TWI834886B - 含有二氰基苯乙烯基之可濕蝕刻之阻劑下層膜形成組成物、經圖案化的基板之製造方法及半導體裝置之製造方法 - Google Patents

含有二氰基苯乙烯基之可濕蝕刻之阻劑下層膜形成組成物、經圖案化的基板之製造方法及半導體裝置之製造方法 Download PDF

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Publication number
TWI834886B
TWI834886B TW109120311A TW109120311A TWI834886B TW I834886 B TWI834886 B TW I834886B TW 109120311 A TW109120311 A TW 109120311A TW 109120311 A TW109120311 A TW 109120311A TW I834886 B TWI834886 B TW I834886B
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TW
Taiwan
Prior art keywords
resist
group
underlayer film
resist underlayer
film
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TW109120311A
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English (en)
Chinese (zh)
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TW202113486A (zh
Inventor
遠藤貴文
遠藤勇樹
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日商日產化學股份有限公司
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/69—Etching of wafers, substrates or parts of devices using masks for semiconductor materials
    • H10P50/691—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials
    • H10P50/692—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials characterised by their composition, e.g. multilayer masks or materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/286—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials
    • H10P50/287—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials by chemical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • H10P76/2043—Photolithographic processes using an anti-reflective coating

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
TW109120311A 2019-06-17 2020-06-17 含有二氰基苯乙烯基之可濕蝕刻之阻劑下層膜形成組成物、經圖案化的基板之製造方法及半導體裝置之製造方法 TWI834886B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-111916 2019-06-17
JP2019111916 2019-06-17

Publications (2)

Publication Number Publication Date
TW202113486A TW202113486A (zh) 2021-04-01
TWI834886B true TWI834886B (zh) 2024-03-11

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW109120311A TWI834886B (zh) 2019-06-17 2020-06-17 含有二氰基苯乙烯基之可濕蝕刻之阻劑下層膜形成組成物、經圖案化的基板之製造方法及半導體裝置之製造方法

Country Status (6)

Country Link
US (1) US11977331B2 (https=)
JP (1) JP7322949B2 (https=)
KR (1) KR102592573B1 (https=)
CN (1) CN113994263B (https=)
TW (1) TWI834886B (https=)
WO (1) WO2020255985A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI803390B (zh) * 2022-07-15 2023-05-21 三福化工股份有限公司 蝕刻液組成物及其蝕刻方法
KR20250121560A (ko) * 2022-12-15 2025-08-12 닛산 가가쿠 가부시키가이샤 레지스트 하층막 형성용 조성물
TW202535995A (zh) * 2024-01-31 2025-09-16 日商日產化學股份有限公司 光阻下層膜形成用組成物

Citations (4)

* Cited by examiner, † Cited by third party
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TW334465B (en) * 1995-08-21 1998-06-21 Brewer Science Inc Thermosetting anti-reflective coatings and method
TW200302837A (en) * 2002-02-01 2003-08-16 Brewer Science Inc Organic anti-reflective coating compositions for advanced microlithography
CN102803399A (zh) * 2010-03-31 2012-11-28 富士胶片株式会社 着色组成物、喷墨用墨水、彩色滤镜及其制造方法以及固态影像传感器与显示设备
JP5623934B2 (ja) * 2011-02-08 2014-11-12 富士フイルム株式会社 着色組成物、着色感放射線性組成物、色素多量体の製造方法、インクジェット用インク、カラーフィルタ及びその製造方法、固体撮像素子、並びに表示装置

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JPS6199331A (ja) * 1984-10-19 1986-05-17 Sumitomo Chem Co Ltd 微細パタ−ン形成法
US6872506B2 (en) * 2002-06-25 2005-03-29 Brewer Science Inc. Wet-developable anti-reflective compositions
GB0219745D0 (en) 2002-08-23 2002-10-02 Fast Technology Ag Torque sensor adaptor
JP2005321752A (ja) 2004-04-09 2005-11-17 Nissan Chem Ind Ltd イソシアヌル酸化合物と安息香酸化合物との反応生成物を含む反射防止膜形成組成物
KR101599562B1 (ko) 2007-10-10 2016-03-03 바스프 에스이 술포늄 염 개시제
WO2011125839A1 (ja) 2010-03-31 2011-10-13 Jsr株式会社 レジスト下層膜形成用組成物及びパターン形成方法
SG11201606648QA (en) * 2014-02-12 2016-09-29 Nissan Chemical Ind Ltd Film-forming composition including fluorine-containing surfactant
CN107077072B (zh) * 2014-11-19 2021-05-25 日产化学工业株式会社 能够湿式除去的含有硅的抗蚀剂下层膜形成用组合物
TWI843863B (zh) * 2019-06-17 2024-06-01 日商日產化學股份有限公司 含有具二氰基苯乙烯基之雜環化合物之可濕蝕刻之阻劑下層膜形成組成物、經圖案化的基板之製造方法、半導體裝置之製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW334465B (en) * 1995-08-21 1998-06-21 Brewer Science Inc Thermosetting anti-reflective coatings and method
TW200302837A (en) * 2002-02-01 2003-08-16 Brewer Science Inc Organic anti-reflective coating compositions for advanced microlithography
CN102803399A (zh) * 2010-03-31 2012-11-28 富士胶片株式会社 着色组成物、喷墨用墨水、彩色滤镜及其制造方法以及固态影像传感器与显示设备
JP5623934B2 (ja) * 2011-02-08 2014-11-12 富士フイルム株式会社 着色組成物、着色感放射線性組成物、色素多量体の製造方法、インクジェット用インク、カラーフィルタ及びその製造方法、固体撮像素子、並びに表示装置

Also Published As

Publication number Publication date
US20220397828A1 (en) 2022-12-15
WO2020255985A1 (ja) 2020-12-24
JP7322949B2 (ja) 2023-08-08
KR20220024080A (ko) 2022-03-03
US11977331B2 (en) 2024-05-07
JPWO2020255985A1 (https=) 2020-12-24
CN113994263A (zh) 2022-01-28
TW202113486A (zh) 2021-04-01
KR102592573B1 (ko) 2023-10-23
CN113994263B (zh) 2024-08-16

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