronic assembly according to the fifteenth embodiment of the present invention. It should be noted that the difference between the electronic assembly 10n according to the fifteenth embodiment of the present invention and the electronic assembly 10j according to the eleventh embodiment of the present invention in Fig. 13 is only the grounding relationship between the circuit board and the first expansion circuit board. The electronic assembly 10n according to the fifteenth embodiment of the present invention may also include the interference source 200, the shielding cover 300 and the plurality of shielding clips 350 according to the first embodiment of the present invention in FIGS. 1 to 3 , and may include the near shielding pads 401j, 402j, 403j and the antennas 501j, 502j according to the eleventh embodiment of the present invention in FIG. 13 . Other features of the circuit board 100n and the first expansion circuit board 450n according to the fifteenth embodiment of the present invention may also be understood by referring to the relevant description of the circuit board 100 and the first expansion circuit board 450 in FIGS. 1 to 3 . Therefore, only the grounding relationship between the circuit board 100n and the first expansion circuit board 450n is described in detail below, and other similar contents are not repeated. In this embodiment, the circuit board 100n and the first expansion circuit board 450n together constitute a circuit board 550n, and the shielding cover 300 and the antennas 501j and 502j are electrically connected to the same ground layer (not shown) in the circuit board 550n and share the same ground.
本發明並不以屏蔽罩的頂板之開口的外形為限。請參閱圖18，圖18為根據本發明第十六實施例的電子組件之屏蔽罩及近屏蔽墊的上視圖。須注意的是，根據本發明第十六實施例 的電子組件10p與圖1至圖3中根據本發明第一實施例的電子組件10之間的差異僅在於屏蔽罩的頂板之開口的外形。根據本發明第十六實施例的電子組件10p亦可包含圖1至圖3中根據本發明第一實施例的電路板100、干擾源200、多個屏蔽夾350、近屏蔽墊400、第一擴充電路板450及天線500，且可參考圖1至圖3中的屏蔽罩300之相關敘述理解根據本發明第十六實施例的屏蔽罩300p的其他特徵。因此，以下僅詳細說明屏蔽罩300p的頂板320p之開口321p的外形，不再贅述其他相似的內容。須注意的是，為了凸顯本實施例與第一實施例之間的差異，圖18中僅呈現屏蔽罩300p及設置於屏蔽罩300p上的近屏蔽墊400。於本實施例中，屏蔽罩300p的頂板320p之開口321p的剖面例如呈圓形。 The present invention is not limited to the shape of the opening of the top plate of the shielding cover. Please refer to Figure 18, which is a top view of the shielding cover and the near shielding pad of the electronic component according to the sixteenth embodiment of the present invention. It should be noted that the difference between the electronic component 10p according to the sixteenth embodiment of the present invention and the electronic component 10 according to the first embodiment of the present invention in Figures 1 to 3 is only the shape of the opening of the top plate of the shielding cover. The electronic component 10p according to the sixteenth embodiment of the present invention may also include the circuit board 100, the interference source 200, the plurality of shielding clips 350, the near shielding pad 400, the first expansion circuit board 450 and the antenna 500 according to the first embodiment of the present invention in FIGS. 1 to 3 , and the other features of the shielding cover 300p according to the sixteenth embodiment of the present invention may be understood by referring to the relevant description of the shielding cover 300 in FIGS. 1 to 3 . Therefore, the following only describes in detail the shape of the opening 321p of the top plate 320p of the shielding cover 300p, and other similar contents are not described in detail. It should be noted that, in order to highlight the difference between the present embodiment and the first embodiment, FIG. 18 only shows the shielding cover 300p and the near shielding pad 400 disposed on the shielding cover 300p. In this embodiment, the cross-section of the opening 321p of the top plate 320p of the shielding cover 300p is, for example, circular.
或者，圖19為根據本發明第十七實施例的電子組件之屏蔽罩及近屏蔽墊的上視圖。須注意的是，根據本發明第十七實施例的電子組件10q與圖1至圖3中根據本發明第一實施例的電子組件10之間的差異僅在於屏蔽罩的頂板之開口的外形。根據本發明第十七實施例的電子組件10q亦可包含圖1至圖3中根據本發明第一實施例的電路板100、干擾源200、多個屏蔽夾350、近屏蔽墊400、第一擴充電路板450及天線500，且可參考圖1至圖3中的屏蔽罩300之相關敘述理解根據本發明第十七實施例的屏蔽罩300q的其他特徵。因此，以下僅詳細說明屏蔽罩300q的頂板320q之開口321q的外形，不再贅述其他相似的內容。須注意的是，為了凸顯本實施例與第一實施例之間的差異，圖19中僅 呈現屏蔽罩300q及設置於屏蔽罩300q上的近屏蔽墊400。於本實施例中，屏蔽罩300q的頂板320q之開口321q的剖面例如呈長方形。 Alternatively, FIG. 19 is a top view of the shielding cover and the near shielding pad of the electronic assembly according to the seventeenth embodiment of the present invention. It should be noted that the difference between the electronic assembly 10q according to the seventeenth embodiment of the present invention and the electronic assembly 10 according to the first embodiment of the present invention in FIGS. 1 to 3 is only the shape of the opening of the top plate of the shielding cover. The electronic assembly 10q according to the seventeenth embodiment of the present invention may also include the circuit board 100, the interference source 200, the plurality of shielding clips 350, the near shielding pad 400, the first expansion circuit board 450 and the antenna 500 according to the first embodiment of the present invention in FIGS. 1 to 3, and other features of the shielding cover 300q according to the seventeenth embodiment of the present invention may be understood by referring to the relevant description of the shielding cover 300 in FIGS. 1 to 3. Therefore, the following only describes in detail the appearance of the opening 321q of the top plate 320q of the shielding cover 300q, and does not elaborate on other similar contents. It should be noted that in order to highlight the difference between this embodiment and the first embodiment, FIG. 19 only shows the shielding cover 300q and the near shielding pad 400 disposed on the shielding cover 300q. In this embodiment, the cross-section of the opening 321q of the top plate 320q of the shielding cover 300q is, for example, a rectangle.
本發明並不以屏蔽罩的頂板之開口的外形及數量為限。圖20為根據本發明第十八實施例的電子組件之屏蔽罩及近屏蔽墊的上視圖。須注意的是，根據本發明第十八實施例的電子組件10r與圖1至圖3中根據本發明第一實施例的電子組件10之間的差異僅在於屏蔽罩的頂板之開口的數量及外形。根據本發明第十八實施例的電子組件10r亦可包含圖1至圖3中根據本發明第一實施例的電路板100、干擾源200、多個屏蔽夾350、近屏蔽墊400、第一擴充電路板450及天線500，且可參考圖1至圖3中的屏蔽罩300之相關敘述理解根據本發明第十八實施例的屏蔽罩300r的其他特徵。因此，以下僅詳細說明屏蔽罩300r的頂板320r之開口321r的數量及外形，不再贅述其他相似的內容。須注意的是，為了凸顯本實施例與第一實施例之間的差異，圖20中僅呈現屏蔽罩300r及設置於屏蔽罩300r上的近屏蔽墊400。於本實施例中，屏蔽罩300r的頂板320r具有彼此分離的二開口321r，且此二開口321r的剖面例如分別呈三角形以及正方形。更進一步來說，剖面呈正方形的開口321r介於剖面呈三角形的開口321r以及近屏蔽墊400之間。 The present invention is not limited to the shape and number of the openings on the top plate of the shielding cover. FIG. 20 is a top view of the shielding cover and the near shielding pad of the electronic assembly according to the eighteenth embodiment of the present invention. It should be noted that the difference between the electronic assembly 10r according to the eighteenth embodiment of the present invention and the electronic assembly 10 according to the first embodiment of the present invention in FIGS. 1 to 3 is only the number and shape of the openings on the top plate of the shielding cover. The electronic assembly 10r according to the eighteenth embodiment of the present invention may also include the circuit board 100, the interference source 200, the plurality of shielding clips 350, the near shielding pad 400, the first expansion circuit board 450 and the antenna 500 according to the first embodiment of the present invention in FIGS. 1 to 3 , and the other features of the shielding cover 300r according to the eighteenth embodiment of the present invention may be understood by referring to the relevant description of the shielding cover 300 in FIGS. 1 to 3 . Therefore, the following only describes in detail the number and shape of the openings 321r of the top plate 320r of the shielding cover 300r, and other similar contents are not repeated. It should be noted that, in order to highlight the difference between the present embodiment and the first embodiment, FIG. 20 only shows the shielding cover 300r and the near shielding pad 400 disposed on the shielding cover 300r. In this embodiment, the top plate 320r of the shielding cover 300r has two openings 321r separated from each other, and the cross-sections of the two openings 321r are, for example, triangular and square respectively. More specifically, the opening 321r with a square cross-section is between the opening 321r with a triangular cross-section and the near shielding pad 400.
圖21為根據本發明第十九實施例的電子組件之上視圖。須注意的是，根據本發明第十九實施例的電子組件10s與圖 1至圖3中根據本發明第一實施例的電子組件10之間的差異僅在於根據本發明第十九實施例的電子組件10s更包含一第二擴充電路板600s、一殼體650s以及一遠屏蔽墊700s。根據本發明第十九實施例的電子組件10r亦可包含圖1至圖3中根據本發明第一實施例的電路板100、干擾源200、屏蔽罩300、多個屏蔽夾350、近屏蔽墊400、第一擴充電路板450及天線500。因此，以下僅詳細說明第二擴充電路板600s、殼體650s以及遠屏蔽墊700s，不再贅述其他相似的內容。於本實施例中，第二擴充電路板600s介於電路板100及第一擴充電路板450之間。殼體650s設置於第二擴充電路板600s並例如為電腦機殼、伺服器機殼、揚聲器的殼體或電池的殼體。遠屏蔽墊700s設置於殼體650s遠離第二擴充電路板600s的一側。遠屏蔽墊700s分離於屏蔽罩300且位於開口321以及天線500之間。於本實施例中，電路板100、第一擴充電路板450及第二擴充電路板600s彼此分離而使得屏蔽罩300、天線500及遠屏蔽墊700s彼此不共地。 FIG. 21 is a top view of an electronic assembly according to the nineteenth embodiment of the present invention. It should be noted that the difference between the electronic assembly 10s according to the nineteenth embodiment of the present invention and the electronic assembly 10 according to the first embodiment of the present invention in FIGS. 1 to 3 is that the electronic assembly 10s according to the nineteenth embodiment of the present invention further includes a second expansion circuit board 600s, a housing 650s, and a far shielding pad 700s. The electronic assembly 10r according to the nineteenth embodiment of the present invention may also include the circuit board 100, the interference source 200, the shielding cover 300, the plurality of shielding clips 350, the near shielding pad 400, the first expansion circuit board 450, and the antenna 500 according to the first embodiment of the present invention in FIGS. 1 to 3. Therefore, the following only describes the second expansion circuit board 600s, the housing 650s and the remote shielding pad 700s in detail, and other similar contents are not repeated. In this embodiment, the second expansion circuit board 600s is between the circuit board 100 and the first expansion circuit board 450. The housing 650s is disposed on the second expansion circuit board 600s and is, for example, a computer housing, a server housing, a speaker housing or a battery housing. The remote shielding pad 700s is disposed on a side of the housing 650s away from the second expansion circuit board 600s. The remote shielding pad 700s is separated from the shielding cover 300 and is located between the opening 321 and the antenna 500. In this embodiment, the circuit board 100, the first expansion circuit board 450 and the second expansion circuit board 600s are separated from each other so that the shielding cover 300, the antenna 500 and the remote shielding pad 700s are not grounded.
此外，請參閱圖22A及圖22B，圖22A為呈現圖21中的電子組件的遠屏蔽墊及天線之間的間隔距離之示意圖。圖22B為呈現遠屏蔽墊與天線之間在不同間隔距離下的抑制效果。於本實施例中，遠屏蔽墊700s與天線500之間的間隔距離D符合不等式
本發明並不以電路板、第一擴充電路板及第二擴充電路板之間的接地關係為限。請參閱圖23，圖23為根據本發明第二十實施例的電子組件之上視圖。根據本發明第二十實施例的電子組件10t與圖21中根據本發明第十九實施例的電子組件10s之間的差異僅在於電路板、第一擴充電路板及第二擴充電路板之間的接地關係，根據本發明第二十實施例的電子組件10t亦可包含圖1至圖3中根據本發明第一實施例的干擾源200、屏蔽罩300、多個屏蔽夾350、近屏蔽墊400、天線500，且可包含圖21及圖22中根據本發明第十九實施例的殼體650s及遠屏蔽墊700s，亦可參考圖1中的電路板100及第一擴充電路板450的相關敘述以及圖21中的第二擴充電路板600s之相關敘述理解根據本發明第二十實施例之電路板100t、第一擴充電路板450t及第二擴充電路板600t的其他特徵。因此，以下僅詳細說明電路板100t、第一擴充電路板450t及第二擴充電路板600t之間的接地關係，不再贅述其他相似的內容。於本實施例中，電路板100t及第二擴充電路板600t共同構成一電路板550t且屏蔽罩300及遠屏蔽墊700s電性連接於電路板550t的同一個接地層而彼此共地。於本實施例中， 第一擴充電路板450t分離於電路板550t而使得天線500與屏蔽罩300及遠屏蔽墊700s不共地。 The present invention is not limited to the grounding relationship between the circuit board, the first expansion circuit board, and the second expansion circuit board. Please refer to FIG. 23, which is a top view of the electronic assembly according to the twentieth embodiment of the present invention. The difference between the electronic assembly 10t according to the twentieth embodiment of the present invention and the electronic assembly 10s according to the nineteenth embodiment of the present invention in FIG. 21 is only the grounding relationship between the circuit board, the first expansion circuit board, and the second expansion circuit board. The electronic assembly 10t according to the twentieth embodiment of the present invention may also include the interference source 200, the shielding cover 300, the plurality of shielding clips 350, the near shielding pad 400, the shielding cover 300, the shielding cover 35 ... The antenna 500 may include the housing 650s and the remote shielding pad 700s according to the nineteenth embodiment of the present invention in FIGS. 21 and 22 . The other features of the circuit board 100t, the first expansion circuit board 450t, and the second expansion circuit board 600t according to the twentieth embodiment of the present invention may also be understood by referring to the relevant description of the circuit board 100 and the first expansion circuit board 450 in FIG. 1 and the relevant description of the second expansion circuit board 600s in FIG. 21 . Therefore, only the grounding relationship between the circuit board 100t, the first expansion circuit board 450t, and the second expansion circuit board 600t is described in detail below, and other similar contents are not repeated. In this embodiment, the circuit board 100t and the second expansion circuit board 600t together form a circuit board 550t, and the shielding cover 300 and the remote shielding pad 700s are electrically connected to the same ground layer of the circuit board 550t and share the same ground. In this embodiment, the first expansion circuit board 450t is separated from the circuit board 550t so that the antenna 500, the shielding cover 300 and the remote shielding pad 700s do not share the same ground.
圖24為根據本發明第二十一實施例的電子組件之上視圖。根據本發明第二十一實施例的電子組件10u與圖13中根據本發明第十一實施例的電子組件10j之間的差異僅在於根據本發明第二十一實施例的電子組件10u更包含二遠屏蔽墊700u。根據本發明第二十一實施例的電子組件10u亦可包含圖1至圖3中根據本發明第一實施例的電路板100、干擾源200、屏蔽罩300、多個屏蔽夾350及第一擴充電路板450，且可包含圖13中根據第十一實施例的近屏蔽墊401j、402j、403j及天線501j、502j。因此，以下僅詳細說明二遠屏蔽墊700u，不再贅述其他相似的內容。於本實施例中，二遠屏蔽墊700u彼此分離且直接設置於電路板100。二遠屏蔽墊700u分離於屏蔽罩300且位於開口321以及天線501j、502j之間。於本實施例中，遠屏蔽墊700u及屏蔽罩300電性連接於電路板100中相同的接地層而彼此共地。第一擴充電路板450分離於電路板100而使得天線501j、502j與屏蔽罩300及遠屏蔽墊700u不共地。須注意的是，根據本實施例的二遠屏蔽墊700u分別與天線501j、502j相隔的距離關係與圖22中的遠屏蔽墊700s與天線500之間的距離關係相似，故不再贅述。 FIG24 is a top view of an electronic assembly according to the twenty-first embodiment of the present invention. The difference between the electronic assembly 10u according to the twenty-first embodiment of the present invention and the electronic assembly 10j according to the eleventh embodiment of the present invention in FIG13 is that the electronic assembly 10u according to the twenty-first embodiment of the present invention further includes two far shielding pads 700u. The electronic assembly 10u according to the twenty-first embodiment of the present invention may also include the circuit board 100, the interference source 200, the shielding cover 300, the plurality of shielding clips 350 and the first expansion circuit board 450 according to the first embodiment of the present invention in FIGS. 1 to 3, and may include the near shielding pads 401j, 402j, 403j and the antennas 501j, 502j according to the eleventh embodiment in FIG13. Therefore, the following only describes the two remote shielding pads 700u in detail, and other similar contents are not repeated. In this embodiment, the two remote shielding pads 700u are separated from each other and directly disposed on the circuit board 100. The two remote shielding pads 700u are separated from the shielding cover 300 and are located between the opening 321 and the antennas 501j and 502j. In this embodiment, the remote shielding pad 700u and the shielding cover 300 are electrically connected to the same ground layer in the circuit board 100 and share a common ground with each other. The first expansion circuit board 450 is separated from the circuit board 100 so that the antennas 501j and 502j are not shared with the shielding cover 300 and the remote shielding pad 700u. It should be noted that the distance relationship between the two remote shielding pads 700u and the antennas 501j and 502j according to this embodiment is similar to the distance relationship between the remote shielding pad 700s and the antenna 500 in FIG. 22, so it will not be repeated.
圖25為根據本發明第二十二實施例的電子組件之上視圖。根據本發明第二十二實施例的電子組件10v與圖24中根據本發明第二十一實施例的電子組件10u之間的差異僅在於電路 板及第一擴充電路板之間的接地關係，根據本發明第二十二實施例的電子組件10v亦可包含圖1至圖3中根據本發明第一實施例的、干擾源200、屏蔽罩300及多個屏蔽夾350、圖13中根據第十一實施例的近屏蔽墊401j、402j、403j及天線501j、502j以及圖24中的二遠屏蔽墊700u，且亦可參考圖1中的電路板100及第一擴充電路板450的相關敘述理解根據本發明第二十二實施例之電路板100v及第一擴充電路板450v的其他特徵。因此，以下僅詳細說明電路板100v及第一擴充電路板450v之間的接地關係，不再贅述其他相似的內容。於本實施例中，電路板100v及第一擴充電路板450v共同構成一電路板550v，且屏蔽罩300、遠屏蔽墊700u及天線501j、502j電性連接於電路板550v中的同一個接地層(未繪示)而彼此共地。 FIG. 25 is a top view of the electronic assembly according to the twenty-second embodiment of the present invention. The difference between the electronic assembly 10v according to the twenty-second embodiment of the present invention and the electronic assembly 10u according to the twenty-first embodiment of the present invention in FIG. 24 is only the grounding relationship between the circuit board and the first expansion circuit board. The electronic assembly 10v according to the twenty-second embodiment of the present invention may also include the interference source 200, the shielding cover 300 and the plurality of shielding clips according to the first embodiment of the present invention in FIGS. 1 to 3. 350, the near shielding pads 401j, 402j, 403j and the antennas 501j, 502j according to the eleventh embodiment in FIG. 13 and the two far shielding pads 700u in FIG. 24, and the other features of the circuit board 100v and the first expansion circuit board 450v according to the twenty-second embodiment of the present invention can also be understood by referring to the relevant description of the circuit board 100 and the first expansion circuit board 450 in FIG. 1. Therefore, the following only describes in detail the grounding relationship between the circuit board 100v and the first expansion circuit board 450v, and other similar contents are not repeated. In this embodiment, the circuit board 100v and the first expansion circuit board 450v together form a circuit board 550v, and the shielding cover 300, the remote shielding pad 700u and the antennas 501j and 502j are electrically connected to the same grounding layer (not shown) in the circuit board 550v and share the same ground.
須注意的是，於某些實施例中，電子組件亦可僅包含遠屏蔽墊而沒有包含近屏蔽墊。 It should be noted that in some embodiments, the electronic component may include only a far shielding pad but not a near shielding pad.
請參閱圖26及圖27，圖26為呈現根據本發明的電子組件之屏蔽效果的曲線圖，且圖27為呈現根據本發明的電子組件之屏蔽效果的另一曲線圖。於圖26及圖27中，縱軸為干擾源所發出的電磁干擾場之強度(以分貝毫瓦(dBm)為單位)，且橫軸為干擾源發出的電磁波之頻率(以百萬赫(MHz)為單位)。於圖26及圖27中，虛線表示沒有設置屏蔽罩、近屏蔽墊以及遠屏蔽墊的比較例1之實驗數據；細實線表示有設置屏蔽罩但沒有設置近屏蔽墊以及遠屏蔽墊的比較例2之實驗數據，粗實線表示圖14中 設置有彼此共地的屏蔽罩及近屏蔽墊但沒有設置遠屏蔽墊的第十二實施例之實驗數據，且一點鏈線表示圖25中設置有彼此共地的屏蔽罩、近屏蔽墊及遠屏蔽墊的第二十二實施例之實驗數據。 Please refer to Figures 26 and 27, Figure 26 is a curve diagram showing the shielding effect of the electronic component according to the present invention, and Figure 27 is another curve diagram showing the shielding effect of the electronic component according to the present invention. In Figures 26 and 27, the vertical axis is the intensity of the electromagnetic interference field emitted by the interference source (in decibel milliwatts (dBm)), and the horizontal axis is the frequency of the electromagnetic wave emitted by the interference source (in megahertz (MHz)). In FIG. 26 and FIG. 27, the dashed line represents the experimental data of Comparative Example 1 without a shielding cover, a near shielding pad, and a far shielding pad; the thin solid line represents the experimental data of Comparative Example 2 with a shielding cover but without a near shielding pad and a far shielding pad; the thick solid line represents the experimental data of the twelfth embodiment in FIG. 14 with a shielding cover and a near shielding pad that are mutually grounded but without a far shielding pad; and the dotted link represents the experimental data of the twenty-second embodiment in FIG. 25 with a shielding cover, a near shielding pad, and a far shielding pad that are mutually grounded.
如圖26中762MHz至806MHz之間的範圍、850MHz至894MHz之間的範圍以及938MHz至960MHz之間的範圍所示，且如圖27中1802MHz至1848MHz之間的範圍以及2124MHz至2170MHz之間的範圍所示，第一實施例以及第十九實施例抑制電磁干擾的效果明顯優於比較例1及比較例2，且第十九實施例抑制電磁干擾的效果優於第一實施例抑制電磁干擾的效果。因此，使用根據本發明的近屏蔽墊會降低干擾源對天線產生的電磁干擾，且一起使用根據本發明的近屏蔽墊及遠屏蔽墊能更進一步降低干擾源對天線產生的電磁干擾。 As shown in the ranges between 762MHz and 806MHz, 850MHz and 894MHz, and 938MHz and 960MHz in FIG. 26, and as shown in the ranges between 1802MHz and 1848MHz and 2124MHz and 2170MHz in FIG. 27, the electromagnetic interference suppression effects of the first embodiment and the nineteenth embodiment are significantly better than those of comparative examples 1 and 2, and the electromagnetic interference suppression effect of the nineteenth embodiment is better than that of the first embodiment. Therefore, the use of the near shielding pad according to the present invention will reduce the electromagnetic interference generated by the interference source to the antenna, and the use of the near shielding pad and the far shielding pad according to the present invention together can further reduce the electromagnetic interference generated by the interference source to the antenna.
根據上述實施例所揭露之電子組件，透過位於開口以及天線之間的近屏蔽墊或是分離於屏蔽罩且位於開口以及天線之間的遠屏蔽墊，干擾源所發出的電磁波在傳播到天線之前會對近屏蔽墊或是遠屏蔽墊產生反射、繞射、與穿透之現象而產生衰減。如此一來，便能有效地減緩不同規格的干擾源與天線之間產生的電磁干擾，同時降低電子組件的製造成本。 According to the electronic components disclosed in the above embodiments, through the near shielding pad located between the opening and the antenna or the far shielding pad separated from the shielding cover and located between the opening and the antenna, the electromagnetic waves emitted by the interference source will reflect, diffract, and penetrate the near shielding pad or the far shielding pad before propagating to the antenna, resulting in attenuation. In this way, the electromagnetic interference generated between interference sources of different specifications and the antenna can be effectively mitigated, while reducing the manufacturing cost of the electronic components.
此外，干擾源與輻射場型所指出的具有天線峰值增益最大值之處之間的最小距離X符合不等式X<
雖然本發明以前述之諸項實施例揭露如上，然其並非用以限定本發明，任何熟習相像技藝者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。 Although the present invention is disclosed as above by the aforementioned embodiments, they are not used to limit the present invention. Anyone familiar with similar techniques can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be subject to the scope of the patent application attached to this specification.
10:電子組件 10: Electronic components
100:電路板 100: Circuit board
200:干擾源 200: Interference source
300:屏蔽罩 300: Shielding cover
310:側周板 310: Side plate
311:第一外表面 311: First outer surface
312:第二外表面 312: Second outer surface
313:第三外表面 313: Third outer surface
314:第四外表面 314: Fourth outer surface
320:頂板 320: Top plate
321:開口 321: Open your mouth
323:頂面 323: Top
350:屏蔽夾 350: Shielding clip
400:近屏蔽墊 400: Near shielding pad
450:第一擴充電路板 450: First expansion circuit board
500:天線 500: Antenna
G:間隔 G: Interval
L:長度 L: Length
B:基準面 B: Datum surface
C:中心點 C: Center point
Claims (10)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111120429A TWI838757B (en) | 2022-06-01 | Electronic assembly | |
| CN202211280798.0A CN117154402A (en) | 2022-06-01 | 2022-10-19 | Electronic assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111120429A TWI838757B (en) | 2022-06-01 | Electronic assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202350061A TW202350061A (en) | 2023-12-16 |
| TWI838757B true TWI838757B (en) | 2024-04-11 |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200358202A1 (en) | 2017-11-24 | 2020-11-12 | Samsung Electronics Co., Ltd. | Electronic device including antenna |
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200358202A1 (en) | 2017-11-24 | 2020-11-12 | Samsung Electronics Co., Ltd. | Electronic device including antenna |
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