TWI833947B - Adhesive tape - Google Patents

Adhesive tape Download PDF

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TWI833947B
TWI833947B TW109113872A TW109113872A TWI833947B TW I833947 B TWI833947 B TW I833947B TW 109113872 A TW109113872 A TW 109113872A TW 109113872 A TW109113872 A TW 109113872A TW I833947 B TWI833947 B TW I833947B
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weight
base material
adhesive tape
foam base
mentioned
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TW109113872A
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TW202104490A (en
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安田妃那
石堂泰志
土居智
西垣達哉
福山誠
堀尾明史
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日商積水化學工業股份有限公司
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Abstract

本發明之目的在於提供一種具有優異之柔軟性及耐衝擊性、同時耐熱性亦優異的黏著帶。本發明之黏著帶於發泡體基材之兩面具有黏著劑層,上述發泡體基材含有至少具有1個以上之硬嵌段與1個軟嵌段之嵌段共聚物,上述軟嵌段由(甲基)丙烯酸系單體構成。An object of the present invention is to provide an adhesive tape that has excellent flexibility and impact resistance, as well as excellent heat resistance. The adhesive tape of the present invention has adhesive layers on both sides of a foam base material. The foam base material contains a block copolymer having at least one hard block and one soft block. The soft block Composed of (meth)acrylic monomers.

Description

黏著帶Adhesive tape

本發明係關於一種黏著帶。The present invention relates to an adhesive tape.

於行動電話、行動資訊終端(Personal Digital Assistants,PDA)等可攜式電子機器中,為了進行組裝而使用黏著帶(例如專利文獻1、2)。又,於將車載用面板等車載用電子機器零件固定於車輛本體之用途中亦使用黏著帶。 先前技術文獻 專利文獻In portable electronic devices such as mobile phones and mobile information terminals (Personal Digital Assistants, PDAs), adhesive tapes are used for assembly (for example, Patent Documents 1 and 2). In addition, adhesive tapes are also used to fix vehicle-mounted electronic equipment parts such as vehicle-mounted panels to the vehicle body. Prior technical literature patent documents

專利文獻1:日本特開2009-242541號公報 專利文獻2:日本特開2009-258274號公報Patent Document 1: Japanese Patent Application Publication No. 2009-242541 Patent Document 2: Japanese Patent Application Publication No. 2009-258274

[發明所欲解決之課題][Problem to be solved by the invention]

對於可攜式電子機器零件、車載用電子機器零件等之固定中所使用之黏著帶,要求較高之黏著力,同時要求即便受到衝擊亦不會剝離之耐衝擊性。另一方面,近年之可攜式電子機器、車載用電子機器等由於存在伴隨高功能化而形狀更加複雜化之傾向,故而存在將黏著帶貼附於高低差、角、非平面部等處而使用之情況。於此情形時,要求黏著帶具有能夠追隨被著體之形狀的優異之柔軟性。Adhesive tapes used for fixing portable electronic equipment parts, vehicle-mounted electronic equipment parts, etc. are required to have high adhesion and impact resistance that will not peel off even if they are impacted. On the other hand, in recent years, portable electronic devices, vehicle-mounted electronic devices, etc. tend to have more complex shapes as they become more functional, so there is a tendency to attach adhesive tapes to places such as height differences, corners, and non-planar parts. Conditions of use. In this case, the adhesive tape is required to have excellent flexibility that can follow the shape of the adherend.

作為上述柔軟性與耐衝擊性優異之黏著帶,已知有一種使用使聚烯烴樹脂發泡之發泡體基材之黏著帶。另一方面,近年來,伴隨高性能化或高積體化,可攜式電子機器、車載用電子機器等運轉時之溫度升高。於此種長期處於高溫之機器中使用如上所述之採用使聚烯烴樹脂發泡之發泡體基材之黏著帶之情形時,存在不耐熱而變形並剝離之現象。As an adhesive tape excellent in flexibility and impact resistance, an adhesive tape using a foam base material made of polyolefin resin foam is known. On the other hand, in recent years, with the increase in performance or integration, the temperature during operation of portable electronic equipment, vehicle-mounted electronic equipment, etc. has increased. When an adhesive tape using a foam base material made of polyolefin resin as mentioned above is used in such a machine that is exposed to high temperatures for a long time, there is a phenomenon that it is not heat-resistant and deforms and peels off.

本發明之目的在於提供一種具有優異之柔軟性及耐衝擊性、同時耐熱性亦優異的黏著帶。 [解決課題之技術手段]An object of the present invention is to provide an adhesive tape that has excellent flexibility and impact resistance, as well as excellent heat resistance. [Technical means to solve the problem]

本發明係一種黏著帶,其於發泡體基材之兩面具有黏著劑層,上述發泡體基材含有至少具有1個以上之硬嵌段與1個軟嵌段之嵌段共聚物,上述軟嵌段由(甲基)丙烯酸系單體構成。 以下,對本發明進行詳細敍述。The present invention is an adhesive tape with adhesive layers on both sides of a foam base material. The foam base material contains a block copolymer with at least one hard block and one soft block. The above-mentioned The soft block is composed of (meth)acrylic monomers. Hereinafter, the present invention will be described in detail.

本發明之黏著帶於發泡體基材之兩面具有黏著劑層。 藉由使用上述發泡體基材,本發明之黏著帶能夠發揮優異之柔軟性及耐衝擊性。上述發泡體基材可具有連續氣泡結構,亦可具有獨立氣泡結構,較佳為具有獨立氣泡結構。上述發泡體基材可為單層結構,亦可為多層結構。又,上述黏著劑層之兩面可使用相同之黏著劑,亦可使用不同之黏著劑。The adhesive tape of the present invention has adhesive layers on both sides of the foam base material. By using the above-mentioned foam base material, the adhesive tape of the present invention can exhibit excellent flexibility and impact resistance. The above-mentioned foam base material may have a continuous cell structure or an independent cell structure, and preferably has an independent cell structure. The above-mentioned foam base material may have a single-layer structure or a multi-layer structure. In addition, the same adhesive can be used on both sides of the adhesive layer, or different adhesives can be used.

上述發泡體基材含有至少具有1個以上之硬嵌段與1個軟嵌段之嵌段共聚物。 所謂硬嵌段,係具有高凝聚力,具有擬似交聯點(pseudo-crosslinking point)之作用之嵌段,軟嵌段係指顯示出橡膠彈性之柔軟之嵌段。關於具有硬嵌段與軟嵌段之嵌段共聚物,硬嵌段與軟嵌段難以相容,有時會形成為於軟嵌段之海中分散有硬嵌段凝聚而成之島的不均勻之相分離結構。而且,認為藉由使硬嵌段之島成為擬似交聯點,可對共聚物賦予橡膠性,可對所獲得之黏著帶賦予較高之柔軟性及耐衝擊性。又,認為若於硬嵌段上具有交聯性官能基,則可對所獲得之黏著帶賦予進一步的柔軟性及耐衝擊性。上述嵌段共聚物可採取如硬嵌段-軟嵌段均存在於主鏈上之二嵌段結構,亦可採取硬嵌段-軟嵌段-硬嵌段之三嵌段結構,但就進一步提高柔軟性及耐衝擊性之方面而言,較佳為具有三嵌段結構。又,上述嵌段共聚物可為如硬嵌段與軟嵌段分別存在於主鏈與側鏈上之接枝共聚物。作為上述接枝共聚物,例如可列舉苯乙烯巨分子單體-(甲基)丙烯酸單體共聚物等。The foam base material contains a block copolymer having at least one hard block and one soft block. The so-called hard block refers to a block that has high cohesion and functions like a pseudo-crosslinking point. The soft block refers to a soft block that exhibits rubber elasticity. Regarding block copolymers having hard blocks and soft blocks, the hard blocks and the soft blocks are difficult to be compatible with each other, and sometimes uneven formation occurs in which islands formed by agglomeration of the hard blocks are dispersed in a sea of soft blocks. phase separation structure. Furthermore, it is thought that by making the islands of the hard blocks serve as pseudo-crosslinking points, rubbery properties can be imparted to the copolymer, and high flexibility and impact resistance can be imparted to the obtained adhesive tape. Furthermore, it is considered that if the hard block has a crosslinkable functional group, further flexibility and impact resistance can be imparted to the obtained adhesive tape. The above-mentioned block copolymer can adopt a diblock structure in which hard block and soft block both exist on the main chain, and can also adopt a three-block structure in which hard block-soft block-hard block exists. However, as for further details, In terms of improving flexibility and impact resistance, it is preferable to have a triblock structure. In addition, the above-mentioned block copolymer may be a graft copolymer in which hard blocks and soft blocks exist respectively on the main chain and side chains. Examples of the graft copolymer include a styrene macromonomer-(meth)acrylic acid monomer copolymer.

上述硬嵌段若具有剛性結構則並無特別限定,可為單一之上述具有剛性結構之單體之聚合物,亦可為由包含上述具有剛性結構之單體之複數個單體所構成之共聚物。作為上述具有剛性結構之單體,例如可列舉:乙烯基芳香族化合物、具有環狀結構之化合物、側鏈取代基較短之化合物等。其中,就進一步提高耐衝擊性之方面而言,上述硬嵌段更佳為具有來自乙烯基芳香族化合物單體之結構。作為上述乙烯基芳香族化合物單體,例如可列舉:苯乙烯、α-甲基苯乙烯、對甲基苯乙烯、氯苯乙烯等。其中,就進一步提高耐衝擊性之方面而言,較佳為苯乙烯。再者,於本說明書中,所謂來自乙烯基芳香族化合物單體之結構係指如下述通式(1)、(2)所示之結構。If the above-mentioned hard block has a rigid structure, it is not particularly limited. It may be a single polymer of the above-mentioned monomer with a rigid structure, or it may be a copolymer composed of a plurality of monomers including the above-mentioned monomer with a rigid structure. things. Examples of the monomer having a rigid structure include vinyl aromatic compounds, compounds having a cyclic structure, compounds with shorter side chain substituents, and the like. Among these, in order to further improve impact resistance, it is more preferable that the hard block has a structure derived from a vinyl aromatic compound monomer. Examples of the vinyl aromatic compound monomer include styrene, α-methylstyrene, p-methylstyrene, chlorostyrene, and the like. Among them, styrene is preferred in terms of further improving impact resistance. In addition, in this specification, the structure derived from a vinyl aromatic compound monomer means a structure represented by the following general formulas (1) and (2).

式(1)、(2)中R1 表示取代基。作為取代基R1 ,可列舉苯基、甲基苯基、氯苯基等。 In formulas (1) and (2), R 1 represents a substituent. Examples of the substituent R 1 include a phenyl group, a methylphenyl group, a chlorophenyl group, and the like.

於上述嵌段共聚物具有上述來自乙烯基芳香族化合物單體之結構之情形時,上述嵌段共聚物中之上述來自乙烯基芳香族化合物單體之結構之含量較佳為1重量%以上30重量%以下。 藉由使上述來自乙烯基芳香族化合物單體之結構之含量為上述範圍,能夠使柔軟性及耐衝擊性進一步提高。上述來自乙烯基芳香族化合物單體之結構之含量之更佳之下限為1.5重量%,進而較佳之下限為2重量%,特佳之下限為2.5重量%,更佳之上限為24重量%,進而較佳之上限為19重量%,特佳之上限為16重量%,極佳之上限為8重量%。When the block copolymer has the structure derived from the vinyl aromatic compound monomer, the content of the structure derived from the vinyl aromatic compound monomer in the block copolymer is preferably 1% by weight or more. 30 weight% or less. By setting the content of the structure derived from the vinyl aromatic compound monomer to the above range, flexibility and impact resistance can be further improved. A more preferred lower limit for the content of the structure derived from the vinyl aromatic compound monomer is 1.5% by weight, a further preferred lower limit is 2% by weight, a particularly preferred lower limit is 2.5% by weight, a more preferred upper limit is 24% by weight, and still more preferred The upper limit is 19% by weight, the upper limit of particularly good is 16% by weight, and the upper limit of excellent is 8% by weight.

上述硬嵌段較佳為具有來自具有交聯性官能基之單體之結構。 若硬嵌段具有交聯性官能基,則藉由交聯使嵌段共聚物之橡膠性提高,故而能夠進一步提高柔軟性及耐衝擊性。上述交聯性官能基可交聯,亦可不交聯,即便為未交聯之結構時,藉由官能基間之相互作用,嵌段內之凝聚力亦會提高,柔軟性及耐衝擊性亦會提高,但更佳為交聯。再者,於本說明書中,所謂來自具有交聯性官能基之單體之結構係指如下述通式(3)、(4)所示之結構。The hard block preferably has a structure derived from a monomer having a crosslinkable functional group. If the hard block has a crosslinkable functional group, the rubbery properties of the block copolymer are improved by crosslinking, so the flexibility and impact resistance can be further improved. The above-mentioned cross-linkable functional groups may or may not be cross-linked. Even in the case of an uncross-linked structure, through the interaction between the functional groups, the cohesion within the block will be improved, and the softness and impact resistance will also be improved. Improvement, but preferably cross-linking. In addition, in this specification, the structure derived from the monomer which has a crosslinkable functional group means the structure represented by the following general formula (3), (4).

此處,R2 表示取代基。取代基R2 可含有烷基或醚基、羰基、酯基、碳酸酯基、醯胺基、胺酯(urethane)基等作為其構成要素,含有羧基、羥基、環氧基、雙鍵、三鍵、胺基、醯胺基、腈基等中之至少一種官能基。 Here, R 2 represents a substituent. The substituent R 2 may contain an alkyl or ether group, carbonyl group, ester group, carbonate group, amide group, urethane group, etc. as its constituent elements, and may contain a carboxyl group, a hydroxyl group, an epoxy group, a double bond, a triple bond, or a carboxyl group. At least one functional group among bond, amine group, amide group, nitrile group, etc.

上述具有交聯性官能基之單體並無特別限定,例如可列舉:含羧基單體、含羥基單體、含環氧基單體、含雙鍵單體、含三鍵單體、含胺基單體、含醯胺基單體、含腈基單體等。其中,就進一步提高柔軟性及耐衝擊性之方面而言,較佳為選自由含羥基單體、含羧基單體、含環氧基單體、含醯胺基單體、含雙鍵單體及含三鍵單體所組成之群中之至少一種。作為含羥基單體,可列舉(甲基)丙烯酸4-羥丁酯、(甲基)丙烯酸2-羥乙酯等。作為上述含羧基單體,可列舉(甲基)丙烯酸等。作為含環氧基單體,可列舉(甲基)丙烯酸環氧丙酯等。作為含醯胺基單體,可列舉(甲基)丙烯醯胺等。作為含雙鍵單體,可列舉(甲基)丙烯酸烯丙酯、己二醇二(甲基)丙烯酸酯等。作為含三鍵單體,可列舉(甲基)丙烯酸炔丙酯等。該等之中,就能夠對黏著帶賦予更優異之柔軟性及耐衝擊性之方面而言,較佳為含羧基單體,更佳為(甲基)丙烯酸系單體,進而較佳為丙烯酸。The above-mentioned monomers having crosslinkable functional groups are not particularly limited, and examples thereof include: carboxyl-containing monomers, hydroxyl-containing monomers, epoxy-containing monomers, double-bond-containing monomers, triple-bond-containing monomers, and amine-containing monomers. based monomers, amide-containing monomers, nitrile-containing monomers, etc. Among them, in terms of further improving flexibility and impact resistance, it is preferable to select from a hydroxyl group-containing monomer, a carboxyl group-containing monomer, an epoxy group-containing monomer, a amide group-containing monomer, and a double bond-containing monomer. And at least one of the group consisting of three-bond monomers. Examples of the hydroxyl-containing monomer include 4-hydroxybutyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, and the like. Examples of the carboxyl group-containing monomer include (meth)acrylic acid and the like. Examples of the epoxy group-containing monomer include glycidyl (meth)acrylate and the like. Examples of the amide group-containing monomer include (meth)acrylamide. Examples of the double bond-containing monomer include allyl (meth)acrylate, hexanediol di(meth)acrylate, and the like. Examples of the triple bond-containing monomer include propargyl (meth)acrylate. Among these, in terms of being able to impart more excellent flexibility and impact resistance to the adhesive tape, a carboxyl group-containing monomer is preferred, a (meth)acrylic monomer is more preferred, and acrylic acid is even more preferred. .

於上述硬嵌段為上述具有剛性結構之單體與上述具有交聯性官能基之單體之共聚物之情形時,較佳為上述硬嵌段含有0.1重量%以上30重量%以下之上述來自具有交聯性官能基之單體之結構。 藉由將上述硬嵌段中之上述來自具有交聯性官能基之單體之結構的含量設為上述範圍,能夠使柔軟性及耐衝擊性進一步提高。上述來自具有交聯性官能基之單體之結構之含量之更佳之下限為0.5重量%,進而較佳之下限為1重量%,更佳之上限為25重量%,進而較佳之上限為20重量%。When the above-mentioned hard block is a copolymer of the above-mentioned monomer having a rigid structure and the above-mentioned monomer having a crosslinkable functional group, it is preferred that the above-mentioned hard block contains 0.1% by weight or more and 30% by weight or less of the above-mentioned monomer derived from The structure of a monomer with cross-linking functional groups. By setting the content of the structure derived from the monomer having a crosslinkable functional group in the hard block to the above range, flexibility and impact resistance can be further improved. A more preferable lower limit of the content of the structure derived from the monomer having a cross-linkable functional group is 0.5% by weight, a further preferable lower limit is 1 wt%, a more preferable upper limit is 25 wt%, and a further preferable upper limit is 20 wt%.

上述軟嵌段由(甲基)丙烯酸系單體構成。 因上述軟嵌段由(甲基)丙烯酸系單體構成,故而能夠對所獲得之黏著帶賦予耐熱性,即便於長期暴露於高溫之情形時,亦可抑制黏著帶之變形或剝離。上述(甲基)丙烯酸系單體可為單一之單體,亦可使用複數種單體。又,於不失去本發明之效果之範圍內,亦可使用(甲基)丙烯酸系單體以外之單體。The soft block is composed of (meth)acrylic monomers. Since the soft block is composed of a (meth)acrylic monomer, it is possible to impart heat resistance to the obtained adhesive tape, thereby suppressing deformation or peeling of the adhesive tape even when exposed to high temperatures for a long period of time. The above-mentioned (meth)acrylic monomer may be a single monomer, or a plurality of monomers may be used. In addition, monomers other than (meth)acrylic monomers may be used within the scope that the effects of the present invention are not lost.

成為上述軟嵌段之原料之(甲基)丙烯酸系單體若具有顯示出橡膠彈性之柔軟性,則並無特別限定,例如可列舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸-2-乙基己酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸異硬脂酯等。其中,就容易兼顧耐熱性與柔軟性之方面而言,較佳為丙烯酸甲酯、丙烯酸乙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸-2-乙基己酯,進而較佳為丙烯酸甲酯、丙烯酸乙酯、丙烯酸丁酯、丙烯酸-2-乙基己酯。The (meth)acrylic monomer used as the raw material of the soft block is not particularly limited as long as it has flexibility showing rubber elasticity. Examples include: (meth)acrylic acid methyl ester, (meth)acrylic acid ethyl ester Ester, propyl (meth)acrylate, butyl (meth)acrylate, amyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, nonyl (meth)acrylate, decyl (meth)acrylate, dodecyl (meth)acrylate, lauryl (meth)acrylate, (meth)acrylate base) isostearyl acrylate, etc. Among them, in terms of easily achieving a balance between heat resistance and flexibility, methyl acrylate, ethyl acrylate, butyl (meth)acrylate, and 2-ethylhexyl (meth)acrylate are preferred, and further preferred It is methyl acrylate, ethyl acrylate, butyl acrylate, and 2-ethylhexyl acrylate.

作為成為上述軟嵌段之原料之(甲基)丙烯酸系單體,較佳為使用側鏈碳數為2以下之(甲基)丙烯酸系單體。若使用側鏈碳數為2以下之(甲基)丙烯酸系單體,則所獲得之聚合物鏈彼此之交聯增加,凝聚力提高,故而能夠進一步提高耐熱性或耐衝擊性。作為側鏈碳數為2以下之(甲基)丙烯酸系單體,可列舉(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯,特佳為丙烯酸甲酯、丙烯酸乙酯。As the (meth)acrylic monomer used as the raw material of the soft block, it is preferable to use a (meth)acrylic monomer having a side chain carbon number of 2 or less. If a (meth)acrylic monomer with a side chain carbon number of 2 or less is used, the cross-linking of the obtained polymer chains increases and the cohesive force increases, so that the heat resistance or impact resistance can be further improved. Examples of the (meth)acrylic monomer having a side chain carbon number of 2 or less include methyl (meth)acrylate and ethyl (meth)acrylate, with methyl acrylate and ethyl acrylate being particularly preferred.

軟嵌段中之上述側鏈碳數為2以下之(甲基)丙烯酸系單體之含量之較佳之下限為5重量%。藉由包含該下限量,容易顯現上文記載之凝聚力提高效果。更佳之下限為10重量%,進而較佳之下限為20重量%,極佳之下限為25重量%,尤佳之下限為30重量%。軟嵌段中之上述側鏈碳數為2以下之(甲基)丙烯酸系單體之含量之較佳之上限為90重量%。若超過該上限,則凝聚力變得過高而柔軟性變低,會失去作為黏著帶之柔軟性。更佳之上限為85%,進而較佳之上限為80重量%,極佳之上限為75重量%,尤佳之上限為70重量%。The preferred lower limit of the content of the (meth)acrylic monomer with a side chain carbon number of 2 or less in the soft block is 5% by weight. By including this lower amount, the cohesion-improving effect described above can be easily expressed. A more preferable lower limit is 10 wt%, a further preferable lower limit is 20 wt%, an excellent lower limit is 25 wt%, and an even more preferable lower limit is 30 wt%. A preferable upper limit of the content of the (meth)acrylic monomer with a side chain carbon number of 2 or less in the soft block is 90% by weight. If the upper limit is exceeded, the cohesive force becomes too high and the flexibility becomes low, and the flexibility as an adhesive tape is lost. A more preferable upper limit is 85% by weight, a further preferable upper limit is 80% by weight, an excellent upper limit is 75% by weight, and a particularly preferable upper limit is 70% by weight.

較佳為上述嵌段共聚物含有1重量%以上40重量%以下之上述硬嵌段。藉由將上述硬嵌段之含量設為上述範圍,能夠形成柔軟性、耐衝擊性及耐熱性優異之發泡體基材。就進一步提高柔軟性、耐衝擊性及耐熱性之觀點而言,上述硬嵌段之含量之更佳之下限為2重量%,進而較佳之下限為2.5重量%,特佳之下限為3重量%,更佳之上限為35%,進而較佳之上限為30%,更佳之上限為26重量%,進而較佳之上限為20重量%,特佳之上限為17重量%,極佳之上限為8重量%。It is preferable that the block copolymer contains 1% by weight or more and 40% by weight or less of the hard block. By setting the content of the hard block within the above range, a foam base material excellent in flexibility, impact resistance, and heat resistance can be formed. From the viewpoint of further improving softness, impact resistance and heat resistance, a more preferable lower limit of the content of the hard block is 2 wt%, a further preferable lower limit is 2.5 wt%, a particularly preferable lower limit is 3 wt%, and more A preferable upper limit is 35%, a further preferable upper limit is 30%, a further preferable upper limit is 26 wt%, a further preferable upper limit is 20 wt%, a particularly preferable upper limit is 17 wt%, and an excellent upper limit is 8 wt%.

較佳為上述嵌段共聚物之重量平均分子量為50000~800000。 藉由使嵌段共聚物之重量平均分子量為上述範圍,能夠進一步提高柔軟性、耐衝擊性及耐熱性。上述嵌段共聚物之重量平均分子量之更佳之下限為75000,更佳之上限為600000。再者,上述重量平均分子量例如能夠藉由GPC法進行測定,可使用Water公司製造之「2690 Separations Module」作為測定機器,使用昭和電工公司製造之「GPCKF-806L」作為管柱,使用乙酸乙酯作為溶劑,於樣品流量1 mL/min、管柱溫度40℃之條件下進行測定。Preferably, the weight average molecular weight of the above-mentioned block copolymer is 50,000 to 800,000. By setting the weight average molecular weight of the block copolymer within the above range, flexibility, impact resistance, and heat resistance can be further improved. A more preferable lower limit of the weight average molecular weight of the above-mentioned block copolymer is 75,000, and a more preferable upper limit is 600,000. In addition, the above-mentioned weight average molecular weight can be measured by, for example, the GPC method. "2690 Separations Module" manufactured by Water Co., Ltd. can be used as the measurement machine, "GPCKF-806L" manufactured by Showa Denko Co., Ltd. can be used as the column, and ethyl acetate can be used. As a solvent, the measurement was performed under the conditions of sample flow rate 1 mL/min and column temperature 40°C.

為了獲得上述嵌段共聚物,只要使硬嵌段及軟嵌段之原料單體於存在聚合起始劑之條件下分別進行自由基反應而獲得硬嵌段及軟嵌段後,使兩者進行反應或共聚,或者於利用上述方法獲得硬嵌段後,繼而投入軟嵌段之原料單體進行共聚即可。作為使上述自由基反應進行之方法、即聚合方法,可使用以往公知之方法,例如可列舉:溶液聚合(沸點聚合或恆溫聚合)、乳化聚合、懸浮聚合、塊狀聚合等。In order to obtain the above block copolymer, the raw material monomers of the hard block and the soft block are subjected to free radical reactions respectively in the presence of a polymerization initiator to obtain the hard block and the soft block, and then the two are reacted Reaction or copolymerization, or after obtaining the hard block by the above method, then adding the raw material monomers of the soft block for copolymerization. As a method for advancing the radical reaction, that is, a polymerization method, conventionally known methods can be used, and examples thereof include solution polymerization (boiling point polymerization or isothermal polymerization), emulsion polymerization, suspension polymerization, block polymerization, and the like.

上述發泡體基材可含有抗靜電劑、脫模劑、抗氧化劑、耐候劑、結晶成核劑等添加劑、或聚烯烴、聚酯、聚醯胺、彈性體等樹脂改質劑等。The above-mentioned foam base material may contain additives such as antistatic agents, release agents, antioxidants, weathering agents, and crystal nucleating agents, or resin modifiers such as polyolefins, polyesters, polyamides, and elastomers.

上述發泡體基材之視密度較佳為0.3 g/cm3 以上0.75 g/cm3 以下。 藉由將上述發泡體基材之視密度設為上述範圍,能夠維持強度,並且製成柔軟性及耐衝擊性更優異之黏著帶。就進一步提高黏著帶之強度、柔軟性及耐衝擊性之觀點而言,上述發泡體基材之更佳之下限為0.33 g/cm3 ,更佳之上限為0.73 g/cm3 ,進而較佳之下限為0.35 g/cm3 ,進而較佳之上限為0.71 g/cm3 。 此處,所謂視密度係指將黏著帶之黏著劑之密度視為1.0 g/cm3 時之根據黏著帶之重量求出之發泡體基材密度。 再者,上述視密度可依據JIS K 6767並使用電子比重計(例如,MIRAGE公司製,「ED120T」)進行測定。The apparent density of the above-mentioned foam base material is preferably 0.3 g/cm 3 or more and 0.75 g/cm 3 or less. By setting the apparent density of the foam base material within the above range, it is possible to produce an adhesive tape having better flexibility and impact resistance while maintaining strength. From the viewpoint of further improving the strength, softness and impact resistance of the adhesive tape, a more preferable lower limit of the above-mentioned foam base material is 0.33 g/cm 3 , a more preferable upper limit is 0.73 g/cm 3 , and a further preferable lower limit is 0.35 g/cm 3 , and a more preferable upper limit is 0.71 g/cm 3 . Here, the apparent density refers to the density of the foam base material calculated from the weight of the adhesive tape when the density of the adhesive in the adhesive tape is considered to be 1.0 g/cm 3 . In addition, the above-mentioned apparent density can be measured using an electronic hydrometer (for example, "ED120T" manufactured by MIRAGE Co., Ltd.) in accordance with JIS K 6767.

上述發泡體基材之凝膠分率較佳為90%以下。 藉由將上述發泡體基材之凝膠分率設為上述範圍,可進一步提高所獲得之黏著帶之耐衝擊性。就進一步提高黏著帶之耐衝擊性之觀點而言,上述凝膠分率之更佳之上限為85%,進而較佳之上限為80%。上述凝膠分率之下限並無特別限定,例如為10%以上,極佳為20%以上,特佳為35%以上。上述凝膠分率能夠藉由使上述硬嵌段與上述軟嵌段中之至少一個交聯而進行調節。再者,上述凝膠分率能夠利用以下之方法進行測定。 自所獲得之黏著帶僅取出0.1 g之發泡體基材,浸漬於乙酸乙酯50 ml中,利用振動機於溫度23℃、120 rpm之條件下振動24小時。振動後,使用金屬網(網眼#200 mesh)將乙酸乙酯與吸收乙酸乙酯而膨潤後之發泡體基材分離。使分離後之發泡體基材於110℃之條件下乾燥1小時。測定乾燥後之包含金屬網之發泡體基材之重量,利用下式算出發泡體基材之凝膠分率。 凝膠分率(重量%)=100×(W1-W2)/W0 (W0:發泡體基材初始重量,W1:乾燥後之包含金屬網之發泡體基材重量,W2:金屬網之初始重量)The gel fraction of the above-mentioned foam base material is preferably 90% or less. By setting the gel fraction of the foam base material to the above range, the impact resistance of the obtained adhesive tape can be further improved. From the viewpoint of further improving the impact resistance of the adhesive tape, a more preferable upper limit of the gel fraction is 85%, and a more preferable upper limit is 80%. The lower limit of the above-mentioned gel fraction is not particularly limited, but for example, it is 10% or more, excellent is 20% or more, and particularly optimal is 35% or more. The gel fraction can be adjusted by crosslinking at least one of the hard block and the soft block. In addition, the above-mentioned gel fraction can be measured by the following method. Only 0.1 g of the foam base material was taken out from the obtained adhesive tape, immersed in 50 ml of ethyl acetate, and vibrated using a vibration machine at a temperature of 23°C and 120 rpm for 24 hours. After vibration, a metal mesh (mesh #200 mesh) is used to separate the ethyl acetate from the foam base material that has been swollen by absorbing the ethyl acetate. The separated foam base material was dried at 110° C. for 1 hour. The weight of the foam base material including the metal mesh after drying is measured, and the gel fraction of the foam base material is calculated using the following formula. Gel fraction (weight%) = 100×(W1-W2)/W0 (W0: Initial weight of the foam base material, W1: Weight of the foam base material including the metal mesh after drying, W2: Initial weight of the metal mesh)

上述發泡體基材較佳為藉由添加交聯劑而於構成上述發泡體基材之樹脂之主鏈間形成有交聯結構。藉由於構成上述發泡體基材之樹脂之主鏈間形成交聯結構,可使間斷地施加之剝離應力分散,可使黏著帶之耐熱性、耐衝擊性進一步提高。上述交聯劑並無特別限定,可根據構成上述發泡體基材之樹脂所具有之官能基進行適當選擇。具體而言,例如可列舉:異氰酸酯系交聯劑、氮丙啶系交聯劑、環氧系交聯劑、金屬螯合物型交聯劑等。其中,就能夠使「可進一步提高柔軟性與耐衝擊性之具有醇性羥基或羧基之樹脂」交聯之方面而言,較佳為環氧系交聯劑或異氰酸酯系交聯劑。再者,上述異氰酸酯系交聯劑使構成上述發泡體基材之樹脂中之醇性羥基或羧基與交聯劑之異氰酸基之間交聯。又,上述環氧系交聯劑使構成上述發泡體基材之樹脂中之羧基與交聯劑之環氧基之間交聯。 相對於成為上述發泡體基材主成分之樹脂100重量份,上述交聯劑之添加量較佳為0.01~10重量份,更佳為0.1~7重量份。The foam base material preferably has a cross-linked structure formed between the main chains of the resin constituting the foam base material by adding a cross-linking agent. By forming a cross-linked structure between the main chains of the resin constituting the foam base material, peeling stress applied intermittently can be dispersed, and the heat resistance and impact resistance of the adhesive tape can be further improved. The cross-linking agent is not particularly limited and can be appropriately selected according to the functional groups of the resin constituting the foam base material. Specific examples thereof include isocyanate cross-linking agents, aziridine cross-linking agents, epoxy cross-linking agents, metal chelate cross-linking agents, and the like. Among them, in terms of being able to cross-link "a resin having an alcoholic hydroxyl group or a carboxyl group that can further improve flexibility and impact resistance", an epoxy-based cross-linking agent or an isocyanate-based cross-linking agent is preferred. Furthermore, the isocyanate cross-linking agent cross-links the alcoholic hydroxyl group or carboxyl group in the resin constituting the foam base material and the isocyanate group of the cross-linking agent. Furthermore, the epoxy cross-linking agent cross-links the carboxyl group in the resin constituting the foam base material and the epoxy group of the cross-linking agent. The amount of the crosslinking agent added is preferably 0.01 to 10 parts by weight, more preferably 0.1 to 7 parts by weight relative to 100 parts by weight of the resin that is the main component of the foam base material.

上述發泡體基材之氣泡之平均氣泡徑較佳為80 μm以下。藉由使發泡體基材之平均氣室(cell)徑為上述範圍,能夠進一步提高所獲得之黏著帶之強度與柔軟性及耐衝擊性之平衡。 上述發泡體基材之平均氣泡徑更佳為60 μm以下,進而較佳為55 μm以下。上述發泡體基材之平均氣泡徑之下限並無特別限定,就確保帶柔軟性之觀點而言,較佳為20 μm以上,更佳為30 μm以上。 再者,上述平均氣泡徑能夠藉由以下方法進行測定。 首先,將發泡體基材切割成50 mm見方,於液態氮中浸漬1分鐘後,使用剃刀片在垂直於發泡體基材之厚度方向之面上進行切斷。繼而,使用數位顯微鏡(例如,基恩士公司製,「VHX-900」等)以200倍之倍率拍攝切斷面之放大照片,對厚度×2 mm之範圍內之全部氣室測定最長之氣室徑(氣泡之直徑)。重複該操作5次,算出所獲得之全部氣室徑之平均值,藉此算出平均氣泡徑。The average cell diameter of the cells in the foam base material is preferably 80 μm or less. By setting the average cell diameter of the foam base material within the above range, the balance between strength, flexibility, and impact resistance of the obtained adhesive tape can be further improved. The average cell diameter of the foam base material is more preferably 60 μm or less, further preferably 55 μm or less. The lower limit of the average cell diameter of the foam base material is not particularly limited, but from the viewpoint of ensuring flexibility, it is preferably 20 μm or more, and more preferably 30 μm or more. In addition, the above-mentioned average bubble diameter can be measured by the following method. First, the foam base material was cut into 50 mm squares, immersed in liquid nitrogen for 1 minute, and then cut with a razor blade on the surface perpendicular to the thickness direction of the foam base material. Then, use a digital microscope (for example, "VHX-900" manufactured by Keyence Corporation, etc.) to take an enlarged photo of the cut surface at a magnification of 200 times, and measure the longest air chamber of all the air cells within the thickness × 2 mm range. Chamber diameter (diameter of bubble). Repeat this operation 5 times, calculate the average value of all the obtained air chamber diameters, and thereby calculate the average bubble diameter.

上述發泡體基材之厚度並無特別限定,較佳之下限為40 μm,較佳之上限為2900 μm。藉由將上述發泡體基材之厚度設為上述範圍,能夠將本發明之黏著帶適宜地用於可攜式電子機器零件、車載用電子機器零件等之固定。就能夠更適合用於上述零件等之固定之觀點而言,上述發泡體基材之厚度之更佳之下限為60 μm,更佳之上限為1900 μm,進而較佳之下限為80 μm,進而較佳之上限為1400 μm,特佳之下限為100 μm,特佳之上限為1000 μm。The thickness of the above-mentioned foam base material is not particularly limited, but a preferred lower limit is 40 μm and a preferred upper limit is 2900 μm. By setting the thickness of the foam base material within the above range, the adhesive tape of the present invention can be suitably used for fixing portable electronic device parts, vehicle-mounted electronic device parts, and the like. From the viewpoint of being more suitable for fixing the above-mentioned parts and the like, the lower limit of the thickness of the foam base material is preferably 60 μm, the upper limit is more preferably 1900 μm, the lower limit is more preferably 80 μm, and the upper limit is more preferably 80 μm. The upper limit is 1400 μm, the lower limit of the best is 100 μm, and the upper limit of the best is 1000 μm.

上述發泡體基材只要具有氣泡結構即可,製造方法並無特別限定。作為上述發泡體基材之製造方法,例如可列舉:藉由發泡氣體之作用而製造之方法、或藉由於原材料基質中摻合中空球而製造之方法。其中,將利用後者之方法製造之發泡體稱為複合泡材(syntactic foam),就耐衝擊性與耐熱性更優異之方面而言,較佳為上述發泡體基材為複合泡材。藉由使發泡體基材為複合泡材,可獲得具有發泡氣泡之均勻之尺寸分佈之獨立氣泡型發泡體,因此發泡體基材整體之密度變得更為一定,能夠進一步提高耐衝擊性。又,複合泡材與其他發泡體相比,於高溫及高壓不易發生不可逆的崩解,故而顯示出更高之耐熱性。作為複合泡材,存在具有由中空無機粒子構成之發泡結構之複合泡材、及具有由中空有機粒子構成之發泡結構之複合泡材,就柔軟性之觀點而言,具有由中空有機粒子構成之發泡結構之複合泡材較佳。The above-mentioned foam base material only needs to have a bubble structure, and the manufacturing method is not particularly limited. Examples of methods for producing the foam base material include a method of producing the foam base material by the action of a foaming gas, or a method of producing the foam base material by blending hollow spheres into a raw material matrix. Among them, the foam produced by the latter method is called composite foam (syntactic foam). In terms of superior impact resistance and heat resistance, it is preferable that the foam base material is a composite foam. By using the foam base material as a composite foam, it is possible to obtain an independent cell type foam with a uniform size distribution of the foamed cells. Therefore, the density of the entire foam base material becomes more constant and can be further improved. Impact resistance. In addition, compared with other foams, composite foam is less prone to irreversible collapse at high temperatures and high pressures, so it shows higher heat resistance. As composite foam materials, there are composite foam materials having a foam structure composed of hollow inorganic particles, and composite foam materials having a foam structure composed of hollow organic particles. From the perspective of softness, composite foam materials having a foam structure composed of hollow organic particles Composite foam materials with a foamed structure are preferred.

作為上述中空有機微粒子,例如可列舉Expancel DU Series(Japan Fillite公司製)、ADVANCELL EM Series(積水化學工業公司製)等。其中,就容易將發泡後之氣室徑設計於效果更高之區域之方面而言,較佳為Expancel461-20(最佳條件下之發泡後平均氣室徑為20 μm)、Expancel461-40(最佳條件下之發泡後平均氣室徑為40 μm)、Expancel043-80(最佳條件下之發泡後平均氣室徑為80 μm)、ADVANCELL EML101(最佳條件下之發泡後平均氣室徑為50 μm)。Examples of the hollow organic fine particles include Expancel DU Series (manufactured by Japan Fillite Co., Ltd.), ADVANCELL EM Series (manufactured by Sekisui Chemical Industry Co., Ltd.), and the like. Among them, Expancel461-20 (the average air chamber diameter after foaming under optimal conditions is 20 μm) and Expancel461- are preferred because it is easy to design the air chamber diameter after foaming in an area with higher effect 40 (the average air chamber diameter after foaming under the best conditions is 40 μm), Expancel043-80 (the average air chamber diameter after foaming under the best conditions is 80 μm), ADVANCELL EML101 (the average air chamber diameter after foaming under the best conditions The average air chamber diameter is 50 μm).

上述發泡體基材由上述複合泡材以外之發泡體構成之情形時之發泡劑並無特別限定,能夠使用熱分解型發泡劑等以往公知之發泡劑。When the foam base material is composed of a foam other than the composite foam, the foaming agent is not particularly limited, and conventionally known foaming agents such as thermal decomposition foaming agents can be used.

上述黏著劑層並無特別限定,例如可列舉:丙烯酸黏著劑層、橡膠系黏著劑層、胺酯黏著劑層、聚矽氧系黏著劑層等。其中,就耐熱性優異、可接著於多種被接著體之方面而言,較佳為含有丙烯酸共聚物之丙烯酸黏著劑層。The above-mentioned adhesive layer is not particularly limited, and examples include an acrylic adhesive layer, a rubber-based adhesive layer, a urethane adhesive layer, a polysiloxane-based adhesive layer, and the like. Among them, an acrylic adhesive layer containing an acrylic copolymer is preferred because it has excellent heat resistance and can be adhered to a variety of adherends.

就因初始之黏性提高故而低溫時之易貼附性良好之觀點而言,構成上述丙烯酸黏著劑層之丙烯酸共聚物較佳為將含有丙烯酸丁酯及/或丙烯酸-2-乙基己酯之單體混合物進行共聚而獲得。其中,更佳為將含有丙烯酸丁酯及丙烯酸-2-乙基己酯之單體混合物進行共聚而獲得。 上述丙烯酸丁酯於總單體混合物中所占之含量之較佳之下限為40重量%,較佳之上限為80重量%。藉由將上述丙烯酸丁酯之含量設為上述範圍,可兼顧較高之黏著力及黏性。 上述丙烯酸-2-乙基己酯於總單體混合物中所占之含量之較佳之下限為10重量%,較佳之上限為100重量%,更佳之下限為30重量%,更佳之上限為80重量%,進而較佳之下限為50重量%,進而較佳之上限為60重量%。藉由將上述丙烯酸-2-乙基己酯之含量設為上述範圍,能夠發揮較高之黏著力。From the viewpoint of good adhesion at low temperatures due to improved initial viscosity, the acrylic copolymer constituting the acrylic adhesive layer preferably contains butyl acrylate and/or 2-ethylhexyl acrylate. Obtained by copolymerization of monomer mixture. Among them, it is more preferable to obtain it by copolymerizing a monomer mixture containing butyl acrylate and 2-ethylhexyl acrylate. The preferred lower limit of the content of the above-mentioned butyl acrylate in the total monomer mixture is 40% by weight, and the preferred upper limit is 80% by weight. By setting the content of butyl acrylate within the above range, both high adhesive force and viscosity can be achieved. The preferred lower limit of the content of the above-mentioned 2-ethylhexyl acrylate in the total monomer mixture is 10% by weight, the preferred upper limit is 100% by weight, the preferred lower limit is 30% by weight, and the preferred upper limit is 80% by weight. %, a further preferable lower limit is 50 wt%, and a further preferable upper limit is 60 wt%. By setting the content of the 2-ethylhexyl acrylate within the above range, high adhesive force can be exerted.

上述單體混合物亦可視需要含有除丙烯酸丁酯及丙烯酸-2-乙基己酯以外之可共聚之其他聚合性單體。作為上述可共聚之其他聚合性單體,例如可列舉:烷基之碳數為1~3之(甲基)丙烯酸烷基酯、烷基之碳數為13~18之(甲基)丙烯酸烷基酯、官能性單體等。 作為上述烷基之碳數為1~3之(甲基)丙烯酸烷基酯,例如可列舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丙酯、(甲基)丙烯酸異丙酯等。作為上述烷基之碳數為13~18之(甲基)丙烯酸烷基酯,例如可列舉:甲基丙烯酸十三烷基酯、(甲基)丙烯酸硬脂酯等。作為上述官能性單體,例如可列舉:(甲基)丙烯酸羥烷基酯、甘油二甲基丙烯酸酯、(甲基)丙烯酸環氧丙酯、異氰酸2-甲基丙烯醯氧基乙酯、(甲基)丙烯酸、伊康酸、順丁烯二酸酐、丁烯酸、順丁烯二酸、反丁烯二酸等。The above-mentioned monomer mixture may also contain other copolymerizable polymerizable monomers other than butyl acrylate and 2-ethylhexyl acrylate if necessary. Examples of other copolymerizable polymerizable monomers include alkyl (meth)acrylate whose alkyl group has 1 to 3 carbon atoms, and alkyl (meth)acrylate whose alkyl group has 13 to 18 carbon atoms. esters, functional monomers, etc. Examples of the (meth)acrylic acid alkyl ester in which the alkyl group has 1 to 3 carbon atoms include: (meth)acrylic acid methyl ester, (meth)acrylic acid ethyl ester, (meth)acrylic acid n-propyl ester, Isopropyl (meth)acrylate, etc. Examples of the (meth)acrylic acid alkyl ester in which the alkyl group has 13 to 18 carbon atoms include tridecyl methacrylate, stearyl (meth)acrylate, and the like. Examples of the functional monomer include: (meth)hydroxyalkyl acrylate, glycerol dimethacrylate, glycidyl (meth)acrylate, and 2-methacryloyloxyethyl isocyanate. Ester, (meth)acrylic acid, itaconic acid, maleic anhydride, crotonic acid, maleic acid, fumaric acid, etc.

為了將上述單體混合物進行共聚而獲得上述丙烯酸共聚物,只要使上述單體混合物於存在聚合起始劑之條件下進行自由基反應即可。作為使上述單體混合物進行自由基反應之方法、即、聚合方法,可使用以往公知之方法,例如可列舉:溶液聚合(沸點聚合或恆溫聚合)、乳化聚合、懸浮聚合、塊狀聚合等。In order to copolymerize the above-mentioned monomer mixture to obtain the above-mentioned acrylic copolymer, it is only necessary to subject the above-mentioned monomer mixture to a free radical reaction in the presence of a polymerization initiator. As a method of radically reacting the monomer mixture, that is, a polymerization method, conventionally known methods can be used, and examples thereof include solution polymerization (boiling point polymerization or isothermal polymerization), emulsion polymerization, suspension polymerization, block polymerization, and the like.

上述丙烯酸共聚物之重量平均分子量(Mw)之較佳之下限為40萬,較佳之上限為150萬。藉由將上述丙烯酸共聚物之重量平均分子量設為上述範圍,能夠發揮較高之黏著力。就進一步提高黏著力之觀點而言,上述重量平均分子量之更佳之下限為50萬,更佳之上限為140萬。 再者,重量平均分子量(Mw)係指利用GPC(Gel Permeation Chromatography:凝膠滲透層析法)所得之以標準聚苯乙烯換算之重量平均分子量。The preferred lower limit of the weight average molecular weight (Mw) of the acrylic copolymer is 400,000, and the preferred upper limit is 1.5 million. By setting the weight average molecular weight of the acrylic copolymer to the above range, high adhesive force can be exerted. From the viewpoint of further improving the adhesive force, a more preferable lower limit of the weight average molecular weight is 500,000, and a more preferable upper limit is 1.4 million. In addition, the weight average molecular weight (Mw) refers to the weight average molecular weight converted to standard polystyrene obtained by GPC (Gel Permeation Chromatography).

上述丙烯酸共聚物之重量平均分子量(Mw)相對於數量平均分子量(Mn)之比(Mw/Mn)之較佳之上限為10.0。若Mw/Mn為10.0以下,則低分子成分之比率得以被抑制、上述黏著劑層於高溫軟化、體強度降低而接著強度降低之現象得以被抑制。就相同之觀點而言,Mw/Mn之更佳之上限為5.0,進而較佳之上限為3.0。A preferable upper limit of the ratio (Mw/Mn) of the weight average molecular weight (Mw) to the number average molecular weight (Mn) of the acrylic copolymer is 10.0. If Mw/Mn is 10.0 or less, the ratio of low molecular components can be suppressed, and the phenomenon of softening of the adhesive layer at high temperatures, lowering of bulk strength, and subsequent lowering of strength can be suppressed. From the same point of view, a more preferable upper limit of Mw/Mn is 5.0, and a further preferable upper limit is 3.0.

上述黏著劑層亦可含有黏著賦予樹脂。 作為上述黏著賦予樹脂,例如可列舉:松香酯系樹脂、氫化松香系樹脂、萜烯系樹脂、萜酚系樹脂、薰草哢-茚系樹脂、脂環族飽和烴系樹脂、C5系石油樹脂、C9系石油樹脂、C5-C9共聚系石油樹脂等。該等黏著賦予樹脂可單獨使用,亦可併用2種以上。The adhesive layer may contain an adhesive imparting resin. Examples of the above-mentioned tackifier-imparting resin include rosin ester resin, hydrogenated rosin resin, terpene resin, terpenol resin, lavenderine-indene resin, alicyclic saturated hydrocarbon resin, and C5 petroleum resin. , C9 series petroleum resin, C5-C9 copolymer series petroleum resin, etc. These adhesion-imparting resins may be used alone, or two or more types may be used in combination.

上述黏著賦予樹脂之含量並無特別限定,相對於成為上述黏著劑層主成分之樹脂(例如丙烯酸共聚物)100重量份,較佳之下限為10重量份,較佳之上限為60重量份。若上述黏著賦予樹脂之含量為10重量份以上,則可抑制上述黏著劑層之黏著力之降低。若上述黏著賦予樹脂之含量為60重量份以下,則可抑制因上述黏著劑層變硬而引起之黏著力或黏性降低。The content of the adhesion-imparting resin is not particularly limited, but a preferred lower limit is 10 parts by weight and a preferred upper limit is 60 parts by weight based on 100 parts by weight of the resin (for example, acrylic copolymer) that is the main component of the adhesive layer. If the content of the adhesive imparting resin is 10 parts by weight or more, the reduction in the adhesive force of the adhesive layer can be suppressed. If the content of the adhesive imparting resin is 60 parts by weight or less, the decrease in adhesive force or viscosity caused by hardening of the adhesive layer can be suppressed.

上述黏著劑層較佳為藉由添加交聯劑而於構成上述黏著劑層之樹脂(例如上述丙烯酸共聚物、上述黏著賦予樹脂等)之主鏈間形成有交聯結構。上述交聯劑並無特別限定,例如可列舉:異氰酸酯系交聯劑、氮丙啶系交聯劑、環氧系交聯劑、金屬螯合物型交聯劑等。其中,較佳為異氰酸酯系交聯劑。藉由於上述黏著劑層中添加異氰酸酯系交聯劑,使異氰酸酯系交聯劑之異氰酸基與構成上述黏著劑層之樹脂(例如上述丙烯酸共聚物、上述黏著賦予樹脂等)中之醇性羥基進行反應,而使上述黏著劑層交聯。若於構成上述黏著劑層之樹脂之主鏈間形成交聯結構,則上述黏著劑層可使間斷地施加之剝離應力分散,黏著帶之黏著力進一步提高。上述交聯劑之添加量相對於成為上述黏著劑層主成分之樹脂(例如上述丙烯酸共聚物)100重量份,較佳為0.01~10重量份,更佳為0.1~7重量份。The adhesive layer preferably has a cross-linked structure formed between the main chains of the resin constituting the adhesive layer (for example, the acrylic copolymer, the adhesion-imparting resin, etc.) by adding a cross-linking agent. The cross-linking agent is not particularly limited, and examples thereof include isocyanate-based cross-linking agents, aziridine-based cross-linking agents, epoxy-based cross-linking agents, metal chelate-type cross-linking agents, and the like. Among them, an isocyanate cross-linking agent is preferred. By adding an isocyanate cross-linking agent to the above-mentioned adhesive layer, the isocyanate group of the isocyanate-based cross-linking agent and the alcohol in the resin constituting the above-mentioned adhesive layer (such as the above-mentioned acrylic copolymer, the above-mentioned tackifying resin, etc.) The hydroxyl groups react to cross-link the adhesive layer. If a cross-linked structure is formed between the main chains of the resin constituting the adhesive layer, the adhesive layer can disperse the peeling stress applied intermittently, and the adhesive force of the adhesive tape can be further improved. The amount of the crosslinking agent added is preferably 0.01 to 10 parts by weight, more preferably 0.1 to 7 parts by weight relative to 100 parts by weight of the resin (for example, the acrylic copolymer) that is the main component of the adhesive layer.

為了提高黏著力,上述黏著劑層亦可含有矽烷偶合劑。上述矽烷偶合劑並無特別限定,例如可列舉:環氧基矽烷類、丙烯酸矽烷類、甲基丙烯酸矽烷類、胺基矽烷類、異氰酸基矽烷類等。In order to improve the adhesion, the above-mentioned adhesive layer may also contain a silane coupling agent. The silane coupling agent is not particularly limited, and examples thereof include epoxy silanes, acrylic silanes, methacrylic silanes, amino silanes, isocyanato silanes, and the like.

為了賦予遮光性,上述黏著劑層亦可含有著色材。上述著色材並無特別限定,例如可列舉:碳黑、苯胺黑、氧化鈦等。其中,就相對廉價且化學性穩定之方面而言,較佳為碳黑。 上述黏著劑層亦可視需要含有無機微粒子、導電微粒子、抗氧化劑、發泡劑、有機填充劑、無機填充劑等以往公知之微粒子及添加劑。In order to impart light-shielding properties, the adhesive layer may contain a coloring material. The coloring material is not particularly limited, and examples thereof include carbon black, aniline black, titanium oxide, and the like. Among them, carbon black is preferred in terms of being relatively cheap and chemically stable. The above-mentioned adhesive layer may optionally contain conventionally known microparticles and additives such as inorganic microparticles, conductive microparticles, antioxidants, foaming agents, organic fillers, and inorganic fillers.

上述黏著劑層之厚度並無特別限定,較佳之下限為0.01 mm,較佳之上限為0.1 mm。藉由將上述黏著劑層之厚度設為上述範圍,能夠將本發明之黏著帶適宜地用於可攜式電子機器零件、車載用電子機器零件等之固定。就能夠更適合用於上述零件等之固定之觀點而言,上述黏著劑層之厚度之更佳之下限為0.015 mm,更佳之上限為0.09 mm。The thickness of the above-mentioned adhesive layer is not particularly limited, with a preferred lower limit being 0.01 mm and a preferred upper limit being 0.1 mm. By setting the thickness of the adhesive layer within the above range, the adhesive tape of the present invention can be suitably used for fixing portable electronic device parts, vehicle-mounted electronic device parts, and the like. From the viewpoint of being more suitable for fixing the above-mentioned parts, etc., a better lower limit of the thickness of the above-mentioned adhesive layer is 0.015 mm, and a better upper limit is 0.09 mm.

本發明之黏著帶較佳為於上述發泡體基材之至少一面具有樹脂層。 藉由具有上述樹脂層,所獲得之黏著帶之強度提高,故而能夠進一步提高耐衝擊性,特別是能夠提高反覆施加衝擊時之耐久性(翻滾(tumble)性)。上述樹脂層可形成於上述發泡體基材之單面,亦可形成於上述發泡體基材之兩面,較佳為形成於發泡體基材之單面。The adhesive tape of the present invention preferably has a resin layer on at least one side of the foam base material. By having the above-mentioned resin layer, the strength of the obtained adhesive tape is improved, and therefore the impact resistance can be further improved. In particular, the durability (tumble resistance) when impacts are repeatedly applied can be improved. The above-mentioned resin layer may be formed on one side of the above-mentioned foam base material, or may be formed on both sides of the above-mentioned foam base material. It is preferably formed on one side of the above-mentioned foam base material.

構成上述樹脂層之樹脂較佳為具有耐熱性。作為具有耐熱性之構成上述樹脂層之樹脂,例如可列舉:聚對苯二甲酸乙二酯等聚酯系樹脂、丙烯酸系樹脂、聚矽氧樹脂、酚樹脂、聚醯亞胺、聚碳酸酯等。其中,就可獲得柔軟性優異之黏著帶之方面而言,較佳為丙烯酸系樹脂、聚酯系樹脂,更佳為聚對苯二甲酸乙二酯。The resin constituting the above resin layer preferably has heat resistance. Examples of the heat-resistant resin constituting the resin layer include polyester resins such as polyethylene terephthalate, acrylic resins, polysilicone resins, phenol resins, polyimide, and polycarbonate. wait. Among them, in terms of obtaining an adhesive tape with excellent flexibility, acrylic resin and polyester resin are preferred, and polyethylene terephthalate is more preferred.

上述樹脂層亦可進行著色。藉由將上述樹脂層著色,可對黏著帶賦予遮光性。 作為將上述樹脂層著色之方法並無特別限定,例如將碳黑、氧化鈦等粒子或微細之氣泡混練至構成上述樹脂層之樹脂之方法、於上述樹脂層之表面塗佈油墨之方法等。The above-mentioned resin layer may also be colored. By coloring the resin layer, light-shielding properties can be imparted to the adhesive tape. The method for coloring the resin layer is not particularly limited, and examples include kneading particles such as carbon black and titanium oxide or fine bubbles into the resin constituting the resin layer, and applying ink to the surface of the resin layer.

上述樹脂層亦可視需要含有無機微粒子、導電微粒子、塑化劑、黏著賦予劑、紫外線吸收劑、抗氧化劑、發泡劑、有機填充劑、無機填充劑等以往公知之微粒子及添加劑。The above-mentioned resin layer may optionally contain conventionally known fine particles and additives such as inorganic fine particles, conductive fine particles, plasticizers, adhesion-imparting agents, ultraviolet absorbers, antioxidants, foaming agents, organic fillers, inorganic fillers, and the like.

上述樹脂層之厚度並無特別限定,較佳之下限為5 μm,較佳之上限為100 μm。藉由將上述樹脂層之厚度設為上述範圍,可兼顧黏著帶之操作性與耐衝擊性。就進一步兼顧操作性與耐衝擊性之觀點而言,上述樹脂層之厚度之更佳之下限為10 μm,更佳之上限為70 μm。The thickness of the above-mentioned resin layer is not particularly limited, but a preferred lower limit is 5 μm and a preferred upper limit is 100 μm. By setting the thickness of the resin layer within the above range, both the operability and impact resistance of the adhesive tape can be achieved. From the viewpoint of further balancing operability and impact resistance, a more preferable lower limit of the thickness of the resin layer is 10 μm, and a more preferable upper limit is 70 μm.

本發明之黏著帶亦可視需要具有除上述發泡體基材、上述黏著劑層及上述樹脂層以外之其他層。The adhesive tape of the present invention may also have other layers other than the above-mentioned foam base material, the above-mentioned adhesive layer and the above-mentioned resin layer if necessary.

本發明之黏著帶較佳為黏著劑層之厚度與發泡體基材之厚度之比(黏著劑層厚度/發泡體基材厚度)為0.1以上2以下。藉由使黏著劑層與發泡體基材之厚度之比為上述範圍,所獲得之黏著帶整體之強度提高,因此可進一步提高耐衝擊性。上述黏著劑層之厚度與發泡體基材之厚度之比更佳為0.15以上,更佳為1.2以下。再者,上述黏著劑層之厚度係指兩面之黏著劑層之合計厚度。The adhesive tape of the present invention preferably has a ratio of the thickness of the adhesive layer to the thickness of the foam base material (thickness of the adhesive layer/thickness of the foam base material) of 0.1 or more and 2 or less. By setting the ratio of the thickness of the adhesive layer to the foam base material within the above range, the strength of the entire adhesive tape obtained is increased, and therefore the impact resistance can be further improved. The ratio of the thickness of the adhesive layer to the thickness of the foam base material is more preferably 0.15 or more, and more preferably 1.2 or less. Furthermore, the thickness of the adhesive layer mentioned above refers to the total thickness of the adhesive layers on both sides.

本發明之黏著帶之厚度並無特別限定,較佳之下限為0.04 mm,更佳之下限為0.05 mm,較佳之上限為2 mm,更佳之上限為1.5 mm。藉由將本發明之黏著帶之厚度設為上述範圍,可製成操作性優異之黏著帶。The thickness of the adhesive tape of the present invention is not particularly limited. The preferred lower limit is 0.04 mm, the more preferred lower limit is 0.05 mm, the preferred upper limit is 2 mm, and the more preferred upper limit is 1.5 mm. By setting the thickness of the adhesive tape of the present invention within the above range, an adhesive tape having excellent workability can be produced.

作為本發明之黏著帶之製造方法,並無特別限定,例如可列舉如下方法。首先,於脫模膜上塗佈黏著劑溶液,使其乾燥而形成黏著劑層,利用相同之方法形成第2個黏著劑層。繼而,利用上述方法製造未發泡體基材,於上述未發泡體基材上積層上述樹脂層而形成積層體。其後,使所獲得之黏著劑層貼合於所獲得之積層體之兩面,藉由加熱使未發泡基材發泡而製造黏著帶。The manufacturing method of the adhesive tape of the present invention is not particularly limited, and examples thereof include the following methods. First, apply an adhesive solution on the release film and let it dry to form an adhesive layer. Use the same method to form a second adhesive layer. Next, an unfoamed base material is produced by the above-mentioned method, and the above-mentioned resin layer is laminated on the above-mentioned unfoamed base material to form a laminated body. Thereafter, the obtained adhesive layer is bonded to both sides of the obtained laminate, and the unfoamed base material is foamed by heating to produce an adhesive tape.

本發明之黏著帶之形狀並無特別限定,可列舉長方形、邊框狀、圓形、橢圓形、甜甜圈型等。The shape of the adhesive tape of the present invention is not particularly limited, and examples thereof include rectangular, frame-shaped, circular, oval, donut-shaped, and the like.

本發明之黏著帶藉由使用上述嵌段共聚物作為發泡體基材,可發揮優異之柔軟性、耐衝擊性及耐熱性。另一方面,本發明者等人經研究後發現,於上述發泡體基材為含有上述來自乙烯基芳香族化合物單體之結構、上述來自具有交聯性官能基之單體之結構及上述來自(甲基)丙烯酸系單體之結構之無規共聚物之情形時,亦可發揮優異之柔軟性、耐衝擊性及耐熱性。認為其原因可能在於在奈米等級或分子等級之類的極小之尺度中起到與上述相分離結構相同之相互作用。再者,於本說明書中,來自(甲基)丙烯酸系單體之結構係指如下述通式(5)、(6)所示之結構。The adhesive tape of the present invention can exhibit excellent flexibility, impact resistance and heat resistance by using the above-mentioned block copolymer as a foam base material. On the other hand, the present inventors discovered after research that the above-mentioned foam base material contains the above-mentioned structure derived from the vinyl aromatic compound monomer, the above-mentioned structure derived from the monomer having a crosslinkable functional group, and the above-mentioned structure. In the case of a random copolymer derived from a (meth)acrylic monomer structure, it can also exhibit excellent flexibility, impact resistance and heat resistance. It is thought that the reason for this may be that the same interaction as the above-mentioned phase separation structure occurs at extremely small scales such as nanometer level or molecular level. In addition, in this specification, the structure derived from a (meth)acrylic acid-type monomer means the structure represented by the following general formula (5), (6).

此處,R3 表示側鏈。作為側鏈R3 ,可列舉:甲基、乙基、丙基、丁基、戊基、己基、庚基、辛基、2-乙基己基、壬基、癸基、十二烷基、月桂基、異硬脂基等。 Here, R 3 represents a side chain. Examples of side chain R 3 include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, 2-ethylhexyl, nonyl, decyl, dodecyl, and lauryl base, isostearyl base, etc.

因此,本發明亦提供一種黏著帶,其於發泡體基材之兩面具有黏著劑層,上述發泡體基材含有共聚物,上述共聚物具有來自乙烯基芳香族化合物單體之結構、來自具有交聯性官能基之單體之結構及來自(甲基)丙烯酸系單體之結構。Therefore, the present invention also provides an adhesive tape having adhesive layers on both sides of a foam base material, the foam base material containing a copolymer, and the copolymer having a structure derived from a vinyl aromatic compound monomer, derived from The structure of the monomer having a cross-linkable functional group and the structure derived from the (meth)acrylic monomer.

作為上述共聚物,並無特別限制,可列舉嵌段共聚物、無規共聚物。其中,軟嵌段(包含上述來自(甲基)丙烯酸系單體之結構之嵌段)與硬嵌段(包含上述來自乙烯基芳香族化合物單體之結構之嵌段)採取不均勻之相分離結構,由於硬嵌段成為擬似交聯點,因此對共聚物賦予橡膠性,就能夠對所獲得之黏著帶賦予較高之柔軟性及耐衝擊性之觀點而言,較佳為嵌段共聚物。嵌段共聚物可列舉二嵌段共聚物、三嵌段共聚物、接枝共聚物等,就上述層分離形成之觀點而言,較佳為二嵌段共聚物、三嵌段共聚物,更佳為三嵌段共聚物。The copolymer is not particularly limited, and examples thereof include block copolymers and random copolymers. Among them, the soft block (including the block derived from the above-mentioned structure of the (meth)acrylic monomer) and the hard block (including the above-mentioned block derived from the structure of the vinyl aromatic compound monomer) adopt uneven phase separation. Since the hard blocks serve as pseudo-crosslinking points, the copolymer is given rubbery properties and can impart high flexibility and impact resistance to the obtained adhesive tape. Block copolymers are preferred. . Examples of block copolymers include diblock copolymers, triblock copolymers, and graft copolymers. From the viewpoint of formation of the above-mentioned layer separation, diblock copolymers and triblock copolymers are preferred, and more preferably Preferred are triblock copolymers.

於上述共聚物為嵌段共聚物之情形時,嵌段共聚物較佳為含有1重量%以上40重量%以下之上述硬嵌段。藉由將上述硬嵌段之含量設為上述範圍,能夠形成柔軟性、耐衝擊性及耐熱性優異之發泡體基材。就進一步提高柔軟性、耐衝擊性及耐熱性之觀點而言,上述硬嵌段之含量之更佳之下限為2重量%,進而較佳之下限為2.5重量%,特佳之下限為3重量%,更佳之上限為35%,進而較佳之上限為30%,更佳之上限為26重量%,進而較佳之上限為20重量%,特佳之上限為17重量%,極佳之上限為8重量%。When the copolymer is a block copolymer, the block copolymer preferably contains 1% by weight or more and 40% by weight or less of the hard block. By setting the content of the hard block within the above range, a foam base material excellent in flexibility, impact resistance, and heat resistance can be formed. From the viewpoint of further improving softness, impact resistance and heat resistance, a more preferable lower limit of the content of the hard block is 2 wt%, a further preferable lower limit is 2.5 wt%, a particularly preferable lower limit is 3 wt%, and more A preferable upper limit is 35%, a further preferable upper limit is 30%, a further preferable upper limit is 26 wt%, a further preferable upper limit is 20 wt%, a particularly preferable upper limit is 17 wt%, and an excellent upper limit is 8 wt%.

於上述共聚物為嵌段共聚物之情形時,嵌段共聚物之重量平均分子量較佳為50000~800000。 藉由使嵌段共聚物之重量平均分子量為上述範圍,能夠進一步提高柔軟性、耐衝擊性及耐熱性。上述嵌段共聚物之重量平均分子量之更佳之下限為75000,更佳之上限為600000。When the above-mentioned copolymer is a block copolymer, the weight average molecular weight of the block copolymer is preferably 50,000 to 800,000. By setting the weight average molecular weight of the block copolymer within the above range, flexibility, impact resistance, and heat resistance can be further improved. A more preferable lower limit of the weight average molecular weight of the above-mentioned block copolymer is 75,000, and a more preferable upper limit is 600,000.

為了獲得上述嵌段共聚物,只要使硬嵌段及軟嵌段之原料單體於存在聚合起始劑之條件下分別進行自由基反應而獲得硬嵌段及軟嵌段後,使兩者進行反應或共聚,或者於利用上述方法獲得硬嵌段後,繼而投入軟嵌段之原料單體進行共聚即可。作為使上述自由基反應進行之方法、即、聚合方法,可使用以往公知之方法,例如可列舉:溶液聚合(沸點聚合或恆溫聚合)、乳化聚合、懸浮聚合、塊狀聚合等。In order to obtain the above block copolymer, the raw material monomers of the hard block and the soft block are subjected to free radical reactions respectively in the presence of a polymerization initiator to obtain the hard block and the soft block, and then the two are reacted Reaction or copolymerization, or after obtaining the hard block by the above method, then adding the raw material monomers of the soft block for copolymerization. As a method for advancing the radical reaction, that is, a polymerization method, conventionally known methods can be used, and examples thereof include solution polymerization (boiling point polymerization or isothermal polymerization), emulsion polymerization, suspension polymerization, block polymerization, and the like.

關於上述乙烯基芳香族化合物單體,並無特別限定,例如可列舉:苯乙烯、α-甲基苯乙烯、對甲基苯乙烯、氯苯乙烯等。其中,就進一步使耐衝擊性提高之方面而言,較佳為苯乙烯。The vinyl aromatic compound monomer is not particularly limited, and examples thereof include styrene, α-methylstyrene, p-methylstyrene, chlorostyrene, and the like. Among them, styrene is preferred in terms of further improving impact resistance.

上述共聚物中之上述來自乙烯基芳香族化合物單體之結構之含量較佳為1重量%以上30重量%以下。更佳之下限為1.5重量%,進而較佳之下限為2重量%,特佳之下限為2.5重量%,更佳之上限為24重量%,進而較佳之上限為19重量%,特佳之上限為16重量%,極佳之上限為8重量%。The content of the structure derived from the vinyl aromatic compound monomer in the copolymer is preferably 1% by weight or more and 30% by weight or less. A more preferable lower limit is 1.5 wt%, a further preferable lower limit is 2 wt%, a particularly preferable lower limit is 2.5 wt%, a better upper limit is 24 wt%, a further preferable upper limit is 19 wt%, and a particularly preferable upper limit is 16 wt%. The upper limit of excellence is 8% by weight.

上述具有交聯性官能基之單體並無特別限定,例如可列舉:含羧基單體、含羥基單體、含環氧基單體、含雙鍵單體、含三鍵單體、含胺基單體、含醯胺基單體、含腈基單體等。其中,就進一步使柔軟性及耐衝擊性提高之方面而言,較佳為選自由含羥基單體、含羧基單體、含環氧基單體、含醯胺基單體、含雙鍵單體及含三鍵單體所組成之群中之至少一種。作為含羥基單體,可列舉(甲基)丙烯酸4-羥丁酯、(甲基)丙烯酸2-羥乙酯等。作為上述含羧基單體,可列舉(甲基)丙烯酸等。作為含環氧基單體,可列舉(甲基)丙烯酸環氧丙酯等。作為含醯胺基單體,(可列舉(甲基)丙烯醯胺等。作為含雙鍵單體,可列舉(甲基)丙烯酸烯丙酯、己二醇二(甲基)丙烯酸酯等。作為含三鍵單體,可列舉(甲基)丙烯酸炔丙酯等。該等之中,就能夠對黏著帶賦予更優異之柔軟性及耐衝擊性之方面而言,較佳為含羧基單體,更佳為(甲基)丙烯酸系單體,進而較佳為丙烯酸。The above-mentioned monomers having crosslinkable functional groups are not particularly limited, and examples thereof include: carboxyl-containing monomers, hydroxyl-containing monomers, epoxy-containing monomers, double-bond-containing monomers, triple-bond-containing monomers, and amine-containing monomers. based monomers, amide-containing monomers, nitrile-containing monomers, etc. Among them, in terms of further improving flexibility and impact resistance, it is preferable to be selected from the group consisting of hydroxyl group-containing monomers, carboxyl group-containing monomers, epoxy group-containing monomers, amide group-containing monomers, and double bond-containing monomers. At least one of the group consisting of monomers and monomers containing three bonds. Examples of the hydroxyl-containing monomer include 4-hydroxybutyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, and the like. Examples of the carboxyl group-containing monomer include (meth)acrylic acid and the like. Examples of the epoxy group-containing monomer include glycidyl (meth)acrylate and the like. Examples of the amide group-containing monomer include (meth)acrylamide. Examples of the double bond-containing monomer include allyl (meth)acrylate, hexanediol di(meth)acrylate, and the like. Examples of the triple bond-containing monomer include propargyl (meth)acrylate and the like. Among these, carboxyl group-containing monomers are preferred in terms of being able to impart more excellent flexibility and impact resistance to the adhesive tape. The monomer is preferably a (meth)acrylic monomer, and further preferably acrylic acid.

上述共聚物中之上述來自具有交聯性官能基之單體之結構之含量較佳為0.1重量%以上30重量%以下。更佳之下限為0.5重量%,進而較佳之下限為1重量%,更佳之上限為25重量%,進而較佳之上限為20重量%。The content of the structure derived from the monomer having a crosslinkable functional group in the copolymer is preferably 0.1% by weight or more and 30% by weight or less. A more preferred lower limit is 0.5% by weight, a further preferred lower limit is 1% by weight, a more preferred upper limit is 25% by weight, and a further preferred upper limit is 20% by weight.

上述(甲基)丙烯酸系單體並無特別限定,例如可列舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸-2-乙基己酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸異硬脂酯等。其中,就容易兼顧耐熱性與柔軟性之方面而言,較佳為丙烯酸甲酯、丙烯酸乙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸-2-乙基己酯,進而較佳為丙烯酸甲酯、丙烯酸乙酯、丙烯酸丁酯、丙烯酸-2-乙基己酯。上述(甲基)丙烯酸系單體可為單一種單體,亦可使用複數種單體。又,於不損失本發明之效果之範圍內,亦可使用除(甲基)丙烯酸系單體以外之單體。The (meth)acrylic monomer is not particularly limited, and examples thereof include: (meth)acrylic acid methyl ester, (meth)ethyl acrylate, (meth)acrylic acid propyl ester, (meth)acrylic acid butyl ester, Pentyl (meth)acrylate, Hexyl (meth)acrylate, Heptyl (meth)acrylate, Octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, (meth)acrylic acid Nonyl ester, decyl (meth)acrylate, dodecyl (meth)acrylate, lauryl (meth)acrylate, isostearyl (meth)acrylate, etc. Among them, in terms of easily achieving a balance between heat resistance and flexibility, methyl acrylate, ethyl acrylate, butyl (meth)acrylate, and 2-ethylhexyl (meth)acrylate are preferred, and further preferred It is methyl acrylate, ethyl acrylate, butyl acrylate, and 2-ethylhexyl acrylate. The (meth)acrylic monomer may be a single monomer, or a plurality of monomers may be used. In addition, monomers other than (meth)acrylic monomers may be used within the scope that does not impair the effects of the present invention.

上述共聚物中之上述來自(甲基)丙烯酸系單體之結構之含量只要發揮本發明之效果,則並無特別限定,較佳為30重量%以上99重量%以下,更佳為40重量%以上98重量%以下,進而較佳為50重量%以上97重量%以下。The content of the structure derived from the (meth)acrylic monomer in the copolymer is not particularly limited as long as the effect of the present invention is exerted, but is preferably 30% by weight or more and 99% by weight or less, and more preferably 40% by weight. More than 98% by weight and less, and more preferably 50% by weight and less than 97% by weight.

上述發泡體基材較佳為具有由中空有機微粒子構成之發泡結構之複合泡材。 作為構成上述複合泡材之中空有機微粒子,例如可列舉ExpancelDU Series(Japan Fillite公司製)、ADVANCELLEM Series(積水化學工業公司製)。其中,就容易將發泡後之氣室徑設計於效果更高之區域之方面而言,較佳為Expancel461-20(最佳條件下之發泡後平均氣室徑為20 μm)、Expancel461-40(最佳條件下之發泡後平均氣室徑為40 μm)、Expancel043-80(最佳條件下之發泡後平均氣室徑為80 μm)、ADVANCELL EML101(最佳條件下之發泡後平均氣室徑為50 μm)。The above-mentioned foam base material is preferably a composite foam material having a foam structure composed of hollow organic fine particles. Examples of the hollow organic fine particles constituting the composite foam include ExpancelDU Series (manufactured by Japan Fillite Co., Ltd.) and ADVANCELLEM Series (manufactured by Sekisui Chemical Industry Co., Ltd.). Among them, Expancel461-20 (the average air chamber diameter after foaming under optimal conditions is 20 μm) and Expancel461- are preferred because it is easy to design the air chamber diameter after foaming in an area with higher effect 40 (the average air chamber diameter after foaming under the best conditions is 40 μm), Expancel043-80 (the average air chamber diameter after foaming under the best conditions is 80 μm), ADVANCELL EML101 (the average air chamber diameter after foaming under the best conditions The average air chamber diameter is 50 μm).

上述發泡體基材可使用與採用上述嵌段共聚物之黏著帶之發泡體層相同之添加劑。The above-mentioned foam base material may use the same additives as the foam layer of the adhesive tape using the above-mentioned block copolymer.

上述發泡體基材之視密度較佳為0.3 g/cm3 以上0.75 g/cm3 以下,更佳為0.33 g/cm3 以上0.73 g/cm3 以下,進而較佳為0.35 g/cm3 以上0.71 g/cm3 以下。The apparent density of the above-mentioned foam base material is preferably 0.3 g/cm 3 or more and 0.75 g/cm 3 or less, more preferably 0.33 g/cm 3 or more and 0.73 g/cm 3 or less, still more preferably 0.35 g/cm 3 Above 0.71 g/ cm3 and below.

上述發泡體基材之凝膠分率較佳為90%以下,更佳為85%以下,進而較佳為80%以下。上述凝膠分率之下限並無特別限定,例如為10%以上,極佳為20%以上,特佳為35%以上。The gel fraction of the foam base material is preferably 90% or less, more preferably 85% or less, and still more preferably 80% or less. The lower limit of the above-mentioned gel fraction is not particularly limited, but for example, it is 10% or more, excellent is 20% or more, and particularly optimal is 35% or more.

上述發泡體基材之氣泡之平均氣泡徑較佳為80 μm以下,更佳為60 μm以下,進而較佳為55 μm以下。上述氣泡之平均氣泡徑較佳為20 μm以上。The average cell diameter of the cells in the foam base material is preferably 80 μm or less, more preferably 60 μm or less, and still more preferably 55 μm or less. The average bubble diameter of the above-mentioned bubbles is preferably 20 μm or more.

上述發泡體基材之厚度並無特別限定,較佳之下限為40 μm,更佳之下限為60 μm,進而較佳之下限為80 μm,特佳之下限為100 μm,較佳之上限為2900 μm,更佳之上限為1900 μm,進而較佳之上限為1400 μm,特佳之上限為1000 μm。The thickness of the above-mentioned foam base material is not particularly limited. The preferred lower limit is 40 μm, the more preferred lower limit is 60 μm, the preferred lower limit is 80 μm, the particularly preferred lower limit is 100 μm, the preferred upper limit is 2900 μm, and more A preferred upper limit is 1900 μm, a further preferred upper limit is 1400 μm, and a particularly preferred upper limit is 1000 μm.

作為製造上述共聚物之方法,例如只要使混合有乙烯基芳香族化合物單體、具有交聯性官能基之單體、(甲基)丙烯酸系單體及視需要之其他單體之溶液於存在聚合起始劑之條件下進行自由基反應即可。作為使上述自由基反應進行之方法,可使用以往公知之方法,例如可列舉:溶液聚合(沸點聚合或恆溫聚合)、乳化聚合、懸浮聚合、塊狀聚合等。As a method of producing the above-mentioned copolymer, for example, a solution in which a vinyl aromatic compound monomer, a monomer having a crosslinkable functional group, a (meth)acrylic monomer, and other monomers if necessary are mixed is present. The free radical reaction can be carried out under the conditions of polymerization initiator. As a method for advancing the radical reaction, conventionally known methods can be used, and examples thereof include solution polymerization (boiling point polymerization or constant temperature polymerization), emulsion polymerization, suspension polymerization, block polymerization, and the like.

上述發泡體基材之製造方法並無特別限定,例如可列舉如下方法:首先,於上述共聚物之溶液中添加發泡劑加以混合,塗佈成所需形狀,使其乾燥形成未發泡基材,於其後加熱所獲得之未發泡基材而使發泡劑發泡。又,於上述發泡體基材為複合泡材之情形時,可列舉於上述共聚物之溶液中添加上述中空有機微粒子加以混合,塗佈成所需形狀,使其乾燥之方法等。The manufacturing method of the above-mentioned foam base material is not particularly limited. For example, the following method can be cited: first, add a foaming agent to the solution of the above-mentioned copolymer, mix it, apply it into a desired shape, and dry it to form an unfoamed product. The base material is then heated to cause the foaming agent to foam. When the foam base material is a composite foam, the hollow organic fine particles are added to a solution of the copolymer, mixed, coated into a desired shape, and dried.

上述黏著帶較佳為於上述發泡體基材之至少一面具有樹脂層。 構成上述樹脂層之樹脂較佳為具有耐熱性,例如可列舉:聚對苯二甲酸乙二酯等聚酯系樹脂、丙烯酸系樹脂、聚矽氧樹脂、酚樹脂、聚醯亞胺、聚碳酸酯等。其中,就可獲得柔軟性優異之黏著帶之方面而言,較佳為丙烯酸系樹脂、聚酯系樹脂,更佳為聚對苯二甲酸乙二酯。The adhesive tape preferably has a resin layer on at least one side of the foam base material. The resin constituting the above-mentioned resin layer is preferably heat-resistant, and examples thereof include polyester resins such as polyethylene terephthalate, acrylic resins, polysilicone resins, phenol resins, polyimide, and polycarbonate. Ester etc. Among them, in terms of obtaining an adhesive tape with excellent flexibility, acrylic resin and polyester resin are preferred, and polyethylene terephthalate is more preferred.

上述樹脂層之厚度並無特別限定,較佳之下限為5 μm,更佳之下限為10 μm,較佳之上限為100 μm,更佳之上限為70 μm。The thickness of the above-mentioned resin layer is not particularly limited. A preferred lower limit is 5 μm, a more preferred lower limit is 10 μm, a preferred upper limit is 100 μm, and a more preferred upper limit is 70 μm.

上述黏著劑層可使用與採用上述嵌段共聚物之黏著帶之黏著劑層相同之類型。The above-mentioned adhesive layer may be of the same type as the adhesive layer of the adhesive tape using the above-mentioned block copolymer.

本發明之黏著帶之用途並無特別限定,由於柔軟性、耐衝擊性及耐熱性優異,因此適宜用作用以固定可攜式電子機器零件、車載用電子機器零件等電子零件之耐衝擊性黏著帶。此種用於電子零件之固定之本發明之黏著帶亦為本發明之一。 [發明之效果]The use of the adhesive tape of the present invention is not particularly limited. Since it has excellent flexibility, impact resistance and heat resistance, it is suitable for use as an impact-resistant adhesive for fixing electronic parts such as portable electronic equipment parts and vehicle-mounted electronic equipment parts. belt. The adhesive tape of the present invention used for fixing electronic components is also one of the present invention. [Effects of the invention]

根據本發明,能夠提供一種具有優異之柔軟性及耐衝擊性、同時耐熱性亦優異的黏著帶。According to the present invention, it is possible to provide an adhesive tape that has excellent flexibility and impact resistance as well as excellent heat resistance.

以下列舉實施例對本發明之態樣進一步進行詳細說明,但本發明不僅限定於該等實施例。The aspects of the present invention will be further described in detail below with reference to Examples, but the present invention is not limited to these Examples.

(實施例1) (1)未發泡體基材之製造 將1,6-己二硫醇0.902 g、二硫化碳1.83 g、及二甲基甲醯胺11 mL投入二口燒瓶中,於25℃攪拌。歷時15分鐘向其中滴加三乙胺2.49 g,於25℃攪拌3小時。繼而,歷時15分鐘滴加α-溴苯乙酸甲酯2.75 g,於25℃攪拌4小時。其後,於反應液中添加萃取溶劑(正己烷:乙酸乙酯=50:50)100 mL與水50 mL進行分液萃取。將第1次與第2次分液萃取中所獲得之有機層加以混合,依次利用1 M鹽酸50 mL、水50 mL、飽和食鹽水50 mL洗淨。於洗淨後之有機層中添加硫酸鈉進行乾燥後,過濾硫酸鈉,將濾液利用蒸發器濃縮,去除有機溶劑。藉由將所獲得之濃縮物利用矽膠管柱層析法精製,而獲得RAFT劑。(Example 1) (1) Manufacturing of unfoamed base materials Add 0.902 g of 1,6-hexanedithiol, 1.83 g of carbon disulfide, and 11 mL of dimethylformamide into a two-necked flask, and stir at 25°C. 2.49 g of triethylamine was added dropwise over 15 minutes, and the mixture was stirred at 25°C for 3 hours. Then, 2.75 g of α-bromophenylacetic acid methyl ester was added dropwise over 15 minutes, and the mixture was stirred at 25° C. for 4 hours. Thereafter, 100 mL of extraction solvent (n-hexane: ethyl acetate = 50:50) and 50 mL of water were added to the reaction solution to perform liquid separation extraction. The organic layers obtained in the first and second separation extractions were mixed, and washed sequentially with 50 mL of 1 M hydrochloric acid, 50 mL of water, and 50 mL of saturated brine. After adding sodium sulfate to the washed organic layer and drying it, the sodium sulfate was filtered, and the filtrate was concentrated with an evaporator to remove the organic solvent. The RAFT agent is obtained by purifying the obtained concentrate using silica gel column chromatography.

將苯乙烯(St)91.3 g、丙烯酸(AA)8.7 g、RAFT劑1.9 g、及2,2'-偶氮雙(2-甲基丁腈)(ABN-E)0.2 g投入二口燒瓶中,一面對燒瓶內利用氮氣進行置換一面升溫至85℃。其後,於85℃攪拌6小時進行聚合反應(第一階段反應)。 反應結束後,於燒瓶內投入正己烷4000 g,進行攪拌使反應物沈澱後,過濾未反應之單體(St、AA)、及RAFT劑,將反應物於70℃減壓乾燥,獲得共聚物(硬嵌段)。Put 91.3 g of styrene (St), 8.7 g of acrylic acid (AA), 1.9 g of RAFT agent, and 0.2 g of 2,2'-azobis(2-methylbutyronitrile) (ABN-E) into a two-necked flask. , and the temperature was raised to 85°C while replacing the inside of the flask with nitrogen. Thereafter, the mixture was stirred at 85° C. for 6 hours to perform a polymerization reaction (first-stage reaction). After the reaction is completed, add 4000 g of n-hexane into the flask, stir to precipitate the reactant, filter the unreacted monomers (St, AA), and RAFT agent, and dry the reactant under reduced pressure at 70°C to obtain a copolymer. (hard block).

將包含丙烯酸丁酯(BA)100g、0.058 g之ABN-E、及乙酸乙酯50 g之混合物、及上文所獲得之共聚物(硬嵌段)投入二口燒瓶中,一面對燒瓶內利用氮氣進行置換一面升溫至85℃。其後,於85℃攪拌6小時進行聚合反應(第二階段反應),獲得含有由硬嵌段與軟嵌段形成之嵌段共聚物之反應液。再者,混合物(軟嵌段)與硬嵌段之摻合量係使所獲得之嵌段共聚物中之硬嵌段之含量達到17重量%之量。 取一部分之反應液,於其中投入正己烷4000 g,進行攪拌使反應物沈澱後,過濾未反應之單體(BA)及溶劑,將反應物於70℃減壓乾燥,自反應液中取出嵌段共聚物。對於所獲得之嵌段共聚物,利用GPC法測定重量平均分子量,其結果為25萬。使用Water公司製造之「2690 Separations Module」作為測定機器,使用昭和電工公司製造之「GPC KF-806L」作為管柱,使用乙酸乙酯作為溶劑,於樣品流量1 mL/min、管柱溫度40℃之條件下進行測定。Put a mixture containing 100 g of butyl acrylate (BA), 0.058 g of ABN-E, and 50 g of ethyl acetate, and the copolymer (hard block) obtained above into a two-necked flask, with one side facing the inside of the flask. While replacing with nitrogen gas, the temperature was raised to 85°C. Thereafter, the polymerization reaction (second-stage reaction) was performed by stirring at 85°C for 6 hours, and a reaction liquid containing a block copolymer composed of a hard block and a soft block was obtained. Furthermore, the blending amount of the mixture (soft block) and the hard block is such that the content of the hard block in the obtained block copolymer reaches 17% by weight. Take a portion of the reaction solution, add 4000 g of n-hexane into it, stir to precipitate the reactant, filter the unreacted monomer (BA) and solvent, dry the reactant under reduced pressure at 70°C, and take out the embedded solution from the reaction solution. segment copolymer. The weight average molecular weight of the obtained block copolymer was measured by the GPC method, and the result was 250,000. Use "2690 Separations Module" manufactured by Water Corporation as the measurement device, use "GPC KF-806L" manufactured by Showa Denko Corporation as the column, use ethyl acetate as the solvent, and set the sample flow rate to 1 mL/min and the column temperature to 40°C. measured under the conditions.

使所獲得之嵌段共聚物以固形物成分比率成為35%之方式溶解於乙酸乙酯中,對於100重量份之嵌段共聚物A,添加作為發泡劑之Expancel461-40(Japan Fillite公司製,於表中標記為DU40)0.5重量份、作為交聯劑之Tetrad C(三菱瓦斯化學公司製)0.2重量份,進而進行充分攪拌,獲得基材溶液。於單面實施有脫模處理之50 μm之聚對苯二甲酸乙二酯(PET)膜之脫模處理面上塗佈所獲得之基材溶液,使其於90℃乾燥7分鐘,,藉此獲得未發泡體基材。未發泡體基材之厚度係調整為當將未發泡體基材於130℃加熱1分鐘時達到100 μm。The obtained block copolymer was dissolved in ethyl acetate so that the solid content ratio became 35%, and Expancel 461-40 (manufactured by Japan Fillite Co., Ltd.) was added as a foaming agent to 100 parts by weight of the block copolymer A. , marked as DU40 in the table) 0.5 parts by weight, and 0.2 parts by weight of Tetrad C (manufactured by Mitsubishi Gas Chemical Co., Ltd.) as a cross-linking agent, and then stir thoroughly to obtain a base material solution. Coat the obtained base material solution on the release-treated surface of a 50 μm polyethylene terephthalate (PET) film with release treatment on one side, and dry it at 90°C for 7 minutes. This resulted in an unfoamed base material. The thickness of the unfoamed base material was adjusted to reach 100 μm when the unfoamed base material was heated at 130° C. for 1 minute.

(2)黏著劑溶液之製備 於具備溫度計、攪拌機、冷卻管之反應器中添加乙酸乙酯52重量份,進行氮氣置換之後,對反應器進行加熱而開始回流。乙酸乙酯沸騰之後,30分鐘後投入作為聚合起始劑之偶氮二異丁腈0.08重量份。向其中歷時1小時30分鐘均勻且緩慢地滴加由丙烯酸丁酯70重量份、丙烯酸-2-乙基己酯27重量份、丙烯酸3重量份、丙烯酸-2-羥基乙酯0.2重量份構成之單體混合物,使其進行反應。滴加結束30分鐘後添加偶氮二異丁腈0.1重量份,進而使其進行5小時聚合反應,一面於反應器內添加乙酸乙酯進行稀釋一面進行冷卻,藉此獲得固形物成分40重量%之丙烯酸無規共聚物之溶液。 對於所獲得之丙烯酸無規共聚物,使用Water公司製造之「2690 Separations Module」作為管柱,利用GPC法測定重量平均分子量,其結果為71萬。重量平均分子量(Mw)相對於數量平均分子量(Mn)之比(Mw/Mn)為5.5。對所獲得之丙烯酸無規共聚物之固形物成分100重量份,添加軟化點150℃之聚合松香酯15重量份、軟化點145℃之萜酚10重量份、軟化點70℃之松香酯10重量份。進而,添加乙酸乙酯(不二化學藥品公司製)30重量份、異氰酸酯系交聯劑(東曹公司製Coronate L45)3.0重量份,進行攪拌,獲得黏著劑溶液。(2) Preparation of adhesive solution 52 parts by weight of ethyl acetate was added to a reactor equipped with a thermometer, a stirrer, and a cooling tube, and after nitrogen replacement, the reactor was heated to start reflux. After the ethyl acetate boiled, 0.08 parts by weight of azobisisobutyronitrile as a polymerization initiator was added 30 minutes later. A mixture of 70 parts by weight of butyl acrylate, 27 parts by weight of 2-ethylhexyl acrylate, 3 parts by weight of acrylic acid, and 0.2 parts by weight of 2-hydroxyethyl acrylate was added dropwise evenly and slowly over a period of 1 hour and 30 minutes. The monomer mixture is allowed to react. 30 minutes after the completion of the dropwise addition, 0.1 part by weight of azobisisobutyronitrile was added, and the polymerization reaction was continued for 5 hours. Ethyl acetate was added to the reactor to dilute it while cooling, thereby obtaining a solid content of 40% by weight. A solution of acrylic random copolymer. The weight average molecular weight of the obtained acrylic random copolymer was measured by the GPC method using "2690 Separations Module" manufactured by Water Corporation as a column. The result was 710,000. The ratio (Mw/Mn) of the weight average molecular weight (Mw) to the number average molecular weight (Mn) was 5.5. To 100 parts by weight of the solid content of the obtained acrylic random copolymer, 15 parts by weight of polymerized rosin ester with a softening point of 150°C, 10 parts by weight of terpene phenol with a softening point of 145°C, and 10 parts by weight of rosin ester with a softening point of 70°C were added. share. Furthermore, 30 parts by weight of ethyl acetate (manufactured by Fuji Chemical Co., Ltd.) and 3.0 parts by weight of an isocyanate cross-linking agent (Coronate L45 produced by Tosoh Corporation) were added and stirred to obtain an adhesive solution.

(3)黏著帶之製造 利用刮刀將所獲得之黏著劑溶液以乾燥皮膜之厚度成為50 μm之方式塗佈於在單面實施了脫模處理之50 μm之聚對苯二甲酸乙二酯(PET)膜之脫模處理面上,於110℃加熱5分鐘使塗佈溶液乾燥,獲得黏著劑層。繼而,以相同之操作再製造1個黏著劑層,獲得2個黏著劑層。其後,自上文所獲得之未發泡體基材剝離脫模膜,於未發泡體基材之兩面分別貼合所獲得之2個黏著劑層,於40℃之環境下靜置48小時。於48小時後自40℃環境中取出,於130℃加熱1分鐘,藉此使基材發泡,獲得黏著帶。(3) Manufacturing of adhesive tape Use a scraper to apply the obtained adhesive solution to a 50 μm polyethylene terephthalate (PET) film that has been released on one side so that the thickness of the dry film becomes 50 μm. Release treatment On the surface, heat at 110°C for 5 minutes to dry the coating solution to obtain an adhesive layer. Then, use the same operation to create another adhesive layer to obtain two adhesive layers. Thereafter, peel off the release film from the unfoamed base material obtained above, laminate the two adhesive layers obtained on both sides of the unfoamed base material, and let it stand for 48 hours in an environment of 40°C. hours. After 48 hours, take it out from the 40°C environment and heat it at 130°C for 1 minute to foam the base material to obtain an adhesive tape.

(4)帶密度之測定 使用電子比重計(MIRAGE公司製,ED120T)測定所獲得之黏著帶之密度。(4) Determination of belt density The density of the obtained adhesive tape was measured using an electronic hydrometer (ED120T manufactured by Mirage Corporation).

(5)發泡體基材之視密度之測定 依據JISK-6767,使用電子比重計(MIRAGE公司製、ED120T)對所獲得之發泡體基材之密度進行測定。由該結果,將黏著劑之密度視為1.0 g/cm3 ,計算發泡體基材之視密度。(5) Measurement of Apparent Density of Foam Base Material The density of the obtained foam base material was measured using an electronic hydrometer (ED120T manufactured by Mirage Corporation) in accordance with JISK-6767. From this result, the density of the adhesive was regarded as 1.0 g/cm 3 and the apparent density of the foam base material was calculated.

(6)發泡體基材之凝膠分率之測定 自所獲得之黏著帶只取出0.1 g之發泡體基材,浸漬於乙酸乙酯50 ml中,利用振動機於溫度23℃、120 rpm之條件下振動24小時。振動後,使用金屬網(網眼#200 mesh)將乙酸乙酯與吸收乙酸乙酯而膨潤後之發泡體基材分離。使分離後之發泡體基材於110℃之條件下乾燥1小時。測定乾燥後之包含金屬網之發泡體基材之重量,利用下式算出發泡體基材之凝膠分率。 凝膠分率(重量%)=100×(W1-W2)/W0 (W0:發泡體基材初始重量,W1:乾燥後之包含金屬網之發泡體基材重量,W2:金屬網之初始重量)(6) Determination of gel fraction of foam base material Only 0.1 g of the foam base material was taken out from the obtained adhesive tape, immersed in 50 ml of ethyl acetate, and vibrated with a vibrator at a temperature of 23°C and 120 rpm for 24 hours. After vibration, a metal mesh (mesh #200 mesh) is used to separate the ethyl acetate from the foam base material that has been swollen by absorbing the ethyl acetate. The separated foam base material was dried at 110° C. for 1 hour. The weight of the foam base material including the metal mesh after drying is measured, and the gel fraction of the foam base material is calculated using the following formula. Gel fraction (weight%) = 100×(W1-W2)/W0 (W0: Initial weight of the foam base material, W1: Weight of the foam base material including the metal mesh after drying, W2: Initial weight of the metal mesh)

(實施例2~24、27~29) 除將發泡體基材之組成及厚度、黏著劑層之厚度設定為如表1、2所示以外,以與實施例1相同之方式獲得黏著帶。再者,於實施例20中,藉由於150℃加熱1分鐘而使基材發泡。對於所獲得之黏著帶,與實施例1同樣地進行各測定。表中之原料如下所示。 MA:丙烯酸甲酯 AA:丙烯酸 HEA:丙烯酸-2-羥基乙酯 EML101:ADVANCELL EML101(積水化學工業公司製)(Examples 2 to 24, 27 to 29) An adhesive tape was obtained in the same manner as in Example 1, except that the composition and thickness of the foam base material and the thickness of the adhesive layer were set as shown in Tables 1 and 2. Furthermore, in Example 20, the base material was foamed by heating at 150° C. for 1 minute. Each measurement was performed on the obtained adhesive tape in the same manner as in Example 1. The raw materials in the table are as follows. MA: Methyl acrylate AA: acrylic HEA: 2-hydroxyethyl acrylate EML101: ADVANCELL EML101 (manufactured by Sekisui Chemical Industry Co., Ltd.)

(實施例25) 將發泡體基材之組成及厚度、黏著劑層之厚度設為如表2所示,將基材溶液塗佈於樹脂層即厚度25 μm之聚對苯二甲酸乙二酯(PET)片材(東洋紡公司製,E5007)上,除此以外,以與實施例1相同之方式獲得黏著帶。對於所獲得之黏著帶,與實施例1同樣地進行各測定。(Example 25) The composition and thickness of the foam base material and the thickness of the adhesive layer are as shown in Table 2. The base material solution is applied to the resin layer, which is a polyethylene terephthalate (PET) sheet with a thickness of 25 μm. (E5007 manufactured by Toyobo Co., Ltd.), except that the adhesive tape was obtained in the same manner as in Example 1. Each measurement was performed on the obtained adhesive tape in the same manner as in Example 1.

(實施例26、30~34) 除將發泡體基材之組成及厚度、黏著劑層之厚度設為如表2所示以外,以與實施例25相同之方式獲得黏著帶。對於所獲得之黏著帶,與實施例1同樣地進行各測定。(Examples 26, 30 to 34) An adhesive tape was obtained in the same manner as in Example 25, except that the composition and thickness of the foam base material and the thickness of the adhesive layer were as shown in Table 2. Each measurement was performed on the obtained adhesive tape in the same manner as in Example 1.

(實施例35) (1)未發泡基材之製造 於具備溫度計、攪拌機、冷卻管之反應器中添加乙酸乙酯52重量份,進行氮氣置換之後,對反應器進行加熱而開始回流。乙酸乙酯沸騰之後,30分鐘後投入作為聚合起始劑之偶氮二異丁腈0.08重量份。向其中歷時1小時30分鐘均勻且緩慢地滴加由丙烯酸丁酯93.888重量份、苯乙烯巨分子單體(於表中記為AS-6S,東亞合成公司製)4重量份、丙烯酸1.92重量份、丙烯酸-2-羥基乙酯0.192重量份構成之單體混合物,使其進行反應。滴加結束30分鐘後添加偶氮二異丁腈0.1重量份,進而,使其進行5小時聚合反應,一面於反應器內添加乙酸乙酯進行稀釋,一面進行冷卻,藉此獲得固形物成分40重量%之丙烯酸接枝共聚物之溶液。 對於所獲得之丙烯酸接枝共聚物,利用GPC法測定重量平均分子量,其結果為60萬。使用Water公司製造之「2690 Separations Module」作為測定機器,使用昭和電工公司製造之「GPC KF-806L」作為管柱,使用乙酸乙酯作為溶劑,於樣品流量1 mL/min、管柱溫度40℃之條件下進行測定。(Example 35) (1) Manufacturing of unfoamed substrates 52 parts by weight of ethyl acetate was added to a reactor equipped with a thermometer, a stirrer, and a cooling tube, and after nitrogen replacement, the reactor was heated to start reflux. After the ethyl acetate boiled, 0.08 parts by weight of azobisisobutyronitrile as a polymerization initiator was added 30 minutes later. 93.888 parts by weight of butyl acrylate, 4 parts by weight of styrene macromonomer (recorded as AS-6S in the table, manufactured by Toagosei Co., Ltd.), and 1.92 parts by weight of acrylic acid were added dropwise evenly and slowly over a period of 1 hour and 30 minutes. , a monomer mixture composed of 0.192 parts by weight of 2-hydroxyethyl acrylate, and allowed to react. 30 minutes after the completion of the dropwise addition, 0.1 part by weight of azobisisobutyronitrile was added, and the polymerization reaction was carried out for 5 hours. While adding ethyl acetate to the reactor for dilution, the solid content 40 was obtained by cooling. % by weight solution of acrylic graft copolymer. The weight average molecular weight of the obtained acrylic graft copolymer was measured by the GPC method, and the result was 600,000. Use "2690 Separations Module" manufactured by Water Corporation as the measurement device, use "GPC KF-806L" manufactured by Showa Denko Corporation as the column, use ethyl acetate as the solvent, and set the sample flow rate to 1 mL/min and the column temperature to 40°C. measured under the conditions.

使所獲得之接枝共聚物以固形物成分比率成為35%之方式溶解於乙酸乙酯中,對於接枝共聚物100重量份,添加2.12重量份之Expancel461-40作為發泡劑、0.3重量份之Tetrad C作為交聯劑,進而進行充分攪拌,獲得基材溶液。於單面實施了脫模處理之50 μm之聚對苯二甲酸乙二酯(PET)膜之脫模處理面上塗佈所獲得之基材溶液,使其於90℃乾燥7分鐘,藉此獲得由接枝共聚物構成之未發泡體基材。未發泡體基材之厚度調整為當將未發泡體基材於130℃加熱1分鐘時達到100 μm。The obtained graft copolymer was dissolved in ethyl acetate so that the solid content ratio became 35%. To 100 parts by weight of the graft copolymer, 2.12 parts by weight of Expancel 461-40 as a foaming agent and 0.3 parts by weight were added. Use Tetrad C as a cross-linking agent and stir thoroughly to obtain a substrate solution. The obtained substrate solution was applied to the release-treated surface of a 50 μm polyethylene terephthalate (PET) film that had been released on one side and dried at 90°C for 7 minutes. An unfoamed base material composed of a graft copolymer was obtained. The thickness of the unfoamed base material was adjusted to reach 100 μm when the unfoamed base material was heated at 130° C. for 1 minute.

(2)黏著帶之製造 除使用所獲得之由接枝共聚物構成之未發泡基材以外,以與實施例1相同之方式獲得黏著帶。對於所獲得之黏著帶,與實施例1同樣地進行各測定。(2) Manufacturing of adhesive tape An adhesive tape was obtained in the same manner as in Example 1, except that the obtained unfoamed base material composed of the graft copolymer was used. Each measurement was performed on the obtained adhesive tape in the same manner as in Example 1.

(實施例36) 除將硬嵌段成分與軟嵌段成分之含量設為如表2所示以外,以與實施例35相同之方式獲得黏著帶。對於所獲得之黏著帶,與實施例1同樣地進行各測定。(Example 36) An adhesive tape was obtained in the same manner as in Example 35, except that the contents of the hard block component and the soft block component were set as shown in Table 2. Each measurement was performed on the obtained adhesive tape in the same manner as in Example 1.

(實施例37) 除將發泡體基材之組成及厚度設為如表2所示以外,以與實施例35相同之方式獲得由接枝共聚物構成之未發泡基材。繼而,除將黏著劑層之厚度設為如表2所示以外,以與實施例25相同之方式獲得黏著帶。對於所獲得之黏著帶,與實施例1同樣地進行各測定。(Example 37) An unfoamed base material composed of a graft copolymer was obtained in the same manner as in Example 35, except that the composition and thickness of the foam base material were as shown in Table 2. Then, except that the thickness of the adhesive layer was as shown in Table 2, an adhesive tape was obtained in the same manner as in Example 25. Each measurement was performed on the obtained adhesive tape in the same manner as in Example 1.

(實施例38) (1)未發泡基材之製造 於具備溫度計、攪拌機、冷卻管之反應器中添加乙酸乙酯52重量份,進行氮氣置換之後,對反應器進行加熱而開始回流。乙酸乙酯沸騰之後,30分鐘後投入作為聚合起始劑之偶氮二異丁腈0.08重量份。向其中歷時1小時30分鐘均勻且緩慢地滴加由丙烯酸丁酯94.8重量份、苯乙烯3重量份、丙烯酸2重量份、丙烯酸-2-羥基乙酯0.2重量份構成之單體混合物,使其進行反應。滴加結束30分鐘後添加偶氮二異丁腈0.1重量份,進而使其進行5小時聚合反應,一面於反應器內添加乙酸乙酯進行稀釋,一面進行冷卻,獲得固形物成分40重量%之無規共聚物之溶液。對於所獲得之無規共聚物,利用GPC法測定重量平均分子量,其結果為37萬。使用Water公司製造之「2690 Separations Module」作為測定機器,使用昭和電工公司製造之「GPC KF-806L」作為管柱,使用乙酸乙酯作為溶劑,於樣品流量1 mL/min、管柱溫度40℃之條件下進行測定。(Example 38) (1) Manufacturing of unfoamed substrates 52 parts by weight of ethyl acetate was added to a reactor equipped with a thermometer, a stirrer, and a cooling tube, and after nitrogen replacement, the reactor was heated to start reflux. After the ethyl acetate boiled, 0.08 parts by weight of azobisisobutyronitrile as a polymerization initiator was added 30 minutes later. A monomer mixture consisting of 94.8 parts by weight of butyl acrylate, 3 parts by weight of styrene, 2 parts by weight of acrylic acid, and 0.2 parts by weight of 2-hydroxyethyl acrylate was added dropwise evenly and slowly over a period of 1 hour and 30 minutes. react. 30 minutes after the completion of the dropwise addition, 0.1 part by weight of azobisisobutyronitrile was added, and the polymerization reaction was carried out for 5 hours. While adding ethyl acetate to the reactor for dilution, it was cooled to obtain a solid content of 40% by weight. Solution of random copolymer. The weight average molecular weight of the obtained random copolymer was measured by the GPC method, and the result was 370,000. Use "2690 Separations Module" manufactured by Water Corporation as the measurement device, use "GPC KF-806L" manufactured by Showa Denko Corporation as the column, use ethyl acetate as the solvent, and set the sample flow rate to 1 mL/min and the column temperature to 40°C. measured under the conditions.

使所獲得之無規共聚物以固形物成分比率成為35%之方式溶解於乙酸乙酯中,對於無規共聚物100重量份,添加2.12重量份之Expancel461-40作為發泡劑、0.25重量份之Tetrad C作為交聯劑,進而進行充分攪拌,獲得基材溶液。於單面實施了脫模處理之50 μm之聚對苯二甲酸乙二酯(PET)膜之脫模處理面上塗佈所獲得之基材溶液,使其於90℃乾燥7分鐘,藉此獲得由無規共聚物構成之未發泡體基材。未發泡體基材之厚度調整為當將未發泡體基材於130℃加熱1分鐘時達到100 μm。The obtained random copolymer was dissolved in ethyl acetate so that the solid content ratio became 35%. To 100 parts by weight of the random copolymer, 2.12 parts by weight of Expancel 461-40 as a foaming agent and 0.25 parts by weight were added. Use Tetrad C as a cross-linking agent and stir thoroughly to obtain a substrate solution. The obtained substrate solution was applied to the release-treated surface of a 50 μm polyethylene terephthalate (PET) film that had been released on one side and dried at 90°C for 7 minutes. An unfoamed base material composed of a random copolymer was obtained. The thickness of the unfoamed base material was adjusted to reach 100 μm when the unfoamed base material was heated at 130° C. for 1 minute.

(2)黏著帶之製造 除使用所獲得之由無規共聚物構成之未發泡基材以外,以與實施例1相同之方式獲得黏著帶。對於所獲得之黏著帶,與實施例1同樣地進行各測定。(2) Manufacturing of adhesive tape An adhesive tape was obtained in the same manner as in Example 1, except that the obtained unfoamed base material composed of a random copolymer was used. Each measurement was performed on the obtained adhesive tape in the same manner as in Example 1.

(實施例39) 除將發泡體基材之組成設為如表2所示以外,以與實施例38相同之方式獲得黏著帶。對於所獲得之黏著帶,與實施例1同樣地進行各測定。(Example 39) An adhesive tape was obtained in the same manner as in Example 38, except that the composition of the foam base material was as shown in Table 2. Each measurement was performed on the obtained adhesive tape in the same manner as in Example 1.

(實施例40) 除將發泡體基材之組成及厚度設為如表2所示以外,以與實施例38相同之方式獲得由無規共聚物構成之未發泡基材。繼而,除將黏著劑層之厚度設為如表2所示以外,以與實施例25相同之方式獲得黏著帶。對於所獲得之黏著帶,與實施例1同樣地進行各測定。(Example 40) An unfoamed base material composed of a random copolymer was obtained in the same manner as in Example 38, except that the composition and thickness of the foam base material were as shown in Table 2. Then, except that the thickness of the adhesive layer was as shown in Table 2, an adhesive tape was obtained in the same manner as in Example 25. Each measurement was performed on the obtained adhesive tape in the same manner as in Example 1.

(比較例1) 於黏著帶之製造中,不添加發泡劑,不進行於130℃之1分鐘之加熱,不製成發泡體基材,除此以外,以與實施例1相同之方式獲得黏著帶。對於所獲得之黏著帶,與實施例1同樣地進行各測定。(Comparative example 1) In the production of the adhesive tape, the adhesive tape was obtained in the same manner as in Example 1, except that no foaming agent was added, heating at 130° C. for 1 minute was not performed, and a foam base material was not formed. Each measurement was performed on the obtained adhesive tape in the same manner as in Example 1.

(比較例2) (1)發泡體基材之準備 使用Volara H03001(聚乙烯系樹脂,積水化學工業公司製,厚度100 μm)作為發泡體基材。 (2)黏著帶之製造 除使用所獲得之基材以外,以與實施例1相同之方式獲得黏著帶。對於所獲得之黏著帶,與實施例1同樣地進行各測定。(Comparative example 2) (1) Preparation of foam base material Volara H03001 (polyethylene resin, manufactured by Sekisui Chemical Industry Co., Ltd., thickness 100 μm) was used as the foam base material. (2) Manufacturing of adhesive tape An adhesive tape was obtained in the same manner as in Example 1, except that the obtained base material was used. Each measurement was performed on the obtained adhesive tape in the same manner as in Example 1.

(比較例3) (1)發泡體基材之準備 使用Volara H0250012(聚乙烯系樹脂,積水化學工業公司製,厚度120 μm)作為發泡體基材。(Comparative example 3) (1) Preparation of foam base material Volara H0250012 (polyethylene resin, manufactured by Sekisui Chemical Industry Co., Ltd., thickness 120 μm) was used as the foam base material.

(2)黏著帶之製造 除使用所獲得之基材以外,以與實施例1相同之方式獲得黏著帶。對於所獲得之黏著帶,與實施例1同樣地進行各測定。(2) Manufacturing of adhesive tape An adhesive tape was obtained in the same manner as in Example 1 except that the obtained base material was used. Each measurement was performed on the obtained adhesive tape in the same manner as in Example 1.

(比較例4) (1)基材之製造 製作Septon2063(烴系樹脂、可樂麗公司製)之甲苯30%溶液,相對於固形物成分100重量份使用作為發泡劑之Expancel461-40(Japan Fillite公司製)0.5重量份,不使用交聯劑,除此以外,以與實施例1相同之方式獲得未發泡體基材。(Comparative example 4) (1) Manufacturing of base materials A 30% toluene solution of Septon 2063 (hydrocarbon resin, manufactured by Kuraray Co., Ltd.) was prepared, using 0.5 part by weight of Expancel 461-40 (manufactured by Japan Fillite Co., Ltd.) as a foaming agent based on 100 parts by weight of the solid content, and no cross-linking agent was used. , Except for this, an unfoamed base material was obtained in the same manner as in Example 1.

(2)黏著帶之製造 除使用所獲得之未發泡體基材以外,以與實施例1相同之方式獲得黏著帶。對於所獲得之黏著帶,與實施例1同樣地進行各測定。(2) Manufacturing of adhesive tape An adhesive tape was obtained in the same manner as in Example 1, except that the obtained unfoamed base material was used. Each measurement was performed on the obtained adhesive tape in the same manner as in Example 1.

(比較例5) (1)未發泡基材之製造 使用實施例1之黏著劑溶液之製備中所獲得之丙烯酸無規共聚物溶液代替丙烯酸共聚物A,相對於丙烯酸無規共聚物溶液之固形物成分100重量份,使用1重量份之交聯劑、0.5重量份之發泡劑,除此以外,以與實施例1相同之方式獲得未發泡基材。再者,交聯劑與發泡劑使用以下者。 交聯劑:L-45E,東曹公司製 發泡劑:Expancel461-40,Japan Fillite公司製(Comparative example 5) (1) Manufacturing of unfoamed substrates The acrylic random copolymer solution obtained in the preparation of the adhesive solution in Example 1 was used instead of the acrylic copolymer A, and 1 part by weight of the cross-linking agent was used relative to 100 parts by weight of the solid content of the acrylic random copolymer solution. , 0.5 parts by weight of foaming agent, except that the unfoamed base material was obtained in the same manner as in Example 1. In addition, the cross-linking agent and the foaming agent used are the following. Cross-linking agent: L-45E, manufactured by Tosoh Corporation Foaming agent: Expancel461-40, manufactured by Japan Fillite Company

(2)黏著帶之製造 除使用所獲得之未發泡體基材以外,以與實施例1相同之方式獲得黏著帶。對於所獲得之黏著帶,與實施例1同樣地進行各測定。(2) Manufacturing of adhesive tape An adhesive tape was obtained in the same manner as in Example 1, except that the obtained unfoamed base material was used. Each measurement was performed on the obtained adhesive tape in the same manner as in Example 1.

<評價> 對實施例、比較例中所獲得之黏著帶進行以下之評價。將結果示於表1~3。<Evaluation> The adhesive tapes obtained in Examples and Comparative Examples were evaluated as follows. The results are shown in Tables 1 to 3.

(耐衝擊性之評價) 將所獲得之黏著帶沖裁成外形45 mm×60 mm、厚度1 mm之口字形。將沖裁後之黏著帶之單面貼附於中央部具有40 mm×40 mm之孔洞的80 mm×115 mm、厚度2 mm之口字形之不鏽鋼板之中央。繼而,於黏著帶之另一面貼附50 mm×70 mm、厚度4 mm之強化玻璃板,利用5 kg之砝碼壓合10秒,於23℃靜置24小時,藉此獲得試驗用之積層體。將所獲得之積層體以強化玻璃板成為下表面之方式固定於不鏽鋼製之框狀體(內徑60 mm×90 mm)。其後,使150 g之鐵球朝向強化玻璃板之中央掉落。使鐵球之掉落高度上升,測定強化玻璃板自不鏽鋼板剝離時鐵球之高度。將強化玻璃板自不鏽鋼板剝離時鐵球之高度為60 cm以上之情形標記為「◎」,將強化玻璃板自不鏽鋼板剝離時鐵球之高度為40 cm以上未達60 cm之情形標記為「〇」,將強化玻璃板自不鏽鋼板剝離時鐵球之高度為20 cm以上未達40 cm之情形標記為「△」,將強化玻璃板自不鏽鋼板剝離時鐵球之高度未達20 cm之情形標記為「×」,以此評價耐衝擊性。(Evaluation of impact resistance) The obtained adhesive tape was punched into a square shape with an outer shape of 45 mm × 60 mm and a thickness of 1 mm. Attach one side of the punched adhesive tape to the center of an 80 mm × 115 mm, 2 mm thick zigzag stainless steel plate with a 40 mm × 40 mm hole in the center. Then, a 50 mm × 70 mm, 4 mm thick tempered glass plate was attached to the other side of the adhesive tape, pressed with a 5 kg weight for 10 seconds, and left to stand at 23°C for 24 hours to obtain a test laminate. body. The obtained laminated body was fixed to a stainless steel frame (inner diameter 60 mm × 90 mm) so that the tempered glass plate became the lower surface. Thereafter, a 150 g iron ball was dropped toward the center of the tempered glass plate. The falling height of the iron ball is increased, and the height of the iron ball when the tempered glass plate is peeled off the stainless steel plate is measured. When the tempered glass plate is peeled off from the stainless steel plate, the height of the iron ball is 60 cm or more. Mark it as "◎". When the tempered glass plate is peeled off from the stainless steel plate, the height of the iron ball is 40 cm or more but less than 60 cm. Mark it as "◎". "〇", mark "△" when the height of the iron ball when the tempered glass plate is peeled off the stainless steel plate is more than 20 cm and less than 40 cm, and the height of the iron ball when the tempered glass plate is peeled off the stainless steel plate is less than 20 cm. The situation is marked as "×" to evaluate the impact resistance.

(保持力之評價) 圖1中示出說明黏著帶之保持力試驗之示意圖。首先,將黏著帶之尺寸25 mm×25 mm之試驗片1之一面(表面)貼合於SUS板2,自試驗片1之另一面(背面)側使2 kg之橡膠輥以300 mm/分鐘之速度往返一次。繼而,於試驗片1之背面貼合鋁板3,自鋁板3側利用0.5 kg之砝碼加壓10秒使其壓合後,於23℃、相對濕度50%之環境下放置24小時,製作保持力試驗用樣品。將該保持力試驗用樣品置於100℃,以對於試驗片1及鋁板3在水平方向上施加負荷之方式於鋁板3之一端安裝0.5kg或1.0kg之砝碼4,測定1小時後之砝碼之偏移長度。又,安裝1.0 kg之砝碼4,測定2小時後之偏移長度。對於所獲得之測定結果,將偏移長度為0(無偏移)之情形標記為「◎」,將偏移長度大於0未達1 mm之情形標記為「△」,將偏移長度為1 mm以上或黏著帶剝離掉落之情形標記為「×」,以此評價保持力。(evaluation of retention power) A schematic diagram illustrating the retention test of the adhesive tape is shown in Figure 1 . First, attach one side (surface) of the test piece 1 with a size of 25 mm × 25 mm with the adhesive tape to the SUS plate 2, and move a 2 kg rubber roller from the other side (back) of the test piece 1 at 300 mm/min. The speed is one round trip. Then, the aluminum plate 3 was attached to the back of the test piece 1, and a 0.5 kg weight was applied from the side of the aluminum plate 3 for 10 seconds to press it together. Then, it was placed in an environment of 23°C and a relative humidity of 50% for 24 hours to produce a holding test. Samples for force testing. Place the holding force test sample at 100°C, install a 0.5kg or 1.0kg weight 4 on one end of the aluminum plate 3 in a manner that applies a load in the horizontal direction to the test piece 1 and the aluminum plate 3, and measure the weight after 1 hour. The offset length of the code. Also, install weight 4 of 1.0 kg and measure the deflection length after 2 hours. For the measurement results obtained, the case where the offset length is 0 (no offset) is marked as "◎", the case where the offset length is greater than 0 and less than 1 mm is marked as "△", and the case where the offset length is 1 mm or more or the adhesive tape peels off is marked as "×" to evaluate the holding power.

(翻滾性之評價) 準備2個切出為1 mm×70 mm之黏著帶。繼而,於縱72 mm、橫135 mm、厚度1 mm之聚碳酸酯板之各短邊貼附黏著帶。而且,將聚碳酸酯板之貼附有黏著帶之面與縱77 mm、橫150 mm、厚度4 mm之聚碳酸酯板以2塊聚碳酸酯板之短邊彼此長邊彼此對向之方式進行重疊,以0.7 MPa加壓15秒,藉此將2塊聚碳酸酯板接著。其後,於23℃靜置24小時,藉此獲得試驗樣品。將所獲得之試驗樣品放入TD-1000A滾筒式旋轉跌落試驗機(新榮電子計測器公司製),使其於保持23℃之室溫環境之狀態下以12轉/分鐘之速度旋轉,藉此使測定樣品自1 m之高度反覆掉落。將聚碳酸酯板剝離時之掉落次數多於1500次之情形標記為「◎」,將聚碳酸酯板剝離時之掉落次數多於1000次且為1500次以下之情形標記為「〇」,將聚碳酸酯板剝離時之掉落次數為1000次以下之情形標記為「×」,以此評價翻滾性。(evaluation of tumbling properties) Prepare 2 adhesive tapes cut out to 1 mm x 70 mm. Then, adhesive tapes were attached to each short side of a polycarbonate plate with a length of 72 mm, a width of 135 mm, and a thickness of 1 mm. Moreover, the surface of the polycarbonate plate with the adhesive tape attached and the polycarbonate plate with a length of 77 mm, a width of 150 mm, and a thickness of 4 mm were placed in such a way that the short sides of the two polycarbonate plates faced each other and the long sides faced each other. The two polycarbonate plates were joined together by overlapping them and applying pressure at 0.7 MPa for 15 seconds. Thereafter, the test sample was obtained by leaving it still at 23° C. for 24 hours. The obtained test sample was placed in a TD-1000A drum-type rotational drop tester (manufactured by Xinrong Electronic Measurement Co., Ltd.) and allowed to rotate at a speed of 12 rpm while maintaining a room temperature of 23°C. This causes the measurement sample to repeatedly drop from a height of 1 m. The polycarbonate sheet dropped more than 1,500 times when peeled off was marked as "◎", and the polycarbonate sheet dropped more than 1,000 times but less than 1,500 times was marked as "〇". , mark "×" when the number of drops when the polycarbonate sheet is peeled off is 1,000 times or less to evaluate the tumbling properties.

[表1]    實施例 實施例 實施例 實施例 實施例 實施例 實施例 實施例 實施例 實施例 實施例 實施例 實施例 實施例 實施例 實施例 實施例 實施例 實施例 實施例 實施例 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 發泡體基材 共聚物 硬 嵌段 含量 重量% 17 17 17 17 17 17 17 17 17 17 17 17 17 20 26 2 3 8 17 17 17 組成 (重量比) St - 91.3 91.3 91.3 91.3 91.3 91.3 91.3 91.3 91.3 91.3 91.3 91.3 91.3 91.3 91.3 75.0 91.3 91.3 91.3 91.3 91.3 AS-6S - - - - - - - - - - - - - - - - - - - - - - AA - 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 25.0 8.7 8.7 8.7 8.7 8.7 軟 嵌段 含量 重量% 83 83 83 83 83 83 83 83 83 83 83 83 83 80 74 98 97 92 83 83 83 組成 (重量比) MA - - - - - - - - - - - - - - - - - - - - - - BA - 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 2EHA - - - - - - - - - - - - - - - - - - - - - - St - - - - - - - - - - - - - - - - - - - - - - AA - - - - - - - - - - - - - - - - - - - - - - HEA - - - - - - - - - - - - - - - - - - - - - - 來自乙烯基芳香族化合物單體之結構之含量 重量% 15.5 15.5 15.5 15.5 15.5 15.5 15.5 15.5 15.5 15.5 15.5 15.5 15.5 18.3 23.7 1.5 2.7 7.3 15.5 15.5 15.5 重量平均分子量 25 25 25 25 25 25 25 25 25 25 25 25 25 27 24 31 48 47 25 25 25 發泡劑 種類 - DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU20 EML101 DU80 份數 重量份 0.5 0.89 1.23 3.23 6.19 6.53 2.13 2.13 2.13 2.13 2.13 2.13 2.13 2.13 2.55 2.13 2.13 2.13 2.13 2.13 2.13 交聯劑 份數 重量份 0.2 0.2 0.2 0.2 0.2 0.2 0 0.05 0.2 0.4 0.45 0.5 0.55 0.2 0.2 0.1 0.3 0.3 0.2 0.2 0.2 凝膠分率 % 41 39 40 39 40 41 0 10 42 76 82 86 90 41 41 24 58 59 40 38 38 視密度 g/cm3 0.76 0.75 0.70 0.5 0.3 0.28 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.61 0.56 0.59 0.6 0.61 0.62 0.59 0.6 厚度 μm 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 黏著劑層 厚度(每單面) μm 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 樹脂 膜 種類 - - - - - - - - - - - - - - - - - - - - - - 厚度 μm 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 物性 密度 g/cm3 0.88 0.875 0.851 0.751 0.65 0.64 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.81 0.78 0.79 0.8 0.81 0.81 0.79 0.74 厚度 μm 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 糊(兩面)/基材厚比 - 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 評價 耐衝擊性 高度 cm 40 45 54 48 43 40 44 46 60 44 43 41 40 53 45 35 48 60 45 44 40 判定 - 保持力 0.5 Kg、1 h mm 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 判定 - 1 Kg、1 h mm 0.2 0 0 0 0 0 0 0 0 0 0 0 0 0 0 掉落 0.2 0 0 0 0 判定 - × 1 Kg、2 h mm 0.4 0 0 0 0 0 0 0 0 0 0 0 0 0 1.8 掉落 0.4 0 0 0 0 判定 - × × 翻滾性 判定 - × × × × × × × × × × × × × × × × × × × × × [Table 1] Example Example Example Example Example Example Example Example Example Example Example Example Example Example Example Example Example Example Example Example Example 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 twenty one Foam base material copolymer hard block content weight% 17 17 17 17 17 17 17 17 17 17 17 17 17 20 26 2 3 8 17 17 17 Composition (weight ratio) St - 91.3 91.3 91.3 91.3 91.3 91.3 91.3 91.3 91.3 91.3 91.3 91.3 91.3 91.3 91.3 75.0 91.3 91.3 91.3 91.3 91.3 AS-6S - - - - - - - - - - - - - - - - - - - - - - AA - 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 25.0 8.7 8.7 8.7 8.7 8.7 soft block content weight% 83 83 83 83 83 83 83 83 83 83 83 83 83 80 74 98 97 92 83 83 83 Composition (weight ratio) MA - - - - - - - - - - - - - - - - - - - - - - BA - 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 2EHA - - - - - - - - - - - - - - - - - - - - - - St - - - - - - - - - - - - - - - - - - - - - - AA - - - - - - - - - - - - - - - - - - - - - - HEA - - - - - - - - - - - - - - - - - - - - - - Content of structures derived from vinyl aromatic compound monomers weight% 15.5 15.5 15.5 15.5 15.5 15.5 15.5 15.5 15.5 15.5 15.5 15.5 15.5 18.3 23.7 1.5 2.7 7.3 15.5 15.5 15.5 weight average molecular weight ten thousand 25 25 25 25 25 25 25 25 25 25 25 25 25 27 twenty four 31 48 47 25 25 25 Foaming agent Kind - DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU20 EML101 DU80 number of copies parts by weight 0.5 0.89 1.23 3.23 6.19 6.53 2.13 2.13 2.13 2.13 2.13 2.13 2.13 2.13 2.55 2.13 2.13 2.13 2.13 2.13 2.13 Cross-linking agent number of copies parts by weight 0.2 0.2 0.2 0.2 0.2 0.2 0 0.05 0.2 0.4 0.45 0.5 0.55 0.2 0.2 0.1 0.3 0.3 0.2 0.2 0.2 gel fraction % 41 39 40 39 40 41 0 10 42 76 82 86 90 41 41 twenty four 58 59 40 38 38 apparent density g/cm 3 0.76 0.75 0.70 0.5 0.3 0.28 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.61 0.56 0.59 0.6 0.61 0.62 0.59 0.6 thickness μm 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 adhesive layer Thickness (per side) μm 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 resin film Kind - - - - - - - - - - - - - - - - - - - - - - thickness μm 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 physical properties density g/cm 3 0.88 0.875 0.851 0.751 0.65 0.64 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.81 0.78 0.79 0.8 0.81 0.81 0.79 0.74 thickness μm 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 Paste (both sides)/substrate thickness ratio - 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 Evaluation Impact resistance high cm 40 45 54 48 43 40 44 46 60 44 43 41 40 53 45 35 48 60 45 44 40 determination - Retentivity 0.5 kg, 1 hour mm 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 determination - 1 kg, 1 hour mm 0.2 0 0 0 0 0 0 0 0 0 0 0 0 0 0 fall 0.2 0 0 0 0 determination - × 1 kg, 2 hours mm 0.4 0 0 0 0 0 0 0 0 0 0 0 0 0 1.8 fall 0.4 0 0 0 0 determination - × × Rollability determination - × × × × × × × × × × × × × × × × × × × × ×

[表2]    實施例 實施例 實施例 實施例 實施例 實施例 實施例 實施例 實施例 實施例 實施例 實施例 實施例 實施例 實施例 實施例 實施例 實施例 實施例 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 發泡體基材 共聚物 硬 嵌段 含量 重量% 17 17 17 17 17 17 17 17 17 17 8 3 8 4 15 3 0 0 0 組成 (重量比) St - 91.3 91.3 91.3 91.3 91.3 91.3 91.3 91.3 91.3 91.3 91.3 93.0 91.3 - - - - - - AS-6S - - - - - - - - - - - - - - 100 100 100 - - - AA - 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 7.0 8.7 - - - - - - 軟 嵌段 含量 重量% 83 83 83 83 83 83 83 83 83 85 92 97 92 96 85 97 100 100 100 組成 (重量比) MA - - - - - - 50.0 75.0 49.5 49.5 50.0 49.5 49.5 49.5 - - 48.9 - - - BA - 100 100 100 100 100 50.0 25.0 49.5 49.5 50.0 49.5 49.5 49.5 97.8 97.8 49.0 94.8 81.8 91.8 2EHA - - - - - - - - - - - - - - - - - - - - St - - - - - - - - - - - - - - - - - 3.0 16.0 6.0 AA - - - - - - - - 1.0 1.0 - 1.0 1.0 1.0 2.0 2.0 2.0 2.0 2.0 2.0 HEA - - - - - - - - - - - - - - 0.2 0.2 0.1 0.2 0.2 0.2 來自乙烯基芳香族化合物單體之結構之含量 重量% 15.5 15.5 15.5 15.5 15.5 15.5 15.5 15.5 15.5 15.5 7.3 2.8 7.3 4.0 15.0 3.0 3.0 16.0 6.0 重量平均分子量 25 25 25 25 25 30 38 50 50 30 49.6 39.1 49.6 60 51 60.3 37 38 37.2 發泡劑 種類 - DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 份數 重量份 3.23 3.23 3.23 2.13 3.23 3.23 3.23 3.3 3.3 3.23 3.3 3.3 3.3 2.12 2.12 3.3 2.12 2.12 3.3 交聯劑 份數 重量份 0.2 0.2 0.2 0.2 0.2 0.3 0.25 0.15 0.15 0.3 0.15 0.5 0.15 0.3 0.3 0.3 0.25 0.25 0.5 凝膠分率 % 44 45 44 40 42 61 47 35 35 62 35 83 35 60 60 60 49 50 78 視密度 g/cm3 0.49 0.49 0.49 0.6 0.6 0.49 0.5 0.5 0.5 0.49 0.5 0.5 0.5 0.59 0.6 0.49 0.59 0.61 0.49 厚度 μm 175 125 125 100 125 100 100 100 125 125 125 125 275 100 100 125 100 100 125 黏著劑層 厚度(每單面) μm 50 50 75 50 75 50 50 50 75 75 75 75 25 50 50 75 50 50 75 樹脂 膜 種類 - - - - PET PET - - - PET PET PET PET PET - - PET - - PET 厚度 μm 0 0 0 25 25 0 0 0 25 25 25 25 25 0 0 25 0 0 25 物性 密度 g/cm3 0.73 0.73 0.73 0.82 0.73 0.74 0.74 0.74 0.74 0.74 0.74 0.74 0.74 0.79 0.8 0.74 0.79 0.81 - 厚度 μm 275 225 275 225 300 200 200 200 300 300 300 300 350 200 200 300 200 200 300 糊(兩面)/基材厚比 - 0.6 0.8 1.2 0.8 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 0.17 1.0 1.0 1.0 1.0 1.0 1.0 評價 耐衝擊性 高度 cm 80 58 60 62 69 75 70 58 60 90 83 97 90 53 58 62 43 50 48 判定 - 保持力 0.5 Kg、1 h mm 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 判定 - 1 Kg、1 h mm 0 0 0 0 0 0 0 0 0 0 0 0 0 0.3 0 0 0.4 0 0 判定 - 1 Kg、2 h mm 0 0 0 0 0 0 0 0 0 0 0 0 0 0.7 0 0 1.0 0 0 判定 - × 翻滾性 判定 - × × × × × × × × × × [Table 2] Example Example Example Example Example Example Example Example Example Example Example Example Example Example Example Example Example Example Example twenty two twenty three twenty four 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 Foam base material copolymer hard block content weight% 17 17 17 17 17 17 17 17 17 17 8 3 8 4 15 3 0 0 0 Composition (weight ratio) St - 91.3 91.3 91.3 91.3 91.3 91.3 91.3 91.3 91.3 91.3 91.3 93.0 91.3 - - - - - - AS-6S - - - - - - - - - - - - - - 100 100 100 - - - AA - 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 7.0 8.7 - - - - - - soft block content weight% 83 83 83 83 83 83 83 83 83 85 92 97 92 96 85 97 100 100 100 Composition (weight ratio) MA - - - - - - 50.0 75.0 49.5 49.5 50.0 49.5 49.5 49.5 - - 48.9 - - - BA - 100 100 100 100 100 50.0 25.0 49.5 49.5 50.0 49.5 49.5 49.5 97.8 97.8 49.0 94.8 81.8 91.8 2EHA - - - - - - - - - - - - - - - - - - - - St - - - - - - - - - - - - - - - - - 3.0 16.0 6.0 AA - - - - - - - - 1.0 1.0 - 1.0 1.0 1.0 2.0 2.0 2.0 2.0 2.0 2.0 HEA - - - - - - - - - - - - - - 0.2 0.2 0.1 0.2 0.2 0.2 Content of structures derived from vinyl aromatic monomers weight% 15.5 15.5 15.5 15.5 15.5 15.5 15.5 15.5 15.5 15.5 7.3 2.8 7.3 4.0 15.0 3.0 3.0 16.0 6.0 weight average molecular weight ten thousand 25 25 25 25 25 30 38 50 50 30 49.6 39.1 49.6 60 51 60.3 37 38 37.2 Foaming agent Kind - DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 DU40 number of copies parts by weight 3.23 3.23 3.23 2.13 3.23 3.23 3.23 3.3 3.3 3.23 3.3 3.3 3.3 2.12 2.12 3.3 2.12 2.12 3.3 Cross-linking agent number of copies parts by weight 0.2 0.2 0.2 0.2 0.2 0.3 0.25 0.15 0.15 0.3 0.15 0.5 0.15 0.3 0.3 0.3 0.25 0.25 0.5 gel fraction % 44 45 44 40 42 61 47 35 35 62 35 83 35 60 60 60 49 50 78 apparent density g/cm 3 0.49 0.49 0.49 0.6 0.6 0.49 0.5 0.5 0.5 0.49 0.5 0.5 0.5 0.59 0.6 0.49 0.59 0.61 0.49 thickness μm 175 125 125 100 125 100 100 100 125 125 125 125 275 100 100 125 100 100 125 adhesive layer Thickness (per side) μm 50 50 75 50 75 50 50 50 75 75 75 75 25 50 50 75 50 50 75 resin film Kind - - - - PET PET - - - PET PET PET PET PET - - PET - - PET thickness μm 0 0 0 25 25 0 0 0 25 25 25 25 25 0 0 25 0 0 25 physical properties density g/cm 3 0.73 0.73 0.73 0.82 0.73 0.74 0.74 0.74 0.74 0.74 0.74 0.74 0.74 0.79 0.8 0.74 0.79 0.81 - thickness μm 275 225 275 225 300 200 200 200 300 300 300 300 350 200 200 300 200 200 300 Paste (both sides)/substrate thickness ratio - 0.6 0.8 1.2 0.8 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 0.17 1.0 1.0 1.0 1.0 1.0 1.0 Evaluation Impact resistance high cm 80 58 60 62 69 75 70 58 60 90 83 97 90 53 58 62 43 50 48 determination - Retentivity 0.5 kg, 1 hour mm 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 determination - 1 kg, 1 hour mm 0 0 0 0 0 0 0 0 0 0 0 0 0 0.3 0 0 0.4 0 0 determination - 1 kg, 2 hours mm 0 0 0 0 0 0 0 0 0 0 0 0 0 0.7 0 0 1.0 0 0 determination - × Rollability determination - × × × × × × × × × ×

[表3]    比較例 比較例 比較例 比較例 比較例 1 2 3 4 5 發泡體基材 共聚物 硬 嵌段 含量 重量% 17 0 0 13 0 組成 (重量比) St - 87.0 - - 100 - AS-6S -    - - - - AA - 11.0 - - - - HEA - 2.0 - - - - 軟嵌段 含量 重量% 83 100 100 87 100 組成 (重量比) MA - - - - - - BA - 100 - - - 70.0 2EHA - - - - - 27.0 St - - - - - - AA - - - - - 3.0 HEA - - - - - 0.2 PE系樹脂 - - 100 100 - - 烴系樹脂 - - - - 100 - 來自乙烯基芳香族化合物單體之結構之含量 重量% 14.8 0.0 0.0 13.0 0.0 重量平均分子量 25 - - - 71 發泡劑 種類 - - - - DU40 DU40 份數 重量份 0 - - 1.23 0.5 交聯劑 份數 重量份 0.2 - - - 0.2 凝膠分率 % 39    - - - 視密度 g/cm3 1.04 0.35 0.4 0.38 0.752 厚度 μm 100 100 120 100 100 黏著劑層 厚度(每單面) μm 50 50 50 50 50 樹脂 膜 種類 - - - - - - 厚度 μm 0 0 0 0 0 物性 密度 g/cm3 1.02 0.7 0.71 0.74 0.86 厚度 μm 200 200 220 200 200 糊(兩面)/基材厚比 - 1.0 1.0 0.8 1.0 1.0 評價 耐衝擊性 高度 cm 25 15 25 40 32 判定 - × 保持力 0.5 Kg、1h mm 0.1 0.3 0.7 0.1 0.1 判定 - 1 Kg、1 h mm 掉落 1.5 1.4 掉落 0.3 判定 - × × × × 1 Kg、2 h mm 掉落 2.2 2.0 掉落 0.3 判定 - × × × × 翻滾性 判定 - × × × × × [產業上之可利用性][table 3] Comparative example Comparative example Comparative example Comparative example Comparative example 1 2 3 4 5 Foam base material copolymer hard block content weight% 17 0 0 13 0 Composition (weight ratio) St - 87.0 - - 100 - AS-6S - - - - - AA - 11.0 - - - - HEA - 2.0 - - - - soft block content weight% 83 100 100 87 100 Composition (weight ratio) MA - - - - - - BA - 100 - - - 70.0 2EHA - - - - - 27.0 St - - - - - - AA - - - - - 3.0 HEA - - - - - 0.2 PE resin - - 100 100 - - Hydrocarbon resin - - - - 100 - Content of structures derived from vinyl aromatic compound monomers weight% 14.8 0.0 0.0 13.0 0.0 weight average molecular weight ten thousand 25 - - - 71 Foaming agent Kind - - - - DU40 DU40 number of copies parts by weight 0 - - 1.23 0.5 Cross-linking agent number of copies parts by weight 0.2 - - - 0.2 gel fraction % 39 - - - apparent density g/cm 3 1.04 0.35 0.4 0.38 0.752 thickness μm 100 100 120 100 100 adhesive layer Thickness (per side) μm 50 50 50 50 50 resin film Kind - - - - - - thickness μm 0 0 0 0 0 physical properties density g/cm 3 1.02 0.7 0.71 0.74 0.86 thickness μm 200 200 220 200 200 Paste (both sides)/substrate thickness ratio - 1.0 1.0 0.8 1.0 1.0 Evaluation Impact resistance high cm 25 15 25 40 32 determination - × Retentivity 0.5kg, 1h mm 0.1 0.3 0.7 0.1 0.1 determination - 1 kg, 1 hour mm fall 1.5 1.4 fall 0.3 determination - × × × × 1 kg, 2 hours mm fall 2.2 2.0 fall 0.3 determination - × × × × Rollability determination - × × × × × [Industrial availability]

根據本發明,能夠提供一種具有優異之柔軟性及耐衝擊性、同時耐熱性亦優異的黏著帶。According to the present invention, it is possible to provide an adhesive tape that has excellent flexibility and impact resistance as well as excellent heat resistance.

1:黏著帶之尺寸25 mm×25 mm之試驗片 2:SUS板 3:鋁板 4:砝碼(0.5 kg或1.0 kg)1: Adhesive tape size 25 mm × 25 mm test piece 2:SUS board 3:Aluminum plate 4: Weight (0.5 kg or 1.0 kg)

[圖1]係說明黏著帶之保持力試驗之示意圖。[Figure 1] is a schematic diagram illustrating the holding force test of the adhesive tape.

Claims (9)

一種黏著帶,其於發泡體基材之兩面具有黏著劑層,上述發泡體基材含有至少具有1個以上之硬嵌段與1個軟嵌段之嵌段共聚物,上述硬嵌段具有來自乙烯基芳香族化合物單體之結構及來自具有交聯性官能基之單體之結構,上述嵌段共聚物中之上述來自乙烯基芳香族化合物單體之結構之含量為2.5重量%以上30重量%以下,且上述軟嵌段由(甲基)丙烯酸系單體構成。 An adhesive tape having adhesive layers on both sides of a foam base material. The foam base material contains a block copolymer having at least one hard block and one soft block. The hard block It has a structure derived from a vinyl aromatic compound monomer and a structure derived from a monomer having a cross-linkable functional group, and the content of the above-mentioned structure derived from a vinyl aromatic compound monomer in the above-mentioned block copolymer is 2.5% by weight or more. 30% by weight or less, and the soft block is composed of (meth)acrylic monomers. 如請求項1之黏著帶,其中,上述具有交聯性官能基之單體係選自由含羥基單體、含羧基單體、含環氧基單體、含醯胺基單體、含雙鍵單體及含三鍵單體所組成之群中之至少一種。 Such as the adhesive tape of claim 1, wherein the above-mentioned monomer system with cross-linking functional groups is selected from the group consisting of hydroxyl-containing monomers, carboxyl-containing monomers, epoxy-containing monomers, amide group-containing monomers, and double bond-containing monomers. At least one of the group consisting of monomers and monomers containing triple bonds. 如請求項1之黏著帶,其中,上述嵌段共聚物含有2.5重量%以上40重量%以下之上述硬嵌段。 The adhesive tape of claim 1, wherein the block copolymer contains 2.5% by weight or more and 40% by weight or less of the above-mentioned hard block. 一種黏著帶,其於發泡體基材之兩面具有黏著劑層,上述發泡體基材含有共聚物,上述共聚物具有來自乙烯基芳香族化合物單體之結構、來自具有交聯性官能基之單體之結構、及來自(甲基)丙烯酸系單體之結構,且上述來自乙烯基芳香族化合物單體之結構之含量為6重量%以上30重量%以下。 An adhesive tape having adhesive layers on both sides of a foam base material. The foam base material contains a copolymer. The copolymer has a structure derived from a vinyl aromatic compound monomer and a cross-linkable functional group. The structure of the monomer and the structure derived from the (meth)acrylic monomer, and the content of the structure derived from the vinyl aromatic compound monomer is 6% by weight or more and 30% by weight or less. 如請求項1至4中任一項之黏著帶,其中,上述發泡體基材之凝膠分率為90%以下。 The adhesive tape according to any one of claims 1 to 4, wherein the gel fraction of the above-mentioned foam base material is 90% or less. 如請求項1至4中任一項之黏著帶,其中,上述發泡體基材之視密度為0.3g/cm3以上0.75g/cm3以下。 The adhesive tape according to any one of claims 1 to 4, wherein the apparent density of the above-mentioned foam base material is 0.3g/cm3 or more and 0.75g/cm3 or less. 如請求項1至4中任一項之黏著帶,其中,於上述發泡體基材之至少一面具有樹脂層。 The adhesive tape according to any one of claims 1 to 4, wherein at least one side of the foam base material has a resin layer. 如請求項1至4中任一項之黏著帶,其中,上述發泡體基材之氣泡之平均氣泡徑為80μm以下。 The adhesive tape according to any one of claims 1 to 4, wherein the average cell diameter of the cells in the foam base material is 80 μm or less. 如請求項1至4中任一項之黏著帶,其用於電子零件之固定。For example, the adhesive tape according to any one of claims 1 to 4 is used for fixing electronic components.
TW109113872A 2019-04-24 2020-04-24 Adhesive tape TWI833947B (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101454394A (en) 2006-05-26 2009-06-10 电气化学工业株式会社 Tape base and adhesive tape

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101454394A (en) 2006-05-26 2009-06-10 电气化学工业株式会社 Tape base and adhesive tape

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