TWI836902B - Silicon wafer detection tools and silicon wafer detection methods - Google Patents

Abstract

The invention provides a silicon wafer detection tool and a silicon wafer detection method. The silicon wafer detection tool includes: a tray used to place the silicon wafer to be detected; a protective cover used to cooperate with the tray to form a chamber, and the protective cover is fastened The tray is provided with an injection hole and an exhaust hole on the protective cover; a syringe used for injecting and extracting the reaction solution into the chamber. The syringe includes a syringe barrel, a piston movably arranged in the syringe barrel, and a piston removably connected to the The injection head is at the end of the syringe barrel. The syringe barrel is located outside the chamber. The injection head is inserted into the chamber through the injection hole. The injection head includes a bottom surface parallel to the supporting surface of the tray and facing the supporting surface of the tray. The bottom surface There are multiple openings distributed.

Description

Silicon wafer detection tools and silicon wafer detection methods

The present invention relates to the field of semiconductor manufacturing technology, and more particularly to a silicon wafer testing tool and a silicon wafer testing method.

In large-scale integrated circuit manufacturing technology, as device size continues to shrink and semiconductor line widths become narrower, the cleanliness of silicon wafers has an increasingly greater impact on device yield, especially metal impurities in silicon wafers.

Ultra-trace metal contamination can cause different degrees of device failure and reduce the yield of the production line. Heavy metal contamination such as Cu and Ni can shorten the minority carrier life and increase the leakage current. The diffusion rate of these two metal elements is high and they can easily diffuse into the silicon wafer. It is far from enough to just control the Cu and Ni elements on the surface of the silicon wafer to be tested. The detection of Cu and Ni elements in the silicon wafer is crucial.

Polyultra trace profiling is a common method for testing the content of Cu and Ni in silicon wafers. The testing principle is as follows: using the different diffusion coefficients of Cu and Ni in single crystal and polycrystalline silicon, a polycrystalline silicon film is formed on the surface of the silicon wafer to be tested through heat treatment. The Cu, Ni and other elements in the silicon wafer diffuse into the polycrystalline silicon layer and gather in the polycrystalline silicon layer. The polycrystalline silicon layer of the silicon wafer is then etched, and the etching solution is collected for metal element detection.

In related technologies, the polycrystalline silicon layer of silicon wafers is mostly treated by manual testing, that is, a certain proportion of hydrofluoric acid and nitric acid is dripped on the surface to be tested of the silicon wafer, and the silicon wafer is shaken or rotated to evenly coat the etching liquid on the surface to be tested of the silicon wafer, and then the etched solution is collected into a container for testing. In the process of treating the surface to be tested of the silicon wafer, some simple devices are also used to fix or support the silicon wafer, and to assist in coating the etching liquid on the surface to be tested of the silicon wafer. In recent years, there has also been testing using a wafer surface preparation system (WSPS) equipment, which treats the silicon wafer and scans the surface for testing. However, the related technologies have the following disadvantages whether they are manual testing of the polycrystalline silicon layer of silicon wafers or device testing in related technologies: 1) A large area of silicon wafers is exposed to the outside, which is very easy to introduce pollution during the processing process, and the harmful gases generated by the silicon wafers during the processing process will directly enter the air, endangering the health of operators; 2) It is difficult to evenly distribute the etching liquid on the surface to be tested of the silicon wafer, which wastes a lot of etching liquid and requires high operation of personnel; 3) The types of silicon wafers applicable to equipment testing are relatively limited. When the surface to be tested of the silicon wafer is rough or the silicon wafer has a high doping content, the solution recovery will be incomplete or the collection will fail.

Embodiments of the present invention provide a silicon wafer detection tool and a silicon wafer detection method, which can reduce the pollution introduced by the silicon wafer during processing, reduce harm to operators, are easy to install and operate, and reduce material waste.

The technical solution provided by the embodiment of the present invention is as follows: In the first aspect, the embodiment of the present invention provides a silicon wafer detection tool, including: A tray for placing silicon wafers to be detected; A protective cover for forming a chamber with the tray, the protective cover is buckled onto the tray and has an injection hole and an exhaust hole; A syringe for injecting and extracting a reaction solution into the chamber, the syringe includes a syringe, a piston movably arranged in the syringe, and an injection head detachably connected to the end of the syringe, the syringe is located outside the chamber, the injection head is inserted into the chamber through the injection hole, the injection head includes a bottom surface parallel to the supporting surface of the tray and facing the supporting surface of the tray, and a plurality of openings are distributed on the bottom surface.

For example, the injection head includes: The first part is hollow inside and penetrates the injection hole; and The second part is hollow inside and communicates with the first part. The second part includes the bottom surface.

Exemplarily, the first part includes a vertical tube arranged perpendicular to the supporting surface of the tray; The second part includes at least one horizontal tube arranged parallel to the supporting surface of the tray, the horizontal tube is closed at two opposite ends in a direction parallel to the supporting surface of the tray, and the plurality of openings are evenly arranged along the axial direction of the horizontal tube.

Exemplarily, the first part can rotate around an axis perpendicular to the direction of the supporting surface of the tray to drive the second part to rotate, so that the solution in the syringe can evenly cover the silicon chip to be detected through the opening. the surface to be tested.

Exemplarily, the supporting surface of the tray is provided with an accommodating groove for accommodating the silicon wafer to be detected, the depth of the accommodating groove is greater than the thickness of the silicon wafer to be detected, and a through hole is provided at the bottom of the accommodating groove. The outer diameter of the through hole is smaller than the outer diameter of the silicon chip to be detected.

Exemplarily, the silicon wafer inspection tool to be inspected further includes: A driving element, which is connected to the syringe and is used to drive the syringe to rotate around the axis so that the first part can rotate around the axis.

Exemplarily, a control valve is provided between the injection head and the syringe barrel.

Exemplarily, the injection head is movable in the injection hole in a direction perpendicular to the supporting surface of the tray.

For example, the syringe barrel is provided with a scale.

In the second aspect, the embodiment of the present invention provides a silicon wafer inspection method, which uses the silicon wafer inspection tool as described above to inspect the silicon wafer; the silicon wafer inspection method includes the following steps: Placing the silicon wafer to be inspected in a chamber formed by the tray and the protective cover; Adding a reaction solution into the syringe of the syringe; Injecting the reaction solution into the chamber through the injection head so that the reaction solution is distributed on the surface to be inspected of the silicon wafer to be inspected, and the surface to be inspected of the silicon wafer is treated; Extracting the reaction solution in the chamber through the injection head to collect the etching reaction solution; Testing the collected reaction solution.

Exemplarily, in the silicon wafer detection method, The injection of the reaction solution into the chamber through the injection head specifically includes: Rotating the first part around an axis perpendicular to the supporting surface of the tray to drive the second part to rotate, so that the solution in the injection barrel is uniformly covered to the surface to be tested of the silicon wafer to be detected through the opening; Extracting the reaction solution in the chamber through the injection head specifically includes: Rotating the first part around an axis perpendicular to the supporting surface of the tray to drive the second part to rotate, so that the solution in the injection barrel is collected from the surface to be tested of the silicon wafer to be detected through the opening to the injection barrel.

Exemplarily, before injecting the reaction solution into the chamber through the injection head, the silicon chip detection method further includes: Move the injection head in a direction perpendicular to the supporting surface of the tray in a direction close to the tray, so that the injection head maintains a predetermined distance from the surface of the silicon wafer to be tested; After injecting the reaction solution into the chamber through the injection head and before extracting the reaction solution from the chamber through the injection head, the silicon chip detection method further includes: The injection head is moved in a direction perpendicular to the supporting surface of the tray toward a direction close to the tray, so that the injection head is in contact with the reaction solution liquid level on the surface of the silicon chip to be detected.

The beneficial effects brought by the embodiments of the present invention are as follows: In the above solution, the silicon wafer to be detected detection tool can include a tray, a protective cover and a syringe, wherein the tray and the protective cover can be buckled together to form a chamber, and the silicon wafer to be detected can be placed on the tray, and the syringe is used to inject the silicon wafer to be detected. The reaction solution is injected into the chamber, so that the processing of the silicon wafer can be completed in the chamber. Compared with the method of processing the silicon wafer in an open environment in related technologies, it can reduce the introduction of external contamination into the silicon wafer during the processing process. ; Moreover, the protective cover and the tray cooperate to form a chamber, and the protective cover is provided with an exhaust hole through which harmful gases generated during the processing of silicon wafers can be discharged in a directed manner to reduce harm to operators; Moreover, since a syringe is provided to inject and extract the reaction solution into the chamber, it is easy to apply the reaction solution to the surface of the silicon wafer to be measured and to collect the processed reaction solution. It is simple to install and operate, has low requirements on operators, and reduces material waste; In addition, this silicon wafer detection tool can be applied to different types of silicon wafers. Even when the surface of the silicon wafer to be tested is rough or the silicon wafer has a high doping content, the use of a syringe to extract the reaction solution can reduce the occurrence of incomplete solution recovery or collection failure. problem.

In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention.

In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be described clearly and completely in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those with ordinary knowledge in the field without making progressive improvements are within the scope of protection of the present invention.

In addition, it should be noted that in the embodiments of the present invention, the terms "first", "second", etc. are used to distinguish similar objects and are not used to describe a specific order or sequence. It is to be understood that the terms so used are interchangeable under appropriate circumstances so that embodiments of the invention can be practiced in sequences other than those illustrated or described herein, and "first" and "second" distinctions are generally intended to It is a category, and the number of objects is not limited. For example, the first object can be one or multiple.

Those with ordinary knowledge in the art will understand that, unless otherwise stated, the singular forms "one", "an", "said" and "the" used herein may also include plural forms. It should be further understood that the term "including" used in the specification of the present invention refers to the presence of the features, integers, steps, operations, elements and/or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and/or groups thereof. It should be understood that when we say that an element is "connected" or "coupled" to another element, it can be directly connected or coupled to the other element, or there may be intermediate elements. In addition, the "connection" or "coupling" used here may include wireless connection or wireless coupling. The term "and/or" used here includes all or any unit and all combinations of one or more associated listed items.

In the embodiments of the present invention, the term "and/or" describes the relationship between related objects, indicating that three relationships may exist. For example, A and/or B can represent: A exists alone, A and B exist at the same time, and B exists alone. The character "/" generally indicates that the related objects before and after are in an "or" relationship.

In the embodiment of the present invention, the term "multiple" refers to two or more than two, and other quantifiers are similar to it.

"Determining B based on A" in the present invention means that the factor A should be considered when determining B. It is not limited to "B can be determined based on A alone", but also includes: "B is determined based on A and C", "B is determined based on A, C and E", "C is determined based on A, and B is further determined based on C" wait. In addition, it can also include taking A as a condition for determining B, for example, "When A meets the first condition, use the first method to determine B"; another example, "When A meets the second condition, determine B", etc.; another example , "When A meets the third condition, determine B based on the first parameter" and so on. Of course, it can also be a condition that uses A as a factor to determine B, for example, "when A meets the first condition, use the first method to determine C, and further determine B based on C" and so on.

As shown in FIG. 1 , the silicon wafer testing tool provided by the embodiment of the present invention includes: a tray 100 , a protective cover 200 and a syringe 300 .

The tray 100 is used to place the silicon wafer 10 to be detected. The protective cover 200 is used to cooperate with the tray 100 to form a chamber A. The protective cover 200 is fastened to the tray 100 and has an opening on the protective cover 200. Injection hole 210 and exhaust hole (not shown in the figure).

The syringe 300 is used to inject and extract the reaction solution into the chamber A. The syringe 300 includes a syringe barrel 310, a piston 320 movably disposed in the syringe barrel 310, and a removably connected to the end of the syringe barrel 310. Injection head 330. The syringe barrel 310 is located outside the chamber A. The injection head 330 is inserted into the chamber A through the injection hole 210. The injection head 330 includes a supporting surface parallel to the tray 100 and facing towards The supporting surface of the tray 100 is provided with a bottom surface 332a, and a plurality of openings 332b are distributed on the bottom surface 332a.

In the above scheme, the tray 100 and the protective cover 200 can be buckled to form a chamber A, and the silicon wafer 10 to be tested can be placed on the tray 100, and the reaction solution is injected into the chamber A and extracted from the chamber A through the injector 300. In a specific implementation process, the detection process can be specifically: using polycrystalline silicon ultra-trace detection technology to realize the detection of metal in the silicon wafer, the reaction solution can be a mixture of hydrofluoric acid and nitric acid in a certain ratio. Obviously, in actual application, the reaction solution can be adaptively adjusted according to actual detection requirements.

Since the wafer processing can be completed in the chamber A during the testing process, compared with the method of processing the wafer in an open environment in the related art, the introduction of external pollution into the wafer during the processing can be reduced; and the protective cover 200 and the tray 100 cooperate to form the chamber A, and the protective cover 200 is provided with an exhaust hole, through which the harmful gas generated during the wafer processing can be directed to be discharged, so as to reduce the harm to the operator; and, due to the setting of the injection The injector 300 is used to inject and extract the reaction solution into the chamber A, so that the reaction solution can be easily applied to the surface to be tested of the silicon wafer and the reaction solution after treatment can be easily collected. The installation and operation are simple, the requirements for operators are low, and material waste is reduced. In addition, the silicon wafer inspection tool can be applied to different types of silicon wafers. Even when the surface to be tested of the silicon wafer is rough or the silicon wafer has a high amount of impurities, the syringe 300 is used to extract the reaction solution, which can reduce the problem of incomplete solution recovery or collection failure.

In some exemplary embodiments, as shown in FIGS. 1 to 3 , the injection head 330 includes: a first part 331 and a second part 332 , wherein both the first part 331 and the second part 332 are hollow inside, the The first part 331 is passed through the injection hole 210. The second part 332 is located in the chamber A and communicates with the first part 331. The second part 332 includes the bottom surface 332a, and the bottom surface 332a is distributed with Multiple openings 332b.

Using the above solution, the first part 331 plays the role of introducing the reaction solution in the syringe 310 into the inner cavity of the second part 332 in the chamber A. The second part 332 has a supporting surface with the tray 100 The parallel bottom surface 332a, that is, its bottom surface 332a is parallel to the surface of the silicon wafer to be measured. In this way, the reaction solution can be applied to the surface of the silicon wafer to be measured through a plurality of openings 332b distributed on the bottom surface 332a to improve the coating. Cloth uniformity.

In a specific embodiment, as shown in FIGS. 1 to 3 , the first part 331 includes a vertical pipe 3311 arranged perpendicularly to the supporting surface of the tray 100 ; the second part 332 includes a support parallel to the tray 100 At least one transverse tube 3321 is provided on the surface, the opposite ends of the transverse tube 3321 in the direction parallel to the supporting surface of the tray 100 are closed, and a plurality of the openings 332b are evenly arranged along the axis direction of the transverse tube 3321 , and the size of the transverse tube 3321 in its axial direction is greater than or equal to the outer diameter of the silicon chip 10 to be detected.

Adopting the above solution, the injection head 330 is implemented by cross-arranged horizontal tubes 3321 and vertical tubes 3311. A plurality of openings 332b are evenly arranged along the axis of the horizontal tube 3321, and when the silicon chip 10 to be detected is placed on the tray 100, the cross tube 3321 coincides with the orthographic projection of the silicon chip 10 to be detected on the supporting surface of the tray 100, and the size of the cross tube 3321 in the axial direction is greater than or equal to the silicon chip to be detected The outer diameter size of 10, that is to say, in the axial direction of the cross tube 3321, the orthographic projection of the silicon chip 10 to be detected on the supporting surface of the tray 100 should not exceed the axial direction of the cross tube 3321. In this way, the uniformity of coating the reaction solution on the surface of the silicon chip 10 to be tested can be improved.

It should be noted that, in the above scheme, the number of the transverse tubes 3321 is not limited, and can be one or more. When the number of the transverse tubes 3321 is more than one, the transverse tubes 3321 can be mutually crossed or arranged with their axes parallel to each other.

It should also be noted that in the above embodiment, the second part 332 uses a horizontal tube 3321, which has a simple structure and is easy to implement. In other unillustrated embodiments, the second part 332 is not limited to the form of a transverse tube 3321, and may also adopt any suitable structure such as a hollow internal plate. For example, the second part 332 may also be a disk. The orthographic projection of the silicon chip 10 to be detected on the supporting surface of the tray 100 can fall within the orthographic projection of the disc-shaped plate on the supporting surface of the tray 100. The circular The disc-shaped plate has a plurality of openings 332b evenly distributed on the bottom surface 332a facing the silicon chip 10 to be detected.

In addition, in order to further improve the coating uniformity of the reaction solution on the surface of the silicon chip 10 to be tested, in a specific embodiment, as shown in FIG. The axis of the direction can be rotated to drive the second part 332 to rotate, so that the solution in the syringe barrel 310 can evenly cover the surface to be tested of the silicon chip 10 to be tested through the opening 332b. In this way, since the second part 332 can rotate along the circumferential direction of the silicon chip 10 to be tested, the reaction solution can be more evenly coated on the surface of the silicon chip 10 to be tested during the rotation process.

It should be noted that in some embodiments, the rotation axis of the first part 331 and the syringe barrel 310 may be coaxial, and the syringe barrel 310 may be operated to rotate to drive the first part 331 to rotate. In a more specific embodiment, the syringe barrel 310 can be rotated manually, or an electric drive can be used to drive the syringe barrel 310 to rotate. During the rotation of the first part 331, its rotation speed is preferably uniform to improve the uniformity of the reaction solution coating.

In addition, in some exemplary embodiments, a receiving groove 110 for receiving the silicon wafer 10 to be tested is provided on the supporting surface of the tray 100, the depth of the receiving groove 110 is greater than the thickness of the silicon wafer 10 to be tested, and a through hole 120 is opened at the bottom of the receiving groove 110, and the inner diameter of the through hole 120 is smaller than the outer diameter of the silicon wafer 10 to be tested.

By adopting the above solution, the silicon wafer can be placed in the receiving groove 110, and the depth of the receiving groove 110 is greater than the thickness of the silicon wafer 10 to be tested. In this way, when the injector 300 injects a certain amount of reaction solution into the chamber A, it can ensure that the reaction solution fully reacts with the wafer to avoid loss of the reaction solution. Furthermore, a through hole 120 is provided at the bottom of the receiving groove 110. When the silicon wafer 10 to be tested is placed in the receiving groove 110, the center of the circle of the silicon wafer 10 to be tested can coincide with the center of the circle of the through hole 120, and the size of the through hole 120 is smaller than the outer diameter of the silicon wafer 10 to be tested. With such a configuration, on the one hand, the through hole 120 can reduce the contact between the reaction solution and the non-test surface (i.e., the back side of the silicon wafer) of the silicon wafer 10 to be tested, thereby ensuring that the reaction solution only contacts and reacts with the test surface of the silicon wafer 10 to be tested; on the other hand, the size of the through hole 120 is appropriately smaller than the size of the silicon wafer 10 to be tested, thereby preventing the silicon wafer 10 to be tested from falling off the through hole 120. It should be noted that the size difference between the through hole 120 and the silicon wafer 10 to be tested should be as small as possible to reduce the contact between the reaction solution and the back of the silicon wafer, which is more conducive to improving the accuracy of the test result.

In addition, in some embodiments, the silicon wafer inspection tool may further include a fixing member 400, which can apply a force to the silicon wafer 10 to be inspected, so that the silicon wafer 10 to be inspected abuts against the bottom of the receiving groove 110 and is tightly attached to the bottom of the receiving groove 110, thereby closing the through hole 120 through the silicon wafer 10 to be inspected. Exemplarily, the fixing member 400 may be a fixing ring, which is arranged around the outer peripheral side of the silicon wafer 10 to be inspected and exposes the surface to be inspected of the silicon wafer 10 to be inspected as much as possible.

In addition, illustratively, a control valve 340 is provided between the injection head 330 and the syringe 310, and the opening and closing of the injection head 330 can be controlled by the control valve 340. When the reaction solution needs to be injected or extracted, the control valve 340 can be opened.

In addition, for example, the injection head 330 is movable in the injection hole 210 in a direction perpendicular to the supporting surface of the tray 100 , that is to say, the injection head 330 can adjust its extension into the chamber A. depth, and the injection head 330 can freely rotate within the injection hole 210 .

Illustratively, the syringe 310 is provided with a scale 310a to facilitate quantitative injection and collection of the reaction solution.

In addition, it should be noted that the process of injecting and extracting the reaction solution from the syringe 300 into the chamber A can be completed manually. For example, a manual operating part 350 is provided on the syringe 300; it can also be driven by electric means. Automatic injection and extraction process. In a specific embodiment, the silicon wafer inspection tool may further include a processor that can control the injection and extraction actions of the syringe 300 and the rotation action of the syringe 300 to implement an automated inspection process.

In addition, the embodiment of the present invention also provides a silicon wafer detection method, which uses the silicon wafer detection tool provided by the embodiment of the present invention to detect the silicon wafer; the silicon wafer detection method includes: Step S01: Place the silicon chip 10 to be detected in the chamber A formed by the cooperation of the tray 100 and the protective cover 200; The tray 100 and the protective cover 200 are detachably connected, and in some embodiments, the silicon chip 10 to be detected can be placed in the receiving slot 110 of the tray 100 and can be passed through the fixing member 400 Press the silicon chip 10 to be detected to the bottom of the receiving groove 110 to close the through hole 120; Step S02: Add the reaction solution into the syringe barrel 310 of the syringe 300; Among them, in a specific embodiment, the detection process can be as follows: when using polycrystalline silicon ultra-trace detection technology to detect metals in silicon wafers, the reaction solution can be a mixture of hydrofluoric acid and nitric acid in a certain proportion, Obviously, in practical applications, the reaction solution can be adaptively adjusted according to actual detection needs.

Step S03, injecting the reaction solution into the chamber A through the injection head 330, so that the reaction solution is distributed on the surface to be tested of the silicon wafer 10 to be tested, and the surface to be tested of the silicon wafer is processed; Wherein, in this step, in a specific embodiment, the first part 331 can be rotated around the axis perpendicular to the supporting surface direction of the tray 100 to drive the second part 332 to rotate, so that the solution in the injection cylinder 310 is evenly covered to the surface to be tested of the silicon wafer 10 to be tested through the opening 332b; Step S04, extracting the reaction solution in the chamber A through the injection head 330 to collect the reaction solution after etching; In this step, in a specific embodiment, the first part 331 is rotated around an axis perpendicular to the supporting surface direction of the tray 100 to drive the second part 332 to rotate, so that the solution in the syringe 310 is collected from the surface to be tested of the silicon wafer 10 to be tested to the syringe 310 through the opening 332b.

Step S05: Test the collected reaction solution.

In this step, in a specific embodiment, the detection process can be specifically as follows: when the polycrystalline silicon ultra-trace detection technology is used to detect metals in silicon wafers, the collected reaction solution can be tested for metal elements. Of course, in actual applications, the reaction solution can be tested according to actual needs.

In addition, illustratively, before the above step S03, the silicon wafer detection method further includes: Moving the injection head 330 in a direction perpendicular to the supporting surface of the tray 100 toward the tray 100, so that the injection head 330 maintains a predetermined distance from the surface to be tested of the silicon wafer 10 to be tested; After the step S03 and before the step S04, the silicon wafer detection method further includes: Step S03', moving the injection head 330 in a direction perpendicular to the supporting surface of the tray 100 toward the tray 100, so that the injection head 330 contacts the liquid surface of the reaction solution on the surface to be tested of the silicon wafer 10 to be tested.

In the above step S03', when injecting the reaction solution into the chamber A, the depth of the syringe 300 extending into the chamber A can be adjusted so that the injection head 330 is at a certain distance from the surface of the silicon wafer 10 to be tested. During etching When collecting the reaction solution after completion, the depth of the syringe 300 extending into the chamber A can be adjusted so that the syringe 300 goes deeper into the chamber A so that the injection head 330 can contact the reaction solution level to fully collect the reaction solution.

It should be noted that during the process of collecting the reaction solution, the depth of the injection head 330 extending into the chamber A can be adjusted while collecting the reaction solution according to the liquid level position of the reaction solution.

The following points need to be explained: (1) The drawings of the embodiments of the present invention only involve the structures involved in the embodiments of the present invention, and other structures can refer to the general design; (2) For the sake of clarity, in the drawings used to describe the embodiments of the present invention, the thickness of the layer or region is enlarged or reduced, that is, these drawings are not drawn according to the actual scale. It can be understood that when an element such as a layer, film, region or substrate is said to be located "on" or "under" another element, the element can be "directly" located "on" or "under" another element or there can be an intermediate element; (3) In the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other to obtain new embodiments.

Obviously, a person skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the present invention's patent application and its equivalent technology, the present invention is also intended to include these modifications and variations.

10: Silicon wafer 100: Drag tray 110: Receiving tank 120: Receiving tank 200: Protective cover 210: Injection hole 300: Syringe 310: Syringe barrel 310a: Scale 320: Piston 330: Injection head 331: First part 3311: Vertical tube 332: Second part 332a: Bottom surface 332b: Opening 3321: Horizontal tube 340: Control valve 350: Manual operation part 400: Fixing part A: Chamber

FIG1 is a schematic diagram showing the overall structure of the silicon wafer detection tool provided in the embodiment of the present invention; FIG2 is a schematic diagram showing the structure of the cross tube in the silicon wafer detection tool provided in the embodiment of the present invention; FIG3 is a top view showing the combination of the injection head and the tray of the silicon wafer detection tool provided in the embodiment of the present invention.

10: Silicon wafer

100: Drag tray

110: Accommodation slot

120: Accommodation slot

200: Protective cover

210: injection hole

300: syringe

310:Syringe barrel

310a: Scale

320:piston

330:Injection head

331: Part 1

3311:Standpipe

332: Part 2

332a: Bottom surface

3321:Horizontal tube

340:Control valve

350:Manual operation part

400: Fixtures

A: Chamber

Claims (10)

A silicon wafer testing tool comprises: a tray for placing a silicon wafer to be tested; a protective cover for forming a chamber with the tray, the protective cover being buckled onto the tray and having an injection hole and an exhaust hole; a syringe for injecting and extracting a reaction solution into the chamber, the syringe comprising a syringe barrel, a piston movably arranged in the syringe barrel, and an injection head detachably connected to the end of the syringe barrel, The syringe is located outside the chamber, and the injection head is inserted into the chamber through the injection hole. The injection head includes a bottom surface that is parallel to the supporting surface of the tray and faces the supporting surface of the tray, and a plurality of openings are distributed on the bottom surface; when the reaction solution is injected into the chamber, the depth of the syringe extending into the chamber can be adjusted so that the injection head maintains a certain distance from the surface to be tested of the silicon wafer to be tested. The silicon chip inspection tool according to claim 1, wherein the injection head includes: a first part, the first part is hollow inside and penetrates the injection hole; and a second part, the second part is hollow inside and connected with the injection hole. The first parts communicate with each other and the second part includes the bottom surface. The silicon chip detection tool according to claim 2, wherein the first part includes a vertical pipe arranged perpendicularly to the supporting surface of the tray; and the second part includes at least one horizontal tube arranged parallel to the supporting surface of the tray. tube, the transverse tube is closed at opposite ends in a direction parallel to the supporting surface of the tray, and has a plurality of The openings are evenly arranged along the axial direction of the transverse tube, and the size of the transverse tube along the axial direction is greater than or equal to the outer diameter of the silicon chip to be detected. As described in claim 2, the first part can rotate around an axis perpendicular to the supporting surface of the tray to drive the second part to rotate, so that the solution in the syringe can be evenly covered on the surface to be tested of the silicon wafer to be tested through the opening. The silicon chip detection tool according to claim 4, wherein the supporting surface of the tray is provided with an accommodating groove for accommodating the silicon chip to be inspected, the depth of the accommodating groove is greater than the thickness of the silicon chip to be inspected, and A through hole is provided at the bottom of the receiving groove, and the inner diameter of the through hole is smaller than the outer diameter of the silicon chip to be detected. A silicon wafer inspection tool as described in claim 1, wherein a control valve is provided between the injection head and the injection barrel. A silicon wafer inspection tool as described in claim 1, wherein the injection head is movable in the injection hole in a direction perpendicular to the supporting surface of the tray. A silicon wafer testing method, using the silicon wafer testing tool as described in any one of claims 1 to 7 to test the silicon wafer; the silicon wafer testing method comprises the following steps: placing the silicon wafer to be tested in a chamber formed by the tray and the protective cover; adding a reaction solution into the syringe barrel of the syringe; injecting the reaction solution into the chamber through the injection head so that the reaction solution is distributed on the surface to be tested of the silicon wafer to be tested, and testing the silicon wafer; The surface to be tested is processed; Before the reaction solution is injected into the chamber through the injection head, the silicon wafer detection method further includes: moving the injection head in a direction perpendicular to the supporting surface of the tray toward the tray so that the injection head and the surface to be tested of the silicon wafer to be tested maintain a predetermined distance; extracting the reaction solution in the chamber through the injection head to collect the reaction solution after etching; and testing the collected reaction solution after etching. The silicon wafer inspection method as described in claim 8, wherein the method is applied to the silicon wafer inspection tool as described in claim 4, wherein the injection of the reaction solution into the chamber through the injection head specifically includes: rotating the first part of the injection head around an axis perpendicular to the supporting surface of the tray to drive the second part of the injection head to rotate, so that the solution in the injection barrel is uniformly covered to the surface to be tested of the silicon wafer to be tested through the opening; extracting the reaction solution in the chamber through the injection head specifically includes: rotating the first part of the injection head around an axis perpendicular to the supporting surface of the tray to drive the second part of the injection head to rotate, so that the solution in the injection barrel is collected from the surface to be tested of the silicon wafer to be tested to the injection barrel through the opening. The silicon wafer inspection method as described in claim 8, wherein the method is applied to the silicon wafer inspection tool as described in claim 7, wherein after the reaction solution is injected into the chamber by the injection head and before the reaction solution in the chamber is extracted by the injection head, the silicon wafer inspection method further comprises: moving the injection head in a direction perpendicular to the supporting surface of the tray toward the tray, so that the injection head contacts the liquid surface of the reaction solution on the surface to be inspected of the silicon wafer to be inspected.