TWI836095B - Chipless patterned conductor, method of forming a chipless patterned conductor and system for reading a patterned conductor - Google Patents
Chipless patterned conductor, method of forming a chipless patterned conductor and system for reading a patterned conductor Download PDFInfo
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Abstract
Description
本揭露係關於射頻識別(RFID)。 This disclosure relates to radio frequency identification (RFID).
射頻識別(RFID)標籤係一種類型的識別裝置。當由亦稱為詢問器的讀取裝置詢問時,RFID標籤反射或重傳輸射頻信號以將經編碼識別(ID)傳回至該詢問器。RFID標籤裝置可有二種基本類型。晶片化RFID標籤包括儲存資料的微晶片。無晶片RFID標籤不含微晶片,而係替代地依賴磁性材料或無電晶體薄膜電路以儲存資料。 A radio frequency identification (RFID) tag is a type of identification device. When interrogated by a reading device, also called an interrogator, an RFID tag reflects or retransmits a radio frequency signal to transmit an encoded identification (ID) back to the interrogator. There are two basic types of RFID tag devices. Chipped RFID tags include a microchip that stores data. Chipless RFID tags do not contain a microchip, but instead rely on magnetic materials or transistor-free thin-film circuits to store data.
本文描述之實施例涉及一種無晶片圖案化導體,其包含一或多個字符。各字符包含一碟及一環結構,該環結構包含環繞該碟的至少一個環。該碟與該至少一個環之間的一間距及該至少一個環的一寬度的一或多者經組態以判定該字符的一特性諧振頻率。將至少一個凹口設置在該碟及該環結構的至少一個環中之至少一者中。該至少一個凹口經組態使得該字符中之諧振的該量值取決於偏振方向。 Embodiments described herein relate to a chipless patterned conductor comprising one or more characters. Each character comprises a disk and a ring structure, the ring structure comprising at least one ring surrounding the disk. One or more of a spacing between the disk and the at least one ring and a width of the at least one ring are configured to determine a characteristic resonant frequency of the character. At least one notch is disposed in at least one of the disk and the at least one ring of the ring structure. The at least one notch is configured such that the magnitude of the resonance in the character depends on the polarization direction.
一種形成一無晶片圖案化導體的方法包含形成至少一個字符。該至少一個字符係藉由形成一碟及形成包含環繞該碟的至少一個環的一環結構 而形成。該碟與該至少一個環之間的一間距及該至少一個環的一寬度的一或多者經組態以判定該字符的一特性諧振頻率。將至少一個凹口形成在該碟及該環結構的至少一個環中之至少一者中。該至少一個凹口經組態使得該字符中之諧振的該量值取決於偏振方向。 A method of forming a chipless patterned conductor includes forming at least one character. The at least one character is formed by forming a disk and forming a ring structure including at least one ring surrounding the disk. One or more of a spacing between the disk and the at least one ring and a width of the at least one ring are configured to determine a characteristic resonant frequency of the character. At least one notch is formed in at least one of the disk and the at least one ring of the ring structure. The at least one notch is configured so that the magnitude of the resonance in the character depends on the polarization direction.
一種用於讀取一圖案化導體的系統包含一傳輸器,該傳輸器經組態以朝向該圖案化導體傳輸一電磁輻射信號,該圖案化導體包含一或多個字符。各字符包含一碟及一環結構,該環結構包含環繞該碟的至少一個環。該碟與該至少一個環之間的一間距及該至少一個環的一寬度的一或多者經組態以判定該字符的一特性諧振頻率。將至少一個凹口設置在該碟及該環結構的至少一個環中之至少一者中。該至少一個凹口經組態使得該字符中之諧振的該量值取決於偏振方向。各字符經組態以基於該特性諧振頻率及諧振的該量值反向散射該電磁輻射的至少一部分。一接收器經組態以接收一反向散射信號。一處理器經組態以使該反向散射信號與一數位簽章關聯。 A system for reading a patterned conductor includes a transmitter configured to transmit an electromagnetic radiation signal toward the patterned conductor, the patterned conductor containing one or more characters. Each character includes a disc and a ring structure including at least one ring surrounding the disc. One or more of a spacing between the disk and the at least one ring and a width of the at least one ring are configured to determine a characteristic resonant frequency of the character. At least one notch is provided in at least one of the dish and at least one ring of the ring structure. The at least one notch is configured such that the magnitude of the resonance in the character depends on the polarization direction. Each character is configured to backscatter at least a portion of the electromagnetic radiation based on the characteristic resonant frequency and the magnitude of the resonance. A receiver is configured to receive a backscattered signal. A processor is configured to associate the backscattered signal with a digital signature.
上文的發明內容未意圖描述各實施例或每一個實施方案。更完整的瞭解將藉由結合隨附圖式參考以下實施方式及申請專利範圍而變得清楚並理解。 The above invention content is not intended to describe each embodiment or every implementation scheme. A more complete understanding will become clear and understood by referring to the following implementation methods and application scope in conjunction with the accompanying drawings.
射頻識別(RFID)技術具有許多不同應用。無晶片RFID係施加電磁波以提取標籤中之編碼資料的無線資料擷取技術。無晶片RFID標籤具有置換條碼的潛力。無晶片RFID在增加編碼容量、簡化製造、及降低成本方面有增強效能的潛力。Radio frequency identification (RFID) technology has many different applications. Chipless RFID is a wireless data capture technology that applies electromagnetic waves to extract encoded data in tags. Chipless RFID tags have the potential to replace barcodes. Chipless RFID has the potential to enhance performance by increasing encoding capacity, simplifying manufacturing, and reducing costs.
根據本文描述之實施例,無晶片RFID的編碼效率可藉由使用藉由在單一導電字符中組合偏振敏感度與多個頻率編碼的混合編碼技術來改善。根據本文描述之實施例,此係在毫米波(mm波)範圍中完成,雖然該技術不限於此頻率範圍,且亦可使用較高或較低的頻率。此設計的一個動機係改善無晶片RFID標籤的編碼效率。通常,在RFID標籤設計程序中有不同的增加編碼容量的方法。一些實施例涉及多個簡單字符的整合,其中各字符可固持數個位元。增加各單一字符之容量藉由擴展增加全部標籤的容量。According to embodiments described herein, the encoding efficiency of chipless RFID can be improved by using hybrid encoding techniques that combine polarization sensitivity and multiple frequency encoding in a single conductive character. According to embodiments described herein, this is accomplished in the millimeter wave (mm-wave) range, although the technology is not limited to this frequency range and higher or lower frequencies may also be used. One motivation for this design is to improve the encoding efficiency of chipless RFID tags. Generally, there are different methods of increasing encoding capacity in RFID tag design programs. Some embodiments involve the aggregation of multiple simple characters, where each character can hold several bits. Increase the capacity of each single character by expanding the capacity of the entire label.
根據本文描述之實施例,可藉由在某些頻率下在反向散射信號中建立一些諧振而將資料編碼在頻帶內。本文描述之實施例係基於槽環諧振器的概念,其中所有的環均具有建立同心構形的共同中心。為作到此,具有各種直徑之槽環諧振器經設計以編碼不同的頻率簽章,其中各簽章代表一位元。由於偶次諧波及奇次諧波的目前路徑因為設計的對稱構形而消除,在反向散射信號中未觀察到諧波諧振。因此,可將完整頻帶用於編碼資料。為將偏振多樣性添加至經設計標籤中,將二個對稱矩形凹口建立在內圓碟中及/或該等環的一或多者中。根據本文描述之實施例,混合標籤可不具有接地平面,且因此該等場力線不集中至該基材中。According to embodiments described herein, data can be encoded within a frequency band by establishing some resonances in the backscattered signal at certain frequencies. The embodiments described herein are based on the concept of a slot ring resonator, where all rings have a common center establishing a concentric configuration. To do this, slot ring resonators with various diameters are designed to encode different frequency signatures, where each signature represents a bit. Since the current paths of even and odd harmonics are eliminated due to the symmetrical configuration of the design, no harmonic resonance is observed in the backscattered signal. Therefore, the entire frequency band can be used for encoding the material. To add polarization diversity to the designed label, two symmetrical rectangular notches are created in the inner disk and/or in one or more of the rings. According to embodiments described herein, hybrid tags may not have a ground plane, and therefore the field lines are not concentrated into the substrate.
根據本文描述之實施例,圖案化導體包含一或多個字符。字符係設置在介電質基材上的圖案化導電材料。根據一些實施例,基材的反向側具有連續導體(例如,「接地平面」)。圖1A繪示字符100之實例。字符100包括碟110,該碟具有環繞該碟的二個環120、122。根據本文描述之實施例,至少一個環及該至少一個環的寬度經組態以判定字符的特性諧振頻率。According to embodiments described herein, the patterned conductor includes one or more characters. Characters are patterned conductive materials disposed on a dielectric substrate. According to some embodiments, the opposite side of the substrate has a continuous conductor (eg, a "ground plane"). Figure 1A shows an example of a character 100. Character 100 includes a disk 110 with two rings 120, 122 surrounding the disk. According to embodiments described herein, at least one ring and a width of the at least one ring are configured to determine a characteristic resonant frequency of the character.
圖1B繪示根據本文描述的實施例之字符105的實例。圖1B的字符105包括具有二個凹口132、134的碟130。根據各種實施方案,凹口132、134經組態使得字符中之諧振的量值取決於偏振方向。 FIG. 1B illustrates an example of a character 105 according to embodiments described herein. The character 105 of FIG. 1B includes a disk 130 having two notches 132, 134. According to various embodiments, the notches 132, 134 are configured such that the magnitude of the resonance in the character depends on the polarization direction.
根據各種實施例,可印刷對偏振及頻率二者敏感的圖案化導體。混合(偏振及頻率)組態可增強編碼效率,且在mm波範圍中運作帶來更小字符大小的優點。根據本文描述之實施例,圖案化導體包含放置在信用卡大小(例如,85.60×53.98mm)標籤中的一或多個字符以增加總編碼效率。較大及較小大小的標籤二者亦係可實現的。在一些情形中,混合標籤不需要接地平面,其導致簡化及減少製造成本。本文描述之實施例可涉及可在沒有接地平面的情況下輻射的圖案化導體,因為該等環充當中央凹口碟的相對電極且波經引導在二個條之間或在凹口寬度內。 According to various embodiments, patterned conductors that are both polarization and frequency sensitive can be printed. Hybrid (polarization and frequency) configurations can enhance coding efficiency and bring the advantage of smaller character sizes when operating in the mm-wave range. According to embodiments described herein, patterned conductors include one or more characters placed in a credit card sized (e.g., 85.60×53.98 mm) label to increase overall coding efficiency. Both larger and smaller sized labels are also achievable. In some cases, hybrid labels do not require a ground plane, which results in simplification and reduced manufacturing costs. Embodiments described herein may involve patterned conductors that can radiate without a ground plane because the rings act as opposing electrodes to a central notch disk and the waves are guided between the two stripes or within the notch width.
根據本文描述之實施例,簡單字符包括由槽環環繞的凹口圓形補片。圖1C及圖1D顯示具有凹口碟及環繞該凹口碟之環二者的字符的實例。具體地而言,圖1C顯示具有頻率多樣性及偏振二者的字符150,其中頻率多樣性經定義為具有多個諧振頻率。 According to embodiments described herein, a simple character includes a notched circular patch surrounded by a grooved ring. Figures 1C and 1D show examples of characters having both a notched disk and a ring surrounding the notched disk. Specifically, Figure 1C shows a character 150 having both frequency diversity and polarization, where frequency diversity is defined as having multiple resonant frequencies.
字符150具有其具有二個凹口162、164的碟160。在此實例中,將凹口162、164設置在碟160的相對側上並定向成對應於X-偏振,但Y-偏振藉由如圖1D所示地將標籤旋轉90°而係可行的。二個環170、172環繞凹口碟160。圖1D繪示具有頻率多樣性及偏振多樣性二者的另一字符155。字符155具有其具有二個凹口182、184的碟180。凹口182、184經設置在碟180的相對側上。二個環190、192環繞凹口碟180。雖然顯示於圖1C及圖1D中的實例顯示具有二個凹口及二個環的碟,應瞭解可有更多或更少的凹口及更多或更少的環。 Character 150 has its disc 160 with two notches 162,164. In this example, the notches 162, 164 are provided on opposite sides of the dish 160 and oriented to correspond to X-polarization, but Y-polarization is possible by rotating the label 90° as shown in Figure 1D. Two rings 170, 172 surround the notched dish 160. Figure ID illustrates another character 155 with both frequency diversity and polarization diversity. Character 155 has its disc 180 with two notches 182,184. Notches 182, 184 are provided on opposite sides of the dish 180. Two rings 190, 192 surround the notched dish 180. Although the examples shown in Figures 1C and 1D show a dish with two notches and two rings, it should be understood that there may be more or fewer notches and more or fewer rings.
根據一些實施例,該碟係無凹口的及/或該等槽環的一或多者包括開口及/或凹口。圖2A繪示包括具有二個凹口212、214之碟210的字符200的實例。碟210由環220所環繞,該環具有完全通過環220的二個凹口222、224。在此實例中,碟210中的凹口212、214係在Y定向上且環220中的凹口222、224係在X-定向上。在一些組態中,碟210中之凹口的數目與環220中之凹口的數目可不同。圖2B顯示具有其具有在Y定向上的二個凹口242、244之碟240的字符230。碟240由環250所環繞,該環具有未完全通過環250的二個凹口252、254。圖2C繪示包括碟270之字符260的實例。碟270係由內環280及外環290所環繞。外環290具有完全通過外環290的二個凹口292、294。雖然圖2C的實例顯示外環中的凹口,應瞭解凹口可設置在內環280中或在內環280及外環290中。 According to some embodiments, the disk is not notched and/or one or more of the groove rings include openings and/or notches. FIG. 2A shows an example of a character 200 including a disk 210 having two notches 212, 214. The disk 210 is surrounded by a ring 220 having two notches 222, 224 that pass completely through the ring 220. In this example, the notches 212, 214 in the disk 210 are in the Y orientation and the notches 222, 224 in the ring 220 are in the X-orientation. In some configurations, the number of notches in the disk 210 may be different from the number of notches in the ring 220. FIG. 2B shows a character 230 having a disk 240 having two notches 242, 244 in the Y orientation. The disk 240 is surrounded by a ring 250 having two notches 252, 254 that do not completely pass through the ring 250. FIG. 2C shows an example of a character 260 including a disk 270. The disk 270 is surrounded by an inner ring 280 and an outer ring 290. The outer ring 290 has two notches 292, 294 that completely pass through the outer ring 290. Although the example of FIG. 2C shows the notches in the outer ring, it should be understood that the notches can be provided in the inner ring 280 or in both the inner ring 280 and the outer ring 290.
圖3A顯示根據本文描述的實施例之用於形成無晶片圖案化導體的程序。該程序包括形成碟之步驟302、形成環繞該碟的至少一個環之步驟304及將至少一個凹口形成在該碟及該環結構的至少一個環中之至少一者中之步驟306。該碟與該至少一個環之間的一間距及該至少一個環的一寬度的一或多者經組態以判定該字符的一特性諧振頻率。該至少一個凹口經組態使得該字符中之諧振的該量值取決於偏振方向。 FIG. 3A shows a process for forming a chipless patterned conductor according to an embodiment described herein. The process includes a step 302 of forming a disk, a step 304 of forming at least one ring around the disk, and a step 306 of forming at least one notch in at least one of the disk and at least one ring of the ring structure. One or more of a spacing between the disk and the at least one ring and a width of the at least one ring are configured to determine a characteristic resonant frequency of the character. The at least one notch is configured so that the magnitude of the resonance in the character depends on the polarization direction.
圖案化導體可經組態以在包括C頻帶(4至8GHz)、X頻帶(8至12GHz)、Ku、K、及Ka(12至40GHz)、Q頻帶(33-50)、V頻帶(50至75GHz)、及/或W頻帶(75至110GHz)的任何頻帶中操作。雖然此處包括具體的頻率範圍,應瞭解頻率範圍可大於110GHz及/或低於4GHz。 The patterned conductors may be configured to operate in any frequency band including C-band (4 to 8 GHz), X-band (8 to 12 GHz), Ku, K, and Ka (12 to 40 GHz), Q-band (33-50), V-band (50 to 75 GHz), and/or W-band (75 to 110 GHz). While specific frequency ranges are included herein, it is understood that the frequency range may be greater than 110 GHz and/or less than 4 GHz.
根據本文描述之實施例,將至少一個字符形成在基材上,且將該至少一個字符與該基材轉移至物體(例如,箱)。例如,基材可係可轉移至物體的膠黏劑。根據各種實施方案,將字符直接形成在物體上。例如,字符可形成在包裝、紙杯、托板、及/或衣物物品上。至少一個字符可藉由由導電材料印刷該至少一個字符來形成。例如,字符可由包含銀及銅的一或多者的印刷墨水製造。在一些情形中,印刷墨水可包括鎳、碳、碳奈米管、及銀奈米線的一或多者。根據各種組態,進行印刷後退火程序。根據各種實施例,字符係藉由在介電質基材上蝕刻金屬來製造。例如,字符可藉由蝕刻銅及鋁的一或多者來製造。例如,字符可藉由蝕刻透明導體(諸如氧化銦錫)來製造。例如,在一些實施方案中,字符係以使用銅、鋁、金、及/或銀的一或多者的導電帶的熱轉移程序製造。根據一些實施例,字符係通過氣相沉積來製造。例如,字符可使用濺鍍及/或熱蒸鍍程序來製造。在此等程序的任何者中,將導體圖案化於其上的基材可係高效能介電質(諸如Taconic TLX- 8)、低成本聚合物(諸如麥拉(mylar)、聚對苯二甲酸乙二酯(PET)、及/或聚萘二甲酸乙二酯(PEN))、及/或另一基材材料(諸如聚醯亞胺、玻璃、或紙)、及/或上述使用導電膜預塗佈於反向側上的任何者。According to embodiments described herein, at least one character is formed on a substrate, and the at least one character and the substrate are transferred to an object (eg, a box). For example, the substrate can be an adhesive that is transferable to the object. According to various embodiments, the characters are formed directly on the object. For example, characters may be formed on packaging, paper cups, pallets, and/or items of clothing. At least one character may be formed by printing the at least one character with a conductive material. For example, characters can be made from printing inks that include one or more of silver and copper. In some cases, the printing ink may include one or more of nickel, carbon, carbon nanotubes, and silver nanowires. Post-printing annealing procedures are performed according to various configurations. According to various embodiments, characters are produced by etching metal on a dielectric substrate. For example, characters can be produced by etching one or more of copper and aluminum. For example, characters can be made by etching transparent conductors such as indium tin oxide. For example, in some embodiments, characters are manufactured with a thermal transfer process using conductive tapes of one or more of copper, aluminum, gold, and/or silver. According to some embodiments, the characters are produced by vapor deposition. For example, characters can be produced using sputtering and/or thermal evaporation processes. In any of these procedures, the substrate on which the conductors are patterned can be a high-performance dielectric (such as Taconic TLX-8), a low-cost polymer (such as mylar, polyterephthalate), Ethylene formate (PET), and/or polyethylene naphthalate (PEN)), and/or another substrate material (such as polyimide, glass, or paper), and/or the above-mentioned use of conductive The film is pre-coated on either side of the opposite side.
雖然本文描述可用以形成圖案化導體的各種技術,應瞭解任何技術可單獨使用或與任何其他程序組合使用。Although various techniques that may be used to form patterned conductors are described herein, it should be understood that any technique may be used alone or in combination with any other procedure.
在一些組態中,該至少一個字符係由導電箔形成,並將至少一個字符310轉移至基材320,如圖3B所示。根據各種實施方案,基材325具有第一側327及相對第二側329。設置在基材325之第二側329上的導電層330,並將字符315轉移至基材325的第一側327,如圖3C所示。根據各種組態,導電層係接地平面。In some configurations, the at least one character is formed of a conductive foil and the at least one character 310 is transferred to a substrate 320, as shown in FIG3B. According to various embodiments, a substrate 325 has a first side 327 and an opposing second side 329. A conductive layer 330 is disposed on the second side 329 of the substrate 325 and transfers the character 315 to the first side 327 of the substrate 325, as shown in FIG3C. According to various configurations, the conductive layer is a ground plane.
圖3D繪示根據本文描述的實施例之具有多於一個字符的實施例。圖3D顯示具有第一側364及相對第二側366的基材層362。第一字符352設置在基材層362的第一側364上,且第二字符372設置在基材層362的第二側366上。圖3E顯示具有多於一個字符的另一實例。第一字符380設置在第一基材層382的第一側392上。導電層384設置在第一基材層392的第二側392與第二基材層386的第一側394之間。第二字符388設置在第二基材層386的第二側396上。Figure 3D illustrates an embodiment with more than one character in accordance with embodiments described herein. Figure 3D shows substrate layer 362 having a first side 364 and an opposing second side 366. The first character 352 is disposed on the first side 364 of the base material layer 362 , and the second character 372 is disposed on the second side 366 of the base material layer 362 . Figure 3E shows another example with more than one character. The first character 380 is disposed on the first side 392 of the first substrate layer 382. The conductive layer 384 is disposed between the second side 392 of the first base material layer 392 and the first side 394 of the second base material layer 386. The second character 388 is disposed on the second side 396 of the second substrate layer 386.
圖4A及圖4B顯示根據本文描述的實施例之混合字符的更詳細視圖。字符400具有在約1.5 mm至約2.5 mm之範圍中的半徑R。根據各種實施方案,R係約1.5 mm。在一些情形中,R小於1.5 mm或大於2.5 mm。4A and 4B show more detailed views of hybrid characters according to embodiments described herein. Character 400 has a radius R in the range of about 1.5 mm to about 2.5 mm. According to various embodiments, R is about 1.5 mm. In some cases, R is less than 1.5 mm or greater than 2.5 mm.
碟420具有在約0.4 mm至約0.8 mm之範圍中的半徑RD 。根據各種實施方案,RD 係約0.45 mm。在此實例中,碟具有第一凹口422及第二凹口424。第一凹口422具有長度L1 及寬度WN1 。第二凹口424具有長度L2 及寬度WN2 。根據本文描述之實施例,WN1 實質上等於WN2 及/或L1 實質上等於L2 。在一些情形中,L1 係與L2 不同的值及/或WN1 係與WN2 不同的值。根據本文描述之實施例,L1 及L2 係在約0.4 mm至約0.795 mm的範圍中。根據各種實施方案,L1 及/或L2 係約0.405 mm。根據本文描述之實施例,WN1 及WN2 係在約0.1 mm至約0.6 mm的範圍中。根據各種實施方案,WN1 及/或WN2 係約0.05 mm。Disc 420 has a radius RD in the range of about 0.4 mm to about 0.8 mm. According to various embodiments, R D is about 0.45 mm. In this example, the dish has a first notch 422 and a second notch 424 . The first notch 422 has a length L 1 and a width W N1 . The second notch 424 has a length L 2 and a width WN2 . According to embodiments described herein, WN1 is substantially equal to WN2 and/or L1 is substantially equal to L2 . In some cases, L1 is a different value than L2 and/or WN1 is a different value than WN2 . According to embodiments described herein, L 1 and L 2 are in the range of about 0.4 mm to about 0.795 mm. According to various embodiments, L 1 and/or L 2 is about 0.405 mm. According to embodiments described herein, WN1 and WN2 are in the range of about 0.1 mm to about 0.6 mm. According to various embodiments, WN1 and/or WN2 is about 0.05 mm.
第一環430及第二環432環繞碟420。第一環430具有在約0.05 mm至約0.1 mm之範圍中的寬度WR1 。根據各種實施方案,WR1 係約0.105。第二環432具有在約0.04 mm至約0.08 mm之範圍中的寬度WR2 。根據各種實施方案,WR2 係約0.0495。在一些情形中,WR1 實質上等於WR2 。第一間隙具有在約0.025 mm至約0.05 mm之範圍中的寬度WG1 。第二間隙具有在約0.018 mm至約0.03 mm之範圍中的寬度WG2 。根據各種實施方案,WG1 係約0.025 mm及/或WG2 係約0.018 mm。在一些情形中,WG1 實質上等於WG2 。A first ring 430 and a second ring 432 surround the disk 420. The first ring 430 has a width W R1 in the range of about 0.05 mm to about 0.1 mm. According to various embodiments, W R1 is about 0.105. The second ring 432 has a width W R2 in the range of about 0.04 mm to about 0.08 mm. According to various embodiments, W R2 is about 0.0495. In some cases, W R1 is substantially equal to W R2 . The first gap has a width W G1 in the range of about 0.025 mm to about 0.05 mm. The second gap has a width W G2 in the range of about 0.018 mm to about 0.03 mm. According to various embodiments, W G1 is about 0.025 mm and/or W G2 is about 0.018 mm. In some cases, W G1 is substantially equal to W G2 .
根據本文描述之實施例,字符之尺寸中之至少一者係根據最佳化程序選擇。例如,可將尺寸選擇成具有在特定頻率下的諧振。此可藉由使用方程式(1)判定該碟之近似半徑的一或多者而達成,其中該等凹口的寬度及/或該等環的寬度係通過最佳化程序判定。(1) 此處,c係光在自由空間中的速度,係設計諧振頻率,且係用於設計之基材的介電常數。According to embodiments described herein, at least one of the dimensions of the character is selected according to an optimization procedure. For example, the dimensions may be selected to have resonance at a particular frequency. This may be achieved by determining one or more of the approximate radii of the disk using equation (1), wherein the width of the notches and/or the width of the rings are determined by the optimization procedure. (1) Here, c is the speed of light in free space, is the designed resonant frequency, and The dielectric constant of the substrate used for the design.
該字符之後使用該估計尺寸設計。模擬係使用市售電磁模擬工具執行,並監測設計的頻率行為。然後調諧尺寸以獲得在所欲頻率的諧振。The character is then designed using this estimated size. Simulations are performed using commercially available electromagnetic simulation tools and the frequency behavior of the design is monitored. The dimensions are then tuned to obtain resonance at the desired frequency.
圖5顯示根據本文描述的實施例之用於混合無晶片圖案化導體的模擬設定500。線性偏振平面波520係用於激發圖案化導體510。為監測反向散射電場,遠場一或多個探針可位於距圖案化導體510一指定距離處。例如,探針可位於距圖案化導體510約10 cm處。標籤經設置在基材530上。例如,標籤可設置在具有約2.55之介電率及約0.0017之損失的5密耳Taconic TLX- 8基材上。可運行最佳化程序以最佳化環及凹口碟的大小以具有在所欲頻率下的諧振。FIG5 shows a simulation setup 500 for a hybrid chipless patterned conductor according to an embodiment described herein. A linearly polarized plane wave 520 is used to excite the patterned conductor 510. To monitor the backscattered electric field, a remote field one or more probes may be located at a specified distance from the patterned conductor 510. For example, the probes may be located approximately 10 cm from the patterned conductor 510. The tags are disposed on a substrate 530. For example, the tags may be disposed on a 5 mil Taconic TLX-8 substrate having a dielectric constant of approximately 2.55 and a loss of approximately 0.0017. An optimization procedure may be run to optimize the size of the ring and notch disk to have resonance at a desired frequency.
當平面波撞擊顯示於圖1A中之環時,如圖6所描繪的,在環諧振器的諧振頻率觀察到具有隨後之深凹口之峰的頻率選擇行為,其中觀察到二個深凹口610、620。第一諧振610發生在與較大環122相關的約57 GHz。第二諧振620歸因於較小環120而發生在約64 GHz。內圓形碟110落在所欲頻帶外側,因此彼等二個諧振僅導因於該等環。When a plane wave strikes the ring shown in Figure 1A, as depicted in Figure 6, frequency selective behavior is observed with a peak of subsequent deep notches at the resonant frequency of the ring resonator, where two deep notches 610 are observed ,620. The first resonance 610 occurs at approximately 57 GHz associated with the larger ring 122 . The second resonance 620 occurs at approximately 64 GHz due to the smaller ring 120 . The inner circular dish 110 lies outside the desired frequency band, so their two resonances are due only to the rings.
圖1A所示之組態在約57 GHz下的表面電流分布繪示於圖7A中。圖7B繪示在圖1A所示之組態的約64 GHz下的表面電流分布。圖7A及圖7B顯示相鄰槽的耦合與諧振之間的關係。可觀察到相鄰槽的電流密度向量係相反的並產生磁諧振。該等槽的寬度影響耦合強度及諧振頻率。較小的槽寬度使諧振頻率向下移位,而較大的槽寬度導致諧振向上移位。The surface current distribution at approximately 57 GHz for the configuration shown in Figure 1A is plotted in Figure 7A. Figure 7B shows the surface current distribution at approximately 64 GHz for the configuration shown in Figure 1A. Figures 7A and 7B show the relationship between coupling and resonance of adjacent slots. It can be observed that the current density vectors of adjacent slots are opposite and produce magnetic resonance. The width of the slots affects the coupling strength and resonant frequency. Smaller slot widths shift the resonant frequency downward, while larger slot widths cause the resonance to shift upward.
圖8顯示圖1B的圖案化導體針對如圖1C中水平定向810的凹口及如圖1D中旋轉90°並垂直定向820的凹口由X偏振平面激發之反向散射電場的模擬結果。圖1B所示之組態在約60 GHz下的表面電流分布顯示在圖9中。Figure 8 shows the simulation results of the backscattered electric field excited by the X-polarization plane for the patterned conductor of Figure 1B for a notch oriented horizontally 810 as shown in Figure 1C and a notch rotated 90° and vertically oriented 820 as shown in Figure 1D. The surface current distribution at approximately 60 GHz for the configuration shown in Figure 1B is shown in Figure 9.
圖10顯示具有垂直1010於如圖1C中之入射電場之方向(90°旋轉)之凹口的字符的圖案化導體及具有經定向在與如圖1D中之入射電場相同之方向1020(180°旋轉)上之凹口的字符的圖案化導體的反向散射電場的模擬結果。在凹口經定向垂直於入射電場的情形1010中,在監測頻帶中觀察到三個諧振1012、1014、1016。在57 GHz的諧振1012及在64 GHz的諧振1016係導因於環,而在60 GHz觀察到的諧振1014係凹口碟的效果。在凹口經定向在與入射電場相同之方向上的情形1020中,僅觀察到導因於該等環的諧振1022、1026。Figure 10 shows a patterned conductor with characters with notches perpendicular 1010 to the direction of the incident electric field as in Figure 1C (90° rotation) and having characters oriented in the same direction 1020 as the incident electric field as in Figure 1D (180° Simulation results of the backscattered electric field of a patterned conductor on a notched character. In the case 1010 where the notches are oriented perpendicular to the incident electric field, three resonances 1012, 1014, 1016 are observed in the monitoring frequency band. The resonance 1012 at 57 GHz and the resonance 1016 at 64 GHz are due to the ring, while the resonance 1014 observed at 60 GHz is the effect of the notched disk. In the case 1020 where the notch is oriented in the same direction as the incident electric field, only the resonances 1022, 1026 due to the rings are observed.
二元資料可藉由諧振的存在與否編碼。例如,可將凹口的移除及/或環的移除表示為邏輯「0」,其中凹口的出現表示為邏輯「1」。此僅係可如何將邏輯編碼在圖案化導體中的一個實例。此處,顯示圖案化導體的各字符可代表用於三個諧振之各者的3個位元。可使用頻率及偏振多樣性二者對各字符編碼之組合的數目等於8。在信用卡大小無晶片標籤中,考慮各字符之間的足夠分隔,字符的最小數目係40個字符。因此,標籤具有儲存120個位元之資料的能力。Binary data can be encoded by the presence or absence of a resonance. For example, the removal of a notch and/or the removal of a ring can be represented as a logical "0", where the presence of a notch represents a logical "1". This is just one example of how logic can be encoded in a patterned conductor. Here, each character of the patterned conductor is shown to represent 3 bits for each of the three resonances. The number of combinations that can be used to encode each character using both frequency and polarization diversity is equal to 8. In a credit card sized chipless tag, the minimum number of characters is 40 characters, allowing for adequate separation between each character. Therefore, the tag has the ability to store 120 bits of data.
圖11A至圖11C顯示在圖1C所示之混合組態之諧振頻率下的表面電流分布,其中該等凹口經定向成垂直於入射電場。具體地而言,圖11A繪示在約57 GHz的表面電流分布,圖11B繪示在約60 GHz的表面電流分布,且圖11C繪示在約64 GHz的表面電流分布。Figures 11A-11C show the surface current distribution at the resonant frequency of the hybrid configuration shown in Figure 1C, in which the notches are oriented perpendicular to the incident electric field. Specifically, FIG. 11A shows the surface current distribution at about 57 GHz, FIG. 11B shows the surface current distribution at about 60 GHz, and FIG. 11C shows the surface current distribution at about 64 GHz.
根據本文所描述之實施例,無晶片RFID標籤包含圖案化導體的陣列。圖12繪示圖案化導體之實例陣列。圖案化導體之陣列可具有各種環大小、環間隔、及/或凹口定向的一或多個字符。According to embodiments described herein, a chipless RFID tag includes an array of patterned conductors. Figure 12 illustrates an example array of patterned conductors. The array of patterned conductors may have one or more characters of various ring sizes, ring spacing, and/or notch orientations.
圖13顯示經組態以讀取一或多個圖案化導體的無晶片RFID系統1300。傳輸器經組態以將電磁輻射信號朝向圖案化導體傳輸。該系統包括經組態以接收反向散射信號的接收器。耦接至該接收器的處理器經組態以使用儲存在儲存裝置1340中的資訊使該反向散射信號與數位簽章關聯。RFID系統1300可包括用於經由網路與其他裝置通訊的一或多個網路介面1350。系統可包括使使用者能夠與系統1300互動的其他輸入/輸出裝置1360(例如,顯示器、鍵盤、滑鼠、揚聲器、按鈕等)。圖13係用於說明目的之RFID系統之可能組件的高階表示。應瞭解圖13所示之RFID系統可含有其他組件。Figure 13 shows a chipless RFID system 1300 configured to read one or more patterned conductors. The transmitter is configured to transmit the electromagnetic radiation signal toward the patterned conductor. The system includes a receiver configured to receive backscattered signals. A processor coupled to the receiver is configured to correlate the backscattered signal with the digital signature using information stored in storage device 1340 . RFID system 1300 may include one or more network interfaces 1350 for communicating with other devices over a network. The system may include other input/output devices 1360 that enable users to interact with the system 1300 (eg, monitors, keyboards, mice, speakers, buttons, etc.). Figure 13 is a high-level representation of possible components of an RFID system for illustrative purposes. It should be understood that the RFID system shown in Figure 13 may contain other components.
除非另有指明,本說明書及申請專利範圍中用以表達特徵之尺寸、數量、及物理性質的所有數字應理解為在所有情況下皆以用語「約(about)」修飾之。因此,除非另有相反指示,否則在前述說明書以及隨附申請專利範圍中所提出的數值參數取決於所屬技術領域中具有通常知識者運用本文所揭示之教示所獲得的所欲特性而有所不同。藉由端點使用數值範圍包括在該範圍內的所有數字(例如1至5包括1、1.5、2、2.75、3、3.80、4、及5)以及該範圍內的任何範圍。Unless otherwise specified, all numbers used to express dimensions, quantities, and physical properties of features in this specification and the patent claims shall be understood to be modified in all cases by the word "about." Accordingly, unless otherwise indicated to the contrary, the numerical parameters set forth in the foregoing specification and accompanying patent claims will vary depending on the desired characteristics obtained by one of ordinary skill in the art using the teachings disclosed herein. . The use of numerical ranges by endpoints includes all numbers within that range (for example, 1 to 5 includes 1, 1.5, 2, 2.75, 3, 3.80, 4, and 5) as well as any range within that range.
上述各種實施例可使用互動以提供具體結果的電路系統及/或軟體模組實施。在計算技術領域中具有通常知識者可輕易地使用所屬技術領域中通常已知的知識實施此類描述的功能,無論係以模組層級或作為整體。例如,繪示於本文中的流程圖可用以建立用於由處理器執行的電腦可讀取指令/碼。此類指令可儲存在電腦可讀媒體上,並轉移至處理器以用於執行,如所屬技術領域中已知者。The various embodiments described above may be implemented using circuitry and/or software modules that interact to provide specific results. One of ordinary skill in the art of computing can readily implement the functions described, whether at the module level or as a whole, using what is generally known in the art. For example, the flowcharts illustrated herein may be used to create computer readable instructions/code for execution by a processor. Such instructions may be stored on a computer-readable medium and transferred to the processor for execution, as is known in the art.
實例實施例的前述說明已為說明及描述的目的提供。其未意圖窮舉或將發明概念限制在所揭示的精確形式。鑑於上述教示,許多修改及變化係可行的。所揭示之實施例的任何或所有特徵可個別或以任何組合施加,未企圖係限制性的而係純說明性的。意圖使範圍由本文所附的申請專利範圍而非以實施方式限制。The foregoing descriptions of example embodiments have been presented for the purposes of illustration and description. It is not intended to be exhaustive or to limit inventive concepts to the precise forms disclosed. Many modifications and variations are possible in light of the above teachings. Any or all features of the disclosed embodiments may be taken individually or in any combination and are not intended to be limiting and are purely illustrative. It is intended that the scope be limited by the claims appended hereto and not by the implementation.
100:字符100: characters
105:字符105:Character
110:碟110: Disc
120:環120: Ring
122:環122: Ring
130:碟130:Disc
132:凹口132: Notch
134:凹口134: Notch
150:字符150: characters
155:字符155: Characters
160:碟160:disc
162:凹口162: Notch
164:凹口164: Notch
170:環170: Ring
172:環172: Ring
180:碟180:disc
182:凹口182: Notch
184:凹口184: Notch
190:環190: Ring
192:環192: Ring
200:字符200:Character
210:碟210:Disc
212:凹口212: Notch
214:凹口214: Notch
220:環220: Ring
222:凹口222: Notch
224:凹口224: Notch
230:字符 230:Character
240:碟 240: disc
242:凹口 242: Notch
244:凹口 244: Notch
250:環 250: Ring
252:凹口 252: Notch
254:凹口 254:Notch
260:字符 260: characters
270:碟 270: Disc
280:內環 280:Inner ring
290:外環 290: Outer Ring
292:凹口 292: Notch
294:凹口 294: Notch
302:步驟 302: Steps
304:步驟 304: Steps
306:步驟 306: Steps
310:字符 310: Characters
315:字符 315:Character
320:基材 320:Substrate
325:基材 325: Base material
327:第一側 327: First side
329:第二側 329: Second side
330:導電層330: Conductive layer
352:第一字符352: first character
362:基材層362: base material layer
364:第一側364: First side
366:第二側366: Second side
372:第二字符372: Second character
380:第一字符380: First character
382:第一基材層382: First base material layer
384:導電層384:Conductive layer
386:第二基材層386: Second substrate layer
388:第二字符388: Second character
392:第一側/第一基材層/第二側392: first side/first base material layer/second side
394:第一側394: First side
396:第二側396: Second side
400:字符400: Characters
420:碟420:Disc
422:第一凹口422: first notch
424:第二凹口424: Second notch
430:第一環430: First Ring
432:第二環432: Second Ring
500:模擬設定500: Simulation setting
510:圖案化導體510:Patterned Conductor
520:線性偏振平面波520:Linearly polarized plane wave
530:基材530: Base material
610:凹口/第一諧振610: Notch/First Resonance
620:凹口/第二諧振620: Notch/Second Resonance
810:水平定向810: Horizontal orientation
820:垂直定向820: Vertical orientation
1010:垂直1010: Vertical
1012:諧振1012: Resonance
1014:諧振1014: Resonance
1016:諧振1016: Resonance
1020:相同方向1020:Same direction
1022:諧振1022: Resonance
1026:諧振1026: Resonance
1300:無晶片RFID系統/系統1300: Chipless RFID System/System
1340:儲存裝置1340:Storage device
1350:網路介面1350:Network interface
1360:輸入/輸出裝置1360: Input/output device
L1:長度L 1 : Length
L2:長度L 2 : Length
R:半徑R: Radius
RD:半徑R D :radius
WG1:寬度W G1 : Width
WG2:寬度W G2 : Width
WN1:寬度W N1 : Width
WN2:寬度W N2 : Width
WR1:寬度W R1 : Width
WR2:寬度W R2 : Width
〔圖1A〕及〔圖1B〕繪示根據本文描述之實施例的實例字符; [圖1C]及[圖1D]顯示根據本文描述的實施例之具有凹口碟及環繞該凹口碟之環二者的混合字符的實例; [圖2A]至[圖2C]繪示根據本文描述的實施例之在其中該等環的一或多者具有至少一個凹口之字符的實例; [圖3A]顯示根據本文描述的實施例之用於形成無晶片圖案化導體的程序; [圖3B]及[圖3C]繪示根據本文描述的實施例之設置在基材上之字符的實例; [圖3D]及[圖3E]繪示根據本文描述的實施例之具有多於一個字符的實施例; [圖4A]及[圖4B]顯示根據本文描述的實施例之混合字符的更詳細視圖; [圖5]顯示根據本文描述的實施例之用於混合無晶片圖案化導體的模擬設定; [圖6]繪示根據本文描述的實施例在環諧振器之諧振頻率下觀察到的深凹口; [圖7A]根據本文描述的實施例顯示圖1A所示之組態在約57 GHz下的表面電流分布; [圖7B]根據本文描述的實施例繪示圖1A所示之組態在約64 GHz下的表面電流分布; [圖8]根據本文描述的實施例顯示圖1B的圖案化導體針對如圖1C中水平定向的凹口及如圖1D中旋轉90°並垂直定向的凹口由X偏振平面激發之反向散射電場的模擬結果; [圖9]根據本文描述的實施例繪示圖1B所示之組態在約60 GHz下的表面電流分布; [圖10]根據本文描述的實施例顯示如圖1C中之具有垂直於入射電場之方向(90°旋轉)之凹口的圖案化導體及如圖1D中之具有定向在與入射電場相同之方向(180°旋轉)之凹口的圖案化導體之反向散射電場的模擬結果; [圖11A]繪示根據本文描述的實施例之混合字符在約57 GHz下的表面電流分布; [圖11B]繪示根據本文描述的實施例之混合字符在約60 GHz下的表面電流分布; [圖11C]繪示根據本文描述的實施例之混合字符在約64 GHz下的表面電流分布; [圖12]繪示根據本文描述的實施例之字符的實例陣列。 [圖13]顯示能夠實施本文描述之實施例的RFID系統的方塊圖。[FIG. 1A] and [FIG. 1B] show example characters according to embodiments described herein; [FIG. 1C] and [FIG. 1D] show examples of hybrid characters having both a notched disk and a ring surrounding the notched disk according to embodiments described herein; [FIG. 2A] to [FIG. 2C] show examples of characters according to embodiments described herein in which one or more of the rings has at least one notch; [FIG. 3A] shows a process for forming a chipless patterned conductor according to embodiments described herein; [FIG. 3B] and [FIG. 3C] show examples of characters according to embodiments described herein. 3D] and [3E] illustrate embodiments having more than one character according to embodiments described herein; 4A and [4B] show more detailed views of mixed characters according to embodiments described herein; 5] shows a simulation setup for a mixed chipless patterned conductor according to embodiments described herein; 6] shows a deep notch observed at the resonant frequency of a ring resonator according to embodiments described herein; 7A] shows the configuration shown in FIG. 1A at about 57 GHz; [FIG. 7B] shows the surface current distribution of the configuration shown in FIG. 1A at about 64 GHz according to the embodiment described herein; [FIG. 8] shows the simulation results of the backscattered electric field of the patterned conductor of FIG. 1B excited by the X-polarization plane for the notch oriented horizontally as in FIG. 1C and the notch rotated 90° and oriented vertically as in FIG. 1D according to the embodiment described herein; [FIG. 9] shows the surface current distribution of the configuration shown in FIG. 1B at about 60 GHz; [FIG. 10] shows the simulation results of the backscattered electric field of a patterned conductor with notches perpendicular to the direction of the incident electric field (90° rotation) as in FIG. 1C and a patterned conductor with notches oriented in the same direction as the incident electric field (180° rotation) as in FIG. 1D according to the embodiments described herein; [FIG. 11A] shows the surface current distribution of a hybrid character according to the embodiments described herein at about 57 GHz; [FIG. 11B] shows the surface current distribution of a hybrid character according to the embodiments described herein at about 60 GHz; [FIG. 11C] shows the surface current distribution of a hybrid character according to the embodiments described herein at about 64 GHz; [FIG. 12] shows an example array of characters according to the embodiments described herein. [Figure 13] shows a block diagram of an RFID system capable of implementing the embodiments described in this article.
圖式不必然按比例繪製。在圖式中使用的相似數字指稱相似組件。然而,應理解在給定圖式中使用數字指稱組件並未意圖限制在另一圖式中以相同數字標示的組件。The drawings are not necessarily drawn to scale. Like numbers used in the drawings refer to like components. However, it should be understood that the use of a number to refer to a component in a given drawing is not intended to limit the component labeled with the same number in another drawing.
100:字符 100:Character
110:碟 110: disc
120:環 120: Ring
122:環 122: Ring
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CN112241776B (en) | 2020-09-04 | 2022-06-10 | 浙江大学 | Groove type ultra-wideband depolarized chipless RFID (radio frequency identification) tag |
US11856419B2 (en) | 2021-08-17 | 2023-12-26 | Xerox Corporation | Method and system for commissioning environmental sensors |
US11595226B1 (en) | 2021-08-17 | 2023-02-28 | Xerox Corporation | Method and system for collecting sensor data in buildings |
US12114386B2 (en) | 2021-08-17 | 2024-10-08 | Xerox Corporation | Building environmental sensor method and system for collecting data from same |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090112147A1 (en) * | 2007-10-31 | 2009-04-30 | Codman Shurleff, Inc. | Wireless Pressure Setting Indicator |
US20090224883A1 (en) * | 2008-03-05 | 2009-09-10 | Angell Robert L | Environmentally Sensitive Electronic Device |
US20180114041A1 (en) * | 2015-04-13 | 2018-04-26 | Rfid Technologies Pty Ltd | Rfid tag and reader |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2956232B1 (en) * | 2010-02-11 | 2012-02-10 | Inst Polytechnique Grenoble | PASSIVE RFID LABEL WITHOUT CHIP |
KR101120957B1 (en) * | 2010-06-25 | 2012-03-05 | 건국대학교 산학협력단 | Chipless rfid tag |
JP5724671B2 (en) | 2011-03-22 | 2015-05-27 | 株式会社村田製作所 | Antenna device, RFID tag, and communication terminal device |
US9690962B2 (en) * | 2014-01-10 | 2017-06-27 | Vdw Design, Llc | Radio-frequency identification tags |
CN106295765B (en) * | 2016-08-12 | 2023-08-22 | 华南理工大学 | Ultra-wideband polarization-variable chipless RFID tag |
CN106486739A (en) * | 2016-11-04 | 2017-03-08 | 华南理工大学 | A kind of dual polarization chipless RFID label antenna based on coaxial straight-flanked ring |
WO2018218313A1 (en) | 2017-06-02 | 2018-12-06 | Monash University | Improved chipless rfid system and method |
CN208705916U (en) | 2018-01-26 | 2019-04-05 | 同济大学 | A kind of chipless RFID electronic tag expanding information capacity |
CN108682969A (en) * | 2018-03-16 | 2018-10-19 | 南京理工大学 | A kind of anti-metal RFID tag of passive chipless |
CN108629398A (en) * | 2018-05-14 | 2018-10-09 | 北京邮电大学 | A kind of Chip-free label structure |
CN109902788A (en) * | 2019-01-30 | 2019-06-18 | 南京理工大学 | A kind of chipless RFID label based on CSRR |
-
2019
- 2019-07-18 US US16/515,628 patent/US11163967B2/en active Active
-
2020
- 2020-06-15 TW TW109120084A patent/TWI836095B/en active
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- 2020-06-17 JP JP2020104341A patent/JP7419170B2/en active Active
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090112147A1 (en) * | 2007-10-31 | 2009-04-30 | Codman Shurleff, Inc. | Wireless Pressure Setting Indicator |
US20090224883A1 (en) * | 2008-03-05 | 2009-09-10 | Angell Robert L | Environmentally Sensitive Electronic Device |
US20180114041A1 (en) * | 2015-04-13 | 2018-04-26 | Rfid Technologies Pty Ltd | Rfid tag and reader |
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CN112241773B (en) | 2023-09-22 |
TW202105254A (en) | 2021-02-01 |
EP3767539A1 (en) | 2021-01-20 |
US20210019484A1 (en) | 2021-01-21 |
KR20210010317A (en) | 2021-01-27 |
CN112241773A (en) | 2021-01-19 |
KR102639845B1 (en) | 2024-02-26 |
JP7419170B2 (en) | 2024-01-22 |
EP3767539B1 (en) | 2023-08-09 |
US11163967B2 (en) | 2021-11-02 |
JP2021018808A (en) | 2021-02-15 |
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